WO2011121956A1 - 無線通信装置および電流低減方法 - Google Patents
無線通信装置および電流低減方法 Download PDFInfo
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- WO2011121956A1 WO2011121956A1 PCT/JP2011/001760 JP2011001760W WO2011121956A1 WO 2011121956 A1 WO2011121956 A1 WO 2011121956A1 JP 2011001760 W JP2011001760 W JP 2011001760W WO 2011121956 A1 WO2011121956 A1 WO 2011121956A1
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- Prior art keywords
- conductor
- housing
- wireless communication
- communication device
- casing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0241—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings using relative motion of the body parts to change the operational status of the telephone set, e.g. switching on/off, answering incoming call
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0235—Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
Definitions
- the present invention relates to a wireless communication apparatus and a current reduction method.
- Patent Document 1 discloses that the characteristics of an antenna deteriorate when a wireless communication terminal is close to a human body, and in order to suppress this deterioration, the electrical length of the antenna is longer on the front side of a housing having a display unit. It is disclosed that a first parasitic element is provided, and a second parasitic element shorter than the electrical length of the antenna is provided on the back side.
- a problem with mobile phones that open and close the case is that the antenna characteristics of the mobile phone change depending on whether the case is open or closed.
- One of the factors that cause the antenna characteristics to change is that the positional relationship of the conductors included in the mobile phone varies between the open state and the closed state of the housing.
- Cellular phones use flexible boards (FPC: Flexible Printed Circuits) that are flexible wiring boards that connect the cases to each other, and conductors inside the case itself. The positional relationship of the housing and the folded state of the FPC change.
- one of the opened state and the closed state is folded in half, and the other is expanded almost linearly.
- currents in opposite phases flow in an area where the FPC is folded and overlapped with each other (hereinafter referred to as an overlapping area).
- an overlapping area exists in the vicinity of the antenna element arranged in the housing, the two FPCs individually affect the antenna characteristics. Therefore, if the folded state of the FPC changes with the opening and closing of the housing, the antenna characteristics change and the communication quality is adversely affected.
- Patent Document 2 describes that the FPC in the overlapping region is short-circuited by capacitively coupling the folded FPC with a block-shaped conductor piece fixed to the housing. Yes. Thereby, the effective length of the facing length between the housing and the FPC is adjusted.
- the displacement of the housing between the open state and the closed state and the change in the positional relationship of the conductors such as metal plates constituting each housing also cause the antenna characteristics of the mobile phone to change.
- the currents flowing through the casings in the open state do not interfere with each other, whereas the radio waves generated by the currents flowing through the casings that are overlapped in the closed state are in opposite phases to each other. It will reduce the function.
- Patent Document 1 With the technology of Patent Document 1, it is difficult to short-circuit the FPC with good reproducibility when the casing is opened and closed. This is because in order to capacitively couple the conductor piece to the FPC, the conductor piece needs to be opposed to the pair of folded FPCs at a predetermined interval or less. On the other hand, when the distance between the conductor piece and the FPC is too small, the opening / closing operation of the housing is hindered. Conversely, when the distance between the conductor piece and the FPC is too large, both the folded FPCs On the other hand, it is difficult to achieve the desired distance between the conductor pieces.
- the present invention has been made in view of the above-described problems, and a wireless communication apparatus and a current reduction method capable of reducing a change in antenna characteristics due to opening / closing of the casing without impairing the opening / closing operation of the casing. Is to provide.
- a wireless communication device includes a first housing, a second housing, a connecting portion that movably connects the first housing and the second housing, and an antenna element that operates at a predetermined communication frequency. And the first casing and the second casing are switched to each other to move between the following first state and second state.
- the first housing and the second housing are opened or closed from each other, and the first conductor provided from the connecting portion to the first housing, and the connecting portion
- a second conductor provided across the second housing is opposed to each other while being separated from each other, and the first conductor and the second conductor are electrically connected at the communication frequency.
- the second state is a state where the first housing and the second housing are closed or opened.
- the current reduction method of the present invention operates at a predetermined communication frequency with a first housing, a second housing, a connecting portion that movably connects the first housing and the second housing.
- An antenna element a first conductor provided from the connecting portion to the first housing; and a second conductor provided from the connecting portion to the second housing;
- the second conductor is electrically short-circuited. That.
- the various components of the present invention do not have to be individually independent, that a plurality of components are formed as one member, and one component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps a part of another component, and the like.
- FIG. 1A is a longitudinal sectional view schematically showing an open state of the wireless communication apparatus according to the first embodiment.
- FIG. 1B is a longitudinal sectional view schematically showing a closed state of the wireless communication apparatus according to the first embodiment.
- FIG. 2A is a partial schematic view showing the first circuit board, the second circuit board, and the wiring board in an open state.
- FIG. 2B is a partial schematic view showing the first circuit board, the second circuit board, and the wiring board in the closed state. It is a perspective view which shows typically the wiring board of 1st embodiment.
- FIG. 4 is a sectional view taken along line IV-IV in FIG. 3.
- FIG. 5A is an enlarged view of a region near the neck.
- FIG. 5B is an explanatory diagram of an equivalent circuit of a unit cell of metamaterial.
- FIG. 6A is a perspective view for explaining a first modification of the unit cell.
- FIG. 6B is a plan view of the facing portion.
- FIG. 6C is an explanatory diagram of an equivalent circuit of the unit cell.
- FIG. 7A is a perspective view for explaining a second modification of the unit cell.
- FIG. 7B is a perspective view for explaining a third modification of the unit cell.
- FIG. 8A is a perspective view for explaining a fourth modification of the unit cell.
- FIG. 8B is an explanatory diagram of an equivalent circuit of a unit cell.
- FIG. 9A is a perspective view for explaining a fifth modification of the unit cell.
- FIG. 9A is a perspective view for explaining a fifth modification of the unit cell.
- FIG. 10A is a partial schematic diagram illustrating the first circuit board, the second circuit board, and the wiring board in the open state of the wireless communication device of the second embodiment.
- FIG. 10B is a partial schematic diagram illustrating the first circuit board, the second circuit board, and the wiring board in the closed state of the wireless communication device of the second embodiment.
- It is a lamination sectional view showing a wiring board concerning a third embodiment.
- It is a perspective view which shows typically the wiring board used for the radio
- FIG. 13 is a sectional view taken along line XIII-XIII in FIG. 12.
- FIG. 14A is a perspective view schematically showing a first example of a reflective structure.
- FIG. 14A is a perspective view schematically showing a first example of a reflective structure.
- FIG. 14B is an equivalent circuit diagram of a unit cell of the first example of the reflective structure.
- FIG. 15A is a perspective view schematically showing a second example of the reflecting structure.
- FIG. 15B is an equivalent circuit diagram of a unit cell of the second example of the reflective structure.
- FIG. 16A is a perspective view schematically showing a third example of the reflecting structure.
- FIG. 16B is a perspective view schematically showing a fourth example of the reflecting structure.
- FIG. 17A is a perspective view schematically showing a fifth example of the reflecting structure.
- FIG. 17B is an equivalent circuit diagram of a unit cell of the fifth example of the reflecting structure. It is the cross-sectional schematic which shows the structure of the radio
- FIG. 23A is a perspective view for explaining a first modification of the unit cells of the fifth and sixth embodiments.
- FIG. 23B is a plan view of the second conductor shown in FIG. 23A.
- FIG. 23B is an equivalent circuit diagram of the unit cell shown in FIG. 23A. It is a perspective view for demonstrating the 2nd modification of the unit cell of 5th and 6th embodiment.
- FIG. 33A is a schematic diagram illustrating an open state of the first housing and the second housing.
- FIG. 33B is a schematic diagram illustrating a closed state of the first housing and the second housing, and is a schematic diagram for explaining the problem.
- FIG. 1A and 1B are longitudinal sectional views schematically showing a wireless communication device 100 according to the present embodiment.
- 2A is a partial schematic diagram showing the first circuit board 14, the second circuit board 24, and the wiring board 30 in the opened state of FIG. 1A.
- FIG. 2B is a partial schematic diagram showing the first circuit board 14, the second circuit board 24, and the wiring board 30 in the closed state of FIG. 1B.
- the first housing 10 and the second housing 20 are shown by broken lines, and a part of them is omitted for explanation.
- the wireless communication device 100 includes a first housing 10, a second housing 20, a connecting unit 300 that movably connects the first housing 10 and the second housing 20, and a predetermined unit And an antenna element 40 that operates at a communication frequency.
- the wireless communication device 100 is switched between the following first state (FIG. 1A) and second state (FIG. 1B) when the first housing 10 and the second housing 20 move relative to each other.
- first state shown in FIGS. 1A and 2A
- the first housing 10 and the second housing 20 are opened or closed with each other (open in the present embodiment), and the connection portion 300 moves to the first housing 10.
- the first conductor 122 provided over the second conductor 240 and the second conductor 240 provided from the connecting portion 300 to the second housing 20 are opposed to each other.
- the first state the first conductor 122 and the second conductor 240 are electrically connected at the communication frequency.
- the second state shown in FIGS. 1B and 2B is a state in which the first housing 10 and the second housing 20 are closed or opened (closed in the present embodiment).
- the connecting part 300 is an area located between the first casing 10 and the second casing 20, and includes a flexible substrate and a hinge that connect these casings to each other.
- the first housing 10 and the second housing 20 are connected to each other via a connecting portion 300 so as to be slidable or rotatable.
- the first conductor 122 is a conductor provided from the connecting portion 300 to the first housing 10.
- the first conductor 122 extending from the connecting portion 300 to the first housing 10 means that the intermediate position (for example, the folded portion 38) in the connecting portion 300 and the first housing 10 or the first housing 10. It means that a conductive member is disposed in a region of a predetermined area inside the body 10.
- the second conductor 240 extends from the connecting portion 300 to the second housing 20 means that the intermediate position (for example, the folded portion 38) in the connecting portion 300 and the second housing 20 or the second housing. It means that a conductive member is arranged in a predetermined area in the body 20.
- first conductor and a second conductor different regions in the flexible substrate are referred to as a first conductor and a second conductor.
- the casing itself of the first casing or the second casing and the rigid circuit board embedded in each casing are referred to as a first conductor or a second conductor. More specific description will be given below.
