WO2012153840A1 - Boîtier de filtre, dispositif de filtre, et dispositif de photolithographie - Google Patents

Boîtier de filtre, dispositif de filtre, et dispositif de photolithographie Download PDF

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Publication number
WO2012153840A1
WO2012153840A1 PCT/JP2012/062154 JP2012062154W WO2012153840A1 WO 2012153840 A1 WO2012153840 A1 WO 2012153840A1 JP 2012062154 W JP2012062154 W JP 2012062154W WO 2012153840 A1 WO2012153840 A1 WO 2012153840A1
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WIPO (PCT)
Prior art keywords
filter
filter box
frame
groove
exposure
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PCT/JP2012/062154
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English (en)
Japanese (ja)
Inventor
公一 桂
和久 松山
将幸 久保田
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株式会社ニコン
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Publication of WO2012153840A1 publication Critical patent/WO2012153840A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/81—Solid phase processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407—Constructional details of adsorbing systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/40—Further details for adsorption processes and devices
    • B01D2259/41—Further details for adsorption processes and devices using plural beds of the same adsorbent in series
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/45—Gas separation or purification devices adapted for specific applications
    • B01D2259/455—Gas separation or purification devices adapted for specific applications for transportable use

Definitions

  • the present invention provides, for example, a filter box that holds a filter for removing impurities and the like in a gas, a filter device that houses the filter box, an exposure device that includes the filter device, and a semiconductor element that uses the exposure device, for example,
  • the present invention relates to a device manufacturing method for manufacturing a liquid crystal display element, an imaging element, or the like.
  • an exposure apparatus used in a lithography process for manufacturing an electronic device such as a semiconductor element
  • illumination characteristics and projection of an illumination optical system The imaging characteristics of the optical system must be maintained in a predetermined state, and the space where the reticle (or photomask, etc.), projection optical system, and wafer (or glass plate, etc.) are installed must be maintained in a predetermined environment.
  • an exposure main body including a part of an illumination optical system of an exposure apparatus, a reticle stage, a projection optical system, a wafer stage, and the like is installed in a box-shaped chamber, and a predetermined temperature is set in the chamber.
  • An air conditioner that is controlled and supplies clean gas (for example, air) that has passed through a dust filter by a downflow method and a sideflow method is provided.
  • the wavelength of exposure light has been shortened in order to meet the recent demand for finer circuit patterns.
  • KrF excimer laser (wavelength 248 nm) is used as the exposure light, and more or less vacuum.
  • An ArF excimer laser (wavelength 193 nm) in the ultraviolet region is used.
  • the transmittance of the exposure light is reduced if a trace amount of organic gas (organic gas) is present in the space through which the exposure light passes (for example, the internal space of the lens barrel).
  • the reaction between the exposure light and the organic gas may cause a cloudy substance on the surface of the optical element such as a lens element.
  • a chemical filter when installed in a casing, for example, a flat frame that houses the chemical filter is placed horizontally (in a direction in which the filter surface is in the vertical direction) until it hits the side wall in the casing.
  • the operator moved the frame along the side wall in the direction normal to the filter surface to the installation position.
  • the gas containing impurities is exposed through the gap without passing through the chemical filter.
  • the time for accurately positioning the frame at the installation position becomes long, and as a result, the replacement time of the used chemical filter becomes long.
  • an aspect of the present invention aims to enable installation of a filter so that it can be easily positioned.
  • a filter box that holds a filter.
  • the filter box has a frame that holds the filter, and a first shape change portion formed on at least a part of a side surface of the frame, and the first shape change portions are mutually connected on the side surface of the frame. From the two first ends of the two separated first ends, and from the second end of one of the two second ends separated from each other on the side surface of the frame, the two first It includes a first edge portion extending on the other first end portion side of the end portion and on the other second end portion side of the two second end portions.
  • a filter device that houses a filter box that holds a filter.
  • This filter device is provided in the filter box of the present invention, a case in which the first shape changing portion of the frame is formed as a lower surface, a case for storing the filter box, and a lower portion of the case, And a first guide part having a third edge part that can contact the first edge part of the first shape changing part of the filter box.
  • the exposure apparatus which exposes a board
  • This exposure apparatus includes a chamber that houses an exposure main body for exposing the substrate, the filter apparatus of the present invention, and an air conditioner that blows gas taken from outside the chamber into the chamber through the filter apparatus.
  • the device manufacturing method including exposing a photosensitive board
  • the present invention it is possible to easily position the filter by using the first shape changing portion provided on the frame.
  • FIG. 1 is a partially cutaway view showing a configuration of an exposure apparatus as an example of an embodiment. It is a perspective view which shows the filter apparatus 26 in FIG. It is a perspective view which shows the casing 28 in FIG. It is sectional drawing which shows the filter apparatus 26 of FIG. (A) is a perspective view showing the filter box 38 in FIG. 4, (B) is a perspective view showing the filter box 40 in FIG. 4, (C) is a plan view showing the filter box 38, and (D) is a filter box.
  • FIG. (A) is a plan view with a section showing a state in which the filter box 38 is housed in the casing 28, and (B) is a plane with a section in part showing the state in which the filter box 40 is housed in the casing 28.
  • FIG. It is a perspective view which shows the filter apparatus of a modification. It is a flowchart which shows an example of the manufacturing process of an electronic device.
  • FIG. 1 shows an exposure apparatus EX of the present embodiment.
  • the exposure apparatus EX is, for example, a scanning exposure type exposure apparatus (projection exposure apparatus) formed of a scanning stepper.
  • an exposure apparatus EX holds a light source unit 2 that generates exposure light (exposure illumination light) EL, an illumination optical system ILS that illuminates a reticle R (mask) with exposure light EL, and a reticle R.
  • a reticle stage RST that moves and a projection optical system PL that projects an image of the pattern of the reticle R onto the surface of a wafer W (substrate) coated with a photoresist (photosensitive material).
  • the exposure apparatus EX includes a wafer stage WST that holds and moves the wafer W, other drive mechanisms and sensors, a reticle library 9 that stores a plurality of reticles, a plurality of unexposed and / or A wafer cassette 7 for storing exposed wafers and a main controller (not shown) for comprehensively controlling the operation of the exposure apparatus EX are provided.
  • These members from the light source unit 2 to the main control device (not shown) are installed on the upper surface of the first floor FL1 in the clean room of the semiconductor device manufacturing factory, for example.
  • the exposure apparatus EX includes a box-like highly airtight chamber 10 installed on the floor FL1, and the inside of the chamber 10 is formed by a partition member 10d having two openings opened and closed by shutters 24R and 24W, for example.
  • the chamber is divided into an exposure chamber 10a and a loader chamber 10b.
  • An exposure body 4 including an illumination optical system ILS, a reticle stage RST, a projection optical system PL, and a wafer stage WST is installed in the exposure chamber 10a, and the reticle library 9 and the wafer cassette 7 are placed in the loader chamber 10b.
