WO2010079640A1 - 有機エレクトロルミネセンス表示装置及びその製造方法 - Google Patents
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- WO2010079640A1 WO2010079640A1 PCT/JP2009/065927 JP2009065927W WO2010079640A1 WO 2010079640 A1 WO2010079640 A1 WO 2010079640A1 JP 2009065927 W JP2009065927 W JP 2009065927W WO 2010079640 A1 WO2010079640 A1 WO 2010079640A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
- H10K59/1275—Electrical connections of the two substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
Definitions
- the present invention relates to an organic electroluminescence display device and a manufacturing method thereof. More specifically, the present invention relates to an organic electroluminescence display device having a structure in which a substrate having a light emitting layer or the like and a substrate having a thin film transistor (TFT) element or the like are bonded together, and a method for manufacturing the same.
- TFT thin film transistor
- An organic electroluminescence (hereinafter, also referred to as “EL”) display device has been actively developed as a promising display device for the next generation, and its practical range is gradually widened.
- Organic EL display devices can be roughly classified into a top emission type and a bottom emission type from the light extraction direction.
- the top emission type organic EL display device has a film configuration in which a metal electrode, a light emitting layer, and a transparent electrode are formed in this order on a substrate such as a glass substrate.
- the bottom emission type organic EL display device has a film configuration in which a transparent electrode, a light emitting layer, and a metal electrode are formed in the same order on a substrate such as a glass substrate.
- the top emission type organic EL display device emits light in the direction opposite to the element substrate with respect to the light emitting layer, while the bottom emission type organic EL display device has light emission layer as a reference. Light is emitted in the direction of the element substrate. As described above, the light emission direction from the light emitting layer is different between the top emission type organic EL display device and the bottom emission type organic EL display device.
- the organic EL display device In both the top emission type and the bottom emission type, the organic EL display device generates a light guide component due to total reflection in light emission from the light emitting layer. For this reason, the external extraction efficiency for extracting light emitted from the light emitting layer to the outside of the device is only about 20 to 25%, and it is required to increase the external extraction efficiency. In order to increase the external extraction efficiency, it is necessary to be able to extract the light emitted from the light emitting layer within the same pixel. For that purpose, the light emitted from the light emitting layer is scattered, and the scattered light is further converted into the element. It is necessary to guide the light to the outside.
- the light guiding means for guiding the scattered light to the outside of the element needs to be provided on the light emission side, and preferably has a refractive index as low as possible and as thin as possible. Therefore, a method of providing a low refractive index layer such as a metal thin film in the vicinity of the light emitting layer as the light guiding means (for example, see Patent Document 2) has been proposed.
- the low refractive index layer is preferably transparent in consideration of light transmittance.
- a gas layer made of a gas such as air can be considered.
- the low refractive index layer is an organic EL display device having a top emission structure
- the low refractive index layer may be formed after the EL element is formed on the main surface of the element arrangement substrate, so that the application is easy.
- the bottom emission type organic EL display device since the bottom emission type organic EL display device has to form a low refractive index layer between the element arrangement substrate and the EL element, it becomes a problem in which process the low refractive index layer is formed.
- the light emitting layer constituting the organic EL element is generally formed by vacuum film formation, it is difficult to form a gas layer that becomes a low refractive index layer before forming the light emitting layer.
- an optical member having a high scattering effect is provided like the above-described corner cube array, it is difficult to form a gas layer because of the relationship with the method of forming the corner cube array. That is, the corner cube array is formed by a photo-polymer transfer method (hereinafter referred to as a 2P transfer method).
- a liquid ultraviolet (UV) curable resin is applied onto a support substrate, Since it is formed by irradiating UV light while pressing with a mold, the UV curable resin before curing is in a liquid state and it is difficult to keep the gas layer. Thus, in the bottom emission type organic EL display device, it is difficult to form a gas layer in the initial step before the formation of the organic EL element.
- UV ultraviolet
- a functional element such as a thin film transistor (TFT) is formed on a support substrate, and the formed functional element is peeled off from the support substrate.
- TFT thin film transistor
- a method of attaching to another substrate has been proposed. According to this method, when the functional element is formed, a substrate having excellent heat resistance, such as a glass substrate, can be used as the support substrate, and the peeled functional element is separated from a thin and lightweight resin film or the like. Therefore, the display device can be made thinner and lighter.
- a method of peeling the functional element from the support substrate As a method of peeling the functional element from the support substrate, a method of removing the support substrate by etching or polishing (see, for example, Patent Document 3), an oxide layer in contact with a metal layer or a nitride layer on the support substrate.
- a method of mechanically separating the functional element from the release layer see, for example, Patent Document 4), after implanting hydrogen ions into the release film made of amorphous silicon (a-Si),
- a method of separating the substrate from the release film by heating see, for example, Patent Document 5
- forming a separation layer on a support substrate As a method of peeling the functional element from the support substrate, a method of removing the support substrate by etching or polishing (see, for example, Patent Document 3), an oxide layer in contact with a metal layer or a nitride layer on the support substrate.
- a method of mechanically separating the functional element from the release layer see, for example, Patent Document 4
- the low refractive index layer is formed after the organic EL element is attached to another substrate by applying the above-described method for removing the functional element to a bottom emission type organic EL display device.
- the scattering means and the organic EL element are formed on the main surface of the support substrate, peeled from the support substrate, and then attached to another substrate to form a gas layer.
- the peeled surface from the support substrate is not colored and the light transmittance is maintained, the light emitting layer is not damaged, and the large area is entirely covered. It is required to have three points that can be peeled with a good yield.
- the light emitting layer constituting the organic EL element may be deteriorated by the etching chemical solution or the like.
- a technique of mechanical separation as described in Patent Document 4 is simple and desirable, but this method can be applied to the separation of functional elements such as TFTs, but the functionality is not limited.
