EP2548735A4 - Chip through flooring material using pla resin - Google Patents

Chip through flooring material using pla resin

Info

Publication number
EP2548735A4
EP2548735A4 EP11756513.5A EP11756513A EP2548735A4 EP 2548735 A4 EP2548735 A4 EP 2548735A4 EP 11756513 A EP11756513 A EP 11756513A EP 2548735 A4 EP2548735 A4 EP 2548735A4
Authority
EP
European Patent Office
Prior art keywords
chip
flooring material
pla resin
pla
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11756513.5A
Other languages
German (de)
French (fr)
Other versions
EP2548735A2 (en
Inventor
Cheng-Zhe Huang
Ji-Young Kim
Ki-Bong Park
Chang-Won Kang
Jun-Hyuk Kwon
Hyun-Jong Kwon
Sang-Sun Park
Jang-Ki Kim
Gyeong-Min Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LX Hausys Ltd
Original Assignee
LG Hausys Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Hausys Ltd filed Critical LG Hausys Ltd
Publication of EP2548735A2 publication Critical patent/EP2548735A2/en
Publication of EP2548735A4 publication Critical patent/EP2548735A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/08—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/026—Wood layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584—Scratch resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2471/00—Floor coverings
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/253—Cellulosic [e.g., wood, paper, cork, rayon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31591—Next to cellulosic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y10T428/3179—Next to cellulosic
EP11756513.5A 2010-03-15 2011-03-07 Chip through flooring material using pla resin Withdrawn EP2548735A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100023052A KR101260563B1 (en) 2010-03-15 2010-03-15 Chip through flooring material using polylactic acid resin
PCT/KR2011/001559 WO2011115382A2 (en) 2010-03-15 2011-03-07 Chip through flooring material using pla resin

Publications (2)

Publication Number Publication Date
EP2548735A2 EP2548735A2 (en) 2013-01-23
EP2548735A4 true EP2548735A4 (en) 2014-05-21

Family

ID=44649694

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11756513.5A Withdrawn EP2548735A4 (en) 2010-03-15 2011-03-07 Chip through flooring material using pla resin

Country Status (6)

Country Link
US (1) US9623635B2 (en)
EP (1) EP2548735A4 (en)
JP (1) JP5690835B2 (en)
KR (1) KR101260563B1 (en)
CN (1) CN102639323B (en)
WO (1) WO2011115382A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101393811B1 (en) 2011-12-13 2014-05-13 (주)엘지하우시스 Foam sheet using cross-linked pla and manufacturing method of thereof
KR20130080934A (en) 2012-01-06 2013-07-16 (주)엘지하우시스 High desity fiberboard using poly lactic acid resin
KR20140148033A (en) * 2013-06-21 2014-12-31 (주)엘지하우시스 Panel and manufacturing method thereof
CA2873565C (en) * 2013-12-31 2018-03-06 Armstrong World Industries, Inc. Hybrid flooring product
CN105178557B (en) * 2015-09-17 2017-06-30 浙江永裕竹业股份有限公司 One kind restructuring bamboo flooring and its manufacture method
FI127576B (en) * 2017-03-02 2018-09-14 Sulapac Oy Novel materials for packaging

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869985B2 (en) * 2002-05-10 2005-03-22 Awi Licensing Company Environmentally friendly polylactide-based composite formulations
US7256223B2 (en) * 2002-11-26 2007-08-14 Michigan State University, Board Of Trustees Environmentally friendly polylactide-based composite formulations
JP2008062428A (en) * 2006-09-05 2008-03-21 Toppan Printing Co Ltd Floor material and its manufacturing method
JP2008075367A (en) * 2006-09-22 2008-04-03 Toppan Printing Co Ltd Floor material and its manufacturing method
KR20080092588A (en) * 2007-04-12 2008-10-16 주식회사 엘지화학 Wood flooring with composite core comprising kenaf and fiber board

