WO2011069828A1 - Appareil de commande électronique - Google Patents

Appareil de commande électronique Download PDF

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Publication number
WO2011069828A1
WO2011069828A1 PCT/EP2010/068171 EP2010068171W WO2011069828A1 WO 2011069828 A1 WO2011069828 A1 WO 2011069828A1 EP 2010068171 W EP2010068171 W EP 2010068171W WO 2011069828 A1 WO2011069828 A1 WO 2011069828A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
circuit board
electronic control
housing
conductive sheet
Prior art date
Application number
PCT/EP2010/068171
Other languages
German (de)
English (en)
Inventor
Volker Weeber
Heinrich Barth
Ralph Schertlen
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN201080055785.2A priority Critical patent/CN102656961B/zh
Priority to US13/514,705 priority patent/US8929078B2/en
Priority to EP10788276.3A priority patent/EP2510765B1/fr
Priority to IN1784DEN2012 priority patent/IN2012DN01784A/en
Publication of WO2011069828A1 publication Critical patent/WO2011069828A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a control device according to the preamble of claim 1.
  • Such devices are known in a variety of configurations and for different applications. When using such control devices occurs in many areas, the problem of shielding electrical and / or
  • control units in motor vehicles must therefore with regard to their
  • EMC electromagnetic compatibility
  • Circuit components or the entire circuit are covered with a closed shielding box.
  • a closed shielding box is very complex and requires large volumes within the control unit.
  • a Faraday cage is generally understood to mean an all-round or apertured envelope of one
  • An inventive electrically conductive shielding is for example made of sheet metal or a wire mesh.
  • Such an electrically conductive shielding is simple and inexpensive to manufacture and assembly and takes up little space within the housing. Thus, a small and compact structure is possible.
  • the electrically conductive shielding is formed as an electrically conductive sheet metal part, in particular as a deep-drawn part, and has, for example, a hood or cup-like shape. It is preferably mounted on a metal frame which is arranged on the circuit board and surrounds the components or component groups which are shielded by the electrically conductive sheet metal part.
  • the electrically conductive shielding element fulfills other functions in addition to its shielding effect.
  • the electrically conductive shielding element may be used to heat dissipation of power devices or to provide ground potential.
  • the electrically conductive shielding element fulfills several of these functions.
  • Shielding element on the one hand to this backside metallization of Component and on the other hand to ground potential, for example, by appropriate contacts on the circuit board, the ground connection of the wafer level package component can be ensured easily and without additional effort. If the component has no backside metallization, the ground contact can still be produced by connecting the rear side of the component to the electrically conductive shielding element as large as possible over the largest possible area.
  • the shielding element is therefore preferably shaped to be in thermal contact with at least one power device and in thermal contact with the surrounding housing or attached to the housing
  • the electrically conductive shielding member is preferably applied to the housing and further has recesses or elevations which are in position with the position of one or more
  • Power components correspond and are pressed to the power devices.
  • the heat is dissipated from the electrically conductive shielding member to the housing. This way, there are no additional ones
  • Cooling elements or heat-conducting elements on the circuit board necessary.
  • the electrically conductive shielding element preferably consists of a material which, in addition to its electrical
  • Conductivity also has a high heat capacity and a high thermal conductivity.
  • Suitable materials include copper or aluminum.
  • FIG. 1 shows a section through a control device after a first
  • FIG. 2 shows a section through a control device after a second one
  • FIGS. 3a-c respectively show a section and a top view of exemplary embodiments of electrically conductive shielding elements.
  • FIG. 4 shows a detail from FIG. 1.
  • FIG. 1 shows a housing 100 for a control unit 10, which in this example is made of metal.
  • the housing 100 is closed by at least one lid or plug, not shown in itself.
  • a printed circuit board 110 is arranged in the housing 100.
  • the circuit board 110 is in this case
  • Devices such as the capacitor 130 or resistors 140, 142, or active components, such as the power devices 150,160, 162, 164, 192, 194 act.
  • the components are, for example, by lateral connections 135 or by solder balls 154 with those on the circuit board
  • a capacitor 130 On the upper side of the printed circuit board, a capacitor 130, resistors 140, and power devices 150 are arranged.
  • the power devices 150 have only a low power and therefore only a small
  • Component 164 is arranged, which is constructed in wafer-level package construction and which is described in more detail in Figure 4.
  • FIG. 4 shows the electronic component 164, which is constructed in a wafer-level package construction, in detail.
  • the central element of the component 164 is the chip 460.
  • solder balls 430 are arranged on the surface of the chip facing the printed circuit board , which are conductively connected via a contact layer 440 to terminals 410 on the chip 460.
  • a polymer layer 450 is arranged on the contact layer 440.
  • the back side of the chip 460 is provided with a metallic layer 470, the so-called backside metallization.
