WO2010131557A1 - アクチュエータ及びアクチュエータを用いた光走査装置 - Google Patents
アクチュエータ及びアクチュエータを用いた光走査装置 Download PDFInfo
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- WO2010131557A1 WO2010131557A1 PCT/JP2010/057096 JP2010057096W WO2010131557A1 WO 2010131557 A1 WO2010131557 A1 WO 2010131557A1 JP 2010057096 W JP2010057096 W JP 2010057096W WO 2010131557 A1 WO2010131557 A1 WO 2010131557A1
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- 230000003287 optical effect Effects 0.000 title claims description 11
- 238000005452 bending Methods 0.000 claims abstract description 38
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 46
- 230000035945 sensitivity Effects 0.000 description 42
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 230000008859 change Effects 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 230000014509 gene expression Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 7
- 239000012141 concentrate Substances 0.000 description 4
- 238000000708 deep reactive-ion etching Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/12—Constructional details
- H02N2/123—Mechanical transmission means, e.g. for gearing
Definitions
- the present invention relates to an actuator and an optical scanning device, and more particularly to an actuator and an optical scanning device using the actuator that tilt and drive a driven object around a rotation axis.
- an optical scanning device that scans light by changing a reflection direction of light incident on a reflection mirror unit by vibrating at least a part of a vibrating body having a reflection mirror unit formed on a silicon plate.
- the vibrating body includes a first spring portion that is connected to the reflecting mirror portion and generates a torsional vibration, and a plurality of second springs that are connected to the first spring portion and generate a bending vibration and a torsional vibration.
- an optical scanning device that includes a second spring portion, the other end of the second spring portion is connected and fixed to the fixed frame portion, and a drive source that vibrates itself is attached to the second spring portion (for example, a patent). Reference 1).
- each second spring portion has the same elastic coefficient as the first spring portion, but has a cross-sectional shape that is more easily elastically deformed than the first spring portion. Yes. Further, the displacement of the drive source becomes a bending vibration in the plate thickness direction of the plate material constituting the second spring portion, and the bending vibration is generated at a portion connected to the first spring portion of the second spring portion. Is transmitted to the first spring portion as torsional vibration, and the load required to vibrate the reflecting mirror portion is distributed to the first spring and the second spring.
- the dynamic breaking stress due to the twist mode of silicon is about 2 GPa.
- D-RIE deep digging reactive ion etching
- the substantial breaking stress of silicon when commercialized is about 1.5 GPa. Therefore, the configuration described in Patent Document 1 has a problem that the possibility of breakage due to continuous operation is high due to the influence of processing conditions, shapes, variations thereof, and the like.
- the present invention has been made in view of the above-described problems, and an object thereof is to provide an actuator that can meet the demand for downsizing and can be stably operated by preventing stress concentration during tilt driving and an optical scanning device using the actuator. To do.
- an actuator is an actuator that tilts and drives a drive object around a rotation axis, and supports the drive object from both sides along the rotation axis.
- the pair of movable frames and a tip of the support beam are connected by a beam structure including a plurality of beams, and the bending vibration is converted into torsional vibration and transmitted to the support beam. It is characterized by that.
- an actuator is an actuator that tilts and drives a drive object around a rotation axis, and supports the drive object from both sides along the rotation axis.
- the support beam a support beam side connection portion connected to the support beam and extending in a direction perpendicular to the rotation axis, connected to the support beam side connection portion, and parallel to the rotation axis, the drive object
- a drive beam side connection portion extending toward the side, and the drive beam side connection portion, and is arranged so as to sandwich the drive object from both sides in a direction perpendicular to the rotation axis, and the rotation It is characterized by having a driving beam that imparts tilting power to the driving beam side connecting portion by deforming in the opposite direction up and down on both sides of the shaft.
- the internal stress generated during driving can be appropriately dispersed, and the driven object can be stably driven without giving a stress burden to a specific part.
- FIG. 5 is a diagram for explaining a method of driving the actuator according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of driving the actuator according to the first embodiment.
- FIG. 5 is a diagram for explaining a method of driving the actuator according to the first embodiment.
- FIG. 3 is a perspective view illustrating a surface of the actuator according to the first embodiment. It is a perspective view which shows the state which driven the actuator which concerns on Example 1.
- FIG. It is a perspective view which shows the drive source in the case of driving the actuator which concerns on Example 1 biaxially.
- FIG. 3 is a perspective view illustrating a non-resonant drive state of the actuator according to the first embodiment.
- FIG. 3 is a perspective view illustrating a resonance driving unit of the actuator according to the first embodiment.
- FIG. 3 is a partially enlarged view centering on a connecting portion of the actuator according to the first embodiment.
- FIG. 3 is a perspective view illustrating a state during resonance vibration of the actuator according to the first embodiment.
- FIG. 3 is an enlarged view of the periphery of a mirror during resonance driving of the actuator according to the first embodiment. It is a figure which further expands and shows the mirror of the actuator which concerns on Example 1, a support beam, and the part of a connection part. It is a figure for demonstrating the structure of the actuator which rounded the corner of the connection location. It is a figure for demonstrating the structure of the actuator which rounded the corner of the connection location.
- FIG. 6 is a diagram illustrating an example of an electrode arrangement of a drive source of a resonance drive unit of the actuator according to Embodiment 1.
- FIG. 6 is a diagram illustrating an example of an electrode arrangement of a drive source of a resonance drive unit of the actuator according to Embodiment 1.
- FIG. 6 is a diagram illustrating an example of an electrode arrangement of a drive source of a resonance drive unit of the actuator according to Embodiment 1.
- FIG. 6 is a diagram illustrating an example of an electrode arrangement of a drive source of a resonance drive unit of the actuator according to Embodiment 1.
- FIG. It is a comparison figure of the inclination sensitivity of a resonance drive part and the maximum internal stress in each electrode arrangement of Drawing 15A, Drawing 15B, and Drawing 15C.
- FIG. 6 is an enlarged perspective view showing an actuator according to Embodiment 2.
- FIG. 6 is a diagram illustrating a state during resonance driving of an actuator according to a second embodiment.
- FIG. 6 is an enlarged perspective view illustrating a state during resonance driving of an actuator according to a second embodiment.
- FIG. 6 is a diagram illustrating an example of electrode arrangement of an actuator according to Embodiment 2.
- FIG. 6 is a diagram illustrating an example of electrode arrangement of an actuator according to Embodiment 2.
- FIG. 6 is a diagram illustrating an example of electrode arrangement of an actuator according to Embodiment 2.
- FIG. 3 is a side view illustrating a state during resonance driving of the actuator according to the first embodiment.
- FIG. 10 is a side view showing a state during resonance driving of the actuator according to the second embodiment.
- FIG. 10 is a perspective view illustrating a configuration of a surface of an actuator according to a third embodiment.
- FIG. 6 is a perspective view illustrating a configuration of a back surface of an actuator according to a third embodiment.
- FIG. 10 is a diagram for explaining parameter setting of an actuator according to a third embodiment.
- FIG. 10 is a diagram for explaining parameter setting of an actuator according to a third embodiment.
- FIG. 10 is a diagram for explaining parameter setting of an actuator according to a third embodiment.
- FIG. 10 is a perspective view illustrating a configuration of a surface of an actuator according to a fourth embodiment.
- FIG. 10 is a perspective view illustrating a configuration of a back surface of an actuator according to a fourth embodiment.
- FIG. 10 is a diagram for explaining a method for optimally designing an actuator according to a fourth embodiment.
- FIG. 10 is a diagram for explaining parameter setting of an actuator according to a third embodiment.
- FIG. 10 is a diagram for explaining parameter setting of an actuator according to a third embodiment.
- FIG. 10 is a diagram for explaining parameter setting of an actuator according to a third embodiment.
- FIG. 10 is a diagram for explaining a method for optimally designing an actuator according to a fourth embodiment.
- FIG. 10 is a diagram for explaining a method for optimally designing an actuator according to a fourth embodiment. It is a figure for demonstrating the reason the length B of a support beam side connection part has a minimum value. It is a figure for demonstrating the reason the length B of a support beam side connection part has a minimum value. It is a figure for demonstrating the reason the length B of a support beam side connection part has a minimum value. It is a figure for demonstrating the reason the length B of a support beam side connection part has a minimum value. It is a figure which shows the characteristic of the inclination angle sensitivity of the actuator which concerns on Example 4.
- FIG. FIG. 10 is a diagram illustrating an overall configuration of a projector according to a fifth embodiment.
- FIG. 1 is a diagram showing a cross-sectional configuration of an actuator according to Example 1 of the present invention.
- the actuator according to the first embodiment includes a semiconductor wafer 10 and a drive source 20.
- the actuator according to the first embodiment can be manufactured by processing the semiconductor wafer 10 using, for example, MEMS (Micro Electro Mechanical Systems) technology.
