WO2011122068A1 - Sonde de contact, corps de connexion de sonde de contact et procédés pour leur fabrication - Google Patents

Sonde de contact, corps de connexion de sonde de contact et procédés pour leur fabrication Download PDF

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Publication number
WO2011122068A1
WO2011122068A1 PCT/JP2011/050770 JP2011050770W WO2011122068A1 WO 2011122068 A1 WO2011122068 A1 WO 2011122068A1 JP 2011050770 W JP2011050770 W JP 2011050770W WO 2011122068 A1 WO2011122068 A1 WO 2011122068A1
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WO
WIPO (PCT)
Prior art keywords
contact
contact probe
probes
main body
manufacturing
Prior art date
Application number
PCT/JP2011/050770
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English (en)
Japanese (ja)
Other versions
WO2011122068A9 (fr
Inventor
平田　嘉裕
和典 川瀬
新田　耕司
稲澤　信二
健之 徳田
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to US13/395,860 priority Critical patent/US20120176122A1/en
Priority to JP2012508112A priority patent/JPWO2011122068A1/ja
Priority to EP11762309A priority patent/EP2555001A1/fr
Publication of WO2011122068A1 publication Critical patent/WO2011122068A1/fr
Publication of WO2011122068A9 publication Critical patent/WO2011122068A9/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Definitions

  • Another object of the present invention is to provide a contact probe coupling body, a contact probe coupling body manufacturing method, and a contact probe manufacturing method that facilitate handling and reduce costs.
  • the contact probe of the present invention has a contact portion that contacts the object to be measured, a main body portion connected to the contact portion, and a direction intersecting with the extending direction of the main body portion, and has an entire outer periphery of a cross section not including the contact portion.
  • the volume resistivity of the material of the covering portion is smaller than the volume resistivity of the material of the main body portion.
  • the contact probe coupling body of the present invention includes a plurality of the contact probes, a coupling member that couples the plurality of contact probes at a portion other than the contact portion in the plurality of contact probes and the tip portion opposite to the contact portion. Is provided.
  • the plurality of contact probes are positioned by the connecting member, the plurality of contact probes can be integrally handled as one contact probe connecting body. Therefore, workability such as processing for the contact probe can be improved.
  • a plurality of contact probes are formed in a region to be a plurality of contact probes including a contact portion, a main body portion, and a tip portion, and in a portion other than the contact portion and the tip portion in the plurality of contact probes.
  • region which should become a connection member to connect opens is formed.
  • the coupling member couples the other ends of the plurality of separating portions and is arranged at a distance from the contact portions or tip portions of the plurality of contact probes facing each other. Further included.
  • connection member connects the other ends of the plurality of separation portions, and is spaced from the contact portions or tip portions of the plurality of contact probes facing each other.
  • the opening is formed so as to further include a second connection portion that is spaced apart.
  • a plurality of contact probes can be manufactured by separating the plurality of contact probes from the contact probe assembly. Further, when the post-processing is performed on each contact probe, it is possible to cope with the processing by separating the plurality of contact probes from the connecting member after the post-processing in the state of the contact probe coupling body. For this reason, handling is easy also in post-processing. In addition, since a plurality of contact probes can be easily separated, the cost can be reduced.
  • the contact probe 10a in this Embodiment includes a contact portion 11, a main body portion 12, a tip portion 13, a covering portion 14, and a stopper 15.
  • a metal material is filled into the opening 22a of the mold 22 by electroforming.
  • a metal ion solution containing a material that becomes the contact portion 11, the main body portion 12, the tip portion 13, and the stopper 15 of the contact probe 10 a shown in FIG. 1 is prepared.
  • the contact probe connector 1 a made of a metal material is formed in the opening 22 a of the mold 22 on the substrate 21.
  • a metal material can be deposited on the opening 22a of the mold 22 by performing electroforming using the substrate 21 as a plating electrode. At this time, the metal material is deposited to such an extent that the opening 22a of the mold 22 is filled.
