WO2011077477A1 - 表示装置とその製造方法 - Google Patents
表示装置とその製造方法 Download PDFInfo
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- WO2011077477A1 WO2011077477A1 PCT/JP2009/007092 JP2009007092W WO2011077477A1 WO 2011077477 A1 WO2011077477 A1 WO 2011077477A1 JP 2009007092 W JP2009007092 W JP 2009007092W WO 2011077477 A1 WO2011077477 A1 WO 2011077477A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
Definitions
- the present invention relates to a display device and a manufacturing method thereof, and more particularly to a display device including an organic light emitting layer and a manufacturing method thereof.
- each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween.
- driving the display device holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.
- the organic light emitting layers of adjacent pixel portions are partitioned by a bank made of an insulating material.
- the organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the bank and drying the ink.
- Patent Document 1 in which a convex portion is provided on the inner surface of the bank, thereby controlling the pinning position of the ink. Yes. That is, by adopting the technique proposed in Patent Document 1, it is possible to pin the convex portion where the pinning position is formed when the ink in one pixel portion is dropped. Uniformity can be ensured.
- the present invention has been made to solve the above-described problems, and aims to make the film thickness of the organic light-emitting layer uniform in the pixel portion located on the outer periphery of the panel, and to provide a display device with less luminance unevenness in the panel surface. It aims at providing the manufacturing method.
- a display device employs the following configuration.
- a plurality of pixel portions are arranged. Each pixel portion is interposed between the first electrode and the second electrode, and the first electrode and the second electrode. And an organic light emitting layer.
- a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion.
- the plurality of pixel portions include a first pixel portion and a second pixel portion that are located on the end side of the pixel array and are adjacent to each other in the direction of the pixel array.
- a first bank is included to partition the organic light emitting layer of the first pixel portion and the organic light emitting layer of the second pixel portion.
- the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion.
- the inclination angle of the first side surface portion corresponding to the first pixel portion corresponds to the second pixel portion. Since the inclination angle is larger than the inclination angle of the two side surface portions, the pinning position when the ink is dropped at the time of manufacture is higher in the first side surface portion than in the second side surface portion. For this reason, in the drying process, the film thickness corresponding to the first side surface portion in the organic light emitting layer of the first pixel portion is thinner than the film thickness corresponding to the second side surface portion in the organic light emitting layer of the second pixel portion. There is a tendency to try.
- the thickness of the organic light emitting layer after drying is higher in the portion corresponding to the first side surface portion in the first pixel portion than in the second pixel portion. Tend to be thicker than the portion corresponding to the second side surface portion. Therefore, in the display device according to one embodiment of the present invention, the effect of increasing the film thickness of the organic light emitting layer in the portion corresponding to the first side surface portion due to the nonuniformity of the vapor concentration distribution is Since the film thickness is reduced by increasing the inclination angle of one side surface, the film shape of the organic light emitting layer in the end side pixel portion can be made uniform.
- the film shape of the organic light emitting layer in the pixel portion located on the outer peripheral portion of the panel is made uniform, and luminance unevenness is reduced.
- FIG. 3 is a schematic cross-sectional view showing a pixel unit 100 in the display panel 10.
- FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing the structure of banks 105a to 105f for each of pixel portions 100a to 100c in the display panel 10.
- (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small
- (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large
- (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small
- (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer.
- FIG. 6 is a diagram showing the film thickness distribution of organic light emitting layers in Samples 1 to 3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5.
- FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1.
- FIG. 14 is a schematic plan view showing a structure of a bank 305 included in a display panel 30 according to Modification 3.
- FIG. 14 is a schematic plan view showing a structure of a bank 305 included in a display panel 30 according to Modification 3.
- (A) is a schematic cross section which shows the organic light emitting layer in the display panel which concerns on a prior art
- (b) is a figure which shows the film thickness uniformity distribution of the organic light emitting layer for every area
- a plurality of pixel portions are arranged. Each pixel portion is interposed between the first electrode and the second electrode, and the first electrode and the second electrode. And an organic light emitting layer.
- a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion.
- the plurality of pixel portions include a first pixel portion and a second pixel portion that are located on the end side of the pixel array and are adjacent to each other in the direction of the pixel array.
- a first bank is included to partition the organic light emitting layer of the first pixel portion and the organic light emitting layer of the second pixel portion.
- the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion.
- the inclination angle of the first side surface portion is relative to the inclination angle of the second side surface portion. Since it is large, when the ink is dropped in the step of forming the organic light emitting layer, the pinning position on the first side surface portion becomes higher than the pinning position on the second side surface portion. Specifically, the pinning position at the first side surface portion having a relatively large inclination angle is higher than the pinning position at the second side surface portion having a relatively small inclination angle.
- the thickness of the organic light emitting layer after drying is such that the film thickness of the organic light emitting layer corresponding to the first side surface portion in the first bank is greater than the film thickness of the organic light emitting layer corresponding to the second side surface portion. Try to be thin.
- the effect of increasing the film thickness at the portion due to the movement of the solvent to reduce the surface free energy during drying is due to the inclination angle of the first side surface portion being larger than that of the second side surface portion.
- the film thickness is reduced by the change of the pinning position, and the film shape of the organic light emitting layer is made uniform in the entire pixel portion including the pixel portion on the end side of the pixel array.
- the thickness of the organic light-emitting layer in all the pixel portions is made uniform, and luminance unevenness is reduced.
- a third pixel portion and a fourth pixel portion that are located on the center side of the pixel array and are adjacent to each other in the direction of the pixel array are extracted. Try.
- the plurality of banks include a second bank that partitions the organic light emitting layer of the third pixel portion and the organic light emitting layer of the fourth pixel portion.
- the inclination angle of the third side surface portion corresponding to the third pixel portion in the second bank and the fourth side surface portion corresponding to the fourth pixel portion in the second bank are equal to each other. It is possible to adopt a configuration that is formed as described above.
- the film thicknesses of the organic light emitting layers 906a and 906b in the pixel portion are substantially uniform in the center portion of the panel (center side in the pixel array). Yes. For this reason, the film thickness of the organic light emitting layer of the pixel portion located on the center side of the pixel array can be kept uniform by equalizing the inclination angles of the third side surface portion and the fourth side surface portion. It becomes.