- MEMS Micro Electro Mechanical Systems
- FIG. 1 an example in which an actuator is configured using such a semiconductor wafer 10 will be described.
- the semiconductor wafer 10 includes a silicon substrate 11, SiO 2 12 and 14, and a Si active layer 14.
- an SOI (Silicon On Insulator) substrate may be used as the semiconductor wafer 10.
- SOI substrate, between the silicon substrate 11 is a substrate which SiO 2 12 is formed of an insulating film, in the case of cutting the silicon substrate 11 by deep reactive ion etching or the like, it is SiO 2 on the bottom surface of the cutting end point Since it is formed, deep etching can be easily performed.
- the beam 15 is formed by the SiO 2 12, the Si active layer 13 and the SIO 2 14. In the portion of the beam 15, an operation of supporting the driving object or transmitting the driving force is performed.
- the portion of the silicon substrate 11 is used as an outer fixed frame, for example.
- the semiconductor wafer 10 having a thickness of 300 to 500 [ ⁇ m] as a whole may be used as the semiconductor wafer 10.
- the semiconductor wafer 10 is 350 [ ⁇ m]
- the Si active layer 13 is about 30 [ ⁇ m]
- the SiO 2 12 and 14 are about 0.5 [ ⁇ m]
- the beams 15 are about 31 [ ⁇ m] in total.
- the thickness may be about 1/10 of that of the semiconductor wafer 10.
- the driving source 20 is a power source that generates a driving force in the actuator according to the present embodiment.
- various means can be used as the drive source 20, but in the first embodiment, a case where the piezoelectric element 21 is used as the drive source 20 will be described as an example.
- the piezoelectric element 21 is a passive element that converts a voltage applied to the piezoelectric body 22 into a force.
- the piezoelectric element 21 drives the mounted beam 15 by applying a voltage to expand and contract its length.
- Various piezoelectric bodies 22 may be applied as the piezoelectric body 22, but for example, a PZT thin film (lead zirconate titanate) may be used.
- the beam 15 is about 30 [ ⁇ m]
- the piezoelectric element 21 may be formed with a thickness of about 2 [ ⁇ m].
- the piezoelectric element 21 includes an upper electrode 23 and a lower electrode 24.
- the upper electrode 23 and the lower electrode 24 are electrodes for applying a voltage to the piezoelectric body 22, and when the voltage is applied to the upper electrode 23 and the lower electrode 24, the piezoelectric body 22 expands and contracts to drive the beam 15.
- FIGS. 2A to 2C are diagrams for explaining a method in which the piezoelectric element 21 drives the actuator according to the first embodiment by causing the beam 15 to generate a bending vibration.
- FIG. 2A is a side view schematically showing the beam structure 15 and the piezoelectric element 21 made of silicon. As shown in FIG. 2A, a piezoelectric element 21 is mounted in a thin film shape on a beam 15 composed of a Si active layer 13 or the like.
- FIG. 2B is a diagram showing a state in which the piezoelectric element 21 is contracted and deformed. As shown in FIG. 2B, when the piezoelectric element 21 contracts, the beam structure 15 has a shape that warps upward and convex downward.
- FIG. 2C is a diagram showing a state in which the piezoelectric element 21 is expanded and deformed. As shown in FIG. 2C, when the piezoelectric element 21 extends, the beam structure 15 has a shape that warps upward and downward.
- the piezoelectric element 21 is warped upward or downward depending on the polarization direction and the polarity or phase of the applied voltage.
- the driving target may be driven using the piezoelectric element 21 as the driving source 20 by utilizing such a property of the piezoelectric element 21.
- FIG. 3 is a perspective view illustrating the surface of the actuator according to the first embodiment.
- the actuator according to the present embodiment has an outer fixed frame formed of the silicon substrate 11, and the inner portion of the silicon substrate 11 is formed of a thin portion having the same thickness as the beam 15.
- a driving object 30 is disposed in the center of the actuator.
- a piezoelectric element 21 that is a pair of driving sources 20 is formed on the beam 15 so as to sandwich the driving object 30 from both the left and right sides, thereby forming a driving beam 70.
- the drive source 20 is mounted on the beam 15 that supports the drive object 30 from both sides, and the drive object 30 is driven as the drive beam 70.
- a voltage that is displaced in the opposite direction on the left and right is applied to the piezoelectric elements 21 of the pair of driving beams 70 arranged on both sides of the driving object 30.
- the vibration generated by the piezoelectric element 21 that is the drive source 20 may be a resonance vibration.
- a large bending vibration can be generated in the driving beam 70, and the driven object 30 can be driven at a high speed and greatly.
- FIG. 4 is a perspective view illustrating a state in which the actuator according to the first embodiment is driven.
- a state in which the driven object 30 is oscillating so as to tilt around the rotation axis X due to vibration generated by the driving beam 70 is shown.
- it is tilted so that the front left side is lowered and the back right side is raised.
- the drive object 30 is driven so as to tilt around the rotation axis.
- various objects can be used as the driving object 30, but for example, a mirror used in a micro projector, a micro scanner, or the like may be used.
- drawing is performed by irradiating a mirror with laser light and scanning reflected light from the mirror.
- a screen resolution of XGA (1024 ⁇ 768 pixels) is required, scanning is performed in an angle range of ⁇ 12 [deg] at a high speed of about 30 [kHz] in the horizontal direction. In the direction, it is required to scan in an angular range of ⁇ 18 [deg] at a low speed of about 60 [Hz].
- a high-speed tilt drive of about 30 [kHz] is performed.
- the resonance drive is used in the tilting of the driven object 30 around the rotation axis X, such a high-speed tilting drive can be realized.
- FIG. 5 is a perspective view showing a drive source that tilts and drives around an axis different from the rotation axis X when the actuator according to the first embodiment is driven in two axes.
- An actuator that performs biaxial driving is often used in the above-described microprojector and microscanner. Therefore, an example in which the driven object 30 is a mirror 31 will be described.
- a non-resonant drive source 90 that is a drive source for performing low-speed drive of about 60 [Hz] is shown around the mirror 31.
- the non-resonant driving source 90 is configured such that each beam 15 extends in a direction orthogonal to the extending direction of the driving beam 70, and the piezoelectric element 21 that is the driving source 20 is formed on the surface of the beam 15.
- the non-resonant drive source 90 performs tilt drive around an axis orthogonal to the rotation axis X shown in FIG.
- the non-resonant drive source 90 is connected so that the ends of adjacent beams are alternated at both ends, and constitutes a zigzag meandering beam as a whole.
- FIG. 6 is a perspective view illustrating a state in which non-resonant driving is performed by the non-resonant driving source 90 in the actuator according to the first embodiment.
- the inclination angle accumulates for each beam 15 of the non-resonant driving source 90, and the mirror 31 is driven to tilt around the rotation axis Y.
- FIG. 6 shows a state of a tilting operation in which the front right side is lowered and the far left side is raised.
- the actuator according to the present embodiment can be used as an actuator for biaxial driving by combining resonant driving and non-resonant driving.
- FIG. 7 is a perspective view showing an extracted resonance driving unit 80 of the actuator according to the first embodiment.
- the resonance drive unit 80 includes a mirror 31, a support beam 40, a connection unit 50, a movable frame 60, a drive beam 70, and a drive source 20, all of which are connected together. Has been.
- the mirror 31 is a driving object 30 that is tilt-driven by the actuator according to the present embodiment.
- the drive object 30 may be other than the mirror 31, but hereinafter, for ease of explanation, an example in which the mirror 31 is applied as the drive object 30 will be described.
- the support beam 40 is a pair of beams that support the mirror 31 from both sides.
- the support beams 40 are connected to the mirror 31 and are provided symmetrically with respect to the mirror 31 in pairs along the rotation axis X.
- the support beam 40 is configured as a thin silicon active layer 14 having a thickness of about 30 ⁇ m, for example, and thus functions as an elastic member having elasticity.
- the movable frame 60 is a medium that transmits bending vibration and is a movable support member that movably supports the mirror 31 via the support beam 40.
- the movable frame 60 is provided as a pair in line symmetry with respect to the rotation axis X so as to sandwich the mirror 31 and the support beam 40 from both sides. In FIG. 7, the mirror 31 and the support beam 40 are enclosed so as to be sandwiched from both the near side and the far side.
- the movable frame 60 has a rectangular shape as a whole in FIG. 7, the outer shape is not limited as long as it can transmit bending vibration and can be supported so as to surround the support beam 40 and the mirror 31. .
- the movable frame 60 is coupled so as to be sandwiched from both sides by a pair of drive beams 70 which are resonant vibration drive sources.
- the bending vibration is transmitted from the driving beam 70 to the movable frame 60.
- the movable frame 60 serves as a medium for transmitting the bending vibration.
- the drive beam 70 generates bending vibration as shown in FIGS. 2A to 4.
