WO2011125973A1 - Support de filtre, dispositif d'exposition, et procédé de production de dispositif - Google Patents

Support de filtre, dispositif d'exposition, et procédé de production de dispositif Download PDF

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Publication number
WO2011125973A1
WO2011125973A1 PCT/JP2011/058511 JP2011058511W WO2011125973A1 WO 2011125973 A1 WO2011125973 A1 WO 2011125973A1 JP 2011058511 W JP2011058511 W JP 2011058511W WO 2011125973 A1 WO2011125973 A1 WO 2011125973A1
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WIPO (PCT)
Prior art keywords
frame
filter
shape changing
holding device
changing portion
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PCT/JP2011/058511
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English (en)
Japanese (ja)
Inventor
公一 桂
恵二 松浦
佳成 堀田
孝志 増川
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2012509649A priority Critical patent/JPWO2011125973A1/ja
Priority to CN2011800168666A priority patent/CN102821828A/zh
Priority to KR1020127028904A priority patent/KR20130019416A/ko
Publication of WO2011125973A1 publication Critical patent/WO2011125973A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407—Constructional details of adsorbing systems
    • B01D53/0415—Beds in cartridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/0002—Casings; Housings; Frame constructions
    • B01D46/0005—Mounting of filtering elements within casings, housings or frames
    • B01D46/0008—Two or more filter elements not fluidly connected positioned in the same housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/42—Auxiliary equipment or operation thereof
    • B01D46/4227—Manipulating filters or filter elements, e.g. handles or extracting tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407—Constructional details of adsorbing systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10—Inorganic adsorbents
    • B01D2253/102—Carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/20—Organic adsorbents
    • B01D2253/206—Ion exchange resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/40—Nitrogen compounds
    • B01D2257/406—Ammonia
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing

Definitions

  • the present invention relates to, for example, a filter holding device that holds a filter for removing impurities or the like in a gas, an exposure apparatus including the filter holding device, and a semiconductor element, a liquid crystal display element, or an imaging element using the exposure apparatus. It is related with the device manufacturing method for manufacturing.
  • an exposure apparatus used in a lithography process for manufacturing an electronic device such as a semiconductor element
  • illumination characteristics and projection of an illumination optical system The imaging characteristics of the optical system must be maintained in a predetermined state, and the space where the reticle (or photomask, etc.), projection optical system, and wafer (or glass plate, etc.) are installed must be maintained in a predetermined environment.
  • an exposure main body including a part of an illumination optical system of an exposure apparatus, a reticle stage, a projection optical system, a wafer stage, and the like is installed in a box-shaped chamber, and a predetermined temperature is set in the chamber.
  • An air conditioner that is controlled and supplies clean gas (for example, air) that has passed through a dust filter by a downflow method and a sideflow method is provided.
  • the wavelength of exposure light has been shortened in order to meet the recent demand for finer circuit patterns.
  • KrF excimer laser (wavelength 248 nm) is used as the exposure light, and more or less vacuum.
  • An ArF excimer laser (wavelength 193 nm) in the ultraviolet region is used.
  • the transmittance of the exposure light is reduced if a trace amount of organic gas (organic gas) is present in the space through which the exposure light passes (for example, the internal space of the lens barrel).
  • the reaction between the exposure light and the organic gas may cause a cloudy substance on the surface of the optical element such as a lens element.
  • a chemical filter is installed in a casing
  • a flat frame that houses the chemical filter is placed horizontally (in a direction in which the filter surface is in the vertical direction) until it hits the side wall in the casing.
  • the operator moved the frame along the side wall in the direction normal to the filter surface.
  • the gas containing impurities does not pass through the gap without passing through the chemical filter.
  • the time for accurately positioning the frame at the installation position becomes long, and as a result, the replacement time of the used chemical filter becomes long.
  • an object of the present invention is to accurately replace a filter.
  • a filter holding device that holds a plurality of filters including a first filter and a second filter.
  • the filter holding device includes a first frame that holds the first filter, a first handle portion that is provided on the first frame, a second frame that holds the second filter, and a second frame that is provided on the second frame.
  • a second handle portion provided on at least a part of the first side surface of the first frame, and from one end surface side to the other end surface side of the two end surfaces of the first frame.
  • a first shape changing portion that is directed to the outside of the first frame, and at least a part of the second side surface of the second frame, and of the two end surfaces of the second frame, A second shape change portion that changes from one end face side to the other end face side and changes to the outside of the second frame, and the positional relationship of the first shape change portion on the first side surface and the second shape change portion.
  • Second on the side Positional relationship Jo changing portion and at least one of which is different from the positional relationship of the second handle portion relative positional relationship between the second frame of the first handle portion with respect to the first frame.
  • an exposure apparatus that exposes a substrate with exposure light through a pattern, a chamber that houses an exposure main body that exposes the substrate, the filter holding apparatus of the present invention.
  • An exposure apparatus is provided that includes an air conditioner that blows a gas taken in from the outside of the chamber into the chamber through the filter holding device.
  • a device manufacturing method including exposing a photosensitive substrate using the exposure apparatus of the present invention and processing the exposed photosensitive substrate. Is done.
  • FIG. 1 is a partially cutaway view showing a configuration of an exposure apparatus as an example of an embodiment. It is a perspective view which shows the filter apparatus 26 of FIG. It is sectional drawing which shows the filter apparatus 26 of FIG. (A) is a perspective view which shows the filter box 38 in FIG. 3, (B) is a perspective view which shows the filter box 40 in FIG. (A) And (B) is the top view in which the part which shows the change of the relative position of the filter box 38 and the casing 28 was notched, respectively. (A) And (B) is the top view by which the part which shows the change of the relative position of the filter boxes 38 and 40 and the casing 28 was notched, respectively.
  • (A) is a perspective view showing filter box 38A of the 1st modification
  • (B) is a perspective view showing filter box 40A of the 1st modification
  • (A) is a perspective view showing filter box 38B of the 2nd modification
  • (B) is a perspective view showing filter box 40B of the 2nd modification.
  • (A), (B), (C) is a top view which shows the filter box of a 3rd modification, a 4th modification, and a 5th modification, respectively.
  • (A) is sectional drawing which shows the filter apparatus of another example
  • (B) is a perspective view which shows the filter box in FIG. 10 (A). It is a flowchart which shows an example of the manufacturing process of an electronic device.
  • FIG. 1 is a partially cutaway view showing a scanning exposure type exposure apparatus EX composed of a scanning stepper according to the present embodiment.
  • an exposure apparatus EX holds a light source unit 2 that generates exposure light (exposure illumination light) EL, an illumination optical system ILS that illuminates a reticle R (mask) with exposure light EL, and a reticle R.
  • a reticle stage RST that moves and a projection optical system PL that projects an image of the pattern of the reticle R onto the surface of a wafer W (substrate) coated with a photoresist (photosensitive material).
  • the exposure apparatus EX includes a wafer stage WST that holds and moves the wafer W, other drive mechanisms and sensors, a reticle library 9 that stores a plurality of reticles, a plurality of unexposed and / or A wafer cassette 7 for storing exposed wafers and a main controller (not shown) for comprehensively controlling the operation of the exposure apparatus EX are provided.
  • These members from the light source unit 2 to the main control device (not shown) are installed on the upper surface of the first floor FL1 in the clean room of the semiconductor device manufacturing factory, for example.
  • the exposure apparatus EX includes a box-like highly airtight chamber 10 installed on the floor FL1, and the inside of the chamber 10 is formed by a partition member 10d having two openings opened and closed by shutters 24R and 24W, for example.
  • the chamber is divided into an exposure chamber 10a and a loader chamber 10b.
  • An exposure body 4 including an illumination optical system ILS, a reticle stage RST, a projection optical system PL, and a wafer stage WST is installed in the exposure chamber 10a, and the reticle library 9 and the wafer cassette 7 are placed in the loader chamber 10b.
  • a reticle loader system and a wafer loader system are installed.
  • the exposure apparatus EX includes an overall air conditioning system for air conditioning the entire interior of the chamber 10.
  • This overall air conditioning system is installed on the upper surface of the second floor FL2 of the machine room below the first floor FL1, and has a filter device 26 having a plurality of chemical filters arranged in series, and an upper surface of the floor FL2.
  • An air conditioner 30 having an air conditioning main body 31 installed, a large air outlet 18 installed at the top of the exposure chamber 10a, and a small air outlet arranged on the bottom surface of the sub-chamber 22 that houses the illumination optical system ILS. 19R and a small outlet 19W disposed in the vicinity of the projection optical system PL.
  • the filter device 26 removes predetermined impurities from the air AR, which is an air-conditioning gas supplied via the pipe 25, and the air from which the impurities have been removed passes through the first duct 32 as indicated by an arrow A1. It supplies to the part 31 (details are mentioned later).
  • the air conditioner 30 includes a first duct 32, an air conditioning main body 31, a second duct 35 that connects the air conditioning main body 31 and the inside of the chamber 10 through an opening provided in the floor FL1, and, for example, A dustproof filter 36 such as an ULPA filter (Ultra Low Low Penetration Air Filter) that is arranged in the middle and removes minute particles from the air flowing inside is provided.
  • a dustproof filter 36 such as an ULPA filter (Ultra Low Low Penetration Air Filter) that is arranged in the middle and removes minute particles from the air flowing inside is provided.
