WO2011061961A1 - 配線基板及び表示装置 - Google Patents
配線基板及び表示装置 Download PDFInfo
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- WO2011061961A1 WO2011061961A1 PCT/JP2010/061269 JP2010061269W WO2011061961A1 WO 2011061961 A1 WO2011061961 A1 WO 2011061961A1 JP 2010061269 W JP2010061269 W JP 2010061269W WO 2011061961 A1 WO2011061961 A1 WO 2011061961A1
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- gate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/2092—Details of a display terminals using a flat panel, the details relating to the control arrangement of the display terminal and to the interfaces thereto
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
Definitions
- the present invention relates to a wiring board and a display device. More specifically, the present invention relates to a wiring board that is preferably used as a board constituting a panel of a display device, and a display device including the wiring board.
- a plurality of gate wirings (scanning signal lines) and a plurality of source wirings (image signal lines) are provided in the display area in order to perform high-definition display.
- the plurality of gate lines are driven by a gate driver, and the plurality of source lines are driven by a source driver.
- Each of these wirings is connected to each driver via a routing wiring provided outside the display area.
- the area (frame area) in which the routing wiring is provided tends to narrow the interval between the adjacent routing wirings as the frame becomes narrower, and an electrical short circuit between the routing wirings is likely to occur.
- a device has been devised such that each of a plurality of routing wirings is formed in different layers via an insulating film, and two routing wirings are arranged in one space (for example, Patent Document 1). To 3).
- the present inventor has made various studies on a method of narrowing a frame by forming a plurality of routing wirings in different layers through insulating films, and processes of each routing wiring formed independently. It has been found that a resistance difference can be generated between the routing wires due to the variation.
- FIG. 7 is a schematic plan view showing an example of the configuration of the routing wiring for narrowing the frame.
- a plurality of gate lines 111 are arranged extending in the row direction, and a plurality of source lines 112 are arranged extending in the column direction.
- a gate driver 121 is provided in the peripheral region.
- a plurality of routing wires 130 drawn from the gate driver 121 are alternately routed from both ends of the gate driver 121 to lead wires connected to the first row gate wires, and lead wires connected to the second row gate wires, 3
- the lead-out wiring connected to the gate wiring in the row and the lead-out wiring are led out in order, and each lead-out wiring 130 passing through the peripheral region is connected to each gate wiring 111 in the display region P.
- routing wiring 130 connected to the odd-numbered gate wiring 111 is drawn in order from the outside, and the routing wiring connected to the second gate wiring and the fourth gate wiring are connected from the other end of the gate driver 121.
- the routing wiring 130 connected to the even-numbered gate wiring 111 such as the routing wiring and the sixth gate wiring is sequentially drawn from the outside.
- the display area P can be arranged in the center and the frame can be narrowed.
- a material (a solid line) formed of a material used for the gate wiring 111 (hereinafter also referred to as a gate metal) and a material (a material used for the source wiring 112).
- routing wirings formed of different materials such as routing wirings 132 (broken lines) formed by source metal are alternately drawn out.
- Such a wiring structure is effective in narrowing the frame as will be described below.
- FIG. 8 is a schematic sectional view taken along line EF in FIG.
- various wirings are formed on an insulating substrate 123 such as glass, and the routing wiring 130 is extended in two layers in the peripheral region.
- the routing wiring 131 disposed in the lower layer is a gate metal routing wiring
- the routing wiring 132 disposed in the upper layer is a source metal routing wiring.
- a first insulating layer 124 is formed between the gate metal routing wiring 131 and the source metal routing wiring 132
- a second insulating layer 125 is formed on the source metal routing wiring 132 disposed in the upper layer. Is formed.
- the wiring layer 131 formed between the lower wiring layer 131 and the upper wiring layer 132 was formed. May cause process variations such as different widths or different thicknesses. As a result, a resistance difference occurs between the routing wirings 131 and 132 of each layer, and the gate wirings connected to the respective routing wirings 131 and 132 It has been found that the signal transmission varies due to signal delay between 111. Further, when such a wiring board is applied to a liquid crystal display device, the effective voltage between the liquid crystals of each pixel in the display region P is affected due to variations in signal transmission, and the gate wiring as shown in FIG.
- FIG. 9 is a photographic diagram showing luminance unevenness (moire) in the display region when the configuration of the routing wiring of FIG. 7 is used.
- Such luminance unevenness of horizontal stripes is particularly prominent when a two-layer wiring structure in which the routing wiring is formed independently in each layer.