  • Each of the holding portions 5 of the present embodiment holds two opposing locations of a plurality of contact probes, but may hold one location of each contact probe and hold 3 or more locations. Also good.
  • the method of removing is not particularly limited, but for example, machining, etching, etc. can be employed.
  • machining the metal layer is removed by polishing, for example.
  • Etching can be performed by either dry etching or wet etching, but is preferably performed by wet etching.
  • the extending direction of the main body 12 in the present embodiment means the extending direction at each position. That is, the direction in which the main body 12 extends in the present embodiment is different at each position.
  • any conductor can be used, for example, copper (Cu) or a copper alloy can be used.
  • the lower limit of the thickness of the first coating layer 34 can be set to, for example, 1 ⁇ m, more preferably 1.5 ⁇ m, and still more preferably 2 ⁇ m.
  • the upper limit of the thickness of the 1st coating layer 34 is 5 micrometers or less, for example, More preferably, it can be 4 micrometers, More preferably, it can be 3 micrometers.
  • fills required R3 can be used.
  • the second covering layer 44 can be determined as follows. That is, probes having the second coating layer 44 having various thicknesses are manufactured, and an acceleration test is performed under the usage environment conditions (temperature and humidity conditions are the same as those in the usage environment). Thereafter, by analyzing the surface of the probe in the depth direction by XPS (X-ray photoelectron spectroscopy), the presence or absence of oxidation of the first coating layer 34 is confirmed, so that the second coating layer 44 is experimentally tested. The required thickness can be determined.
  • the contact probe 110a is pressed against a measurement object such as a measurement surface of an electric circuit to measure various electrical characteristics.
  • Each of the plurality of contact probes 110a includes a contact portion 111a that contacts the object to be measured, a main body portion 112a that is connected to the contact portion 111a, a main body portion 112a, and a tip that is opposite to the contact portion 111a. 113a.
  • a recess may be formed in a side portion of the main body portion 112a that is connected to the holding portion 105a of the connecting member 102a.
  • the plurality of contact probes 110a are arranged in parallel. In other words, the plurality of contact probes 110a are arranged in the same direction.
  • the plurality of contact probes 110a have, for example, the shape shown in FIG.
  • the shape of the said contact probe is not specifically limited, According to a use, you may have arbitrary shapes.
  • the shapes of the plurality of contact probes may be the same or different.
  • the contact probe 110a contained in the contact probe coupling body 101a may be plural, and the number is not particularly limited.
  • the connecting member 102a connects the plurality of contact probes 110a at a portion other than the contact portion 111a and the tip portion 113a in the plurality of contact probes 110a.
  • the connecting member 102a includes a separating portion 103a, a connecting portion 104a that is a first connecting portion, a holding portion 105a, and a gripping portion 106a.
  • the separation unit 103a, the connection unit 104a, the holding unit 105a, and the gripping unit 106a are connected to each other and integrated.
  • the planar shape of the separating portion 103a and the connecting portion 104a is a comb shape.
  • the planar shapes of the plurality of separation portions 103a and the connection portions 104a constitute a comb-shaped frame portion with respect to the plurality of contact probes 110a.
  • the holding unit 105a is connected to the side surface of the separation unit 103a.
  • Each of the holding portions 105a extends from the opposite side surface of the separation portion 103a in a direction (right-and-left direction in FIG. 25) that intersects (orthogonal in this embodiment) with the extending direction (vertical direction in FIG. 25) of the separation portion 103a. , Projecting toward the adjacent separation portion 103a.
  • the holding portion 105a has a plurality of contact probes 110a along one direction (left and right direction in FIG. 25) intersecting (orthogonal in this embodiment) with the extending direction (vertical direction in FIG. 25) of the plurality of contact probes 110a. At least two locations on the outer periphery of the. In other words, the holding part 105a is connected to both sides of the side surface of the region other than the contact part 111a and the tip part 113a of the plurality of contact probes 110a.
  • the holding portions 105a are arranged along one direction (left and right direction in FIG. 25) that intersects the extending direction (up and down direction in FIG. 25) of the plurality of contact probes 110a.
