IN2012DN01784A - - Google Patents
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- Publication number
- IN2012DN01784A IN2012DN01784A IN1784DEN2012A IN2012DN01784A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A IN 1784DEN2012 A IN1784DEN2012 A IN 1784DEN2012A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A
- Authority
- IN
- India
- Prior art keywords
- shielding
- electrically conductive
- electronic component
- conductive shielding
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200910054517 DE102009054517B4 (de) | 2009-12-10 | 2009-12-10 | Elektronisches Steuergerät |
PCT/EP2010/068171 WO2011069828A1 (fr) | 2009-12-10 | 2010-11-25 | Appareil de commande électronique |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2012DN01784A true IN2012DN01784A (fr) | 2015-06-05 |
Family
ID=43607705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1784DEN2012 IN2012DN01784A (fr) | 2009-12-10 | 2010-11-25 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8929078B2 (fr) |
EP (1) | EP2510765B1 (fr) |
CN (1) | CN102656961B (fr) |
DE (1) | DE102009054517B4 (fr) |
IN (1) | IN2012DN01784A (fr) |
WO (1) | WO2011069828A1 (fr) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
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US8451600B1 (en) | 2010-03-04 | 2013-05-28 | Amazon Technologies, Inc. | Heat spreading chassis for rack-mounted computer system |
US9119327B2 (en) * | 2010-10-26 | 2015-08-25 | Tdk-Lambda Corporation | Thermal management system and method |
DE102011075308A1 (de) | 2011-05-05 | 2012-11-08 | Robert Bosch Gmbh | Elektronische Schaltungsanordnung |
WO2013095490A1 (fr) * | 2011-12-22 | 2013-06-27 | Hewlett-Packard Development Company, L.P. | Base et blindage de dissipateur thermique |
EP2820929A4 (fr) | 2012-03-01 | 2015-09-30 | Autoliv Dev | Unité électronique avec pcb et deux parties de boîtier |
JP5733260B2 (ja) * | 2012-04-09 | 2015-06-10 | 株式会社村田製作所 | 電源モジュール |
JP5897765B2 (ja) * | 2012-05-04 | 2016-03-30 | モレックス エルエルシー | 連結されたコネクタシステム |
TW201410127A (zh) * | 2012-08-30 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | 電子設備 |
US9215833B2 (en) * | 2013-03-15 | 2015-12-15 | Apple Inc. | Electronic device with heat dissipating electromagnetic interference shielding structures |
DE102013212446A1 (de) * | 2013-06-27 | 2015-01-15 | Zf Friedrichshafen Ag | Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung zur Ansteuerung einer Last |
US9736967B2 (en) * | 2013-08-07 | 2017-08-15 | Abb S.P.A. | Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus |
JP6075267B2 (ja) * | 2013-10-29 | 2017-02-08 | 日立金属株式会社 | 光アンプモジュール |
JP6278695B2 (ja) * | 2013-12-26 | 2018-02-14 | 株式会社デンソー | 電子制御ユニット、および、これを用いた電動パワーステアリング装置 |
CN105321890A (zh) * | 2014-06-03 | 2016-02-10 | 住友电木株式会社 | 金属基座安装基板以及金属基座安装基板安装部件 |
CN105321898A (zh) * | 2014-06-03 | 2016-02-10 | 住友电木株式会社 | 金属基座安装基板以及金属基座安装基板安装部件 |
DE102014212540A1 (de) * | 2014-06-30 | 2015-12-31 | Robert Bosch Gmbh | Fahrzeug mit verbesserter Batterieabschirmung |
DE102014217552A1 (de) * | 2014-09-03 | 2016-03-03 | Conti Temic Microelectronic Gmbh | Steuergerätevorrichtung für ein Kraftfahrzeug sowie Verfahren zum Herstellen einer solchen |
US20160135282A1 (en) * | 2014-11-07 | 2016-05-12 | Kabushiki Kaisha Toshiba | Electronic apparatus |
JP6328044B2 (ja) * | 2014-12-09 | 2018-05-23 | カルソニックカンセイ株式会社 | 電子ユニット |