- the wireless communication device 100 includes a first housing 10, a second housing 20, and a flexible wiring board 30.
- the second housing 20 slides with respect to the first housing 10.
- the wiring board 30 includes a wiring layer 32, a conductor layer 34, and a conductor element 36 (see FIG. 4) connected to the conductor layer 34, and connects the first housing 10 and the second housing 20.
- the wireless communication device 100 is switched between the following first state and second state by sliding the first housing 10 and the second housing 20 together. In the first state, the wiring board 30 is folded back so that the conductor element 36 in one region and the conductor layer 34 in the other region face each other (see FIG. 5). In the second state, the wiring board 30 extends more than in the first state.
- the wireless communication device 100 is, for example, a slide opening / closing type mobile phone.
- the first housing 10 is an operation-side housing that a user grips with a hand and operates keys, and is provided with an operation key 12, a first circuit board 14, a power supply 16, and an antenna element 40.
- the operation key 12, the power supply 16 and the antenna element 40 are electrically connected to the first circuit board 14.
- the operation key 12 is an input interface through which a user performs an input operation with a finger or the like.
- the first circuit board 14 controls the wireless communication device 100.
- the antenna element 40 transmits and receives radio waves having a predetermined communication frequency.
- the power supply 16 supplies power to the wireless communication device 100.
- the second housing 20 is a display-side housing including the display panel 22 and the second circuit board 24.
- the second circuit board 24 receives a signal from the first circuit board 14 through the wiring board 30 and controls the display panel 22.
- the display panel 22 is a display that performs various display outputs.
- the wireless communication device 100 may have a plurality of operating frequencies. Examples of the operating frequency include the clock frequency of the elements mounted on the first circuit board 14 and the second circuit board 24 and the communication frequency of the antenna element 40.
- Examples of the communication frequency of the antenna element 40 include a frequency band of a positioning system and a digital television, in addition to a call or communication frequency band of a mobile phone or a wireless communication system. Specific examples include a 800 MHz band, a 1.5 GHz band, and a 2 GHz band for a mobile communication system, and a 2.4 GHz band and a 5 GHz band for a wireless LAN (Local Area Network).
- the wiring board 30 is a so-called flexible board (FPC). Details of the structure of the wiring board 30 will be described later with reference to FIG.
- the vertical direction on the paper surface corresponding to the direction of the operation key 12 of the first housing 10 is defined as the front-rear direction
- the horizontal direction on the paper surface corresponding to the longitudinal direction of the wireless communication device 100 is defined. It is defined as the vertical direction.
- this is a direction defined for the sake of convenience in order to explain the relative relationship between the components, and does not limit the direction when the wireless communication device 100 is manufactured or used.
- the first casing 10 and the second casing 20 are opened and closed by sliding relative to each other by a slide mechanism (not shown) extending in the vertical direction.
- a slide mechanism (not shown) extending in the vertical direction.
- the first housing 10 is described as a fixed side and the second housing 20 is described as a sliding side for convenience. However, it is not necessary to fix one of the housings to the user or the space, and both may be slid in opposite directions.
- FIG. 1A shows an open state in which the second casing 20 slides upward and the operation key 12 is exposed
- FIG. 1B shows a closed state where the second casing 20 slides downward and the operation key 12 is covered.
- the direction perpendicular to the surface of the display panel 22 of the opened second casing 20 is slightly inclined with respect to the front-rear direction of the wireless communication device 100.
- the second housing 20 that transitions between the closed state and the open state slides in the vertical direction and slightly rotates about the width direction (the front-rear direction in FIG. 1A and FIG. 1B, respectively).
- the second casing 20 slides in addition to the second casing 20 translating in a linear or curved manner with respect to the first casing 10, Including rotational movement with respect to one housing 10.
- the second housing 20 is not inclined with respect to the first housing 10 and is opened and closed by sliding in a straight line with the respective perpendicular directions aligned. Also good.
- the wiring board 30 shown in FIG. 2A is folded back as a whole. This state is the first state. Connectors (not shown) are provided at both ends of the first circuit board 14, the second circuit board 24, and the wiring board 30, and are fitted to each other. The fixing direction of each end of the wiring board 30 and the first circuit board 14 and the second circuit board 24 is arbitrary.
- the overlapping region OVL between the bent wiring boards 30 is accommodated in the second casing 20.
- the accommodation space of the overlapping region OVL has a limited volume due to the dimensional constraints of the second housing 20, whereas the wiring board 30 has a predetermined form retention property based on the bending rigidity.
- the second casing 20 are in close contact with each other, and the wiring boards 30 are close to or in close contact with each other.
- the wiring board 30 is formed with a neck portion 37 having a small facing distance between the wiring boards 30.
- the folded portion 38 of the bent wiring board 30 has an arc shape, and the wiring board 30 has a substantially ⁇ shape as a whole.
- the shape of the wiring board 30 in the first state has high reproducibility. For this reason, each time the second housing 20 is slid to bring the wireless communication device 100 into an open state, the predetermined facing distance (surface distance) between the wiring boards 30 in the neck portion 37 is reproduced.
- the overlapping region OVL of the wiring board 30 is a plurality of wiring boards 30 when the wiring board 30 is viewed from the direction perpendicular to the surface of at least one of the first casing 10 and the second casing 20.
- the neck portion 37 is a region in which the facing interval between the wiring boards 30 is minimum except in the vicinity of the folded portion 38 in the overlapping region OVL in the first state.
- the neck 37 is an area having a predetermined extent.
- a length region corresponding to the front side of the overlap region OVL is distinguished as a front surface portion 30a
- a length region corresponding to the rear surface side is distinguished as a rear surface portion 30b.
- the conductor included in the front surface portion 30 a corresponds to the second conductor 240
- the conductor included in the rear surface portion 30 b corresponds to the first conductor 122.
- the current flowing through the wiring board 30 from the first housing 10 toward the second housing 20 (or vice versa) is a reverse-phase current in the opposite direction between the front surface portion 30a and the rear surface portion 30b.
- the wiring board 30 is pulled downward together with the second housing 20 and extends as a whole (see FIG. 2B).
- This state corresponds to the second state.
- the area of the overlap region OVL between the folded wiring boards 30 in the first state is larger than the area of the overlap region OVL in the second state.
- the neck part 37 does not exist in the wiring board 30 in the second state.
- the antenna element 40 is disposed at a position facing the overlapping region OVL in the first state.
- the antenna element 40 is opposed to the overlapping area OVL when the antenna element 40 is viewed from the direction perpendicular to the casing (second casing 20 in the present embodiment) in which the overlapping area OVL is accommodated.
- it means that at least a part of the antenna element 40 is inside the overlapping region OVL.
- the wireless communication device 100 has a metamaterial structure that suppresses the influence on the antenna characteristics of the antenna element 40 by short-circuiting the reverse-phase current flowing in the overlapping region OVL in the first state inside the wiring board 30. ing.
- the wiring board 30 of this embodiment will be described.
- FIG. 3 is a perspective view schematically showing the wiring board 30 of the present embodiment
- FIG. 4 is a sectional view taken along line IV-IV.
- the wiring board 30 includes a conductor element 36 on at least one main surface in addition to the wiring layer 32 and the conductor layer 34.
- the main surface on which the conductor element 36 is provided is referred to as a front surface 301, and the opposite surface is referred to as a back surface 302.
- four conductor elements 36 in the width direction and three conductor elements 36 in the longitudinal direction are illustrated, but the number, size, and position are examples. Only one conductor element 36 may be provided.
- the wiring layer 32 shown in FIG. 4 includes a large number of signal lines SIG for transmitting and receiving signals of an operating frequency between the first circuit board 14 and the second circuit board 24 (see FIG. 1), and a constant potential such as a ground potential. Is a layer in which a ground GND and a power supply wiring (not shown) are arranged in a pattern.
- the signal lines SIG and the signal line SIG and the ground GND are insulated from each other.
- the wiring layer 32 can be formed by a chemical etching process of copper plating.
- the wiring board 30 includes one or more wiring layers 32.
- FIG. 4 illustrates a wiring board 30 including two wiring layers 32a and 32b.
- the conductor layer 34 (34a, 34b) is a shield layer made of a metal material such as copper, which is laminated on both upper and lower sides of the wiring layer 32.
- One of the conductor layers 34a and 34b is grounded, and both are electrically connected to each other by a via (not shown).
- the conductor layer 34 is formed substantially over the entire surface of the wiring substrate 30 in the layer, but allows a local non-formation region to exist.
- Insulating layers 33 are laminated between the conductor layer 34 and the wiring layer 32 and between the wiring layers 32, respectively.
- the insulating layer 33 can be created by applying and forming an insulating resin material.
- insulating coating layers 35 a and 35 b are further laminated on the outside of the conductor layer 34.
- the conductor element 36 is provided in the same layer as the conductor layer 34 or is laminated directly or indirectly on the surface 301 side of the conductor layer 34.
- a facing portion 361 formed in a planar shape along the conductor layer 34, and a connecting member 362 extending in a direction perpendicular to the surface of the wiring board 30 and connecting the facing portion 361 and the conductor layer 34a,
- a so-called mushroom-like conductor element 36 constituted by:
- various forms of the conductor element 36 can be adopted as will be described later.
- the connection member 362 is a columnar via that penetrates the coating layer 35a.
- an insulating coat layer (not shown) that covers the facing portion 361 may be further provided on the surface 301 of the wiring board 30.
- the thickness of the coat layer will be described as being included in the thickness of the coating layer 35a.
- FIG. 5A is an enlarged view of a region in the vicinity of the neck portion 37, which is represented by a circle V in FIG. 2A showing the first state of the wiring board 30.
- the wiring board 30 is folded back with the surface 301 side inward in the first state.
- the wiring board 30 having one end connected to the second circuit board 24, the front surface portion 30a and the rear surface portion 30b overlap each other in the overlapping region OVL including the neck portion 37.
- the wiring board 30 is folded back so that the conductor element 36 in one region (front surface portion 30a) and the conductor layer 34 in the other region (rear surface portion 30b) face each other.
- the wiring board 30 in the first state has a substantially ⁇ -shape (see FIG. 2A), and one or a plurality of conductor elements 36 are provided on a neck portion 37 corresponding to a narrow portion having a substantially ⁇ -shape.