- the movable frame 60 is formed as a thin Si active layer 14 like the support beam 40, an elastic member having elasticity. The bending vibration generated in the drive beam 70 can be transmitted.
- the movable frame 60 is connected to the support beam 40 via the connecting portion 50. Accordingly, the movable frame 60 can support the support beam 40 and transmit vibration to the support beam 40.
- the movable frame 60 is connected to the drive beam 70, but is not fixed to a fixed body such as a fixed frame, and is in a movable state, and thus transmits vibration in the movable state.
- the connecting portion 50 is a portion that connects the distal end portion of the support beam 40 and the movable frame 60, converts the bending vibration of the movable frame 60 into torsional vibration, and transmits it to the support beam 40.
- the connecting portion 50 is configured as a pair so as to sandwich the support beam 40 from both sides in the rotation axis X direction. Since the movable frame 60 is paired so as to sandwich the support beam 40 from both sides in the direction orthogonal to the rotation axis X, one connecting portion 50 is provided on both sides of the support beam 40 and the support beam 40. Three members of the frame 60 are connected.
- FIG. 8 is a partially enlarged view centering on the connecting portion 50 of the resonance drive unit 80 of the actuator according to the first embodiment.
- the connecting portion 50 is shown with the connecting portion 50 as the center.
- the connecting portion 50 may be integrally configured by the same member as the support beam 40 and the movable frame 60. Thereby, the tolerance of the resonance drive part 80 can be raised and mechanical strength can be raised rather than connecting a several member. Further, by integrally configuring with the support beam 40 and the movable frame 60, it is possible to eliminate unnatural unevenness in the way of transmitting vibrations and transmit vibrations smoothly. Therefore, when the support beam 40 and the movable frame 60 are composed of the SiO 2 12 and 14 and the Si active layer 15 of the semiconductor wafer 10 shown in FIG. The wafer 10 may be composed of the SiO 2 12 and 14 and the Si active layer 13.
- the connecting portion 50 may be configured as a beam structure including a plurality of beams extending horizontally and elongated.
- the connecting portion 50 has a shape that is more elastic than a wide shape, and the bending vibration transmitted from the movable frame 60 is twisted without concentrating the stress load on a specific location. It can be converted into vibration.
- the tip of the support beam 40 opposite to the mirror 31 is connected to the connecting portion 50, and this location is where the torsional stress is applied when the mirror 31 is tilted and is subjected to the most stress load. is there.
- the connecting portion 50 to which the distal end portion of the support beam 40 is connected has a beam structure, not only the support beam 40 but also the connecting portion 50 corresponds to the torsional stress of the support beam 40. Torsional deformation can be caused and the torsional stress applied to the support beam 40 can be dispersed. Details of this point will be described later.
- the connecting portion 50 may have a shape protruding outward. By making the connecting portion 50 a beam structure, elasticity can be improved and stress distribution can be promoted. However, by making the support beam 40 longer, torsional stress applied to the support beam 40 can be reduced.
- the connecting portion 50 also has a beam structure that projects to the outside of the movable frame 60 according to the support beam 40. Moreover, the length of the beam which comprises the connection part 50 can also be taken long, and the absorbency of stress can be improved. In FIG.
- the connecting portion 50 has a bowl-like shape extending in the direction orthogonal to the rotation axis X on both sides of the support beam 40 and extending in the direction of the movable frame 60 in parallel with the rotation axis X. It has become. With this configuration, the beam portion of the connecting portion 50 is lengthened, and the stress dispersion efficiency is increased.
- the connecting portion 50 may be processed so that the corner 55 generated by the connection with the support beam 40 is rounded. Thereby, the stress of the connection location of the support beam 40 and the connection part 50 can be disperse
- the driving beam 70 is a driving force generation source that applies bending stress to the movable frame 60.
- the drive beam 70 extends in a direction orthogonal to the rotation axis X, and is connected to the movable frame 60 so as to sandwich the movable frame 60 from both sides, and is provided as a pair.
- the driving beam 70 has a driving source 20 mounted on the surface thereof, and is deformed into the driving source 20 to generate bending vibration.
- the piezoelectric element 21 may be used as the drive source 20, but other means may be used as long as it can generate bending vibration.
- voltages that are displaced in different directions on both sides are applied to the piezoelectric elements 21 of the pair of drive beams 70.
- the voltage may be applied from the upper surface electrode 23 and the lower surface electrode 24 provided on the piezoelectric body 22 as described in FIG.
- the drive beam 70 may also be formed integrally with the movable frame 60. Therefore, when the movable frame 60 is configured by a thin portion constituting the beam 15 of the semiconductor wafer 10 illustrated in FIG. 1, the drive frame 70 may also be configured as the beam 15.
- the resonance driving unit 80 is configured by a thin portion of the semiconductor wafer 10 having a thickness of about 30 [ ⁇ m], the resonance driving unit 80 is configured by an elastic member. Such elasticity can be adjusted by the width, length, shape, etc., since the thickness of the resonance driving unit 80 is constant.
- an actuator is provided in which stress is dispersed and there is no fear of breakage due to the stress.
- FIG. 9 is a perspective view illustrating a deformed state of the resonance driving unit 80 of the actuator according to the first embodiment during resonance vibration.
- the pair of drive sources 20 includes a back side piezoelectric element 25 and a front side piezoelectric element 26 to which voltages having different polarities or phases are applied.
- the pair of drive beams 70 are deformed such that the back-side drive beam 71 warps upward and the front-side drive beam 72 warps downward, and imparts bending vibration to the movable frame 60.
- the bending vibration of the movable frame 60 is transmitted to the support beam 40 at the connecting portion 50.
- the bending vibration is converted into torsional vibration, and the pair of support beams 40 vibrate torsionally on the left side and the right side. Due to this torsional vibration, the mirror 31 supported by the support beams 40 from both sides performs a tilting vibration to the back side and the near side, and is driven to tilt around the rotation axis X. By such an operation, the mirror 31 is driven to tilt around the rotation axis X.
- FIG. 10 is an enlarged view of the periphery of the mirror 31 showing a deformed state during resonance driving of the resonance driving unit 80 of the actuator according to the first embodiment.
- the mirror 31 is tilted so that the right side is raised and the left side is lowered, but the movable frame 60 is also tilted in the same direction as the mirror 31, and the mirror 31 is more than the movable frame 60.
- the tilt angle is large.
- the pair of drive sources 20 provided in the pair of drive beams 70 are resonated by applying voltages having different polarities or phases
- the vicinity of the connecting portion between the drive beam 70 and the movable frame 60 is used. However, it vibrates up and down greatly.
- the movable frame 60 tilts and the movable frame 60 itself bends, whereby the vicinity of the connecting portion 50 is further tilted, and the connecting portion 50 is twisted to further tilt the mirror 31.
- the actuator it is preferable to select a resonance mode in which the mirror 31 and the movable frame 60 tilt in the same direction as shown in FIG.
- the displacement of the mirror 31 is added to the displacement of the movable frame 60, and the tilt sensitivity of the mirror 31 with respect to the applied voltage can be increased.
- the connecting portion 50 is twisted, the amount of twist is small with respect to the amount of tilt of the mirror 31, so that the internal stress can be reduced and breakage can hardly occur.
- FIG. 11 is an enlarged view showing the mirror 31, the support beam 40, and the connecting portion 50 in the state shown in FIG. In FIG. 11, even if the support beam 40 in the vicinity of the connection portion with the connecting portion 50 is not greatly twisted, the tilt angle of the mirror 31 can be secured by twisting the connecting portion 50.
- the resonance drive unit 80 of the actuator according to the present embodiment is provided with the connecting portion 50 having the beam structure between the movable frame 60 and the support beam 40 to which a large stress load is applied by the conversion from the bending stress to the torsional stress.
- a sufficient tilt angle of the mirror 31 can be secured while reducing the twist angle between the connecting portion 50 and the support beam 40.
- the actuator according to the present embodiment is driven at a frequency of 30 [kHz] and an inclination width of ⁇ 12 [deg].
- the maximum internal stress of the connection part 50 will be 0.4 [GPa] or less. This means that the stress generated when the mirror 31 is tilted is mainly distributed to the connecting portion 50, the movable frame 60, and the driving beam 70.
- the actuator according to the present embodiment can change the resonance frequency by changing the width, thickness, cross-sectional shape, length, etc. of the connecting portion 50, the speed can be further increased to 30 [kHz] or more. This can be done without changing the structure. However, when the shape of the connecting portion 50 is changed, the dimensions of the support beam 40 and the drive beam 70 may be changed accordingly.
- FIG. 12A and FIG. 12B are diagrams for explaining a case where a corner generated at a connection portion 45 between the mirror 31 and the support beam 40 is rounded.
- FIG. 12A is a perspective view of the actuator when an angle R is given to the angle generated at the connection point 45 between the mirror 31 and the support beam 40
- FIG. 12B shows the inclination sensitivity when the angle R is given and ⁇ 12 [Deg] It is a figure which shows the maximum stress change of the connection location 45 when it inclines.
