WO2010108399A1 - 侧向耦合光纤构件及其加工方法 - Google Patents

侧向耦合光纤构件及其加工方法 Download PDF

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Publication number
WO2010108399A1
WO2010108399A1 PCT/CN2010/070505 CN2010070505W WO2010108399A1 WO 2010108399 A1 WO2010108399 A1 WO 2010108399A1 CN 2010070505 W CN2010070505 W CN 2010070505W WO 2010108399 A1 WO2010108399 A1 WO 2010108399A1
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WO
WIPO (PCT)
Prior art keywords
substrate
optical fiber
laterally coupled
fiber
disposed
Prior art date
Application number
PCT/CN2010/070505
Other languages
English (en)
French (fr)
Inventor
周丹
Original Assignee
武汉电信器件有限公司
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Filing date
Publication date
Application filed by 武汉电信器件有限公司 filed Critical 武汉电信器件有限公司
Priority to EP10755399A priority Critical patent/EP2413171A4/en
Priority to JP2012501120A priority patent/JP2012521570A/ja
Priority to US13/255,870 priority patent/US8827572B2/en
Publication of WO2010108399A1 publication Critical patent/WO2010108399A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Definitions

  • the present invention relates to an optical coupling package technology for an optoelectronic device, and more particularly to a laterally coupled fiber member for an optical communication device of the optical communication field and a method of processing the same.
  • FIG. 1 it is a schematic diagram of a laterally coupled fiber optic component of the prior art. That is, the input and output of the beam at the end face of the fiber do not proceed along the axial direction of the fiber, but in the radial direction perpendicular to the axis.
  • This lateral coupling is accomplished by machining the fiber end face 140 to form a beveled end surface that satisfies the condition of total reflection angle.
  • the laterally coupled structure is generally applied to the coupling between the optical fiber and the surface type photoelectric conversion element 100 in a certain type of package form, and is relatively common, such as the optical fiber 110 of the butterfly package and the semiconductor light receiving chip of the surface type structure. coupling.
  • FIG. 2 there is shown a schematic representation of an embodiment of a laterally coupled fiber optic member of the prior art.
  • the fixing of the optical fiber 110 in a spatial position is achieved by a package tube 150 of a generally metallic material encapsulating the photoelectric conversion element 100.
  • the package body 150 has a circular through hole 160 through which the optical fiber can pass, and a certain portion of the optical fiber 110 is fixed in the through hole 160.
  • a typical fixing process is to apply a metal sleeve 170 tightly on the bare fiber 110 from which the outer protective material has been removed, and then solder the optical fiber 110 having the metal sheath 170 to the through hole 160 by metal solder. , forming a sealed, stable package.
  • the optical fiber needs to be placed on the upper portion of the surface type photoelectric conversion element. This is determined by two main reasons: 1.
  • the structure in which the working surface of the photoelectric conversion element faces upward and the end face of the optical fiber is placed on the upper surface of the working surface is easy to observe and align.
  • the effective working area of the working surface of the photoelectric conversion element is typically a circular area 120 of defined size surrounded by a circle of metal electrodes 130 (as shown in Figure 1), and the viewing and alignment operations are performed under a microscope.
  • the extraction electrode 130 of the photoelectric conversion element is generally located on the same side as the working surface of the component
  • the lead-out electrode to the component base, the electrical connections between the components and between the package body are usually wire bonded, the leads are typically very thin gold wires, by special leads
  • the bonding device is completed, and the wire bonding process requires that the respective electrodes face up. Therefore, the working surface of the photoelectric conversion element must also be placed face up.
  • the prior art still has the problem of stability of the optical fiber fixing due to the fixing means limited by the optical fiber.
  • This problem begins to stand out when the area of the photoelectric conversion element has a small work area.
  • the size of the working area directly affects the rate at which the chip can operate. The higher the rate, the smaller the area of the working area required to be designed. Since the fixing of the optical fiber in the prior art is not directly fixed to the end surface, but a certain limited area away from the end surface, the optical fiber end surface can have a large degree of freedom in space, especially with respect to the fixed portion.
  • the change of the corner angle can produce a large distance movement at the end face of the fiber;
  • the fiber fixing is a metal member with a large thermal expansion and contraction effect, including a metal solder which is unevenly distributed, and the metallization is a hermetic package.
  • the application rate is increasing towards higher rates, and electrical packaging for optoelectronic devices is also required.
  • the blocking and parasitic effects of the gold wire lead on the high frequency electrical signal increase with the increase of the signal frequency, and the performance will be significantly deteriorated at a certain stage.
  • this frequency variation can be accommodated by reducing the length of the leads, but limited by the wire bonding process technology, the length of the leads cannot be reduced without limitation.
  • the signal connection is as short as 100 microns, it is very difficult to use wire bonding techniques, which basically corresponds to the lead length requirement at a rate of 40 Gbits per second.
  • flip-chip technology of the chip, that is, the lead-out electrode of the chip is directed downward, and is directly bonded to the circuit portion on the pedestal or the substrate, and the commonly used soldering method such as soldering is used.
  • the connection distance of this connection will be the shortest, which can meet the requirements of high speed performance.
  • flipping is also beneficial to improve heat dissipation and increase electrical connection density.
  • Flip-chip technology is already an existing technology in the field of microelectronics. For optoelectronic components, one of the main types is that the extraction electrode is on the same side as the working surface on which the optical coupling is implemented.