- the opposing portion 361 of the conductor element 36 disposed on the neck portion 37 includes a conductor layer 34a on the front surface 301 side in the front surface portion 30a (hereinafter referred to as a conductor layer 34a1) and a conductor layer 34a on the front surface 301 side in the rear surface portion 30b (hereinafter referred to as the following). , Conductor layer 34a2). That is, the conductor layers 34a1 and 34a2 refer to different regions in the same conductor layer 34a.
- the thickness of the coating layer 35a (hereinafter referred to as coating layer 35a1) on the surface 301 side of the front surface portion 30a corresponds to the distance between the conductor layer 34a1 and the facing portion 361. Further, the thickness of the coating layer 35a (hereinafter referred to as coating layer 35a2) on the surface 301 side of the rear surface portion 30b corresponds to the distance between the conductor layer 34a2 and the facing portion 361.
- At least one of the second conductor 240 (the conductor element 36 and the conductor layer 34a1 in this embodiment) and the first conductor 122 (the conductor layer 34a2) facing each other in the first state is the wireless communication device. Resonates at 100 communication frequencies to form a metamaterial. This metamaterial electrically connects the conductor element 36 and the conductor layers 34a1 and 34a2 at the communication frequency of the wireless communication apparatus 100.
- the conductor element 36 and the conductor layer 34 of the present embodiment constitute a so-called right-handed electromagnetic band-gap (EBG) structure.
- ESG electromagnetic band-gap
- the right-handed metamaterial refers to an artificial material having both positive dielectric constant and magnetic permeability and positive refractive index.
- a left-handed metamaterial is an artificial material having a negative dielectric constant and a negative refractive index.
- a unit cell 50 of this type of EBG structure is composed of a pair of conductor planes parallel to each other and a conductor element 36 electrically connected to one of them.
- the present embodiment has a so-called mushroom type EBG structure, and the unit cell 50 includes a facing portion 361, a region of the conductor layer 34a1 and the conductor layer 34a2 facing the facing portion 361, and optionally an auxiliary connecting member ( (Not shown).
- the opposing portion 361 which is a flat conductive member in the conductor element 36 corresponds to the head portion of the mushroom, and a columnar or linear connecting member 362 having a smaller area in plan view than the opposing portion 361, Corresponds to the inductance part of the mushroom.
- the conductor layer 34a2 corresponds to the upper conductor plane
- the conductor layer 34a1 corresponds to the lower conductor plane. That is, in the wireless communication device 100 of this embodiment, the conductor layers 34a1 and 34a2 formed by folding back one conductor layer 34a are used as a pair of conductor planes in the EBG structure. And since the wiring board 30 changes between a 1st state and a 2nd state, the conductor element 36 is physically connected only with one conductor layer, and the other is comprised so that relative displacement is possible.
- FIG. 5B This figure is an explanatory diagram of an equivalent circuit of the unit cell 50 of metamaterial.
- the unit cell 50 of the present embodiment is a so-called mushroom type unit cell.
- the connection member 362 functions as an inductance element of the unit cell 50.
- the conductor layer 34a1 and the facing portion 361 function as a first capacity of the unit cell 50, and the conductor layer 34a1 and the conductor layer 34a2 function as a second capacity of the unit cell 50.
- a third capacitor is formed between the adjacent facing portions 361.
- the conductor element 36 resonates at the communication frequency of the wireless communication device 100. Thereby, even if the electromagnetic wave of the communication frequency transmitted / received by the antenna element 40 interferes with the conductor layer 34 of the wiring board 30 and produces the reverse phase current I, this is the conductor element between the conductor layer 34a1 and the conductor layer 34a2. 36 is short-circuited. Therefore, when viewed from the antenna element 40, the conductor layers 34a1 and 34a2 can be regarded as one conductor, and the adverse effect of these conductor layers on the antenna element 40 is reduced to a negligible level. Note that that the conductor element 36 resonates means that at least a part of the elements constituting the conductor element 36 resonate.
- the wireless communication device 100 includes the first housing 10, the second housing 20, and the connecting unit 300 (wiring board) that movably connects the first housing 10 and the second housing 20. 30 folded portions 38), an antenna element 40 operating at a predetermined communication frequency, and a first conductor 122 (conductor layer 34a2) provided from the connecting portion 300 (folded portion 38) to the first housing 10. And a second conductor (conductor element 36 and conductor layer 34a1) provided from the connecting portion 300 (folded portion 38) to the second housing 20.
- the overlapping region of the first conductor 122 and the second conductor 240 changes.
- at least one of the first conductor 122 and the second conductor 240 is connected at the communication frequency of the wireless communication device 100 with the first conductor 122 and the second conductor 240 facing each other apart from each other. By resonating, the first conductor 122 and the second conductor 240 are electrically short-circuited.
- the current reduction method of the present embodiment includes the first housing 10, the second housing 20 that slides with respect to the first housing 10, the wiring layer 32, the conductor layer 34, and the conductor layer. 34 and a flexible and folded wiring board 30 including the conductor element 36 electrically connected to the first casing 10 and the second casing 20, and the folded wiring boards 30.
- the present invention relates to a method for reducing the current flowing through the overlapping region OVL in the wireless communication device 100 in which the overlapping region OVL changes by sliding between the first housing 10 and the second housing 20.
- the conductor layer 34a2 of one wiring substrate (rear surface portion 30b) and the conductor element 36 of the other wiring substrate (front surface portion 30a) are opposed to each other.
- the conductor element 36 and the conductor layers 34a1 and 34a2 are electrically short-circuited.
- the pair of opposing conductor layers 34a1 and 34a2 in the folded flexible wiring board 30 are short-circuited through the conductor element 36 electrically connected to one of them.
- the conductor element 36 since the conductor element 36 is connected to the conductor layer 34a1 in advance to form the wiring board 30, the short circuit between the conductor layers 34a1 and 34a2 can be achieved by simply adjusting the facing distance between the folded wiring boards 30 to a predetermined value. Is easily realized.
- the conductor element 36 provided in a part of the overlapping region OVL (neck portion 37 of the front surface portion 30a) in the same layer as the conductor layer 34a1 or on the inner side of the folded back than the conductor layer 34a. Is made to resonate with the conductor element 34a2 at the communication frequency of the wireless communication device 100 in a state where the conductor element 34a2 is opposed to the conductor layer 34a2 in the other part of the overlap region OVL (the neck portion 37 of the rear surface portion 30b).
- the above-mentioned part and the other part are short-circuited.
- the reverse-phase current I flowing between the first circuit board 14 and the second circuit board 24 in the conductor layer 34a is closer to the antenna element 40 side than the neck 37 (right side of the figure). ) Does not flow substantially.
- the conductor layer 34a and the conductor layer 34b are connected to each other by vias (not shown). For this reason, the reverse phase current flowing through the conductor layer 34 b is also short-circuited between the front surface portion 30 a and the rear surface portion 30 b via the conductor element 36.
- Vias for connecting the conductor layer 34a and the conductor layer 34b are provided between the neck portion 37 and the second circuit board 24 and between the neck portion 37 and the second circuit board 24 so that the current does not flow from the neck portion 37 to the antenna element 40 side. It may be provided between the circuit board 14.
- the above effect of short-circuiting the overlapping region OVL can be obtained even when the number of unit cells 50 of the metamaterial is one. However, as shown in FIG. 3, the above effect becomes larger when a plurality of unit cells 50 are repeatedly arranged.
- the unit cells 50 (conductor elements 36) of FIG. 3 are repeatedly arranged along the width direction and the longitudinal direction of the wiring board 30.
- the arrangement pattern of the unit cells 50 is not limited, but is preferably arranged periodically, for example.
- the interval (distance between the centers) of the connection members 362 is the wavelength ⁇ of the electromagnetic wave at the communication frequency (if any). It is preferable to make it within 1/2.
- “repetition” includes a case where a part of the configuration is missing in any unit cell 50.
- “repetition” includes a case where the unit cell 50 is partially missing.
- “periodic” includes a case where some of the constituent elements are deviated in some unit cells 50 and a case where the arrangement of some unit cells 50 themselves is deviated.
- the periodicity in the strict sense collapses if the unit cells 50 are repeatedly arranged, the characteristics as a metamaterial can be obtained, so that “periodicity” has a certain amount of defects. Permissible.
- the cause of these defects includes manufacturing reasons when wiring, vias, and connection members 362 are passed between the unit cells 50.
- unit cells cannot be placed due to existing vias, patterns, or connecting members, or manufacturing errors, existing vias, patterns, or connecting members Is used as a part of the unit cell.
- FIG. 5A shows a state in which the front surface portion 30a and the rear surface portion 30b are in close contact with each other via the facing portion 361 in the wiring substrate 30 in the first state, but the present invention is not limited to this.
- the front surface portion 30a and the rear surface portion 30b may be separated from each other with a predetermined facing distance.
- the shape of the overlapping region OVL of the wiring board 30 accommodated in the wireless communication device 100 has high reproducibility.
- the facing distance between the front surface portion 30a and the rear surface portion 30b also has reproducibility to the extent that the first and second capacitors in the equivalent circuit of FIG. 5B are realized.
- the present embodiment can be variously modified.
- the example has been described in which the facing portion 361 connected to the conductor layer 34a is opposed to a different region of the same conductor layer 34a, but the present invention is not limited to this.
- the facing portion 361 may face a conductor layer other than the conductor layer 34 a in the first state of the wireless communication device 100.
- the conductor layer 34a is cut out in a partial region of the wiring board 30, and the conductor layer 34b or another conductor layer (which is electrically connected to the conductor layer 34a) is exposed on the surface 301 side.
- the facing portion 361 may constitute a right-handed metamaterial facing the conductor layer of the partial region. Therefore, in the wireless communication device 100 of the present embodiment, when the conductor element 36 in one region and the conductor layer 34 in the other region face each other in the first state, the conductor layer 34 to which the conductor element 36 is connected. Thus, it is not always necessary that the conductor elements 36 face each other.
- a right-handed metamaterial structure is established in the first state of the wiring board 30, and this is not established in the second state.