- the lead-out wiring is composed of a single-layer wiring, even if there is a difference in line width and thickness due to process variations, a large resistance difference does not occur between adjacent gate wirings, so that the luminance unevenness gradually changes (Gradual). And has little effect on display quality.
- the lead wiring is alternately drawn from both sides of the gate driver and the gate metal lead wiring and the source metal lead wiring are alternately drawn from one end as described above, the brightness unevenness pitch of the luminance unevenness is increased. Because it spreads, the horizontal stripes of moiré are especially likely to appear clearly.
- the present invention has been made in view of the above situation, and an object of the present invention is to provide a wiring board in which a resistance difference between wirings of a plurality of routing wirings is reduced.
- the present inventor has focused on the configuration of the routing wiring formed in different layers. Then, by providing a contact portion for connecting the respective routing wirings formed in different layers at a point in the middle of the routing wiring, one routing wiring is constituted by a plurality of wirings formed in different layers. Even if process variations occur, it has been found that a resistance difference between adjacent routing lines can be eliminated, and a robust design against process variations can be obtained.
- the present invention provides a control region including a plurality of gate wirings extending in the row direction and a plurality of source wirings extending in the column direction, a gate driver connected to the plurality of gate wirings, and the plurality of the plurality of gate wirings.
- Each of the plurality of routing wirings includes a gate metal portion made of a material of the gate wiring and a source metal portion made of a material of the source wiring, and the gate metal portion
- An insulating layer is disposed between the gate metal portion and the source metal portion, and the gate metal portion and the source metal portion are connected via a contact portion that penetrates the insulating layer.
- the wiring board of the present invention has a control region including a plurality of gate wirings extending in the row direction and a plurality of source wirings extending in the column direction.
- the control region for example, a region surrounded by a gate wiring and a source wiring can be used as a display region as one pixel.
- each pixel can be individually controlled by disposing a switching element adjacent to each intersection of the plurality of gate lines and the plurality of source lines. Examples of the switching element include a three-terminal type thin film transistor (TFT: Thin Film Transistor).
- TFT Thin Film Transistor
- the display area can be controlled by active matrix driving.
- the wiring board preferably has a switching element for each of a plurality of pixels surrounded by the plurality of gate wirings and the plurality of source wirings, and the switching element is preferably a thin film transistor.
- the switching element is preferably a thin film transistor.
- a wiring substrate that controls a matrix region using an active element such as a TFT is also referred to as an active matrix substrate.
- the wiring board of the present invention includes a gate driver connected to the plurality of gate wirings, a source driver connected to the plurality of source wirings, and the gate driver routed along an outer periphery of the control region. And a peripheral region including a plurality of routing wirings connecting the plurality of gate wirings.
- the peripheral region is a region other than the control region, and can be used as a space for arranging a driver connected to the gate wiring or the source wiring, or a space for guiding the lead wiring from the driver to the control region. .
- Each of the plurality of routing wirings has a gate metal portion made of the material of the gate wiring and a source metal portion made of the material of the source wiring.
- the gate wiring and the gate metal portion of the routing wiring can be formed by the same process, and the source wiring and the source metal portion of the routing wiring can be formed by the same process. Manufacturing efficiency can be increased as compared with the case where the wiring and the routing wiring or the source wiring and the routing wiring are formed with different manufacturing conditions and materials.
- the wiring metal board of the present invention since the difference in resistance generated in each routing wiring due to the difference in manufacturing conditions and materials can be eliminated, the wiring metal board of the present invention is different in the gate metal portion and the source metal portion. It is particularly preferably used when formed under production conditions. Further, it is particularly preferably used when the material of the gate metal portion is different from the material of the source metal portion. Thereby, the freedom degree of selection of manufacturing conditions and wiring material becomes high, and the manufacturing conditions with good productivity can be selected.
- An insulating layer is disposed between the gate metal portion and the source metal portion.
- the gate metal portion and the source metal portion are connected via a contact portion that penetrates the insulating layer.
- the contact portion connecting the gate metal portion and the source metal portion is provided in the middle of each routing wiring. Since the gate metal portion and the source metal portion are usually formed in different processes, process variations are likely to occur between these processes.
- the cause of the resistance difference between the gate wirings may be due to the difference in the line width and film thickness of the lead wiring, the difference in the specific resistance of the material, or the like.
- the process variation creates a resistance difference between the routing wires and causes a signal delay, but it is actually difficult to eliminate variations in the line width and film thickness of the routing wires.
