WO2010099642A1 - 一种卡片制造方法 - Google Patents

一种卡片制造方法 Download PDF

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Publication number
WO2010099642A1
WO2010099642A1 PCT/CN2009/001344 CN2009001344W WO2010099642A1 WO 2010099642 A1 WO2010099642 A1 WO 2010099642A1 CN 2009001344 W CN2009001344 W CN 2009001344W WO 2010099642 A1 WO2010099642 A1 WO 2010099642A1
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WO
WIPO (PCT)
Prior art keywords
card
insert
shell
flexible
case
Prior art date
Application number
PCT/CN2009/001344
Other languages
English (en)
French (fr)
Inventor
谢学理
张徵
郭吉祥
谢涛令
Original Assignee
北京海升天达科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京海升天达科技有限公司 filed Critical 北京海升天达科技有限公司
Priority to US13/254,141 priority Critical patent/US9039851B2/en
Priority to EP09840976.6A priority patent/EP2405384B8/en
Publication of WO2010099642A1 publication Critical patent/WO2010099642A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina

Definitions

  • the present invention relates to the field of cards, and more particularly to a method of manufacturing a card having a flexible inner insert. Background technique
  • the packaging manufacturing process of traditional cards uses a thermal lamination method of plastic films such as PVC (polyvinyl chloride id, polyvinyl chloride) or PET (polyes ter, polyester), generally at about 135 °C, 5-6 MPa pressure.
  • plastic films such as PVC (polyvinyl chloride id, polyvinyl chloride) or PET (polyes ter, polyester), generally at about 135 °C, 5-6 MPa pressure.
  • PET polyvinyl chloride
  • PET polymers ter, polyester
  • a novel smart card including a flexible battery, a smart card chip mounted on a flexible circuit board, a flexible input device, a flexible display device, and the like is disclosed.
  • the electronic components and flexible displays in this new type of card can be damaged under high temperature and high pressure, and because of the physical properties of the materials used and the card materials, they cannot be combined with plastic materials such as PVC.
  • a card type product having a flexible inner insert for example, a flexible active circuit and a flexible display
  • a novel smart card having a flexible inner insert conforming to the I S07816/IS07810 standard in the manufacturing process. Has not been able to break through.
  • There is no prior art solution for manufacturing a new type of card having a flexible inner insert and in particular, a technical solution for mass production of a new smart card product having a flexible inner insert. Summary of the invention
  • the present invention provides a card manufacturing method comprising the steps of: 1) manufacturing an upper case and a lower case ;
  • the upper and lower shells have a slot that fits with the inner insert of the card; in the above step 3), the inner insert is placed in the upper or lower shell corresponding to the slot.
  • the upper and lower shells are fabricated by a hot calendering method using a synthetic resin sheet type material or a plastic sheet type material to press a groove which is fitted to the insert of the card.
  • the upper and lower shells are fabricated by using a synthetic resin sheet type material or a plastic sheet type material by milling the milled frame to fit the card insert.
  • the upper and lower shells having the slots that conform to the inserts of the card are fabricated by injection molding using a plastic material using an injection mold.
  • the invention provides a card manufacturing method, firstly manufacturing an upper shell and a lower shell, and then wrapping the flexible inner insert of the card in the upper shell and the lower shell, and finally combining the upper shell and the lower shell, and splicing the shell
  • the latter card is laminated at medium temperature to complete the manufacture of the card, thereby enabling the manufacture of cards with flexible inserts, such as new smart cards including flexible active boards and flexible displays, ensuring new cards with flexible inserts.
  • the performance of the products provides a good manufacturing technology foundation for the large-scale application of new smart cards.
  • FIG. 1 is a schematic structural view of an upper case according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a lower case according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a card insert according to an embodiment of the present invention.
  • FIG. 4 is a schematic view of an upper case and a lower case hull according to an embodiment of the present invention.
  • FIG. 5 is a flow chart showing the manufacture of a card in accordance with an embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention first manufactures an upper case and a lower case, and then wraps the card inner insert in the upper case and the lower case, and finally puts the upper case and the lower case together to complete the manufacture of the card, and the following is manufactured in accordance with I S07816. / 7810 Standard new smart card as an example, the technical solution of the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.