- the mirror 31 is circular and the support beam 40 has a rectangular planar configuration, when the connection state is left as it is, the mirror 31 is squared outside the connection point 45 between the mirror 31 and the support beam 40. Corners are generated, and internal stress tends to concentrate on the corners. However, by providing the angle R, the internal stress can be dispersed.
- the angle R may be given within a range of 0.01 to 0.2 [mm], for example.
- the tilt sensitivity does not change much, but slightly deteriorates when the angle R is 0.01 [mm] or more. ing.
- the maximum internal stress of the corner R portion (connecting portion 45) is 0.3 [GPa] or less, and is 0.05 [GPa] or less, which is a value obtained by multiplying the breaking stress by a safety factor. It is shown that there is no problem with the durability of the R portion.
- FIG. 13A and 13B show the angles generated at the connection point 45 between the mirror 31 and the support beam 40, the connection point 55 between the support beam 40 and the connection part 50, and the connection point 65 between the connection part 50 and the movable frame 60. It is a figure for demonstrating the case where it rounds.
- FIG. 13A is a perspective view of the actuator when an angle R is given to the connection points 45, 55, and 65
- FIG. 13B shows the tilt sensitivity when the angle R is given and when the angle is tilted by ⁇ 12 [deg]. It is a figure which shows the largest stress change of the connection location 45,55,65.
- connection portion 45 between the mirror 31 and the support beam 40 not only the connection portion 45 between the mirror 31 and the support beam 40 but also the connection portion 55 between the support beam 40 and the connection portion 50 and the connection portion 65 between the connection portion 50 and the movable frame 60 are also angular.
- R is given.
- the corner R of the connection portions 55 and 65 may be given in the range of 0.005 to 0.04 [mm], for example.
- FIG. 13B shows the change in the tilt sensitivity and the maximum stress in the configuration with the angle R as shown in FIG. 13A.
- the tilt angle sensitivity does not change much, but is slightly deteriorated when the angle R is 0.02 [mm] or more.
- the internal stress becomes maximum at the connecting portion 50 where the twist occurs.
- the maximum internal stress is 0.5 [GPa]
- the possibility of fracture due to the influence of the work-affected layer due to deep reactive ion etching and the application of repeated stress Will come out.
- R 0.03 [mm]
- the maximum stress is 0.49 [GPa]
- FIG. 14A is a perspective view of the actuator when an angle R is given to the connection points 45, 55, 65, and 75
- FIG. 14B is an inclination sensitivity when the angle R is given and is tilted ⁇ 12 [deg]. It is a figure which shows the largest stress change of the connection location 45, 55, 65, 75 at the time.
- the inside of the connecting portion 75 can be obtained by performing a processing process for rounding the corner by giving the corner R. Stress can also be dispersed.
- the corner R of the connecting portion 75 may be given in the range of 0.005 to 0.06 [mm], for example.
- FIG. 15A to 15C are diagrams showing examples of electrode arrangement of the driving source 20 in the resonance driving unit 80.
- FIG. 15A to 15C are diagrams showing examples of electrode arrangement of the driving source 20 in the resonance driving unit 80.
- FIG. 15A is a diagram illustrating a configuration of a resonance driving unit 80 in which the driving source 20 is provided only on the driving beam 70.
- the resonance drive unit 80 in which the drive source 20 is provided only on the drive beam 70 is shown.
- the vertical movement of the drive beam 70 including the pair of drive beams 71 and 72 is applied to the movable frame 60 including the pair of movable frames 61 and 62 as bending vibration. Is done.
- bending vibration is transmitted from the movable frame 60 to the pair of connecting portions 50, the bending vibration is converted into torsional vibration, and the pair of support beams 40 and the mirror 31 are driven to tilt by the torsional vibration.
- FIG. 15B is a diagram showing a configuration of a resonant vibration unit 80a in which the drive beam 20 and the movable frame 60 are provided with the drive source 20a.
- the drive source 20 a is provided not only on the drive beam 70 but also on the movable frame 60. That is, in the drive source 20a, a pair of drive sources 25 and 26 are provided on the pair of drive beams 71 and 72, and the drive sources 27 and 28 are also provided on the pair of movable frames 61 and 62, respectively.
- FIG. 15B the drive source 20 a is provided not only on the drive beam 70 but also on the movable frame 60. That is, in the drive source 20a, a pair of drive sources 25 and 26 are provided on the pair of drive beams 71 and 72, and the drive sources 27 and 28 are also provided on the pair of movable frames 61 and 62, respectively.
- driving sources 25 and 27 to which voltages of the same polarity or the same phase are applied are provided on the driving beam 71 and the movable frame 61 on the back side that are connected to each other around the rotation axis X.
- the driving beam 72 and the movable frame 62 on the near side connected to each other are provided with driving sources 26 and 28 to which voltages having the same polarity or the same phase are applied, and their polarities are Different from the drive sources 25 and 27. That is, in FIG. 15B, the drive source 20a is arranged so that the same polarity voltage is applied to the drive beam 70 and the movable beam 60 on the same side.
- FIG. 15C is a diagram illustrating a configuration of a resonance vibration unit 80b in which the drive beam 70 and the movable frame 60 provided with the drive source 20b are different from those in FIG. 15B.
- the arrangement of the drive source 20 provided in the drive beam 70 is the same as that in FIGS. 15A and 15B, but the drive sources 27 and 28 provided in the movable frame 60 are connected to the drive beam 70 that is connected.
- the source 26 and the drive source 25 are configured to have opposite polarities. That is, the drive source 25 of the back drive beam 71 and the drive source 28 of the movable frame 61 connected to the drive beam 71 are opposite in polarity with respect to the rotation axis X.
- the drive source 26 of the drive beam 72 on the near side and the drive source 27 of the movable frame 62 connected to the drive beam 72 have opposite polarities.
- the drive sources 25 and 26 of the pair of drive beams 71 and 72 are opposite in polarity, and the drive sources 28 and 27 of the pair of movable frames 61 and 62 are also opposite in polarity.
- FIG. 16 is a diagram comparing the inclination sensitivity per unit voltage and the maximum internal stress of each of the resonance driving units 80, 80a, and 80b of the three types of electrode arrangement configurations shown in FIGS. 15A to 15C.
- the tilt sensitivity per unit voltage when comparing the tilt sensitivity per unit voltage, the drive beam 70 and the movable frame 60 on the same side are compared with the case where the drive source 20 is provided only on the drive beam 70 shown in FIG.
- the tilt sensitivity decreases
- FIG. 15C in which the drive beam 70 and the movable frame 60 on the same side have opposite polarities
- the tilt sensitivity increases. That is, in the configuration of FIG. 15A, the tilt sensitivity is 0.535 [deg / V], whereas in the configuration of FIG. 15B, it decreases to 0.131 [deg / V], and in the configuration of FIG. It has risen to 975 [deg / V].
- FIG. 16 when comparing the maximum internal stresses of FIGS. 15A, 15B, and 15C, 0.39 [GPa] in the standard FIG. It is a problem-free value with little risk of breakage. However, in the case of FIG. 15B, since it increases at 0.59 [GPa] and the maximum internal stress exceeds 0.5 [GPa], there is a possibility of breakage.
- the actuator having the configuration shown in FIG. 15C has the highest tilt angle sensitivity and the maximum internal stress has no problem. Therefore, as shown in FIG. 15C, the drive source is applied to both the drive beam 70 and the movable frame 70 so that the voltages applied to the drive beam 70 and the drive source 20b of the movable frame 60 which are connected to each other have opposite polarities.
- the arrangement configuration in which 20b is provided is the most efficient and is less likely to break.
- the tilt angle sensitivity can be improved without changing the outer dimensions.
- the applied voltage can be reduced to 1 / 1.8 because the tilt sensitivity has increased 1.8 times.
- the drive voltage required to tilt the mirror 31 by ⁇ 12 [deg] is 0 to 22.5 [V] in the configuration of FIG. 15A
- the voltage can be set to 0 to 12.5 [V]
- the required drive voltage can be greatly reduced.
- the connecting portion 50 that connects the movable frame 60 connected to the driving beam 70 having the driving source 20 and the support beam 40 connected to the mirror 31 is provided.
- the bending vibration can be converted into torsional vibration without increasing the internal stress, and the mirror 31 can be driven to tilt.
- a process of rounding the corners by giving an angle R to the connection points 45, 55, 65, and 75, or providing the drive source 20 b on the movable frame 60, and the drive source 20 b provided on the drive beam 70 and the movable frame 60
- the applied voltage By configuring the applied voltage to be reversed, it is possible to obtain a better tilt angle sensitivity and an internal stress dispersion effect.
- FIG. 17 is a perspective view showing the configuration of the resonance drive unit 81 of the actuator according to the second embodiment of the present invention.