- the difference in specific resistance of the materials cannot be changed essentially. For example, tantalum and aluminum have different specific resistances as shown in Table 1 below, and it is difficult to match the resistance per unit length within the range of realistic line width and film thickness differences. .
- the contact portion between the gate metal portion and the source metal portion is provided in the middle of the routing wiring, and one routing wiring is configured by wiring formed in two different processes, thereby improving the resistance as a whole. The difference of the difference is eliminated.
- connection points is not particularly limited as long as at least one contact portion (connection point) exists.
- the configuration of the wiring board of the present invention is not particularly limited by other components as long as such components are formed as essential.
- routing wirings made of different materials are alternately led out from the gate driver. That is, it is preferable that the gate metal portion of one routing wire and the source metal portion of the routing wire adjacent thereto are adjacent to each other. By doing so, it becomes easy to divide adjacent routing wirings into an upper layer and a lower layer, and it becomes easy to narrow the frame.
- the wiring board has a plurality of source routing wirings connecting the source driver and the plurality of source wirings, and routing wirings made of different materials are alternately led out from the source driver in order. Preferably it is.
- the routing wiring that connects the source wiring and the source driver With materials different from each other, the routing wiring connected to the source wiring can be provided in a different layer between adjacent routing wirings.
- the frame can be narrowed while suppressing the possibility of short-circuiting each other.
- the routing wiring is connected to the odd-numbered gate wiring from the one end of the gate driver, and the even-numbered wiring from the other end of the gate driver. Therefore, the effect of narrowing the frame can be obtained while the control region is arranged at the center. Note that when the wiring board having such a wiring configuration is applied to a display device, the pitch of horizontal stripes due to the resistance difference of each gate wiring becomes wide, and horizontal stripes may appear more clearly. Since the occurrence of horizontal stripes is suppressed by the characteristics of the present invention, this embodiment is particularly suitable.
- the ratio of the gate metal portion and the source metal portion to the entire length of each of the plurality of routing wires is preferably substantially the same between the plurality of routing wires. Thereby, the resistance difference between each routing wiring can be reduced more.
- the contact portion is located at a substantially middle point of the routing wiring. Therefore, since one routing wiring can be equally divided into the gate metal portion and the source metal portion, the resistance difference between each routing wiring can be further reduced.
- the positions of the contact portions of the adjacent routing wirings are shifted in the column direction.
- the wiring board of the present invention has a switching element for each of a plurality of pixels surrounded by the plurality of gate wirings and the plurality of source wirings, the plurality of pixels may have different polarities for adjacent columns.
- the wiring board of this embodiment is a wiring board of a column (source) inversion driving system.
- the wiring board of the present invention has a switching element for each of the plurality of pixels surrounded by the plurality of gate wirings and the plurality of source wirings, the plurality of pixels have different polarities for each adjacent pixel. It is preferable.
- the wiring board of this embodiment is a wiring board of the dot inversion driving method.
- the resistance difference of the gate wiring tends to cause a difference in luminance, and moiré is particularly likely to appear clearly.
- the wiring board of the present invention it is possible to suppress the occurrence of signal delay between the gate wirings, so that the effect of polarity inversion driving for preventing flicker, burn-in, etc. is obtained and display is performed. Degradation can be suppressed.
- the present invention is also a display device including the wiring board.
- the wiring board of the present invention to a display device, it is possible to obtain a display device in which the frame region is narrow, a short circuit between the lead wirings hardly occurs, and a display quality is hardly deteriorated such as moire.
- the wiring board of the present invention it is possible to reduce a resistance difference between each wiring of a plurality of routing wirings.
- the frame region can be narrowed, it is difficult to cause a short circuit between the lead wirings, and it is possible to prevent the display quality from being lowered such as moire.
- FIG. 2 is a schematic plan view showing a wiring structure of an active matrix substrate according to Embodiment 1.
- FIG. It is an enlarged view of the connection part of routing wiring.
- FIG. 2 is a schematic cross-sectional view taken along the line AB of FIG.
- FIG. 2 is a schematic sectional view taken along line CD in FIG. 1. It is a graph showing the correlation between the gate wiring resistance and the luminance at the time of halftone display in the pixels on the gate wiring.
- 6 is a schematic plan view showing a wiring structure of an active matrix substrate according to Embodiment 2.
- FIG. It is a plane schematic diagram which shows an example of the structure of the routing wiring for narrowing a frame.