  • the ducts 32 and 35 and the pipe 25 are formed using a material that generates a small amount of contaminants, such as stainless steel or fluororesin.
  • the air conditioning body 31 includes a temperature controller 33A that controls the temperature of air supplied through the first duct 32, a humidity controller 33B that controls the humidity of the air, and the air to the second duct 35 side. And a fan motor 34 for blowing air.
  • the air is controlled to have a temperature of, for example, 23 ° C. within a range of 20 ° C. to 30 ° C., and is supplied to the inside of the exposure chamber 10 a through the second duct 35 and the outlet 18 in a downflow manner.
  • the inside of the chamber 10 is set to a positive pressure state by the supply of air.
  • the air in the second duct 35 is supplied into the exposure chamber 10a through the branch pipes 35a and 35b and the corresponding outlets 19W and 19R. Part of the air in the exposure chamber 10a also flows into the loader chamber 10b.
  • the air that has flowed through the inside of the chamber 10 flows into the exhaust duct 44 under the floor through a large number of openings 45a provided in the bottom surface of the chamber 10 and a large number of openings 45b provided in the floor FL1.
  • the air in the exhaust duct 44 is exhausted after being purified through a filter (not shown). It should be noted that all or a part of the air flowing through the exhaust duct 44 can be returned to the pipe 25 side and reused.
  • the Z-axis is taken in parallel to the optical axis AX of the projection optical system PL, and X is perpendicular to the plane of FIG. 1 within a plane perpendicular to the Z-axis (substantially parallel to the horizontal plane in this embodiment).
  • the axis will be described by taking the Y axis parallel to the paper surface of FIG.
  • the scanning direction of reticle R and wafer W during scanning exposure is the Y direction.
  • the rotation directions around the X axis, Y axis, and Z axis are also referred to as ⁇ x, ⁇ y, and ⁇ z directions.
  • the light source unit 2 installed on the floor FL1 outside the chamber 10 is an exposure light source that generates ArF excimer laser light (wavelength 193 nm) as exposure light EL, and a beam that guides the exposure light EL to the illumination optical system ILS. And a light transmission optical system.
  • the exit end of the exposure light EL of the light source unit 2 is disposed in the exposure chamber 10a through the opening at the upper side of the chamber 10 in the + Y direction.
  • an ultraviolet pulse laser light source such as a KrF excimer laser light source (wavelength 248 nm), a harmonic generation light source of a YAG laser, a harmonic generation device of a solid laser (semiconductor laser, etc.), or a mercury lamp (i-line etc.) ) Etc. can also be used.
  • the illumination optical system ILS disposed in the upper portion of the chamber 10 includes an illuminance uniformizing optical system including an optical integrator, a reticle blind, as disclosed in, for example, US Patent Application Publication No. 2003/0025890. And a condenser optical system.
  • the illumination optical system ILS illuminates a slit-like illumination area elongated in the X direction of the pattern surface of the reticle R defined by the reticle blind with the exposure light EL with a substantially uniform illuminance.
  • the image of the pattern in the illumination area is imaged on the surface of the wafer W via the projection optical system PL that is telecentric on both sides and the projection magnification ⁇ is reduced (for example, 1/4).
  • a lower frame 12 is installed on the floor FL 1 in the exposure chamber 10 a of the chamber 10 via a plurality of pedestals 11.
  • a flat base member 13 is fixed to the center of the lower frame 12.
  • a flat wafer base WB is supported via three anti-vibration tables 14, and the wafer stage WST can be moved in the X and Y directions via an air bearing on the upper surface parallel to the XY plane of the wafer base WB. And is rotatable in the ⁇ z direction.
  • an optical system frame 16 is supported on the upper end of the lower frame 12 via, for example, three anti-vibration tables 15 arranged so as to surround the wafer base WB.
  • the projection optical system PL is disposed in the central opening of the optical system frame 16, and the upper frame 17 is fixed on the optical system frame 16 so as to surround the projection optical system PL.
  • a Y-axis laser interferometer 21WY is fixed to an end portion in the + Y direction on the bottom surface of the optical system frame 16, and an X-axis laser interferometer (not shown) is fixed to an end portion in the + X direction on the bottom surface.
  • Wafer interferometers composed of these interferometers each irradiate a reflecting surface (or moving mirror) on the side surface of wafer stage WST with a measurement beam of a plurality of axes, for example, a reference mirror (not shown) on the side surface of projection optical system PL. ) Is used as a reference to measure the X- and Y-direction positions of wafer stage WST and the rotation angles in ⁇ x, ⁇ y, and ⁇ z directions, and supply the measured values to a main controller (not shown).
  • a stage control system in a main controller has a drive mechanism (not shown) including a linear motor based on the measured value of the wafer interferometer and the measured value of an autofocus sensor (not shown).
  • the wafer stage WST is controlled so that the position and speed of the wafer stage WST in the X and Y directions and the rotation angle in the ⁇ z direction are controlled, and the surface of the wafer W is focused on the image plane of the projection optical system PL.
  • the Z stage (not shown) is controlled.
  • An alignment system ALG and the like for aligning the reticle R and the wafer W are also provided.
  • a sub-chamber 22 that houses the illumination optical system ILS is fixed to the upper portion of the upper frame 17 in the + Y direction.
  • the reticle stage RST is mounted on the upper surface of the upper frame 17 parallel to the XY plane so that the reticle stage RST can move at a constant speed in the Y direction, and can move in the X direction and rotate in ⁇ z.
  • a Y-axis laser interferometer 21RY is fixed to the + Y direction end of the upper surface of the upper frame 17, and an X-axis laser interferometer (not shown) is fixed to the + X direction end of the upper surface.
  • a reticle interferometer including these interferometers irradiates a movable mirror 21MY or the like provided on the reticle stage RST with a plurality of axes of measurement beams, for example, to provide a reference mirror (not shown) on the side surface of the projection optical system PL.
  • a reference mirror (not shown) on the side surface of the projection optical system PL.
  • the stage control system in the main control device is configured such that the speed and position of the reticle stage RST in the Y direction via a drive mechanism (not shown) including a linear motor based on the measurement value of the reticle interferometer, etc.
  • the position in the X direction and the rotation angle in the ⁇ z direction are controlled.
  • a local liquid immersion mechanism including, for example, a ring-shaped nozzle head disposed on the lower surface of the optical member at the lower end of the projection optical system PL.
  • a predetermined liquid (pure water or the like) is supplied to a local liquid immersion region between the optical member at the tip of the projection optical system PL and the wafer W.
  • a local immersion mechanism an immersion mechanism disclosed in, for example, US Patent Application Publication No. 2007/242247 can be used.
  • the exposure apparatus EX is a dry type, it is not necessary to provide the liquid immersion mechanism.
  • a reticle library 9 and a reticle loader 8 which is a horizontal articulated robot are installed on the upper surface of an upper support base 67.
  • the reticle loader 8 exchanges the reticle R between the reticle library 9 and the reticle stage RST through an opening opened and closed by the shutter 24R of the partition member 10d.
  • a wafer cassette 7 and a horizontal articulated robot 6 a for taking in and out the wafer between the wafer cassette 7 are installed on the upper surface of the lower support stand 68.
  • a wafer transfer device 6b constituting the wafer loader 6 together with the horizontal articulated robot 6a is installed. Wafer transfer device 6b transfers wafer W between horizontal articulated robot 6a and wafer stage WST through an opening opened and closed by shutter 24W of partition member 10d.
  • the reticle R and the wafer W are first aligned. Thereafter, the exposure of the exposure light EL to the reticle R is started, and a reticle stage RST is projected while projecting a partial image of the pattern of the reticle R onto one shot area on the surface of the wafer W via the projection optical system PL.
  • the pattern image of the reticle R is transferred to the shot area by a scanning exposure operation that moves the wafer stage WST in synchronization with the Y direction using the projection magnification ⁇ of the projection optical system PL as a speed ratio (synchronous scanning).
  • the reticle is applied to all shot areas of the wafer W by the step-and-scan method.
  • An R pattern image is transferred.
  • the exposure apparatus EX of the present embodiment maintains the illumination characteristics (illuminance uniformity, etc.) of the illumination optical system ILS and the imaging characteristics (resolution, etc.) of the projection optical system in a predetermined state, and the reticle R, projection In order to perform exposure with high exposure accuracy (resolution, positioning accuracy, etc.) while maintaining the atmosphere (space) in which the optical system PL and the wafer W are installed in a predetermined environment, as described above, the inside of the chamber 10
  • An overall air conditioning system including an air conditioner 30 that supplies temperature-controlled clean air in a downflow manner is provided.
  • the entire air conditioning system has a local air conditioning unit. That is, clean air whose temperature is controlled is supplied from the branch pipes 35b and 35a of the second duct 35 to the blowing portion 19R on the bottom surface of the sub chamber 22 and the blowing portion 19W on the bottom surface of the optical system frame 16, respectively.
  • the blowing portions 19R and 19W are disposed on the optical paths of the measurement beams of the Y-axis laser interferometer 21RY for the reticle stage RST and the Y-axis laser interferometer 21WY for the wafer stage WST, respectively.
