WO2011115382A3 - Pla 수지를 사용한 칩 스루 바닥재 - Google Patents

Pla 수지를 사용한 칩 스루 바닥재 Download PDF

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Publication number
WO2011115382A3
WO2011115382A3 PCT/KR2011/001559 KR2011001559W WO2011115382A3 WO 2011115382 A3 WO2011115382 A3 WO 2011115382A3 KR 2011001559 W KR2011001559 W KR 2011001559W WO 2011115382 A3 WO2011115382 A3 WO 2011115382A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
pla resin
flooring material
layer
pla
Prior art date
Application number
PCT/KR2011/001559
Other languages
English (en)
French (fr)
Other versions
WO2011115382A2 (ko
Inventor
황승철
김지영
박귀봉
강창원
권준혁
권현종
박상선
김장기
이경민
Original Assignee
㈜엘지하우시스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ㈜엘지하우시스 filed Critical ㈜엘지하우시스
Priority to EP11756513.5A priority Critical patent/EP2548735A4/en
Priority to JP2012541036A priority patent/JP5690835B2/ja
Priority to US13/510,049 priority patent/US9623635B2/en
Priority to CN201180004552.4A priority patent/CN102639323B/zh
Publication of WO2011115382A2 publication Critical patent/WO2011115382A2/ko
Publication of WO2011115382A3 publication Critical patent/WO2011115382A3/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/08Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/026Wood layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584Scratch resistance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2471/00Floor coverings
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/10Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/253Cellulosic [e.g., wood, paper, cork, rayon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263Coating layer not in excess of 5 mils thick or equivalent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31591Next to cellulosic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]
    • Y10T428/3179Next to cellulosic

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Floor Finish (AREA)

Abstract

PLA 수지를 사용하여 친환경적이며, 천연 나무의 질감 및 나무 고유의 향기를 구현할 수 있는 PLA 수지를 사용한 칩 스루(chip through) 바닥재에 대하여 개시한다. 본 발명에 따른 PLA 수지를 사용한 칩 스루 바닥재는 칩 스루 층(Chip Through Layer); 및 상기 칩 스루 층의 표면에 형성되는 표면처리층;을 포함하고, 상기 칩 스루 층은 PLA 수지를 포함하는 것을 특징으로 한다.
PCT/KR2011/001559 2010-03-15 2011-03-07 Pla 수지를 사용한 칩 스루 바닥재 WO2011115382A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11756513.5A EP2548735A4 (en) 2010-03-15 2011-03-07 FLOOR COVERING MATERIAL WITH POLYMOSIC ACID RESIN
JP2012541036A JP5690835B2 (ja) 2010-03-15 2011-03-07 Pla樹脂を使用したチップスルー床材
US13/510,049 US9623635B2 (en) 2010-03-15 2011-03-07 Chip through flooring material using PLA resin
CN201180004552.4A CN102639323B (zh) 2010-03-15 2011-03-07 使用聚乳酸树脂的碎屑贯穿地板材

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100023052A KR101260563B1 (ko) 2010-03-15 2010-03-15 Pla 수지를 사용한 칩 스루 바닥재
KR10-2010-0023052 2010-03-15

Publications (2)

Publication Number Publication Date
WO2011115382A2 WO2011115382A2 (ko) 2011-09-22
WO2011115382A3 true WO2011115382A3 (ko) 2012-01-26

Family

ID=44649694

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001559 WO2011115382A2 (ko) 2010-03-15 2011-03-07 Pla 수지를 사용한 칩 스루 바닥재

Country Status (6)

Country Link
US (1) US9623635B2 (ko)
EP (1) EP2548735A4 (ko)
JP (1) JP5690835B2 (ko)
KR (1) KR101260563B1 (ko)
CN (1) CN102639323B (ko)
WO (1) WO2011115382A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101393811B1 (ko) * 2011-12-13 2014-05-13 (주)엘지하우시스 가교된 폴리락트산을 이용한 발포 시트 및 이의 제조방법
KR20130080934A (ko) 2012-01-06 2013-07-16 (주)엘지하우시스 Pla 수지를 이용한 강화 마루
KR20140148033A (ko) * 2013-06-21 2014-12-31 (주)엘지하우시스 생분해성 수지 및 목분을 포함하는 판재 및 이의 제조방법
CA2873565C (en) * 2013-12-31 2018-03-06 Armstrong World Industries, Inc. Hybrid flooring product
CN105178557B (zh) * 2015-09-17 2017-06-30 浙江永裕竹业股份有限公司 一种重组竹地板及其制造方法
FI127576B (en) * 2017-03-02 2018-09-14 Sulapac Oy New packaging materials

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Publication number Priority date Publication date Assignee Title
US4902367A (en) * 1987-06-19 1990-02-20 Lucky, Ltd. Apparatus and method for the preparation of mosaic floor decorations
US20020150775A1 (en) * 1998-09-14 2002-10-17 Masahiro Ishikawa Degradable laminated body and a method for the preparation thereof
US20060142505A1 (en) * 2004-12-27 2006-06-29 Kabushiki Kaisha Toyota Chuo Kenkyusho Aliphatic polyester composition and its molded article
US20090270524A1 (en) * 2005-03-28 2009-10-29 Toray Industries, Inc. Polylactic acid foam
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Title
See also references of EP2548735A4 *

Also Published As

Publication number Publication date
EP2548735A2 (en) 2013-01-23
KR101260563B1 (ko) 2013-05-06
EP2548735A4 (en) 2014-05-21
CN102639323A (zh) 2012-08-15
CN102639323B (zh) 2015-04-08
US9623635B2 (en) 2017-04-18
JP5690835B2 (ja) 2015-03-25
JP2013512361A (ja) 2013-04-11
US20120231256A1 (en) 2012-09-13
KR20110103809A (ko) 2011-09-21
WO2011115382A2 (ko) 2011-09-22

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