- FIG. 8 is a schematic cross-sectional view taken along line EF in FIG. 7. It is a photograph figure which shows the brightness nonuniformity (moire) in a display area when the structure of the routing wiring of FIG. 7 is used.
- Embodiment 1 is an example of an active matrix substrate (wiring substrate) of the present invention that can be used as a substrate constituting a liquid crystal display panel.
- FIG. 1 is a schematic plan view illustrating a wiring structure of an active matrix substrate according to the first embodiment.
- the active matrix substrate of the first embodiment is provided with a plurality of gate lines 11 and a plurality of source lines 12 in a display area (control area) P.
- the plurality of gate lines 11 are extended in the row direction, and the plurality of source lines 12 are extended in the column direction.
- TFTs serving as switching elements are arranged at positions adjacent to the intersections of the plurality of gate lines 11 and the plurality of source lines 12, and the TFTs are connected to the pixel electrodes.
- the pixel electrode is an electrode provided in a region (pixel) surrounded by the gate wiring 11 and the source wiring 12.
- the active matrix substrate according to the first embodiment includes a gate driver 21 in the peripheral area, and a plurality of routing lines 22 are sequentially drawn from the gate driver 21, and each routing line 22 is routed along the outer periphery of the display area P. And connected to each of the plurality of gate wirings 11. Each routing wiring 22 is extended in the column direction and bent in the middle.
- the routing wirings 22 led out from both ends of the gate driver 21 inward and alternately in the left and right directions are the first row gate wiring, the second row gate wiring,
- the gate lines are connected in order from the gate line 11 with the smallest number, such as the gate line in the third row.
- an odd-numbered line such as a routing line connected to the gate wiring in the first row, a routing line connected to the gate wiring in the third row, and a gate wiring in the fifth row
- the routing wiring 22 connected to the gate wiring 11 is drawn out in order, and from the other end of the gate driver 21, the routing wiring connected to the gate wiring on the second row and the routing wiring connected to the gate wiring on the fourth row.
- a lead-out wiring 22 connected to the even-numbered gate wiring 11 such as the wiring and the gate wiring in the sixth row is sequentially drawn out.
- the display region P can be arranged in the center and the frame can be narrowed.
- the plurality of source lines 12 are respectively connected to separately provided source drivers.
- the routing wiring 22 is composed of a gate metal portion 22a and a source metal portion 22b.
- a portion represented by a solid line is a gate metal portion 22a
- a portion represented by a broken line is a source metal portion 22b.
- the gate metal portion 22a is a portion made of the same material as the gate wiring 11 in the display region P and formed by the same process (step).
- the source metal portion 22b is a portion made of the same material as the source wiring in the display region P and formed by the same process (process).
- the gate wiring 11 and the gate metal portion 22a of the routing wiring 22 are formed first, then the insulating layer is formed, and finally the source wiring and the source metal portion 22b of the routing wiring 22 are formed. And are formed. Therefore, the gate metal part 22a and the source metal part 22b are arranged in different layers with an insulating layer interposed therebetween.
- the gate metal portion 22a and the source metal portion 22b are connected to each other by a contact portion 31 provided in the middle of each routing wiring 22, and the routing wiring 22 moves to a different layer with this point as a boundary.
- the routing wiring 22 formed by the gate metal 22a, the routing wiring 22 formed by the source metal 22b, and the routing wiring formed by the gate metal 22a are drawn in order of 22. That is, from the end of the gate driver 21, a lead portion that is the gate metal portion 22a and a lead portion that is the source metal portion 22b are alternately drawn. By such a drawing method, the gate metal portions 22a and the source metal portions 22b are alternately arranged in order.
- the wiring composed of the gate metal and the wiring composed of the source metal are alternately drawn out from the gate driver, that is, the manufacturing process, the layer arrangement, the material, and the like are made different between the adjacent routing wirings. By making it, it becomes easier to narrow the frame.
- the position of the contact portion 31 between the gate metal portion 22a and the source metal portion 22b is not particularly limited as long as it is formed in the middle of the lead-out wiring 22.
- the difference in resistance between the routing wirings 22 can be reduced.
- the ratio of the gate metal portion 23 a and the ratio of the source metal portion 23 b in one routing wiring 22 are equal.
- the contact portion 31 between the gate metal portion 22 a and the source metal portion 22 b is provided at a substantially middle point between the respective lead wires 22, thereby the length of the gate metal portion 22 a in one lead wire 22. Since the length L1 is equal to the length L2 of the source metal portion 22b, it becomes easier to eliminate the resistance difference between the routing wires 22.