  • the blowing units 19R and 19W blow out the temperature-controlled air on the optical path of the measurement beam with a substantially uniform wind speed distribution by a down flow method (or a side flow method). Similarly, temperature-controlled air is locally supplied to the optical path of the measurement beam of the X-axis laser interferometer. Accordingly, the positions of reticle stage RST and wafer stage WST can be measured with high accuracy by reticle interferometer 21R, wafer interferometer 21W, and the like.
  • a local air conditioner 60 is installed in the loader room 10b.
  • the local air conditioner 60 is disposed above the reticle library 9 and the wafer cassette 7, a small fan motor 61 disposed on the bottom surface of the support base 68, a duct 62 that supplies air blown by the fan motor 61 to the upper part.
  • the blowout ports 65 and 66 are provided.
  • the front end of the duct 62 is divided into branch pipes 62R and 62W that supply air to the outlets 65 and 66, respectively.
  • a dust-proof filter such as a ULPA filter is installed in the vicinity of the air inlets of the air outlets 65 and 66, and a filter box for storing a chemical filter for removing predetermined impurities in the duct 62 in the vicinity of the fan motor 61.
  • 63 and 64 are installed.
  • the chemical filter of the filter box 63 removes an organic gas (organic gas)
  • the chemical filter of the filter box 64 removes an alkaline gas (an alkaline substance gas) and an acidic gas (an acidic substance gas). Remove.
  • the air blown from the fan motor 61 is sent from the outlets 65 and 66 through the filter boxes 63 and 64 and the duct 62 in a downflow manner, respectively.
  • the wafer cassette 7 is supplied to the space in which it is placed.
  • the air flowing around the reticle library 9 is returned to the fan motor 61 through the periphery of the support base 67, the periphery of the wafer cassette 7 below the support base 67, and the periphery of the support base 68.
  • the air supplied from the outlet 66 to the periphery of the wafer cassette 7 is returned to the fan motor 61 through the periphery of the support base 68.
  • the air returned to the fan motor 61 is again supplied into the loader chamber 10b from the outlets 65 and 66 via the filter boxes 63 and 64 and the dustproof filter.
  • the air in the loader chamber 10d is kept clean by the local air conditioner 60.
  • the filter device 26 includes an airtight box-shaped casing 28 elongated in the Y direction, and partition plates 42A, 42B parallel to the XZ plane that divide the space in the casing 28 into four spaces in the Y direction in a substantially horizontal plane. 42C and a first type filter box 38, a second type filter box 40, which are installed in close contact with one surface of each of the partition plates 42A, 42B and 42C (the surface in the + Y direction in FIG. 1), And a first type filter box 38.
  • the filter device 26 includes two (three stages) filter boxes 38 and 40 arranged in series.
  • the first type filter box 38 is also referred to as a first filter box 38
  • the second type filter box 40 is also referred to as a second filter box 40.
  • the filter box is installed in a direction in which the filter plane intersects the horizontal direction, for example, the filter plane of the filter box is in the XZ plane.
  • the filter surface of the filter box may be installed inclined with respect to the XZ plane.
  • a taper may be formed on the installation surface of the filter box frame, or a taper member may be provided on the bottom plate 28 h of the casing 28.
  • the installation state of the filter box will be described as follows.
  • the filter device 26 has a hinge mechanism at a plurality of locations in the casing 28 in order to open the window portion 28b (see FIG. 2) for inserting and removing the filter boxes 38, 40 when the filter boxes 38, 40 are inserted or replaced. It has a door 29 that can be opened and closed through 29h (see FIG. 3).
  • An opening 28a is formed in the upper plate of the first space at the end in the + Y direction of the casing 28, and the end of the pipe 25 that takes in the air AR for air conditioning is attached to the opening 28a.
  • An opening 28g is formed in the side wall of the casing 28 in the ⁇ Y direction, and the first duct 32 is connected to the fourth space at the end of the casing 28 in the ⁇ Y direction through the opening 28g.
  • FIG. 2 shows the filter device 26 in a state where the door 29 of the casing 28 in FIG. 1 is opened.
  • the casing 28, the door 29, and the partition plates 42A to 42C are indicated by two-dot chain lines.
  • the door 29 has a gasket for sealing the periphery of the window 28b and the ends of the partition plates 42A to 42C and the door 29 when the window 28b of the casing 28 is closed by the door 29. 46 is fixed.
  • the gasket 46 can be formed of a material having excellent corrosion resistance and low degassing, such as a sheet of Teflon (registered trademark of DuPont) or a sheet of silicon rubber.
  • the first filter box 38 placed horizontally so as to be in close contact with the partition plate 42A at the end portion in the ⁇ Y direction and the partition plate 42 at the end portion in the + Y direction is provided in the opening of the frame 50.
  • a chemical filter 51 for removing an organic gas (organic gas) is held at 50f (see FIG. 3).
  • the second filter box 40 which is placed horizontally so as to be in close contact with the central partition plate 42B, has an alkaline gas (an alkaline substance gas) such as ammonia or amine in the opening 55f (see FIG. 3) of the frame 55, and A chemical filter 56 for removing acid gas (acid substance gas) is held.
  • each filter box 38, 40 in the Y direction is, for example, 200 to 400 mm, and the weight of each filter box 38, 40 is, for example, about 10 to 20 kg.
  • the organic gas removal chemical filter 51 for example, an activated carbon filter or a ceramic filter can be used.
  • the chemical filter 56 for removing alkaline gas and acid gas an additive activated carbon filter, an ion exchange resin filter, an ion exchange fiber filter, an additive ceramic filter, or the like can be used.
  • the frames 50 and 55, the partition plates 42A to 42C, the casing 28, and the door 29 are each made of a material that is corrosion-resistant and has little degassing, for example, aluminum (alumite treatment) with an oxide film (aluminum oxide or the like) formed on the surface. Aluminum), stainless steel or the like.
  • the frames 50 and 55 and the like can be formed of a material (such as a plywood covered with polyethylene or a fluorine-based resin) including a resin material that has corrosion resistance and little degassing.
  • the transmittance of the exposure light EL is improved in the exposure chamber 10a of the chamber 10, and the optical element is formed on the surface by the interaction between the organic gas and the exposure light EL.
  • Generation of cloudy material is suppressed.
  • the alkaline gas and the acid gas changes in the photoresist characteristics of the wafer W and the like are suppressed.
  • the photoresist is a chemically amplified photoresist
  • the generated acid may react to form a slightly soluble layer on the photoresist surface. . Therefore, removal of alkaline gases such as ammonia and amines is particularly effective.
  • the configuration of the chemical filter in the filter boxes 63 and 64 in the loader chamber 10b in FIG. 1 is the same as the configuration of the chemical filters 51 and 56. However, the filter boxes 63 and 64 may be smaller than the filter boxes 38 and 40.
  • the filter device 26 is fixed to the side wall 28i in the ⁇ X direction of the casing 28, and positioning blocks 48A, 48B for positioning the filter boxes 38, 40, 38 with respect to the partition plates 42A, 42B, 42C, respectively. 48C and moving levers 58A, 58B, and 58C for biasing the filter boxes 38, 40, and 38 near the center in the Z direction with respect to the positioning blocks 48A, 48B, and 48C, respectively.
  • Each of the positioning blocks 48A, 48B, and 48C has tapered portions 48Aa, 48Ba, and 48Ca formed by planes inclined at a predetermined taper angle ⁇ (see FIG. 3) clockwise with respect to the ZY plane.
  • FIG. 3 is a plan sectional view showing the filter device 26 in a state in which the door 29 of the casing 28 in FIG. 2 is closed.
  • the air intake opening 28 a formed in the upper plate of the casing 28 is indicated by a two-dot chain line.
  • openings 42Aa, 42Ba, and 42Ca through which air that has passed through the filter boxes 38 and 40 pass are formed in the partition plates 42A to 42C, respectively.
  • the space in the casing 28 is divided into four spaces 28c, 28d, 28e, and 28f in order from the + Y direction by the partition plates 42A to 42C, and the first space 28c communicates with the pipe 25 in FIG. 1 through the opening 28a.
  • the fourth space 28f communicates with the first duct 32 of FIG. 1 through the opening 28g.
  • the taper angles ⁇ of the taper portions 48Aa to 48Ca of the positioning blocks 48A to 48C are equal to each other, and the taper angle ⁇ is, for example, 20 ° to 40 °. As an example, the taper angle ⁇ is 30 °.
  • the moving levers 58A, 58B, 58C having the same configuration are arranged with axes parallel to the Z axis with respect to the fulcrum members 59A, 59B, 59C fixed to the side walls in the + Y direction of the partition plates 42B, 42C and the casing 28, respectively. It is connected so as to be rotatable around ( ⁇ z direction).
  • the moving lever 58A includes a rod 58A1 rotatably connected to the fulcrum member 59A, and a hemispherical contact member 58A2 fixed to the filter box 38 side and the opposite side of the tip of the rod 58A1. And a handle 58A3.
  • FIGS. 4A and 4B are perspective views when the filter boxes 38 and 40 are viewed from the partition plates 42A and 42B side of FIG. 2, respectively.
  • the orthogonal coordinate systems (X, Y, Z) in FIGS. 4A and 4B are coordinate systems in a state where the filter boxes 38 and 40 are installed at target positions in the filter device 26, respectively. Represents.