  • flip-chip technology requires the working surface to be placed face down, which is not compatible with existing fiber-coupled packaging technology. compatible. Since the positioning and fixing of the optical fiber in the prior art are performed through the through holes in the package tube body, all the fiber coupling processes must be completed by means of the package tube body, which causes the optical fiber to be placed on the photoelectric conversion element with the working surface facing downward. The coupling method below is difficult to perform because the fiber end face is not visible. Therefore, the existing optical coupling technology limits the application of component flip-chip technology in many optoelectronic devices. Summary of the invention
  • the technical solution of the present invention is to provide a laterally coupled optical fiber component, which comprises:
  • a first substrate having at least one concave groove disposed on a surface thereof;
  • the bevel is used to achieve total reflection of the light beam conducted in the fiber.
  • the first substrate is fixed to the second substrate to ensure that the optical fiber has no degree of freedom therebetween.
  • one end surface of the first substrate and the second substrate are on the same plane as the inclined surface of the optical fiber.
  • the second substrate is provided with a first light-passing hole, and the first light-passing hole corresponds to a beam path that is totally reflected by the inclined surface of the optical fiber; or the second substrate is used for comparison
  • the second substrate is an optical expansion base, and at least one optical component is disposed thereon.
  • the optical element disposed on the second substrate may be a lens, and the transmissive area of the lens coincides with the projected area of the totally reflected beam.
  • a spacer is disposed on the second substrate, the spacer has a slot, and the lens is adapted to the slot.
  • the method further includes: a light receiving chip substrate disposed on the spacer, wherein the light receiving chip substrate is provided with a second light passing hole corresponding to the projection area of the lens;
  • the light receiving chip is disposed on the second light passing hole and combined with the light receiving chip substrate.
  • the present invention also provides a method for processing a laterally coupled fiber optic member, comprising: disposing an optical fiber in a shaped slot on a first substrate;
  • One end surface of the optical fiber, the first substrate and the second substrate is ground or cut to form a slope on the same plane, so that the light beam conducted in the optical fiber is totally reflected at the inclined surface.
  • the steps of keeping the first substrate and the second substrate in a horizontal state after being fixed are:
  • At least one optical fiber having the same diameter as the optical fiber is disposed in another IS-shaped groove of the first substrate, and then the first substrate and the second substrate are fixedly connected.
  • the beneficial effects of the present invention are as follows: Firstly, as a laterally coupled optical fiber member, it provides direct and complete limitation for the end face of the coupled optical fiber, and can be achieved by the cooperation with the photoelectric conversion element mounting substrate. Stable and reliable fiber lateral coupling required; secondly, the laterally coupled fiber component of the present invention is flexible in installation, and is convenient to be compatible with other packaging technologies including component flipping;
  • laterally coupled fiber optic components of the present invention provide a new assembly platform that can be expanded into a variety of integrated laterally coupled fiber optic components, including extending it to a complete component mounting platform.
  • FIG. 1 is a schematic diagram of a laterally coupled fiber optic member in the prior art
  • FIG. 2 is a schematic view showing an embodiment of a laterally coupled optical fiber member in the prior art
  • FIG. 3 is a perspective view showing a first embodiment of a laterally coupled optical fiber member according to the present invention.
  • FIG. 4 is a side view showing a first embodiment of a laterally coupled optical fiber member of the present invention.
  • Figure 5 is a perspective view showing a second embodiment of the laterally coupled optical fiber member of the present invention.
  • FIG. 6 is a side view showing a second embodiment of a laterally coupled optical fiber member of the present invention.
  • Figure 7 is a side elevational view of a third embodiment of a laterally coupled fiber optic member of the present invention.
  • the laterally coupled fiber optic member of the present invention comprises: an at least one quadrangular slot a first substrate 200 , an optical fiber 210 located in the shaped slot, and a second substrate 220 disposed on the IS-shaped slot substrate and covering the plane of the optical fiber in the IS slot; the shape of the slot needs to be placed
  • the optical fiber 210 therein is tangential to both side walls of the slot, and a portion of the optical fiber is exposed to the surface of the quadrangular groove to make contact with the second substrate 220.
  • the optical fiber 210 is completely confined within the concave slot.
  • the optical fiber 210 here is a bare optical fiber in which a protective layer such as an outer coating material and a plastic sheath is removed to expose the inner optical fiber.
  • the inner optical fiber material is quartz with a fiber diameter of 125 microns.
  • the second substrate 220 and the first substrate 200 may be fixed together by means of adhesive 230.
  • adhesive 230 For example, it can be adhered with a simple UV adhesive. After the glue is applied, the glue is cured under ultraviolet light to tightly connect the parts together. In the case of bonding and fixing to form a tight connection, the optical fiber
  • the degree of freedom in the groove 210 is completely lost, including the translation of the fiber 210 along the axial direction of the groove and the rotation along its own axis, so that the position and state of the fiber end face 240 will be completely determined by the laterally coupled fiber member.
  • the end face 240 of the optical fiber 210 is an oblique end face that is machined to meet the condition of total reflection angle, causing light traveling along the axial direction of the optical fiber 210 to be converted into lateral travel at the end face. Light, and the orientation of the slope causes the laterally traveling light to be located on the side of the second substrate 220.
