WO2016183991A1 - 电路保护结构及电子装置 - Google Patents

电路保护结构及电子装置 Download PDF

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Publication number
WO2016183991A1
WO2016183991A1 PCT/CN2015/090382 CN2015090382W WO2016183991A1 WO 2016183991 A1 WO2016183991 A1 WO 2016183991A1 CN 2015090382 W CN2015090382 W CN 2015090382W WO 2016183991 A1 WO2016183991 A1 WO 2016183991A1
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WO
WIPO (PCT)
Prior art keywords
conductive
circuit
frame
grounding
housing
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PCT/CN2015/090382
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English (en)
French (fr)
Inventor
杨大伟
李晖
朱丹
许春利
Original Assignee
小米科技有限责任公司
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Publication date
Application filed by 小米科技有限责任公司 filed Critical 小米科技有限责任公司
Priority to BR112015029948A priority Critical patent/BR112015029948A2/pt
Priority to JP2017518400A priority patent/JP2017521876A/ja
Priority to KR1020157032919A priority patent/KR20160149133A/ko
Priority to RU2015153023A priority patent/RU2632240C2/ru
Priority to MX2015016621A priority patent/MX2015016621A/es
Publication of WO2016183991A1 publication Critical patent/WO2016183991A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Definitions

  • the present disclosure relates to the field of communication circuit technologies, and in particular, to a circuit protection structure and an electronic device for shielding electromagnetic radiation.
  • Noise in a circuit generally refers to redundant electrical signals that distort the purity of the desired signal.
  • conduction and radiation transmits noise from one place to another through a conductor, such as a wire, a printed circuit, a metal casing of a device, a metal frame of a device, or a component in a circuit.
  • the latter by means of air or other dielectric, propagates noise from one place to another.
  • radiated noise ie, electromagnetic radiation
  • Shielding, filtering, ground design, and overall layout are several effective ways to reduce noise.
  • the conducted noise is usually filtered out using traditional circuit technology; the radiated noise is minimized by the shielding method.
  • conducted noise since it is generally known where conducted noise exists in the system, it can be solved by adding a filter circuit as needed. However, it is very difficult to radiate noise, because it is usually diffused in the whole system.
  • radiation noise the radiation noise of the system can usually be controlled by adding a shielded conductive mask, but adding a shielded conductive mask will increase the product's Weight and volume, and increase the extra cost of the product, reducing the competitive advantage of the product.
  • the present disclosure proposes a circuit protection structure and an electronic device of a novel structure to solve the above technical problems.
  • a circuit protection structure including:
  • PCB printed circuit board having a circuit unit and a grounding circuit frame enclosed by the circuit unit
  • a conductive housing having a receiving cavity for receiving the circuit unit
  • a conductive bonding layer is disposed between the grounding circuit frame and the conductive housing to electrically connect the grounding circuit frame to the conductive housing.
  • the conductive bonding layer coincides with the grounding circuit frame.
  • the conductive bonding layer coincides with an outer edge of the conductive housing.
  • the conductive bonding layer is a first conductive foam, wherein opposite sides of the first conductive foam are divided into two Do not stick between the conductive housing and the grounding circuit frame.
  • the conductive bonding layer is a first conductive silicone, wherein opposite sides of the first conductive silicone are respectively adhered between the conductive housing and the grounding circuit frame.
  • the conductive bonding layer comprises a second conductive foam and a second conductive silicone bonded to each other, wherein the second conductive foam is adhered to the conductive shell, and the second conductive silicone Stick to the grounding wire frame.
  • the conductive bonding layer comprises a third conductive foam and a third conductive silicone bonded to each other, wherein the third conductive foam is adhered to the ground circuit frame, and the third conductive silicone Adhesive to the conductive housing.
  • the grounding circuit frame has a line width of no more than 5 mm.