  • the first filter box 38 includes a substantially annular frame 50 provided with a substantially square opening 50f at the center, a chemical filter 51 held in the opening 50f, and a frame. And a pair of convex handle portions 70 ⁇ / b> A fixed to 50.
  • the material of the gasket 54 is the same as that of the gasket 46.
  • a substantially square annular gasket 54 (seal member) fixed to the first end surface 50a in the ⁇ Y direction parallel to the XZ plane of the frame 50 by adhesion or the like so as to surround the opening 50f.
  • the gasket 54 in the other party (for example, partition plate) with which the 1st end surface 50a closely_contact
  • the opening 50f of the first filter box 38 may be a rectangular shape such as a quadrangle or a polygonal shape.
  • the shape of the frame 50 is not limited to a square, and may be a rectangle or a polygon.
  • the filter box 38 is formed on the entire side surface on the ⁇ X direction side and the side surface on the + X direction side among the four side surfaces of the frame 50, from the second end surface 50 g in the + Y direction parallel to the XZ plane of the frame 50.
  • the first taper portion 50b and the second taper portion 50c are symmetrically formed of a plane formed so as to be inclined to the outside of the frame 50 toward the first end face 50a.
  • the second side surface is a surface opposite to the first side surface with respect to the chemical filter 56 (or the opening 50f of the frame 50).
  • the first taper portion 50b is inclined at a taper angle ⁇ clockwise with respect to the ZY plane
  • the second taper portion 50c is inclined at a taper angle ⁇ counterclockwise with respect to the ZY plane.
  • the taper angle ⁇ is equal to the taper angle of the taper portions 48Aa to 48Ca of the positioning blocks 48A to 48C in FIG. Therefore, in FIG. 3, when the angle formed by the first tapered portion 50b with respect to the end surface 50a of the frame 50 is ⁇ , the sum of the angle ⁇ and the taper angle ⁇ is 90 °.
  • the handle portion 70A is fixed at a position shifted in the ⁇ Z direction from the center portion of the first taper portion 50b of the frame 50, and at a position shifted in the + Z direction from the center portion of the second taper portion 50c.
  • the handle 70A is fixed. That is, the pair of handle portions 70A are substantially point-symmetric with respect to the center of the frame 50.
  • the ⁇ Z direction and + Z direction side surfaces of the frame 50 are installation surfaces 50d and 50e parallel to the XY plane, respectively.
  • the mounting surface 50d of the frame 50 of the filter box 38 is placed on the upper surface of the bottom plate 28h of the third space 28e of the casing 28, and as shown in FIG. 3, the first tapered portion 50b of the frame 50 is the tapered portion of the positioning block 48A.
  • the state where the end face 50a of the frame 50 is brought into close contact with the partition plate 42A via the gasket 54 while being in contact with 48Aa is the installation position Q1 of the filter box 38 in the third space 28e.
  • the filter box 38 is placed horizontally and is stably stationary by its own weight.
  • the tapered portion 50b can be in close contact with the tapered portion 48Aa even if the handle portion 70A is present.
  • the installation surface 50d of the frame 50 of the filter box 38 is placed on the upper surface of the bottom plate 28h, and the first tapered portion 50b of the frame 50 is positioned in the positioning block 48C.
  • the end face 50a is in close contact with the partition plate 42C via the gasket 54.
  • the handle portion 70A provided in the first taper portion 50b is accommodated in the concave portion 48Cb of the taper portion 48Ca of the positioning block 48C.
  • the shape of the filter box 38 is the same even if it is rotated 180 ° around the axis parallel to the Y axis ( ⁇ y direction) in a state where the pair of handle portions 70A is removed. It is also possible to place the installation surface 50e on the bottom plate 28h of the casing 28. When the installation surface 50e is thus placed on the bottom plate 28h, the second taper portion 50c of the frame 50 contacts the taper portion 48Aa (48Ca) of the positioning block 48A (48C) and is provided on the second taper portion 50c. Since the handle portion 70A is accommodated in the recess 48Ab (48Cb), the filter box 38 can be accurately installed at the installation position Q1 or Q3.
  • the second filter box 40 includes a substantially annular frame 55 provided with an opening 55f in the center of the same shape as the frame 50, and a chemical filter 56 held in the opening 55f. And have. Further, the filter box 40 is formed on the entire side surface of the frame 55 on the ⁇ X direction side and the side surface in the + X direction from the second end surface 55g in the + Y direction toward the first end surface 55a in the ⁇ Y direction.
  • the first tapered portion 55b and the second tapered portion 55c are formed symmetrically so as to be inclined at a taper angle ⁇ on the outside of 55.
  • the second filter box 40 may have a gasket 54 fixed to the first end surface 55a of the frame 55 in the ⁇ Y direction so as to surround the opening 55f.
  • the opening 55f of the second filter box 40 may be a rectangular shape such as a quadrangle or a polygonal shape, like the first filter box 38.
  • the shape of the frame 55 is not limited to a square, and may be a rectangle or a polygon.
  • the frames 50 and 55 can be manufactured by, for example, molding.
  • the filter box 40 is fixed to a position shifted in the + Z direction from the center of the first taper portion 55 b and a pair of positions fixed on the second taper portion 55 c that is substantially point-symmetric with respect to this position and the center of the frame 55. It has a handle 70B.
  • the side surfaces of the frame 55 in the ⁇ Z direction and the + Z direction are installation surfaces 55d and 55e, respectively.
  • the shapes of the first filter box 38 and the second filter box 40 are different in that the positions of the pair of handle portions 70A and 70B are shifted in the opposite direction along the Z direction. Yes. This difference in shape is maintained even when the filter boxes 38 and 40 are rotated 180 ° in the ⁇ y direction.
  • the pair of handle portions 70A of the frame 50 in FIG. 4A are fixed to the screw holes of the taper portions 50b and 50c with, for example, bolts (not shown), and the handle portions 70A and Z are formed from the centers of the taper portions 50b and 50c.
  • Attachment areas E1 and E2 in which screw holes to which the handle portion 70A can be attached are formed at positions symmetrical to the direction are set.
  • the attachment position with respect to the taper portions 50b and 50a of the pair of handle portions 70A is variable along a direction different from the inclination direction, in this embodiment, a direction orthogonal to the inclination direction. Therefore, the frame 50 can be used as the frame 55 for the second filter box 40 by attaching the handle portion 70A to the attachment regions E1 and E2 of the frame 50.
  • the attachment position of the pair of handle portions 70B with respect to the taper portions 55b and 55a of the frame 55 is variable along the direction in which there is no inclination between the attachment regions E3 and E4. Therefore, the frame 55 can be used as the frame 50 for the first filter box 38 by attaching the handle portion 70B to the attachment regions E3 and E4 of the frame 55.
  • the installation surface 55d of the frame 55 of the filter box 40 is placed on the upper surface of the bottom plate 28h of the second space 28d of the casing 28, and as shown in FIG. 3, the first taper portion 55b of the frame 55 is the taper portion of the positioning block 48B.
  • a state where the end face 55a of the frame 55 is brought into close contact with the partition plate 42B via the gasket 54 while being in contact with 48Ba is the installation position Q2 of the filter box 40 in the second space 28d.
  • the filter box 40 is also placed horizontally and is stably stationary by its own weight.
  • the concave portion 48Bb is formed at a position facing the handle portion 70B of the tapered portion 48Ba of the positioning block 48B, the tapered portion 55b can be in close contact with the tapered portion 48Ba even if the handle portion 70B is present.
  • the shape of the filter box 40 is the same even when rotated 180 ° in the ⁇ y direction. Therefore, the other installation surface 55e of the frame 55 is placed on the bottom plate 28h of the casing 28 with the pair of handle portions 70B removed. It is also possible to mount it. Thus, when the installation surface 55e is placed on the bottom plate 28h, the second taper portion 55c of the frame 55 contacts the taper portion 48Ba of the positioning block 48B, and the handle portion 70B provided on the second taper portion 55c is a recess 48Bb. Therefore, the filter box 40 can be accurately installed at the installation position Q2.
  • the position of the concave portion 48Cb of the positioning block 48C is at a low position in accordance with the handle portion 70A (the same applies to the concave portion 48Ab of the positioning block 48A), and the position of the concave portion 48Bb of the positioning block 48B is the handle portion. It is at a high position to match 70B. Accordingly, when the second filter box 40 is to be installed at the installation position Q3 or Q1 in the space 28c or 28e, the handle portion 70B of the filter box 40 mechanically interferes with the tapered portion 48Ca or 48Aa of the positioning block 48C or 48A. Therefore, it is possible to prevent the filter box 40 from being erroneously installed at the installation positions Q3 and Q1.
  • the handle portion 70A of the filter box 38 mechanically interferes with the taper portion 48Ba of the positioning block 48B. It is possible to prevent the filter box 38 from being installed by mistake.
  • the position of the handle portion 70A of the filter box 38 and the position of the handle portion 70B of the filter box 40 are different, and the corresponding recesses 48Aa, 48Ca of the positioning blocks 48A, 48C in the casing 28 are provided. And the position of the recess 48Bb of the positioning block 48B are different.
  • the gas in the first space 28c sandwiched between the upper plate in which the opening 28a of the casing 28 is formed and the partition plate 42C always passes through the chemical filter 51 of the filter box 38 and then passes through the opening 42Ca. Then, it flows into the second space 28d sandwiched between the partition plates 42B and 42C. Similarly, the gas in the space 28d always passes through the chemical filter 56 of the filter box 40 and then flows into the third space 28e sandwiched between the partition plates 42A and 42B through the opening 42Ba.
