CN101493902B - 一种卡片制造方法 - Google Patents

一种卡片制造方法 Download PDF

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CN101493902B
CN101493902B CN2009100792870A CN200910079287A CN101493902B CN 101493902 B CN101493902 B CN 101493902B CN 2009100792870 A CN2009100792870 A CN 2009100792870A CN 200910079287 A CN200910079287 A CN 200910079287A CN 101493902 B CN101493902 B CN 101493902B
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谢学理
张徵
郭吉祥
谢涛令
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HIERSTAR (SUZHOU) CO., LTD.
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Abstract

本发明公开了一种有柔性内镶件的卡片的制造方法，包括：制造上壳和下壳；在上壳和下壳内涂覆胶体；把卡片的内镶件放在所述上壳或者下壳内，然后把所述上壳和下壳合在一起，得到合壳后的卡片；对合壳后的卡片进行层压处理，得到卡片。进一步地，上壳和下壳内具有与内镶件吻合的槽位；把内镶件对应槽位放在上壳或者下壳内。本发明实现了有柔性内镶件的卡片的制造，例如包括柔性有源电路板和柔性显示器的智能卡，保证了具有柔性内镶件的新型卡类产品的性能。

Description

一种卡片制造方法
技术领域
本发明涉及卡片领域，尤其涉及一种有柔性内镶件的卡片的制造方法。
背景技术
传统卡片(例如智能卡)的封装制造工艺采用PVC(Polyvinylchlorid，聚氯乙烯)或PET(polyester，聚脂)等塑料薄膜的热层压方法，一般是在135℃左右，5-6MPa压力下，使塑料薄膜牢固地融合在一起，完成卡片的封装制作。但这种用于传统卡片的制造工艺无法直接用于有柔性内镶件的新型卡类产品，例如发明人在专利申请“智能卡及其智能卡用户身份认证方法”中公开的一种包括柔性电池、安装在柔性电路板上的智能卡芯片、柔性输入装置、柔性显示装置等的新型智能卡，这种新型卡中的电子元器件和柔性显示器在高温和高压下会发生损坏，而且由于其采用的材料与卡片材料的物理性质不同，不能很好地和PVC等塑胶材料相结合。现有技术中，制造有柔性内镶件(例如包括柔性有源电路及柔性显示器)的卡类产品，特别是制造符合ISO7816/ISO7810标准的有柔性内镶件的新型智能卡，在制造工艺上一直未能突破。现有技术中没有制造具有柔性内镶件的新型卡片的技术方案，尤其是没有实现具有柔性内镶件的新型智能卡产品的量产制造的技术方案。
发明内容
针对现有技术中对于内有柔性有源电路、柔性显示器等柔性组件的新型卡类产品没有可行的制造方案，本发明提供了一种卡片制造方法，包括步骤：
1)制造上壳和下壳；
2)在所述上壳和下壳内涂覆胶体；
3)把所述卡片内镶件放在所述上壳或者下壳内，然后把所述上壳和下壳合在一起，得到合壳后的卡片；
4)对所述合壳后的卡片进行层压处理，得到卡片。
进一步地，所述上壳和下壳内具有与卡片的内镶件吻合的槽位；上述步骤3)中把所述内镶件对应所述槽位放在所述上壳或者下壳内。
在一种实施例中，利用合成树脂片型材料或者塑胶片型材料，采用热压延的方法，压制出与卡片内镶件吻合的槽位，制造所述上壳和下壳。
在另一种实施例中，利用合成树脂片型材料或者塑胶片型材料，采用铣底加工方式，铣出与卡片内镶件吻合的槽位，制造所述上壳和下壳。
在又一种实施例中，采用塑胶材料，利用注塑模具采用注塑方法制造所述具有与所述卡片内镶件吻合的槽位的上壳和下壳。
本发明提供了一种卡片制造方法，首先制造上壳和下壳，然后把卡片的柔性内镶件包裹在上壳和下壳中，最后把上壳和下壳合在一起，并对合壳后的卡片进行中温层压，完成卡片的制造，从而实现了有柔性内镶件的卡片的制造，例如包括柔性有源电路板和柔性显示器的新型智能卡，保证了具有柔性内镶件的新型卡类产品的性能，为新型智能卡的大量应用提供了良好的生产制造技术基础。
附图说明
图1是本发明一实施例的上壳的结构示意图；
图2是本发明一实施例的下壳的结构示意图；
图3是本发明一实施例的卡片内镶件的结构示意图；
图4是本发明一实施例的上壳和下壳合壳的示意图；
图5是本发明一实施例的卡片制造流程图。
具体实施方式
本发明首先制造上壳和下壳，然后把卡片内镶件包裹在上壳和下壳内，最后把上壳和下壳合在一起，完成卡片的制造，下面以制造符合ISO7816/7810标准的新型智能卡为例，结合附图及具体实施方式对本发明技术方案做进一步的详细描述。
图5是本发明一实施例的卡片制造流程图，如图5所示，本发明的卡片制造方法包括步骤：
1)制造具有与卡片内镶件吻合的槽位的上壳和下壳。有以下三种方法：