  • the second substrate 220 can be formed with a light-passing hole or a gap so that the light beam does not pass directly through the second substrate, and even the second substrate can leave a part of the position of the fiber end surface 240, but There is still an inevitable spill of glue "contamination" light
  • the second substrate 220 can be made of the same or similar material as the optical fiber 210, and the adhesive 230 can also be used with the refractive index of the optical fiber 210 and the second substrate 220. Matching, while light absorption is small, these materials and products are available in practice, and then the optical fiber 210 is completely covered by the second substrate 220.
  • the light beam is equivalent to propagating in the same material, so there is no excessive internal reflection loss and influence.
  • the case where the light beam travels through the upper surface of the second substrate 220 is the same as the case where the optical fiber is input and output along the axial end surface, and the reflection effect of the interface may be included.
  • the optical antireflection film may be selectively plated at the interface. Reduce the occurrence of reflections.
  • the angle ⁇ of the fiber end face 240 is determined according to the critical angle of total reflection of the interface formed by the optical fiber material and the medium environment. When the incident angle of the transmitted beam in the optical fiber 210 at the end face is greater than the critical angle, the beam is at the end face. Complete internal reflection will occur without a transmissive output. Therefore, the value of this bevel angle ⁇ is not unique and can be selected according to the specific requirements for the direction of beam exit and the influence of interface reflection. For the interface formed by quartz and air, the angle of the bevel here can be set to 42 degrees.
  • the second substrate is an optical expansion pedestal on which at least one optical component can be disposed. This is also a feature that needs to be described in the focus of the present invention.
  • FIG. 5 and FIG. 6 are respectively a perspective view and a side view of a second embodiment of the laterally coupled optical fiber component of the present invention.
  • This expansion is derived from an assembly platform function that the second substrate 220 can actually provide.
  • some other optical components such as a lens, a filter, and a polarizer can be easily mounted and fixed. , mirrors, etc., as well as directly mounting some optoelectronic and electronic components on them.
  • the function that the second substrate 220 can provide is no different from the mounting substrate used for the various components to be mounted.
  • a microlens 270 is added to the second substrate 220, and the microlens is obtained by using a semiconductor chip manufacturing process, and the lens diameter can be less than 1 nm.
  • the lens surface is made by photolithography and chemical etching in a semiconductor process. Got it.
  • chip type microlenses 270 are commercially available.
  • Lens material Including quartz and silicon, it is well transmitted through the infrared wavelengths used in the field of optical communications.
  • the microlens 270 can be made into a single-sided lens or a double-sided lens. In this embodiment, a single-sided lens is used, so that the flat surface of the lens substrate can be directly attached to the surface of the second substrate 220, and the mounting is simple.
  • Both the lens surface and the base surface of the microlens 270 may be coated with an anti-reflection coating as needed to reduce the influence of reflection.
  • the bonding between the microlens 270 and the second substrate 220 can also be performed using the index matching adhesive 230.
  • the light beam emitted from the coupling fiber end face 240 passes through the effective area of the lens 270, so that there is a problem of accurate positioning of the lens 270 with respect to the axial point of the fiber end face 240, and then the oblique end face processing can be performed.
  • the alignment of the upper surface of the formed second substrate 220 is indicated by the edge 250.
  • the chip lens 270 can be designed to form a pattern alignment mark on the surface of the material other than the aperture, using the mark, the alignment indicating the edge 250 of the upper surface of the second substrate 220, and other pairs of grooves and the like. With reference to the reference, the positioning of the lens can be accurately performed.
  • Such a microlens 270 with a surface-added coating and a specified alignment mark can be provided by the manufacturer with a corresponding customized service.
  • the lens 270 will increase the control function of the transmitted beam outside the fiber 210, such as for the light output by the fiber 210, which will have a converging effect due to its divergent nature, which is small for the diameter of the receiving region. It is very important for high speed devices.
  • a light-emitting element such as a semiconductor laser diode chip used in the field of optical communication
  • the laser beam emitted therefrom also has a diverging property, so that the lens can perform the same convergence.
  • the thickness of the second substrate 220 itself becomes an important parameter for controlling the optical characteristics of the entire laterally coupled fiber member.
  • FIG. 7 is a side view of a third embodiment of the laterally coupled fiber optic member of the present invention. It is implemented in a fiber-coupled package of a high-speed light-receiving device in the field of optical communication, and is provided with a surface-type semiconductor light-receiving chip 100, and a substrate 300 on which the chip is mounted.
  • the electrical connection of the light receiving chip 100 draws a chip flipping process.
  • the surface electrode of the light-receiving chip 100 is directly bonded to the microwave transfer circuit on the substrate 300 by the alloy solder 310, and the light-receiving chip 100 for the optically coupled working surface is thus placed toward the substrate 300 toward the lower side.
  • the substrate 300 has a second light-passing hole 320 at a corresponding portion, and the hole diameter is smaller than the size of the chip 100, but is much larger than the working area diameter of the light-receiving chip 100 applied to a high-speed occasion.
  • the working area of the light receiving chip 100 is 12 ⁇ m in diameter
  • the second light passing hole 320 can be set to 200 ⁇ m in diameter.
  • a chip type microlens 270 can be further added to make it a new expansion member.
  • the thickness of the second substrate 220 determines the distance parameter of the object 270.
  • a spacer 330 is attached under the substrate 300 of the light receiving chip, and the spacer 330 is bonded to the substrate 300 of the light receiving chip.
  • the spacer 330 has a large rectangular hole or slot 340 in a region corresponding to the second light passing hole 320.