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US4902367A (en) 1987-06-19 1990-02-20 Lucky, Ltd. Apparatus and method for the preparation of mosaic floor decorations
JPH09151594A (en) 1995-11-30 1997-06-10 Mitsubishi Chem Mkv Co Direct sticking flooring
JPH116278A (en) 1997-06-16 1999-01-12 Shin Etsu Polymer Co Ltd Woody-toned synthetic-resin-made deck
JP2000085054A (en) 1998-09-14 2000-03-28 Daicel Chem Ind Ltd Collapsible laminate and manufacture thereof
WO2002090440A1 (en) * 2001-05-08 2002-11-14 Mitsubishi Rayon Co., Ltd. Modifier for thermoplastic resin and thermoplastic resin composition containing the same
JP2004018592A (en) 2002-06-13 2004-01-22 Fukuvi Chem Ind Co Ltd Profile extrusion molded building material
JP4285984B2 (en) * 2002-12-19 2009-06-24 フクビ化学工業株式会社 Polyester flooring
JP4792690B2 (en) * 2003-06-10 2011-10-12 東レ株式会社 Resin composition and molded article comprising the same
JP4910270B2 (en) * 2003-07-31 2012-04-04 東レ株式会社 Foam and production method thereof
JP2005232828A (en) 2004-02-20 2005-09-02 Toppan Printing Co Ltd Floor material
JP2005306932A (en) 2004-04-19 2005-11-04 Mitsubishi Heavy Ind Ltd Biodegradable synthetic paper and its manufacturing process
WO2006033706A1 (en) * 2004-07-30 2006-03-30 Mannington Mills, Inc. Flooring products and methods of making the same
JP2006118120A (en) 2004-10-19 2006-05-11 Toli Corp Floor material
JP5008015B2 (en) * 2004-12-27 2012-08-22 株式会社豊田中央研究所 Aliphatic polyester composition and molded article thereof
JP5076499B2 (en) 2005-03-28 2012-11-21 東レ株式会社 Polylactic acid foam
JP4440165B2 (en) 2005-04-26 2010-03-24 名古屋油化株式会社 Formable sheet and interior material
US20070014977A1 (en) 2005-07-12 2007-01-18 Daniel Graney Multilayer Film
NZ544493A (en) * 2005-12-22 2008-07-31 Nz Forest Research Inst Ltd Method for producing wood fibre composite products
CN100549073C (en) * 2006-03-07 2009-10-14 中国科学院化学研究所 A kind of method for preparing expanded product of thermoplastic resin
JP2008056745A (en) 2006-08-29 2008-03-13 Toppan Cosmo Inc Resin molded product
US8551604B2 (en) * 2006-10-02 2013-10-08 Awi Licensing Company Flooring product having regions of different recycle or renewable content
KR20080043041A (en) 2006-11-13 2008-05-16 제일모직주식회사 Polylactic acid resin composition with good elongation and impact strength
KR101288213B1 (en) * 2007-01-05 2013-07-18 (주)엘지하우시스 Chip inlaid flooring tile in which interior pattern of chip layer and surface embo are harmonious
JP5563733B2 (en) * 2007-03-30 2014-07-30 大日本印刷株式会社 Cosmetic material
KR101234496B1 (en) 2008-02-01 2013-02-18 주식회사 엘지화학 Biodegradable Polylactic Acid Resin Composition Having High Thermal Stability And Impact Strength, And Preparation Method Thereof
JP2011515605A (en) 2008-03-24 2011-05-19 バイオベーション，エルエルシー Biolaminate composite assembly and related methods
JP2009235365A (en) * 2008-03-28 2009-10-15 Toyota Motor Corp Polylactic acid composite molding, manufacturing method for polylactic acid composite molding, and surface member for automobile interior material
JP5154352B2 (en) 2008-05-26 2013-02-27 花王株式会社 Method for producing polylactic acid resin injection molded body
JP5200281B2 (en) 2008-08-29 2013-06-05 日本エイアンドエル株式会社 Thermoplastic resin composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869985B2 (en) * 2002-05-10 2005-03-22 Awi Licensing Company Environmentally friendly polylactide-based composite formulations
US7256223B2 (en) * 2002-11-26 2007-08-14 Michigan State University, Board Of Trustees Environmentally friendly polylactide-based composite formulations
US7354656B2 (en) * 2002-11-26 2008-04-08 Michigan State University, Board Of Trustees Floor covering made from an environmentally friendly polylactide-based composite formulation
JP2008062428A (en) * 2006-09-05 2008-03-21 Toppan Printing Co Ltd Floor material and its manufacturing method
JP2008075367A (en) * 2006-09-22 2008-04-03 Toppan Printing Co Ltd Floor material and its manufacturing method
KR20080092588A (en) * 2007-04-12 2008-10-16 주식회사 엘지화학 Wood flooring with composite core comprising kenaf and fiber board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200914, Derwent World Patents Index; AN 2009-E82452, XP002723296 *

Also Published As

Publication number Publication date
US20120231256A1 (en) 2012-09-13
WO2011115382A3 (en) 2012-01-26
CN102639323A (en) 2012-08-15
US9623635B2 (en) 2017-04-18
JP2013512361A (en) 2013-04-11
EP2548735A2 (en) 2013-01-23
KR101260563B1 (en) 2013-05-06
CN102639323B (en) 2015-04-08
JP5690835B2 (en) 2015-03-25
KR20110103809A (en) 2011-09-21
WO2011115382A2 (en) 2011-09-22

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Inventor name: KIM, JANG-KI

Inventor name: KWON, JUN-HYUK

Inventor name: LEE, GYEONG-MIN

Inventor name: HUANG, CHENG-ZHE

Inventor name: KIM, JI-YOUNG

Inventor name: PARK, KI-BONG

Inventor name: PARK, SANG-SUN

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