第一种方法：利用的材料是由合成树脂制成的片型材料或者塑胶材料制成的片材材料，例如：PVC(Polyvinylchlorid，聚氯乙烯)、PC(聚碳酸脂)、PETG(Polyethylene Terephtalate Glycol，共聚聚酯)、PET(polyester，聚脂)或ABS(丙烯睛-丁二烯-苯乙烯共聚物)片型材料，通过采用热压延的方法，压制出对应卡片内镶件(inlay)组件长宽高的槽位，从而得到具有与卡片内镶件吻合的槽位的上壳和下壳。图1是本发明一实施例的上壳的结构示意图，如2是本发明一实施例的下壳的结构示意图，如图1和图2所示，11是上壳，21是下壳，12是卡片内镶件的柔性显示器在上壳的避空凹槽，22是卡片内镶件的柔性显示器在下壳的避空凹槽；13是卡片内镶件的柔性电池在上壳的避空凹槽，23是卡片内镶件的柔性电池在下壳的避空凹槽；14是卡片内镶件的柔性按键在上壳的避空凹槽，24是卡片内镶件的柔性按键和柔性电路板在下壳的避空凹槽。
第二种方法：利用的材料是由合成树脂制成的片型材料或者塑胶材料制成的片材材料，例如：PVC、PC、PETG、PET或ABS等片型材料，通过采用铣床或雕刻机等加工机械，进行铣底加工工艺操作，铣出与卡片内镶件的组件吻合的槽位，从而得到具有与卡片内镶件吻合的槽位的上壳和下壳。其中铣槽长宽根据内镶件上组件的长宽决定，铣槽深度根据卡片内镶件上组件的高度决定。
第三种方法：采用塑胶材料，通过采用注塑方法，利用注塑模具，直接注塑出具有与卡片内镶件长宽高吻合的槽位的上壳和下壳。注塑模具的具体制造如下：
采用常规注塑模具，对于薄片产品注塑，最薄只能做到0.18毫米，而对于内有柔性电池和柔性显示器等组件的卡类产品注塑，柔性显示器对应的正面和底面的塑胶层较薄，最薄区域的厚度可达0.1mm或更薄，柔性电池对应的正面和底面的塑胶层也比较薄。本发明使用的注塑模具在上述较薄区域采用排气钢材材料或者采用分格镶件结构，以利于较薄注塑区域排气，让模框排气畅通，胶体阻力最小，流动顺畅。
采用常规注塑模具，注塑完成后，注塑产品顶出模具时会产生顶针印痕。为了避免卡片注塑完成后从注塑模具中顶出时卡片产生顶针印，在注塑模具设计上，卡片注塑顶出结构是采用气动顶出结构，有两种方式可以实现：疏气针和漏斗吹气结构。
2)在上壳和下壳内涂覆胶体。
卡片内镶件的材质与上壳和下壳的材质不同，需要考虑不同材质之间的亲合性，否则所制造的成卡会出现内镶件和上壳以及下壳相脱离，造成起鼓想象，因此需要考虑使用胶脂类材料来弥补上、下壳和内镶件的不同材料之间的亲合力。而且内镶件上的不同组件具有不同的高度并且存在公差，因此内镶件不可能与上壳和下壳之间完全吻合，需要考虑用填充物，例如胶体，来弥补内镶件和上壳以及下壳之间的这些间隙。
图3是本发明一实施例的卡片内镶件的结构示意图，内镶件上具有电池、柔性电路板和柔性显示器等不同组件，需要和上壳和下壳的材料结合。如图3所示，31表示柔性电池，32表示柔性显示器，33表示柔性电路板，34表示柔性按键。所选择使用的胶体应有一个35-70摄氏度的玻化转换温度，并用光聚合。胶体可使用环氧树脂或热塑聚亚胺酯。当使用环氧树脂及玻化温度在70摄氏度以下，就不会损害内镶件的电池和芯片。
在本发明的实施例中，通过自动点胶机或自动喷胶机把胶体喷涂覆到上壳和下壳，采用均匀等间距条状涂覆或点状喷射，点胶机可以精确控制点胶量以及被涂覆胶体的位置。
在以上涂胶基础上，进一步采用柔性滚筒，对所涂覆胶体进行抚平处理。抚平处理的目的首先是让条状胶体可以均匀铺展开，其次是避免在后续工艺中产生气泡，气泡会导致最终卡片产品表面不平整。
在抚平处理之后，还可进一步对涂覆有胶体的上壳和下壳进行抽真空处理，抽真空的目的同样也是为了除去胶体中的气泡。
3)在对上壳和下壳涂覆完胶体并进行了上述相应的抚平和抽真空处理后，把卡片内镶件对应槽位放在上壳或者下壳内，然后把上壳和下壳合在一起，得到合壳后的卡片。
卡片内镶件的各个组件之间需要选择牢固及挠性连接，ISO7816/7810除定义了智能卡模块布局外，同时还定义了智能卡所必须具备的耐弯折性要求。图4是本发明一实施例的上壳和下壳合壳的示意图，如图4所示，11是上壳，21是下壳，23是卡片内镶件的电池在下壳的区域，22是卡片内镶件的显示器在下壳的区域，24是卡片内镶件的按键和柔性电路板在下壳的区域，把内镶件摆放在下壳21内对应内镶件形状区域22、23和24，再合上上壳11。进一步，把上壳和下壳合在一起后可采用柔性滚筒滚压，以保证上壳及下壳和内镶件之间接触严密，避免产生气泡。
4)在得到合壳后的卡片后，对合壳后的卡片采用中温层压方法，得到智能卡卡片。传统智能卡层压方法一般采用高温层压法，其加工温度为135℃(摄氏度)，加工压力为5～6MPa(兆帕)。在本发明中，为了保护内镶件上的电子元器件及显示器，采用中温层压法，加工温度为50～100℃(摄氏度)，压力采用2.5～5MPa(兆帕)。
在得到智能卡卡片后还要进行卡片卡面的印刷，现有的常规制卡印刷层不直接外露，在卡片表面都有0.06毫米或者0.08毫米厚的透明保护膜保护印刷层。本发明的卡面印刷与常规制卡印刷有区别，本发明的卡片印刷层直接印在卡片表面，因此对印刷层的耐磨性要求较高。卡片卡面印刷可采用万能转印，热转印，水转印及丝印来完成.
最后采用现有的ISO7816标准工艺来完成冲字、磁条的粘接、接触式IC贴合等，完成卡片的制造。
需要说明的是，以上所述仅为本发明较佳的具体实施例，而不是对本发明技术方案的限定，任何熟悉该技术的本领域普通技术人员在本发明所提示的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。