  • the upper surface of the second substrate 220 of the lateral coupling optical fiber member can be adhered to the lower surface of the spacer 330.
  • the microlenses 270 mounted on the second substrate 220 can be in the openings or slots 340 formed by the spacers 330.
  • the optical fiber 210 is disposed under the light receiving chip 100 with the working surface facing downward, which solves the problem that the prior art fiber coupling is difficult to be compatible with the flip chip package of the component.
  • the spacer 330 simultaneously functions to control the image 270 image distance parameter.
  • the coupled package of the fiber has actually been detached from the package body 150 of the photoelectric conversion element.
  • the coupling and fixing process between the substrate 300 on which the light receiving chip 100 is mounted and the laterally coupled fiber member can be independently performed.
  • the substrate 300 on which the light-receiving chip 100 is mounted may be turned over to perform observation and alignment of the fiber coupling, and the two coupled and fixed together are placed in the package body 150.
  • the optical fiber 210 still passes through the through hole 160 of the package tube 150, but at this time, the fixing of the through hole to the optical fiber will only be considered for both airtightness and mechanical strength, and no longer relates to the coupling of light.
  • the change in the movement of the through hole 160 to the fixed portion of the fiber does not affect the coupling state.
  • the degree of freedom of the fiber end face 240 has been completely limited by the laterally coupled fiber member of the present invention and the chip mounting substrate 300 fixedly connected thereto System.
  • the direct fixing method of the fiber end face solves the problem that the coupling state in the prior art is susceptible to the fixed portion of the through hole 160 and the coupling stability is poor.
  • a method of processing a laterally coupled fiber optic member includes the steps of:
  • One end surface of the optical fiber, the first substrate and the second substrate is ground or cut to form a slope on the same plane, so that the light beam conducted in the optical fiber is totally reflected at the inclined surface.
  • the fiber end face 240 is machined to a desired angle of inclination ⁇ , and placed in a desired orientation relative to the groove.
  • the unprocessed fiber 210 is first placed in the groove, and the adhesive is used.
  • the glue 230 fixes the second substrate 220, the optical fiber 210, and the first substrate 200