- FIG. 2 is an enlarged view of a contact portion of the routing wiring. As shown in FIG. 2, the region in the vicinity where each contact portion 31 is formed is formed wider than the wiring portion. This makes it easier to form a contact hole for the insulating layer.
- the contact portions 31 are provided so as to be shifted in the column direction between the adjacent routing wires 22. Thereby, it is possible to prevent an increase in the width in the row direction of a wide portion for forming the contact portion 31, which greatly contributes to a narrow frame.
- FIG. 3 is a schematic sectional view taken along the line AB in FIG.
- various wirings are formed on an insulating substrate 23 such as glass, and the routing wirings 22 are extended in two layers in the peripheral region.
- the routing wiring 22a disposed in the lower layer is formed of gate metal
- the routing wiring 22b disposed in the upper layer is formed of source metal.
- a first insulating layer 24 is formed between the routing wiring 22a disposed in the lower layer and the routing wiring 22b disposed in the upper layer
- the second insulating layer 25 is disposed on the routing wiring 22b disposed in the upper layer. Is formed.
- Examples of the material of the first insulating layer 24 and the second insulating layer 25 include silicon oxide (SiO 2 ) and silicon nitride (SiN x ).
- the routing wiring 22a formed of gate metal and the routing wiring 22b formed of source metal have different widths and different thicknesses due to process variations.
- each of the routing wirings 22 is configured by the gate metal portion 22a and the source metal portion 22b, it is possible to suppress a resistance difference between the routing wirings 22 from occurring.
- the routing wiring 22a formed of the gate metal and the routing wiring 22b formed of the source metal may be reversed, and the routing wiring 22a formed of the gate metal is in the upper layer.
- the routing wiring 22b formed of source metal may be arranged in the lower layer.
- the contact portion 31 is provided inside the first insulating layer 24.
- the conductive material constituting the inside of the contact portion 31 may be either gate metal or source metal, but from the viewpoint of the manufacturing process, the material of the source metal portion formed in the upper layer ( Source metal) is preferable.
- cross-sectional structures can be confirmed by, for example, a cross-sectional SEM (Scanning / Electron / Microscope) or an optical microscope.
- materials for the gate metal and the source metal include metals such as tantalum (Ta), aluminum (Al), tungsten (W), and copper (Cu), and nitrides of these metals.
- the active matrix substrate of Embodiment 1 can perform active matrix driving for each pixel as described above.
- a common electrode formed on one side is prepared as an opposing substrate, and a liquid crystal layer is formed between these substrates, whereby liquid crystal Can be driven for each pixel.
- the active matrix substrate of the first embodiment is a dot inversion drive in which the voltage is different for each adjacent pixel or a column (source) in which the voltage is different for each column as a countermeasure against flicker and burn-in. Inversion driving can be applied.
- the common electrode signal is DC (direct current) driven and the polarity is inverted for each column or pixel
- pixel recharging occurs when the gate signal falls due to the delay of the gate signal.
- a slight difference in resistance is likely to occur as a luminance difference.
- the influence of the signal delay can be reduced for each gate wiring, and thus, it is suitably used for the active matrix driving method by polarity inversion driving.
- the number of gate wirings is three times the resolution, so the pitch between the gate wirings needs to be narrowed.
- the active matrix substrate of Embodiment 1 is preferably used.
- FIG. 5 is a graph (actual measurement value) showing the correlation between the gate wiring resistance and the luminance at the time of halftone display in the pixels on the gate wiring. As shown in FIG. 5, the result is that the luminance (cd / m 2 ) increases as the gate wiring resistance (k ⁇ ) increases, and the variation in the gate wiring resistance affects the actual display. I understand.
- Embodiment 2 is an example of an active matrix substrate (wiring substrate) of the present invention that can be used as a substrate constituting a liquid crystal display panel.
- the active matrix substrate of the second embodiment is the same as the active matrix substrate of the first embodiment except that the source wiring is composed of a gate metal part and a source metal part.
- FIG. 6 is a schematic plan view showing a wiring structure of the active matrix substrate according to the second embodiment.
- the active matrix substrate according to the second embodiment is provided with a plurality of gate lines 11 and a plurality of source lines 12 in a display area (control area) P.
- the plurality of gate lines 11 are extended in the row direction
- the plurality of source lines 12 are extended in the column direction.
- a plurality of lead wires 42 made of different materials are alternately drawn out from the source driver 41 in order, and are connected to each of the plurality of source wires 12.