- Application is difficult when the element is an organic EL element and a resin structure such as a corner cube array is provided. This is because the adhesion between the resin structure and the organic EL element is often lower than the adhesion between the support substrate and the release layer, and the element is likely to deteriorate due to mechanical separation.
- JP 2002-198184 A Japanese Patent Laid-Open No. 2004-22176 JP 2007-88491 A JP 2003-174153 A JP 2004-335968 A JP 2004-140381 A
- the present invention has been made in view of the above-described present situation, and an object thereof is to provide an organic electroluminescence display device capable of producing an organic electroluminescence display device having high external extraction efficiency with high yield and a method for producing the same. It is.
- the inventors of the present invention have made various studies on the configuration of an organic EL display device that can efficiently extract light from the light emitting layer to the outside, and first focused on a low refractive index layer provided in the vicinity of the light emitting layer. Then, it has been found that an organic EL display device with high external extraction efficiency can be obtained by configuring the low refractive index layer with a gas layer.
- a method of peeling a functional element used in the manufacture of a display device including a functional element such as a TFT from a support substrate, specifically, a functional element such as a TFT formed on the support substrate is provided.
- the present invention is an organic electroluminescence display device having a structure in which an element arrangement substrate having an organic electroluminescence element and a circuit board having a drive circuit for the organic electroluminescence element are joined to each other.
- the element arrangement substrate includes a transparent release layer, a light scattering layer, a transparent electrode, a light emitting layer, and a reflection electrode from the observation surface side, and the reflection electrode is disposed in the gap between the element arrangement substrate and the circuit board.
- An organic electroluminescence display device having a conductor electrically connected to an electrode of a drive circuit.
- the present invention also provides a method for manufacturing an organic electroluminescence display device having a structure in which an element arrangement substrate having an organic electroluminescence element and a circuit board having a drive circuit for the organic electroluminescence element are joined to each other.
- the manufacturing method includes a transparent release layer forming step of forming a transparent release layer on the main surface of the support substrate, a light scattering layer forming step of forming a light scattering layer on the transparent release layer, and the above
- a conductor material disposing step of disposing a conductor material on at least one of the surface and the main surface of the circuit board; and the reflective electrode and the electrode of the drive circuit are guided.
- an organic electroluminescence display device comprising: a laser irradiation process for modifying a part of the transparent release layer by performing typical laser irradiation; and a peeling process for peeling the support substrate from a portion of the modified transparent release layer It is also a manufacturing method.
- the present invention is described in detail below.
- the organic EL display device of the present invention has a structure in which an element arrangement substrate having an organic EL element and a circuit substrate having a drive circuit for the organic EL element are joined to each other.
- the element arrangement substrate bonded to the circuit board includes a transparent peeling layer, a light scattering layer, a transparent electrode, a light emitting layer, and a reflective electrode (metal electrode) from the observation surface side, and light from the light emitting layer is emitted from the transparent peeling layer. It is taken out from the surface on the provided side. Therefore, it can be said that the organic EL display device according to the present invention has a top emission structure from the viewpoint of the film structure, although it is a bottom emission type structure.
- the organic EL display device may be generally called an organic light emitting diode (OLED) display device.
- a low refractive index layer having a lower refractive index than that of a substrate made of glass, resin, or the like can be easily formed on the surface of the element placement substrate on which the transparent release layer is provided. . Thereby, total reflection occurs at the interface between the low refractive index layer and the element arrangement substrate and / or the transparent release layer, and the scattered light from the light emitting layer can be efficiently emitted to the outside.
- the low-refractive index layer is not particularly limited, but the cheapest and simplest structure is one that uses air on the transparent release layer forming surface side as the low-refractive index layer.
- a low refractive index layer can be easily formed even in an organic EL display device having a bottom emission type film structure, which has conventionally been difficult to form a low refractive index layer, and has high external utilization efficiency.
- An organic EL display device can be realized.
- the transparent release layer provided on the element arrangement substrate absorbs irradiated light and causes peeling (in-layer peeling, interface peeling) in the layer and / or the interface.
- the bonding force between the atoms or molecules of the substance constituting the transparent release layer disappears or decreases due to light irradiation, and ablation occurs to cause in-layer peeling and / or interfacial peeling.
- the transparent release layer include those formed of a material such as a polyimide film.
- the transparent peeling layer should just be formed on the light-scattering layer, the arrangement
- the organic EL display device is not specifically limited, It may be formed in the main surface whole surface of a light-scattering layer, and it is partially It may be formed.
- the presence of the transparent release layer can be confirmed using, for example, a scanning electron microscope (EMS).
- the thickness of the transparent release layer is not particularly limited, but is preferably as thin as possible, for example, 40 nm to 300 nm.
- the thickness of the transparent release layer is less than 40 nm, it is difficult to form the transparent release layer, and when the thickness exceeds 300 nm, it is difficult to obtain high light guide properties.
- the light scattering layer is a layer having a light scattering property to scatter light from the light emitting layer, and examples thereof include those formed of a material such as an acrylic or urethane-based photocurable resin.
- a light-scattering layer is a corner cube array.
- the corner cube array is an optical member in which a plurality of pyramidal unit structures (corner cubes) formed by combining planes having the property of reflecting light are arranged, and has high light scattering properties.
- the light incident from the bottom side of the corner cube array has a retroreflective function that repeats reflection on a plane and returns to the incident direction, so the corner cube array is a retroreflective substrate.
- black display can be realized without using a circularly polarizing plate, and effective external extraction efficiency can be improved.
- the corner cube array is used as the scattering means, the scattering property is enhanced, but the light emitted from the light emitting layer is guided and emitted outside the panel at a place away from the light emitting point.
- the low refractive index layer is formed on the light scattering layer as described above, and further, the external extraction efficiency can be further improved by using a corner cube array in combination as a scattering means.