- the inclination angles of the third side surface portion and the fourth side surface portion are made equal to each other within a range where the difference in luminance efficiency (luminance unevenness) of the plurality of pixel portions in the entire panel is practically acceptable. means.
- the plurality of banks includes a third bank that partitions the organic light emitting layer of the second pixel portion on the end side of the pixel array.
- a configuration in which the fifth side surface portion corresponding to the second pixel portion in the third bank has a larger inclination angle than the second side surface portion can be employed.
- the film thickness of the organic light emitting layer of the second pixel portion is suppressed from being increased by the above relationship even in the portion corresponding to the fifth side surface portion, and the entire pixel portion is The thickness of the organic light emitting layer can be made uniform.
- the inclination angle of the first side surface portion is set in a range of 35 [°] or more and 40 [°] or less, and the inclination angle of the second side surface portion is 25. As an example, it can be set within the range of [°] to 30 [°]. If the first side surface portion and the second side surface portion are formed with an inclination angle in such a range, the film thickness (film shape) of each organic light emitting layer is surely uniform over the entire single unit side pixel unit. Can be
- the inclination angles of the third side surface portion and the fourth side surface portion are both in the range of 25 [°] to 30 [°]. As an example. If the third side surface portion and the fourth side surface portion are formed with an inclination angle in such a range, the thickness of the organic light emitting layer in the central pixel portion can be made uniform as a whole.
- the “inclination angle” means each side surface portion of the bank and the underlying layer on which the bank is provided (the first electrode, the hole injection layer, the hole transport layer, and the hole injection transport layer) The angle formed by the top surface of
- a method for manufacturing a display device is a method for manufacturing a display device in which a plurality of pixel portions are arranged, and includes the following steps.
- a functional layer including a first electrode is formed on a substrate.
- a photosensitive resist material is laminated on the functional layer.
- the photosensitive resist material laminated in the execution of the second step is subjected to mask exposure and patterned to form a plurality of openings corresponding to a plurality of pixel portions, and between adjacent openings. A plurality of banks to be partitioned are formed.
- a 2nd electrode is formed above an organic light emitting layer.
- the plurality of openings are both positioned on the end side of the pixel array and are adjacent to each other in the pixel array direction.
- the plurality of banks includes a first bank that partitions the organic light emitting layers of the first opening and the second opening.
- the inclination angle of the first side surface portion corresponding to the first opening in the first bank is equal to the side surface portion corresponding to the second opening in the first bank (hereinafter, for simplicity, “ The first bank is formed so as to increase with respect to the inclination angle of “second side surface portion”.
- the pinning position when ink is dropped on the end side opening at the time of manufacturing is the second side surface portion at the first side surface portion. From the relationship between the pinning position and the film thickness as described above, the film thickness of the organic light emitting layer can be made uniform, and the luminance unevenness can be reduced.
- the thickness of the organic light-emitting layer in the pixel portion at the outer peripheral portion of the panel (at the end of the pixel array) is made uniform, and uneven luminance in the surface is reduced. Fewer display devices can be manufactured.
- the exposure amount to the photosensitive resist material in the portion corresponding to the first side surface portion is set to the second side surface.
- a configuration in which the inclination angle of the first side surface portion is made larger than the inclination angle of the second side surface portion by increasing the exposure amount of the portion corresponding to the portion to the photosensitive resist material. can be adopted.
- the light transmittance of the portion corresponding to the first side surface portion corresponds to the second side surface portion.
- Adopting a configuration in which the inclination angle of the first side surface portion is made larger than the inclination angle of the second side surface portion by performing exposure using a mask having a large relationship with respect to the light transmittance of the portion. Can do.
- the tilt angle of the first side surface portion is larger than the tilt angle of the second side surface portion, and a display device with little luminance variation in the surface can be manufactured.
- a photosensitive resist material is used for a portion corresponding to the first side surface portion and a portion corresponding to the second side surface portion. After exposure and development, it is possible to adopt a configuration in which an exposure process is additionally performed on a portion corresponding to the first side surface portion.
- the first bank and the second bank can be formed in which the inclination angle of the first side surface portion is larger than the inclination angle of the second side surface portion.
- the organic light emitting layers 906a and 906c are formed between banks 905 erected on a substrate 901.
- the organic light emitting layer 906c in the pixel portion at the outer peripheral portion of the panel tends to be less uniform in film thickness than the organic light emitting layer 906a in the pixel portion at the central portion of the panel.
- Parts indicated by two-dot chain lines D 1 and D 2 in FIG. 17B the present inventor has confirmed that the surface of the organic light emitting layer is higher in the pixel portion located on the outer periphery of the panel as it goes to the outer periphery of the panel.
- the horizontal axis indicates the distance from the outer peripheral edge
- the vertical axis indicates the degree of film thickness deviation.
- the present inventor presumed that the decrease in the uniformity of the organic light-emitting layer thickness was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did. Specifically, as shown in FIG. 18, the vapor concentration in the vicinity of the pixel portions 900b and 900c located on the outer periphery of the panel is lower than the vapor concentration in the vicinity of the pixel portion 900a located in the center of the panel. It has become.
- the evaporation rate from the dropped ink in the pixel portion 900a at the center of the panel is substantially uniform.
- the solvent moves as indicated by the solid line arrow inside the ink 9061c in the middle of drying.
- the solvent moves so as to compensate for the evaporated amount (moves so as to minimize the surface free energy), and the solute (organic light emitting material) moves as the solvent moves. Therefore, as shown in FIG. 19 (c), in the pixel portion of the panel outer periphery, the surface profile L 2 is the organic light emitting layer 906c which raised the more outer is formed.
- the present inventor relates to an organic light-emitting display device, and the film thickness of the organic light-emitting layer is uniform due to the non-uniformity of the vapor concentration distribution during ink drying on the outer peripheral side and the central side of the panel. I got the inference that the gender declines.