  • the backside metallization it may be necessary for the backside metallization to be at ground potential, otherwise parasitic currents in the substrate of the chip 460 may cause the circuit to malfunction.
  • the devices 160, 162, 192 and 194 are power devices with high performance and correspondingly high heat development.
  • Power device 160 is in this example in so-called slug-up
  • Construction constructed. It has a metal plate 161, a so-called heat slug, on its side facing away from the printed circuit board 110 side. This heat-slug serves to dissipate heat from the interior of the power device 160 at its surface. Power devices 160 and 162 and passive devices 142 form a group of devices. This group must be shielded from electrical and / or magnetic interference fields in this example.
  • a so-called module 190 also called multi-chip modules (MCM), arranged.
  • MCM multi-chip modules
  • the module 190 consists of a printed circuit board 112 which is smaller and thinner is formed as the circuit board 110, and on the two power devices 192 and 194 are arranged.
  • the power devices 192 and 194 are constructed in wafer-level package design.
  • the module 190 is contacted via solder balls 154 with the circuit board 110.
  • a metal frame 180 is arranged, which surrounds the component group consisting of the power components 160 and 162 and the passive component 142.
  • An electrically conductive sheet metal part 170 is fastened to the metal frame 180 by means of a clip connection 188.
  • the metal frame or the electrically conductive sheet metal part 170 has a circumferential groove into which an extension attached to the respective other part engages in the manner of a tongue and groove connection and thus the electrically conductive sheet metal part 170 is fixed on the metal frame 180.
  • the metal frame 180, the electrically conductive sheet metal part 170 and the printed circuit board 110 together form a Faraday cage for the components 160, 162 and 142, resulting in an effective shielding of electrical and / or magnetic interference fields for these devices 160, 162 and 142.
  • the electrically conductive sheet metal part 170 thus serves as a shielding element.
  • Metal frame 180 and the electrically conductive sheet metal part 170 for example, also be produced by welding or soldering.
  • portions 174 are formed on the electrically conductive sheet metal part 170, which are in thermal contact with the power devices 160, 162, and areas 172, which are in thermal contact with the housing 100.
  • the electrically conductive sheet-metal part 170 is for this purpose designed as a deep-drawn part, which has areal regions 172 which rest against the housing 100.
  • recesses 174 are arranged in the electrically conductive sheet metal part 170. These are also planar and abut against the surfaces of the power devices 160 and 162.
  • an electrically conductive metal frame 184 is arranged, which surrounds the component 164.
  • an electrically conductive sheet metal part 176 is attached. The attachment takes place via a clip connection 188 and is thus electrically conductive.
  • connection between the metal frame 184 and the electrically conductive sheet metal part 176 for example, also be produced by welding or soldering.
  • the metal frame 184, the electrically conductive sheet metal part 176 and the circuit board 110 together form a Faraday cage for the component 164, resulting in an effective shielding of electrical and / or magnetic interference fields.
  • the electrically conductive sheet metal part 176 thus serves as a shielding element.
  • the component 164 is constructed in wafer-level package construction and has on its side facing away from the circuit board 110 a back-side metallization 168th Die
  • Rear side metallization 168 is in conductive electrical contact with the electrically conductive sheet metal part 176.
  • the metal frame 184 and thus also the electrically conductive sheet metal part 176 are connected to ground potential.
  • the backside metallization 168 of the device 164 is also present
  • a conductive metal frame 182 is also arranged on the circuit board 112 on the underside of the circuit board 110.
  • An electrically conductive sheet metal part 178 is fixed on the metal frame 182 by means of a clip connection 188.
  • the connection between the metal frame 182 and the electrically conductive sheet-metal part 178 can also be produced, for example, by welding or soldering.
  • the metal frame 182, the electrically conductive sheet metal part 178 and the small circuit board 112 together form one
  • the electrically conductive sheet metal part 178 thus serves as a shielding.
  • the metal frame 182 is connected via the small circuit board 112 to ground potential.
  • the electrically conductive sheet metal part 178 is so shaped so that it rests in its central region on the two components 192 and 194 and thus both the ground contact for the
  • the electrically conductive sheet-metal part 178 is approximately V-shaped in cross section and is in thermal contact with the housing 100. Heat arising in the power components 192 and 194 is thus absorbed by the electrically conductive sheet metal part 178 in the electrically conductive sheet metal part 178 distributed and derived to the housing 100.
  • the electrically conductive sheet metal part 178 combines the functions of the shield of
  • FIG. 2 shows a second exemplary embodiment of the invention.
  • the structure essentially corresponds to the example from FIG. 1.
  • the same components are provided with the same reference numerals.
  • the housing 200 is made of plastic in this example. It has on its underside an opening 215 which is covered by a metallic heat sink 210.
  • the heat sink 210 forms in a known manner cooling fins 213.
  • the opening 215 and thus also the heat sink 210 are arranged in the immediate vicinity of these power components 160 and 162.