- the transparent electrode, the light emitting layer, and the reflective electrode constitute an organic EL element.
- the transparent electrode metal oxides such as indium tin oxide (ITO) and indium zinc oxide (IZO) are preferably used.
- ITO indium tin oxide
- IZO indium zinc oxide
- a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, and the like may be disposed between the reflective electrode and the transparent electrode.
- the circuit board has a drive circuit for the organic EL element.
- the driving circuit is not particularly limited as long as it is a circuit used for driving an organic EL element provided on the element arrangement substrate, wiring for transmitting a signal to the organic EL element, an element used for driving control of the organic EL element, and the like. Consists of. Examples of the wiring for transmitting a signal to the organic EL element include a gate line and a source line. Examples of the element used for driving control of the organic EL element include a TFT.
- the drive circuit provided on the circuit board does not have to be all circuits necessary for driving the organic EL element, but is provided on the element arrangement board, an external circuit other than the circuit board, and other elements provided on the element arrangement board.
- the organic EL element may be driven together with the circuit or the like.
- the configuration of the circuit board is not particularly limited as long as it has the above-described drive circuit.
- a circuit board having a configuration in which wiring, electrodes, electrical elements, and the like are laminated on an insulating film is preferable. .
- the organic EL display device of the present invention has a conductor that electrically connects the reflective electrode to the electrode of the drive circuit in the gap between the element arrangement substrate and the circuit substrate.
- a conductor that electrically connects the reflective electrode to the electrode of the drive circuit in the gap between the element arrangement substrate and the circuit substrate.
- the element placement substrate and the circuit board are electrically connected by a conductor formed using a plastically deformable material.
- a conductor formed using a plastically deformable material (hereinafter also referred to as a conductor material)
- the conductor material follows the shape of the substrate surface when the element placement substrate and the circuit board are bonded together. Therefore, it is possible to reliably make electrical contact between the electrode of the organic EL element and the electrode of the drive circuit and to ensure a large contact area. As a result, the margin of the substrate interval in the manufacturing process (design tolerance when considering electrical contact by the conductor) is increased.
- the conductor material only needs to be plastically deformed when the element arrangement substrate and the circuit board are bonded together, and may not be plastically deformed after the element arrangement substrate and the circuit board are bonded together.
- the shape of the conductor follows the shape of the substrate surface of the element placement substrate and / or the circuit board.
- the conductor material examples include a conductive paste, an anisotropic conductive film, and solder. In particular, it has excellent followability and retains an appropriate shape, and can conduct electrical connection between the electrode of the organic EL element and the electrode of the drive circuit under mild temperature and pressure conditions.
- An adhesive paste is preferred. That is, it is preferable that the conductor is formed from a conductive paste.
- the conductive paste is usually a material containing a solid content and a solvent.
- the arrangement of the conductor is not particularly limited as long as it electrically connects the electrode of the organic EL element and the electrode of the drive circuit.
- the conductor is provided on the organic EL element arranged for each pixel and the circuit board.
- the conductor is individually arranged for each pixel.
- the electric current generated by the conductor is bonded by bonding with a conductor formed using a plastically deformable material. It is possible to increase the certainty of the direct contact, ensure a large contact area, and suppress the occurrence of inter-pixel leaks and defects (voids). Furthermore, when a spacer made of a material that is not plastically deformed is provided, the effect becomes more remarkable.
- the organic EL device of the present invention may have a spacer in at least one of the element arrangement substrate, the circuit board, and the gap between the element arrangement substrate and the circuit board.
- This spacer is preferably made of a non-plastically deformable material. Since the spacer is made of a material that is not plastically deformed, even when the conductive material is plastically deformed when the element arrangement substrate and the circuit board are bonded together, the spacer between the element arrangement substrate and the circuit board can be appropriately adjusted by the spacer. Can be prescribed. Thereby, it can prevent that a board
- the spacer is not particularly limited as long as it is made of a material that is not plastically deformed, and may have conductivity or may not have conductivity.
- the spacer is not particularly limited as long as it substantially determines the distance between the two substrates due to the presence thereof.
- a protrusion hereinafter referred to as a bump
- an element arrangement substrate and a circuit board hereinafter also referred to as scattering spacers.
- the protrusion is formed on the substrate by, for example, a photolithography method.
- the scattering spacer examples include particulate or rod spacers such as plastic beads and glass beads, and fiber spacers such as glass fibers.
- distribution spacer is spread
- distribution spacer may be kneaded in conductor material, and may be arrange
- non-plastic deformability means a property that does not substantially deform with respect to the pressure applied when the element arrangement substrate and the circuit substrate are bonded together, It is a property that does not generate.
- the original shape is substantially obtained after the deformation occurs with respect to the pressure applied when the element placement substrate and the circuit substrate are bonded.
- the property of recovering may also be included in the nonplastic deformability.
- plastic deformation means that the pressure is applied when the element arrangement substrate and the circuit substrate are bonded together, and the shape before deformation is not recovered. As a pressurizing condition at the time of bonding an element arrangement substrate and a circuit board, it is usually performed at 1 kg / cm 2 or less.
- the element arrangement substrate may further include a protective substrate on the observation surface side with a gap from the transparent release layer.
- a gas layer is formed between the light scattering layer and the protective substrate. This gas layer is generally air.
- the protective substrate is not particularly limited and may be appropriately set depending on the application, but is preferably a glass substrate or a resin film.
- the protective substrate is a resin film
- the resin film is thin and lightweight, so that the organic EL display device can be made thinner and lighter. Further, since the resin film has flexibility, it can be a flexible organic EL display device.
- the protective substrate may be a color filter substrate.
- the configuration of the organic EL display device of the present invention is not particularly limited as long as such components are formed as essential, and other components may or may not be included. is not.
- a transparent release layer forming step for forming a transparent release layer on the main surface of the support substrate, and light scattering for forming a light scattering layer on the transparent release layer.