  • an electronic device includes a housing and at least one circuit protection structure disposed in the housing, the circuit protection structure including:
  • PCB printed circuit board having a circuit unit and a grounding circuit frame enclosed by the circuit unit
  • a conductive housing having a receiving cavity for receiving the circuit unit
  • a conductive bonding layer is disposed between the grounding circuit frame and the conductive housing to electrically connect the grounding circuit frame to the conductive housing.
  • the conductive bonding layer coincides with the grounding circuit frame.
  • the circuit unit that needs to be protected in the present disclosure forms a Faraday cage structure through a combination of a conductive shell, a conductive bonding layer, and a grounding circuit frame on the PCB to achieve shielding electromagnetic radiation to eliminate or reduce electromagnetic Radiation interferes with the circuit unit and avoids increasing the weight and volume of the product by adding a shielded conductive mask, thereby increasing the competitive advantage of the product.
  • FIG. 1 is a partial structural schematic view of an angle of a circuit protection structure of the present disclosure
  • FIG. 2 is a schematic view showing the overall structure of the circuit protection structure of the present disclosure at another angle;
  • FIG. 3 is a schematic exploded view showing an embodiment of a circuit protection structure according to the present disclosure
  • FIG. 4 is a schematic exploded view showing still another embodiment of the circuit protection structure of the present disclosure.
  • FIG. 5 is a schematic exploded view showing still another embodiment of the circuit protection structure of the present disclosure.
  • FIG. 6 is a schematic exploded view of still another embodiment of the circuit protection structure of the present disclosure.
  • first, second, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.
  • first information may also be referred to as second information without departing from the scope of the present disclosure.
  • second information may also be referred to as first information.
  • word "if” as used herein may be interpreted as "when” or “when” or “in response to a determination.”
  • FIG. 1 is a partial structural view of the circuit protection structure of the present disclosure
  • FIG. 2 is a schematic view of the overall structure of the circuit protection structure of the present disclosure.
  • the circuit protection structure of the present disclosure utilizes the Faraday cage principle to close and enclose the circuit unit 111 on the PCB (Printed Circuit Board) 11 to shield the external electromagnetic radiation from electromagnetic interference to the circuit unit 111.
  • the circuit unit 111 may be a CPU unit, an audio circuit unit, a video circuit unit, or the like.
  • the circuit protection structure of the present disclosure includes a PCB 11 , a ground wiring frame 12 , a conductive housing 14 , and a conductive bonding layer 13 .
  • the PCB 11 has a circuit unit 111 and a grounding circuit frame 12 enclosing the circuit unit 111.
  • the grounding circuit frame 12 is formed on the PCB 11 as a partial printed circuit on the PCB 11.
  • the grounding circuit frame 12 can be connected to the PCB 11.
  • the main ground line is connected and can also be connected directly to the ground.
  • the line width of the grounding wire frame 12 is no more than 5 mm.
  • the width of the grounding wire frame 12 is about 2 mm.
  • the grounding wire frame 12 is a closed structure and is located on the circumferential side of the circuit unit 111.
  • the conductive housing 14 has an accommodating cavity for accommodating the circuit unit 111.
  • the depth of the accommodating cavity ie, the dimension of the conductive housing 14 toward the mounting direction of the circuit unit 111) is not less than the highest in the circuit unit 111.
  • the height of the component preferably, in order to have a thinner size of the electronic device having the circuit protection structure, the depth of the accommodating cavity is equal to or slightly larger than the height of the highest component in the circuit unit 111.
  • the conductive housing 14 of the present disclosure is sealed on the grounding circuit frame 12 by the conductive bonding layer 13.
  • the conductive housing 14 can be further fixed by screws or the like at a later stage.
  • the conductive bonding layer 13 is disposed on the ground.
  • the grounding frame 12 and the conductive housing 14 are electrically connected between the circuit frame 12 and the conductive housing 14 such that the protective circuit structure forms a Faraday cage structure to prevent the circuit unit 111 from being subjected to electromagnetic radiation.
  • the conductive bonding layer 13 of the present disclosure coincides with the grounding wire frame 12, and further, the conductive bonding layer 13 coincides with the outer edge of the conductive housing 14.