  • the tip of the holding portion 105a may be formed in a tapered shape. Further, the tip of the holding portion 105a may have a width L1 as shown in FIG. 27, or may be sharp as shown in FIG.
  • the gripping portion 106a is connected to the opposite side of the connecting portion 104a where the separating portion 103a is formed.
  • the grip part 106a is a member for gripping the contact probe connector 101a, for example.
  • the length L5 excluding the tip of the holding portion 105a is, for example, 50 ⁇ m to 100 ⁇ m
  • the width L6 of the contact probe 110a is, for example, 30 ⁇ m to 70 ⁇ m
  • the width L7 of the separating portion 103a is, for example, 50 ⁇ m to 100 ⁇ m.
  • the length L8 of the concave portion of the contact probe 110a is, for example, the sum of L1, L2, and L3 in FIG.
  • 100 contact probes 110a are arranged in parallel, and for example, 101 separation parts 103a are arranged in parallel.
  • the main body 112a of the contact probe 110a connected to the connecting member 102a is formed with a recess, but may have a shape without a recess (step).
  • the dent is formed, even if the fracture surface of the contact probe 110a and the holding portion 105a becomes a burr, it can be effectively suppressed from protruding outside the contact probe 110a.
  • the burr can be suppressed by separating the contact probe 110a and the connecting member 102a with a laser or the like.
  • FIG. 29 is a plan view schematically showing a first manufacturing process of the contact probe connector 101a in the present embodiment.
  • 30 is a cross-sectional view taken along line XXX-XXX in FIG.
  • FIG. 31 is a plan view schematically showing a second manufacturing process of contact probe assembly 101a in the present embodiment.
  • 32 is a cross-sectional view taken along line XXXII-XXXII in FIG.
  • the connecting member 102a may be connected to a single connecting portion 102a regardless of its specific structure as long as a plurality of contact probes 110a are connected.
  • the connection member 102a has an opening so as to include a holding portion 105a that holds at least two of the outer peripheral edges of the plurality of contact probes 110a along one direction intersecting the extending direction of the plurality of contact probes 110a.
  • a portion 122a is formed.
  • the connecting member 102a includes a plurality of separating portions 103a arranged in parallel at intervals, and a connecting portion 104a for connecting one ends of the plurality of separating portions 103a, and each of the plurality of contact probes 110a includes:
  • the opening 122a is formed so that the contact portion 111a or the tip portion 113a that is disposed between each of the plurality of separation portions 103a and that faces the connection portion 104a is spaced from the connection portion 104a.
  • the substrate 121 is prepared.
  • the substrate 121 is not particularly limited.
  • a stainless steel such as copper (Cu), nickel (Ni), or SUS, a metal substrate such as aluminum (Al), a Si substrate provided with conductivity, a glass substrate, or the like may be used. it can.
  • a resin layer to be a resin mold 122 is formed on the substrate 121.
  • the resin layer is not particularly limited.
  • a resist such as a resin material mainly composed of polymethacrylic acid ester or a chemically amplified resin material sensitive to ultraviolet rays (UV) or X-rays can be used.
  • the thickness of the resin layer (thickness H1 in FIG.
  • the thickness H1 of the resin layer is about 10 to 20% thicker than the thickness of the contact probe 110a to be formed, for example, 40 ⁇ m.
  • a mask having an absorption layer that does not transmit light and a light-transmitting layer that transmits light is disposed on the resin layer.
  • the absorption layer of the mask has the same shape as that of the contact probe connector 101a shown in FIG.
  • the mask absorption layer has a shape opposite to that of the contact probe connector 101a.
  • light such as UV or X-ray is irradiated through the mask.
  • the resin layer located under the absorbing layer is not exposed, and the resin layer located under the light transmitting layer is altered.
  • the resin layer is a positive type resin, only the part where the alteration (molecular chain is cut) is removed by development, and a resin mold 122 as shown in FIGS. 29 and 30 is obtained.
  • the opening 122a of the mold 122 is filled with a metal material by electroforming.
  • a metal ion solution containing a material that becomes the contact probe connector 101a shown in FIG. 25 is prepared.