  • the common end faces of the three are processed together on a special mold, and the entire angle is integrally ground or cut, and the whole grinding or cutting is not only
  • the consideration of the orientation of the optical fiber 210 can be removed, and an important aspect is that: the alignment of the upper surface of the second substrate 220 with the processing indicates the edge 250, and its axial position relative to the fiber end surface 240 is horizontal.
  • the upper distance will always be a fixed amount that can be calculated, so this alignment indication edge 250 can be a good alignment mark to indicate the axial position of the fiber end face 240. Since the size of the optical fiber is small and the material is transparent and uniform, the position of the optical fiber axis is difficult to accurately judge with the naked eye. The presence of the alignment indicating rim 250 provides an advantageous condition for the structural and functional expansion of the laterally coupled fiber optic members.
  • the upper surface of the second substrate 220 is horizontal or not is important in the processing of the second substrate 220, which is related to the traveling direction of the light beam after passing through the second substrate 220, so that the upper and lower surfaces of the second substrate 220 are required to be not only
  • the auxiliary optical fiber 260 having the degree of matching can maintain the lower surface of the second substrate 220 in a horizontal state after being bonded and fixed to the first substrate 200 by the auxiliary grooves and the optical fibers.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Description

侧向耦合光纤构件及其加工方法
技术领域
本发明涉及一种光电子器件的光耦合封装技术， 特别是一种光通信领 域半导体光电子器件的侧向耦合光纤构件及其加工方法。 背景技术
在应用于发射或接收光信号或能量的光电子器件中， 光电子器件与外 界之间的光传导许多需经由光纤完成， 因此在这些光电子器件中， 存在着 作为器件核心的光电转换元件与光纤之间的光耦合问题， 这种问题称为光 电子器件的光纤耦合封装。
请参阅图 1 所示， 为现有技术中的侧向耦合光纤构件的原理图。 即光 束在光纤端面的输入、 输出并非沿着光纤的轴向进行， 而是沿着垂直于轴 向的径向方向进行。 这种侧向耦合的实现是通过在光纤端面 140加工形成 一满足全反射角条件的斜端面来完成。 这种侧向耦合的结构一般应用于某 类封装形式下光纤与表面型光电转换元件 100 间的耦合需要， 比较常见的 如蝶形管壳封装下光纤 110与表面型结构的半导体光接收芯片的耦合。
请参阅图 2所示， 为现有技术中的侧向耦合光纤构件的实施方式示意 图。 光纤 110在空间位置上的固定， 通过包裹光电转换元件 100的通常为 金属材料的封装管体 150实现。 封装管体 150上有可容纳光纤通过的圆形 通孔 160, 光纤 110的某一节部位在通孔 160中被固定。 一种典型的固定工 艺是在已去掉外层保护材料的裸光纤 110上紧覆上一层金属套层 170,然后 以金属焊料将制有金属套层 170的光纤 110焊接固定在通孔 160中， 形成 一种密闭、 稳固的封装。
在现有技术的侧向耦合结构中， 光纤需安放于表面型光电转换元件的 上部。 这是由以下两个主要原因决定： 一、 光电转换元件的工作表面朝上、 光纤端面置于工作表面上部的结 构， 易于实施观察和对准。 光电转换元件工作表面的有效工作区通常为一 限定大小的圆形区域 120, 周围被一圈金属电极 130环绕（如图 1中所示）, 观察和对准的工作在显微镜下操作完成。
二、 光电转换元件的引出电极 130通常与元件的工作表面位于同一面
(如图 1中所示）， 引出电极到元件底座， 各元件之间以及与封装管体间的 电连接通常釆用引线键合的方式， 引线一般为极细的金丝， 由专门的引线 键合设备完成， 而引线键合工艺要求各个电极面朝上。 因此， 光电转换元 件的工作表面也必需是朝上放置。