  • the shape and size of the side surface of the conductive housing 14 in contact with the conductive bonding layer 13 are the same as the shape and size of the grounding circuit frame 12, so that the conductive bonding layer 13 and the grounding circuit frame 14 are optimally achieved.
  • the line transmission effect avoids the effect that the connection of the conductive bonding layer 13 is too wide and the other lines on the PCB 11 cause the wiring connection to be disordered or the width of the conductive bonding layer 13 is too narrow to affect the electrical signal transmission.
  • the conductive adhesive layer 13 is a first conductive foam 131, and opposite sides of the first conductive foam 131 are respectively adhered to the conductive shell. 14 and the grounding circuit frame 12, wherein the opposite sides of the first conductive foam 131 comprise conductive double-sided tape, so that the first conductive foam 131 can connect the conductive housing 14 and the grounding circuit frame 12 Bond and make electrical connections.
  • the first conductive foam 131 can connect the conductive housing 14 and the grounding circuit frame 12 Bond and make electrical connections.
  • One side of the first conductive foam 131 is attached to the conductive housing 14 to form a closed Faraday cage structure, and more importantly, a conductive foam is used.
  • the utility model has the advantages of good electrical conductivity and large elasticity, can effectively fill the small gap between the conductive housing 14 and the PCB 11, and fully contact between the conductive housing 14 and the PCB 11, thereby effectively overcoming the installation process on the PCB 11.
  • the conductive adhesive layer 13 is a first conductive silica gel 132 , wherein the opposite sides of the first conductive silica gel 132 are respectively adhered. Between the conductive housing 14 and the grounding wire frame 12, the conductive housing 14 is bonded to the grounding wire frame 12 through the first conductive silicone 132 and electrically connected.
  • the first conductive silica gel 132 is respectively attached to the conductive housing 14 and the grounding circuit frame 12 to form a closed Faraday cage structure, so that the conductive housing 14 and the PCB 11 are in sufficient contact, thereby effectively
  • the problem that the contact between the conductive housing 14 and the PCB 11 due to the deformation of the PCB 11 during the PCB 11 mounting process is insufficient to make the shielding effect worse is overcome.
  • the conductive bonding layer 13 includes a second conductive foam 133 and a second conductive silicone 134 which are bonded to each other, wherein the second The conductive foam 133 is adhered to the conductive housing 14 and the second conductive silicone 134 is adhered to the grounding circuit frame 12.
  • one side of the second conductive foam 133 is bonded to the second conductive silicone 134, and the other side of the second conductive foam 133 is bonded to the conductive housing 14, the second conductive silicone 134 and the second
  • the other side of the conductive foam 133 bonded to the opposite side is bonded to the grounding circuit frame 12 to form a closed Faraday cage structure, and the conductive foam has the same good electrical conductivity and elasticity, and can effectively
  • the small gap existing after the conductive connection between the conductive housing 14 and the PCB 11 is filled, so that the conductive housing 14 and the PCB 11 are in sufficient contact, so that the conductive housing 14 caused by the deformation of the PCB 11 during the PCB 11 mounting process can be effectively overcome.
  • the problem of insufficient contact with the ground of the PCB 11 is that the shielding effect is deteriorated.
  • the conductive bonding layer 13 includes a third conductive foam 135 and a third conductive silicone 136 which are bonded to each other, wherein the third The conductive foam 135 is adhered to the grounding wire frame 12, and the third conductive silicone 136 is adhered to the conductive housing 14.
  • one side of the third conductive foam 135 is bonded to the third conductive silicone 136, and the other side of the third conductive foam 135 is bonded to the ground wiring frame 12, the third conductive silicone 136 and the third.
  • the other side of the conductive foam 135 bonded to one side opposite to the conductive shell 14 is bonded to the conductive housing 14 to form a closed Faraday cage structure, and the same conductive foam has good electrical conductivity and elasticity, and can effectively
  • the ground contact of the PCB 11 is insufficient to make the shielding effect worse.