- the inventor makes the pinning position on the bank side surface of the ink different by changing the inclination angle of the bank side surface in the panel surface, and as a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.
- the display device 1 includes a display panel unit 10 and a drive control unit 20 connected to the display panel unit 10.
- the display panel unit 10 is an organic EL panel using an electroluminescence phenomenon of an organic material, and a plurality of organic EL elements are arranged and configured.
- the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
- the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.
- the configuration of the display panel 10 will be described with reference to FIG.
- the display panel 10 according to the present embodiment employs a top emission type organic EL panel as an example, and emits organic light having one of red (R), green (G), and blue (B).
- a plurality of pixel portions 100 including layers are arranged and configured in a matrix, but in FIG. 2, one pixel portion 100 is extracted and drawn.
- the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each pixel unit 100.
- a hole injecting and transporting layer 104 is formed on the electrode coating layer 103, and a bank 105 made of an insulating material and partitioning each pixel unit 100 is erected thereon.
- An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each pixel unit 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .
- the substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.
- the anode electrode 102 is composed of a single layer made of a conductive material or a laminate in which a plurality of layers are laminated.
- a conductive material for example, Ag (silver), APC (silver, palladium, copper alloy), ARA ( Silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), etc. are used.
- the top emission type as in the present embodiment, it is preferably formed of a highly reflective material.
- Electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers the upper surface of the anode electrode 102 in the Z-axis direction.
- ITO indium tin oxide
- the hole injecting and transporting layer 104 is a layer made of an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), for example. It is.
- the hole injecting and transporting layer 104 made of such a metal oxide has a function of injecting and transporting holes to and from the organic light emitting layer 106 in a stable manner or assisting the generation of holes, and has a large work function. Have.
- the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.
- the hole injecting and transporting layer 104 can be formed by using PEDOT (mixture of polythiophene and polystyrene sulfonic acid) or the like in addition to the metal oxide as described above.
- PEDOT mixture of polythiophene and polystyrene sulfonic acid
- the bank 105 is made of an organic material such as resin and has an insulating property. Examples of the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin. The bank 105 preferably has organic solvent resistance.
- the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the process.
- the side surface portion can be treated with fluorine.
- a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or more and having water repellency can be used as the insulating material used for forming the bank 105. This is because when a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent pixel portions 100 is generated. This is because various problems such as an increase in power consumption are caused.
- the bank 105 When the bank 105 is formed using a hydrophilic material, the difference in affinity / water repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. This is because it becomes difficult to selectively hold the ink containing the organic substance in the opening of the bank 105.
- the structure of the bank 105 not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted.
- the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.
- Organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108.
- As a material used for forming the organic light emitting layer 106 it is necessary to use a light emitting organic material that can be formed by a wet printing method.
- Electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.
- the cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance is 80% or more.
- the cathode electrode 108 As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also.
- the layer containing silver may be formed of silver alone, or may be formed of a silver alloy.
- a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.
- the sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.
- each of the banks 105 extends in the Y-axis direction, and partitions between adjacent pixel units 100 in the X-axis direction.
- the pixel unit 100 is formed so that the light emission color is different for each region partitioned by the bank 105.
- the organic light emitting layers (not shown in FIG. 4) are partitioned by the bank 105a, and the side surface portions 105aa and 105ab of the bank 105a and the hole injecting and transporting layer which is a base layer.
- the surface 104a of 104 forms angles ⁇ aa and ⁇ ab, respectively.
- the pixel portion 100c and the pixel portion 100d located on the outer periphery of the panel are partitioned by a bank 105a between the organic light emitting layers (not shown in FIG. 4), and the side portions 105ca and 105cb of the bank 105c are separated from each other.
- the surface 104a of the hole injecting and transporting layer 104 which is the underlayer, forms angles ⁇ ca and ⁇ cb, respectively.
- the bank 105d that further divides the organic light emitting layer (not shown in FIG.
- the angle of inclination of the side surface of the bank 105x (the angle formed between the side surface and the surface of the hole injecting and transporting layer 104) is an angle ⁇ x
- the inclination angle of the side surface portion of the bank 105y (the angle formed between the side surface portion and the surface of the hole injection transport layer 104) is the angle ⁇ y.
- the angle ⁇ x and the angle ⁇ y satisfy the following relationship.
- Hy> Hx As shown in FIG. 5C, when the ink 1060x is dried, the central portion of the pixel portion of the formed organic light emitting layer 106x is caused by the relatively low height Hx of the pinning position Px. The thickness rises and the film thickness becomes the thickness Tx.
- the organic light emitting layer 106y is formed in the center of the pixel portion due to the relatively high height Hy at the pinning position Py.
- the portion is recessed and the film thickness becomes the thickness Ty.
- the thickness Tx and the thickness Ty satisfy the following relationship.
- the pinning position is higher in Sample 3 and Sample 4 where the taper angle is larger than the thickness distribution of Sample 2.
- the horizontal axis indicates the horizontal direction
- the vertical axis indicates the height direction.
- the anode electrode 102 and the electrode covering layer 103 are formed on the upper surface of the substrate 101 in the Z-axis direction so as to correspond to the regions where the pixel portions 100a to 100d,. Are sequentially stacked. Then, a hole injecting and transporting layer 104 is laminated and formed so as to cover the entire surface.
- the anode electrode 102 is formed by, for example, forming an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the Ag thin film using a photolithography method.
- the electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode electrode 102 using a sputtering method and patterning the ITO thin film using a photolithography method or the like.
- a metal film is formed on the surface of the substrate 101 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injecting and transporting layer 104.
- a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coat method.
- a photosensitive resist material is used for the formation of the bank material layer 1050.
- an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.
- a mask 501 provided with openings 501a and 501c is provided above the bank material layer 1050 at a location where a bank is to be formed. In this state, exposure is performed through the openings 501a and 501c of the mask 501.
- the width Wa of the opening 501a of the mask 501 between the regions corresponding to the pixel portions 100a and 100b located in the center is the banks 105a and 105b to be formed (FIG. 4). )) Is defined by points Pa1 and Pa2 at the lower end of the side surface portion.