- a conductor material arranging step of arranging a conductor material on at least one of the side surface and the main surface of the circuit board, and the electrode of the organic EL element and the electrode of the drive circuit are connected by the conductor material.
- the laminating step of bonding the element arrangement substrate and the circuit board, and partial laser irradiation from the main surface side opposite to the side on which the organic EL element of the support substrate is formed Modified a part of the transparent release layer It has to a laser irradiation process, from portions of the reformed transparent release layer and the peeling step of peeling the supporting substrate.
- a part of the transparent release layer can be modified by partial laser irradiation in the laser irradiation step. Since the modified transparent release layer is easily peeled off by applying a mechanical external force, the support substrate is easily peeled off in the peeling step. Thereby, even if a large-sized support substrate is used, it can be peeled with good yield over the entire surface of the substrate. Therefore, it is particularly effective when, for example, a plurality of organic EL element substrates are formed at a time using a single support substrate.
- a mechanical method can be used in the subsequent peeling step by giving a trigger for intentional peeling using partial laser irradiation as a control means for peeling. Large area can be peeled with good yield.
- the transparent peeling layer which is not modified in the laser irradiation process remains on the main surface of the light scattering layer.
- the support substrate is a substrate made of a glass substrate, a plastic film, or the like. If heat resistance is required, a plastic film in which glass fiber or the like is woven into the base material may be used.
- the material is not particularly limited, and may be appropriately selected as necessary. The material is applicable not only to a single layer structure but also to a laminated structure substrate.
- the transparent release layer is made of a polyimide film or the like, and is formed on the main surface of the support substrate by applying a resin solution or laminating a resin film.
- the thickness of the transparent release layer is not particularly limited, but is preferably 40 nm to 300 nm.
- the light scattering layer is not particularly limited as long as it has light scattering properties, but in the present invention, a corner cube array having high light scattering properties is preferably used. it can.
- the method for forming the corner cube array is not particularly limited, and may be formed by a conventionally known method.
- the organic EL element is an organic EL element in which a transparent electrode, a light emitting layer, and a reflective electrode are laminated in this order.
- the formation method of an organic EL element is not specifically limited, What is necessary is just to form by a conventionally well-known method.
- the conductor material arranging step is a step of arranging a conductor material on at least one of the element arrangement substrate and the circuit board.
- the conductor material those described above are used.
- a method for arranging the conductor material for example, if the conductor material is a conductive paste, a method of arranging with a dispenser or an ink jet method is preferably used.
- the bonding step is a step of bonding the element arrangement substrate and the circuit substrate so that the electrode of the organic EL element and the electrode of the drive circuit are connected by a conductor material.
- a bonding method used in this step for example, a method in which both substrates are pressed from above and below in a state in which both substrates are aligned so that the positions of the marks for bonding of both substrates coincide. Is mentioned.
- laser irradiation is partially performed from the main surface side opposite to the side on which the organic EL element of the support substrate is formed toward the transparent release layer.
- Such laser irradiation can be easily realized by using a mask. Since the transparent release layer irradiated with the laser is modified, it is easily peeled off in the subsequent peeling step. Note that when laser irradiation is performed on the transparent release layer in the display region, the transparent release layer is colored, and therefore, partial laser irradiation is performed so that the display region is not irradiated with laser. Since the transparent release layer remaining after peeling is not modified by laser irradiation, the transparency is not impaired.
- Laser irradiation is not particularly limited, and examples thereof include a gas laser and a solid (semiconductor) laser, and an excimer laser using ultraviolet rays is particularly preferable.
- the energy density of the irradiated laser beam particularly in the case of an excimer laser, is preferably about 150 mJ / cm 2 to 250 mJ / cm 2, and is preferably about 190 mJ / cm 2 to 210 mJ / cm 2. More preferred.
- the laser irradiation time is preferably about 10 nsec to 200 nsec, and more preferably about 10 nsec to 50 nsec.
- the support substrate is peeled from the light scattering layer.
- a part of the transparent release layer remains on the surface of the light scattering layer provided with the transparent release layer, and there is no support substrate on the surface, and the surface is in contact with gas (air) having a low refractive index.
- gas air
- the configuration of the manufacturing method of the organic EL display device of the present invention is not particularly limited by the presence or absence of other steps as long as such components are essential.
- laser irradiation may be performed between the outer edge of the display area of the display device and / or the pixel area in the display area through a mask. According to this process, the laser irradiation region and the non-irradiation region can be easily distinguished. Moreover, as a preferable aspect according to the present invention, there is one that uses a color filter as a mask when the element arrangement substrate is provided with a color filter. According to such a configuration, laser irradiation can be easily performed between the outer edge of the display area and the pixel area in the display area.
- the manufacturing method may further include a spacer arrangement step of arranging a spacer on at least one of the element arrangement substrate and the circuit board.
- a spacer it is preferable to dispose a spacer made of a material harder than the conductor material.
- “harder than the conductor material” means that a higher pressure is required for plastic deformation than the conductor material. Even when such a spacer is used, when the conductive material is plastically deformed when the element arrangement substrate and the circuit board are bonded together, the substrate spacing between the element arrangement substrate and the circuit board is appropriately defined by the spacer. can do. As a result, the distance between the substrates can be reduced and the conductor material can be prevented from being excessively spread, so that a short circuit between pixels can be prevented.
- Examples of the spacer arrangement method include a method of patterning a photosensitive resin film by a photolithography method to form a bump at a desired position if the spacer is a bump, and a dispenser if the spacer is a granular spacer. And a method of spraying by an ink jet method.
- the organic EL display device according to the present invention obtained by the above manufacturing method finally extracts light from the upper surface of the substrate by transferring an organic EL element having a bottom emission type element structure. . Therefore, it can be said that the organic EL display device finally obtained is an organic EL display device manufactured to have a top emission structure while the film configuration of the organic EL element is a bottom emission type configuration.