在现有的技术下， 虽然光纤位于光电转换元件上部的结构易于实施观 察和对准， 但由于受限于光纤的固定手段， 现有技术仍存在光纤固定的稳 定性问题。 这个问题在光电转换元件的工作区面积很小的情况下开始突出。 对于光通信中应用于光接收的半导体光电子芯片而言， 工作区的大小直接 影响着所述芯片可工作于什么样的速率， 速率越高， 则要求设计的工作区 面积越小。 由于现有技术下对光纤的固定并不是直接对端面的固定， 而是 离开端面一定距离的某个有限区域， 因此光纤端面在空间上可具有较大的 自由度， 尤其相对于固定部位的轻微的转角变化， 在光纤端面可产生较大 距离的移动； 光纤固定又是釆用有较大热胀冷缩效应的金属构件， 包括分 布不均匀的金属焊料， 这种金属化焊接是密闭性封装所要求的， 因此在发 生比如由温度变化引起的焊接区应力的变化而导致光纤固定部位发生轻微 的移动时， 光纤端面就容易偏离原来的最佳耦合位置， 使器件性能下降甚 至失效。
在当前光通信系统中应用的传输速率已达到 10G ( 1G = 109 ) 比特每秒 的单路光纤线路中， 用于光接收的半导体光电子芯片的工作区直径已经小 至 30微米， 当速率提高至下一应用阶段 40G时， 其直径将进一步减至 12 微米， 而常规使用的单模光纤中所传输光束的直径就已经在 10微米左右， 因此随着速率的提高， 耦合对光纤位置的变化会越来越敏感。 在目前业界 以 10 G为主的产品开发与生产实践中， 已经面临着这种耦合不稳定性所带 来的可靠性指标不易通过， 一次成品率低， 生产耗时长的问题， 使生产难 以形成规模， 同时成本高昂。
在另一方面， 应用速率向着更高速率的提高， 对光电子器件的电学封 装也提出了要求。 金丝引线对高频电信号所产生的阻挡和寄生效应随着信 号频率的增加而增大， 到一定阶段会使性能发生显著恶化。 在理论上， 通 过减小引线的长度可以适应这种频率变化的要求， 但是受限于引线键合的 工艺技术， 引线的长度不可能无限制缩短。 当信号连接线短至 100微米水 平时， 使用引线键合技术将变得十分困难， 这种情形基本对应着速率达到 40G比特每秒时对引线长度的要求。
一种有效的解决办法是釆用芯片的 "倒装" 技术， 即将芯片的引出电 极朝下， 与基座或基板上的电路部分直接键合在一起， 常用的如釆用焊料 的焊接方式， 这种连接的连接距离将是最短的， 可很好的满足高速性能上 的要求。 同时倒装还有利于提高散热， 增加电连接密度等优点。 倒装技术 已经是微电子领域的现有技术。 对于光电子元件而言， 一个主要的类型是 引出电极与实施光耦合的工作表面处于同一面， 如釆用倒装技术， 则要求 工作表面为朝下放置， 这与现有的光纤耦合封装技术不兼容。 由于现有技 术下对光纤的定位、 固定是通过封装管体上的通孔进行， 因此所有的光纤 耦合过程都必须借助于封装管体完成， 这就使光纤位于工作表面朝下的光 电转换元件下方的耦合方式因光纤端面不可见而难以施行。 因此现有的光 耦合技术限制了很多光电子器件中元件倒装技术的应用。 发明内容
本发明的目的在于， 提供一种侧向耦合光纤构件及其加工方法， 用以 克服上述缺陷。
为实现上述目的， 本发明釆用的技术方案在于， 首先提供一种侧向耦 合光纤构件， 包括：
一第一基板， 其一表面上设置有至少一凹形槽；
光纤， 设置于所述的凹形槽内；
一第二基板， 设置于所述的第一基板上并压盖住所述的光纤； 其中， 所述的光纤位于所述的第一基板和第二基板之间的一端设置有 斜面， 所述的斜面用以将所述光纤中传导的光束实现全反射。
其中， 所述的第一基板与所述的第二基板相固定， 确保所述的光纤在 其间没有自由度。
较佳的， 所述的第一基板以及第二基板的一端面与所述的光纤的斜面 位于同一平面上。
其中， 所述的第二基板上设置有一第一通光孔， 所述第一通光孔与经 过所述光纤的斜面发生全反射的光束路径相对应； 或所述的第二基板釆用 较佳的， 所述的第二基板为一光学扩展基座， 在其上设置有至少一光 学元件。
其中， 在所述的第二基板上设置的光学元件可以为一透镜， 所述的透 镜的透射区域与所述的全反射光束的投射区域相一致。
较佳的， 还包括一垫片， 其设置于所述的第二基板上， 所述的垫片开 有一槽孔， 所述的透镜与所述的槽孔相适应。
较佳的， 还包括： 一光接收芯片基板， 设置在所述的垫片上， 所述的 光接收芯片基板设置有一第二通光孔， 其与所述的透镜的投射区域相对应； 一光接收芯片设置在所述的第二通光孔上， 并与所述的光接收芯片基板相 结合。 本发明同时提供了一种侧向耦合光纤构件的加工方法， 包括： 将光纤设置于一第一基板上的 形槽中；
通过粘结方式将所述的第一基板和一第二基板相固定， 使所述的光纤 失去所有的自由度；
将所述的光纤、 第一基板和第二基板的一端面进行研磨或切削形成位 于同一平面的斜面， 使所述光纤中传导的光束在所述的斜面处实现全反射。
为此保持第一基板和第二基板固定后处于水平状态的步骤：
在所述的第一基板的其他 IS形槽内设置至少一与所述光纤相同直径的 光纤， 然后将所述第一基板和第二基板进行固定连接。
与现有技术比较， 本发明的有益效果在于： 首先， 作为侧向耦合光纤 构件， 其为耦合光纤的端面提供了直接和完全的限制， 通过与光电转换元 件安装基板的配合， 可实现针对苛刻要求下的稳定、 可靠的光纤侧向耦合; 其次， 本发明的侧向耦合光纤构件的安装形式灵活， 便于兼容其它包 括元件倒装在内的多种封装技术；
最后， 本发明的侧向耦合光纤构件可提供新的装配平台， 可扩展为功 能多样的一体化侧向耦合光纤构件， 包括将其扩展为完整的元件安装平台
附图说明
图 1为现有技术中的侧向耦合光纤构件的原理图；
图 2为现有技术中的侧向耦合光纤构件的实施方式示意图；
图 3为本发明的侧向耦合光纤构件实施例一的立体示意图；
图 4为本发明的侧向耦合光纤构件实施例一的侧视示意图；
图 5为本发明的侧向耦合光纤构件实施例二的立体示意图；
图 6为本发明的侧向耦合光纤构件实施例二的侧视示意图；
图 7为本发明的侧向耦合光纤构件实施例三的侧视示意图。 具体实施方式 以下结合附图， 对本发明上述的和另外的技术特征和优点作更详细的 说明。
