WO2011013449A1 - レーザースクライブ加工方法 - Google Patents
レーザースクライブ加工方法 Download PDFInfo
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- WO2011013449A1 WO2011013449A1 PCT/JP2010/059868 JP2010059868W WO2011013449A1 WO 2011013449 A1 WO2011013449 A1 WO 2011013449A1 JP 2010059868 W JP2010059868 W JP 2010059868W WO 2011013449 A1 WO2011013449 A1 WO 2011013449A1
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- light component
- laser
- optical system
- irradiation
- beam spots
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- 238000003672 processing method Methods 0.000 title claims abstract description 16
- 230000003287 optical effect Effects 0.000 claims abstract description 111
- 238000012545 processing Methods 0.000 claims abstract description 69
- 238000000926 separation method Methods 0.000 claims abstract description 62
- 230000001678 irradiating effect Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 32
- 238000003776 cleavage reaction Methods 0.000 claims description 15
- 230000007017 scission Effects 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 26
- 239000010980 sapphire Substances 0.000 abstract description 10
- 229910052594 sapphire Inorganic materials 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 description 21
- 238000005520 cutting process Methods 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 15
- 238000002474 experimental method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 239000013078 crystal Substances 0.000 description 13
- 230000010355 oscillation Effects 0.000 description 13
- 238000012937 correction Methods 0.000 description 10
- 239000010453 quartz Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 230000008646 thermal stress Effects 0.000 description 7
- 238000005286 illumination Methods 0.000 description 6
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- 239000002178 crystalline material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 229910021532 Calcite Inorganic materials 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 230000010356 wave oscillation Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
Definitions
- the mirror 8 guides the laser beam P transmitted through the optical path correction optical system 7 to the focusing lens 10.
- the 1 ⁇ 4 wavelength plate 9 is disposed after the optical path correction optical system 7 with reference to the traveling direction of the laser beam P, and converts linearly polarized light of the laser beam P guided from the mirror 8 into circularly polarized light.
- the condensing lens 10 condenses the ordinary light component 13 and the extraordinary light component 14 of the laser beam P transmitted through the 1 ⁇ 4 wavelength plate 9 onto the object Q to be processed.
- Example 1 and Example 2 by rotating the quartz wedge plate by 90 ° (45 ° + 45 °) around the optical axis of the irradiation optical system, the formation direction of the crack generated between the pair of beam spots changes by 90 ° It turned out to be done.
- Example 3 it was found that the formation direction of the crack generated between the pair of beam spots coincides with the scribing direction, and the formation of the crack extending in the direction different from the scribing direction is suppressed.
- Example 4 regular connection of cracks was observed.
- Example 5 as in Example 4, regular connection of cracks was observed.
- Example 6 and Example 7 it was recognized that the cracks in the 45 ° direction in which the beam spots were aligned were greatly elongated.
- Example 8 and Example 9 it was recognized that the direction of the largest crack rotated 90 degrees with respect to Example 6 and Example 7.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