  • a reticle loader system and a wafer loader system are installed.
  • the exposure apparatus EX includes an overall air conditioning system for air conditioning the entire interior of the chamber 10.
  • This overall air conditioning system is installed on the upper surface of the second floor FL2 of the machine room below the first floor FL1, and has a filter device 26 having a plurality of chemical filters arranged in series, and an upper surface of the floor FL2.
  • An air conditioner 30 having an air conditioning main body 31 installed, a large air outlet 18 installed at the top of the exposure chamber 10a, and a small air outlet arranged on the bottom surface of the sub-chamber 22 that houses the illumination optical system ILS. 19R and a small outlet 19W disposed in the vicinity of the projection optical system PL.
  • the filter device 26 removes predetermined impurities from the air AR, which is an air-conditioning gas supplied via the pipe 25, and the air from which the impurities have been removed passes through the first duct 32 as indicated by an arrow A1. This is supplied to the unit 31 (details will be described later). *
  • the air conditioner 30 includes a first duct 32, an air conditioning main body 31, a second duct 35 that connects the air conditioning main body 31 and the inside of the chamber 10 through an opening provided in the floor FL1, and, for example, A dustproof filter 36 such as an ULPA filter (Ultra Low Low Penetration Air Filter) that is arranged in the middle and removes minute particles from the air flowing inside is provided.
  • a dustproof filter 36 such as an ULPA filter (Ultra Low Low Penetration Air Filter) that is arranged in the middle and removes minute particles from the air flowing inside is provided.
  • the ducts 32 and 35 and the pipe 25 are formed using a material that generates a small amount of contaminants, such as stainless steel or fluororesin.
  • the air conditioning body 31 includes a temperature controller 33A that controls the temperature of air supplied through the first duct 32, a humidity controller 33B that controls the humidity of the air, and the air to the second duct 35 side. And a fan motor 34 for blowing air.
  • the air is controlled to have a temperature of, for example, 23 ° C. within a range of 20 ° C. to 30 ° C., and is supplied to the inside of the exposure chamber 10 a through the second duct 35 and the outlet 18 in a downflow manner.
  • the inside of the chamber 10 is set to a positive pressure state by the supply of air.
  • the air in the second duct 35 is supplied into the exposure chamber 10a through the branch pipes 35a and 35b and the corresponding outlets 19W and 19R. Part of the air in the exposure chamber 10a also flows into the loader chamber 10b.
  • the air that has flowed through the inside of the chamber 10 flows into the exhaust duct 44 under the floor through a large number of openings 45a provided in the bottom surface of the chamber 10 and a large number of openings 45b provided in the floor FL1.
  • the air in the exhaust duct 44 is exhausted after being purified through a filter (not shown). It should be noted that all or a part of the air flowing through the exhaust duct 44 can be returned to the pipe 25 side and reused.
  • the Z-axis is taken in parallel to the optical axis AX of the projection optical system PL, and X is perpendicular to the plane of FIG. 1 within a plane perpendicular to the Z-axis (substantially parallel to the horizontal plane in this embodiment).
  • the axis will be described by taking the Y axis parallel to the paper surface of FIG.
  • the scanning direction of reticle R and wafer W during scanning exposure is the Y direction.
  • the rotation directions around the X axis, Y axis, and Z axis are also referred to as ⁇ x, ⁇ y, and ⁇ z directions.
  • the light source unit 2 installed on the floor FL1 outside the chamber 10 is an exposure light source that generates ArF excimer laser light (wavelength 193 nm) as exposure light EL, and a beam that guides the exposure light EL to the illumination optical system ILS. And a light transmission optical system.
  • the exit end of the exposure light EL of the light source unit 2 is disposed in the exposure chamber 10a through the opening at the upper side of the chamber 10 in the + Y direction.
  • an ultraviolet pulse laser light source such as a KrF excimer laser light source (wavelength 248 nm), a harmonic generation light source of a YAG laser, a harmonic generation device of a solid laser (semiconductor laser, etc.), or a mercury lamp (i-line etc.) ) Etc. can also be used.
  • the illumination optical system ILS disposed in the upper portion of the chamber 10 includes an illuminance uniformizing optical system including an optical integrator, a reticle blind, as disclosed in, for example, US Patent Application Publication No. 2003/0025890. And a condenser optical system.
  • the illumination optical system ILS illuminates a slit-like illumination area elongated in the X direction of the pattern surface of the reticle R defined by the reticle blind with the exposure light EL with a substantially uniform illuminance.
  • the image of the pattern in the illumination area is imaged on the surface of the wafer W via the projection optical system PL that is telecentric on both sides and the projection magnification ⁇ is reduced (for example, 1/4).
  • a lower frame 12 is installed on the floor FL 1 in the exposure chamber 10 a of the chamber 10 via a plurality of pedestals 11.
  • a flat base member 13 is fixed to the center of the lower frame 12.
  • a flat wafer base WB is supported via three anti-vibration tables 14, and the wafer stage WST can be moved in the X and Y directions via an air bearing on the upper surface parallel to the XY plane of the wafer base WB. And is rotatable in the ⁇ z direction.
  • an optical system frame 16 is supported on the upper end of the lower frame 12 via, for example, three anti-vibration tables 15 arranged so as to surround the wafer base WB.
  • the projection optical system PL is disposed in the central opening of the optical system frame 16, and the upper frame 17 is fixed on the optical system frame 16 so as to surround the projection optical system PL.
  • a Y-axis laser interferometer 21WY is fixed to an end portion in the + Y direction on the bottom surface of the optical system frame 16, and an X-axis laser interferometer (not shown) is fixed to an end portion in the + X direction on the bottom surface.
  • Wafer interferometers composed of these interferometers each irradiate a reflecting surface (or moving mirror) on the side surface of wafer stage WST with a measurement beam of a plurality of axes, for example, a reference mirror (not shown) on the side surface of projection optical system PL. ) Is used as a reference to measure the X- and Y-direction positions of wafer stage WST and the rotation angles in ⁇ x, ⁇ y, and ⁇ z directions, and supply the measured values to a main controller (not shown).
  • a stage control system in a main controller has a drive mechanism (not shown) including a linear motor based on the measured value of the wafer interferometer and the measured value of an autofocus sensor (not shown).
  • the wafer stage WST is controlled so that the position and speed of the wafer stage WST in the X and Y directions and the rotation angle in the ⁇ z direction are controlled, and the surface of the wafer W is focused on the image plane of the projection optical system PL.
  • the Z stage (not shown) is controlled.
  • An alignment system ALG and the like for aligning the reticle R and the wafer W are also provided.
  • a sub-chamber 22 that houses the illumination optical system ILS is fixed to the upper portion of the upper frame 17 in the + Y direction.
  • the reticle stage RST is mounted on the upper surface of the upper frame 17 parallel to the XY plane so that the reticle stage RST can move at a constant speed in the Y direction, and can move in the X direction and rotate in ⁇ z.