  • FIG. 5 is a flow chart of manufacturing a card according to an embodiment of the present invention. As shown in FIG. 5, the card manufacturing method of the present invention includes the steps of:
  • the material used is a sheet material made of synthetic resin or a sheet material made of a plastic material, such as: PVC (Polyvinylchlor id, polyvinyl chloride), PC (polycarbonate), PETG (Po lyethylene Terephta la te Glycol) , copolyester), PET (polyes ter, poly-month) or ABS (acrylonitrile-butadiene-styrene copolymer) sheet material.
  • PVC Polyvinylchlor id, polyvinyl chloride
  • PC polycarbonate
  • PETG Poly lyethylene Terephta la te Glycol
  • copolyester copolyester
  • PET polyyes ter, poly-month
  • ABS acrylonitrile-butadiene-styrene copolymer
  • Fig. 1 is a schematic view showing the structure of an upper casing according to an embodiment of the present invention
  • Fig. 2 is a schematic view showing the structure of a lower casing according to an embodiment of the present invention. As shown in FIGS.
  • 11 is an upper case
  • 21 is a lower case
  • 12 is an upper case avoidance recess which can be used for mounting a flexible display such as a card insert
  • 22 can be used for mounting, for example, as
  • the lower casing of the flexible display of the card insert avoids the recess
  • 13 is an upper casing recess that can be used to mount a flexible battery, for example as a card insert
  • 23 can be used for mounting, for example, as a card insert
  • the lower case of the flexible battery avoids the recess
  • 14 is an upper cover cutout that can be used to mount a flexible button, for example as a card insert, 24 can be used to mount a flexible button, for example as a card insert
  • the lower case of the flexible circuit board avoids the recess.
  • the second method is a sheet material made of synthetic resin or a sheet material made of a plastic material, for example, a sheet material such as PVC, PC, PETG, PET or ABS.
  • a processing machine such as a milling machine or an engraving machine
  • the aforementioned sheet material is subjected to a milling operation process, and a groove that matches the assembly of the card insert is milled, thereby obtaining a groove having a groove matching the insert of the card.
  • the length and width of the milling groove are determined by the length and width of the components on the insert, and the depth of the milling is determined by the height of the components on the insert in the card.
  • the third method using the injection mold, the upper and lower shells having the slots that match the length, width and height of the inserts in the card are directly injection molded from the plastic material.
  • the thinnest can only be achieved 0. 1 8 mm.
  • the thickness of the different parts is uneven, and the plastic layer of the front side and the bottom side of the flexible display is thinner, and the thickness of the thinnest area can be 0.1 or more.
  • the thin, flexible battery has a thinner plastic layer on the front and bottom.
  • the injection mold used in the present invention employs a vented steel material or a lattice insert structure in the above-mentioned thinner region to facilitate venting of the thinner injection molding area, and to allow the mold frame to be vented.
  • the colloidal resistance is minimal and the flow is smooth.
  • the injection product After injection molding using a conventional injection mold, the injection product will produce a thimble impression when it is ejected from the mold.
  • the card injection ejection structure adopts a pneumatic ejection structure, which can be realized in two ways: Air venting needle and funnel blowing structure.
  • the material of the insert in the card is different from the material of the upper and lower shells. It is necessary to consider the affinity between different materials. Otherwise, the formed card will have the inner insert and the upper shell and the lower shell separated, causing the drum to be Imagine, therefore, the need to consider the use of a gelatinous material to compensate for the affinity between the different materials of the upper and lower shells and the inner insert. Moreover, the different components on the inner insert have different heights and tolerances, so that the inner insert is not completely compatible with the upper and lower shells, and it is necessary to consider the use of a filler, such as a gel, to compensate for the inner insert and the upper insert. These gaps between the shell and the lower shell.
  • Fig. 3 is a schematic view showing the structure of a card insert according to an embodiment of the present invention.
  • the inner insert has different components such as a battery, a flexible circuit board and a flexible display, and needs to be combined with the materials of the upper and lower shells.
  • 31 denotes a flexible battery
  • 32 denotes a flexible display
  • 33 denotes a flexible circuit board
  • 34 denotes a flexible key.
  • the colloid chosen should have a glass transition temperature of 35-70 degrees Celsius and be cured by photopolymerization. Epoxy or thermoplastic polyurethane can be used as the colloid. When an epoxy resin is used and the glass transition temperature is below 70 degrees Celsius, the cells and chips of the inner insert are not damaged.
  • the gel is sprayed onto the upper and lower shells by means of an automatic dispenser or an automatic glue dispenser, using evenly spaced strip coating or spot jetting, and the dispenser can precisely control the amount of dispensing and The location of the coated gel.