- the resonance drive unit 81 of the actuator according to the second embodiment includes a mirror 31, a support beam 40 a, a connection unit 50 a, a movable frame 60, a drive beam 70, and a drive source 20.
- the actuator according to the second embodiment is the same as the configuration of the actuator according to the first embodiment except for the cross-sectional configuration and the configuration of the resonance driving unit 81 such as a non-resonance driving unit. Is omitted.
- the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
- the mirror 31 is supported by a pair of support beams 40a from both sides, and the pair of movable frames 60 and 62 and the support beams 40a are connected to each other by a connecting portion 50a. It is connected.
- a pair of drive beams 70 including drive beams 71 and 72 are connected to both sides of the movable frame 60 in a direction orthogonal to the rotation axis X.
- the drive beams 71 and 72 are connected to a pair of drive sources 25 and 26.
- the basic configuration provided with the drive source 20 is the same as that of the actuator according to the first embodiment.
- bending vibration is generated from the driving beam 70 by the driving source 20 and converted into torsional vibration by the connecting portion 50a, and the mirror 31 is tilted and driven through the support beam 40a. This is the same as the actuator according to the first embodiment.
- the actuator according to the second embodiment is different from the first embodiment in that the support beams 40a paired in the direction of the rotation axis X are divided into two on one side, the back side and the near side, and further paired. 1 is different from the actuator according to 1. Further, in the actuator according to the second embodiment, as the support beams 40a are two on each side, the connecting portion 50a connects each support beam 40a to the movable frames 61 and 62 on the closer side. This is different from the actuator according to the first embodiment.
- FIG. 18 is an enlarged perspective view showing the support beam 40a, the connecting portion 50a, and the movable frame 60 of the actuator according to the second embodiment.
- the actuator according to the first embodiment has one support beam 40 on one side, whereas in the actuator according to the second embodiment, the central portion of the support beam 40 a is cut along the rotation axis X. It has an extracted shape. Along with this, the width of the support beam 40a is narrowed, and the support beam 40a is composed of two beams 15 that are thinner than the support beam 40 of the first embodiment.
- the connecting portion 50a extends open on both sides in a direction orthogonal to the rotation axis X, and the movable beam 50 is movable along the rotation axis X. Since it is connected to 60 and has a bowl shape, the shape of the connecting portion 50a itself is essentially unchanged.
- the support beam 40a is composed of the two support beams 41 and 42, a connecting portion 51 is provided corresponding to the support beam 41, and a connecting portion 52 is provided corresponding to the support beam 42.
- Each of the connecting portions 51 and 52 is provided corresponding to each of the supporting beams 41 and 42.
- the actuator according to the second embodiment can make the beam structure portion of the connecting portion 50a longer than the actuator according to the first embodiment, and the connecting portion 51 and the connecting portion 52. It is possible to operate differently. Therefore, the degree of freedom of deformation of the connecting portion 50a can be further increased, and the bending vibration transmitted from the movable frame 60 can be more efficiently converted to torsional vibration.
- FIG. 19 is a diagram illustrating a deformation state of the resonance driving unit 81 of the actuator according to the second embodiment during resonance driving.
- voltages having different polarities are applied to the driving source 25 and the driving source 26, the driving beam 71 warps upward, the driving beam 72 warps downward, and is bent into a pair of movable frames 61 and 62. Vibration is applied.
- the bending vibration applied to the movable frames 61 and 62 is transmitted to the connecting portion 50a, converted into torsional vibration, and transmitted to the support beam 40a.
- the bending vibration of the movable frame 61 is transmitted to the connecting portion 51, and the bending vibration of the movable frame 62 is transmitted to the connecting portion 52, which is different from the actuator according to the first embodiment.
- Torsional vibration from the connecting portion 51 is transmitted to the support beam 41, and torsional vibration from the connecting portion 52 is transmitted to the connecting portion 52.
- the right support beam 40a but also the left support beam 40a perform the same operation, and the mirror 31 is tilted.
- FIG. 20 is an enlarged perspective view illustrating a deformed state during resonance driving of the resonance driving unit 81 of the actuator according to the second embodiment.
- the deflection due to the bending vibration of the movable frames 61 and 62 transmitted from the drive beams 71 and 72 is transmitted to the connecting portion 50a.
- the connecting portion 50a In the connecting portion 50a, the upper connecting portion 51 and the lower connecting portion are connected.
- a step is generated at the portion 52.
- a level difference is generated in the upper support beam 41 and the lower support beam 42 in the support beam 40a.
- the mirror 31 can be largely tilted by increasing the step, the mirror 31 can be tilted and driven more directly. That is, by using two support beams 40a, a step is generated between the support beams 41 and 42 when the support beams 41 and 42 are tilted, and the tilt angle can be increased.
- the movable frame 60 and the mirror 31 are inclined in the same direction.
- the resonance mode uses a resonance mode in which the mirror 31 and the movable frame 60 are tilted in the same direction, thereby adding the displacement of the movable frame 60 and the mirror 31 and increasing the tilt sensitivity of the mirror 31. Can be increased. Further, both the support beam 40a and the connecting portion 50a are twisted, and the drive beam 70 and the movable frame 60 are both bent and driven. However, since the twist amount is small with respect to the tilt angle amount, the internal stress is small and it is difficult to break.
- the actuator according to this embodiment when the angle R is given when the actuator is driven at a frequency of 30 [kHz] and an inclination angle width of ⁇ 12 [deg], the maximum internal stress is 0.5 [GPa]. .
- the stress generated when the mirror 31 is tilted is mainly distributed to the support beam 40a, the connecting portion 50a, the movable frame 60, and the drive beam 70.
- the actuator according to the present embodiment can have a mirror tilt sensitivity of 0.56 [deg / V] and a maximum internal stress of 0.48 [GPa].
- the actuator according to Example 2 can change the resonance frequency by changing the width, thickness, cross-sectional shape, length, or the like of both or one of the support beam 40a and the connecting portion 50a, 30 [ It is possible to cope with further speed-up of [kHz] or more without changing the structure.
- the shape of the support beam 40a and / or the connecting portion 50a is changed, the dimensions of the movable frame 60 and the drive beam 70 may be changed accordingly.
- FIGS. 17 to 20 are diagrams illustrating examples of electrode arrangement of the resonance drive unit 81 of the actuator according to the second embodiment.
- FIG. 21A is a perspective view showing the resonance drive unit 81 shown in FIGS. 17 to 20 in which the drive source 20 is provided only on the drive beam 70.
- FIG. 21B is a perspective view showing a resonance drive unit 81 in which the drive beam 70 and the movable frame 60 are provided with the drive source 20a having the same polarity.
- FIG. 21C is a perspective view showing the resonance driving unit 81 in which the driving beam 70 and the movable frame 60 are provided with the driving sources 20a having different polarities.
- FIG. 21A The configuration in FIG. 21A is the same as the configuration shown in FIG. 17-20, and therefore, the same reference numerals are assigned to the same components and the description thereof is omitted.
- FIG. 21B is different from FIG. 21A in that not only the drive beam 70 but also the movable frame 60 is provided with drive sources 27 and 28.
- the polarity of the applied voltage of the drive sources 27 and 28 is such that the voltage having the same polarity as that of the drive frame 71 is applied to the movable frame 61 connected to the drive beam 71, and the movable frame 62 connected to the drive beam 72 is applied to the movable frame 62.
- a voltage having the same polarity as that of the drive frame 72 is applied. That is, a voltage having the same polarity is applied to the drive source 25 and the drive source 27, and a voltage having the same polarity is applied to the drive source 26 and the drive source 28.
- the voltage applied to the drive sources 25 and 27 and the voltage applied to the drive sources 26 and 28 have opposite polarities. It is the method of applying the same voltage as FIG. 15B in Example 1.
- FIG. 21C is the same as FIG. 21B in that the drive sources 27 and 28 are provided not only on the drive beam 70 but also on the movable frame 60.
- the polarity of the voltage applied to the drive source 28 of the movable frame 61 connected to the drive beam 71 is opposite to the voltage polarity applied to the drive source 25 of the drive beam 71.
- the polarity of the voltage applied to the drive source 27 of the movable frame 62 is different from the polarity of the voltage applied to the drive source 26 of the drive beam 72, which is different from the electrode arrangement in FIG. 21B.
- This is a method of applying a voltage similar to FIG. 15C of the first embodiment.
- FIG. 22 is a diagram showing the tilt sensitivity and the maximum internal stress with respect to the applied voltage in each electrode arrangement shown in FIGS. 21A, 21B, and 21C.
- the actuator having the greatest inclination sensitivity is an actuator having the resonance drive unit 81a having the configuration shown in FIG. 21B.