请参阅图 3和图 4所示， 其分别为本发明的侧向耦合光纤构件实施例 一的立体示意图以及侧视示意图； 本发明的侧向耦合光纤构件包括： 一带 有至少一个四形槽的第一基板 200, —位于 形槽内的光纤 210, 和一置于 IS形槽基板之上并压盖住 IS槽内光纤的平面的第二基板 220;所述的 形槽 的形状需使放入其内的光纤 210 与 槽的两个侧壁同时相切， 同时光纤的 一部分需露出四形槽的表面， 与所述第二基板 220 实现接触。 在四槽侧壁 与所述第二基板 220的共同限制下， 光纤 210被完全限制于凹形槽内。 一 般情形下， 此处的光纤 210为去除了外涂覆层材料、 塑料套层等保护层， 露出内部光导纤维的裸光纤。 对于标准单模光纤而言， 其内部光导纤维材 料为石英， 纤维直径为 125微米。
所述的第二基板 220与第一基板 200之间可用胶粘 230的方式固定在 一起。 比如可釆用简单的紫外胶粘接， 上好胶后， 在紫外光照射下使胶固 化， 将各部分紧密连接在一起。 在粘接固定形成紧密连接的情况下， 光纤
210于凹槽内的自由度完全丧失，这包括光纤 210沿凹槽轴向的平移以及沿 自身轴的转动， 因此光纤端面 240 的位置、 状态将由所述侧向耦合光纤构 件完全决定。
本发明的侧向耦合光纤构件的一个重要特征为： 光纤 210 的端面 240 为加工成满足全反射角条件的斜端面， 使沿光纤 210轴向行进的光在所述 端面转变成侧向行进的光， 并且斜面的方位使所述侧向行进的光位于第二 基板 220—侧。 在原理中， 所述第二基板 220可以制作出一个通光孔或缺 口以使光束不经过所述第二基板直接通过， 甚至所述第二基板可以留出光 纤端面 240位置的一部分， 但由于仍存在难以避免的粘胶溢出 "污染" 光 纤端面的问题， 因此一个简单可行的方式是： 所述的第二基板 220可釆用 与光导纤维 210相同或相近的材料， 粘胶 230亦釆用与光导纤维 210及第 二基板 220折射率匹配， 同时光吸收小的种类， 这些材料及产品在实际中 均可获得， 然后以第二基板 220完全压盖住光纤 210。 由于各部分材料折射 率相近， 光束相当于在同一种材料内传播， 因此不会产生内部过多的反射 损失和影响。 光束经由第二基板 220上表面行进的情形则与通常光纤沿轴 向端面输入、 输出时的情形一样， 可以计入这个界面的反射影响， 也可以 选择在这个界面镀制光学增透膜， 以减小反射的发生。
光纤端面 240 的角度 Θ依据光导纤维材料与所处媒质环境形成的界面 的全反射临界角来决定， 当光纤 210 内传输光束在所述端面的入射角大于 这个临界角时， 光束在所述端面将发生完全的内反射， 而不会有透射输出。 因此这个斜面角度 Θ的取值并不是唯一的， 可根据对光束出射方向、 界面 反射影响等方面的具体要求选定。 对于石英与空气所形成的界面， 这里的 斜面角度 Θ可设置成 42度。
对于本发明而言， 所述的第二基板为一光学扩展基座， 在其上可设置 有至少一光学元件。 这也是本发明重点需要描述的特征。
请参阅图 5和图 6所示， 分别为本发明的侧向耦合光纤构件实施例二 的立体示意图以及侧视示意图。 这种扩展源于第二基板 220 实际可提供的 一种装配平台功能， 所述的第二基板 220之上， 可以很容易地安装和固定 一些其它的光学元件， 如透镜、 滤波片、 偏振片、 反射镜等等， 以及直接 在其上安装一些光电子和电子元件。 从原理上， 这个第二基板 220所能提 供的功能， 与各类元器件通常安装所使用的安装基板没有什么不同。 所述 第二基板 220上将添加一微透镜 270 ,所述微透镜为釆用半导体芯片制造工 艺获得， 透镜口径可在 1 亳米以下， 透镜曲面由半导体工艺中的光刻和化 学腐蚀工艺制得。 这种芯片型微透镜 270商业上已经可以获得。 透镜材料 包括石英和硅， 可很好的透过光通信领域所用的红外波长。 微透镜 270 既 可以制成单面透镜， 也可以制成双面， 本实施例选用单面型透镜， 以方便 直接将透镜基底平整的一面粘贴于第二基板 220 的表面， 安装实施简易。 微透镜 270的透镜面和基底面都可以根据需要镀制增透膜以减小反射影响。 微透镜 270与第二基板 220之间的粘接同样可釆用折射率匹配的粘胶 230 进行。 在安装工艺中， 要求由耦合光纤端面 240发出的光束要通过透镜 270 的有效区域， 因此存在透镜 270相对于光纤端面 240轴心点的准确定位问 题， 这时就可以通过前述的斜端面加工中所形成的第二基板 220上表面的 对准指示边沿 250进行。 在半导体芯片工艺下， 所述芯片透镜 270在口径 以外的材料表面可以设计制作图形对准标记， 使用所述标记， 结合第二基 板 220上表面的对准指示边沿 250, 以及凹槽等其它对准参考基准， 便可准 确地实施所述透镜的定位。 表面添加镀膜和指定对准标记的这种微透镜 270, 都可由厂家提供相应的定制业务。
同时在添加所述微透镜 270后， 在原有的侧向耦合光纤构件的基础上 便形成了一个新的完整构件。 添加所述透镜 270将增加对光纤 210外部传 输光束的控制功能， 比如对于光纤 210输出的光， 由于其具有发散性质， 所述透镜 270将起到汇聚作用， 这点对于接收区直径很小的高速器件而言 是很重要的。 对于光发射元件， 如光通信领域使用的半导体激光二极管芯 片， 其发射的激光光束也具有发散性质， 因此所述透镜可起到同样的汇聚 作用。 在添加有透镜 270后， 第二基板 220本身的厚度则成为控制整个侧 向耦合光纤构件光学特性的一个重要参数。
请参阅图 7所示， 其为本发明的侧向耦合光纤构件实施例三的侧视示 意图。 其实施于一光通信领域高速光接收器件的光纤耦合封装， 其设置有 一表面型半导体光接收芯片 100, 以及安装所述芯片的基板 300。 其中， 为 适应高速的要求， 所述的光接收芯片 100 的电连接釆取了芯片倒装工艺， 通过合金焊料 310使光接收芯片 100的表面电极与基板 300上的微波传输 电路直接键合在一起， 光接收芯片 100用于光耦合的工作表面因此朝下面 向基板 300放置。基板 300在对应部位开有一第二通光孔 320, 孔直径小于 芯片 100的尺寸， 但远大于应用于高速场合的光接收芯片 100的工作区直 径。 对于应用于 40G比特每秒速率的情形， 光接收芯片 100的工作区直径 为 12微米， 第二通光孔 320直径可设为 200微米。