- the conductor element 36 in the first state is located in the neck 37 and the conductor element 36 is detached from the neck 37 by transitioning to the second state is described as an example. It is not limited to this. That is, the conductor element 36 may be positioned on the neck 37 in both the first state and the second state to short-circuit the overlapping region OVL.
- the conductor element 36 used in this embodiment will be described in more detail.
- the conductor element 36 of the present embodiment shown in FIG. 5 has a so-called mushroom type shape.
- the conductor element 36 includes a flat plate-like facing portion 361 provided by being laminated on the surface 301 side with respect to the conductor layer 34a1, and a columnar connection member 362 that stands on this and is connected to the conductor layer 34a1.
- the flat opposing portion 361 may be referred to as a patch
- the EBG structure may be referred to as a patch type.
- a microstrip line in which the facing portion 361 is a linear transmission line can be used.
- an open stub structure in which one end of the microstrip line (opposing portion 361) is connected to the conductor layer 34a1 and the other end is an open end is employed.
- an EBG structure may be referred to as an open stub type.
- the facing portion 361 may be formed in the same layer as the conductor layer 34a1 in an island shape, or the facing portion 361 may be formed in a different layer from the conductor layer 34a1 as in the above embodiment. Good.
- a linear element for increasing inductance may be added to the facing portion 361 or the connection member 362.
- FIG. 5B is turned upside down, and the conductor layer 34a2 and the rear surface portion 30b are illustrated upward, and the conductor layer 34a1 and the front surface portion 30a are illustrated downward.
- FIG. 6A is a perspective view for explaining a first modification of the unit cell 50
- FIG. 6B is a plan view of the facing portion 361 shown in FIG. 6A.
- the unit cell 50 is different from the conductor element 36 (see FIG. 5) shown in the present embodiment in that the facing portion 361 is separated into a first conductor piece 3611 and a second conductor piece 3612. is doing.
- the conductor element 36 of this modification the first conductor piece 3611 and the second conductor piece 3612 are patches formed in the same layer.
- a rectangular first conductor piece 3611 is provided in an island shape inside the opening 363 of the second conductor piece 3612 formed in a rectangular frame shape.
- the first conductor piece 3611 and the second conductor piece 3612 are connected by a wiring 3613 provided in the same layer as these.
- the width dimension of the wiring 3613 (the vertical dimension in FIG. 6B) is smaller than the dimension of the first conductor piece 3611.
- the connecting member 362 is connected to the first conductor piece 3611.
- FIG. 6C is an explanatory diagram of an equivalent circuit of the unit cell 50 shown in FIG. 6A.
- the connection member 362 functions as a first inductance element of the unit cell 50.
- the first conductor piece 3611 and the conductor layer 34a2 function as a first capacity of the unit cell 50
- the conductor layers 34a1 and 34a2 function as a second capacity of the unit cell 50.
- a third capacitor is formed between the adjacent facing portions 361 (not shown in FIG. 6C).
- the second conductor piece 3612 and the conductor layer 34 a 2 function as a fourth capacity of the unit cell 50.
- the wiring 3613 functions as a second inductance element. This inductance element is provided in series with the fourth capacitor.
- the second inductance element and the fourth capacitance are in parallel with the first capacitance (first conductor piece 3611).
- FIG. 7A is a perspective view for explaining a second modification of the unit cell 50.
- the unit cell 50 is formed in the present embodiment in that an opening 363 is formed in a region facing the facing portion 361 in the conductor layer 34a1, and the connection member 362 and the conductor layer 34a1 are connected by the wiring 3621. Different from the conductor element 36 shown (see FIG. 5).
- the lower end position of the connection member 362 shown in FIG. 7A that is, the position of the connection member 362 in the conductor layer 34 a 1 is located inside the opening 363.
- the size of the opening 363 and the facing portion 361 is not particularly limited.
- the facing portion 361 is made larger than the opening 363, and the facing portion 361 includes the opening 363 when the conductor layer 34a1 is viewed in the direction perpendicular to the plane.
- the equivalent circuit of the unit cell 50 of the second modified example shown in FIG. 7A is almost the same as FIG. 5B.
- the wiring 3621 functions as an inductance element of the unit cell 50 together with the connection member 362. That is, in this modification, the inductance value of the unit cell 50 can be increased by providing the opening 363 and the wiring 3621.
- FIG. 7B is a perspective view for explaining a third modification of the unit cell 50.
- the unit cell 50 in the present modification is different from the second modification in that the facing portion 361 is formed in the opening 363 so as to be separated in an island shape. That is, the facing portion 361 of the present modification is provided in the same layer as the conductor layer 34a1, and is connected to the conductor layer 34a1 by the wiring 3621 having a narrower width.
- the equivalent circuit of the unit cell 50 of the third modification is almost the same as that shown in FIG. 5B. Specifically, the wiring 3621 functions as an inductance element of the unit cell 50 instead of the connection member 362.
- the conductor element 36 (opposing portion 361) of this modification is formed in the same layer as the conductor layer 34a1. That is, when the conductor element 36 is provided on the surface 301 side of the conductor layer 34a as in the present embodiment (see FIGS. 4 and 5a), the conductor element 36 is provided in the same layer as the conductor layer 34a as in the present modification. May be. Note that the same effect as that of the second modification can be obtained by this modification. Since the unit cell 50 can be formed of two layers of the conductor layers 34a1 and 34a2, the wiring board 30 can be made thin and the flexibility can be increased.
- FIG. 8A is a perspective view for explaining a fourth modification of the unit cell 50.
- This unit cell 50 is different from the third modified example shown in FIG. 7B in that the facing portion 361 is an open stub type that is not a patch but a linear shape.
- FIG. 8B is an explanatory diagram of an equivalent circuit of the unit cell 50 of the fourth modified example.
- This equivalent circuit has an open stub instead of the LC series resonance circuit in FIG. 5B, and the other configurations are the same as those in FIG. 5B.
- the linear opposing portion 361 is electrically coupled to the opposing conductor layer 34a2, thereby forming a microstrip line having the conductor layer 34a2 as a return path.
- One end of the microstrip line is an open end, and is configured to function as an open stub.
- the unit cell 50 configured as described above can be expressed by the equivalent circuit of FIG.
- the dimension of the linear facing portion 361 in the length direction is larger than the dimension in the width direction orthogonal to the dimension.
- the aspect ratio of the facing portion 361 is not particularly limited as long as the microstrip line is formed by the facing portion 361 and the conductor layer 34a2.
- FIG. 9A is a perspective view for explaining a fifth modification of the unit cell 50.
- the unit cell 50 has the same configuration as the unit cell 50 shown in the present embodiment shown in FIG. 5 except that the facing portion 361 is linear.
- the facing portion 361 of this modification extends in parallel with the conductor layer 34a1.
- One end of the facing portion 361 is connected to the connection member 362, and the other end is an open end.
- FIG. 9B is an explanatory diagram of an equivalent circuit of the unit cell 50 of the fifth modification.
- the unit cell 50 of the fifth modified example has the open stub instead of the first capacitor formed by the facing portion 361 and the conductor layer 34a2, and the unit cell 50 of the present embodiment shown in FIG. This is the same as the equivalent circuit.
- the open stub is formed by a linear facing portion 361 and a portion of the conductor layer 34a2 facing the facing portion 361.
- the unit cell 50 is given a large inductance. For this reason, the adjustment range of the characteristic of a metamaterial becomes large.
- FIG. 10 is a partial schematic diagram illustrating the first circuit board 14, the second circuit board 24, and the wiring board 30 in the wireless communication apparatus 100 according to the second embodiment.
- 10A shows an open state in which the second housing 20 slides upward with respect to the first housing 10
- FIG. 10B shows a closed state in which the second housing 20 slides downward with respect to the first housing 10.
- the wireless communication device 100 according to the present embodiment is the first shown in FIGS. 1 and 2 in that the overlapping region OVL of the wiring board 30 in the closed state is larger than the overlapping region OVL of the wiring substrate 30 in the open state. It is different from the embodiment.
- the second state in which the wiring board 30 is extended may be an open state as in this embodiment (see FIG. 10A) or a closed state as in the first embodiment. Good (see FIG. 1B).
- the inside of the overlapping region OVL that is mainly on the rear surface side in the second state is the surface 301 of the wiring board 30.
- the outer side of the overlapping region OVL that is mainly on the front surface side in the second state is defined as the back surface 302 of the wiring board 30.
- the wiring board 30 of this embodiment is also a front surface by the conductor element 36 (refer FIG. 5) electrically connected with the conductor layer 34 located inside the overlap area
- the portion 30a and the rear surface portion 30b are short-circuited. For this reason, noise flowing through the conductor layer 34 between the conductor element 36 and the folded portion 38 can be reduced.
- the antenna element 40 is generally arranged at the upper end of the first housing 10 due to various restrictions. Therefore, in the first embodiment, the overlapping region OVL faces the antenna element 40, whereas in the second embodiment, the overlapping region OVL does not face the antenna element 40. Therefore, the merit of reducing the noise to the antenna element 40 by short-circuiting the overlapping region OVL with the conductor element 36 is more favorably enjoyed in the wireless communication device 100 of the first embodiment.
- FIG. 11 is a cross-sectional view showing a wiring board 30 according to the third embodiment of the present invention.
- the wiring board 30 of this embodiment is different from the first embodiment (FIG. 4) in that an adhesive layer 35c is interposed between the coating layer 35a and the conductor layer 34a.
- connection member 362 is electrically connected with the conductor layer 34a by joining the adhesion layer 35c to the conductor layer 34a. Since the adhesive layer 35c slightly shrinks in the perpendicular direction with time, the connection member 362 and the conductor layer 34a are closely connected. In this way, by preparing an adhesive sheet or tape in which the covering layer 35a and the conductor element 36 are integrated in advance, the conductor layer 34a of the existing wiring board 30 can be easily and in a desired region. Conductive elements 36 can be provided.
- FIG. 12 is a perspective view schematically showing a wiring board 30 used in the wireless communication apparatus 100 according to the fourth embodiment of the present invention
- FIG. 13 is a sectional view taken along line XIII-XIII.
- the dimensions of the conductor element 36 (unit cell 50) are exaggerated.
- the wiring board 30 of this embodiment further includes a reflection structure 36b that reflects electromagnetic waves having a communication frequency of the wireless communication device 100 in addition to the conductor element 36 (36a) described in the first embodiment.