  • a layer made of a metal material is formed in the opening 122a of the mold 122 on the substrate 121 using this metal ion solution.
  • a metal material can be deposited in the opening 122a of the mold 122 by performing electroforming using the substrate 121 as a plating electrode. At this time, a metal material is deposited to such an extent that the opening 122a of the mold 122 is filled.
  • the surface of the metal material filled in the opening 122a of the mold 122 is polished or ground.
  • the thickness of the metal material is adjusted to be the thickness of the contact probe connector 101a to be formed.
  • the thickness H2 of the metal material is, for example, 30 ⁇ m.
  • the mold 122 and the substrate 121 are removed.
  • the removal method is not particularly limited.
  • the mold 122 is removed by wet etching, plasma ashing, or the like.
  • the substrate 121 is removed by, for example, wet etching using acid or alkali, machining, or the like. Thereby, the contact probe coupling body 101a shown in FIGS. 25 and 26 can be manufactured.
  • the coupling member 102a couples the plurality of contact probes 110a with the main body 112a that has little influence on the function.
  • An integrated contact probe connector 101a can be realized. Since the contact probe coupling body 101a is larger than the individual contact probe 110a, handling becomes easy. Further, by performing post-processing with the contact probe coupling body 101a, productivity can be improved as compared with the case where the contact probes 110a are individually post-processed, so that costs can be reduced.
  • FIG. 33 is a plan view schematically showing contact probe connector 101b according to Embodiment 6 of the present invention. With reference to FIG. 33, the contact probe coupling body 101b in this Embodiment is demonstrated.
  • the contact probe connector 101b in the present embodiment basically has the same configuration as the contact probe connector 101a of the fifth embodiment shown in FIG.
  • the contact probe coupling body 101b according to the present embodiment is different in that the coupling member 102b further includes a connection portion 107b as a second connection portion.
  • the connecting portion 107b connects the other ends (lower ends in FIG. 33) of the plurality of separating portions 103a, and contacts the contact portions 111a or the tip portions 113a (the tip portions 113a in the present embodiment) of the plurality of contact probes 110a facing each other. They are arranged at intervals.
  • the connecting portion 107b is formed in parallel with the connecting portion 104a.
  • the direction in which the connecting portion 107b extends (left and right in FIG. 33) intersects (in the present embodiment, orthogonal) with the direction in which the separating portion 103a extends (up and down in FIG. 33).
  • connection parts 104a and 7b and the separation part 103a can surround the plurality of contact probes 110a. For this reason, the strength of the contact probe connector 101b can be further increased. Therefore, when the plurality of contact probes 110a are separated from the contact probe coupling body 101b, they can be easily separated and handling becomes easier.
  • FIG. 34 is a plan view schematically showing contact probe 110a in the seventh embodiment of the present invention. Referring to FIG. 34, contact probe 110a in the present embodiment will be described. Contact probe 110a of the present embodiment is manufactured using contact probe connector 101a of Embodiment 5 shown in FIGS. 25 and 26 or contact probe connector 101b of Embodiment 6 shown in FIG.
  • the contact probe 110a includes a contact portion 111a, a main body portion 112a, a tip portion 113a, and a stopper 114a.
  • the contact part 111a is brought into contact with the object to be measured.
  • the main body part 112a is connected to the contact part 111a.
  • the tip portion 113a is connected to the main body portion 112a and is an end portion on the opposite side to the contact portion 111a.
  • the tip 113a is brought into contact with, for example, a connection terminal on the inspection apparatus side.
  • the stopper 114a is a protrusion that is connected to the contact portion 111a and the tip end portion 113a side from the center of the main body portion 112a and protrudes in a direction intersecting with the extending direction of the main body portion 112a.
  • the stopper 114a is a member for holding the contact probe 110a against an object to be measured such as a surface to be measured of an electric circuit and measuring the various electrical characteristics to a jig. In other words, the contact probe 110a is supported by the stopper 114a so as not to move during measurement.