  • the coated gel is further smoothed by a flexible roller on the above coated base stone.
  • the purpose of the leveling treatment is firstly to allow the strip of colloid to spread evenly, and secondly to avoid the generation of bubbles in the subsequent process, which may cause the surface of the final card product to be uneven. Whole.
  • the upper and lower shells coated with the colloid may be further subjected to vacuum treatment, and the purpose of evacuation is also to remove bubbles in the colloid.
  • the corresponding slot of the card insert is placed in the upper shell or the lower shell, and then the upper shell and the lower shell are placed.
  • the shells are put together to obtain a card after the shell.
  • Fig. 4 is a schematic view showing the upper case and the lower case hull according to an embodiment of the present invention. As shown in Fig. 4, 1 1 is the upper case, 21 is the lower case, 23 is the area of the lower case of the battery as the insert of the card, 22 is the area of the lower case of the display as the card insert, 24 is used as the card.
  • the buttons of the insert and the flexible circuit board are placed in the region of the lower casing, and the inner inserts are placed in the corresponding inner insert shape regions 22, 23 and 24 in the lower casing 21, and the upper casing 11 is closed. Further, after the upper shell and the lower shell are put together, the flexible roller can be rolled to ensure tight contact between the upper shell and the lower shell and the inner insert to avoid air bubbles.
  • the card after the husking is subjected to a medium temperature lamination method to obtain a smart card card.
  • Conventional smart card lamination methods generally use a high temperature lamination process with a processing temperature of 1 35 ° C (degrees Celsius) and a processing pressure of 5 fly MPa (MPa).
  • the temperature employed in the laminating method is 50 ⁇ 100 ° C (Celsius), the pressure employed 2. 5_5 MPa (megapascals).
  • the card surface is printed.
  • the existing conventional card printing layer is not directly exposed.