  • the heat dissipation of the power components 160 and 162 takes place via an electrically conductive sheet-metal part 270, which is in thermal contact with the power components 160 and 162 and is in thermal contact with the heat sink 210.
  • the electrically conductive sheet-metal part 270 is designed as a deep-drawn part, which has areal regions 274 which rest against the power components 160 and 162.
  • an elevation 272 is arranged on the electrically conductive sheet-metal part 270. This is also flat and is located on the heat sink
  • a module 290 is arranged.
  • the module consists of a printed circuit board 212 on which two power devices 290 and 292 are arranged.
  • a conductive metal frame 282 is arranged on the circuit board 212.
  • An electrically conductive sheet metal part 278 is mounted on the metal frame 282.
  • the metal frame 282, the electrically conductive sheet metal part 278 and the small circuit board 212 together form a Faraday cage for the components 290 and 292.
  • the metal frame 282 is further over the
  • Printed circuit board 212 connected to ground potential.
  • the electrically conductive sheet metal part 278 abuts against the two components 292 and 294 and thus establishes the ground contact for the backside metallization 268 of the component 292.
  • the power components 292 and 294 are components with low power, so that no heat dissipation to a heat sink via the electrically conductive sheet metal part 278 is necessary. It is sufficient that the heat is discharged into the interior of the housing 200.
  • FIG. 3 shows three exemplary embodiments of electrically conductive shielding elements according to the invention, which are designed as sheet metal parts, in each case in FIG. 3
  • FIG. 3a shows a very simply constructed electrically conductive sheet-metal part 300. It has a substantially pot-shaped construction and has a flat cover area 302, as well as a border area 304, which is substantially perpendicular to the
  • Cover area is formed and extends around the lid portion 302 around.
  • the edge region 304 has a circumferential extension 306, which is suitable for a
  • Clip connection can be used.
  • FIG. 3b shows a further example of an electrically conductive sheet-metal part 310. It has a cover region 312 and a circumferential edge region 314 formed perpendicular to the cover region. The edge region 314 has a circumferential extension 306 which can be used for a clip connection.
  • the lid portion 312 is structured and has a recess 316. This depression is suitably a thermal and / or electrically conductive contact to one or more arranged underneath
  • FIG. 3c shows a continuation of the example from FIG. 3b.
  • the illustrated electrically conductive sheet-metal part 320 has a cover region 322, as well as a circumferential edge region 324 formed perpendicular to the cover region.
  • the edge region 324 has a circumferential extension 306 which is suitable for a
  • the lid portion 322 is structured and has two recesses 326 and 328. This depression is suitable for producing a thermal and / or conductive contact with one or more electronic components arranged underneath.
  • Recesses 326 and 328 are different deep and offset from one another. The respective depth and position is adapted to the overall height and the position of the associated electronic components.
  • FIGS. 3 b and 3 c are as flat as possible in order to ensure a large contact area between the electrically conductive sheet metal part and electronic components provided underneath.
  • the recesses are rectangular in the examples shown, but any other shape is also conceivable, e.g. round, elliptical or L-shaped.
  • thermal contact can be ensured by contact or by a heat transfer medium, such as a thermal grease.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un appareil de commande électronique (10) qui présente des composants électroniques (160, 162) montés sur une carte de circuits (110), qui sont protégés par blindage, des champs perturbateurs électriques et/ou magnétiques. A cet effet, la carte de circuits (110) comporte un élément en tôle électroconductrice (170) qui forme conjointement avec la carte de circuits une cage de Faraday pour les composants électroniques (160, 162). L'élément en tôle électroconductrice (170) est en outre en contact thermique avec les composants électroniques (160, 162) ainsi qu'avec le boîtier (100) de l'appareil de commande (10) et évacue ainsi la chaleur des composants électroniques (160, 162) dans le boîtier (100).
PCT/EP2010/068171 2009-12-10 2010-11-25 Appareil de commande électronique WO2011069828A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201080055785.2A CN102656961B (zh) 2009-12-10 2010-11-25 电子控制设备
US13/514,705 US8929078B2 (en) 2009-12-10 2010-11-25 Electronic control device
EP10788276.3A EP2510765B1 (fr) 2009-12-10 2010-11-25 Appareil de commande électronique
IN1784DEN2012 IN2012DN01784A (fr) 2009-12-10 2010-11-25

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009054517.4 2009-12-10
DE200910054517 DE102009054517B4 (de) 2009-12-10 2009-12-10 Elektronisches Steuergerät

Publications (1)

Publication Number Publication Date
WO2011069828A1 true WO2011069828A1 (fr) 2011-06-16

Family

ID=43607705

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/068171 WO2011069828A1 (fr) 2009-12-10 2010-11-25 Appareil de commande électronique

Country Status (6)

Country Link
US (1) US8929078B2 (fr)
EP (1) EP2510765B1 (fr)
CN (1) CN102656961B (fr)
DE (1) DE102009054517B4 (fr)
IN (1) IN2012DN01784A (fr)
WO (1) WO2011069828A1 (fr)

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DE102009054517A1 (de) 2011-06-16
US20120300405A1 (en) 2012-11-29
EP2510765A1 (fr) 2012-10-17
IN2012DN01784A (fr) 2015-06-05
US8929078B2 (en) 2015-01-06
DE102009054517B4 (de) 2011-12-29
EP2510765B1 (fr) 2013-11-06
CN102656961B (zh) 2015-11-25
CN102656961A (zh) 2012-09-05

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