- the maximum internal stress is also the smallest value in the resonance drive unit 81 configured in FIG. 21A and the resonance drive unit 81a configured in FIG. 21B. That is, in the actuator according to the second embodiment, the electrode arrangement shown in FIG. 21B in which the same polarity voltage is applied to the movable frame 60 connected to the driving beam 70 to perform resonance driving is optimal. This is a different result from the actuator according to the first embodiment.
- the optimal electrode arrangement is that when the driving beam 70 to be connected and the drive source 20b of the movable frame 60 are applied with voltages of different polarities and are driven to resonate,
- the optimum configuration is when the same driving voltage is applied to the driving beam 70 to be connected and the driving source 20a of the movable frame 60 to drive resonance.
- FIG. 23A and 23B are diagrams for explaining the reason why the optimum electrode arrangement of the actuator according to the first embodiment is different from the optimum electrode arrangement of the actuator according to the second embodiment.
- FIG. 23A is a side view showing a deformation state at the time of resonance driving of the actuator according to the first embodiment
- FIG. 23B is a side view showing a deformation state at the time of resonance driving of the actuator according to the second embodiment.
- the actuator in the actuator according to the first embodiment, as the movable frame 60 is displaced up and down in the opposite direction to the driving beam 70, the center beam 40 and the connecting portion 50 are inclined, and the mirror 31 is rotated.
- the angle increases. That is, as the warp of the movable frame 61 and the drive beam 71 and the warp of the movable frame 62 and the drive beam 72 are larger, the central beam 40 and the connecting portion 50 are inclined, and the inclination angle of the mirror 31 is increased.
- the rotation angle of 31 increases. That is, as the difference between the upward displacement of the movable frame 61 and the driving beam 71 and the downward displacement of the movable frame 62 and the driving beam 72 is larger, the support beam 41 and the support beam 42 are vertically opened and the level difference is increased. The tilt angle increases.
- the tilting mechanism is completely different at the same frequency and the same resonance mode depending on whether the support beams 40 and 40a are one or two.
- Example 1 Example 2 can be combined.
- FIG. 24A and FIG. 24B are perspective views illustrating the entire configuration of the actuator according to the third embodiment.
- FIG. 24A is a perspective view from the front surface side of the actuator according to the third embodiment
- FIG. 24B is a perspective view from the back surface side of the actuator according to the third embodiment.
- the actuator according to the third embodiment includes a movable part 100 and a fixed frame 110.
- the fixed frame 100 is an outer frame that is in a fixed state even during driving, and the movable portion 110 is connected and supported by the fixed frame 100.
- the movable unit 100 includes a driving object 30, a pair of support beams 40b, a pair of connecting portions 50b, and a pair of driving beams 73.
- the connecting portion 50b includes a driving beam side connecting portion 53 connected to the driving beam 73, and a support beam side connecting portion 54 that connects the driving beam side connecting portion 53 and the support beam 40b.
- the surface side of the actuator according to Example 3 is entirely composed of the Si active layer 13.
- the actuator according to the third embodiment is the same as the actuator according to the first embodiment in that the driving beam 30 is connected to the support beam 40 extending along the rotation axis direction. However, the actuator according to the third embodiment is different from the actuator according to the first and second embodiments in that the movable frame 60 is not provided.
- the support beam side coupling portion 54 of the coupling portion 50b extends long in the direction orthogonal to the rotation axis X, and is configured to be approximately the same as or longer than the width of the driving object 30.
- the drive beam side connection portion 53 extends from the support beam side connection portion 54 so as to return to the drive beam 73 side in parallel with the rotation axis X and is directly connected to the drive beam 73. Therefore, the connecting portion 50b includes a driving source side connecting portion 53 that is directly connected to the driving beam 73 instead of the movable frame 60, and a support beam side connecting portion 54 that connects the driving beam side connecting portion 53 and the support beam 40b. Consists of including.
- the position where the support beam side connection portion 54 and the drive beam side connection portion 53 are connected is configured to be the same as the end portion of the drive object 30 in the direction perpendicular to the rotation axis X or outside of it. May be.
- the length of the driving beam side connecting portion 53 extending toward the driving object 30 in parallel with the rotation axis X can be secured sufficiently long, and the absorption of stress can be sufficiently reduced.
- the length of the support beam side connection portion 54 extending perpendicularly to the rotation axis X is increased, the support beam side connection portion 54 and the drive beam 73 are connected by the drive beam side connection portion 53, and the movable frame
- the configuration may be such that 60 is omitted.
- the tilting force generated by the drive beam 73 is directly transmitted to the drive beam side connecting portion 53 of the connecting portion 50b.
- the drive beam side connection portion 53 can transmit the tilting force of the drive beam 73 to the support beam side connection portion 54 and has a beam structure that reduces stress, so that stress distribution can be appropriately performed. .
- a smaller and space-saving actuator can be configured.
- the drive beam 73 has a larger width parallel to the rotation axis X than the actuator drive source 70 according to the first and second embodiments, and the film formation area of the piezoelectric element 21 that is the drive source 20 is increased. ing. Thereby, it is possible to further improve the tilt angle sensitivity and drive at higher speed. That is, it is possible to obtain an actuator having a sufficient tilt angle sensitivity while being small.
- the driving beam 73 is the same as the actuator according to the first and second embodiments in that a voltage that is displaced in different directions on both sides of the rotation axis X is applied.
- the actuator according to the third embodiment is a single-axis type actuator that tilts around the rotation axis X.
- the actuator according to Example 3 can be configured as a single-axis actuator.
- an actuator that tilts and drives around an axis different from the rotation axis X may be incorporated in the area of the fixed frame 110 to form a biaxial actuator.
- the actuator according to the third embodiment can be applied to a uniaxial actuator and a biaxial actuator.
- FIG. 24B the back side configuration of the actuator according to the third embodiment is shown.
- the movable part 100 shown in FIG. 24A is configured to be thin as a beam 15, and the fixed frame 110 is a thick silicon substrate. 11.
- FIGS. 25A to 25C are diagrams for explaining parameter setting for improving the tilt sensitivity of the actuator and reducing the maximum stress according to the third embodiment.
- FIG. 25A is a diagram illustrating a planar configuration of the movable portion 100 of the actuator according to the third embodiment.
- a rotation axis Y perpendicular to the rotation axis X and passing through the center of the drive target 30 is shown.
- the width of the support beam 40b is set to A
- the width of the drive beam side connecting portion 53 is set to A / 2 that is 1 ⁇ 2 of the width A of the support beam 40b.
- the length of the support beam side connecting portion 54 is B
- the distance from the outer ends of the support beam 40b and the drive beam side connecting portion 53 to the rotation axis Y is C.
- the resonance frequency is set to a constant 30 kHz. Note that there are four drive beam side connecting portions 53, but they are all set to a common value.
- FIG. 25B shows the change characteristic of the tilt sensitivity [deg / V] with respect to the change of the width A of the support beam 40b and the length B of the support beam side connecting portion 54 when the drive object 30 is tilted by an angle of ⁇ 12 deg.
- the tilt sensitivity is 4.50 deg / V
- the voltage for tilting at a tilt angle of ⁇ 12 deg is 0-5.3 V
- the maximum stress can be 0.38 GPa
- the maximum stress is small
- the tilt sensitivity is high. Good characteristics can be obtained.
- FIG. 26A and FIG. 26B are perspective views illustrating the entire configuration of the actuator according to the fourth embodiment.
- FIG. 26A is a diagram illustrating the configuration of the front surface side of the actuator according to the fourth embodiment
- FIG. 26B is a diagram illustrating the configuration of the back surface side of the actuator according to the fourth embodiment.
- the actuator according to the fourth embodiment includes a movable portion 101 and a fixed frame 111.
- the fixed frame 111 is an outer frame that is in a fixed state during driving, and the movable portion 111 is connected to and supported by the fixed frame 111 in the same manner as the actuator according to the third embodiment.
- the movable part 101 includes a driving object 30, a pair of support beams 40c, and a pair of connection parts 50c.
- the connection part 50c includes a drive beam side connection part 53 and a support beam side connection part 54. The point of inclusion is the same as that of the actuator according to the third embodiment.
- the actuator according to the fourth embodiment is different from the actuator according to the third embodiment in that the support beam 40c is separated along the rotation axis X and is two.
- the configuration of the support beam 40c is similar to that of the support beam 40a of the actuator according to the second embodiment.
- the connection part 50c is also separated along the rotation axis X, and includes two connection parts 50c.
- the two connecting portions 50c each have a shape that extends perpendicularly to the rotation axis X in the outward direction, and each has a U shape together with the support beam 40c.
- the actuator according to the fourth embodiment has a configuration in which a large tilt angle can be obtained by driving with the height difference between the two support beams 40c being increased. Yes.
- the length of the support beam side connecting portion 54 extending in the direction perpendicular to the rotation axis X of the connecting portion 50c is equal to or longer than the width of the driven object 30, and the movable frame 60 is required.