  • the transparent protective film of 0. 06 mm or 0.08 mm thick is used to protect the printed layer on the surface of the card.
  • the card surface printing of the present invention is different from the conventional card printing.
  • the card printing layer of the present invention is directly printed on the surface of the card, so that the wear resistance of the printing layer is required to be high.
  • Card face printing can be done by universal transfer, thermal transfer, water transfer and silk screen printing.
  • the existing I S07816 standard process is used to complete the bonding of the punch, the magnetic strip, the contact IC bonding, etc., to complete the manufacture of the card.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)

Description

一种卡片制造方法 技术领域
本发明涉及卡片领域， 尤其涉及一种有柔性内镶件的卡片的制造方法。 背景技术
传统卡片（例如智能卡）的封装制造工艺采用 PVC ( Polyvinylchlor id, 聚氯乙烯）或 PET ( polyes ter , 聚脂）等塑料薄膜的热层压方法， 一般是 在 135 °C左右， 5-6MPa压力下， 使塑料薄膜牢固地融合在一起， 完成卡片的 封装制作。但这种用于传统卡片的制造工艺无法直接用于有柔性内镶件的新 型卡类产品， 例如本申请人在 发明名称为 "智能卡及其智能卡用户身份认 证方法" 的专利申请 200910077144. 6中公开的一种包括柔性电池、 安装在 柔性电路板上的智能卡芯片、柔性输入装置、柔性显示装置等的新型智能卡。 这种新型卡中的电子元器件和柔性显示器在高温和高压下会发生损坏，而且 由于其采用的材料与卡片材料的物理性质不同，不能艮好地和 PVC等塑胶材 料相结合。 现有技术中， 制造有柔性内镶件（例如包括柔性有源电路及柔性 显示器）的卡类产品， 特别是制造符合 I S07816/ IS07810标准的有柔性内镶 件的新型智能卡， 在制造工艺上一直未能突破。 现有技术中没有制造具有柔 性内镶件的新型卡片的技术方案，尤其是没有实现具有柔性内镶件的新型智 能卡产品的量产制造的技术方案。 发明内容
针对现有技术中对于内有柔性有源电路、柔性显示器等柔性组件的新型 卡类产品没有可行的制造方案，本发明提供了一种卡片制造方法，包括步骤： 1 )制造上壳和下壳；
2 )在所述上壳和下壳内涂覆胶体；
3 )把所述卡片内镶件放在所述上壳或者下壳内， 然后把所述上壳和下 壳合在一起， 得到合壳后的卡片；
4 )对所述合壳后的卡片进行层压处理， 得到卡片。 进一步地， 所述上壳和下壳内具有与卡片的内镶件吻合的槽位； 上述步 骤 3 ) 中把所述内镶件对应所述槽位放在所述上壳或者下壳内。
在一种实施例中， 利用合成树脂片型材料或者塑胶片型材料， 采用热压 延的方法， 压制出与卡片内镶件吻合的槽位， 制造所述上壳和下壳。
在另一种实施例中， 利用合成树脂片型材料或者塑胶片型材料， 采用铣 底加工方式， 铣出与卡片内镶件吻合的槽位， 制造所述上壳和下壳。
在又一种实施例中， 采用塑胶材料， 利用注塑模具采用注塑方法制造所 述具有与所述卡片内镶件吻合的槽位的上壳和下壳。 本发明提供了一种卡片制造方法， 首先制造上壳和下壳， 然后把卡片的 柔性内镶件包裹在上壳和下壳中， 最后把上壳和下壳合在一起， 并对合壳后 的卡片进行中温层压， 完成卡片的制造， 从而实现了有柔性内镶件的卡片的 制造， 例如包括柔性有源电路板和柔性显示器的新型智能卡， 保证了具有柔 性内镶件的新型卡类产品的性能，为新型智能卡的大量应用提供了良好的生 产制造技术基础。 附图说明
下面将参照附图对本发明的具体实施方案进行更详细的说明， 附图 中：
图 1是本发明一实施例的上壳的结构示意图；
图 2是本发明一实施例的下壳的结构示意图；
图 3是本发明一实施例的卡片内镶件的结构示意图；
图 4是本发明一实施例的上壳和下壳合壳的示意图；