- the width Wc1 of the mask opening 501a is the point at the upper end of the side portion of the banks 105c and 105d (see FIG. 4) to be formed. It is defined by Pc1 and the point Pc2 at the bottom.
- openings 502c are provided above the bank material layer 1050 at locations corresponding to the side portions 105ca and 105da (see FIG. 4) of the banks 105c and 105d, respectively.
- the mask 502 is disposed. In this state, the second exposure is executed through the opening 502c of the mask 502.
- the width Wc2 of the opening 502c in the mask 502 is defined by the lower end point Pc3 and the upper end point Pc1 of the side surfaces of the banks 105c and 105d to be formed.
- banks 105a to 105d,... are formed by performing development and baking.
- the side surfaces 105ca and 105da in the banks 105c and 100d have an inclination angle larger than that of the side surface 105cb in the bank 105c, and the inclination angles of the side surfaces 105aa, 105ab,. Will be equal.
- ink containing an organic light emitting material is dropped into the openings defined by the banks 105a to 105d,...
- the organic light emitting layers 106a to 106d,... Are formed by drying the ink.
- the display panel 10 is formed by sequentially stacking the electron injection layer 107, the cathode electrode 108, the sealing layer 109, and the like.
- the organic light emitting layers 106c and 106d (see FIG. 10C) of the pixel portion 100c and the pixel portion 100d located on the outer periphery of the panel.
- the inclination angles ⁇ ca and ⁇ cb of the side surface portions 105ca and 105cb are set so as to satisfy the relationship of [Equation 1], that is, the angle ⁇ ca is larger than the angle ⁇ cb. Has been.
- the pinning positions corresponding to the side surface portions 105ca and 105da when ink is dropped at the time of manufacture are higher than the pinning positions corresponding to the side surface portion 105cb. .
- the film thicknesses of the organic light emitting layers 106c and 106d are on the outer peripheral side of the pixel portions 100c and 100d located on the outer peripheral portion of the panel (portions corresponding to the side surface portions 105ca and 105da) due to the vapor concentration distribution during ink drying.
- the action of increasing the thickness can be suppressed by the action by setting the respective inclination angles ⁇ ca to ⁇ da of the corresponding side surface parts 105ca and 105da of the banks 105c and 105d as described above, and the pixel parts 100c and
- the film thickness on the end side of the organic light emitting layers 106c and 106d at 100d can be made uniform as a whole.
- the inclination angles ⁇ aa and ⁇ ab of the side surface portions 105aa and 105ab in the bank 105a are equal to each other as shown in the above [Equation 2]. For this reason, the film thickness of the organic light emitting layer 106d corresponding to each part is equalized (uniformed) as a whole.
- the display panel 10 has an effect that the thickness of the organic light-emitting layer 106 after drying is uniform in the pixel portions 100a to 100d,.
- “equal” does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device. Specifically, the inclination angles are made equal in a range where the difference in luminance efficiency (brightness unevenness) between the pixel portions 100a to 100d,. Means.
- Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG. FIG. 11 shows steps corresponding to the steps shown in FIGS. 9C to 10A.
- a mask 503 is disposed thereon.
- the mask 503 is provided with light transmitting portions 503a, 503c1, 503c2,.
- Each of the light transmitting portions 503a, 503c1, 503c2,... Corresponds to a place where each of the banks 105a to 105d,... (See FIG. 4) partitioning between the pixel portions 100a to 100d,. Is provided.
- the width Wa of the light transmitting portion 503a in the region corresponding to the pixel portion 100a is the point at the lower end of the banks 105a and 105b (see FIG. 4) to be formed. It is defined by Pa1 and Pa2.
- the width Wc2 of the light transmitting portion 503c1 in the region corresponding to the pixel portion 100c is defined by the lower end point Pc2 and the upper end point Pc1 of the banks 105c and 105d to be formed (see FIG. 4).
- the light transmitting portion 503c2 is defined by points Pc3 and Pc1 at the lower ends of the banks 105e and 105f (see FIG. 4) to be formed.
- the mask 503 is configured using a mask such as a halftone, and the light transmittances of the light transmitting portions 503a and 503c1 and the light transmitting portion 503c2 are different. Specifically, the light transmittance of the light transmitting portion 503c2 is larger than the light transmittance of the light transmitting portions 503a and 503c1.
- Banks 105a to 105d,... As shown in FIG. 10B can be formed by performing exposure / development and baking after the mask 503 having the above configuration is arranged. it can. That is, in the portion exposed through the light transmitting portion 503c2 where the light transmittance is set to be large, as compared with the portion exposed through the other light transmitting portions 503a and 503c1, The inclination angle of the side wall surface is increased.
- the display device 1 can also be manufactured by the manufacturing method as described above.
- a mask 504 is disposed thereon.
- the mask 504 is provided with openings 504a, 504c,... Corresponding to the locations where the banks 105a to 105d,.
- Openings 504a provided at locations where banks 105a and 105b (see FIG. 4) corresponding to the pixel portions 100a and 100b are to be formed are the same as the openings 501a of the mask 501 used in the manufacturing method of the above embodiment. It is formed with a width.
- the width Wc3 of the opening 504c provided at a location where the banks 105c and 105d (see FIG. 4) corresponding to the pixel portions 100c and 100d are to be formed is surrounded by a two-dot chain line in FIG. As shown in the portion, the width is set to be larger than the width defined by the points Pc2 and Pc3 at the lower ends of the banks 105c and 105d. Specifically, the width is increased at a location where the inclination angle is to be increased.
- the first exposure / development is performed with the mask 504 having the configuration shown in FIG. As a result, as shown in FIG. 12B, bank material layers 1051a to 1051d,... Remain at locations corresponding to the openings 504a and 504c of the mask 504.
- a mask 505 is disposed thereon.
- the mask 505 has openings only at locations where the inclination angle is to be increased (side portions 105ca, 105da,... In FIG. 4) among locations corresponding to the side portions of the banks 105a to 105d to be formed. 505c and 505d are provided.
- Banks 105a to 105d as shown in FIG. 13B can be formed by performing the second exposure / development with the mask 505 arranged and then baking.