- the organic EL display device having such a configuration can prevent deterioration of the electrode, which is a problem in the manufacturing process, while realizing a high aperture ratio which is an advantage of the top emission type. That is, the aperture ratio can be increased as compared with an organic EL display device having a general bottom emission structure.
- an organic EL display device having a bottom emission structure that performs high-definition display exceeding 200 ppi (pixels per inch) has an extremely low aperture ratio, which is particularly advantageous in such a case. .
- the organic EL material can be prevented from deteriorating during the manufacturing process. It is possible to avoid a decrease in transmittance when the electrode is formed.
- the present invention there is no support substrate in contact with the surface of the light scattering layer on which the transparent release layer is provided, and this surface is in contact with the low refractive index layer. it can. Further, by separating the organic EL element from the support substrate by combining partial laser irradiation and mechanical peeling, it is possible to perform peeling with a high yield over a large area, which is excellent in mass productivity.
- FIGS. 1A and 1B are cross-sectional views illustrating the configuration of a bottom emission type organic EL display device according to Embodiment 1.
- FIG. FIGS. 2A to 2D are schematic cross-sectional views illustrating the manufacturing process of the bottom emission type organic EL display device according to the first embodiment.
- FIGS. 2-2 (e) to (g) are schematic cross-sectional views illustrating the manufacturing process of the bottom emission type organic EL display device according to the first embodiment.
- FIG. 3A is a schematic plan view showing the state of the substrate shown in FIG. 2-1C.
- FIG. 3B is a schematic plan view showing a state where a sealing seal is further applied.
- . 4A shows a state in which the organic EL display device according to Embodiment 1 is lit, and FIG.
- FIG. 4B is a schematic plan view showing a state in which the organic EL display device according to Comparative Embodiment 1 is lit.
- FIG. FIG. 5A is a schematic plan view illustrating an example of four chamfering according to the third embodiment
- FIG. 5B is a schematic plan view illustrating a mother substrate for forming a color filter substrate.
- FIG. 5C is an enlarged view of a main part showing a part of a plurality of color filters included in the color filter substrate.
- Embodiment 1 The present embodiment will be described below with reference to FIGS. First, the main configuration of the organic EL display device according to the present embodiment will be described with reference to FIG.
- FIG. 1A is a schematic cross-sectional view showing the configuration of the organic EL display device according to this embodiment.
- the organic EL display device 101 has a configuration in which an element placement substrate 10 and an auxiliary substrate 20 as a circuit substrate, which are individually manufactured, are bonded together via a conductive paste 30.
- the element placement substrate 10 is provided with a sealing glass 50 on the side facing the auxiliary substrate 20 via a sealing seal 40, and the sealing glass 50 is a counterbore formed in the central portion of the auxiliary substrate 20. Placed in.
- the element arrangement substrate 10 has a corner cube array 11 as a light scattering layer.
- the corner cube array 11 is an optical member that scatters light from the light emitting layer 13 described later, and is disposed on the transparent electrode 12 side.
- an ultraviolet curable resin is preferably used, but it is colorless and transparent in the visible light range, and has reliability including mechanical resistance after curing, light resistance, weather resistance, and the like. If it is a thing, it can apply also to thermosetting inorganic materials, such as a thermosetting resin and SOG (Spin on glass).
- the organic EL element 15 is provided on the main surface of the corner cube array 11 on the unevenness forming surface side.
- the organic EL element 15 includes a transparent electrode (ITO) 12 serving as an anode, a light emitting layer 13, and a reflective electrode (metal film) 14 serving as a reflective electrode, which are laminated in this order.
- ITO transparent electrode
- metal film metal film
- a hole injection layer, an electron transport layer, an electron injection layer, and the like may be laminated.
- the auxiliary substrate 20 has a configuration in which circuits (not shown) such as TFT elements, gate lines, and source lines for driving the organic EL elements 15 are formed on the main surface of a substrate such as a glass substrate or a plastic substrate.
- the element arrangement substrate 10 configured as described above and the auxiliary substrate 20 are electrically connected via a conductive paste 30 applied between the two substrates.
- the conductive paste 30 is made of a plastically deformable material, and when the element placement substrate 10 and the auxiliary substrate 20 are bonded together, it is preferable that the conductive paste 30 be plastically deformed by pressure from both substrates.
- the air on the observation surface side of the element arrangement substrate 10 functions as a low refractive index layer, so that the external extraction efficiency of light emission is improved. Can be planned.
- the element arrangement substrate 10 and the auxiliary substrate 20 are connected using the conductive paste 30 having plastic deformability, a reliable and low resistance electrical connection can be realized and the two substrates can be bonded together. In this case, even if the substrate interval changes, it is easy to ensure the electrical connection, so that a tolerance for designing the substrate interval can be increased, and the mass productivity is excellent.
- each component of the organic EL display device shown in FIGS. 1A and 1B has been described, but the organic EL display device of the present embodiment is shown in FIGS. 1A and 1B. Components other than those shown may be included. Further, the configuration of the organic EL display device shown in FIGS. 1A and 1B is partially simplified, and various changes or modifications may be made.
- the corner cube array 11 is described as an example of the light scattering layer.
- the present invention is not limited to this, and any substrate having scattering properties can be applied as the light scattering layer.
- an organic EL display device 102 in which a front substrate 17 as a protective substrate is bonded to the element arrangement substrate 10 with a sealant 19 may be used. Even with such a configuration, an air layer serving as a low refractive index layer is formed between the front substrate 17 and the transparent release layer 16, and thus the same effect as described above can be obtained.
- the front substrate 17 include a glass substrate and a resin film, and a color filter substrate.