图 5是本发明一实施例的卡片制造流程图。 具体实施方式 本发明首先制造上壳和下壳， 然后把卡片内镶件包裹在上壳和下壳内， 最后把上壳和下壳合在一起， 完成卡片的制造， 下面以制造符合 I S07816/ 7810 标准的新型智能卡为例， 结合附图及具体实施方式对本发明 技术方案做进一步的详细描述。 图 5是本发明一实施例的卡片制造流程图， 如图 5所示， 本发明的卡片 制造方法包括步骤：
1 )制造具有与卡片内镶件吻合的槽位的上壳和下壳。 可以有以下三种 制造方法。
第一种方法：
利用的材料是由合成树脂制成的片型材料或者塑胶材料制成的片材材 料， 例如： PVC ( Polyvinylchlor id, 聚氯乙烯） 、 PC (聚碳酸脂） 、 PETG ( Po lyethylene Terephta la te Glycol , 共聚聚酯） 、 PET ( polyes ter , 聚 月旨）或 ABS (丙烯睛 -丁二烯-苯乙烯共聚物） 片型材料。 对上述片型材料 采用热压延的方法， 压制出对应卡片内镶件（ inlay )组件长宽高的槽位， 从而得到具有与卡片内镶件吻合的槽位的上壳和下壳。图 1是本发明一实施 例的上壳的结构示意图， 图 2是本发明一实施例的下壳的结构示意图。 如图 1和图 2所示， 11是上壳， 21是下壳， 12是可以用于安装例如作为卡片内 镶件的柔性显示器的上壳避空凹槽， 22 是可以用于安装例如作为卡片内镶 件的柔性显示器的下壳避空凹槽； 13 是可以用于安装例如作为卡片内镶件 的柔性电池的上壳避空凹槽， 23 是可以用于安装例如作为卡片内镶件的柔 性电池的下壳避空凹槽； 14 是可以用于安装例如作为卡片内镶件的柔性按 键的上壳避空凹槽， 24 是可以用于安装例如作为卡片内镶件的柔性按键和 柔性电路板的下壳避空凹槽。
第二种方法： 利用的材料是由合成树脂制成的片型材料或者塑胶材料制成的片材材 料， 例如： PVC、 PC、 PETG , PET或 ABS等片型材料。 通过采用铣床或雕刻 机等加工机械， 对前述片型材料进行铣底加工工艺操作， 铣出与卡片内镶件 的组件吻合的槽位， 从而得到具有与卡片内镶件吻合的槽位的上壳和下壳。 其中铣槽长宽根据内镶件上组件的长宽决定，铣槽深度根据卡片内镶件上组 件的高度决定。
第三种方法： 利用注塑模具， 由塑胶材料直接注塑出具有与卡片内镶件长宽高吻合的 槽位的上壳和下壳。 采用常规注塑模具， 对于薄片产品注塑， 最薄只能做到 0. 1 8毫米。 此外， 对于内有柔性电池和柔性显示器等组件的卡类产品注塑， 不同部位厚薄不均， 柔性显示器对应的正面和底面的塑胶层较薄， 最薄区域 的厚度可达 0. 1匪或更薄， 柔性电池对应的正面和底面的塑胶层也比较薄。 为此， 在一个优选实施方案中， 本发明使用的注塑模具在上述较薄区域采用 排气钢材材料或者采用分格镶件结构， 以利于较薄注塑区域排气， 让模框排 气畅通， 胶体阻力最小， 流动顺畅。
在采用常规注塑模具注塑完成后， 注塑产品顶出模具时会产生顶针印 痕。 在一个优选实施方案中， 为了避免卡片注塑完成后从注塑模具中顶出时 卡片产生顶针印， 在注塑模具设计上， 卡片注塑顶出结构是采用气动顶出结 构， 可以有两种方式实现： 疏气针和漏斗吹气结构。
2 )在上壳和下壳内涂覆胶体。
卡片内镶件的材质与上壳和下壳的材质不同，需要考虑不同材质之间的 亲合性， 否则所制造的成卡会出现内镶件和上壳以及下壳相脱离， 造成起鼓 想象， 因此需要考虑使用胶脂类材料来弥补上、 下壳和内镶件的不同材料之 间的亲合力。 而且， 内镶件上的不同组件具有不同的高度并且存在公差， 因 此内镶件不可能与上壳和下壳之间完全吻合，需要考虑用填充物，例如胶体， 来弥补内镶件和上壳以及下壳之间的这些间隙。
图 3 是本发明一实施例的卡片内镶件的结构示意图， 内镶件上具有电 池、 柔性电路板和柔性显示器等不同组件， 需要与上壳和下壳的材料结合。 如图 3所示， 31表示柔性电池， 32表示柔性显示器， 33表示柔性电路板， 34表示柔性按键。 所选择使用的胶体应有一个 35-70摄氏度的玻化转换温 度， 并用光聚合促进固化。 胶体可使用环氧树脂或热塑聚亚胺酯。 当使用环 氧树脂及玻化温度在 70摄氏度以下， 就不会损害内镶件的电池和芯片。
在一个实施例中，通过自动点胶机或自动喷胶机把胶体喷涂覆到上壳和 下壳， 采用均匀等间距条状涂覆或点状喷射， 点胶机可以精确控制点胶量以 及被涂覆胶体的位置。
在一个优选实施方案中， 在以上涂胶基石出上， 进一步采用柔性滚筒， 对 所涂覆胶体进行抚平处理。抚平处理的目的首先是让条状胶体可以均匀铺展 开， 其次是避免在后续工艺中产生气泡， 气泡会导致最终卡片产品表面不平 整。
在抚平处理之后，还可进一步对涂覆有胶体的上壳和下壳进行抽真空处 理， 抽真空的目的同样也是为了除去胶体中的气泡。
3 )在对上壳和下壳涂覆完胶体并进行了上述相应的抚平和抽真空处理 后， 把卡片内镶件对应槽位放在上壳或者下壳内， 然后把上壳和下壳合在一 起， 得到合壳后的卡片。