  • the gas in the space 28e always passes through the chemical filter 51 of the filter box 38, and then passes through the opening 42Aa, the fourth space 28f on the back surface of the partition plate 42A, and the opening 28g on the side wall of the casing 28. 2 flows into the first duct 32.
  • the air AR flowing from the upper opening 28a in the + Y direction of the casing 28 always has two (two-stage) filter boxes 38 for organic gas removal and one (one-stage) alkaline gas and acid gas. Since the air passes through the filter box 40 for removal and is supplied to the air conditioner 30 in FIG. 1, air from which impurities are highly removed is supplied into the chamber 10.
  • 5A to 6B are plan views showing the filter device 26 in which the casing 28 is shown in cross section.
  • two filter boxes 38 and one filter box 40 are first installed in the casing 28, two filter boxes 38 filled with an unused chemical filter 51 of FIG. 4A, and FIG. And a single filter box 40 filled with an unused chemical filter 56.
  • the moving levers 58A to 58C are moved forward (the window portion of the casing 28). 28b outside).
  • the operator holds the handle 70A of the first filter box 38, and places the installation surface 50d of the filter box 38 (frame 50) on the bottom plate 28h (see FIG. 2) in the third space 28e of the casing 28. Put. Then, the operator pushes the filter box 38 into the third space 28e as indicated by the arrow B2. Next, as indicated by an arrow B3 in FIG. 5B, the operator engages (contacts) the first tapered portion 50b of the filter box 38 with the tapered portion 48Aa of the positioning block 48A. One handle 70A of the filter box 38 fits in the recess 48Ab of the positioning block 48A. Then, as indicated by the arrow B4, the moving lever 58A is pressed against the second tapered portion 50c of the filter box 38.
  • the operator further rotates the moving lever 58A as indicated by an arrow B5 in FIG. 6A to urge the filter box 38 in the ⁇ X direction and the ⁇ Y direction.
  • the filter box 38 moves to the installation position Q1 in the casing 28, and the end surface 50a of the filter box 38 comes into close contact with the partition plate 42A via the gasket 54.
  • the movement lever 58A may be further rotated after the movement lever 58A is pressed against the second tapered portion 50c of the filter box 38. .
  • the operator holds the handle 70B of the second filter box 40, and places the installation surface 55d of the filter box 40 (frame 55) on the bottom plate 28h in the second space 28d of the casing 28. Then, the operator pushes the filter box 40 into the second space 28d of the casing 28 as indicated by an arrow B7.
  • the operator engages (contacts) the first taper portion 55b of the filter box 40 with the taper portion 48Ba of the positioning block 48B, and makes the second taper portion 55c of the filter box 40 contact the second taper portion 55c.
  • the moving lever 58B is pressed.
  • One handle 70B of the filter box 40 fits in the recess 48Bb of the positioning block 48B.
  • the operator further rotates the moving lever 58B as indicated by the arrow B8, and moves the filter box 40 to the installation position Q2 in the casing 28 as indicated by the arrow B9.
  • the end surface 55a of the filter box 40 is in close contact with the partition plate 42B via the gasket 54.
  • the movement lever 58B may be further rotated after the movement lever 58B is pressed against the second tapered portion 55c of the filter box 40.
  • the third filter box 38 is moved in the first space 28c of the casing 28, the moving lever 58C is rotated, and the filter box 38 is moved to the installation position in the first space 28c. Install.
  • the door 29 of the casing 28 is closed and locked to complete the installation of the filter boxes 38 and 40.
  • the first taper portion 50b (55b) of the filter box 38 (40) is pressed against the taper portion 48Aa (48Ba) of the positioning block 48A (48B) to urge the filter box 38 (40).
  • the filter box 38 (40) is installed in a short time at the installation position Q1 (Q2) on the front surface of the partition plate 42A (42B). Therefore, the filter box 38 (40), and thus the internal chemical filter 51 (56) can be efficiently and easily positioned at the target position.
  • the operator when exchanging the filter boxes 38 and 40 in the casing 28, the operator first releases the lock of the casing 28 and opens the door 29, and moves as shown by an arrow D1 in FIG. 6B.
  • the lever 58C is removed from the filter box 38.
  • the operator holds the handle 70A of the filter box 38 in the first space 28c, and carries out the filter box 38 as indicated by an arrow D2.
  • the operator after removing the moving lever 58B from the filter box 40 as indicated by an arrow D3 in FIG. 6A, the operator holds the handle 70B of the filter box 40 in the second space 28d, and the filter box
  • the 40 first taper portions 55b are moved forward along the taper portion 42Ba of the positioning block 48B.
  • the operator pulls out the filter box 40 from the second space 28d of the casing 28 as indicated by an arrow D4.
  • the operator installs new filter boxes 38 and 40 at target positions in the casing 28 by the same process as the installation operation of the filter boxes 38 and 40 described above.
  • the exchange of the filter boxes 38 and 40 is completed.
  • the filter boxes 38 and 40 can be easily pulled out from the installation position, the filter boxes 38 and 40 in the casing 28 can be easily and efficiently replaced.
  • the exposure apparatus EX of the present embodiment includes an entire air conditioning system including the filter device 26 and the air conditioner 30, and the filter device 26 is a device that holds a plurality of filters including the chemical filter 51 and the chemical filter 56.
  • the filter device 26 (filter holding device) is formed on a substantially annular frame 50 (first frame) that holds the chemical filter 51 (first filter) and a side surface (first side surface) in the ⁇ X direction of the frame 50.
  • a first tapered portion 50b (first inclined portion as a first shape changing portion) that gradually slopes outward from the frame 50 from the second end face 50g side toward the first end face 50a side, and a first tapered portion And a convex handle portion 70A (first handle portion) provided at 50b.
  • the filter device 26 is formed on a substantially annular frame 55 (second frame) that holds the chemical filter 56 (second filter) and a side surface (second side surface) in the ⁇ X direction of the frame 55, and the second A first tapered portion 55b (second inclined portion serving as a second shape changing portion) that is gradually inclined to the outside of the frame 55 from the end surface 55g side toward the first end surface 55a side, and the first tapered portion 55b.
  • a convex handle 70B (second handle). Further, a gasket 54 (seal member) is provided on the first end face 50 a of the frame 50, and a gasket 54 (seal member) is provided on the first end face 55 a of the frame 55. Then, the positional relationship of the handle portion 70A with respect to the frame 50 (the distance from the side edge (installation surface 50d) in the ⁇ Z direction on the side surface where the first taper portion 50b is formed) and the positional relationship of the handle portion 70B with respect to the frame 55 (the first relationship) The side surface on which the one taper portion 55b is formed is different from the side end in the ⁇ Z direction (distance from the installation surface 55d).
  • the tapered portion 48Aa having the same inclination angle as the first tapered portions 50b and 55b.
  • 48Ba are provided with positioning blocks 48A, 48B.
  • the frames 50 and 55 are biased (moved) so that the first taper portions 50b and 55b of the frames 50 and 55 move along the taper portions 48Aa and 48Ba of the casing 28.
  • Installation of the (chemical filters 51, 56) with respect to the target position in the casing 28 can be performed efficiently and easily.
  • the first tapered portions 50b and 55b of the frames 50 and 56 can perform two functions of movement and positioning.
  • the positional relationship of the handle portion 70A with respect to the frame 50 and the positional relationship of the handle portion 70B with respect to the frame 55 are different. Therefore, since the frame 50 and the frame 55 can be easily distinguished from each other in appearance, it is possible to prevent the chemical filters 51 and 56 from being installed at different positions. As a result, for example, the used chemical filters 51 and 56 can be accurately replaced. Can do.
  • the filter device 26 has a side surface (first side surface) in the + X direction opposite to the side surface (first side surface) where the first taper portion 50b of the frame 50 of the filter box 38 is formed with the chemical filter 51 interposed therebetween.
  • Second tapered portion 50c (third inclined portion) that is formed on the three side surfaces and gradually inclines toward the outside of the frame 50 symmetrically with the first tapered portion 50b from the second end surface 50g toward the first end surface 50a side.
  • the filter device 26 has a side surface (fourth side surface) in the + X direction opposite to the side surface (second side surface) where the first taper portion 55b of the frame 55 of the filter box 40 is formed with the chemical filter 56 interposed therebetween.
  • second tapered portion 55c (fourth inclined portion) that is gradually inclined to the outside of the frame 55 symmetrically with the first tapered portion 55b.
  • the second taper portions 50c and 55c of the frames 50 and 55 are moved along the taper portions 48Aa and 48Ba of the casing 28, so that the frames 50 and 55 (chemical filter) 51, 56) can be efficiently installed at the target position in the casing 28.
  • the first taper portion 50b and the second taper portion 50c of the frame 50 are formed on the entire surface of the two side surfaces of the frame 50, and the first taper portion 55b and the second taper portion 55c of the frame 55 are formed on the frame 55. It is formed on the entire surface of the two side surfaces. Therefore, it is easy to process the tapered portions 50b and 50c.
  • the tapered portions 50b and 50c may be formed only on a part of the corresponding side surface of the frame 50.