- Each routing wiring 42 is extended in the column direction.
- the wiring composed of the gate metal and the wiring composed of the source metal are drawn out in turn from the source driver, that is, the manufacturing process, the layer arrangement, the material, etc. are made different between the adjacent routing wirings. By making it easier, it becomes easier to narrow the frame.
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Abstract
Description
実施形態1は、液晶表示パネルを構成する基板として用いることができる本発明のアクティブマトリクス基板(配線基板)の一例である。図1は、実施形態1のアクティブマトリクス基板の配線構造を示す平面模式図である。図1に示すように、実施形態1のアクティブマトリクス基板は、表示領域(制御領域)Pに複数本のゲート配線11と、複数本のソース配線12とが設けられている。複数本のゲート配線11は行方向に延伸されており、複数本のソース配線12は列方向に延伸されている。
実施形態2は、液晶表示パネルを構成する基板として用いることができる本発明のアクティブマトリクス基板(配線基板)の一例である。実施形態2のアクティブマトリクス基板は、ソース配線がゲートメタル部とソースメタル部とで構成されている点以外は、実施形態1のアクティブマトリクス基板と同様である。
12,112:ソース配線
21,121:ゲートドライバ
22:引き回し配線
22a:ゲートメタル部
22b:ソースメタル部
23,123:絶縁基板
24,124:第一絶縁層
25,125:第二絶縁層
31:コンタクト部
41:ソースドライバ
42:引き回し配線
42a:ゲートメタル部
42b:ソースメタル部
130:引き回し配線
131:ゲートメタルで形成された引き回し配線
132:ソースメタルで形成された引き回し配線
P:表示領域
Claims (11)
- 行方向に伸びる複数本のゲート配線と、列方向に延びる複数本のソース配線とを含む制御領域、及び、該複数本のゲート配線と接続されるゲートドライバと、該複数本のソース配線と接続されるソースドライバと、該制御領域の外周に沿って引き回されて該ゲートドライバと該複数本のゲート配線とを結ぶ複数本の引き回し配線とを含む周辺領域を有する配線基板であって、
該複数本の引き回し配線のそれぞれは、該ゲート配線の材料で構成されるゲートメタル部と、該ソース配線の材料で構成されるソースメタル部とを有し、
該ゲートメタル部と該ソースメタル部との間には、絶縁層が配置されており、
該ゲートメタル部と該ソースメタル部とは、該絶縁層を貫通するコンタクト部を介して接続されている
ことを特徴とする配線基板。 - 前記ゲートドライバからは、互いに異なる材料で構成された引き回し配線が互い違いに順に引き出されていることを特徴とする請求項1記載の配線基板。
- 前記配線基板は、前記ソースドライバと前記複数本のソース配線とを結ぶ複数本のソース引き回し配線を有し、
前記ソースドライバからは、互いに異なる材料で構成された引き回し配線が互い違いに順に引き出されている
ことを特徴とする請求項1又は2記載の配線基板。 - 前記ゲートドライバからは、前記複数本の引き回し配線が互い違いに順に引き出され、かつ両末端から左右交互に順に引き出された各引き回し配線が、各ゲート配線の行番号の小さいものから順に接続されていることを特徴とする請求項1~3のいずれかに記載の配線基板。
- 前記複数本の引き回し配線のそれぞれの長さ全体に対する前記ゲートメタル部及び前記ソースメタル部の占める割合が、複数本の引き回し配線間で実質的に同一であることを特徴とする請求項1~4のいずれかに記載の配線基板。
- 前記コンタクト部は、前記引き回し配線の略中間点に位置することを特徴とする請求項1~5のいずれかに記載の配線基板。
- 前記隣接する引き回し配線の各コンタクト部の位置は、列方向にずれて配置されていることを特徴とする請求項1~6のいずれかに記載の配線基板。
- 前記配線基板は、前記複数本のゲート配線と前記複数本のソース配線とで囲まれる複数の画素ごとにスイッチング素子を有することを特徴とする請求項1~7のいずれかに記載の配線基板。
- 前記複数の画素は、隣接する列ごとに極性が異なることを特徴とする請求項8記載の配線基板。
- 前記複数の画素は、隣接する画素ごとに極性が異なることを特徴とする請求項8記載の配線基板。
- 請求項1~10のいずれかに記載の配線基板を備えることを特徴とする表示装置。
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US20120235713A1 (en) | 2012-09-20 |
US9078363B2 (en) | 2015-07-07 |
CN102667897A (zh) | 2012-09-12 |
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