  • an electronic device includes a housing and at least one circuit protection structure disposed in the housing, where the circuit protection structure is any of the foregoing embodiments.
  • the circuit protection structure in particular, the circuit protection structure comprises: a printed circuit board PCB11, a grounding circuit frame 12, a conductive housing 14 and a grounding circuit frame 12 and the conductive housing 14 for grounding the circuit frame 12 is a conductive bonding layer 13 electrically connected to the conductive housing 14 , wherein the PCB 11 has a circuit unit 111 and is enclosed by the circuit unit 111 Ground line frame 12.
  • the conductive bonding layer 13 coincides with the orthographic projection of the grounding wire frame 12 on the PCB 11, that is, the conductive bonding layer coincides with the grounding circuit frame.
  • the structure and material selection of the conductive bonding layer 13 and the conductive bonding layer 13 of the circuit protection unit 111 are the same, and will not be described herein.
  • the circuit unit to be protected in the present disclosure forms a Faraday cage structure through a combination of a conductive shell, a conductive bonding layer, and a grounding wire frame to achieve shielding electromagnetic radiation to eliminate or reduce electromagnetic radiation interference to the circuit unit, and to avoid By adding a shielded conductive mask to increase the weight and volume of the product, the competitive advantage of the product is enhanced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本公开公开了一种电路保护结构，包括：印刷电路板PCB，其上具有电路单元和围合于所述电路单元的接地线路框；导电壳体，具有容置所述电路单元的容置腔体；导电粘接层，设置于所述接地线路框及所述导电壳体之间以供所述接地线路框与所述导电壳体电气连接。本公开中需要保护的电路单元通过导电壳体、导电粘接层、及PCB上的接地线路框的组合方式以形成法拉第笼结构，实现屏蔽电磁辐射以消除或者降低电磁辐射对电路单元干扰的目的，并且避免通过添加屏蔽导电面罩增加产品的重量和体积，从而提高了产品竞争优势。

Description

电路保护结构及电子装置