Claims (9)

1.一种卡片制造方法，其特征在于，包括步骤：
1)通过以下方式之一制造上壳和下壳：
利用合成树脂片型材料或者塑胶片型材料，采用热压延的方法，压制出与卡片内镶件吻合的槽位，制造所述上壳和下壳；
利用合成树脂片型材料或者塑胶片型材料，采用铣底加工方式，铣出与卡片内镶件吻合的槽位，制造所述上壳和下壳；
采用塑胶材料，利用注塑模具采用注塑方法制造所述上壳和下壳，所述注塑模具在对应卡片塑胶层较薄的区域采用排气钢材材料或者采用分格镶件结构，所述注塑模具上具有疏气针或漏斗吹气结构；
2)采用均匀等间距条状涂覆或者点状喷射在所述上壳和下壳内涂覆胶体；
3)把卡片内镶件放在所述上壳或者下壳内，然后把所述上壳和下壳合在一起，得到合壳后的卡片；
4)对所述合壳后的卡片进行层压处理，得到卡片。
2.如权利要求1所述的方法，其特征在于，所述上壳和下壳内具有与所述卡片内镶件吻合的槽位；步骤3)中把所述内镶件对应所述上壳或者下壳的槽位放在所述上壳或者下壳内。
3.如权利要求1所述的方法，其特征在于，所述卡片塑胶层较薄的区域是所述卡片内电池和显示器所在的区域。
4.如权利要求1所述的方法，其特征在于，步骤2)中进一步包括，在所述上壳和下壳内涂覆胶体后，采用柔性滚筒，对所述涂覆胶体进行抚平处理。
5.如权利要求4所述的方法，其特征在于，进一步包括，在所述抚平处理后，对涂覆有胶体的所述上壳和下壳进行抽真空处理。
6.如权利要求1或4或5所述的方法，其特征在于，步骤3)中进一步包括，把所述上壳和下壳合在一起后，采用柔性滚筒滚压，得到合壳后的卡片。
7.如权利要求1所述的方法，其特征在于，所述层压处理的温度为50摄氏度至100摄氏度。
8.如权利要求1或7所述的方法，其特征在于，所述层压处理的压力为2.5兆帕至5兆帕。
9.如权利要求1所述的方法，其特征在于，进一步包括：得到所述卡片后，在所述卡片的表面直接印制印刷层。
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