DE102015001148B4 (de) | 2015-01-30 | 2019-04-11 | e.solutions GmbH | Anordnung und Verfahren zur elektromagnetischen Abschirmung |
JP6398849B2 (ja) * | 2015-04-06 | 2018-10-03 | 株式会社デンソー | 電子制御装置 |
DE102015206480A1 (de) * | 2015-04-10 | 2016-10-13 | Robert Bosch Gmbh | Steuergerät |
US10061363B2 (en) | 2015-09-04 | 2018-08-28 | Apple Inc. | Combination parallel path heatsink and EMI shield |
JP6528620B2 (ja) * | 2015-09-15 | 2019-06-12 | 株式会社オートネットワーク技術研究所 | 回路構成体および電気接続箱 |
KR101998343B1 (ko) | 2016-02-26 | 2019-07-09 | 삼성전자주식회사 | 냉각 구조를 포함하는 전자 장치 |
US10624240B2 (en) * | 2016-04-29 | 2020-04-14 | Hewlett Packard Enterprise Development Lp | First and second shields for thermal isolation |
US20180042144A1 (en) * | 2016-08-03 | 2018-02-08 | Kuei-Piao Lee | Method of Cooling Electric-Vehicle Controller |
DE102017212968B4 (de) * | 2016-08-05 | 2024-02-01 | Robert Bosch Gmbh | Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren |
DE102016115453B4 (de) * | 2016-08-19 | 2023-10-19 | Krohne Ag | Messgerät mit Wärmeleitvorrichtung, Wärmeleitvorrichtung und Verfahren |
TWM541686U (zh) * | 2016-12-27 | 2017-05-11 | Micro-Star Int'l Co Ltd | 電子裝置 |
JP2019003965A (ja) * | 2017-06-09 | 2019-01-10 | 富士通株式会社 | 電子機器 |
EP3416467B1 (fr) * | 2017-06-13 | 2022-05-04 | ABB Schweiz AG | Structure d'échangeur de chaleur pour un ensemble de support |
US10299405B2 (en) * | 2017-10-02 | 2019-05-21 | Plume Design, Inc. | Mid-spreader for stacked circuit boards in an electronic device |
US10631438B2 (en) | 2017-12-23 | 2020-04-21 | International Business Machines Corporation | Mechanically flexible cold plates for low power components |
JP7016054B2 (ja) * | 2018-01-12 | 2022-02-04 | パナソニックIpマネジメント株式会社 | 電源装置、前照灯、及び移動体 |
US10999957B2 (en) * | 2018-02-12 | 2021-05-04 | Samsung Electro-Mechanics Co., Ltd. | Communication module and mounting structure thereof |
EP3756431A1 (fr) * | 2018-02-19 | 2020-12-30 | InterDigital CE Patent Holdings | Ensemble dissipateur thermique destiné à un dispositif électronique |
DE102018103713A1 (de) * | 2018-02-20 | 2019-08-22 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Mechanisches und thermisches System für eine modulare Batterie mit Leistungselektronikkomponenten |
US11122707B2 (en) * | 2018-07-12 | 2021-09-14 | Arris Enterprises Llc | Raised pathway heat sink |
US10496137B1 (en) * | 2018-09-13 | 2019-12-03 | Fujifilm Sonosite, Inc. | Electronics board mounting system |
JP6945514B2 (ja) * | 2018-09-20 | 2021-10-06 | 日立Astemo株式会社 | 電子制御装置 |
US20220195373A1 (en) * | 2020-12-17 | 2022-06-23 | NearField Atomics Inc. | Incubator with a magnetically-quiet incubator chamber and methods of making and using |
DE102021117920A1 (de) | 2021-07-12 | 2023-01-12 | Valeo Schalter Und Sensoren Gmbh | Detektionsvorrichtung zur Überwachung wenigstens eines Überwachungsbereichs, Gehäuse für eine Detektionsvorrichtung, Fahrzeug mit wenigstens einer Detektionsvorrichtung und Verfahren zur Herstellung einer Detektionsvorrichtung |
DE102022113505A1 (de) | 2022-05-30 | 2023-11-30 | Bayerische Motoren Werke Aktiengesellschaft | Abschirmblech für eine Baugruppe eines Leistungselektronikmodul mit Abstützfunktion |
DE102022207567A1 (de) | 2022-07-25 | 2024-01-25 | Robert Bosch Gesellschaft mit beschränkter Haftung | Elektrische Vorrichtung, insbesondere Steuergerät |