- the side surface portions 105ca, 105da on the left side in the X-axis direction (panel center side) have a larger inclination angle than the other side surface portions 105aa, 105ab, 105cb,.
- the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.
- the inclination angle of the bank side surface portion to be formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.
- the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.
- a horizontal axis shows a horizontal direction and a vertical axis
- shaft shows a height direction.
- each configuration as an example is adopted in order to easily understand the configuration and the operation / effect of the present invention.
- the present invention except for essential parts, It is not limited to the said form.
- the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example.
- a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.
- the cathode electrode 108 When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.
- the specific external shape of the display device 1 is not shown, but it can be a part of the system as shown in FIG. 15, for example.
- the organic EL display device does not require a backlight like a liquid crystal display device, and thus is suitable for thinning and exhibits excellent characteristics from the viewpoint of system design.
- the so-called line bank structure as shown in FIG. 3 is adopted as the form of the bank 105, but the bank 105 extends in the Y-axis direction as shown in FIG.
- the display panel 30 can also be configured by using a pixel bank 305 including a bank element 305a and a bank element 305b extending in the X-axis direction.
- the inclination of the side wall portion indicated by the arrows B 1 and B 3 The angle is made larger than the inclination angle of the side wall portion indicated by the arrow B 2 , and the inclination angle of the side wall portion indicated by the arrows B 4 and B 6 is larger than the inclination angle of the side wall portion indicated by the arrow B 5.
- the inclination angle of the side wall part of the outer side of the bank formed in a panel outer peripheral part was decided to be larger than the inclination angle of the bank side part corresponding to a panel center part.
- this relationship can be appropriately changed according to the flow of vapor (vapor concentration) in the drying process related to the formation of the organic light emitting layer during production.
- the flow of vapor during drying of the ink is in the direction from the outer periphery of the panel toward the center of the panel, it corresponds to the location where the film thickness of the organic light emitting layer increases.
- the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.
- the light emission colors (red, green, and blue) in the pixel portion are not distinguished, but the characteristics of the ink including the organic light emitting material change according to the light emission color.
- the inclination angle of the corresponding bank side surface portion can be defined according to the ink characteristics of each emission color.
- the region for which the inclination angle of the bank side surface portion is to be increased can be appropriately determined according to the manufacturing process, the panel size, and the like. For example, 0.5% to It is considered desirable to target a pixel portion of about [%] (for example, 1 [%]). This is because the variation in the thickness of the organic light emitting layer in the display device according to the prior art shown in FIG.
- the present invention is useful for realizing a display device with little luminance unevenness and high image quality performance.
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Abstract
Description
本発明の一態様に係る表示装置は、複数の画素部が配列されてなる、各画素部は、第1電極および第2電極と、第1電極と第2電極との間に介挿された有機発光層とを有し構成されている。本発明の一態様に係る表示装置では、第1電極の上方に、有機発光層を画素部ごとに区画する複数のバンクが立設されている。上記複数の画素部には、ともに画素配列の端部側に位置し、且つ、画素配列の方向において互いに隣接する第1画素部と第2画素部とが含まれており、複数のバンクには、第1画素部の有機発光層と第2画素部の前記有機発光層とを区画する第1バンクが含まれている。