  • a Y-axis laser interferometer 21RY is fixed to the + Y direction end of the upper surface of the upper frame 17, and an X-axis laser interferometer (not shown) is fixed to the + X direction end of the upper surface.
  • a reticle interferometer including these interferometers irradiates a movable mirror 21MY or the like provided on the reticle stage RST with a plurality of axes of measurement beams, for example, to provide a reference mirror (not shown) on the side surface of the projection optical system PL.
  • a reference mirror (not shown) on the side surface of the projection optical system PL.
  • the stage control system in the main control device is configured such that the speed and position of the reticle stage RST in the Y direction via a drive mechanism (not shown) including a linear motor based on the measurement value of the reticle interferometer, etc.
  • the position in the X direction and the rotation angle in the ⁇ z direction are controlled.
  • a local liquid immersion mechanism including, for example, a ring-shaped nozzle head disposed on the lower surface of the optical member at the lower end of the projection optical system PL.
  • a predetermined liquid (pure water or the like) is supplied to a local liquid immersion region between the optical member at the tip of the projection optical system PL and the wafer W.
  • a local immersion mechanism an immersion mechanism disclosed in, for example, US Patent Application Publication No. 2007/242247 can be used.
  • the exposure apparatus EX is a dry type, it is not necessary to provide the liquid immersion mechanism.
  • a reticle library 9 and a reticle loader 8 which is a horizontal articulated robot are installed on the upper surface of an upper support base 67.
  • the reticle loader 8 exchanges the reticle R between the reticle library 9 and the reticle stage RST through an opening opened and closed by the shutter 24R of the partition member 10d.
  • a wafer cassette 7 and a horizontal articulated robot 6 a for taking in and out the wafer between the wafer cassette 7 are installed on the upper surface of the lower support stand 68.
  • a wafer transfer device 6b constituting the wafer loader 6 together with the horizontal articulated robot 6a is installed. Wafer transfer device 6b transfers wafer W between horizontal articulated robot 6a and wafer stage WST through an opening opened and closed by shutter 24W of partition member 10d.
  • the reticle R and the wafer W are first aligned. Thereafter, the exposure of the exposure light EL to the reticle R is started, and a reticle stage RST is projected while projecting a partial image of the pattern of the reticle R onto one shot area on the surface of the wafer W via the projection optical system PL.
  • the pattern image of the reticle R is transferred to the shot area by a scanning exposure operation that moves the wafer stage WST in synchronization with the Y direction using the projection magnification ⁇ of the projection optical system PL as a speed ratio (synchronous scanning).
  • the reticle is applied to all shot areas of the wafer W by the step-and-scan method.
  • An R pattern image is transferred.
  • the exposure apparatus EX of the present embodiment maintains the illumination characteristics (illuminance uniformity, etc.) of the illumination optical system ILS and the imaging characteristics (resolution, etc.) of the projection optical system in a predetermined state, and the reticle R, projection In order to perform exposure with high exposure accuracy (resolution, positioning accuracy, etc.) while maintaining the atmosphere (space) in which the optical system PL and the wafer W are installed in a predetermined environment, as described above, the inside of the chamber 10
  • An overall air conditioning system including an air conditioner 30 that supplies temperature-controlled clean air in a downflow manner is provided.
  • the entire air conditioning system has a local air conditioning unit. That is, clean air whose temperature is controlled is supplied from the branch pipes 35b and 35a of the second duct 35 to the blowing portion 19R on the bottom surface of the sub chamber 22 and the blowing portion 19W on the bottom surface of the optical system frame 16, respectively.
  • the blowing portions 19R and 19W are disposed on the optical paths of the measurement beams of the Y-axis laser interferometer 21RY for the reticle stage RST and the Y-axis laser interferometer 21WY for the wafer stage WST, respectively.
  • the blowing units 19R and 19W blow out the temperature-controlled air on the optical path of the measurement beam with a substantially uniform wind speed distribution by a down flow method (or a side flow method). Similarly, temperature-controlled air is locally supplied to the optical path of the measurement beam of the X-axis laser interferometer. Accordingly, the positions of reticle stage RST and wafer stage WST can be measured with high accuracy by reticle interferometer 21R, wafer interferometer 21W, and the like.
  • a local air conditioner 60 is installed in the loader room 10b.
  • the local air conditioner 60 is disposed above the reticle library 9 and the wafer cassette 7, a small fan motor 61 disposed on the bottom surface of the support base 68, a duct 62 that supplies air blown by the fan motor 61 to the upper part.
  • the blowout ports 65 and 66 are provided.
  • the front end of the duct 62 is divided into branch pipes 62R and 62W that supply air to the outlets 65 and 66, respectively.
  • a dust-proof filter such as a ULPA filter is installed in the vicinity of the air inlets of the air outlets 65 and 66, and a filter box for storing a chemical filter for removing predetermined impurities in the duct 62 in the vicinity of the fan motor 61.
  • 63 and 64 are installed.
  • the chemical filter of the filter box 63 removes an organic gas (organic gas)
  • the chemical filter of the filter box 64 removes an alkaline gas (an alkaline substance gas) and an acidic gas (an acidic substance gas). Remove.
  • the air blown from the fan motor 61 is sent from the outlets 65 and 66 through the filter boxes 63 and 64 and the duct 62 in a downflow manner, respectively.
  • the wafer cassette 7 is supplied to the space in which it is placed.
  • the air flowing around the reticle library 9 is returned to the fan motor 61 through the periphery of the support base 67, the periphery of the wafer cassette 7 below the support base 67, and the periphery of the support base 68.
  • the air supplied from the outlet 66 to the periphery of the wafer cassette 7 is returned to the fan motor 61 through the periphery of the support base 68.
  • the air returned to the fan motor 61 is again supplied into the loader chamber 10b from the outlets 65 and 66 via the filter boxes 63 and 64 and the dustproof filter.
  • the air in the loader chamber 10d is kept clean by the local air conditioner 60.
  • the filter device 26 includes an airtight box-shaped casing 28 elongated in the Y direction, a partition plate 42 parallel to the XZ plane that divides the space in the casing 28 into two spaces in the Y direction in a substantially horizontal plane, A first type filter box 38 and a second type filter that are installed in close contact with each one surface (surface in the + Y direction in FIG. 1) via a cover member (not shown) described later.
  • the filter device 26 includes two (three stages) filter boxes 38 and 40 arranged in series.
  • the first type filter box 38 is also referred to as a first filter box 38
  • the second type filter box 40 is also referred to as a second filter box 40.
  • the filter box is installed in a direction in which the filter surface intersects the horizontal direction, for example, the filter surface of the filter box is in the XZ plane. The following description will be made assuming that the filter box is installed horizontally.
  • the filter device 26 has a hinge mechanism at a plurality of locations in the casing 28 in order to open the window portion 28b (see FIG. 2) for inserting and removing the filter boxes 38, 40 when the filter boxes 38, 40 are inserted or replaced. It has a door 29 that can be opened and closed through 29h (see FIG. 4).