- the point which is not performed is the same as that of the actuator according to the third embodiment. Thereby, the movable frame 60 is not required, and a small and space-saving actuator can be configured.
- the connecting portion 50c since the connecting portion 50c has a beam structure with elastic force in both the driving beam side connecting portion 53 and the support beam side connecting portion 54, the connecting portion 50c absorbs applied stress.
- the driven object 30 can be tilted and moved stably.
- the area of the drive beam 73 on which the drive source 20 is formed can be increased, and sufficient tilt angle sensitivity and high-speed drive can be realized, similar to the actuator according to the third embodiment.
- FIG. 26B a perspective view from the back side of the actuator according to the fourth embodiment is shown, but the outer fixed frame 111 is formed of a thick silicon substrate 11, and the movable portion 101 is a thin elastic body as the beam 15.
- the point constituted by is the same as that of the actuator according to the third embodiment.
- FIGS. 27A to 27C are diagrams for explaining a method for optimally designing the shape of the movable portion 101 of the actuator according to the fourth embodiment.
- FIG. 27A is a diagram illustrating a planar configuration of the actuator according to the fourth embodiment.
- the support beam 40c is separated along the rotation axis X and includes two support beams 41a and 42a.
- the connecting part 50c is also divided into two parts with the rotation axis X as a boundary, and includes two connecting parts 51a and 52a.
- a connecting portion 51a is connected to the support beam 41a, and a connecting portion 52a is connected to the support beam 42a.
- the support beam side coupling portions 54 of the coupling portions 51 a and 52 a extend in a direction perpendicular to the rotation axis X and away from the rotation axis X, and are again centered along the rotation axis X at the drive source side coupling portion 53. It has a shape to return to.
- each parameter is determined as follows.
- the width of each one of the support beams 40c 41a and 42a is 0.06 mm, and similarly the width of the drive beam side connecting portion 53 of the connecting portion 50c is 0.06 mm.
- the resonance frequency can be greatly changed by changing the width of the support beam 40c that elastically supports the drive object 30 and the width of the drive beam side connecting portion 53.
- the widths of the support beam 40c and the drive beam side connecting portion 53 are made constant, and other parameters are moved.
- the resonance frequency can be adjusted to a constant 30 kHz by making C variable. That is, the resonance frequency can be finely adjusted.
- FIG. 27B shows the distance A between the two support beams 41a and 42a and the distance between the support beam 40c and the drive beam side connecting portion 53 when the drive target 30 is tilted by ⁇ 12 deg under the conditions of FIG. 27A. It is a figure which shows the change characteristic of the maximum stress when the distance (length of the support beam side connection part 54) B is used as a parameter.
- the horizontal axis indicates the length B [mm] of the support beam side connecting portion 54
- the vertical axis indicates the maximum stress [GPa].
- FIG. 27B shows that the smaller the value of A, the smaller the maximum stress.
- the connection portion near the middle between the support beam 40c and the drive beam side connection portion 53. Stress concentrates at the position 50c.
- the width of the support beam 40c and the drive beam side connection portion 53 is 0.06 mm, which is narrower than the width of the support beam side connection portion 50c connecting them, and includes a twisted portion. become. Therefore, when the length of the support beam side connecting portion 54 is shortened, stress concentrates on the twisted portion of the drive beam side connecting portion 53, and when the length of the support beam side connecting portion 54 is increased, the stress is added to the twisted portion of the support beam 40c. Although stress concentrates, the stress concentration part can be moved to the support beam side connection part 54 by making the length of the support beam side connection part 54 into an intermediate length. By moving the stress concentration portion to the support beam connecting portion 54 that is wide and does not include a large twist portion, the stress when the drive target 30 is tilted by ⁇ 12 deg can be reduced and a minimum value can be obtained. .
- the distance B at which the stress indicates a limit value of 0.5 GPa or less satisfies not only Bmin that satisfies the above-described expression (1) but also the condition of the following expression (4).
- FIG. 27C is a diagram showing an area where the above relational expressions (1) to (4) satisfy.
- the horizontal axis indicates the distance A [mm] between the support beams 41a and 42a
- the vertical axis indicates the length B [mm] of the support beam side connecting portion 54.
- the range satisfying the equation (4) is indicated by hatching, and the equation (1) is shown between the equations (2) and (3) which are the boundary lines of the region. From the viewpoint of reducing the stress, the combination of A and B satisfying the expression (1) is optimal, but if it falls within the range of the expression (4), it can be said that there is no problem in design. Therefore, it can be seen that the distance A between the support beams 41a and 42a and the length B of the support beam side connecting portion 54 may be determined within the hatched range that satisfies the equation (4).
- FIG. 29 is a diagram showing the characteristics of the tilt sensitivity when the distance A between the support beams 41a and 42a and the length B of the support beam side connecting portion 54 are used as parameters.
- the horizontal axis indicates the length B [mm] of the support beam side connecting portion 54
- the vertical axis indicates the tilt sensitivity [deg / V].
- the tilt sensitivity is 3.58 deg / V
- the voltage for tilting at a tilt angle of ⁇ 12 deg is 0 to 6.5 V
- the maximum stress is 0.49 GPa.
- the actuator according to the fourth embodiment has lower tilt angle sensitivity and larger maximum stress than the actuator according to the third embodiment, but the actuator according to the fourth embodiment is smaller than the actuator according to the third embodiment. Can be formed. Therefore, the actuator according to the third embodiment may be used when an actuator with higher tilt sensitivity is used, and the actuator according to the fourth embodiment may be used when a smaller actuator is desired. As described above, the actuator according to the third embodiment and the actuator according to the fourth embodiment can be properly used depending on the application.
- the driving target in the third and fourth embodiments may be, for example, the mirror 31.
- the example in which the actuator is configured as a uniaxial actuator has been described.
- the actuator may be configured as a biaxial actuator.
- FIG. 30 is a diagram illustrating an overall configuration of a projector 200 according to Embodiment 5 of the present invention.
- the actuator according to the first to fourth embodiments is applied to an optical scanning device, for example, the projector 200 will be described.
- the projector 200 includes a first piezoelectric mirror 120, a second piezoelectric mirror 121, a laser diode 130, a collimator lens 140, and a CPU (Central Processing Unit) 150. And a laser diode driver IC (Integrated Circuit) 160, a first piezoelectric mirror driver IC 170, and a second piezoelectric mirror driver IC 171. Further, in FIG. 30, a screen 210 is shown as a related component.
- the projector 200 is a device that projects and projects an image on the screen 210.
- the first piezoelectric mirror 120 is configured as a single-axis drive actuator that tilts and drives the mirror 31 about the rotation axis X, and is applied to the projector 300.
- the second piezoelectric mirror 120 is configured as a single-axis drive actuator that tilts and drives the mirror 31 around the rotation axis Y, and is applied to the projector 300.
- the laser diode 130 is a light source that emits laser light.
- the laser light emitted from the laser diode 130 may be diverging light.
- the collimator lens 140 is a means for converting divergent light into parallel light.
- the parallel light may include, for example, P-polarized light that vibrates in the light incident surface and S-polarized light that vibrates perpendicularly to the light incident surface.
- Parallel light from the collimator lens 220 is applied to the first piezoelectric mirror 120 and reflected by the mirror 31.
- the first piezoelectric mirror 120 drives the mirror 31 to tilt around the axis of rotation X, and gives a motion such that the reflected laser beam vibrates perpendicularly to the axis of rotation X. All the actuators described in the first to fourth embodiments can be applied to the first piezoelectric mirror 120.
- the reflected light from the first piezoelectric mirror 120 is applied to the second piezoelectric mirror 121.
- the second piezoelectric mirror 121 drives the mirror 31 to tilt around the rotation axis Y, and reflects the laser light from the first piezoelectric mirror 120. Thereby, the movement which vibrates perpendicularly to the rotation axis Y is given to reflected light.
- all the actuators according to the first to fourth embodiments can be applied to the second piezoelectric mirror 121 as well.
- the laser beam reflected by the second piezoelectric mirror 121 is applied to the screen 210.
- the laser light on the screen 210 can be scanned in two axes in the vertical direction by combining the first piezoelectric mirror 120 and the second piezoelectric mirror 121 in one axis, and an image can be formed.
- the CPU 150 is means for controlling the laser diode driver IC 160, the first piezoelectric mirror driver IC 170, and the second piezoelectric mirror driver IC 171.
- the laser diode driver IC 160 is means for driving the laser diode 130.
- the first piezoelectric mirror driver IC 170 is means for driving the first piezoelectric mirror 120, and the second piezoelectric mirror driver IC 171 is means for driving the second piezoelectric mirror 121.