按照前述的内容， 还可以再添加一芯片型微透镜 270, 使之成为一个新 的扩展构件。 所述的第二基板 220的厚度决定了透镜 270物方的距离参数。 在光接收芯片的基板 300下添加一个垫片 330,所述的垫片 330与光接收芯 片的基板 300为粘合在一起。 垫片 330在对应第二通光孔 320的区域开有 一个大的矩形孔或槽 340, 这样， 侧向耦合光纤构件的第二基板 220上表面 可与垫片 330的下表面粘接固定在一起， 而第二基板 220上安装的微透镜 270则可处于垫片 330所形成的开孔或槽 340之中。这种光纤 210位于工作 表面朝下的光接收芯片 100下方的耦合形式， 解决了原有技术中光纤耦合 与元件的倒装封装难以兼容的问题。 在所述实施例中， 垫片 330 同时起到 控制透镜 270像方距离参数的作用。
在所述实施例中， 光纤的耦合封装实际已脱离了光电转换元件的封装 管体 150。安装光接收芯片 100的基板 300与侧向耦合光纤构件之间的耦合 和固定工艺可以独立地进行。 在操作过程中， 安装光接收芯片 100 的基板 300可以翻转过来， 以实施光纤耦合的观察和对准， 耦合固定好后的两者再 一起放入封装管体 150中。 这时， 光纤 210仍然要通过封装管体 150的通 孔 160, 但此时通孔对光纤的固定将只针对气密性和机械强度两方面的考 虑， 不再与光的耦合发生联系， 同时该通孔 160 的固定对光纤固定部位所 产生的移动的变化也不再影响其耦合状态。 光纤端面 240 的自由度已经由 本发明的侧向耦合光纤构件和与之相固定连接的芯片安装基板 300 完全限 制。 这种光纤端面的直接固定的方式， 则解决了原有技术中耦合状态易受 通孔 160固定部位的影响而使耦合稳定性差的问题。
对于本发明而言， 同时提供了一种侧向耦合光纤构件的加工方法， 其 包括的步骤为：
将光纤设置于一第一基板上的 形槽中；
通过粘结方式将所述的第一基板和一第二基板相固定， 使所述的光纤 失去所有的自由度；
将所述的光纤、 第一基板和第二基板的一端面进行研磨或切削形成位 于同一平面的斜面， 使所述光纤中传导的光束在所述的斜面处实现全反射。
结合图 4所示， 将光纤端面 240加工成所需的斜端面角度 Θ , 并使其 严格按所需方位相对于凹槽摆放， 先将未经加工的光纤 210置于凹槽， 用 粘胶 230使第二基板 220、 光纤 210、 第一基板 200三者固定后， 将三者构 成的共同端面一起在专门的模具上加工， 整体研磨或切削出所需的角度， 整体研磨或切削不仅可以去除对光纤 210摆放方位的考虑， 同时一个重要 的方面是： 所述第二基板 220上表面随加工所形成的对准指示边沿 250, 其 相对于光纤端面 240 的轴心位置在水平方向上的距离， 将始终是一个可以 由计算得出的固定量， 因此这个对准指示边沿 250可成为一个很好的用以 指示光纤端面 240 轴心位置的对准标记。 由于光导纤维尺寸细小并且材料 透明、 均匀， 光纤轴心的位置肉眼是难以准确判断的。 所述对准指示边沿 250 的存在将对所述侧向耦合光纤构件在结构和功能上的扩展提供有利条 件。
在所述的第二基板 220的处理上， 第二基板 220的上表面是否处于水 平十分重要， 这关系到光束经过第二基板 220后的行进方向， 所以要求第 二基板 220上下两个表面不仅有较高的平行度， 同时在第一基板 200上还 可同时制作出多个相同的凹槽， 并置入相同的、 但长度有限， 仅与凹槽长 度匹配的辅助用光纤 260， 通过这些辅助 槽及光纤， 使第二基板 220的下 表面在与第一基板 200进行粘接固定后能保持为水平的状态。
以上所述仅为本发明的较佳实施例， 对本发明而言仅仅是说明性的， 而非限制性的。 本专业技术人员理解， 在本发明权利要求所限定的精神和 范围内可对其进行许多改变， 修改， 甚至等效， 但都将落入本发明的保护 范围内。

Claims

权利要求书
1、 一种侧向耦合光纤构件， 其特征在于， 包括：
第一基板， 其一表面上设置有至少一凹形槽；
光纤， 设置于所述的凹形槽内；
第二基板， 设置于所述的第一基板上并压盖住所述的光纤；
其中， 所述的光纤位于所述的第一基板和第二基板之间的一端设置有 斜面， 所述的斜面用以将所述光纤中传导的光束实现全反射。
2、 根据权利要求 1所述的侧向耦合光纤构件， 其特征在于， 所述的第 一基板与所述的第二基板相固定。
3、 根据权利要求 2所述的侧向耦合光纤构件， 其特征在于， 所述的第 一基板以及第二基板的一端面与所述的光纤的斜面位于同一平面上。
4、 根据权利要求 3所述的侧向耦合光纤构件， 其特征在于， 所述的第 二基板上设置有第一通光孔， 所述第一通光孔与经过所述光纤的斜面发生 全反射的光束路径相对应； 或所述的第二基板釆用与所述的光纤中光导材 料相同或相近似的材料制得。
5、 根据权利要求 1-4中任一权利要求所述的侧向耦合光纤构件， 其特 征在于， 所述的第二基板为光学扩展基座， 在其上设置有至少一光学元件。
6、 根据权利要求 5所述的侧向耦合光纤构件， 其特征在于， 在所述的 第二基板上设置的光学元件为透镜， 所述的透镜的透射区域与所述的全反 射光束的投射区域相一致。
7、 根据权利要求 6所述的侧向耦合光纤构件， 其特征在于， 还包括垫 片， 其设置于所述的第二基板上， 所述的垫片开有槽孔， 所述的透镜与所 述的槽孔相适应。
8、 根据权利要求 7所述的侧向耦合光纤构件， 其特征在于， 还包括： 光接收芯片基板， 设置在所述的垫片上， 所述的光接收芯片基板设置有第 二通光孔， 其与所述的透镜的投射区域相对应； 一光接收芯片设置在所述 的第二通光孔上， 并与所述的光接收芯片基板相结合。
9、 一种侧向耦合光纤构件的加工方法， 其特征在于， 包括：
将光纤设置于第一基板上的 形槽中；
通过粘结方式将所述的第一基板和第二基板相固定， 使所述的光纤失 去所有的自由度；
将所述的光纤、 第一基板和第二基板的一端面进行研磨或切削形成位 于同一平面的斜面， 使所述光纤中传导的光束在所述的斜面处实现全反射。
10、 根据权利要求 9所述的侧向耦合光纤构件的加工方法， 其特征在 于， 还包括保持第一基板和第二基板固定后处于水平状态的步骤：
在所述的第一基板的其他 IS形槽内设置至少一与所述光纤相同直径的 光纤， 然后将所述第一基板和第二基板进行固定连接。
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