  • An opening 28a is formed on the side wall in the + Y direction of the casing 28, and a pipe 25 for taking in the air AR for air conditioning through the opening 28a is fixed to the side wall.
  • An opening 28g is formed on the side wall in the ⁇ Y direction of the casing 28, and a first duct 32 for discharging the purified air through the opening 28g is connected to the side wall.
  • FIG. 2 shows the filter device 26 in a state where the door 29 of the casing 28 in FIG. 1 is opened.
  • FIG. 3 shows a state after the filter boxes 38 and 40 are taken out from the casing 28 of FIG. 2 and 3, the casing 28 is indicated by a two-dot chain line for convenience of explanation.
  • the door 29 has a gasket 46 for sealing the periphery of the window 28 b and the end of the partition plate 42 and the door 29 when the window 28 b of the casing 28 is closed by the door 29. It is fixed.
  • the gasket 46 can be formed of a material having excellent corrosion resistance and low degassing, such as a sheet of Teflon (registered trademark of DuPont) or a sheet of silicon rubber.
  • a partition plate 42 is installed in the casing 28 so as to divide the space in the casing 28 into a first space 28c having a large + Y direction and a second space 28f having a small ⁇ Y direction.
  • Air AR is supplied from the outside through the pipe 25 and the opening 28a in FIG. 1 into the space 28c, and the air in the space 28f is supplied to the air conditioning main body 31 through the opening 28g and the first duct 32 in FIG.
  • the partition plate 42 is formed with a substantially square or rectangular opening 42 a for allowing the purified air to pass through.
  • the surface of the partition plate 42 facing the filter box 38 is slippery,
  • a flat cover member TF3 having an opening through which gas passes in the center is fixed by bonding or the like.
  • the cover member TF3 is made of, for example, a synthetic resin, and specifically made of, for example, Teflon (registered trademark of DuPont).
  • a first filter box 38 is installed in the first space 28 c of the casing 28 so as to be in close contact with the cover member TF ⁇ b> 3 fixed to the partition plate 42, and the first filter box 38 is in close contact with the filter box 38.
  • Two filter boxes 40 are installed, and a first filter box 38 is installed in close contact with the filter box 40.
  • the first filter box 38 holds a chemical filter 51 for removing an organic gas (organic gas) in an opening 50f (see FIG. 4) of the frame 50.
  • the second filter box 40 removes an alkaline gas (an alkaline substance gas) such as ammonia or amine and an acidic gas (an acidic substance gas) from the opening 55f (see FIG. 4) of the frame 55 as a basic structure.
  • the chemical filter 56 is held.
  • the width of each filter box 38, 40 in the Y direction is, for example, 200 to 400 mm, and the weight of each filter box 38, 40 is, for example, about 10 to 20 kg.
  • the chemical filter 51 for removing organic gas for example, an activated carbon filter or a ceramic filter can be used.
  • an additive activated carbon filter, an ion exchange resin filter, an ion exchange fiber filter, an additive ceramic filter, or the like can be used.
  • the frames 50 and 55, the partition plate 42, the casing 28, and the door 29 are each made of a material having corrosion resistance and less degassing, for example, aluminum having an oxide film (aluminum oxide or the like) formed on the surface (anodized). (Aluminum) or stainless steel.
  • the frames 50 and 55 and the like can be formed of a material (such as a plywood covered with polyethylene or a fluorine-based resin) including a resin material that has corrosion resistance and little degassing.
  • the transmittance of the exposure light EL is improved in the exposure chamber 10a of the chamber 10 and formed on the surface of the optical element by the interaction between the organic gas and the exposure light EL. Generation of cloudy material is suppressed. Further, by removing the alkaline gas and the acid gas, changes in the photoresist characteristics of the wafer W and the like are suppressed. In particular, when the photoresist is a chemically amplified photoresist, if there is an alkaline gas such as ammonia or amine in the air, the generated acid may react to form a slightly soluble layer on the photoresist surface. . Therefore, removal of alkaline gases such as ammonia and amines is particularly effective.
  • the configuration of the chemical filter in the filter boxes 63 and 64 in the loader chamber 10b in FIG. 1 is the same as the configuration of the chemical filters 51 and 56. However, the filter boxes 63 and 64 may be smaller than the filter boxes 38 and 40.
  • the configuration of the filter boxes 38 and 40 will be described with reference to FIGS. 5C is a plan view showing the filter box 38 in FIG. 5A, and FIG. 5D is a plan view showing the filter box 40 in FIG. 5B.
  • the first filter box 38 includes a substantially annular frame 50 provided with a substantially square opening 50f (see FIG. 4) in the center, and a chemical held in the opening 50f.
  • a substantially annular frame 50 provided with a substantially square opening 50f (see FIG. 4) in the center, and a chemical held in the opening 50f.
  • the lower surface (bottom surface or mounting surface) 50b As the first side surface mounted on the upper surface of the filter 51 and the bottom plate 28h (see FIG. 2) of the casing 28 of the frame 50.
  • a first groove portion 52A formed to be inclined with respect to the first end face 50a at an inclination angle ⁇ (see FIG. 5C).
  • the inclination angle ⁇ is several degrees to 20 degrees, for example, about 3 degrees to 10 degrees.
  • the filter box 38 is formed on the upper surface 50c as the second side surface opposite to the lower surface 50b of the frame 50 with respect to the chemical filter 51 and is formed in the same shape in parallel with the first groove portion 52A.
  • Fixed to the groove portion 52B the first end surface 50a of the frame 50 by a substantially square annular gasket 54A fixed by adhesion or the like so as to surround the opening 50f, and the fourth side surface 50e adjacent to the end surface 50a of the frame 50.
  • the frame-like cover member TF1 fixed to the second end face 50g of the frame 50 through which the gas flows in by adhesion or the like.
  • the material of the gasket 54A is the same as that of the gasket 46, and the material of the cover member TF1 is the same as the material of the cover member TF3, for example.
  • the shape of the handle portion 70A is arbitrary.
  • the groove portions 52A and 52B of the frame 50 have edge portions 52Aa, 52Ab and 52Ba, 52Bb arranged in parallel with a depth d1 and a width a1 in the direction from the end surface 50a to the end surface 50g.
  • the groove portions 52A and 52B are inclined so as to be close to the second end surface 50g on the fourth side surface 50e of the frame 50 on the average and close to the first end surface 50a on the third side surface 50d.
  • chamfered portions 52Bc and 52Bd are formed at both ends of the second groove portion 52B (and the first groove portion 52A) to facilitate engagement with upper guide plates 48A and 48C on the casing 28 described later ( (See FIG. 5C).
  • the second filter box 40 is held in a substantially annular frame 55 provided with a substantially square opening 55f (see FIG. 4) in the center, and the opening 55f.