以下では、本発明を実施するための形態の一例について、図面を参酌しながら説明する。
本発明者は、(背景技術)において記載した有機発光表示装置に関し、鋭意研究の結果、次のような知見を得た。
本実施の形態に係る表示装置1の全体構成について、図1を用い説明する。
表示パネル10の構成について、図2を用い説明する。なお、本実施の形態に係る表示パネル10は、一例として、トップエミッション型の有機ELパネルを採用し、赤(R)、緑(G)、青(B)の何れか発光色を有する有機発光層を備える複数の画素部100がマトリクス状に配置され構成されているが、図2では、一つの画素部100を抜き出して描いている。
基板101は、例えば、無アルカリガラス、ソーダガラス、無蛍光ガラス、燐酸系ガラス、硼酸系ガラス、石英、アクリル系樹脂、スチレン系樹脂、ポリカーボネート系樹脂、エポキシ系樹脂、ポリエチレン、ポリエステル、シリコーン系樹脂、又はアルミナ等の絶縁性材料をベースとして形成されている。
アノード電極102は、導電性材料からなる単層、あるいは複数の層が積層されてなる積層体から構成されており、例えば、Ag(銀)、APC(銀、パラジウム、銅の合金)、ARA(銀、ルビジウム、金の合金)、MoCr(モリブデンとクロムの合金)、NiCr(ニッケルとクロムの合金)などを用い形成されている。なお、本実施の形態のように、トップエミッション型の場合には、高反射性の材料で形成されていることが好ましい。
電極被覆層103は、例えば、ITO(酸化インジウムスズ)を用い形成されており、アノード電極102のZ軸方向上部の表面を被覆する。
ホール注入輸送層104は、例えば、銀(Ag)、モリブデン(Mo)、クロム(Cr)、バナジウム(V)、タングステン(W)、ニッケル(Ni)、イリジウム(Ir)などの酸化物からなる層である。このような酸化金属からなるホール注入輸送層104は、ホールを安定的に、またはホールの生成を補助して、有機発光層106に対しホールを注入および輸送する機能を有し、大きな仕事関数を有する。
バンク105は、樹脂等の有機材料で形成されており絶縁性を有する。バンク105の形成に用いる有機材料の例としては、アクリル系樹脂、ポリイミド系樹脂、ノボラック型フェノール樹脂等があげられる。そして、バンク105は、有機溶剤耐性を有することが好ましい。
有機発光層106は、アノード電極102から注入されたホールと、カソード電極108から注入された電子とが再結合されることにより励起状態が生成され発光する機能を有する。有機発光層106の形成に用いる材料は、湿式印刷法を用い製膜できる発光性の有機材料を用いることが必要である。
電子注入層107は、カソード電極108から注入された電子を有機発光層106へ輸送する機能を有し、例えば、バリウム、フタロシアニン、フッ化リチウム、あるいはこれらの組み合わせで形成されることが好ましい。
カソード電極108は、例えば、ITO、IZO(酸化インジウム亜鉛)などで形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。光透過性については、透過率が80[%]以上とすることが好ましい。
封止層109は、有機発光層106などが水分に晒されたり、空気に晒されたりすることを抑制する機能を有し、例えば、SiN(窒化シリコン)、SiON(酸窒化シリコン)などの材料を用い形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。
図3に示すように、本実施の形態に係る表示パネル10では、一例としてライン状のバンク105を採用している。具体的には、バンク105は、各々がY軸方向に延伸形成され、X軸方向において隣接する画素部100間を区画している。そして、画素部100は、バンク105により区画された領域ごとに、発光色が異なるように形成されている。
図4に示すように、表示パネル10から、中央部に位置する画素部100a,100bと、外周部に位置する画素部(配列された複数の画素部の内、配列端部に位置する画素部)100c,100dとを抜き出し、各画素部100a~100dのそれぞれの両脇にバンク105a~105dが配されているとする。
[数2] θaa=θab
[数3] θda>θcb
なお、本実施の形態では、角度θaa,θab,θcbを25[°]以上30[°]以下の範囲内の角度とし、角度θca,θdaを35[°]以上40[°]以下の範囲内の角度とする。
バンク105における側面部の傾斜角度θと有機発光層106の膜厚との関係について、図5および図6を用い説明する。なお、図5では、画素部の構造を模式的に描いている。
各バンク105x,105yで区画された開口部に有機発光材料を含むインク1060x,1060yを滴下すると、各ピンニング位置Px,Pyの高さHx,Hyが次のような関係となる。
図5(c)に示すように、インク1060xを乾燥させると、ピンニング位置Pxの高さHxが相対的に低いことに起因して、形成される有機発光層106xでは、画素部の中央部分が盛り上がり、その膜厚が厚みTxとなる。
上記の関係を図6に纏めて示す。図6に示すように、バンク105の傾斜角度(テーパ角)θを小さくすれば、ピンニング高さHが低くなり、結果的に得られる有機発光層106の膜厚Tが厚くなる。逆に、バンク105の傾斜角度(テーパ角)θを大きくすれば、ピンニング高さHが高くなり、結果的に得られる有機発光層106の膜厚Tが薄くなる。
本実施の形態に係る表示パネル10の製造方法について、図9および図10を用い、特徴となる部分を説明する。なお、以下で説明を省略する製造工程については、従来技術として提案されている種々の工程を採用することが可能である。
図4に示すように、本実施の形態に係る表示装置1の表示パネル10では、パネル外周部に位置する画素部100cと画素部100dとの各有機発光層106c,106d(図10(c)を参照。)同士を区画するバンク105cでは、その各側面部105ca,105cbの各傾斜角度θca,θcbが、上記[数1]の関係、即ち、角度θcaの方が角度θcbよりも大きく設定されている。このため、パネル外周部に位置する画素部100c,100dでは、その製造時におけるインクを滴下した際の側面部105ca,105daに対応するピンニング位置が、側面部105cbに対応するピンニング位置に対し高くなる。
次に、図11を用い、表示装置1の製造方法の変形例1について説明する。図11は、図9(c)から図10(a)に示す工程に対応する工程を示す。
次に、図12および図13を用い、表示装置1の製造方法の変形例2について説明する。図12および図13は、図9(c)から図10(b)に示す工程に対応する工程を示す。
上記実施の形態および変形例1,2に係る各製造方法について、具体例を以って形成後のバンク形状について検証を行った。その結果について、図14を用い説明する。
上記実施の形態および変形例1,2では、本発明の構成および作用・効果を分かりやすく説明するために一例としての各構成を採用するものであり、本発明は、本質的な部分を除き、上記形態に限定されるものではない。例えば、上記実施の形態では、図2に示すように、有機発光層106に対し、そのZ軸方向下側にアノード電極102が配されている構成を一例として採用したが、本発明は、これに限らず有機発光層106に対し、そのZ軸方向下側にカソード電極108が配されているような構成を採用することもできる。
10,30.表示パネル
20.駆動制御部
21~24.駆動回路
25.制御回路
100,100a~100c,300.画素部
101.基板
102.アノード電極
103.電極被覆層
104.ホール注入層
105,105a~105f,105x,105y,305.バンク
106,106a,106c,106x,106y.有機発光層
107.電子注入層
108.カソード電極
109.封止層
501~505.露光マスク
1050,1051a,1051b,1051e,1051f.バンク材料層
1060x,1060y.インク
Claims (10)
- 複数の画素部が配列されてなる表示装置であって、
各画素部は、第1電極および第2電極と、前記第1電極と前記第2電極との間に介挿された有機発光層とを有し構成されており、
前記第1電極の上方には、前記有機発光層を前記画素部ごとに区画する複数のバンクが立設されており、
前記複数の画素部には、ともに前記配列の端部側に位置し、且つ、前記配列の方向において互いに隣接する第1画素部と第2画素部とが含まれており、
前記第1画素部は、前記第2画素部に対し、前記配列の中央部側に位置しており、
前記複数のバンクには、前記第1画素部の前記有機発光層と前記第2画素部の前記有機発光層とを区画する第1バンクが含まれており、
前記第1バンクにおいて、前記第1画素部に対応する第1側面部は、前記第2画素部に対応する第2側面部に対し、その傾斜角度が大きい
ことを特徴とする表示装置。 - 前記複数の画素部には、ともに前記配列の中央部側に位置し、且つ、前記配列の方向において互いに隣接する第3画素部と第4画素部とが含まれており、
前記複数のバンクには、前記第3画素部の前記有機発光層と前記第4画素部の前記有機発光層とを区画する第2バンクが含まれており、
前記第2バンクにおいて、前記第3画素部に対応する第3側面部と、前記第4画素部に対応する第4側面部とは、その傾斜角度が等しい