  • the shape of the contact probe of the present invention is not particularly limited, and can be applied to contact probes having other shapes such as a curved main body.
  • FIG. 35 is a plan view showing one manufacturing process of the contact probe in the present embodiment.
  • the contact probe connector 101a of the fifth embodiment in FIG. 25 or the contact probe connector 101b of the sixth embodiment in FIG. 33 is manufactured.
  • the contact probe 110a is separated from the coupling members 102a and 102b.
  • the method of separating is not particularly limited.
  • the contact probe coupling body 101a is disposed on an elastic member such as rubber and the center of the main body 112a of the plurality of contact probes 110a is pushed, whereby the plurality of contact probes 110a and the plurality of contact probes 110a are arranged.
  • the holding part 105a is cut.
  • the contact points between the plurality of contact probes 110a and the plurality of holding portions 105a may be cut with a cutting member such as a cutter.
  • the contact probe 110a may be separated from the contact probe coupling bodies 101a and 101b by sandwiching the tip 113a of the contact probe 110a with a gripping member such as tweezers and pulling it upward.
  • the contact probe 110a and the holding unit 105a may be cut by irradiating a laser at a contact point between the contact probe 110a and the holding unit 105a.
  • a plurality of contact probes 110a shown in FIG. 34 can be manufactured.
  • the plurality of contact probes 110a can be manufactured by separating the plurality of contact probes from the contact probe coupling bodies 101a and 101b. This separation step is easy to handle. In addition, since a plurality of contact probes can be easily separated, the cost can be reduced.
  • FIG. 36 is a plan view schematically showing a contact probe connector 101c according to the eighth embodiment of the present invention.
  • FIG. 37 is a sectional view taken along the line XXXVII-XXXVII in FIG. With reference to FIG. 36 and FIG. 37, the contact probe coupling body 101c in this Embodiment is demonstrated.
  • contact probe connector 101c in the present embodiment basically has the same configuration as contact probe connector 101a in Embodiment 5 shown in FIGS. 25 and 26. Yes.
  • the contact probe coupling body 101c of the present embodiment is different in that a metal layer 108c covering the entire surface excluding the grip portion 106a of the contact probe coupling body 101a is further formed.
  • the metal layer 108c of the present embodiment uniformly covers the entire surface of the contact probe connector 101a.
  • rhodium (Rh), Au, Cu, PdCo (palladium cobalt), or the like can be used for the metal layer 108c.
  • FIG. 38 is a schematic diagram showing a process of plating in the present embodiment. First, the contact probe connector 101a according to the fifth embodiment is manufactured.
  • the entire surface of the contact probe connector 101a is plated.
  • a plating solution 123 containing a metal to be the metal layer 108c and an electrode 126 are prepared.
  • the contact probe connector 101a is immersed in the plating solution 123.
  • the plating wiring is taken out from a part (for example, the gripping portion 106a) of the connecting member 102a of the contact probe connecting body 101a, and the contact probe connecting body 101a and the electrode 126 are connected to the power source 124.
  • the positive electrode is disposed on the front side and the back side of the contact probe coupling body 101a, and the negative electrode is disposed on the contact probe coupling body 101a. In this case, variation in plating thickness can be suppressed.
  • the metal layer 108c can be plated on the entire surface of the contact probe connector 101a.
  • the contact probe connector 101c in which the metal layer 108c is formed on the entire outer peripheral surface shown in FIGS. 36 and 37 can be manufactured.
  • the metal layer 108c is formed in a state where the plurality of contact probes 110c are connected. Since the contact probe coupling body 101c according to the present embodiment does not need to hold the contact probe 110c individually, the metal layer 108c can be easily formed as compared with the case where plating is performed individually. Therefore, handling can be facilitated and cost can be reduced.
  • the characteristics of the plurality of contact probes 110a can be improved according to the selected metal material and thickness. For example, when Rh is formed as the metal layer 108c, the wear resistance can be improved, when Rh or PdCo is formed as the metal layer 108c, the contact resistance can be reduced, and when Cu or Au is formed as the metal layer 108c, the allowable current value can be improved. it can.