- the CPU 150 controls the laser driver IC 160 and drives the laser diode 130. Further, the CPU 150 controls the first piezoelectric mirror driver 170 to control the tilting operation of the first piezoelectric mirror 120 around the rotation axis X, and also controls the second piezoelectric mirror driver 171 to control the second piezoelectric mirror driver 171. The tilting operation of the piezoelectric mirror 121 around the rotation axis Y is controlled. As the first piezoelectric mirror 120 and the second piezoelectric mirror 121 tilt, the laser beam is moved around both rotation axes X and Y and reflected by the mirror 31 of the second piezoelectric mirror 121. Light is scanned on the screen 210 to form an image on the screen 210.
- the actuator according to the present embodiment can be suitably applied as the piezoelectric mirrors 120 and 121 for the projector 200, and can drive the mirror 31 in a stable state with a small stress load to project an image. .
- the first piezoelectric mirror 120 performs tilt driving around the rotation axis X
- the second piezoelectric mirror 121 performs tilt driving around the rotation axis Y.
- the first rotation axis for tilting and driving the first piezoelectric mirror 120 and the second rotation axis for tilting and driving the second piezoelectric mirror 121 only need to be in different directions. It can be a combination of the rotation axes in the direction of.
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Abstract
Description
上記の(1)式は、各特性曲線の極小値を結んで得られた関係式である。
また、各特性曲線が、応力が0.5GPaで交わるBの値が大きい方の関係式は、下記の(3)式のようになる。
よって、応力が限界値の0.5GPa以下を示す距離Bは、上記の(1)式を満たすBminだけではなく、下記の(4)式の条件を満足する。
図27Cは、上記の(1)~(4)の関係式が満たす領域を示す図である。図27Cにおいて、横軸は支持梁41a、42a間の距離A〔mm〕、縦軸は支持梁側連結部54の長さB〔mm〕を示している。図27Cにおいて、(4)式を満たす範囲が斜線で示されており、領域の境界線である(2)式と(3)式の間に、(1)式が示されている。応力の低減の観点から見れば、(1)式を満たすA、Bの組み合わせが最適であるが、(4)式の範囲内に入っていれば、設計上問題無いと言える。よって、(4)式を満たす斜線の範囲内で支持梁41a、42a間の距離A及び支持梁側連結部54の長さBを定めればよいことが分かる。
Claims (17)
- 駆動対象物を回転軸周りに傾動駆動させるアクチュエータであって、
前記駆動対象物を前記回転軸に沿って両側から支持する1対の支持梁と、
前記駆動対象物及び前記1対の支持梁を、前記回転軸と直交する方向の両側から挟むように配置された1対の可動枠と、
前記可動枠に曲げ振動を付与する駆動源と、
前記1対の可動枠と前記支持梁の先端部を、複数の梁を含む梁構造で連結し、前記曲げ振動をねじれ振動に変換して前記支持梁に伝達する1対の連結部と、
を有することを特徴とするアクチュエータ。 - 前記支持梁の前記先端部は、前記可動枠の前記回転軸方向の幅よりも外側まで延在し、
前記連結部は、前記先端部から前記回転軸と直交する方向に両側に延びる梁と、前記梁の先端と前記可動枠とを前記回転軸方向に延在して連結する錨形の前記梁構造を有することを特徴とする請求項1に記載のアクチュエータ。 - 前記可動枠に、前記回転軸に直交する方向の両側から前記可動枠を挟むように連結された1対の駆動梁を有し、
前記1対の駆動梁は、前記駆動源を備えることを特徴とする請求項1に記載のアクチュエータ。 - 前記駆動源は、電圧の印加により伸縮する圧電素子であり、
前記1対の駆動梁の前記圧電素子には、互いに異なる方向に変位する印加されることを特徴とする請求項3に記載のアクチュエータ。 - 前記1対の可動枠が、前記圧電素子を更に有し、
連結された同じ側の前記駆動梁と前記可動枠の前記圧電素子には、互いに逆方向に変位する電圧が印加されることを特徴とする請求項4に記載のアクチュエータ。 - 前記1対の支持梁は、前記回転軸に沿って2本の支持梁が平行に延在して片側の前記支持梁を構成し、
前記連結部は、前記2本の支持梁の各々を、前記1対の可動枠の近い方に連結することを特徴とする請求項3に記載のアクチュエータ。 - 前記1対の可動枠が、前記圧電素子を更に有し、
連結された同じ側の前記駆動梁と前記可動枠の前記圧電素子には、互いに同方向に変位する電圧が印加されることを特徴とする請求項6に記載のアクチュエータ。 - 前記駆動対象物と前記支持梁の連結箇所に生じる角と、前記支持梁と前記連結部の連結箇所に生じる角と、前記連結部と前記可動枠の連結箇所に生じる角とが、丸められていることを特徴とする請求項3に記載のアクチュエータ。
- 前記可動枠と前記駆動梁の連結箇所に生じる角が、丸められていることを特徴とする請求項3に記載のアクチュエータ。
- 前記圧電素子は、共振駆動により振動を発生させることを特徴とする請求項3に記載のアクチュエータ。
- 前記駆動対象物と前記可動枠が、同一の方向に傾く共振モードで前記共振駆動を行うことを特徴とする請求項10に記載のアクチュエータ。
- 駆動対象物を回転軸周りに傾動駆動させるアクチュエータであって、
前記駆動対象物を前記回転軸に沿って両側から支持する1対の支持梁と、
前記支持梁に連結され前記回転軸に垂直な方向に延在する支持梁側連結部と、前記支持梁側連結部に連結され前記回転軸と平行に前記駆動対象物側に向かって延びる駆動梁側連結部とを含む連結部と、
前記駆動梁側連結部に連結され、前記回転軸と垂直な方向の両側から前記駆動対象物を挟むように配置され、前記回転軸の両側で上下逆方向に反る変形をすることにより、前記駆動梁側連結部に傾動力を付与する駆動梁と、
を有することを特徴とするアクチュエータ。 - 前記支持梁は、前記回転軸に沿って2つに分離された構造を有し、
前記支持梁側連結部は、前記回転軸から離れる方向に延びることを特徴とする請求項12に記載のアクチュエータ。 - 前記支持梁側連結部が前記駆動梁側連結部と連結されている位置は、前記回転軸と垂直な方向において、前記駆動対象物の端部と同じか前記端部よりも外側にあることを特徴とする請求項12に記載のアクチュエータ。
- 前記駆動対象物は、ミラーであることを特徴とする請求項1に記載のアクチュエータ。
- 請求項1に記載のアクチュエータと、
光を前記アクチュエータに向けて発射する光源とを備え、
前記アクチュエータのミラーを傾動駆動させることにより、前記ミラーにより反射された前記光を走査させることを特徴とする光走査装置。 - 請求項1に記載のアクチュエータを複数有し、スクリーンに映像を映し出す光走査装置であって、
光を発射する光源と、
前記光源からの前記光をミラーにより反射し、前記ミラーを第1の回転軸の軸周りに傾動駆動させる第1のアクチュエータと、
前記第1のアクチュエータからの前記光をミラーにより反射し、前記ミラーを第2の回転軸の軸周りに傾動駆動させる第2のアクチュエータとを有し、
前記第2のアクチュエータからの前記光を前記スクリーン上に走査させ、映像を形成することを特徴とする光走査装置。
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CN104272166A (zh) * | 2012-05-07 | 2015-01-07 | 松下知识产权经营株式会社 | 光学反射元件 |
JP2014238581A (ja) * | 2014-06-24 | 2014-12-18 | ミツミ電機株式会社 | 光走査装置 |
JP2017151476A (ja) * | 2017-05-24 | 2017-08-31 | ミツミ電機株式会社 | 光走査装置 |
WO2020246245A1 (ja) * | 2019-06-06 | 2020-12-10 | スタンレー電気株式会社 | 光偏向器及び製造方法 |
JP2020201308A (ja) * | 2019-06-06 | 2020-12-17 | スタンレー電気株式会社 | 光偏向器及び製造方法 |
JP7297538B2 (ja) | 2019-06-06 | 2023-06-26 | スタンレー電気株式会社 | 光偏向器及び製造方法 |
CN112165273A (zh) * | 2020-09-24 | 2021-01-01 | 南京工程学院 | 基于同向偏心约束和斜压电陶瓷的耦合模态型超声波电机 |
CN112165273B (zh) * | 2020-09-24 | 2021-11-30 | 南京工程学院 | 基于同向偏心约束和斜压电陶瓷的耦合模态型超声波电机 |
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US8610983B2 (en) | 2013-12-17 |
US20140016170A1 (en) | 2014-01-16 |
JP5444968B2 (ja) | 2014-03-19 |
CN103840704B (zh) | 2016-09-14 |
JP2010288435A (ja) | 2010-12-24 |
US8681404B2 (en) | 2014-03-25 |
US20120062970A1 (en) | 2012-03-15 |
CN102422521A (zh) | 2012-04-18 |
CN103840704A (zh) | 2014-06-04 |
CN102422521B (zh) | 2014-09-03 |
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