- the sealing agent 19 for example, a sealing agent mixed with a filler having a diameter of 5 ⁇ m can be used. Further, since the light emitting layer 13 is vulnerable to heat, it is preferable to use a photocurable sealing agent as the sealing agent 19 instead of a thermosetting sealing agent.
- the element placement substrate 10 has been described as an example in which the auxiliary substrate 20 on which the TFT or the like is formed and the sealing glass 50 are bonded.
- the present invention is not limited to this, for example, Also, an active matrix substrate or the like in which the auxiliary substrate 20 and the sealing glass 50 are integrated and a TFT element is formed can be used.
- FIGS. 2A and 2B are schematic cross-sectional views illustrating the manufacturing process of the organic EL element according to the present embodiment
- FIG. 3 is a schematic plan view showing the state of the element forming substrate during the manufacturing process. It is.
- a method of peeling the organic EL element formed on the support substrate from the support substrate and attaching it to another substrate is applied. Therefore, first, as shown in FIG.
- a transparent release layer 16 is formed by forming a polyimide film with a thickness of 40 nm to 200 nm on the main surface of the support substrate 60 made of a glass substrate. A resin layer was formed.
- this resin layer is referred to as a transparent resin layer 18.
- the corner cube array 11 was formed on the transparent resin layer 18.
- the corner cube array 11 was formed by transfer molding using a 2P method (photopolymer process method) using an ultraviolet curable transparent acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., brand: MP107).
- the thickness d1 of the concave portion is about 10 ⁇ m
- the thickness d2 of the convex portion is about 30 ⁇ m.
- a transparent electrode (registered trademark IZO, manufactured by Idemitsu Kosan Co., Ltd.) 12, a light emitting layer 13, and a reflective electrode (aluminum metal film) 14 are sequentially formed in a desired shape on the corner cube array 11, and FIG. As shown in -1 (c), a substrate on which the organic EL element 15 was formed was obtained.
- a schematic cross-sectional view of the organic EL element 15 in a portion having a three-layer structure is shown, but in reality, the organic EL element 15 has a three-layer structure on the entire surface of the corner cube array 11. It has a three-layer structure in part. The configuration is shown in FIG.
- FIG. 3A is a schematic plan view showing the state of the substrate shown in FIG. 2-1C, and shows a 25 mm square region on the corner cube array 11.
- transparent electrodes (ITO) 12 having a width of 2 mm and a length of 10 mm are formed at four locations.
- a 13 mm square light emitting layer 13 is formed at the center of this region so as to cover a part of the transparent electrode 12.
- reflective electrodes 14 having a width of 2 mm and a length of 10 mm are formed at four locations.
- the transparent electrode 12 and the reflective electrode 14 are disposed so as to be orthogonal to each other.
- the transparent electrode 12, the light emitting layer 13, and the reflective electrode 14 are each formed into a film in the above-described pattern. Thereby, the organic EL element 15 is formed on the main surface of the substrate.
- a sealing seal 40 is applied to a 17 mm square region, and sealing is performed via the sealing seal 40. Glass 50 was bonded.
- a silver paste (made by Toyobo Co., Ltd., brand: DW-351H-30, curing type: thermosetting type, filler: silver) using a dispenser around the counterbore formed on the auxiliary substrate 20 ) was applied.
- the conductive paste 30 at this point holds a hemispherical shape (a shape with the bowl turned down).
- the sealing glass 50 is disposed in the counterbore part, the corner cube array 11 on which the organic EL element 15 is formed, and the auxiliary substrate 20 are bonded together while being pressed, and taken out around the organic EL element 15 and the auxiliary substrate 20.
- the electrodes were electrically connected. As a result, a substrate shown in FIG. 2-1 (d) was obtained.
- UV ultraviolet rays
- the resin layer 18a irradiated with UV is modified and colored, and the adhesive force for bonding the support substrate 60 and the corner cube array 11 is weakened. Therefore, when the resin layer 18a irradiated with UV was used as a trigger for peeling, the support substrate 60 was peeled off by applying a mechanical external force. As a result, substantially all of the resin layer 18a was peeled off together with the support substrate 60. The reason why the resin layer 18a was adhered to the support substrate 60 side and peeled off was because it had higher adhesion than the corner cube array 11 made of acrylic resin with respect to the support substrate 60 that is a glass substrate. Conceivable.
- a front substrate 17 is disposed with a gap from the transparent release layer 16 as necessary. May be.
- the manufacturing method of the organic EL display device According to the manufacturing method of the organic EL display device according to the present embodiment, even in the organic EL display device having the bottom emission type film structure, which has been difficult in the past, the vicinity of the light emitting layer can be obtained in a simple process. In addition, a gas layer as a low refractive index layer can be formed. Further, by performing partial laser irradiation, the resin layer 18b in a display area or the like where transparency is required remains without loss of transparency, and the colored resin layer 18a is peeled off. The external take-out efficiency is not impaired.
- the light emitting layer 13 is not damaged by performing partial laser irradiation of irradiating a portion other than the display portion with laser within the display element surface.
- the support substrate 60 when the support substrate 60 is peeled off by applying a mechanical external force after performing partial laser irradiation, the support substrate 60 can be easily peeled off with high yield, and only a mechanical method is applied. Productivity.
- FIG. 4A is a schematic plan view showing a lighting state of the organic EL display element.
- no light emission was observed except that four 2 mm square light emission 41 were confirmed, and almost no dispersion of the light emission was observed. This is because the light guide component can be emitted at substantially the same location as the light emitting point, and the light emission 41 is brighter than the light emission of the organic EL display element according to Comparative Example 1 described later. . As a result, it was confirmed that effective external extraction efficiency was improved.
- Comparative embodiment 1 In order to confirm the effect of UV irradiation in the first embodiment, this comparative embodiment was performed as follows. That is, an organic EL element was tried to be produced in the same manner as in Embodiment 1 except that the laser irradiation process shown in FIG. 2-2 (e) was not performed. However, it was difficult to peel off the support substrate 60, and the transparent resin layer 18 was left on almost the entire surface of the corner cube array 11.