  • the metal layer 108c is formed after manufacturing the contact probe connector 101a of the fifth embodiment. However, after manufacturing the contact probe connector 101b of the sixth embodiment, the metal layer 108c is formed. The layer 108c may be formed. In this case, since the connection portions 104a and 7b are connected to the separation portion 103a to form a frame of the contact probe 110a, the contact probe connection body 101b has high stability. For this reason, when forming the metal layer 108c, the dispersion
  • FIG. 39 is a plan view schematically showing a contact probe 110c according to the ninth embodiment of the present invention.
  • the contact probe 110c in the present embodiment basically has the same configuration as contact probe 110a in the seventh embodiment shown in FIG. However, the contact probe 110c of the present embodiment is different in that a metal layer 108c is formed on the contact probe 110a.
  • the contact probe 110c of the present embodiment is manufactured using the contact probe connector 101c of the eighth embodiment shown in FIGS.
  • the metal layer 108c is formed in all regions except for the portion 109c in contact with the holding portion 105a in FIG. That is, 99% or more of the surface area of the contact probe 110c is covered with the metal layer 108c.
  • the thickness of the metal layer 108c is, for example, not less than 0.5 ⁇ m and not more than 10 ⁇ m. By setting the thickness within this range, the characteristics of the plurality of contact probes 110a can be improved.
  • the thickness of the metal layer 108c is within the above range, for example, if Rh is formed as the metal layer 108c, the wear resistance can be improved, and if Rh or PdCo is formed as the metal layer 108c, the contact resistance can be reduced, and Cu or Au can be used as the metal layer 108c.
  • the allowable current value can be improved by forming.
  • the contact probe 110c in the present embodiment is manufactured.
  • the contact probe 110c is separated from the coupling member 102c. Since the separation method is the same as that of the seventh embodiment, description thereof will not be repeated.
  • the contact probe 110c is individually plated by separating the contact probe 110c after plating the entire contact probe coupling body 101c. In this way, a plated contact probe 110c is realized. For this reason, as compared with the case of individually plating, handling can be facilitated and cost can be reduced.
  • the contact probe 110c is plated by gripping and plating the grip portion 106a of the contact probe coupling body 101c as in the present embodiment. A region that is not formed (only the portion 109c in contact with the connecting member 102c) can be reduced. Further, the contact probe 110c can be uniformly plated. Therefore, the contact probe 110c with improved performance can be realized.
  • FIG. 40 is a plan view schematically showing contact probe connector 101d according to the tenth embodiment of the present invention. 41 is a cross-sectional view taken along line XVII-XVII in FIG. A cross-sectional view taken along line II-II in FIG. 40 is the same as FIG. With reference to FIG. 26, FIG. 40 and FIG. 41, contact probe coupling body 101d in the present embodiment will be described.
  • the contact probe coupling body 101d in the present embodiment basically has the same configuration as the contact probe coupling body 101a in the fifth embodiment shown in FIGS. However, the contact probe connector 101d of the present embodiment is different in that an insulating layer 108d that covers a part of the contact probe connector 101a is further formed.
  • the insulating layer 108d of the present embodiment partially covers the center of the contact probe connector 101a. That is, the insulating layer 108d is not formed on the contact portions 111a and the tip portions 113a of the plurality of contact probes 110d. In other words, the insulating layer 108d is formed in a region located in parallel with the main body 112a in the connecting member 102d and the main body 112a.
  • an organic film such as a parylene resin can be used, and a thin organic material is preferably used.
  • FIGS. 40 to 43 a method of manufacturing the contact probe assembly 101d in the present embodiment will be described.
  • 42 and 43 are plan views showing one manufacturing process of the contact probe assembly in the present embodiment.
  • the contact probe connector 101a according to the fifth embodiment is manufactured.
  • the region exposed from the mask layer 125 is subjected to RIE (Reactive Ion Etching) or ashing using, for example, a mixed gas of carbon tetrafluoride gas (CF 4 ) and oxygen gas (O 2 ). .