  • the gas of the frame 55 flows out to the chemical filter 56 and the lower surface (bottom surface or mounting surface) 55b as the first side surface mounted on the upper surface of the bottom plate 28h (see FIG. 2) of the casing 28 of the frame 55.
  • the first groove portion 57A is formed to be inclined with respect to the first end surface 55a on the side at the same inclination angle ⁇ as that of the first groove portion 52A (see FIG. 5D).
  • the filter box 40 has a second groove portion 57B formed in the same shape in parallel with the first groove portion 57A on the upper surface 55c (second side surface) opposite to the lower surface 55b of the frame 55 with respect to the chemical filter 56.
  • the depth d2 of the groove portions 57A and 57B of the filter box 40 is deeper than the depth d1 of the groove portions 52A and 52B of the filter box 38, and the width a2 of the two edge portions 57Aa, 57Ab and 57Ba, 57Bc of the groove portions 57A and 57B. Is set narrower than the width a1 of the groove portions 52A and 52B.
  • the configuration of the filter box 40 is the same as that of the filter box 38 except that the type of the chemical filter 56 is different from the chemical filter 51 and the shape of the groove portions 57A and 57B is different from the groove portions 52A and 52B. *
  • the filter box 40 also has a substantially square annular gasket 54B fixed to the first end surface 55a of the frame 55 by adhesion or the like so as to surround the opening 55f, and a handle fixed to the fourth side surface 55e of the frame 55. And a frame-like cover member TF2 fixed to the second end surface 55g of the frame 55 on the gas inflow side by bonding or the like. Further, the groove portions 57A and 57B provided in the frame 55 are also close to the second end surface 55g on the fourth side surface 55e of the frame 55 on the average and close to the first end surface 55a on the third side surface 55d. So as to be inclined.
  • chamfered portions 57Bc and 57Bd are formed at both ends of the second groove portion 57B (and the first groove portion 57A) to facilitate engagement with an upper guide plate 48B on the casing 28 described later (FIG. 5). (See (D)).
  • the first filter box 38 and the second filter box 40 are different from each other in the shape of the groove portions 52A, 52B and 57A, 57B, so that the types of the chemical filters 51, 56 are different from the outer shape. Be identifiable.
  • the cover member TF3 is provided on the partition plate 42 in FIG. 2, and the cover members TF1 and TF2 are provided on the filter boxes 38 and 40, whereby the filter boxes 38 and 40 are carried out from the casing 28 when the filter boxes 38 and 40 are replaced.
  • the gaskets 54A and 54B of the filter boxes 38 and 40 can be easily separated from the partition plate 42 (cover member TF3) and the filter box 38 (cover member TF1), respectively.
  • the gasket 54A of the filter box 38 can be easily separated from the filter box 40 (cover member TF2).
  • the filter device 26 has three rails fixed in parallel to the upper surface of the bottom plate 28 h of the casing 28 so as to be inclined at an inclination angle ⁇ with respect to the surface of the partition plate 42.
  • Lower rail guide plates 47A, 47B, 47C and three rail-like upper guides fixed in parallel to the bottom surface of the upper plate 28j of the casing 28 so as to incline at an inclination angle ⁇ with respect to the surface of the partition plate 42.
  • Plates 48A, 48B, 48C In the present embodiment, the lower portion is a portion (bottom portion) in the ⁇ Z direction (vertically below) in use, and the upper portion is a portion in the + Z direction. *
  • the lower guide plates 47A to 47C and the upper guide plates 48A to 48C are parallel to each other.
  • the inclination angles ⁇ of the guide plates 47A to 47C and 48A to 48C are the inclination angles ⁇ of the grooves 52A and 52B and 57A and 57B provided in the frames 50 and 55 of the filter boxes 38 and 40 (FIGS. 5C and 5D). ))).
  • the guide plates 47A to 47C and 48A to 48C are made of the same metal as the frames 50 and 55, for example.
  • the guide plates 47A to 47C and 48A to 48C may be formed of a slippery synthetic resin, similar to the cover member TF3.
  • the lower guide plates 47A and 47C for the filter box 38 have the same shape.
  • the lower guide plate 47A is a flat plate-like member having parallel edge portions 47Aa and 47Ab having a width b1 in the Y direction.
  • the width b1 of the lower guide plate 47A is set to be slightly smaller than the width a1 of the first groove 52A of the filter box 38 and wider than the width a2 of the first groove 57A of the filter box 40.
  • the thickness h1 of the lower guide plate 47A is set slightly smaller than the depth d1 of the first groove 52A of the filter box 38.
  • the lower guide plate 47A is accommodated in the first groove portion 52A, and the lower guide plate 47A is in the first groove portion 57A of the filter box 40. You can't hold it in.
  • the length L1 of the lower guide plate 47A is set longer than the first groove 52A.
  • the lower guide plate 47B for the filter box 40 has edge portions 47Ba and 47Bb having a width b2 narrower than the width b1 in the Y direction, and is a flat plate member having a length L1 with a thickness h2 thicker than h1. It is.
  • the width b2 is set slightly smaller than the width a2 of the first groove 57A of the filter box 40.
  • the thickness h2 of the lower guide plate 47B is set to be larger than the depth d1 of the first groove 52A of the filter box 38 and slightly smaller than the depth d2 of the first groove 57A. Therefore, in a state where the filter boxes 38 and 40 are placed on the bottom plate 28h, the lower guide plate 47B is accommodated in the first groove portion 57A, and the lower guide plate 47B cannot be held in the first groove portion 52A.
  • the filter box 38, 40 is smoothly placed on the bottom plate 28h in the state where the first groove portions 52A, 57A, 52A of the filter box 38, 40, 38 are engaged with the lower guide plates 47A, 47B, 47C, respectively.
  • the filter boxes 38 and 40 can be easily and accurately positioned with respect to the partition plate 42 by being moved to the side.
  • chamfered portions 47Ac and 47Bc are formed at the tip portions of the lower guide plates 47A and 47B on the window portion 28b side. Therefore, the first groove portions 52A and 57A of the filter boxes 38 and 40 can be easily engaged with the lower guide plates 47A and 47B.
  • the shapes of the upper guide plates 48A and 48C for the filter box 38 are the same.
  • the upper guide plate 48A is a plate-like member having a length L2 and having edge portions 48Aa and 48Ab having the same width in the Y direction as the width b1 of the lower guide plate 47A.
  • the thickness h3 of the upper guide plate 48A is set so that the upper guide plate 48A can be accommodated in the second groove 52B of the frame 50 of the filter box 38 when the filter box 38 is placed on the bottom plate 28h.
  • the length L2 of the upper guide plate 48A is set to be shorter than the length of the second groove 52B. *
  • the upper guide plate 48B for the filter box 40 has edge portions 48Ba and 48Bb whose width in the Y direction is the same as the width b2 of the lower guide plate 47B, a flat plate shape having a thickness h4 larger than h3 and a length L2. It is a member.