本申请基于申请号为201510263801.1、申请日为2015年05月21日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开涉及通信电路技术领域，尤其涉及一种屏蔽电磁辐射的电路保护结构及电子装置。
背景技术
电路中的“噪声”通常泛指那些会使所需信号的纯净度失真的多余的电气信号。噪声有两种传播方式：传导和辐射，前者通过导体将噪声从一处传播至另一处，例如：一节导线、一段印刷电路、设备金属外壳、设备金属机架、或者电路中的元器件等；而后者则借助于空气或其它电介质将噪声从一处传播至另一处。另外，当传导噪声遇到一个适配的天线通常会转化为辐射噪声(即电磁辐射)。
屏蔽、滤波、地线设计和整体布局等是降低噪声的几种有效方法。其中，传导噪声通常利用传统的电路技术加以滤出；辐射噪声则利用屏蔽方法将其最小化。对于传导噪声，由于通常知道传导噪声存在于系统何处，因此根据需要通过增加滤波电路就可以解决。然而对辐射噪声却很难办，因为它通常弥漫于整个系统之中，现有技术中，针对辐射噪音，通常可以通过外加屏蔽导电面罩控制系统的辐射噪声，但是添加屏蔽导电面罩会增加产品的重量和体积，而且增加了产品的额外成本，降低了产品的竞争优势。
发明内容
有鉴于此，本公开提出一种新型结构的电路保护结构及电子装置，以解决上述技术问题。
为了到达上述目的，本公开所采用的技术方案为：
根据本公开实施例的第一方面，提出一种电路保护结构，包括：
印刷电路板PCB，其上具有电路单元和围合于所述电路单元的接地线路框；
导电壳体，具有容置所述电路单元的容置腔体；
导电粘接层，设置于所述接地线路框及所述导电壳体之间以供所述接地线路框与所述导电壳体电气连接。
可选的，所述导电粘接层与所述接地线路框相重合。
可选的，所述导电粘接层与所述导电壳体的外缘相重合。
可选的，所述导电粘接层为第一导电泡棉，其中，所述第一导电泡棉的相对两侧面分 别粘黏于所述导电壳体和所述接地线路框之间。
可选的，所述导电粘接层为第一导电硅胶，其中，所述第一导电硅胶的相对两侧面分别粘黏于所述导电壳体和所述接地线路框之间。
可选的，所述导电粘接层包括相互贴合的第二导电泡棉和第二导电硅胶，其中，所述第二导电泡棉粘黏于所述导电壳体，所述第二导电硅胶粘黏于所述接地线路框。
可选的，所述导电粘接层包括相互贴合的第三导电泡棉和第三导电硅胶，其中，所述第三导电泡棉粘黏于所述接地线路框，所述第三导电硅胶粘黏于所述导电壳体。
可选的，所述接地线路框的线宽不大于5mm。
根据本公开实施例的第二方面，提出一种电子装置，包括壳体以及装设于所述壳体内的至少一个电路保护结构，所述电路保护结构包括：
印刷电路板PCB，其上具有电路单元和围合于所述电路单元的接地线路框；
导电壳体，具有容置所述电路单元的容置腔体；
导电粘接层，设置于所述接地线路框及所述导电壳体之间以供所述接地线路框与所述导电壳体电气连接。
可选的，所述导电粘接层与所述接地线路框相重合。
与现有技术相比，本公开中需要保护的电路单元通过导电壳体、导电粘接层、及PCB上的接地线路框的组合方式以形成法拉第笼结构，实现屏蔽电磁辐射以消除或者降低电磁辐射对电路单元干扰的目的，并且避免通过添加屏蔽导电面罩增加产品的重量和体积，从而提高了产品竞争优势。
附图说明
图1为本公开电路保护结构一角度的部分结构示意图；
图2为本公开电路保护结构又一角度的整体结构示意图；
图3为本公开电路保护结构一实施例的分解结构示意图；
图4为本公开电路保护结构又一实施例的分解结构示意图；
图5为本公开电路保护结构又一实施例的分解结构示意图；
图6为本公开电路保护结构又一实施例的分解结构示意图。
具体实施方式
以下将结合附图所示的具体实施方式对本公开进行详细描述。但这些实施方式并不限制本公开，本领域的普通技术人员根据这些实施方式所做出的结构、方法、或功能上的变换均包含在本公开的保护范围内。
在本公开使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本公开。在本公开和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。还应当理解，本文中使用的术语“和/或”是 指并包含一个或多个相关联的列出项目的任何或所有可能组合。
应当理解，尽管在本公开可能采用术语第一、第二等来描述各种信息，但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如，在不脱离本公开范围的情况下，第一信息也可以被称为第二信息，类似地，第二信息也可以被称为第一信息。取决于语境，如在此所使用的词语“如果”可以被解释成为“在……时”或“当……时”或“响应于确定”。