  • RIE reactive Ion Etching
  • ashing using, for example, a mixed gas of carbon tetrafluoride gas (CF 4 ) and oxygen gas (O 2 ).
  • a metal mask may be used instead of the mask layer 125.
  • a metal mask is placed so as to cover a region where the insulating layer 108d is to be formed.
  • a contact probe connector 101d in which an insulating layer 108d is partially formed can be manufactured.
  • the insulating layer 108d is formed in the state of the contact probe connector 101d including the plurality of contact probes 110d, and unnecessary portions are removed.
  • the insulating layer 108d can be easily formed as compared with the case where the insulating layer 108d is formed individually. Further, positioning is facilitated when the mask layer 125 is formed by the connecting member 102d. Therefore, handling at the time of post-processing such as insulation coating can be facilitated and the cost can be reduced.
  • the insulating layer 108d it is possible to suppress short-circuiting of each of the plurality of contact probes 110d even when they are arranged at high density.
  • FIG. 44 is a plan view schematically showing a contact probe 110d according to the eleventh embodiment of the present invention.
  • the contact probe 110d in the present embodiment basically has the same configuration as contact probe 110a in the seventh embodiment shown in FIG.
  • the contact probe 110d of the present embodiment is different in that an insulating layer 108d is formed on a part of the contact probe 110a.
  • Contact probe 110d of the present embodiment is manufactured using contact probe connector 101d of the tenth embodiment shown in FIGS.
  • the contact probe 110d is partially formed with an insulating layer 108d.
  • part of the main body 112a is covered with the insulating layer 108d.
  • the contact probe connector 101d according to the tenth embodiment is manufactured.
  • the contact probe 110d is separated from the coupling member 102c. Since the separation method is the same as that of the seventh embodiment, description thereof will not be repeated.
  • the insulating layer 108d is formed on the contact probe connector 101d, and a part of the insulating layer 108d is removed. Therefore, the contact probe 110d in which the insulating layer 108d is partially formed can be realized without separately forming the insulating layer 108d on the contact probe 110d. Accordingly, handling can be facilitated and cost can be reduced.
  • a covering portion that covers the entire outer periphery of the cross section that does not include the contact portion and that intersects the extending direction of the main body portion and has a volume resistivity smaller than the volume resistivity of the main body portion is provided. Find out about the effects of.
  • the contact probe 10b shown in FIG. 22 is manufactured according to the method for manufacturing the contact probe 10b of the third embodiment described above.
  • lithography is performed on a SUS substrate as a conductive substrate 21 to form a resist resin mold 22 as a resin having an opening 22a.
  • the shape of the opening 22a includes a region R1 to be a contact probe having a shape in which the covering portion 14 is not formed in the contact probe 10b of FIG. 22, and a region R2 to be a connecting member for connecting the plurality of contact probes. Is open.
  • the region R1 to be a contact probe is formed so as to have 100 or more contact probes.
  • L1 is 10 to 20 ⁇ m
  • L2 is 10 to 20 ⁇ m
  • L3 is 10 to 20 ⁇ m
  • L4 is 10 ⁇ m
  • L5 so that the region R2 to be the connecting member 2 can be easily cut. Is 100 ⁇ m
  • L6 is 60 ⁇ m
  • L7 is 60 ⁇ m.
  • nickel-manganese alloy plating is performed on the opening 22a of the mold 22 and polished to a thickness H2 of 60 ⁇ m.
  • parylene is coated as an insulating layer 18 on the entire contact probe assembly 1a.
  • the portion other than the portion where the covering portion 14 is formed is covered with a mask layer 25, and ashing is performed using a mixed gas of CF 4 and O 2 .
  • the insulating layer 18 in the region where the covering portion 14 is formed is removed.
  • copper plating is performed by electrolytic plating.
  • positive electrodes are arranged on the front side and the back side, and devised so that the thickness is uniform.
  • a copper plating layer having a thickness of 4 ⁇ m is formed so as to cover the entire circumference of the central portion of the main body portion 12. This copper plating layer is the covering portion 14.