- the reflective structure 36b constitutes a left-handed metamaterial. Therefore, the conductor element 36a constituting the right-handed metamaterial in the first state and the reflection structure 36b of the present embodiment constitute different kinds of metamaterials.
- the conductor element 36a and the reflective structure 36b constitute a metamaterial or an EBG structure means that they constitute part or all of the unit cell 50 of the metamaterial or EBG structure.
- the reflection structure 36b reflects the electromagnetic wave having the communication frequency of the wireless communication device 100.
- the reflection structure 36b reflects the electromagnetic wave in cooperation with other elements (conductor layer 34b) that together form the EBG structure. Including cases.
- the reflective structure 36b is a second conductor element and constitutes a left-handed metamaterial with the conductor plane (conductor layer 34b). More specifically, the wiring board 30 of this embodiment forms an EBG structure by the reflective structure 36b and a partial region of the conductor layer 34b that faces the reflective structure 36b.
- the reflective structure 36b is illustrated as a mushroom type, but a specific example of an EBG structure that is preferably used as the reflective structure 36b will be described in detail later.
- the wiring board 30 of the present embodiment reflects an electromagnetic wave having a communication frequency of the antenna element 40 by a left-handed EBG structure including the reflective structure 36b and the second conductor layer 34b.
- the first circuit board 14 and the second circuit board 24 located behind the wiring board 30 when viewed from the antenna element 40 can be covered from the antenna element 40.
- the substrate being obscured from the antenna element 40 means a state in which at least a part of transmission / reception of electromagnetic waves between the substrate and the antenna element 40 is reduced by other physical elements.
- the reflective structure 36b is preferably opposed to the antenna element 40 in at least one of the first state and the second state. Therefore, when the antenna element 40 is arranged at the upper end portion of the first housing 10 as shown in FIG. 1, in the first embodiment shown in FIGS. 2 and 5, the rear surface portion 30 b of the wiring board 30 is arranged.
- a reflective structure 36b is preferably provided on the back surface 302 side.
- the reflection structure 36 b is provided on the surface 301 of the front surface portion 30 a of the wiring board 30. Therefore, the reflective structure 36b may be provided on the side opposite to the conductor element 36a connected to the conductor layer (first conductor layer 34a), or may be provided on the same side, and further the wiring. It may be provided on both surfaces of the substrate 30.
- the EBG structure of the present embodiment configured by the reflective structure 36 b and the conductor layer 34 b also has a function of attenuating noise propagating through the coating layer 35 b of the wiring board 30.
- noise of various operating frequencies (the clock frequency of the element and the communication frequency) of the wireless communication apparatus 100 may propagate to the covering layer 35b. Therefore, it is preferable that the reflective structure 36b has a size that realizes both a function as a reflector for any of the communication frequencies of the wireless communication device 100 and a function of attenuating noise at the operating frequency of the wireless communication device 100. .
- the reflective structure 36b and the second conductor layer 34b of the present embodiment constitute a left-handed metamaterial.
- the reflective structure 36b of the present embodiment has both a first state where the wiring substrate 30 is folded and the area of the overlapping region OVL is large, and a second state where the wiring substrate 30 is extended and the area of the overlapping region OVL is small. It functions as a left-handed metamaterial.
- the reflective structure 36b is provided in the same layer as the second conductor layer 34b provided on the back surface 302 side of the conductor layer 34a or on the back surface 302 side of the second conductor layer 34b with the wiring layer 32 interposed therebetween. ing.
- the opposing portion 361 of the reflective structure 36b shown in FIG. 13 is provided on the back surface 302 side of the coating layer 35b.
- the connection member 362 penetrates the coating layer 35b and electrically connects the second conductor layer 34b and the facing portion 361.
- the thickness of the covering layer 35b is set to a dimension for adjusting the facing distance between the facing portion 361 and the second conductor layer 34b as desired. In this sense, the coating layer 35b of the present embodiment may be thicker than the coating layer 35b of the first embodiment (see FIG. 4).
- the conductor element 36a since the conductor element 36a has an EBG structure for short-circuiting the overlapping region OVL, it can be used singularly, and in the case where a plurality of conductor elements 36a are used, it is sufficient if they are locally arranged inside the overlapping region OVL.
- the reflection structure 36b constitutes an EBG structure for obscuring the substrate such as the second circuit substrate 24 from the antenna element 40, it is preferable that a plurality of the reflection structures 36b be periodically and widely disposed. .
- the conductor element 36a of this embodiment is provided locally with respect to the conductor layer 34a, and the reflection structure 36b is provided with a larger number than the conductor element 36a with respect to the second conductor layer 34b.
- the conductor element 36 a is locally provided in the vicinity of the neck portion 37 (see FIGS. 2 and 5) on one surface of the wiring substrate 30, and the reflective structure 36 b is on the other surface side of the wiring substrate 30. Is provided almost throughout.
- a first capacitor constituted by a conductor plane (conductor layer 34b) and a facing portion 361 facing each other, and And an inductance element provided in series.
- FIG. 14A is a perspective view schematically showing a first example of the reflecting structure 36b
- FIG. 14B is an equivalent circuit diagram of the unit cell 50.
- the unit cell 50 of the first example is formed in an island shape inside the opening 363, a patch-like facing portion 361 facing the outside of the conductor layer 34b, an opening 363 provided in the conductor layer 34b.
- a conductor piece 364 and a wiring 365 connecting the conductor piece 364 and the conductor layer 34b are provided.
- the conductor piece 364 and the wiring 365 are formed in the same layer as the conductor layer 34b.
- the reflection structure 36b of the present embodiment includes a facing portion 361, a conductor piece 364, and a wiring 365.
- a capacitor C1 is formed between the facing portion 361 and the conductor layer 34b.
- a capacitance C2 and an inductance L1 are formed between the adjacent facing portions 361.
- a capacitor C3 is formed between the facing portion 361 and the conductor piece 364.
- the wiring 365 has an inductance L2.
- FIG. 15A is a perspective view schematically showing a second example of the reflecting structure 36b
- FIG. 15B is an equivalent circuit diagram of the unit cell 50.
- FIG. The unit cell 50 of the second example is different from the first example in that it is an open stub type having a linear microstrip line 366 instead of the conductor piece 364 and the wiring 365 of FIG. 14A.
- One end of the microstrip line 366 is connected to the conductor layer 34b, and the other end is an open end.
- the reflective structure 36b of the present embodiment is composed of a facing portion 361 and a microstrip line 366.
- FIG. 16A is a perspective view schematically showing a third example of the reflecting structure 36b.
- the equivalent circuit diagram of the unit cell 50 of the third example is common to the second example (FIG. 15B).
- the unit cell 50 of the third example is different from the second example in that the microstrip line 366 is formed in a different layer from the conductor layer 34b, and one end of the microstrip line 366 and the conductor layer 34b are connected by the connecting member 362. Is different.
- the other end of the microstrip line 366 is an open end. Thereby, the inductance of the microstrip line 366 and the connection member 362 is connected in series, and a high inductance L2 can be obtained.
- the microstrip line 366 of the third example is formed in an intermediate layer between the facing portion 361 and the conductor layer 34b.
- the reflective structure 36b of the present embodiment includes a facing portion 361, a microstrip line 366, and a connection member 362.
- FIG. 16B is a perspective view schematically showing a fourth example of the reflecting structure 36b.
- the equivalent circuit diagram of the unit cell 50 of the fourth example is common to the second example (FIG. 15B).
- the unit cell 50 of the fourth example is different from the third example in that the microstrip line 366 is located on the opposite side of the conductor layer 34b with the facing portion 361 interposed therebetween. That is, the connection member 362 of the fourth example penetrates the facing portion 361 and connects one end of the microstrip line 366 and the conductor layer 34b. Thereby, the inductance of the connection member 362 can be increased.
- the reflection structure 36b of the present embodiment is also composed of a facing portion 361, a microstrip line 366, and a connection member 362.
- FIG. 17A is a perspective view schematically showing a fifth example of the reflecting structure 36b
- FIG. 17B is an equivalent circuit diagram of the unit cell 50.
- FIG. The unit cell 50 of the fifth example is different from the fourth example in that the tip of the microstrip line 366 is not an open end but is short-circuited to the facing portion 361 by the second connection member 367.
- the unit cell 50 includes an impedance part including an inductance L1 and a capacitor C2, and an admittance part including a microstrip line 366, a second connection member 367, a capacitor C1, and an inductance L2.
- the reflective structure 36b of the present embodiment includes a facing portion 361, a microstrip line 366, a connection member 362, and a second connection member 367.
- the unit cell 50 shown in FIG. 16 or FIG. 17 can be realized with three layers, whereas the unit cell 50 shown in FIG. 14 or FIG. 15 can be realized with two layers.
- a system EBG structure can be realized, which is preferable.
- the reverse phase current that may be generated when the wiring board 30 that connects the first housing 10 and the second housing 20 is folded is suppressed by the short circuit of the wiring board 30. By doing so, fluctuations in the antenna characteristics of the wireless communication apparatus 100 are reduced.
- the wireless communication terminal has a structure in which the first housing and the second housing are rotatably attached.
- the first housing 600 and the second housing 620 do not overlap as shown in FIG. 33A, the current generated in the first housing 600 and the current generated in the second housing 620 do not interfere with each other.
- the first casing 600 and the second casing 620 overlap as shown in FIG.
- a current loop is formed by the first casing 600 and the second casing 620, so the first casing
- the current flowing through 600 and the current flowing through the second housing 620 are opposite to each other.
- the radio waves emitted from the first housing 600 and the second housing 620 are out of phase in a direction in which they cancel each other out in phase, so that these antenna functions are degraded.
- the wireless communication devices of the following fifth to seventh embodiments suppress such reverse phase current and reduce fluctuations in antenna characteristics.
- FIG. 18 is a schematic cross-sectional view showing the configuration of the wireless communication apparatus according to the fifth embodiment.
- This wireless communication apparatus includes a first housing 10, a second housing 20, a connecting member 300, an antenna element 400, a first conductor 122, and a plurality of second conductors 240.
- the connecting member 300 is, for example, a hinge, and one end of the first housing 10 is rotatably attached to one end of the second housing 20 so that the first housing 10 and the second housing 20 can overlap each other.