  • the corresponding positioning blocks 48A and 48C on the casing 28 side may be formed with a tapered portion only in a portion corresponding to the tapered portion 50b.
  • the tapered portions 55b and 55c are each formed in a plane, that is, in a straight line shape, and positioning corresponding to these. Since the tapered portions 48Aa and 48Ba of the blocks 48A and 48B are also formed in a plane, the tapered portions 50b and 50c and the like can be easily formed.
  • the tapered portions 50b and 50c and the tapered portions 55b and 55c may be formed in a convex or concave spherical shape, that is, a curved shape.
  • the taper portions 48Aa and 48Ba of the positioning blocks 48A and 48B corresponding to these are formed in a concave or convex spherical shape, and the filter box using the positioning blocks 48A and 48B is used in the same manner as in the above embodiment. 38 and 40 can be moved and positioned.
  • a convex handle portion 70A (first handle portion) provided on the side surface in the ⁇ X direction of the frame 50 of the filter box 38 in FIG. 4A is provided in the first taper portion 50b.
  • a tapered portion 48Aa of the positioning block 48A in the casing 28 is provided with a concave portion 48Ab through which the handle portion 70A can pass. Therefore, even if there is the handle portion 70A, the first taper portion 50b of the frame 50 can be moved in close contact with the taper portion 48Aa of the positioning block 48A. The same applies to the handle portion 70B of the first tapered portion 55b of the filter box 40.
  • the convex handle portion 70A (third handle portion) provided on the side surface in the + X direction of the frame 50 of the filter box 38 in FIG. 4A is provided in the second tapered portion 50c.
  • the second taper portion 50c of the frame 50 is moved to the taper portion 48Aa of the positioning block 48A. It can move in close contact with.
  • the handle portion 70B (fourth handle portion) of the second tapered portion 55c of the filter box 40.
  • the frame 50 may be formed with a concave handle portion instead of the convex handle portion 70A.
  • a concave handle portion may be formed on the frame 55 instead of the convex handle portion 70B.
  • a handle portion 70A is provided near the center of the second tapered portion 50c of the frame 50 of the first filter box 38 at a position F2 near the end surface 50a, and the first tapered portion 50b.
  • the handle portion 70A may be provided at a position symmetrical to the position F2.
  • a recess 48Ab is formed at a position corresponding to the tapered portion 48Aa of the positioning block 48A of FIG. Further, in FIG.
  • a handle portion 70B is provided near the center of the second taper portion 55c of the frame 55 of the second filter box 40 at a position F4 away from the end face 50a, and the position of the first taper portion 55b.
  • a handle portion 70B is provided at a position symmetrical to F4.
  • a recess 48Bb is formed at a position corresponding to the tapered portion 48Ba of the positioning block 48B of FIG.
  • the positional relationship between the handle portions 70A and 70B with respect to the frames 50 and 55 is different from the distance between the end surfaces 50a and 55a. Therefore, the operator can identify the filter boxes 38 and 40 from the positions of the handle portions 70A and 70B with respect to the frames 50 and 55.
  • the filter device 26 includes the movement levers 58A to 58C for urging the frames 50 and 55 of the filter boxes 38 and 40 toward the positioning blocks 48A to 48C in the casing 28, the frame 50, The movement of 55 can be performed smoothly.
  • the movement levers 58A to 58C are not necessarily provided.
  • the partition plates 42A to 42C in the casing 28 are substantially parallel to the plane including the vertical line (substantially perpendicular to the horizontal plane), but in the present embodiment, since the positioning blocks 48A to 48C are provided, the filter boxes 38, 40 are provided. Can be moved and positioned smoothly. Note that the partition plates 42A to 42C may be inclined obliquely with respect to the plane including the vertical line, for example.
  • the chemical filter 51 in the filter box 38 (in the frame 50) removes the organic gas (organic substance) in the gas passing through it, and the chemical in the filter box 40 (in the frame 55). Since the filter 56 (filter medium) removes alkaline gas and acidic gas in the gas passing through the filter 56, the air in which impurities are highly removed can be supplied into the chamber 10 in which the exposure main body 4 is housed. .
  • the filter in the frame 56 may be, for example, a filter that removes at least one of an alkaline substance and an acidic substance in a gas passing through the frame 56.
  • the impurity which a chemical filter removes is arbitrary, For example, you may make it absorb organic gas, alkaline gas, and acidic gas with one chemical filter.
  • any filter (filter medium) other than the chemical filter can be used for the filters in the frames 50 and 55.
  • a dustproof filter for removing minute particles (particles) such as a HEPA filter or a ULPA filter may be used.
  • the frames 50 and 55 provided in the filter device 26 are provided.
  • the number of is arbitrary.
  • the filter device 26 may be provided with only one or a plurality of frames 50 or a plurality of frames for storing a plurality of filters including one or a plurality of frames 55.
  • the casing 28 of the filter device 26 is partitioned into a plurality of spaces by the partition plates 42A to 42C. However, the filter boxes 38 and 40 (frames 50 and 55) are simply divided without partitioning the casing 28 by the partition plates 42A to 42C. ) Can be stacked alternately, for example.
  • the exposure apparatus EX of the present embodiment is an exposure main body that exposes the wafer W in the exposure apparatus that exposes the wafer W (substrate) through the pattern of the reticle R and the projection optical system PL with the exposure light EL. 4, a filter device 26 according to the present embodiment, and an air conditioner 30 that blows air taken in from the outside of the chamber 10 into the chamber 10 through the filter device 26.
  • the filter boxes 38 and 40 (frames 50 and 55) of the filter device 26 can be exchanged efficiently, and the frames 50 and 55 can be positioned with high accuracy. Maintenance of the apparatus can be performed efficiently, and impurities in the air in the chamber 10 can be removed with high accuracy.
  • a frame having a tapered portion similar to the frames 50 and 55 of the filter boxes 38 and 40 is used as the frame of the filter boxes 63 and 64 of the local air conditioner 60 in the loader chamber 10b.
  • the filter boxes 63 and 64 may be housed in a casing having a positioning block formed with a tapered portion similar to the positioning blocks 48A to 48C.
  • FIG. 7 (A) is a perspective view showing a first filter box 38A and a positioning block 48A corresponding to the first filter box 38A of the first modification of the above embodiment
  • FIG. 7 (B) is a first modification thereof. It is a perspective view which shows the 2nd filter box 40A of an example, and the positioning block 48B corresponding to this.
  • the filter of the first modification example is obtained by installing the positioning block 48A of FIG. 7A and the positioning block 48B of FIG. 7B in the casing 28 instead of the positioning blocks 48A, 48C and 48B of FIG.
  • the boxes 38A, 40A can be installed in the casing 28.
  • the first filter box 38A includes a substantially annular frame 50 that holds the chemical filter 51, and a gasket 54A (a part of the gasket 54 is provided on the first end surface 50a of the frame 50). And a handle portion 50b1 (first handle portion) formed of a recess provided on a side surface (first side surface) in the ⁇ X direction of the frame 50, and a handle portion 50b1 on the side surface in the ⁇ X direction of the frame 50.
  • Two first tapered portions 50b2 and 50b3 (first inclined portions) formed so as to be sandwiched in the Z direction and gradually inclined outward from the second end surface 50g of the frame 50 toward the first end surface 50a side. 2 parts).
  • the filter box 38A has a handle portion 50c1 (third handle portion) formed of a recess provided on a side surface (third side surface) in the + X direction of the frame 50 and a handle portion 50c1 on the side surface in the + X direction of the frame 50 Z.
  • Two second tapered portions 50c2 and 50c3 (two portions of the second inclined portion) that are formed so as to be sandwiched in the direction and are inclined symmetrically with the first tapered portions 50b2 and 50b3.
  • grip portions 49A are provided on the handle portions 50b1 and 50c1 so that the operator can easily hold them.
  • the position of the handle portion 50b1 in the Z direction with respect to the installation surface of the frame 50 is lower than the position of the handle portion 50c1 in the Z direction, and the handle portions 50b1 and 50c1 have a rotationally symmetrical positional relationship with respect to the center of the frame 50. Is provided. In other words, the distance in the Z direction from the installation surface below the frame 50 of one handle portion 50b1 is equal to the distance in the Z direction from the installation surface above the frame 50 of the other handle portion 50c1. Furthermore, a convex portion 49C is provided at a position corresponding to the handle portion 50b1 (and 50c1) of the tapered portion 48Aa of the positioning block 48A.
  • the height of the convex portion 49C is set lower than the depth from the tapered portions 50b2 and 50b3 to the grip portion 49A. Therefore, the taper portions 50b2 and 50b3 (or 50c2 and 50c3) of the frame 50 can be brought into close contact with the taper portion 48Aa of the positioning block 48A.
  • the second filter box 40A includes a substantially annular frame 55 that holds the chemical filter 56, and a gasket 54B (a part of the gasket 54) provided on the first end surface 55a of the frame 55. ) And a pair of handle portions 55b1 and 55c1 (second shape) including a recess provided on a side surface (second side surface) in the ⁇ X direction of the frame 55 and a side surface (fourth side surface) opposite to the ⁇ X direction.
  • First tapered portions 55b2 and 55b3 (the second inclined portion of the second inclined portion), which are formed so as to sandwich the handle portions 55b1 and 55c1 in the Z direction on the two side surfaces in the X direction of the frame 55, respectively.