  • the thickness h4 is such that when the filter boxes 38, 40 are placed on the bottom plate 28h, the upper guide plate 48B cannot be held in the second groove 52B of the filter box 38, and the thickness of the frame 55 of the filter box 40 is
  • the upper guide plate 48B is set to fit in the two groove portions 57B. A certain amount of clearance is secured between the upper surfaces of the filter boxes 38 and 40 and the upper plate 28j of the casing 28.
  • the first guide portions 52A, 57A, and 52A of the filter boxes 38, 40, and 38 are engaged with the lower guide plates 47A, 47B, and 47C in the casing 28, respectively, and then the upper guide plates 48A, 48B, and 48C.
  • the second groove portions 52B, 57B, and 52B of the filter boxes 38, 40, and 38 can be engaged with each other.
  • the filter boxes 38 and 40 can be smoothly moved on the bottom plate 28h.
  • chamfered portions 48Ac and 48Bc are formed at the tip portions of the upper guide plates 48A and 48B on the window portion 28b side. For this reason, the second groove portions 52B and 57B of the filter boxes 38 and 40 can be easily engaged with the upper guide plates 48A and 48B.
  • FIG. 4 is a cross-sectional view of the filter device 26 in a state in which the door 29 of the casing 28 in FIG. 2 is closed as seen from above.
  • the first groove portions 52A, 57A, 52A of the filter boxes 38, 40, 38 horizontally disposed on the upper surface of the bottom plate 28h of the casing 28 are engaged with the lower guide plates 47A, 47B, 47C, respectively.
  • the second groove portions 52B, 57B, 52B of the filter boxes 38, 40, 38 are engaged with the upper guide plates 48A, 48B, 48C, respectively (see FIG. 2).
  • the gasket 54A of the filter box 38 engaged with the lower guide plate 47A is in close contact with the cover member TF3 fixed to the partition plate 42, and the lower guide plate is attached to the cover member TF1 fixed to the filter box 38.
  • the gasket 54B of the filter box 40 engaged with 47B is in close contact
  • the gasket 54A of the filter box 38 engaged with the lower guide plate 47C is in close contact with the cover member TF2 fixed to the filter box 40.
  • the spaces 28 c and 28 f divided by the partition plate 42 in the casing 28 are airtight by a door 29 having a gasket 46.
  • the urging mechanisms 58A, 58B, 58C having the same configuration for urging the filter boxes 38, 40 from the door 29 side toward the side wall 28i of the casing 28 correspond to the lower guide plates 47A-47C. 29.
  • the urging mechanism 58C includes a fulcrum portion 58C3 fixed to the door 29, a lever member 58C2 rotatably attached to the fulcrum portion 58C3, and a compression coil that urges the lever member 58C2 from the door 29 toward the casing 28.
  • the spring 58C1 and a stopper (not shown) that suppresses the rotation angle of the lever member 58C2 to a predetermined value or less.
  • Lower guide plates 47A to 47C (and upper guide plates 48A to 48C) and first groove portions 52A and 57A (and second groove portions 52B and 57B) are inclined with respect to the surface of partition plate 42 at an inclination angle ⁇ (see FIG. 3). Therefore, the filter boxes 38 and 40 are urged toward the partition plate 42 by urging the filter boxes 38 and 40 toward the side wall 28i with the urging mechanisms 58A to 58C. Therefore, the airtightness between the partition plate 42 (cover member TF3) and the filter boxes 38 and 40 is maintained high.
  • the air AR in the first space 28c in the casing 28 always has the chemical filter 51 in the filter box 38 engaged with the lower guide plate 47C and the chemical filter in the filter box 40 engaged with the lower guide plate 47B.
  • the chemical filter 51 in the filter box 38 engaged with the lower guide plate 47A, and the opening 42a of the partition plate 42 to flow into the second space 28f.
  • the air in the space 28i flows through the side wall opening 28g to the first duct 32 of FIG. Therefore, the air AR flowing from the opening 28a of the casing 28 always passes through the filter box 38 for removing the organic gas in the second stage and the filter box 40 for removing the alkaline gas and the acidic gas in the first stage, as shown in FIG. Since air is supplied to the air conditioner 30, air from which impurities are highly removed is supplied into the chamber 10.
  • FIGS. 6A and 6B the casing 28 is shown in section.
  • two filter boxes 38 and one filter box 40 are first installed in the casing 28, two filter boxes 38 filled with an unused chemical filter 51 of FIG. 5A, and FIG. And a single filter box 40 filled with an unused chemical filter 56.
  • the operator (not shown) holds the handle 70A of the first filter box 38,
  • the first groove 52A of the lower surface 50b of the filter box 38 (frame 50) is engaged with the tip of the lower guide plate 47A on the bottom plate 28h in the space 28c of the casing 28.
  • the filter box 38 moves obliquely along the lower guide plate 47A, and the second groove 52B of the filter box 38 (frame 50) is formed on the upper guide plate 48A of the casing 28.
  • the filter box 38 is further pushed into the side wall 28i in this state, as shown in FIG. 6B, the filter box 38 is located at the position where the gasket 54A contacts the cover member TF3 on the surface of the partition plate 42 (installation position). Stop at. In this case, the edge portions 52Aa and 52Ba on the end face 50a side (the partition plate 42 side in FIG.
  • the operator holds the handle portion 70B of the first filter box 40, and engages the first groove portion 57A of the lower surface 55b of the filter box 40 (frame 55) with the tip portion of the lower guide plate 47B on the bottom plate 28h.
  • the filter box 40 moves obliquely along the lower guide plate 47B, and the second groove portion 57B of the filter box 40 engages with the upper guide plate 48B of the casing 28.
  • the filter box 40 stops at a position (installation position) where the gasket 54B contacts the cover member TF1 of the first filter box 38.
  • the edge portions 57Aa and 57Ba on the end surface 55a side (the partition plate 42 side in FIG. 6B) of the groove portions 57A and 57B of the filter box 40 partition the lower guide plate 47B and the upper guide plate 48B in the casing 28. Since the edge portions 47Ba and 48Ba on the plate 42 side are biased toward the partition plate 42, the gasket 54B is in close contact with the cover member TF1.
  • the operator engages the first groove 52A on the lower surface 50b of the second filter box 38 (not shown) with the tip of the lower guide plate 47C on the bottom plate 28h.
  • the filter box 38 is pushed into the side wall 28i.
  • the second groove 52B of the filter box 38 is engaged with the upper guide plate 48C of the casing 28 and then the filter box 38 is further pushed into the side wall 28i, as shown in FIG. 54A stops at a position (installation position) in contact with the cover member TF2 of the filter box 40. Thereafter, by closing the door 29, the filter device 26 can be used.
  • the operator holds the handle 70A of the second filter box 38, and moves the filter box 38 along the guide plates 47C, 48C to the casing 28. Pull out. Subsequently, the handle 70B of the filter box 40 is held, the filter box 40 is pulled out of the casing 28 along the guide plates 47B and 48B, and the first filter box 38 is pulled out of the casing 28 along the guide plates 47A and 48A. Pull out. Thereafter, the new filter boxes 38 and 40 are installed in the casing 28 in the order described with reference to FIGS. 6A and 6B, whereby the replacement of the filter boxes 38 and 40 is completed.