CN117119777A (zh) * | 2023-07-27 | 2023-11-24 | 重庆天概电源科技有限公司 | 电磁屏蔽装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4317469A1 (de) * | 1993-05-26 | 1994-12-01 | Bosch Gmbh Robert | Baugruppe für elektronische Geräte |
US5815371A (en) * | 1996-09-26 | 1998-09-29 | Dell U.S.A., L.P. | Multi-function heat dissipator |
DE69732174T2 (de) * | 1997-03-19 | 2005-12-29 | Telefonaktiebolaget Lm Ericsson (Publ) | Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte |
US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
US7082033B1 (en) * | 1998-02-13 | 2006-07-25 | Micron Technology, Inc. | Removing heat from integrated circuit devices mounted on a support structure |
US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
US6367263B1 (en) * | 2000-05-31 | 2002-04-09 | Intel Corporation | Integrated circuit refrigeration device |
CN1290391C (zh) * | 2000-06-06 | 2006-12-13 | 三菱电机株式会社 | 通信机器的散热构造 |
US6562655B1 (en) * | 2001-04-20 | 2003-05-13 | Amkor Technology, Inc. | Heat spreader with spring IC package fabrication method |
US6740959B2 (en) * | 2001-08-01 | 2004-05-25 | International Business Machines Corporation | EMI shielding for semiconductor chip carriers |
US6881077B2 (en) * | 2002-07-22 | 2005-04-19 | Siemens Vdo Automotive Corporation | Automotive control module housing |
JP4469563B2 (ja) * | 2003-06-05 | 2010-05-26 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器、電磁波放射抑制部材 |
US7746666B2 (en) | 2004-09-27 | 2010-06-29 | Murata Manufacturing Co., Ltd. | Shield case |
JP2006190707A (ja) * | 2004-12-28 | 2006-07-20 | Toshiba Corp | 電子機器とこの電子機器が適用されるテレビジョン受像装置 |
JP4555119B2 (ja) * | 2005-02-22 | 2010-09-29 | アルプス電気株式会社 | 面実装型電子回路ユニット |
CN1845666A (zh) * | 2005-04-07 | 2006-10-11 | 华硕电脑股份有限公司 | 遮蔽结构 |
KR100703090B1 (ko) * | 2005-08-30 | 2007-04-06 | 삼성전기주식회사 | 후면 접지형 플립칩 반도체 패키지 |
US7651938B2 (en) * | 2006-06-07 | 2010-01-26 | Advanced Micro Devices, Inc. | Void reduction in indium thermal interface material |
US20080310114A1 (en) * | 2007-06-18 | 2008-12-18 | Lucent Technologies Inc. | Heat-transfer device for an electromagnetic interference (emi) shield using conductive bristles |
US20090002949A1 (en) * | 2007-06-29 | 2009-01-01 | Lucent Technologies Inc. | Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation |
CN101150123B (zh) * | 2007-10-31 | 2010-06-02 | 日月光半导体制造股份有限公司 | 具有电磁屏蔽罩盖的半导体封装结构 |
US8507319B2 (en) * | 2007-12-07 | 2013-08-13 | Stats Chippac Ltd. | Integrated circuit package system with shield |
TWI370722B (en) * | 2008-12-22 | 2012-08-11 | Unihan Corp | Electromagnetic shielding device with heat dissipating |
-
2009
- 2009-12-10 DE DE200910054517 patent/DE102009054517B4/de not_active Expired - Fee Related
-
2010
- 2010-11-25 US US13/514,705 patent/US8929078B2/en not_active Expired - Fee Related
- 2010-11-25 IN IN1784DEN2012 patent/IN2012DN01784A/en unknown
- 2010-11-25 CN CN201080055785.2A patent/CN102656961B/zh not_active Expired - Fee Related
- 2010-11-25 EP EP10788276.3A patent/EP2510765B1/fr not_active Not-in-force
- 2010-11-25 WO PCT/EP2010/068171 patent/WO2011069828A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US8929078B2 (en) | 2015-01-06 |
CN102656961B (zh) | 2015-11-25 |
US20120300405A1 (en) | 2012-11-29 |
EP2510765A1 (fr) | 2012-10-17 |
EP2510765B1 (fr) | 2013-11-06 |
WO2011069828A1 (fr) | 2011-06-16 |
CN102656961A (zh) | 2012-09-05 |
DE102009054517A1 (de) | 2011-06-16 |
DE102009054517B4 (de) | 2011-12-29 |
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