- FIG. 4B is a schematic plan view showing a lighting state of the organic EL display element.
- three light emission 42a to 42c were seen around each light emission 42. Since the light emission 42a to 42c is about 2 to 3 mm away from the center (light emission point) of the light emission 42, the region including the light emission 42a to 42c with the light emission 42 as the center is larger than the size of one pixel of the display element. . Therefore, this light guide component cannot be effectively used for display.
- the emitted light 42 is darker than the emitted light 41 according to the first embodiment shown in FIG.
- Embodiment 2 an organic EL display device having a configuration using a color filter substrate as a protective substrate will be described.
- a color filter substrate is used as a mask instead of the polyimide resin (Kapton tape) 80 used in the first embodiment.
- a color filter substrate has a combination of color display color layers such as red (R), green (G), and blue (B) color filter layers on a substrate such as a glass substrate or a plastic substrate for each pixel.
- a grid-like black matrix (BM) is provided as a black color filter layer so as to partition the colored layers for color display.
- a polyimide film is formed on the color filter substrate configured as described above and used as a mask.
- the resin in the region covered with the R, G, B color filter layers is irradiated with UV, and the resin in the region covered with BM. No UV irradiation. Thereby, in the subsequent peeling step, the resin in the region covered with the color filter layer is peeled off, and the resin in the region covered with BM remains as the transparent peeling layer 16.
- the color filter substrate used as a mask is attached as the front substrate 17, whereby a gas layer which is a low refractive index layer is formed between the color filter layer and the corner cube array, and the light emitting layer
- the external extraction efficiency from 13 is improved.
- the transparent resin layer 18 can be modified by using the color filter substrate as a mask in the laser irradiation step shown in FIG. Further, it is not necessary to apply a polyimide resin (Kapton tape) 80 to the support substrate 60 to be peeled off, and the support substrate 60 can be easily reused.
- a polyimide resin Kapton tape
- Embodiment 3 when an organic EL element is applied to a display device, a case where a plurality of organic EL display devices are formed at a time using a large support substrate will be described as an example.
- FIG. 5A is a schematic plan view showing an example of so-called four chamfering, in which four support substrates 11a to 11d are formed from a large support substrate 110, and FIG. 5B shows a color filter substrate.
- FIG. 5C is a schematic plan view showing a mother substrate to be formed, and FIG. 5C is an enlarged view of a main part showing a part of a plurality of color filters included in the color filter substrate.
- organic EL elements are formed in the same manner as the steps shown in FIGS. 2-1 (a) to 2-1 (c) in the first embodiment.
- a sealing seal 40 is applied to each of the support substrates 11a to 11d and bonded to the sealing glass 40.
- the sealing glass 40 may be provided individually so as to correspond to each of the support substrates 11a to 11d, or a plurality of sealing glasses 40 may be arranged on a large mother substrate.
- the substrate is bonded to the auxiliary substrate 20 using the conductive paste 30 in the same manner as the step shown in FIG.
- the auxiliary substrate 20 is not shown here, a circuit and a counterbore are formed so as to correspond to the support substrates 11a to 11d.
- a color filter substrate is used here as in the second embodiment.
- the color filter substrates may be individually arranged on the respective support substrates 11a to 11d.
- four color filter substrates 71a are provided so as to face the respective support substrates 11a to 11d. It is easy to use the mother board 120 on which .about.71d is arranged.
- laser irradiation it is effective to perform UV irradiation on a region outside the display area of the display device, that is, outside the frame BMs 72a to 72d in FIG. 5B.
- laser irradiation may be performed between each pixel in the display area, or a combination of both may be used.
- the BM formed on the color filter substrates 71a to 71d can be used as a light shielding portion.
- the color filter substrates 71a to 71d are provided with a color filter 702 for each pixel, and adjacent pixels are partitioned by a BM 703. Therefore, laser irradiation can be performed using the BM 703 as a light shielding portion.
- a polyimide film that absorbs ultraviolet rays is preferably provided over the color filter 702.
- the support substrates 11a to 11d that is, the support substrate 110 is peeled off.
- the resin for forming the transparent resin layer 18 is modified in advance by partial laser irradiation, the subsequent mechanical peeling causes the case where such a large substrate is used. Even if it exists, it can peel easily with a good yield.
- color filter substrates 71a to 71d and the like are provided as necessary, and are separated for each display device, thereby obtaining four organic EL display devices at a time.
- the color filter substrate is used as a mask in the laser irradiation step shown in FIG. It is possible to easily modify the transparent resin layer at a desired location. Further, it is not necessary to apply a polyimide resin (Kapton tape) 80 to the support substrate 110 to be peeled off, and the support substrate 110 can be easily reused. Further, by combining the modification of the resin by partial laser irradiation and the separation by applying a mechanical external force, the separation can be performed with a high yield even when a large substrate is used. Thereby, the gas layer as a low refractive index layer can be formed in the vicinity of the light emitting layer in a plurality of organic EL display devices at a time.