  • Comparative Example 1 The contact probe of Comparative Example 1 is manufactured in the same manner as Example 1 of the present invention, but is different in that the covering portion is not formed. Specifically, after producing the contact probe assembly 1a shown in FIG. 7, the connection member 2 is cut in the same manner as in Example 1 of the present invention, and the contact probe is made into individual pieces.
  • FIG. 45 is a perspective view schematically showing a contact probe of Comparative Example 2.
  • the contact probe of Invention Example 1 had a larger spring constant than the contact probe of Comparative Example 1, but the contact constant was higher. It can be used as a probe, and an allowable current value can flow 1 A or more.
  • the allowable current value of Example 1 of the present invention is the same value as that of the contact probe of Comparative Example 2.
  • the contact probe of Example 1 of the present invention does not come off the copper plating portion even after repeated use, and can be used stably as compared with the contact probe of Comparative Example 2 in which the metal layer shown in FIG. 45 is laminated. I understand that I can do it.
  • the present invention is particularly advantageously applied to a contact probe used for measurement of electrical characteristics such as an electric circuit.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention porte sur une sonde de contact qui est stable lors de l'utilisation, sur un procédé de fabrication de corps de connexion de sonde de contact, et sur un procédé de fabrication de sonde de contact. Une sonde de contact (10a) comprend une partie contact (11) qui vient en contact avec un objet à mesurer, un corps principal (12) connecté à la partie contact (11), et une partie revêtement (14) qui revêt la périphérie d'une section transversale, non comprise la partie contact (11), dans une direction croisant la direction d'étendue du corps principal (12). La résistance volumique de la partie revêtement (14) est inférieure à la résistance volumique du matériau du corps principal (12).
PCT/JP2011/050770 2010-03-30 2011-01-18 Sonde de contact, corps de connexion de sonde de contact et procédés pour leur fabrication WO2011122068A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/395,860 US20120176122A1 (en) 2010-03-30 2011-01-18 Contact probe, linked body of contact probes, and manufacturing methods thereof
JP2012508112A JPWO2011122068A1 (ja) 2010-03-30 2011-01-18 コンタクトプローブ、コンタクトプローブ連結体およびこれらの製造方法
EP11762309A EP2555001A1 (fr) 2010-03-30 2011-01-18 Sonde de contact, corps de connexion de sonde de contact et procédés pour leur fabrication

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JP2010077877 2010-03-30
JP2010-077878 2010-03-30
JP2010-077877 2010-03-30
JP2010077878 2010-03-30

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KR20170105031A (ko) * 2014-12-30 2017-09-18 테크노프로브 에스.피.에이. 검사 헤드용 접촉 프로브의 제조 방법
JP2018508753A (ja) * 2014-12-30 2018-03-29 テクノプローベ エス．ピー．エー． テストヘッド用の複数のコンタクトプローブを含む半製品および関連する製造方法
JP2019039755A (ja) * 2017-08-24 2019-03-14 株式会社日本マイクロニクス プローブ
JP2019039756A (ja) * 2017-08-24 2019-03-14 株式会社日本マイクロニクス プローブ
KR20190103188A (ko) * 2016-12-16 2019-09-04 테크노프로브 에스.피.에이. 전자 소자 테스트용 장치의 콘택 프로브 및 관련 프로브 헤드

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US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape

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KR20170105031A (ko) * 2014-12-30 2017-09-18 테크노프로브 에스.피.에이. 검사 헤드용 접촉 프로브의 제조 방법
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JP2018508753A (ja) * 2014-12-30 2018-03-29 テクノプローベ エス．ピー．エー． テストヘッド用の複数のコンタクトプローブを含む半製品および関連する製造方法
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KR20190103188A (ko) * 2016-12-16 2019-09-04 테크노프로브 에스.피.에이. 전자 소자 테스트용 장치의 콘택 프로브 및 관련 프로브 헤드
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JP2019039756A (ja) * 2017-08-24 2019-03-14 株式会社日本マイクロニクス プローブ

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JPWO2011122068A1 (ja) 2013-07-08

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