MX2015016621A - Estructura de proteccion de circuito y dispositivo electronico. - Google Patents

Estructura de proteccion de circuito y dispositivo electronico.

Info

Publication number
MX2015016621A
MX2015016621A MX2015016621A MX2015016621A MX2015016621A MX 2015016621 A MX2015016621 A MX 2015016621A MX 2015016621 A MX2015016621 A MX 2015016621A MX 2015016621 A MX2015016621 A MX 2015016621A MX 2015016621 A MX2015016621 A MX 2015016621A
Authority
MX
Mexico
Prior art keywords
circuit
circuit unit
conductive
grounding
frame
Prior art date
Application number
MX2015016621A
Other languages
English (en)
Inventor
Hui Li
Yang Dawei
Zhu Dan
Xu Chunli
Original Assignee
Xiaomi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiaomi Inc filed Critical Xiaomi Inc
Publication of MX2015016621A publication Critical patent/MX2015016621A/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064Earth or grounding circuit
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0277Details of the structure or mounting of specific components for a printed circuit board assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Se divulga una estructura de protección de circuito; la estructura de protección de circuito comprende: un tablero de circuitos impresos PCB, que tiene sobre el mismo una unidad de circuito y un alambre a tierra que rodea a la unidad de circuito; un alojamiento conductivo, que tiene una cavidad receptora para recibir la unidad de circuito; y una capa adhesiva conductiva, proporcionada entre el alambre a tierra y el alojamiento conductivo para conexión eléctrica entre el alambre a tierra y el alojamiento conductivo; en la presente divulgación la unidad de circuito está protegida formando una estructura de jaula de Faraday por medio de la combinación del alojamiento conductivo, la capa adhesiva conductiva y el alambre a tierra sobre el PCB, con el propósito de blindar la radiación electromagnética para eliminar o reducir la interferencia radiativa electromagnética sobre la unidad de circuito, sin incrementar el peso y el tamaño del producto a causa de la cubierta conductiva de blindaje adicional, y así mejorar la competitividad del producto.
MX2015016621A 2015-05-21 2015-09-23 Estructura de proteccion de circuito y dispositivo electronico. MX2015016621A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510263801.1A CN104837327A (zh) 2015-05-21 2015-05-21 电路保护结构及电子装置
PCT/CN2015/090382 WO2016183991A1 (zh) 2015-05-21 2015-09-23 电路保护结构及电子装置

Publications (1)

Publication Number Publication Date
MX2015016621A true MX2015016621A (es) 2017-02-23

Family

ID=53814880

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015016621A MX2015016621A (es) 2015-05-21 2015-09-23 Estructura de proteccion de circuito y dispositivo electronico.

Country Status (9)

Country Link
US (1) US20160344444A1 (es)
EP (1) EP3096594A1 (es)
JP (1) JP2017521876A (es)
KR (1) KR20160149133A (es)
CN (1) CN104837327A (es)
BR (1) BR112015029948A2 (es)
MX (1) MX2015016621A (es)
RU (1) RU2632240C2 (es)
WO (1) WO2016183991A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN105898979A (zh) * 2015-12-09 2016-08-24 乐视致新电子科技(天津)有限公司 焊接导电散热片的pcb板装置、导电散热片及焊接方法
CN105592679B (zh) 2016-03-09 2018-07-13 深圳市华星光电技术有限公司 Pcb固定结构及液晶显示装置
US10299416B2 (en) * 2016-06-28 2019-05-21 Microsoft Technology Licensing, Llc Shield for electronic components
CN106612610B (zh) * 2016-12-05 2019-05-07 上海阿莱德实业股份有限公司 一种电路的屏蔽结构
US10410452B2 (en) 2017-05-16 2019-09-10 Gentex Corporation Battery module housing and packaging
CN108200755A (zh) * 2018-01-17 2018-06-22 珠海博杰电子股份有限公司 一种双层屏蔽箱
US10753973B2 (en) * 2018-04-18 2020-08-25 Ase Test, Inc. Test apparatus and method for operating the same
CN114823238B (zh) * 2022-06-29 2022-11-04 深圳市恒讯通电子有限公司 一种具备过载保护的电磁电开关
CN117559136B (zh) * 2024-01-12 2024-04-02 成都天锐星通科技有限公司 天线终端和电子设备

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
JPH0821788B2 (ja) * 1989-09-18 1996-03-04 北川工業株式会社 シール・シールド構造
DE4320527A1 (de) * 1992-06-22 1993-12-23 Whitaker Corp Elektrisch leitfähiges Gel
JPH06260785A (ja) * 1993-03-04 1994-09-16 Oki Electric Ind Co Ltd 基板シールド構造
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
EP0806891B1 (en) * 1996-05-08 1999-03-10 W.L. GORE & ASSOCIATES, INC. A lid assembly for shielding electronic components from EMI/RFI interferences
JP2898603B2 (ja) * 1996-07-02 1999-06-02 三菱電機株式会社 回路基板用シールド機構
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
JP2828059B2 (ja) * 1996-08-28 1998-11-25 日本電気株式会社 ヒートシンクの実装構造
CN1126060C (zh) * 1998-05-19 2003-10-29 因芬尼昂技术股份公司 用于检测生物测量学特征,特别是指纹的传感器装置
JP3270028B2 (ja) * 1999-09-10 2002-04-02 株式会社ソニー・コンピュータエンタテインメント 電磁シールド板、電磁シールド構造体及びエンタテインメント装置
JP3630595B2 (ja) * 1999-10-14 2005-03-16 信越ポリマー株式会社 電磁波シールド成形品
US6646199B2 (en) * 1999-10-20 2003-11-11 Chemque, Inc. Polymeric foam gaskets and seals
NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
JP2004158650A (ja) * 2002-11-06 2004-06-03 Nec Corp 電磁波シールド及び防水構造型筐体
CN101091425A (zh) * 2003-02-26 2007-12-19 波零公司 将emi屏蔽连接到印刷电路板及接地的方法和装置
JP2005268428A (ja) * 2004-03-17 2005-09-29 Mitsubishi Electric Corp 基板の電磁シールド構造
US7514774B2 (en) * 2006-09-15 2009-04-07 Hong Kong Applied Science Technology Research Institute Company Limited Stacked multi-chip package with EMI shielding
KR101059820B1 (ko) * 2007-01-31 2011-08-26 삼성전자주식회사 화상형성기기
TWI375509B (en) * 2008-10-13 2012-10-21 Askey Computer Corp A circuit board having an isolation cover and a method for assembling
US20120188727A1 (en) * 2011-01-24 2012-07-26 ADL Engineering Inc. EMI Shielding in a Package Module
JP2012182227A (ja) * 2011-02-28 2012-09-20 Panasonic Corp パッキン部材
US20130322029A1 (en) * 2012-05-30 2013-12-05 Dror Hurwitz Multilayer electronic structure with integral faraday shielding
JP2015065343A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN204634156U (zh) * 2015-05-21 2015-09-09 小米科技有限责任公司 电路保护结构及电子装置

Also Published As

Publication number Publication date
WO2016183991A1 (zh) 2016-11-24
RU2632240C2 (ru) 2017-10-04
KR20160149133A (ko) 2016-12-27
BR112015029948A2 (pt) 2017-07-25
RU2015153023A (ru) 2017-06-20
JP2017521876A (ja) 2017-08-03
US20160344444A1 (en) 2016-11-24
CN104837327A (zh) 2015-08-12
EP3096594A1 (en) 2016-11-23

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