- the antenna element 400 is built in the first housing 10, the second housing 20, or the connecting member 300. In the example shown in the figure, the antenna element 400 is built in one end side of the first housing 10.
- the first conductor 122 is built in the first housing 10.
- the plurality of second conductors 240 are built in the second housing 20, and are repeatedly arranged at positions facing the first conductor 122 when the first housing 10 is stacked on the second housing 20.
- the first conductor 122 is given an arbitrary constant potential, for example, a ground potential. Details will be described below.
- This wireless communication device is, for example, a mobile phone.
- the first housing 10 has operation keys (not shown) and a first circuit board 120
- the second housing 20 has a display panel.
- This display panel has a second circuit board 220.
- the first circuit board 120 controls the wireless communication device
- the second circuit board 220 controls the display panel.
- the first circuit board 120 and the second circuit board 220 are connected to each other via the flexible board 500.
- the flexible substrate 500 passes through the inside of the connecting member 300.
- the antenna element 400 is connected to the first circuit board 120 and transmits radio waves for communication.
- the antenna element 400 is disposed at the end of the first housing 10 on the side where the connecting member 300 is attached.
- the first conductor 122 and the plurality of second conductors 240 are provided at the end opposite to the antenna element 400.
- the second housing 20 is provided with a third conductor 222 and a plurality of connecting members 230.
- the third conductor 222 is a sheet-like conductor and is disposed at a position facing the plurality of second conductors 240.
- the connection member 230 is, for example, a via and connects each of the plurality of second conductors 240 to the third conductor 222.
- the first conductor 122 and the plurality of second conductors 240 are opposed to each other without a conductor, for example, a metal plate or a metal layer.
- the first conductor 122 is formed as a part of the first circuit board 120, and the third conductor 222 is formed as a part of the second circuit board 220.
- the first conductor 122 is given a constant potential such as a ground potential via a wiring in the first circuit board 120, and the third conductor 222 is connected to the first conductor 122 via a wiring in the second circuit board 220, for example.
- a constant potential such as a ground potential is applied.
- FIG. 19 is a view showing a cross section indicated by a one-dot chain line in FIG.
- FIG. 20 is an equivalent circuit diagram of the unit cell 50.
- the second conductor 240 is repeatedly arranged in the width direction of the wireless communication device, for example, periodically.
- a metamaterial unit cell 50 is configured by the first conductor 122, the second conductor 240, the third conductor 222, and the connection member 230.
- the unit cell 50 is a so-called mushroom type unit cell.
- the connecting member 230 functions as an inductance element of the unit cell 50.
- the second conductor 240 and the first conductor 122 function as a first capacity of the unit cell 50, and the first conductor 122 and the third conductor 222 function as a second capacity of the unit cell 50.
- a third capacitor is formed between the adjacent second conductors 240.
- the unit cell 50 is repeatedly arrange
- This metamaterial does not include the communication frequency of the wireless communication device in the band gap frequency band. That is, since the first circuit board 120 and the second circuit board 220 are electrically connected by the metamaterial at the communication frequency of the wireless communication device, they can be regarded as one conductor.
- the interval between the same connection members is within 1 ⁇ 2 of the wavelength ⁇ of the electromagnetic wave used for communication. It is preferable to do this.
- the unit cell of the metamaterial is formed by the first conductor 122, the second conductor 240, the third conductor 222, and the connection member 230. 50 is configured.
- This metamaterial does not include the communication frequency of the wireless communication device in the band gap frequency band.
- the first circuit board 120 and the second circuit board 220 are electrically connected to each other through the metamaterial at the communication frequency of the wireless communication device, and thus can be regarded as a single conductor.
- This effect can be obtained even when the number of unit cells 50 of the metamaterial is one.
- the above-described effect becomes greater when a plurality of unit cells 50 are arranged repeatedly.
- the radio wave transmitted by the antenna element 400 interferes with a conductor other than the antenna element of the wireless communication device, for example, the first circuit board 120 and the second circuit board 220 to generate a current.
- the first circuit board 120 and the second circuit board 220 also function as antennas.
- the first circuit board 120 and the second circuit board 220 can be regarded as one conductor at the communication frequency of the wireless communication device. Therefore, the current generated in the first circuit board 120 and the current generated in the second circuit board 220 are in phase. As a result, it is possible to suppress degradation of the antenna characteristics of the first circuit board 120 and the second circuit board 220 in a state where the first casing 10 and the second casing 20 face each other.
- FIG. 21 is a cross-sectional view showing the configuration of the wireless communication apparatus according to the sixth embodiment.
- This wireless communication apparatus has the same configuration as that of the wireless communication apparatus according to the fifth embodiment except for the positions of the first conductor 122 and the third conductor 222 in the thickness direction of the housing.
- the first conductor 122 is formed separately from the first circuit board 120. Specifically, the first conductor 122 is located closer to the second housing 20 than the first circuit board 120, and is formed using, for example, a metal plate. The first conductor 122 is connected to one of the power supply line and the ground line of the first circuit board 120 through a connection member 124, for example, a via.
- the third conductor 222 is formed separately from the second circuit board 220. Specifically, the third conductor 222 is located between the second circuit board 220 and the second conductor 240 and is formed using, for example, a metal plate. The third conductor 222 is connected to the other of the power supply line and the ground line of the second circuit board 220 through a connection member 221, for example, a via.
- the same effect as that of the fifth embodiment can be obtained. Further, since the first conductor 122 can be positioned near the second conductor 240, the capacity of the unit cell 50 can be increased. Further, since the third conductor 222 can be positioned near the first conductor 122, the capacity of the unit cell 50 can be increased. For this reason, the adjustment range of the characteristic of a metamaterial becomes large.
- the first housing 10 is configured using the first metal structure 102 and the resin layer 104.
- the first metal structure 102 is a structure serving as a base of the first housing 10, and is formed by pressing a metal plate.
- the resin layer 104 is provided on at least a portion of the first metal structure 102 that is the outer surface of the first housing 10.
- the first conductor 122 can be formed in a part of the first metal structure 102.
- the second housing 20 is constituted by a second metal structure and a resin layer. Since the configurations of the second metal structure and the resin layer are the same as the configurations of the first metal structure 102 and the resin layer 104, illustration is omitted. In this case, the second conductor 240 can be formed in a part of the second metal structure.
- the configuration of the unit cell 50 is not limited to the above example.
- modified examples of the unit cell 50 will be described.
- FIG. 23A is a perspective view for explaining a first modification of the unit cell 50
- FIG. 23B is a plan view of the second conductor 240 shown in FIG. 23A.
- the unit cell 50 has the same configuration as that of the unit cell 50 shown in the fifth and sixth embodiments except that the opening 246, the conductor 242, and the wiring 244 are formed in the second conductor 240. It is.
- the conductor 242 is provided in an island shape in the opening 246, and the wiring 244 connects the conductor 242 and the second conductor 240.
- the connecting member 230 is connected to the conductor 242.
- FIG. 24 is an equivalent circuit diagram of the unit cell 50 shown in FIG. Similar to the example shown in FIG. 20, the connection member 230 functions as an inductance element of the unit cell 50.
- the second conductor 240 and the first conductor 122 function as a first capacity of the unit cell 50, and the first conductor 122 and the third conductor 222 function as a second capacity of the unit cell 50.
- a third capacitor is formed between the adjacent second conductors 240.
- a second inductance element composed of the wiring 244 and a fourth capacitor composed of the conductor 242 and the first conductor 122 are provided in series with each other.
- the second inductance element and the fourth capacitance are in parallel with the first capacitance composed of the second conductor 240 and the first conductor 122.
- FIG. 25 is a perspective view for explaining a second modification of the unit cell 50.
- the unit cell 50 has the same configuration as the unit cell 50 shown in the fifth and sixth embodiments, except that a plurality of openings 224 and a plurality of wirings 226 are formed in the third conductor 222. It is.
- the opening 224 is provided at each position facing the second conductor 240 in the third conductor 222.
- the end of the connection member 230 is located in the opening 224.
- the wiring 226 connects the connection member 230 and the third conductor 222.
- the equivalent circuit of the unit cell 50 shown in FIG. 25 is almost the same as that of the unit cell 50 shown in FIG. Specifically, the wiring 226 functions as an inductance element of the unit cell 50 together with the connection member 230. That is, in this modification, the inductance element of the unit cell 50 can be increased by providing the opening 224 and the wiring 226.
- FIG. 26 is a perspective view for explaining a third modification of the unit cell 50.
- the unit cell 50 has the same configuration as the unit cell 50 shown in FIG. 25 except that a second conductor 225 is provided instead of the second conductor 240.
- the second conductor 225 is provided in an island shape in the opening 224 and is connected to the third conductor 222 by a wiring 226.
- the equivalent circuit of the unit cell 50 shown in FIG. 26 is almost the same as that of the unit cell 50 shown in FIG. Specifically, the wiring 226 functions as an inductance element of the unit cell 50 instead of the connection member 230, and the second conductor 225 forms a first capacitance together with the first conductor 122 instead of the second conductor 240.
- the first conductor 122 and the third conductor 222 function as a second capacity of the unit cell 50, and a third capacity is formed between the adjacent second conductors 240.
- the same effect as the fifth and sixth embodiments can be obtained.
- the unit cell 50 can be formed of two layers, the wireless communication device can be thinned.
- FIG. 27 is a perspective view for explaining a fourth modification of the unit cell 50.
- This unit cell 50 has the same configuration as that of the unit cell 50 shown in FIG. 26 except that it does not have the second conductor 225.
- FIG. 28 is an equivalent circuit diagram of the unit cell 50 shown in FIG.
- the equivalent circuit shown in FIG. 28 has an open stub instead of the LC series resonance circuit in FIG. 20, and the other configuration is the same as that of the equivalent circuit in FIG.
- the wiring 226 is electrically coupled to the opposing first conductor 122 to form a microstrip line having the first conductor 122 as a return path.
- One end of the microstrip line is an open end, and is configured to function as an open stub.
- the unit cell 50 configured as described above can be expressed by an equivalent circuit of FIG. 28 in which a parallel plate composed of the first conductor 122 and the third conductor 222 is shunted with an open stub.
