WO2010067977A3 - 인쇄회로기판의 제조방법 - Google Patents

인쇄회로기판의 제조방법 Download PDF

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Publication number
WO2010067977A3
WO2010067977A3 PCT/KR2009/007016 KR2009007016W WO2010067977A3 WO 2010067977 A3 WO2010067977 A3 WO 2010067977A3 KR 2009007016 W KR2009007016 W KR 2009007016W WO 2010067977 A3 WO2010067977 A3 WO 2010067977A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
manufacturing
circuit board
printed circuit
forming
Prior art date
Application number
PCT/KR2009/007016
Other languages
English (en)
French (fr)
Other versions
WO2010067977A2 (ko
Inventor
이영인
김용범
남명화
명세호
김태선
Original Assignee
엘지이노텍주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍주식회사 filed Critical 엘지이노텍주식회사
Publication of WO2010067977A2 publication Critical patent/WO2010067977A2/ko
Publication of WO2010067977A3 publication Critical patent/WO2010067977A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

실시예에 따른 인쇄회로기판의 제조방법은 제1 도전층 상에 경화성 수지를 형성하는 단계; 패턴이 형성된 금형을 이용하여 상기 경화성 수지에 비아홀을 형성하는 단계; 상기 제1 도전층 상에 도금층을 형성하여 상기 비아홀을 채우는 도전비아를 형성하는 단계; 상기 도전비아 및 경화성 수지의 상면에 제2 도전층을 적층하는 단계; 및 상기 제1 도전층 및 제2 도전층을 패터닝하는 단계를 포함한다.
PCT/KR2009/007016 2008-12-08 2009-11-26 인쇄회로기판의 제조방법 WO2010067977A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0123814 2008-12-08
KR1020080123814A KR20100065474A (ko) 2008-12-08 2008-12-08 인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
WO2010067977A2 WO2010067977A2 (ko) 2010-06-17
WO2010067977A3 true WO2010067977A3 (ko) 2010-08-26

Family

ID=42243167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007016 WO2010067977A2 (ko) 2008-12-08 2009-11-26 인쇄회로기판의 제조방법

Country Status (2)

Country Link
KR (1) KR20100065474A (ko)
WO (1) WO2010067977A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200055424A (ko) 2018-11-13 2020-05-21 삼성전기주식회사 인쇄회로기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法
JP2001196714A (ja) * 2000-01-17 2001-07-19 Jsr Corp 回路基板およびその製造方法
KR100601474B1 (ko) * 2004-10-28 2006-07-18 삼성전기주식회사 임프린트법을 이용한 고분해능 인쇄회로기판의 제조방법
KR100688103B1 (ko) * 2003-09-29 2007-03-02 이비덴 가부시키가이샤 프린트 배선판용 층간 절연층, 프린트 배선판 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法
JP2001196714A (ja) * 2000-01-17 2001-07-19 Jsr Corp 回路基板およびその製造方法
KR100688103B1 (ko) * 2003-09-29 2007-03-02 이비덴 가부시키가이샤 프린트 배선판용 층간 절연층, 프린트 배선판 및 그 제조방법
KR100601474B1 (ko) * 2004-10-28 2006-07-18 삼성전기주식회사 임프린트법을 이용한 고분해능 인쇄회로기판의 제조방법

Also Published As

Publication number Publication date
WO2010067977A2 (ko) 2010-06-17
KR20100065474A (ko) 2010-06-17

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