卡片内镶件的各个组件之间需要选择牢固及挠性连接， I S07816/7810 除定义了智能卡模块布局外， 同时还定义了智能卡所必须具备的耐弯折性要 求。 图 4是本发明一实施例的上壳和下壳合壳的示意图。 如图 4 所示， 1 1 是上壳， 21是下壳， 23是作为卡片内镶件的电池在下壳的区域， 22是作为 卡片内镶件的显示器在下壳的区域， 24 是作为卡片内镶件的按键和柔性电 路板在下壳的区域， 把各内镶件摆放在下壳 21内对应内镶件形状区域 22、 23和 24 , 再合上上壳 11。 进一步， 把上壳和下壳合在一起后可采用柔性滚 筒滚压， 以保证上壳及下壳和内镶件之间接触严密， 避免产生气泡。
4 )在得到合壳后的卡片后， 对合壳后的卡片采用中温层压方法， 得到 智能卡卡片。 传统智能卡层压方法一般采用高温层压法， 其加工温度为 1 35 °C (摄氏度） ， 加工压力为 5飞 MPa (兆帕） 。 在一个优选实施方案中， 为 了保护内镶件上的电子元器件及显示器， 采用中温层压法， 加工温度为 50~100 °C (摄氏度） ， 压力采用 2. 5_5MPa (兆帕） 。
在得到智能卡卡片后还要进行卡片卡面的印刷 ,现有的常规制卡印刷层 不直接外露，在卡片表面都有 0. 06毫米或者 0. 08毫米厚的透明保护膜保护 印刷层。 本发明的卡面印刷与常规制卡印刷有区别，本发明的卡片印刷层直 接印在卡片表面， 因此对印刷层的耐磨性要求较高。 卡片卡面印刷可采用万 能转印，热转印，水转印及丝印来完成。
最后采用例如现有的 I S07816标准工艺来完成冲字、磁条的粘接、接触 式 IC贴合等， 完成卡片的制造。
需要说明的是， 以上所述仅为本发明较佳的具体实施例， 而不是对本发 明技术方案的限定。
显而易见， 在此描述的本发明可以有许多变化， 这种变化不能认为偏 离本发明的精神和范围。 因此， 所有对本领域技术人员显而易见的改变, 都包括在本权利要求书的涵盖范围之内。

Claims

权利要求书
1、 一种卡片制造方法， 其特征在于， 包括步骤：
1 )制造上壳和下壳；
2 )在所述上壳和下壳内涂覆胶体；
3 )把卡片内镶件放在所述上壳或者下壳内， 然后把所述上壳和下壳合 在一起， 得到合壳后的卡片；
4 )对所述合壳后的卡片进行层压处理， 得到卡片。
2、 如权利要求 1所述的方法， 其特征在于， 所述上壳和下壳内具有 与所述卡片内镶件吻合的槽位； 步骤 3 ) 包括把所述内镶件对应所述槽位放 在所述上壳或者下壳内。
3、 如权利要求 2所述的方法， 其特征在于所述步骤 1 ) 包括利用合 成树脂片型材料或者塑胶片型材料， 采用热压延的方法， 压制出与所述卡片 内镶件吻合的槽位。
4、 如权利要求 2所述的方法， 其特征在于所述步骤 1 ) 包括利用合 成树脂片型材料或者塑胶片型材料， 采用铣底加工方式， 铣出与所述卡片内 镶件吻合的槽位。
5、 如权利要求 2所述的方法， 其特征在于所述步骤 1 ) 包括采用塑 胶材料，利用注塑模具采用注塑方法制造所述具有与所述卡片内镶件吻合的 槽位的上壳和下壳。
6、 如权利要求 5所述的方法， 其特征在于， 所述注塑模具在对应所 述卡片塑胶层较薄的区域采用排气钢材材料或者采用分格镶件结构。
7、 如权利要求 6 所述的方法， 其特征在于， 所述卡片包括电池和 / 或显示器， 所述卡片塑胶层较薄的区域是所述卡片内电池和 /或显示器所在 的区 i或。
8、 如权利要求 5所述的方法， 其特征在于， 所述注塑模具上具有气 动卡片顶出结构。
9、 如权利要求 8所述的方法， 其特征在于， 所述气动卡片顶出结构 是疏气针或漏斗吹气结构。
10、 如权利要求 1 所述的方法， 其特征在于所述步骤 2 ) 包括采用均 匀等间距条状涂覆或者点状喷射在所述上壳和下壳内涂覆胶体。
1 1、 如权利要求 1所述的方法， 其特征在于， 步骤 2包括采用柔性滚 筒， 对所述涂覆胶体进行抚平处理。
12、 如权利要求 11所述的方法， 其特征在于步骤 2 ) 包括在所述抚平 处理后， 对涂覆有胶体的所述上壳和下壳进行抽真空处理。
13、 如权利要求 1、 11或 12所述的方法， 其特征在于， 步骤 3 ) 包括 把所述上壳和下壳合在一起后， 采用柔性滚筒滚压， 得到合壳后的卡片。
14、 如权利要求 1所述的方法， 其特征在于， 所述层压处理的温度为
50摄氏度至 1 00摄氏度。
15、 如权利要求 1或 14所述的方法， 其特征在于， 所述层压处理的压 力为 2. 5兆帕至 5兆帕。
16、 如权利要求 1所述的方法， 其特征在于所述方法包括： 在步骤 4 ) 之后， 在所述卡片的表面直接印制印刷层。
PCT/CN2009/001344 2009-03-06 2009-11-23 一种卡片制造方法 WO2010099642A1 (zh)

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