Abstract
Description
以下に本発明を詳述する。
なお、有機EL表示装置は、一般に有機発光ダイオード(OLED)表示装置と呼ばれることもある。
以下に、図1~図4を用いて、本実施形態を説明する。まず、図1を用いて本実施形態に係る有機EL表示装置の主要な構成について説明する。図1(a)は、本実施形態に係る有機EL表示装置の構成を示す断面模式図である。
上記実施形態1におけるUV照射の効果を確かめるために、以下のように本比較実施形態を行った。すなわち、図2-2(e)に示すレーザ照射工程を行わなないこと以外は、実施形態1と同様にして有機EL素子を作製しようとした。しかしながら、支持基板60の剥離は困難であり、透明樹脂層18がコーナーキューブアレイ11のほぼ全面に残った状態となった。
この実施形態では、保護基板としてカラーフィルタ基板を用いた構成の有機EL表示装置について説明する。本実施形態においては、レーザ照射工程において、上記実施形態1において使用したポリイミド樹脂(カプトンテープ)80に代えてカラーフィルタ基板をマスクとして用いる。
この実施形態では、有機EL素子をディスプレイ装置に適用する際において、大型の支持基板を用いて一度に複数の有機EL表示装置を形成する場合を例に挙げて説明する。
11 コーナーキューブアレイ
12 透明電極
13 発光層
14 反射電極
15 有機EL素子
16 透明剥離層
17 前側基板
18 透明樹脂層
18a、18b 樹脂層
19 シール剤
20 補助基板
30 導電性ペースト
40 封止シール
41、42、42a~42c 発光
50 封止ガラス
60、110、11a~11d 支持基板
71a~71d カラーフィルタ基板
80 ポリイミド樹脂
81 紫外線
101、102 有機EL表示装置
120 母基板
702 カラーフィルタ
703 BM
d1 凹部の厚み
d2 凸部の厚み
Claims (10)
- 有機エレトクトロルミネセンス素子を有する素子配置基板と、該有機エレクトロルミネセンス素子の駆動回路を有する回路基板とが互いに接合された構造を有する有機エレクトロルミネセンス表示装置であって、
該素子配置基板は、観察面側から、透明剥離層、光散乱層、透明電極、発光層及び反射電極を備え、
該素子配置基板と該回路基板との間隙に、該反射電極を該駆動回路の電極に電気的に接続する導電体を有することを特徴とする有機エレクトロルミネセンス表示装置。 - 前記透明剥離層は、前記光散乱層上に部分的に形成されており、
前記有機エレクトロルミネセンス表示装置は、前記観察面側に該透明剥離層と間隙を空けて保護基板を更に備え、
該素子配置基板と該保護基板との間には、気体層が形成されていることを特徴とする請求項1記載の有機エレクトロルミネセンス表示装置。 - 前記気体層は、空気層であることを特徴とする請求項1又は2記載の有機エレクトロルミネセンス表示装置。
- 前記保護基板は、ガラス基板又は樹脂フィルムであることを特徴とする請求項2又は3記載の有機エレクトロルミネセンス表示装置。
- 前記保護基板は、カラーフィルタ基板であることを特徴とする請求項2~4のいずれかに記載の有機エレクトロルミネセンス表示装置。
- 前記透明剥離層の厚みは、40nm~300nmであることを特徴とする請求項1~5のいずれかに記載の有機エレクトロルミネセンス表示装置。
- 前記光散乱層は、コーナーキューブアレイであることを特徴とする請求項1~6のいずれかに記載の有機エレクトロルミネセンス表示装置。
- 有機エレトクトロルミネセンス素子を有する素子配置基板と、該有機エレクトロルミネセンス素子の駆動回路を有する回路基板とが互いに接合された構造を有する有機エレクトロルミネセンス表示装置の製造方法であって、
該製造方法は、
支持基板の主面上に透明剥離層を形成する透明剥離層形成工程と、
該透明剥離層の上に光散乱層を形成する光散乱層形成工程と、
該光散乱層の上に、透明電極、発光層及び反射電極がこの順に積層された有機エレクトロルミネセンス素子を形成する素子形成工程と、
該支持基板の該有機エレクトロルミネセンス素子が形成された側の面及び該回路基板の主面の少なくとも一方の面上に導電体材料を配置する導電体材料配置工程と、
該反射電極と該駆動回路の電極とが導電体材料により接続されるように、該素子配置基板と該回路基板とを貼り合わせる貼り合わせ工程と、
該支持基板の該有機エレクトロルミネセンス素子が形成された側とは反対の主面側から部分的なレーザ照射を行って該透明剥離層の一部を改質するレーザ照射工程と、
改質した透明剥離層の部分から該支持基板を剥離する剥離工程とを
有することを特徴とする有機エレクトロルミネセンス表示装置の製造方法。 - 前記レーザ照射工程は、
マスクを介して、表示装置の表示領域の外縁及び/又は表示領域内における画素領域間にレーザ照射することを特徴とする請求項8記載の有機エレクトロルミネセンス表示装置の製造方法。 - 前記マスクとしてカラーフィルタを用いることを特徴とする請求項9記載の有機エレクトロルミネセンス表示装置の製造方法。
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CN2009801471165A CN102224613A (zh) | 2009-01-07 | 2009-09-11 | 有机电致发光显示装置及其制造方法 |
US13/140,135 US20110254440A1 (en) | 2009-01-07 | 2009-09-11 | Organic electroluminescence display device and method for producing the same |
JP2010545685A JPWO2010079640A1 (ja) | 2009-01-07 | 2009-09-11 | 有機エレクトロルミネセンス表示装置及びその製造方法 |
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JP2016009554A (ja) * | 2014-06-23 | 2016-01-18 | 王子ホールディングス株式会社 | 半導体素子用基板、有機発光ダイオード素子、または有機薄膜太陽電池素子 |
JP2017098087A (ja) * | 2015-11-25 | 2017-06-01 | 東レ株式会社 | 樹脂膜の製造方法、樹脂積層膜の製造方法および表示装置の製造方法 |
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WO2020136849A1 (ja) * | 2018-12-27 | 2020-07-02 | シャープ株式会社 | 表示装置及び表示装置の製造方法 |
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US20110254440A1 (en) | 2011-10-20 |
EP2375466A1 (en) | 2011-10-12 |
BRPI0924191A2 (pt) | 2016-02-10 |
CN102224613A (zh) | 2011-10-19 |
EP2375466A4 (en) | 2012-10-17 |
RU2011133042A (ru) | 2013-02-20 |
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