如图1和图2所示，图1为本公开电路保护结构一角度的部分结构示意图；图2为本公开电路保护结构又一角度的整体结构示意图。本公开的电路保护结构利用法拉第笼原理对PCB(Printed Circuit Board，印刷电路板)11上的电路单元111进行闭合封装，以使对外界电磁辐射进行屏蔽，避免电磁辐射对电路单元111的干扰。其中，该电路单元111可以为CPU单元、音频电路单元、视频电路单元等。
具体地，根据本公开实施例的第一方面，本公开的电路保护结构包括：PCB11，接地线路框12，导电壳体14以及导电粘接层13。其中，该PCB11上具有电路单元111和围合于电路单元111的接地线路框12，该接地线路框12形成于PCB11上、为PCB11上的部分印刷电路，该接地线路框12可以与PCB11上的主接地线路相连，也可以直接与地相连。在本公开的实施例中，该接地线路框12的线宽不大于5mm，较佳地，该接地线路框12的宽度为2mm左右。
进一步地，该接地线路框12为一闭合结构且位于该电路单元111的周侧。另外，该导电壳体14具有容置该电路单元111的容置腔体，该容置腔体的深度(即导电壳体14朝向电路单元111的装配方向的尺寸)不小于电路单元111中最高元器件的高度，优选地，为了使具有该电路保护结构的电子装置具有较薄的尺寸，该容置腔体的深度等于或者略大于电路单元111中最高元器件的高度。
进一步地，本公开导电壳体14通过导电粘接层13密封于接地线路框12上，当然，后期还可以通过螺钉等对该导电壳体14进行进一步固定，该导电粘接层13设置于接地线路框12及导电壳体14之间以供接地线路框12与导电壳体14电气连接，从而使该保护电路结构形成法拉第笼结构，避免该电路单元111受到电磁辐射。可选的，本公开的导电粘接层13与接地线路框12相重合，进一步地，该导电粘接层13与导电壳体14的外缘相重合。该导电壳体14与导电粘接层13相接触部分侧面的形状及大小与接地线路框12的形状及大小均一致，如此设置以使导电粘接层13与接地线路框14达到一个最佳的线路传输效果，避免因该导电粘接层13的宽度过宽与PCB11上的其他线路相连造成线路连接混乱或者因导电粘接层13的宽度过窄影响电气信号传输的效果。
如图1至图3所示，在本公开的一实施例中，该导电粘接层13为第一导电泡棉131，该第一导电泡棉131的相对两侧面分别粘黏于导电壳体14和接地线路框12之间，其中，该第一导电泡棉131的相对两侧面上包括导电双面胶，以使该第一导电泡棉131可以将导电壳体14和接地线路框12相粘合并实现电气连接。该实施例中，通过将第一导电泡棉131 的一侧面贴合在接地线路框12上，并通过将第一导电泡棉131另一侧面贴合在导电壳体14上，以形成闭合的法拉第笼结构，更重要的是，利用导电泡棉具有良好导电性及弹性大的特点，能够有效地填补导导电壳体14和PCB11之间的微小间隙，使导电壳体14与PCB11之间充分的接触，从而可以有效地克服了在PCB11安装过程中PCB11的变形而导致的导电壳体14与PCB11的地接触不充分使屏蔽效果变差的问题。
如图1、图2和图4所示，在本公开的又一实施例中，该导电粘接层13为第一导电硅胶132，其中，该第一导电硅胶132的相对两侧面分别粘黏于导电壳体14和接地线路框12之间，以通过该第一导电硅胶132将导电壳体14与接地线路框12相粘合并实现电气连接。在该实施例中，通过第一导电硅胶132分别贴合于导电壳体14和接地线路框12以形成闭合的法拉第笼结构，使导电壳体14与PCB11之间充分的接触，从而可以有效地克服了在PCB11安装过程中PCB11的变形而导致的导电壳体14与PCB11的地接触不充分使屏蔽效果变差的问题。
如图1、图2和图5所示，在本公开的又一实施例中，该导电粘接层13包括相互贴合的第二导电泡棉133和第二导电硅胶134，其中，第二导电泡棉133粘133黏于导电壳体14，第二导电硅胶134粘黏于接地线路框12。在该实施例中，第二导电泡棉133的一侧面粘合于第二导电硅胶134，第二导电泡棉133的另一侧面粘合于导电壳体14，第二导电硅胶134与第二导电泡棉133相粘合的一侧面相背的另一侧面粘合于接地线路框12以形成闭合的法拉第笼结构，同样的利用导电泡棉具有良好导电性及弹性大的特点，能够有效地填补导导电壳体14和PCB11电气连接后存在的微小间隙，使导电壳体14与PCB11之间充分的接触，从而可以有效地克服了在PCB11安装过程中PCB11的变形而导致的导电壳体14与PCB11的地接触不充分使屏蔽效果变差的问题。