- the conductor 122 and the third conductor 222 are short-circuited. Since the frequency to be short-circuited can be controlled by the stub length of the open stub, adjustment is easy, and the unit cell 50 can be downsized.
- FIG. 29 is a perspective view for explaining a fifth modification of the unit cell 50.
- This unit cell 50 has the same configuration as that of the unit cell 50 shown in the fifth or sixth embodiment, except that the wiring 245 is provided instead of the second conductor 240.
- the wiring 245 extends in parallel with the third conductor 222.
- One end of the wiring 245 is connected to the connection member 230, and the other end is an open end.
- FIG. 30 is an equivalent circuit diagram of the unit cell 50 shown in FIG.
- the unit cell 50 shown in FIG. 29 is the same as the equivalent circuit shown in FIG. 20 except that it has an open stub instead of the first capacitor formed by the second conductor 240 and the first conductor 122. It is.
- the open stub is formed by the wiring 245 and a portion of the first conductor 122 facing the wiring 245. By forming the open stub, the unit cell 50 is given a large inductance. For this reason, the adjustment range of the characteristic of a metamaterial becomes large.
- FIG. 31 is a cross-sectional view showing a configuration of a wireless communication apparatus according to the seventh embodiment.
- FIG. 32 is a diagram showing a cross-section taken along the alternate long and short dash line in FIG. 31.
- the wireless communication apparatus according to the present embodiment has the same configuration as that of the wireless communication apparatus according to the fifth embodiment except that the first housing 10 includes a plurality of fourth conductors 140 and a plurality of connection members 130. It is.
- the fourth conductor 140 is positioned closer to the second housing 20 than the first conductor 122 and faces the second conductor 240. It is repeatedly arranged at the position.
- the connection member 130 is, for example, a via and connects the fourth conductor 140 and the first conductor 122.
- the first conductor 122, the connection member 130, and the plurality of fourth conductors 140 constitute a first metamaterial
- the plurality of second conductors 240, the connection member 230, and the third conductor 222 are the second.
- the first metamaterial and the second metamaterial do not include the communication frequency of the wireless communication device in the bandgap frequency band.
- the first circuit board 120 and the second circuit board 220 are electrically connected to each other through the first metamaterial and the second metamaterial at the communication frequency of the wireless communication device, and thus are regarded as one conductor. Can do. Therefore, according to this embodiment, the same effect as that of the fifth embodiment can be obtained.
- the influence of the conductor layer 34 of the wiring board 30 on the antenna characteristics of the antenna element 40 is reduced as in the first embodiment.
- These embodiments are examples of the present invention, and various configurations other than those described above can also be employed.
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Abstract
Description
図1A、図1Bは、本実施形態にかかる無線通信装置100を模式的に示す縦断面図である。また、図2Aは、図1Aの開放状態における第一回路基板14、第二回路基板24および配線基板30を示す部分模式図である。同様に、図2Bは、図1Bの閉止状態における第一回路基板14、第二回路基板24および配線基板30を示す部分模式図である。図2A、図2Bにおいて、第一筐体10と第二筐体20は破線で図示し、説明のため一部図示を省略している。
図1Aおよび図2Aに示す第一状態は、第一筐体10と第二筐体20とが互いに開放または閉止(本実施形態では、開放)されて、連結部300から第一筐体10に亘って設けられた第一導体122と、連結部300から第二筐体20に亘って設けられた第二導体240と、が互いに離間して対向している状態である。そして第一状態では、第一導体122と第二導体240とが通信周波数において電気的に接続されている。
一方、図1Bおよび図2Bに示す第二状態は、第一筐体10と第二筐体20とが閉止または開放(本実施形態では、閉止)された状態である。
無線通信装置100は、第一筐体10と第二筐体20とが互いに摺動することより、以下の第一状態と第二状態とに切り替えられる。
第一状態では、配線基板30が折り返されて一の領域の導体要素36と、他の領域の導体層34とが対向する(図5を参照)。そして第二状態では、第一状態よりも配線基板30が伸張する。
無線通信装置100は、例えばスライド開閉式の携帯電話機である。
第一筐体10は、ユーザが手で把持してキー操作する操作側筐体であり、操作キー12、第一回路基板14、電源16およびアンテナ素子40が設けられている。操作キー12、電源16およびアンテナ素子40は第一回路基板14と電気的に接続されている。操作キー12はユーザが指等で入力操作を行う入力インタフェースである。第一回路基板14は無線通信装置100の制御を行う。アンテナ素子40は、所定の通信周波数の電波を送受信する。電源16は無線通信装置100に電力を供給する。
第二回路基板24は、配線基板30を通じて第一回路基板14から信号を受信し、表示パネル22の制御を行う。表示パネル22は種々の表示出力を行うディスプレイである。
開放状態の第二筐体20の表示パネル22の面直方向は、無線通信装置100の前後方向に対して僅かに傾斜している。すなわち、閉止状態と開放状態とに遷移する第二筐体20は、上下方向に摺動するとともに、幅方向(図1Aおよび図1Bのそれぞれ紙面前後方向)を軸として僅かに回転する。本実施形態において第二筐体20が摺動するとは、第二筐体20が第一筐体10に対して直線状または曲線状に並進移動することに加えて、第二筐体20が第一筐体10に対して回転移動することを含む。なお、本実施形態に代えて、第二筐体20は第一筐体10に対して傾斜することなく、それぞれの面直方向を一致させた状態で互いに直線状に摺動して開閉してもよい。
また、頸部37とは、第一状態における重なり領域OVLの内部において、配線基板30同士の対向間隔が、折返部38近傍を除いて最小となる領域をいう。頸部37は所定の広がりをもつ領域である。なお、頸部37において、配線基板30同士は接触してもよく(対向間隔=0)、または互いに離間していてもよい(対向間隔≠0)。
第一筐体10から第二筐体20に向かって(またはその逆に)配線基板30を流れる電流は、前面部30aと後面部30bとでは逆向きの逆相電流となる。
なお、本実施形態においてアンテナ素子40が重なり領域OVLに対向するとは、重なり領域OVLが収容された筐体(本実施形態の場合、第二筐体20)の面直方向からアンテナ素子40を見た場合に、アンテナ素子40の少なくとも一部が重なり領域OVLの内側にあることをいう。
頸部37に配設された導体要素36の対向部361は、前面部30aにおける表面301側の導体層34a(以下、導体層34a1)と、後面部30bにおける表面301側の導体層34a(以下、導体層34a2)と、に挟まれている。
すなわち、導体層34a1および34a2とは、同一の導体層34aにおける異なる領域をいう。
そして、この電流低減方法は、第一導体122と第二導体240とを互いに離間して対向させた状態で、無線通信装置100の通信周波数で第一導体122または第二導体240の少なくとも一方を共振させることにより第一導体122と第二導体240とを電気的に短絡するものである。
そして、この電流低減方法は、重なり領域OVLにおける一方の配線基板(後面部30b)の導体層34a2と、他方の配線基板(前面部30a)の導体要素36と、を対向させた状態で、無線通信装置100の通信周波数で導体要素36を共振させることにより導体要素36と導体層34a1、34a2とを電気的に短絡するものである。
なお、これらの欠陥が生じる要因としては、単位セル50間に配線やビア、接続部材362を通す場合の製造上の理由が挙げられる。このほか、既存の配線レイアウトや基板間接続構造にメタマテリアル構造を追加する場合において、既存のビアやパターン、接続部材によって単位セルが配置できない場合、または製造誤差、既存のビアやパターン、接続部材を単位セルの一部として用いる場合などが挙げられる。
本実施形態に用いられる導体要素36についてより詳細に説明する。
図5に示した本実施形態の導体要素36は、いわゆるマッシュルーム型の形状をなす。導体要素36は、導体層34a1よりも表面301側に積層して設けられた平板状の対向部361と、これに立設されて導体層34a1と接続される柱状の接続部材362とを備えている。以下、平板状の対向部361をパッチといい、かかるEBG構造をパッチ型という場合がある。