  • the filter boxes 38 and 40 are provided with grooves 52A and 52B and 57A and 57B, and the lower guide plates 47A to 47C and the upper guide plates 48A to 48C are provided in the casing 28. , 40 can be easily and quickly installed at the installation position. Furthermore, since the filter boxes 38 and 40 can be easily taken out from the casing 28, the filter boxes 38 and 40 can be easily and quickly replaced.
  • the exposure apparatus EX of the present embodiment includes an entire air conditioning system including the filter device 26 and the air conditioner 30.
  • the filter device 26 includes two first filter boxes 38 and one second filter box 40. ing.
  • the first filter box 38 that holds the chemical filter 51 includes a frame 50 that holds the chemical filter 51, and a first groove 52A (first shape changing portion) formed on the lower surface 50b (first side surface) of the frame 50. And).
  • the first groove 52A includes two side surfaces (first end surfaces) 50a and 50g that are separated from each other on the side surface of the frame 50, on one end surface 50g side, and on the side surfaces of the frame 50 that are separated from each other ( Edge portion 52Aa extending from the side surface 50e side of the second end surface 50d, 50e to the other side surface 50a side of the two end surfaces 50a, 50g and to the other side surface 50d of the two side surfaces 50d, 50e. Including.
  • the filter device 26 includes a filter box 38 and a casing 28 that houses the filter box 38 with a side surface of the frame 50 of the filter box 38 in which the first groove 52A is formed as a lower surface 50b, and a bottom plate 28h of the casing 28. And a lower guide plate 47A (first guide portion) having an edge portion 47Aa that can contact the edge portion 52Aa of the first groove portion 52A of the filter box 38.
  • the frame 50 is urged (moved) so that the edge 52Aa of the first groove 52A of the filter box 38 moves along the edge 47Aa of the lower guide plate 47A of the casing 28.
  • the filter box 38 (chemical filter 51) can be installed efficiently and easily with respect to the target position in the casing 28.
  • the lower guide plate 47A of the filter box 38 can perform two functions of movement and positioning.
  • the first filter box 38 is formed on the upper surface 50c (second side surface) opposite to the lower surface 50b of the frame 50 with respect to the chemical filter 51, and includes a first filter box 38 including an edge portion 52Ba parallel to the edge portion 52Aa. It has 2 groove part 52B (2nd shape change part). Further, the filter device 26 is provided on the bottom surface (upper part) of the upper plate 28j of the casing 28, and has an upper guide plate 48A (first guide) having an edge part 48Aa that can contact the edge part 52Ba of the second groove part 52B of the filter box 38. 2 guides).
  • the shape of the first groove 57A and the second groove 57B provided in the frame 55 of the second filter box 40 is different from the shape of the grooves 52A and 52B of the first filter box 38, and the casing
  • the lower guide plates 47A and 47B in 28 are configured to engage with the first groove portions 52A and 57A, respectively, and the upper guide plates 48A and 48B are configured to engage with the second groove portions 52B and 57B, respectively.
  • the chemical filter 51 (filter medium) of the filter box 38 removes organic gas (organic matter) in the gas passing through the filter box 38
  • the chemical filter 56 (filter medium) of the filter box 40 contains the inside thereof. Since the alkaline gas and the acidic gas in the passing gas are removed, air in which impurities are highly removed can be supplied into the chamber 10 in which the exposure main body 4 is accommodated.
  • the filter in the filter box 40 may be, for example, a filter that removes at least one of an alkaline substance and an acidic substance in a gas passing through the filter box 40.
  • the impurity which a chemical filter removes is arbitrary, For example, you may make it absorb organic gas, alkaline gas, and acidic gas with one chemical filter.
  • one type of filter box may be arranged in a plurality of stages in the casing 28.
  • any filter (filter medium) other than the chemical filter can be used for the filters in the filter boxes 38 and 40.
  • a dustproof filter for removing minute particles (particles) such as a HEPA filter or a ULPA filter may be used.
  • the air can be highly purified.
  • the number of filter boxes 38 and 40 included in the filter device 26 is arbitrary.
  • one or a plurality of filter boxes 38 or one or a plurality of filter boxes 40 may be installed in the filter device 26.
  • the inside of the casing 28 may be divided into a plurality of spaces in the Z direction, and one or a plurality of filter boxes 38 and 40 may be installed in each space.
  • the filter boxes 38 and 40 can be easily installed. It is also possible to simply stack the filter boxes 38 and 40, for example, alternately without partitioning the inside of the casing 28 with the partition plate 42.
  • the exposure apparatus EX of the present embodiment is an exposure main body that exposes the wafer W in the exposure apparatus that exposes the wafer W (substrate) through the pattern of the reticle R and the projection optical system PL with the exposure light EL. 4, a filter device 26 including the filter boxes 38 and 40 of the present embodiment, and an air conditioner 30 that blows air taken from the filter device 26 into the chamber 10.
  • the filter boxes 38 and 40 can be exchanged efficiently, and positioning between the filter boxes 38 and 40 can be performed with high accuracy, so that the exposure apparatus can be efficiently maintained. And impurities in the air in the chamber 10 can be removed with high accuracy.
  • the frame in which the groove portions similar to the frames 50 and 55 of the filter boxes 38 and 40 are formed is used as the frame of the filter boxes 63 and 64 of the local air conditioner 60 in the loader chamber 10b.
  • the filter boxes 63 and 64 may be housed in a casing in which guide plates similar to the lower guide plates 47A and 47B and the upper guide plates 48A and 48B are formed.
  • FIG. 7 shows a filter device 26A according to a modification of the above embodiment.
  • the filter device 26A includes two filter boxes 38A, one filter box 40A, and a casing 28 that houses the filter boxes 38A and 40A.
  • the filter box 38A has a first groove 52A formed on the bottom surface of the frame, and no groove is formed on the top surface of the frame.
  • the filter box 40A has a first groove portion 57A formed on the bottom surface of the frame, and no groove portion formed on the upper surface of the frame.
  • the groove portions 52A and 52B of the frame 50 have been described as having the edge portions 52Aa, 52Ab and 52Ba, 52Bb arranged in parallel.
  • the edge portions are limited to the configuration arranged in parallel.
  • the groove 52A of the frame 50 And in 52B, you may make it a groove part from which the width
  • an upper guide plate and a lower guide plate suitable for the shape of the groove may be provided.
  • the lower plate 28c of the casing 28 of the filter device 26A is provided with lower guide plates 47A to 47C, but the upper plate 28j is not provided with a guide plate.
  • the other configuration is the same as that of the filter device 26.
  • the filter boxes 38A and 40A are installed in the casing 28 by engaging the first groove portions 52A and 57A of the filter boxes 38A and 40A with the lower guide plates 47A (47C) and 47B, respectively. Can be done relatively easily.