如图1、图2和图6所示，在本公开的又一实施例中，该导电粘接层13包括相互贴合的第三导电泡棉135和第三导电硅胶136，其中，第三导电泡棉135粘黏于接地线路框12，第三导电硅胶136粘黏于导电壳体14。在该实施例中，第三导电泡棉135的一侧面粘合于第三导电硅胶136，第三导电泡棉135的另一侧面粘合于接地线路框12，第三导电硅胶136与第三导电泡棉135相粘合的一侧面相背的另一侧面粘合于导电壳体14以形成闭合的法拉第笼结构，同样的利用导电泡棉具有良好导电性及弹性大的特点，能够有效地填补导电壳体14和PCB11电气连接后存在的微小间隙，使导电壳体14与PCB11之间充分的接触，从而可以有效地克服了在PCB11安装过程中PCB11的变形而导致的导电壳体14与PCB11的地接触不充分使屏蔽效果变差的问题。
进一步的，根据本公开实施例的第二方面，还提出一种电子装置，包括壳体以及装设于壳体内的至少一个电路保护结构，该电路保护结构即为上述任一项实施例中的电路保护结构，具体地，该电路保护结构包括：印刷电路板PCB11，接地线路框12，导电壳体14以及设置于所述接地线路框12及所述导电壳体14之间以供接地线路框12与导电壳体14电气连接的导电粘接层13，其中，PCB11上具有电路单元111和围合于电路单元111的 接地线路框12。优选地，该导电粘接层13与接地线路框12在PCB11上的正投影相重合，即导电粘接层与接地线路框相重合。在本实施例中，该导电粘接层13与上述电路保护单元111的导电粘接层13的结构及选材均相同，在此就不再赘述。
本公开中需要保护的电路单元通过导电壳体、导电粘接层、及接地线路框的组合方式以形成法拉第笼结构，实现屏蔽电磁辐射以消除或者降低电磁辐射对电路单元干扰的目的，并且避免通过添加屏蔽导电面罩增加产品的重量和体积，从而提高了产品竞争优势。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由本申请的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (10)

  1. 一种电路保护结构，其特征在于，包括：
    印刷电路板PCB，其上具有电路单元和围合于所述电路单元的接地线路框；导电壳体，具有容置所述电路单元的容置腔体；
    导电粘接层，设置于所述接地线路框及所述导电壳体之间以供所述接地线路框与所述导电壳体电气连接。
  2. 根据权利要求1所述的电路保护结构，其特征在于，所述导电粘接层与所述接地线路框相重合。
  3. 根据权利要求1或2所述的电路保护结构，其特征在于，所述导电粘接层与所述导电壳体的外缘相重合。
  4. 根据权利要求3所述的电路保护结构，其特征在于，所述导电粘接层为第一导电泡棉，其中，所述第一导电泡棉的相对两侧面分别粘黏于所述导电壳体和所述接地线路框之间。
  5. 根据权利要求3所述的电路保护结构，其特征在于，所述导电粘接层为第一导电硅胶，其中，所述第一导电硅胶的相对两侧面分别粘黏于所述导电壳体和所述接地线路框之间。
  6. 根据权利要求3所述的电路保护结构，其特征在于，所述导电粘接层包括相互贴合的第二导电泡棉和第二导电硅胶，其中，所述第二导电泡棉粘黏于所述导电壳体，所述第二导电硅胶粘黏于所述接地线路框。
  7. 根据权利要求3所述的电路保护结构，其特征在于，所述导电粘接层包括相互贴合的第三导电泡棉和第三导电硅胶，其中，所述第三导电泡棉粘黏于所述接地线路框，所述第三导电硅胶粘黏于所述导电壳体。
  8. 根据权利要求1所述的电路保护结构，其特征在于，所述接地线路框的线宽不大于5mm。
  9. 一种电子装置，包括壳体以及装设于所述壳体内的至少一个电路保护结构，其特征在于，所述电路保护结构包括：
    印刷电路板PCB，其上具有电路单元和围合于所述电路单元的接地线路框；
    导电壳体，具有容置所述电路单元的容置腔体；
    导电粘接层，设置于所述接地线路框及所述导电壳体之间以供所述接地线路框与所述导电壳体电气连接。
  10. 根据权利要求9所述的电子装置，其特征在于，所述导电粘接层与所述接地线路框相重合。
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