ことを特徴とする請求項1に記載の表示装置。 - 前記複数のバンクには、前記第2画素部の前記有機発光層を、前記配列の端部側で区画する第3バンクが含まれており、
前記第3バンクにおける前記第2画素部に対応する第5側面部は、前記第2側面部に対し、その傾斜角度が大きい
ことを特徴とする請求項1に記載の表示装置。 - 前記第1側面部の傾斜角度は、35°以上40°以下の範囲内にあり、
前記第2側面部の傾斜角度は、25°以上30°以下の範囲内にある
ことを特徴とする請求項1に記載の表示装置。 - 前記第3側面部および前記第4側面部の傾斜角度は、ともに25°以上30°以下の範囲内にある
ことを特徴とする請求項2に記載の表示装置。 - 前記傾斜角度は、前記バンクにおける各側面部と、前記バンクが設けられている下地層の上面とがなす角度である
ことを特徴とする請求項1に記載の表示装置。 - 複数の画素部が配列されてなる表示装置の製造方法であって、
基板上に、第1電極を含む機能層を形成する第1工程と、
前記機能層の上に、感光性レジスト材料を積層する第2工程と、
前記積層された感光性レジスト材料をマスク露光してパターニングすることにより、複数の画素部に対応する複数の開口部を形成するとともに、隣接する前記開口部間を区画する複数のバンクを形成する第3工程と、
前記複数の開口部のそれぞれに対して、有機発光材料を含むインクを滴下して乾燥させ、有機発光層を形成する第4工程と、
前記有機発光層の上方に、第2電極を形成する第5工程と、
を有し、
前記複数の開口部には、ともに前記配列の端部側に位置し、且つ、前記配列の方向において互いに隣接する第1開口部と第2開口部とが含まれており、
前記第1開口部は、前記第2開口部に対し、前記配列の中央部側に位置しており、
前記複数のバンクには、前記第1開口部の前記有機発光層と前記第2開口部の前記有機発光層とを区画する第1バンクとが含まれており、
前記第3工程では、第1バンクにおいて、前記第1開口部に対応する第1側面部が、前記第第2開口部に対応する第2側面部に対し、その傾斜角度が大きくなるように、前記第1バンクの形成を行う
ことを特徴とする表示装置の製造方法。 - 前記第3工程では、前記感光性レジスト材料の露光に関し、前記第1側面部に相当する部分への露光量を、前記第2側面部に相当する部分への露光量に対して大きくすることにより、前記第1側面部の傾斜角度が、前記第2側面部の傾斜角度に対し、大きくなるようにする
ことを特徴とする請求項7に記載の表示装置の製造方法。 - 前記第3工程では、前記感光性レジスト材料の露光に関し、前記第1側面部に相当する部分への光の透過率を、前記第2側面部に相当する部分への光の透過率に対して大きいマスクを用いることにより、第1側面部の傾斜角度が、前記第2側面部の傾斜角度に対し、大きくなるようにする
ことを特徴とする請求項7に記載の表示装置の製造方法。 - 前記第3工程では、前記第1側面部に相当する部分と、前記第2側面部に相当する部分とに対し、前記感光性レジスト材料を露光して現像した後、前記第1側面部に相当する部分に対して、露光処理を追加して行うことにより、第1側面部の傾斜角度が、前記第2側面部の傾斜角度に対して大きくなるようにする
ことを特徴とする請求項7に記載の表示装置の製造方法。
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WO2018179133A1 (ja) * | 2017-03-29 | 2018-10-04 | シャープ株式会社 | 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置、成膜装置、コントローラ |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2398083B1 (en) | 2009-02-10 | 2018-06-13 | Joled Inc. | Light-emitting element, display device, and method for manufacturing light-emitting element |
CN102272970B (zh) | 2009-02-10 | 2014-12-10 | 松下电器产业株式会社 | 发光元件、具备发光元件的发光装置以及发光元件的制造方法 |
JP5303036B2 (ja) | 2009-09-29 | 2013-10-02 | パナソニック株式会社 | 発光素子およびそれを用いた表示装置 |
CN102474939B (zh) | 2009-11-04 | 2015-03-04 | 松下电器产业株式会社 | 显示面板装置及其制造方法 |
KR101643009B1 (ko) * | 2009-12-22 | 2016-07-27 | 가부시키가이샤 제이올레드 | 표시 장치와 그 제조 방법 |
JP5574114B2 (ja) * | 2009-12-22 | 2014-08-20 | パナソニック株式会社 | 表示装置とその製造方法 |
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WO2012017499A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子 |
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CN102960066B (zh) * | 2010-10-15 | 2015-09-30 | 株式会社日本有机雷特显示器 | 有机发光面板及其制造方法以及有机显示装置 |
WO2012049718A1 (ja) | 2010-10-15 | 2012-04-19 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
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WO2012049719A1 (ja) | 2010-10-15 | 2012-04-19 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
CN102577614B (zh) | 2010-10-15 | 2015-11-25 | 株式会社日本有机雷特显示器 | 有机发光面板及其制造方法以及有机显示装置 |
CN103109387B (zh) * | 2011-09-08 | 2016-02-10 | 株式会社日本有机雷特显示器 | 发光装置及其制造方法 |
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KR20140033671A (ko) * | 2012-09-10 | 2014-03-19 | 삼성디스플레이 주식회사 | 유기발광 표시장치 및 그 제조 방법 |
JP6160499B2 (ja) | 2014-02-06 | 2017-07-12 | ソニー株式会社 | 表示装置および表示装置の製造方法、並びに電子機器 |
KR102430819B1 (ko) * | 2015-08-19 | 2022-08-10 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
US10873050B2 (en) * | 2016-03-29 | 2020-12-22 | Sharp Kabushiki Kaisha | Organic EL display device and organic EL display device manufacturing method |
WO2019064410A1 (ja) * | 2017-09-28 | 2019-04-04 | シャープ株式会社 | 表示装置 |
CN107863451B (zh) * | 2017-10-30 | 2019-06-25 | 武汉华星光电技术有限公司 | 一种oled阳极的制备方法及oled显示装置的制备方法 |
US10581011B2 (en) * | 2018-06-01 | 2020-03-03 | Int Tech Co., Ltd. | Light emitting device with different light emitting material overlapping width |
CN109786552B (zh) * | 2019-01-22 | 2020-10-16 | 合肥京东方光电科技有限公司 | 有机薄膜及其制作方法、显示装置和光学器件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005267984A (ja) * | 2004-03-17 | 2005-09-29 | Sanyo Electric Co Ltd | 有機el表示装置 |
JP2007310156A (ja) * | 2006-05-18 | 2007-11-29 | Seiko Epson Corp | 膜形成方法、電気光学基板の製造方法、及び電気光学装置の製造方法、並びに機能膜、電気光学基板、電気光学装置、及び電子機器 |