  • the handle portions 70A and 70B such as the filter boxes 38 and 40 are convex portions.
  • concave portions provided on the side surfaces of the frames 50 and 55 may be used as the handle portions.
  • a slippery synthetic resin plate may be fixed to the grooves 52A, 52B, 57A, and 57B of the frames 50 and 55 such as the filter boxes 38 and 40 of the above-described embodiment by, for example, bonding. As a result, the filter boxes 38, 40, etc. can be inserted and removed more smoothly.
  • stepped portions having edge portions 52Aa, 52Ba, 57Aa, 57Ba are formed instead of the groove portions 52A, 52B, 57A, 57B of the frames 50, 55 such as the filter boxes 38, 40 of the above embodiment. Also good.
  • the cover member TF3 on the surface of the partition plate 42 and / or the cover members TF1 and TF2 of the filter boxes 38 and 40 may be omitted.
  • the gaskets 54A and 54B of the filter boxes 38 and 40 can be omitted.
  • the gaskets 54 ⁇ / b> A and 54 ⁇ / b> B may be provided on the other party (for example, a partition plate or other filter box) with which the first end surface 50 a is in close contact.
  • a slippery resin adhesive tape may be attached instead of the cover members TF1 to TF3, for example.
  • the outer shapes of the frames 50 and 55 of the filter boxes 38, 38A, 40, and 40A are substantially square (substantially square ring (frame shape)).
  • the outer shapes of the frames 50 and 55 may be chamfered at corners in a substantially rectangular shape such as a rectangle (substantially rectangular ring (frame shape)), or a substantially square or rectangular shape.
  • the filter box has a direction in which the filter plane intersects the horizontal direction, for example, the filter plane of the filter box is installed in the XZ plane, but the filter plane of the filter box is the XZ plane. May be installed with an inclination relative to.
  • a taper may be formed on the installation surface of the filter box frame, or a taper member may be provided on the bottom plate 28 h of the casing 28.
  • the exposure apparatus EX of the above-described embodiment incorporates an illumination optical system and a projection optical system composed of a plurality of lenses into the exposure apparatus main body to perform optical adjustment, and a reticle stage and wafer stage composed of a large number of mechanical parts. Is attached to the exposure apparatus main body, wiring and piping are connected, and further comprehensive adjustment (electrical adjustment, operation check, etc.) is performed.
  • the exposure apparatus is preferably manufactured in a clean room in which the temperature, cleanliness, etc. are controlled.
  • the electronic device when an electronic device (or micro device) such as a semiconductor device is manufactured using the exposure apparatus EX of the above embodiment, the electronic device performs a function / performance design of the electronic device as shown in FIG. 221, manufacturing a mask (reticle) based on this design step 222, manufacturing a substrate (wafer) as a base material of the device and applying a resist 223, mask pattern by the exposure apparatus of the above-described embodiment
  • a substrate (sensitive substrate), a process for developing the exposed substrate, a substrate processing step 224 including heating (curing) and etching process of the developed substrate, a device assembly step (dicing process, bonding process, package process) 225) as well as the inspection step 22 It is manufactured through the like.
  • this device manufacturing method includes forming the pattern of the photosensitive layer on the substrate using the exposure apparatus of the above embodiment, and processing the substrate on which the pattern is formed (step 224). Yes.
  • the exposure apparatus the maintenance cost can be reduced and the exposure accuracy can be improved, so that the electronic device can be manufactured at a low cost with high accuracy.
  • air is used as the air conditioning gas. Instead, nitrogen gas or a rare gas (such as helium or neon), or a mixed gas of these gases may be used. .
  • the present invention can be applied not only to a scanning exposure type projection exposure apparatus but also to exposure using a batch exposure type (stepper type) projection exposure apparatus.
  • the present invention can also be applied when exposure is performed using a proximity type or contact type exposure apparatus that does not use a projection optical system.
  • the present invention is not limited to application to a semiconductor device manufacturing process.
  • a manufacturing process of a display device such as a liquid crystal display element or a plasma display formed on a square glass plate, or an imaging element (CCD, etc.), micromachines, MEMS (Microelectromechanical Systems), thin film magnetic heads, and various devices such as DNA chips can be widely applied to the manufacturing process.
  • the present invention can also be applied to a manufacturing process when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.
  • the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be taken without departing from the gist of the present invention.
  • the disclosures in the above-mentioned publications, international publication pamphlets, US patents, or US patent application publication specifications described in the present application are incorporated into the description of this specification.
  • the entire disclosure of Japanese Patent Application No. 2011-105904 filed on May 11, 2011, including the specification, claims, drawings, and abstract, is incorporated herein by reference in its entirety. ing.
  • EX ... exposure device, R ... reticle, PL ... projection optical system, W ... wafer, 4 ... exposure body, 10 ... chamber, 26 ... filter device, 28 ... casing, 30 ... air conditioner, 38,40 ... filter box, 42 ... partition plate, 47A to 47C ... lower guide plate, 48A to 48C ... upper guide plate, 50, 55 ... frame, 52A, 57A ... first groove, 52B, 57B ... second groove, 51, 56 ... chemical filter, 60 ... Local air conditioner, 70A, 70B ... Handle part

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Le boîtier de filtre de l'invention possède : un cadre dans lequel un filtre chimique est conservé, et des premières parties rainure formées sur les faces latérales du cadre. Ces premières parties rainure incluent des parties bord se prolongeant depuis une première face latérale parmi les deux faces latérales séparées l'une de l'autre des faces latérales du cadre, du côté d'une première face extrémité parmi deux faces extrémité séparées l'une de l'autre sur la face latérale du cadre, jusqu'à l'autre face latérale parmi les deux faces latérales, du côté de l'autre face extrémité parmi deux faces extrémité. Selon l'invention, il est possible d'effectuer un placement de filtre de manière à permettre un positionnement aisé de celui-ci.
PCT/JP2012/062154 2011-05-11 2012-05-11 Boîtier de filtre, dispositif de filtre, et dispositif de photolithographie WO2012153840A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014219159A (ja) * 2013-05-09 2014-11-20 株式会社Ｆｈアライアンス 住宅吸気システム
JP2015086847A (ja) * 2013-11-01 2015-05-07 愛三工業株式会社 蒸発燃料処理装置
TWI656590B (zh) * 2017-04-07 2019-04-11 鈺祥企業股份有限公司 空氣濾網模組

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220774U (fr) * 1988-07-27 1990-02-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220774U (fr) * 1988-07-27 1990-02-13

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014219159A (ja) * 2013-05-09 2014-11-20 株式会社Ｆｈアライアンス 住宅吸気システム
JP2015086847A (ja) * 2013-11-01 2015-05-07 愛三工業株式会社 蒸発燃料処理装置
TWI656590B (zh) * 2017-04-07 2019-04-11 鈺祥企業股份有限公司 空氣濾網模組

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