  • Two portions) and second tapered portions 55c2 and 55c3 two portions of the fourth inclined portion).
  • the grip portions 49B are provided on the handle portions 55b1 and 55c1.
  • the positional relationship in the Z direction of the handle portions 55b1 and 55c1 with respect to the frame 55 is opposite to the positional relationship in the Z direction of the handle portions 50b1 and 50c1 with respect to the frame 50.
  • the distance in the Z direction from the installation surface below the frame 55 of one handle portion 55b1 is equal to the distance in the Z direction from the installation surface above the frame 55 of the other handle portion 55c1.
  • the distance in the Z direction from the installation surface below the frame 55 of the one handle portion 55b1 of the filter box 40A and the distance in the Z direction from the installation surface below the frame 50 of the one handle portion 50b1 of the filter box 38A. are different from each other.
  • a convex portion 49D is provided at a position corresponding to the handle portion 55b1 (and 55c1) of the tapered portion 48Ba of the positioning block 48B. Therefore, if the frame 50 of the first filter box 38A is erroneously brought into contact with the positioning block 48B, the convex portion 49D and the first taper portion 50b2 (or 50c2) of the frame 50 mechanically interfere with each other. On the other hand, the taper portions 55b2 and 55b3 (or 55c2 and 55c3) of the frame 55 can be brought into close contact with the taper portion 48Ba of the positioning block 48B. Conversely, if the frame 55 of the second filter box 40A is accidentally brought into contact with the positioning block 48A of FIG.
  • FIG. 8A is a perspective view showing a first filter box 38B and a positioning block 48A1 corresponding to the first filter box 38B of the second modification of the above embodiment, and FIG. It is a perspective view showing the 2nd filter box 40B of the 1st modification, and positioning block 48A2 corresponding to this.
  • the positioning block 48A1 of FIG. 8A and the positioning block 48A1 of FIG. 8B are installed in the casing 28 instead of the positioning blocks 48A, 48C and 48B of FIG. Boxes 38B and 40B (frames 50A and 55A) can be installed in casing 28.
  • the first filter box 38B includes a substantially annular frame 50A (first frame) that holds the chemical filter 51, and a gasket 54 provided on the first end surface in the ⁇ Y direction of the frame 50A.
  • a handle portion 70C (first handle portion) made of a convex portion provided on the side surface in the + Z direction of the frame 50, and the + Z direction side of the side surface 50Ab in the ⁇ X direction of the frame 50A and facing the gasket 54 side.
  • a first tapered portion 50Abt (first inclined portion) inclined at a taper angle ⁇ on the outside of the frame 50A.
  • the side surface 50Ac in the + X direction of the frame 50A is parallel to the ZY plane and is not inclined.
  • the taper portion 48A1a having the taper angle ⁇ of the positioning block 48A1 is formed only in a portion corresponding to the first taper portion 50bt of the frame 50A. Therefore, the first taper portion 50Abt of the frame 50A can be brought into close contact with the taper portion 48A1a of the positioning block 48A1.
  • the second filter box 40B includes a substantially annular frame 55A (second frame) for holding the chemical filter 56, a gasket 54 provided on the first end surface of the frame 55A, A handle portion 70D (second handle portion) made of a convex portion provided on the side surface in the + Z direction of the frame 55 and a ⁇ Z direction side of the side surface 55Ab in the ⁇ X direction of the frame 55A are formed toward the gasket 54 side.
  • a first tapered portion 55Abt (second inclined portion) that is inclined at a taper angle ⁇ is provided outside the frame 55A.
  • the side surface 55Ac in the + X direction of the frame 55A is parallel to the ZY plane and is not inclined.
  • the taper portion 48A2a having the taper angle ⁇ of the positioning block 48A2 is formed only in a portion corresponding to the first taper portion 55Abt of the frame 55A.
  • the positional relationship in the Z direction of the first tapered portion 55Abt with respect to the frame 55A is opposite to the positional relationship in the Z direction of the first tapered portion 50Abt with respect to the frame 50A.
  • the taper portion 48A1a of the positioning block 48A1 and the taper portion 48A2a of the positioning block 48A2 have different positions in the Z direction. Therefore, the frames 50A and 55A can be easily identified from the appearance. Further, it is possible to prevent the first filter box 38B from being erroneously installed in the space where the positioning block 48A2 is located, and conversely, the second filter box 40B is erroneously installed in the space where the positioning block 48A1 in FIG. Installation can be prevented.
  • the distance from the second side surface 50Ac may be different.
  • the distance from the end surface 50Aa of the handle portion 70C may be different from the distance from the end surface 55Ac of the handle portion 70D.
  • FIG. 9A is a plan view showing a first filter box 38C and a positioning block 48A corresponding to the first filter box 38C of the third modified example of the above embodiment.
  • the filter box 38C has a chemical filter 51 housed in an annular frame 50C and a gasket 54 fixed to the end surface of the frame 50C. Further, the opposing first side surface 50Cb and second side surface 50Cc of the frame 50C are inclined symmetrically on average, and stepped step portions are formed respectively, and a handle portion 70A is attached to the side surfaces 50Cb and 50Cc.
  • the filter box 38C By moving the filter box 38C by bringing the first side surface 50Cb or the second side surface 50Cc into contact with the tapered portion of the positioning block 48A, the filter box 38C can be easily positioned in the casing 28 so as to contact the partition plate 42A.
  • FIG. 9B is a plan view showing a first filter box 38D of the fourth modified example and a positioning block 48A corresponding to the first filter box 38D.
  • the filter box 38D has a chemical filter 51 housed in an annular frame 50D and a gasket 54 fixed to the end surface of the frame 50D. Further, the first side surface 50Db and the second side surface 50Dc facing each other of the frame 50D are inclined symmetrically on average, and a plurality of convex arcs are formed on the outer sides, respectively, and a handle portion 70A is attached to the side surfaces 50Db and 50Dc. ing.
  • the filter box 38D can be easily positioned so as to contact the partition plate 42A by moving the filter box 38D by bringing the first side surface 50Db or the second side surface 50Dc into contact with the tapered portion of the positioning block 48A.
  • FIG. 9C is a plan view showing the first filter box 38E of the fifth modified example and the positioning block 48A corresponding thereto.
  • the filter box 38E has a chemical filter 51 housed in an annular frame 50E and a gasket 54 fixed to the end surface of the frame 50E. Further, the first side surface 50Eb and the second side surface 50Ec facing each other of the frame 50E are inclined symmetrically on average, and convex arc portions are formed on the outer sides, respectively, and a handle portion 70A is attached to the side surfaces 50Eb and 50Ec. .
  • the filter box 38E By moving the filter box 38E by bringing the first side surface 50Eb or the second side surface 50Ec into contact with the tapered portion of the positioning block 48A, the filter box 38E can be easily positioned so as to contact the partition plate 42A.
  • FIG. 10 (A) shows another example of the filter device 26B of the above embodiment
  • FIG. 10 (B) shows the first filter box 38F in FIG. 10 (A).
  • the surface of the partition plate 42A in the casing 28 facing the filter boxes 38F and 40F can be easily separated from the gasket 54 and easily slipped.
  • a flat cover member TF5 having an opening through which is passed is attached.
  • the cover member TF5 is made of, for example, a synthetic resin, and specifically made of, for example, Teflon (registered trademark of DuPont).
  • first filter box 38F is positioned so as to be in close contact with the cover member TF5 attached to the partition plate 42A, and the second filter box 40F and the first filter box are sequentially provided so as to be in close contact with the filter box 38F.
  • 38F and the second filter box 40F are positioned.
  • the row of filter boxes 38F, 40F, 38F, 40F are positioned by positioning blocks 48A3, 48B3, 48A4, 48B4 fixed to the inner surface of the casing 28, respectively.
  • the length in the Y direction of the positioning blocks 48A3, 48B3, etc. is set to be smaller than the height in the Y direction of the filter boxes 38F, 40F.
  • the filter boxes 38F and 40F are obtained by housing the chemical filters 51 and 56 in the annular frames 50F and 55F, respectively, and fixing the gasket 54 to the end faces of the frames 50F and 55F.
  • the first side surface and the second side surface of the frames 50F and 55F that face each other are tapered in a symmetrical manner, and face the first side surface and the second side surface of the frames 50F and 55F and the end surface to which the gasket 54 is fixed.
  • Cover members TF1 and TF2 which can be easily separated from the gasket 54 and are slippery, are attached along the end face.
  • the handle portions 70A and 70B are fixed to the first and second side surfaces of the frames 50F and 55F through the cover members TF3 and TF4.
  • Cover members TF3 and TF4 each having a flat plate shape and partially formed with a groove are also fixed to the tapered portions of the positioning blocks 48A3, 48A4 and 48B3 and 48B4.
  • the material of the cover members TF1, TF2, TF3, and TF4 is the same as the material of the cover member TF5, for example.
  • a rectangular opening TF1c that allows gas to pass is formed in a portion of the cover member TF1 of the filter box 38F that faces the chemical filter 51.
  • the portions of the cover member TF1 that cover the first side surface and the second side surface of the frame 50F are tapered portions TF1a and TF1b that are symmetrically inclined.
  • the configuration of the filter box 40F is the same, but the position of the handle portion 70B is different from the position of the handle portion 70A.