JP2009054608A (ja) * | 2007-08-23 | 2009-03-12 | Dainippon Printing Co Ltd | 有機エレクトロルミネッセンス素子およびその製造方法 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5443922A (en) | 1991-11-07 | 1995-08-22 | Konica Corporation | Organic thin film electroluminescence element |
JPH05163488A (ja) | 1991-12-17 | 1993-06-29 | Konica Corp | 有機薄膜エレクトロルミネッセンス素子 |
JP3633229B2 (ja) | 1997-09-01 | 2005-03-30 | セイコーエプソン株式会社 | 発光素子の製造方法および多色表示装置の製造方法 |
US6762552B1 (en) * | 1999-11-29 | 2004-07-13 | Koninklijke Philips Electronics N.V. | Organic electroluminescent device and a method of manufacturing thereof |
TW461228B (en) * | 2000-04-26 | 2001-10-21 | Ritdisplay Corp | Method to manufacture the non-photosensitive polyimide pixel definition layer of organic electro-luminescent display panel |
JP3628997B2 (ja) | 2000-11-27 | 2005-03-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置の製造方法 |
JP4651860B2 (ja) | 2001-06-01 | 2011-03-16 | 本田技研工業株式会社 | 燃料電池スタック |
JP2003280600A (ja) | 2002-03-20 | 2003-10-02 | Hitachi Ltd | 表示装置およびその駆動方法 |
US7307381B2 (en) * | 2002-07-31 | 2007-12-11 | Dai Nippon Printing Co., Ltd. | Electroluminescent display and process for producing the same |
JP2004192935A (ja) | 2002-12-11 | 2004-07-08 | Hitachi Displays Ltd | 有機el表示装置 |
JP4225237B2 (ja) * | 2004-04-21 | 2009-02-18 | セイコーエプソン株式会社 | 有機el装置及び有機el装置の製造方法並びに電子機器 |
JP4812627B2 (ja) * | 2004-10-28 | 2011-11-09 | シャープ株式会社 | 有機エレクトロルミネセンスパネル及びその製造方法、並びに、カラーフィルタ基板及びその製造方法 |
JP2006140205A (ja) | 2004-11-10 | 2006-06-01 | Toppan Printing Co Ltd | 電磁波遮蔽材およびその製造方法、ならびにディスプレイ用フィルム |
JP2006185869A (ja) | 2004-12-28 | 2006-07-13 | Asahi Glass Co Ltd | 有機電界発光素子及びその製造方法 |
US7994711B2 (en) | 2005-08-08 | 2011-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
JP2007073499A (ja) | 2005-08-08 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2007165167A (ja) * | 2005-12-15 | 2007-06-28 | Optrex Corp | 有機el表示パネルおよびその製造方法 |
JP2007287354A (ja) | 2006-04-12 | 2007-11-01 | Hitachi Displays Ltd | 有機el表示装置 |
JP2007311235A (ja) | 2006-05-19 | 2007-11-29 | Seiko Epson Corp | デバイス、膜形成方法、及びデバイスの製造方法 |
JP5161200B2 (ja) | 2007-02-27 | 2013-03-13 | パナソニック株式会社 | 表示装置 |
WO2008146470A1 (ja) * | 2007-05-28 | 2008-12-04 | Panasonic Corporation | 有機elデバイス及び表示装置 |
JP4885906B2 (ja) | 2008-05-16 | 2012-02-29 | パナソニック株式会社 | 発光装置の製造方法 |
JP4678421B2 (ja) | 2008-05-16 | 2011-04-27 | ソニー株式会社 | 表示装置 |
EP2429263B1 (en) | 2009-04-09 | 2018-07-18 | Joled Inc. | Organic electroluminescent display device |
JP5574114B2 (ja) | 2009-12-22 | 2014-08-20 | パナソニック株式会社 | 表示装置とその製造方法 |
KR101643009B1 (ko) | 2009-12-22 | 2016-07-27 | 가부시키가이샤 제이올레드 | 표시 장치와 그 제조 방법 |
WO2012049718A1 (ja) | 2010-10-15 | 2012-04-19 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
WO2012049719A1 (ja) | 2010-10-15 | 2012-04-19 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
KR20130073012A (ko) | 2010-10-15 | 2013-07-02 | 파나소닉 주식회사 | 유기 발광 패널과 그 제조 방법, 및 유기 표시 장치 |
CN102577614B (zh) | 2010-10-15 | 2015-11-25 | 株式会社日本有机雷特显示器 | 有机发光面板及其制造方法以及有机显示装置 |
JP5677315B2 (ja) | 2010-10-15 | 2015-02-25 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
-
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- 2009-12-22 JP JP2010543242A patent/JP5574113B2/ja active Active
- 2009-12-22 CN CN200980123220.0A patent/CN102165591B/zh active Active
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- 2011-04-21 US US13/091,667 patent/US8536589B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005267984A (ja) * | 2004-03-17 | 2005-09-29 | Sanyo Electric Co Ltd | 有機el表示装置 |
JP2007310156A (ja) * | 2006-05-18 | 2007-11-29 | Seiko Epson Corp | 膜形成方法、電気光学基板の製造方法、及び電気光学装置の製造方法、並びに機能膜、電気光学基板、電気光学装置、及び電子機器 |
JP2009054608A (ja) * | 2007-08-23 | 2009-03-12 | Dainippon Printing Co Ltd | 有機エレクトロルミネッセンス素子およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018179133A1 (ja) * | 2017-03-29 | 2018-10-04 | シャープ株式会社 | 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置、成膜装置、コントローラ |
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JP5574113B2 (ja) | 2014-08-20 |
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