本実施形態に用いられるEBG構造としては、パッチ型のほか、対向部361を線状の伝送線路としたマイクロストリップ線路とすることもできる。具体的には、マイクロストリップライン(対向部361)の一端を導体層34a1に接続し、他端をオープン端とするオープンスタブ構造とする。以下、かかるEBG構造をオープンスタブ型という場合がある。
パッチ型、オープンスタブ型とも、対向部361を導体層34a1と同層で島状に形成してもよく、または上記実施形態のように対向部361を導体層34a1と異層で形成してもよい。さらに、対向部361または接続部材362に対して、インダクタンスを増加するための線状要素を付加してもよい。
そして、配線3613は第二のインダクタンス要素として機能する。このインダクタンス要素は、第四の容量と直列に設けられている。また、この第二のインダクタンス要素および第四の容量は、第一の容量(第一導体片3611)と並列になっている。
なお、本変形例によっても、第二変形例と同様の効果を得ることができる。そして、単位セル50を導体層34a1および34a2の二層で形成することができるため、配線基板30を薄くし、かつ可撓性を高めることができる。
図10は、第二実施形態の無線通信装置100における第一回路基板14、第二回路基板24および配線基板30を示す部分模式図である。図10Aは第二筐体20が第一筐体10に対して上方に摺動した開放状態を表し、図10Bは第二筐体20が第一筐体10に対して下方に摺動した閉止状態を表している。本実施形態の無線通信装置100は、開放状態における配線基板30の重なり領域OVLよりも、閉止状態における配線基板30の重なり領域OVLの方が大きい点で、図1および図2に示した第一実施形態と相違する。
図12は本発明の第四実施形態の無線通信装置100に用いられる配線基板30を模式的に示す斜視図であり、図13はそのXIII-XIII線断面図である。なお、図12では導体要素36(単位セル50)の寸法を誇張して表現している。
被覆層35bの厚さは、対向部361と第二の導体層34bとの対向間隔を所望に調整する寸法に設定されている。かかる意味で、本実施形態の被覆層35bは、第一実施形態の被覆層35b(図4を参照)よりも厚くてもよい。
本実施形態に用いられる左手系のEBG構造を構成する反射構造体36bに共通する特徴として、互いに対向する導体平面(導体層34b)および対向部361で構成される第一の容量と、これに直列に設けられたインダクタンス要素とを含む点が挙げられる。
図18は、第五実施形態に係る無線通信装置の構成を示す断面概略図である。この無線通信装置は、第一筐体10、第二筐体20、連結部材300、アンテナ素子400、第一導体122、および複数の第二導体240を備えている。連結部材300は例えばヒンジであり、第一筐体10と第二筐体20が互いに重なることができるように、第一筐体10の一端を第二筐体20の一端に回転可能に取り付けている。アンテナ素子400は第一筐体10、第二筐体20、または連結部材300に内蔵されている。本図に示す例ではアンテナ素子400は第一筐体10の一端側に内蔵されている。第一導体122は第一筐体10に内蔵されている。複数の第二導体240は第二筐体20に内蔵されており、第一筐体10を第二筐体20に重ねたときに第一導体122に対向する位置に、繰り返し配置されている。第一導体122は、任意の定電位、たとえばグランド電位が与えられている。以下、詳細に説明する。
図21は、第六実施形態に係る無線通信装置の構成を示す断面図である。この無線通信装置は、筐体の厚さ方向における第一導体122および第三導体222の位置を除いて、第五実施形態に係る無線通信装置の構成と同様である。
図31は、第七実施形態に係る無線通信装置の構成を示す断面図である。図32は、図31の一点鎖線の断面を示す図である。本実施形態に係る無線通信装置は、第一筐体10の内部に複数の第四導体140および複数の接続部材130を有する点を除いて、第五実施形態に係る無線通信装置と同様の構成である。
Claims (25)
- 第一筐体と、第二筐体と、前記第一筐体と前記第二筐体とを可動に連結する連結部と、所定の通信周波数で動作するアンテナ素子と、を備え、前記第一筐体と前記第二筐体とが互いに移動することにより以下の第一状態と第二状態とに切り替えられることを特徴とする無線通信装置;
第一状態:前記第一筐体と前記第二筐体とが互いに開放または閉止されて、前記連結部から前記第一筐体に亘って設けられた第一導体と、前記連結部から前記第二筐体に亘って設けられた第二導体と、が互いに離間して対向するとともに、前記第一導体と前記第二導体とが前記通信周波数において電気的に接続されている状態、
第二状態:前記第一筐体と前記第二筐体とが閉止または開放された状態。 - 前記第一状態で互いに対向する前記第一導体または前記第二導体の少なくとも一方が前記通信周波数で共振してメタマテリアルを構成する請求項1に記載の無線通信装置。
- 前記第二筐体が前記連結部によって前記第一筐体に対して摺動可能に連結されており、配線層、導体層、および前記導体層と接続された導体要素を含み前記第一筐体と前記第二筐体とを接続する可撓性の配線基板をさらに備える請求項1または2に記載の無線通信装置であって、
前記第一筐体と前記第二筐体とが互いに摺動することより前記第一状態と前記第二状態とが切り替えられるとともに、
前記第一状態では前記配線基板が折り返されて、一の領域の前記導体要素からなる前記第一導体と、他の領域の導体層からなる前記第二導体と、が対向し、
前記第二状態では前記第一状態よりも前記配線基板が伸張することを特徴とする無線通信装置。 - 前記第一状態における折り返された前記配線基板同士の重なり領域の面積が、前記第二状態における前記重なり領域の面積よりも大きい請求項3に記載の無線通信装置。
- 前記アンテナ素子が、前記第一状態における前記重なり領域に対向する位置に配置されている請求項4に記載の無線通信装置。
- 前記導体要素が、前記導体層と同層でまたは前記導体層の表面側に積層して設けられ、
前記配線基板が、前記第一状態において前記表面側を内側に向けて折り返される請求項3から5のいずれか一項に記載の無線通信装置。 - 前記第一状態にある前記配線基板が略Ω字形状をなし、一つまたは複数の前記導体要素が前記略Ω字形状の頸部に設けられている請求項3から6のいずれか一項に記載の無線通信装置。
- 前記配線基板が、前記無線通信装置の通信周波数の電磁波を反射する反射構造体をさらに備える請求項3から7のいずれか一項に記載の無線通信装置。
- 前記反射構造体が、前記第一状態または前記第二状態の少なくとも一方で前記アンテナ素子に対向している請求項8に記載の無線通信装置。
- 前記反射構造体が、前記配線層を挟んで前記導体層の裏面側に設けられた第二の導体層と同層または前記第二の導体層よりも裏面側に積層して設けられている請求項8または9に記載の無線通信装置。
- 前記導体要素が前記導体層に対して局所的に設けられ、
前記反射構造体が、前記第二の導体層に対して前記導体要素よりも多くの個数で設けられている請求項10に記載の無線通信装置。 - 前記導体要素が前記第一状態において右手系のメタマテリアルを構成し、前記反射構造体が左手系のメタマテリアルを構成する請求項8から11のいずれか一項に記載の無線通信装置。
- 前記第一筐体と前記第二筐体とが互いに重なることができるように前記連結部によって前記第一筐体の一端が前記第二筐体の一端に回転可能に取り付けられ、
前記アンテナ素子が前記第一筐体、前記第二筐体、または前記連結部に内蔵され、
前記第一導体が前記第一筐体に内蔵され、
前記第二導体が前記第二筐体に内蔵され、前記第一筐体を前記第二筐体に重ねたときに前記第一導体に対向する位置に配置されていることを特徴とする請求項1から12のいずれか一項に記載の無線通信装置。 - 前記第二導体を複数有する請求項13に記載の無線通信装置。
- 前記無線通信装置の通信周波数における波長の半分以下の間隔で、前記第二導体が複数配置されている請求項14に記載の無線通信装置。
- 前記第二筐体に内蔵され、前記第二導体に対向する位置に配置された第三導体と、
前記第二導体のそれぞれを前記第三導体に接続する接続部材と、
を備え、
前記第一筐体を前記第二筐体に重ねたときに、前記第二導体は前記第三導体よりも前記第一筐体の近くに位置する請求項13から15のいずれか一項に記載の無線通信装置。 - 前記第二筐体に内蔵され、前記第二導体に対向する位置に配置された第三導体と、
前記第一筐体に内蔵され、前記第一導体に対向する位置に配置された第四導体と、
をさらに備え、
前記第一筐体を前記第二筐体に重ねたときに、前記第四導体は前記第一導体よりも前記第二筐体の近くに位置し、かつ前記第二導体は前記第三導体よりも前記第一筐体の近くに位置する請求項13に記載の無線通信装置。 - 前記第一導体と前記第三導体は第一メタマテリアルを構成し、
前記第二導体と前記第四導体は第二メタマテリアルを構成し、
前記第一メタマテリアルおよび前記第二メタマテリアルは、前記無線通信装置の通信周波数において前記第一筐体と前記第二筐体を電気的に接続する請求項17に記載の無線通信装置。 - 前記第一筐体は、板状の金属からなる第一金属構造体を有しており、
前記第一導体は前記第一金属構造体の一部として形成されている請求項13から18のいずれか一項に記載の無線通信装置。 - 前記第二筐体は、板状の金属からなる第二金属構造体を有しており、
前記第二導体は前記第二金属構造体の一部として形成されている請求項13から19のいずれか一項に記載の無線通信装置。 - 前記アンテナ素子は、前記連結部の内部、または前記第一筐体もしくは前記第二筐体の一端に取り付けられており、
前記第一導体は、前記第一筐体の他端に位置しており、
前記第二導体は、前記第二筐体の他端に位置している請求項13から20のいずれか一項に記載の無線通信装置。 - 前記第一筐体を前記第二筐体に重ねたときに、前記第一導体と前記第二導体は、導体を介さずに対向している請求項13から21のいずれか一項に記載の無線通信装置。
- 第一筐体と、第二筐体と、前記第一筐体と前記第二筐体とを可動に連結する連結部と、所定の通信周波数で動作するアンテナ素子と、前記連結部から前記第一筐体に亘って設けられた第一導体と、前記連結部から前記第二筐体に亘って設けられた第二導体と、を備え、前記第一筐体と前記第二筐体とが互いに移動することによって前記第一導体と前記第二導体との重なり領域が変化する無線通信装置において前記重なり領域を流れる電流を低減する方法であって、
前記第一導体と前記第二導体とを互いに離間して対向させた状態で、前記無線通信装置の通信周波数で前記第一導体または前記第二導体の少なくとも一方を共振させることにより前記第一導体と前記第二導体とを電気的に短絡することを特徴とする電流低減方法。 - 前記第二筐体が前記連結部によって前記第一筐体に対して摺動可能に連結されており、前記第一筐体と前記第二筐体とが互いに摺動することより前記第一状態と前記第二状態とが切り替えられるとともに、
前記無線通信装置が、配線層、導体層、および前記導体層と接続された導体要素を含み前記第一筐体と前記第二筐体とを接続する可撓性の配線基板をさらに備え、かつ、折り返された前記配線基板同士の重なり領域が前記第一筐体と前記第二筐体との摺動によって変化し、
前記第一状態では、前記重なり領域における一方の前記配線基板の導体層からなる前記第二導体と、他方の前記配線基板の前記導体要素からなる前記第一導体と、を対向させた状態で、前記通信周波数で前記導体要素を共振させる請求項23に記載の電流低減方法。 - 前記重なり領域の一部に前記導体層と同層でまたは前記導体層よりも折り返しの内側に積層して設けられた前記導体要素を、前記重なり領域の他の一部における導体層と対向させた状態で、前記無線通信装置の通信周波数で前記導体要素を共振させることにより、前記重なり領域の前記一部と前記他の一部とを短絡させることを特徴とする請求項24に記載の電流低減方法。
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JP5945048B2 (ja) | 2016-07-05 |
CN102834969B (zh) | 2015-02-11 |
JP5805626B2 (ja) | 2015-11-04 |
CN102834969A (zh) | 2012-12-19 |
EP2555323A4 (en) | 2016-11-30 |
EP2555323B1 (en) | 2017-12-06 |
US9065891B2 (en) | 2015-06-23 |
JP2016007059A (ja) | 2016-01-14 |
JP2016178684A (ja) | 2016-10-06 |
US20120306705A1 (en) | 2012-12-06 |
EP2555323A1 (en) | 2013-02-06 |
JPWO2011121956A1 (ja) | 2013-07-04 |
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