  • a moving lever portion 58G is provided inside a door 29 that closes the casing 28.
  • the moving lever 58G includes a pedestal portion 58G3, a guide portion 58G4 extending along the Y direction, a lever portion 58G1 having an inclined surface movable in the Y direction along the guide portion 58G4, and the lever portion 58G1 from the pedestal portion 58G3.
  • the cover members TF3 and TF4 covering the positioning blocks 48A3, 48B3, 48A4 and 48B4 are covered with the filter boxes 38F and 40F, respectively.
  • the taper portions of the members TF1 and TF2 are brought into contact with each other, and the filter boxes 38F and 40F are sequentially moved substantially in the ⁇ Y direction.
  • the cover members TF1 to TF4 are slippery, the filter boxes 38F and 40F can be easily moved.
  • the gasket 54 of the filter box 38F at the end in the ⁇ Y direction comes into contact with the cover member TF5 that covers the partition plate 42A, and the filter box 38F (40F)
  • the gasket 54 of the filter box 40F (38F) adjacent thereto is in contact with the cover member TF1 (TF2).
  • the filter box 40F at the end in the + Y direction is urged in the ⁇ Y direction by the moving lever portion 58G, so that the partition plate 42A (cover member TF5) and the filter box 38F , 40F can be adhered while maintaining airtightness. Accordingly, clean gas can be supplied to the air blowing unit (not shown) of the air conditioner through the four-stage filter boxes 38F and 40F.
  • the door 29 is opened, and the filter boxes 40F and 38F are sequentially carried out of the casing 28.
  • the gasket 54 of the filter box 40F can be easily separated from the cover member TF1 of the filter box 38F, and the gasket 54 of the filter box 38F can also be easily separated from the cover member TF5.
  • the filter boxes 38F and 40F can be easily replaced.
  • the number of stages of the filter boxes 38F and 40F is arbitrary. Further, the cover members TF3 and TF4 such as the positioning blocks 48A3 and 48B3 can be omitted. Further, when the cover members TF3 and TF4 such as the positioning blocks 48A3 and 48B3 are provided, the taper portions of the cover members TF1 and TF2 on the filter box 38F and 40F side can be omitted. Further, instead of the cover members TF1 to TF4, for example, slippery resin adhesive tape may be attached.
  • the outer shapes of the frames 50, 50A to 50F and 55, 55A to 55F of the filter boxes 38 to 38F and 40 to 40F are substantially square (substantially square ring (frame shape)). It is.
  • the outer shapes of the frames 50, 50A, etc. and 55, 55A, etc. are, for example, a substantially rectangular shape such as a rectangle (substantially rectangular ring (frame shape)), or a substantially square or rectangular shape, and the corners are chamfered. May be.
  • the electronic device performs a function / performance design of the electronic device as shown in FIG. 221, manufacturing a mask (reticle) based on this design step 222, manufacturing a substrate (wafer) as a base material of the device and applying a resist 223, mask pattern by the exposure apparatus of the above-described embodiment
  • a substrate (sensitive substrate), a process for developing the exposed substrate, a substrate processing step 224 including heating (curing) and etching process of the developed substrate, a device assembly step (dicing process, bonding process, package process) 225) as well as inspection step 2 It is produced through a 6 or the like.
  • this device manufacturing method includes forming the pattern of the photosensitive layer on the substrate using the exposure apparatus of the above embodiment, and processing the substrate on which the pattern is formed (step 224). Yes.
  • the exposure apparatus the maintenance cost can be reduced and the exposure accuracy can be improved, so that the electronic device can be manufactured at a low cost with high accuracy.
  • air is used as the air conditioning gas. Instead, nitrogen gas or a rare gas (such as helium or neon), or a mixed gas of these gases may be used. .
  • the present invention can be applied not only to a scanning exposure type projection exposure apparatus but also to exposure using a batch exposure type (stepper type) projection exposure apparatus.
  • the present invention can also be applied when exposure is performed using a proximity type or contact type exposure apparatus that does not use a projection optical system.
  • the present invention is not limited to application to a semiconductor device manufacturing process.
  • a manufacturing process of a display device such as a liquid crystal display element or a plasma display formed on a square glass plate, or an imaging element (CCD, etc.), micromachines, MEMS (Microelectromechanical Systems), thin film magnetic heads, and various devices such as DNA chips can be widely applied to the manufacturing process.
  • the present invention can also be applied to a manufacturing process when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.
  • the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be taken without departing from the gist of the present invention.
  • the disclosures in the above-mentioned publications, international publication pamphlets, US patents, or US patent application publication specifications described in the present application are incorporated into the description of this specification.
  • the entire disclosure of US Patent Application No. 61 / 320,922, filed April 5, 2010, including the description, claims, drawings, and abstract, is incorporated herein by reference in its entirety. It is.
  • EX ... exposure device, R ... reticle, PL ... projection optical system, W ... wafer, 4 ... exposure body, 10 ... chamber, 26 ... filter device, 28 ... casing, 30 ... main air conditioner, 38, 40 ... filter box 42A to 42C ... partition plate, 48A to 48C ... positioning block, 50, 55 ... frame, 50b, 55b ... first taper part, 51, 56 ... chemical filter, 60 ... local air conditioner, 70A, 70B ... handle part

Abstract

La présente invention concerne un support de filtre qui est équipé de premier et deuxième cadres qui soutiennent des premier et deuxième filtres, et des première et deuxième poignées qui sont disposées sur les premier et deuxième cadres ; et a des première et deuxième parties à forme modifiée qui sont formées sur au moins des parties des côtés des premier et deuxième cadres, qui sont orientées depuis une surface d'extrémité vers l'autre surface d'extrémité des premier et deuxième cadres, et qui sont modifiées à l'extérieur des premier et deuxième cadres. La relation positionnelle de la première poignée par rapport au premier cadre, et la relation positionnelle de la deuxième poignée par rapport au deuxième cadre sont différentes. Le remplacement de filtre peut être effectué de façon précise.
PCT/JP2011/058511 2010-04-05 2011-04-04 Support de filtre, dispositif d'exposition, et procédé de production de dispositif WO2011125973A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012509649A JPWO2011125973A1 (ja) 2010-04-05 2011-04-04 フィルタ保持装置、露光装置、及びデバイス製造方法
CN2011800168666A CN102821828A (zh) 2010-04-05 2011-04-04 过滤器保持装置、曝光装置、及元件制造方法
KR1020127028904A KR20130019416A (ko) 2010-04-05 2011-04-04 필터 유지 장치, 노광 장치, 및 디바이스 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32092210P 2010-04-05 2010-04-05
US61/320,922 2010-04-05

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WO2011125973A1 true WO2011125973A1 (fr) 2011-10-13

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DE102013020653A1 (de) * 2013-12-05 2015-06-11 Rt-Filtertechnik Gmbh Filtervorrichtung, insbesondere in Form einer Luftfiltervorrichtung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6511858B2 (ja) * 2015-02-27 2019-05-15 シンフォニアテクノロジー株式会社 搬送室
CN110652804A (zh) * 2019-10-10 2020-01-07 极达鑫环境科技(重庆)有限公司 一种高密闭型高效滤网安装框

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JPS5013971A (fr) * 1973-06-08 1975-02-13
JPS6320930U (fr) * 1986-07-23 1988-02-12
JPH09113028A (ja) * 1995-10-17 1997-05-02 Matsushita Electric Ind Co Ltd 空気清浄フィルタ用収納ケース
JPH09249024A (ja) * 1996-03-14 1997-09-22 Zexel Corp 空調ユニット
JPH1147531A (ja) * 1997-07-31 1999-02-23 Tennex:Kk 室内空気処理用のフィルタ部材
JP2002158170A (ja) * 2000-09-08 2002-05-31 Nikon Corp 露光装置及びデバイス製造方法
JP2004045573A (ja) * 2002-07-09 2004-02-12 Canon Inc 画像形成装置
JP2009240938A (ja) * 2008-03-31 2009-10-22 Panasonic Corp ファンフィルタユニット

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Publication number Priority date Publication date Assignee Title
JPS5013971A (fr) * 1973-06-08 1975-02-13
JPS6320930U (fr) * 1986-07-23 1988-02-12
JPH09113028A (ja) * 1995-10-17 1997-05-02 Matsushita Electric Ind Co Ltd 空気清浄フィルタ用収納ケース
JPH09249024A (ja) * 1996-03-14 1997-09-22 Zexel Corp 空調ユニット
JPH1147531A (ja) * 1997-07-31 1999-02-23 Tennex:Kk 室内空気処理用のフィルタ部材
JP2002158170A (ja) * 2000-09-08 2002-05-31 Nikon Corp 露光装置及びデバイス製造方法
JP2004045573A (ja) * 2002-07-09 2004-02-12 Canon Inc 画像形成装置
JP2009240938A (ja) * 2008-03-31 2009-10-22 Panasonic Corp ファンフィルタユニット

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013020653A1 (de) * 2013-12-05 2015-06-11 Rt-Filtertechnik Gmbh Filtervorrichtung, insbesondere in Form einer Luftfiltervorrichtung

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CN102821828A (zh) 2012-12-12
TW201231144A (en) 2012-08-01
JPWO2011125973A1 (ja) 2013-07-11

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