レーザー光線を出射する光源と、このレーザー光線を加工対象物に導く照射光学系とを用い、加工対象物のスクライブ方向に沿うクラックを形成するレーザースクライブ加工方法であって、
光源からレーザー光線を出射する出射工程と、
このレーザー光線を進行方向が異なる常光成分及び異常光成分に分離する分離工程と、
この常光成分及び異常光成分を集光しつつ、複数対のビームスポットを形成する集光工程と、
この複数対のビームスポットを有するレーザー光線を加工対象物のスクライブ方向に間欠的に照射する照射工程と
を有するレーザースクライブ加工方法である。
(実験1)
[実施例1から3]
〈実験系の説明〉
(実験2)
[比較例1から3]
〈実験系の説明〉
〈実験1及び2における特性の評価〉
(実験3)
[比較例4]
〈実験系の説明〉
(実験4)
[実施例4から9]
〈実験系の説明〉
〈実験3及び4における特性の評価〉
2 ステージ
3 照射光学系
4 ビームエキスパンダ
5 1/2波長板
6 複屈折性プリズム
7 光路補正光学系
8 ミラー
9 1/4波長板
10 集光レンズ
11 凹レンズ
12 凸レンズ
13 常光成分
14 異常光成分
P レーザー光線
Q 加工対象物
R 照射光学系の光軸
S 結晶軸
STP1 出射工程
STP2 分離工程
STP3 集光工程
STP4 照射工程
Claims (10)
- レーザー光線を出射する光源と、このレーザー光線を加工対象物に導く照射光学系とを用い、加工対象物のスクライブ方向に沿うクラックを形成するレーザースクライブ加工方法であって、
光源からレーザー光線を出射する出射工程と、
このレーザー光線を進行方向が異なる常光成分及び異常光成分に分離する分離工程と、
この常光成分及び異常光成分を集光しつつ、複数対のビームスポットを形成する集光工程と、
この複数対のビームスポットを有するレーザー光線を加工対象物のスクライブ方向に間欠的に照射する照射工程と
を有するレーザースクライブ加工方法。 - 上記分離工程における常光成分及び異常光成分の分離に、照射光学系に配設される複屈折性プリズムを用いる請求項1に記載のレーザースクライブ加工方法。
- 上記照射工程における一対のビームスポットの分離方向を、加工対象物のスクライブ方向に沿うよう常光成分及び異常光成分の分離方向を調整する請求項1に記載のレーザースクライブ加工方法。
- 上記照射工程における一対のビームスポットの分離方向を、加工対象物の劈開面に沿うよう常光成分及び異常光成分の分離方向を調整する請求項1に記載のレーザースクライブ加工方法。
- 上記照射工程における一対のビームスポットの分離方向の調整に、照射光学系に配設され、照射光学系の光軸を中心に回転可能な複屈折性プリズムを用いる請求項3又は請求項4に記載のレーザースクライブ加工方法。
- 上記照射工程における一対のビームスポットの中心間距離を調整するよう常光成分及び異常光成分の分離方向を調整する請求項1に記載のレーザースクライブ加工方法。
- 上記照射工程における一対のビームスポットの中心間距離を、スポット径の0.2倍以上50倍以下に調整する請求項6に記載のレーザースクライブ加工方法。
- 上記分離工程において、照射光学系に配設され、かつ照射光学系の光軸を中心に回転可能な1/2波長板を用いて常光成分及び異常光成分の強度比を調整する請求項1に記載のレーザースクライブ加工方法。
- 上記照射工程において形成される複数対のビームスポットのスポット径が、0.3μm以上300μm以下である請求項1に記載のレーザースクライブ加工方法。
- 上記照射光学系が、1/4波長板をさらに備える請求項1に記載のレーザー加工方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/261,033 US8779327B2 (en) | 2009-07-29 | 2010-06-10 | Laser scribe processing method |
CN201080026930.4A CN102470482B (zh) | 2009-07-29 | 2010-06-10 | 激光切割加工方法 |
EP20100804196 EP2460614B1 (en) | 2009-07-29 | 2010-06-10 | Laser scribe processing method |
KR1020117026784A KR101167236B1 (ko) | 2009-07-29 | 2010-06-10 | 레이저 스크라이브 가공 방법 |
Applications Claiming Priority (2)
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JP2009-176462 | 2009-07-29 | ||
JP2009176462A JP4651731B2 (ja) | 2009-07-29 | 2009-07-29 | レーザースクライブ加工方法 |
Publications (1)
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WO2011013449A1 true WO2011013449A1 (ja) | 2011-02-03 |
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ID=43529113
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PCT/JP2010/059868 WO2011013449A1 (ja) | 2009-07-29 | 2010-06-10 | レーザースクライブ加工方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8779327B2 (ja) |
EP (1) | EP2460614B1 (ja) |
JP (1) | JP4651731B2 (ja) |
KR (1) | KR101167236B1 (ja) |
CN (1) | CN102470482B (ja) |
TW (1) | TWI391203B (ja) |
WO (1) | WO2011013449A1 (ja) |
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US9868179B2 (en) | 2012-03-09 | 2018-01-16 | TOYOKOH, Co., Ltd. | Laser irradiation device, laser irradiation system, and method for removing coating or adhering matter |
JP2021533559A (ja) * | 2018-07-31 | 2021-12-02 | コヒーレント レーザーシステムズ ゲーエムベーハー ウント コンパニー カーゲー | 波長分離のための複屈折プリズム |
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EP2460614A4 (en) | 2013-01-23 |
CN102470482A (zh) | 2012-05-23 |
JP2011025304A (ja) | 2011-02-10 |
KR20120005507A (ko) | 2012-01-16 |
EP2460614B1 (en) | 2014-07-16 |
JP4651731B2 (ja) | 2011-03-16 |
US8779327B2 (en) | 2014-07-15 |
CN102470482B (zh) | 2015-02-18 |
TWI391203B (zh) | 2013-04-01 |
TW201103685A (en) | 2011-02-01 |
US20120261453A1 (en) | 2012-10-18 |
KR101167236B1 (ko) | 2012-07-23 |
EP2460614A1 (en) | 2012-06-06 |
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