WO2008140017A1 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents
感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDFInfo
- Publication number
- WO2008140017A1 WO2008140017A1 PCT/JP2008/058552 JP2008058552W WO2008140017A1 WO 2008140017 A1 WO2008140017 A1 WO 2008140017A1 JP 2008058552 W JP2008058552 W JP 2008058552W WO 2008140017 A1 WO2008140017 A1 WO 2008140017A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- wiring board
- printed wiring
- resist pattern
- photosensitive resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800155325A CN101681107B (zh) | 2007-05-11 | 2008-05-08 | 感光性树脂组合物、感光性元件、抗蚀剂图形的形成方法以及印刷电路板的制造方法 |
KR1020097021753A KR101139543B1 (ko) | 2007-05-11 | 2008-05-08 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
JP2009514138A JP4985768B2 (ja) | 2007-05-11 | 2008-05-08 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-127224 | 2007-05-11 | ||
JP2007127224 | 2007-05-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008140017A1 true WO2008140017A1 (ja) | 2008-11-20 |
Family
ID=40002217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058552 WO2008140017A1 (ja) | 2007-05-11 | 2008-05-08 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4985768B2 (ja) |
KR (1) | KR101139543B1 (ja) |
CN (1) | CN101681107B (ja) |
TW (1) | TWI398729B (ja) |
WO (1) | WO2008140017A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010039475A (ja) * | 2008-06-10 | 2010-02-18 | Fujifilm Corp | 紫外光レーザー露光用感光性樹脂組成物、パターン形成方法、その方法を用いて製造したカラーフィルタ、カラーフィルタの製造方法および液晶表示装置 |
JP2010271708A (ja) * | 2009-04-21 | 2010-12-02 | Central Glass Co Ltd | トップコート組成物 |
JP2011034005A (ja) * | 2009-08-05 | 2011-02-17 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2012048202A (ja) * | 2010-07-30 | 2012-03-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法、プリント配線板の製造方法及びプリント配線板 |
JP2013047816A (ja) * | 2012-10-01 | 2013-03-07 | Taiyo Holdings Co Ltd | プリント配線板用光硬化性樹脂組成物 |
JP2018049220A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5521800B2 (ja) * | 2010-06-08 | 2014-06-18 | Jsr株式会社 | 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、及び表示素子 |
CN103109234A (zh) * | 2010-09-16 | 2013-05-15 | 株式会社Lg化学 | 光敏树脂组合物、干膜阻焊膜以及电路板 |
KR101609634B1 (ko) | 2012-12-26 | 2016-04-06 | 제일모직 주식회사 | 감광성 수지 조성물 및 이를 이용한 차광층 |
US10111328B2 (en) * | 2013-03-07 | 2018-10-23 | Htachi Chemical Company, Ltd. | Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board |
KR20210150619A (ko) * | 2013-08-02 | 2021-12-10 | 쇼와덴코머티리얼즈가부시끼가이샤 | 감광성 수지 조성물 |
JPWO2020026810A1 (ja) * | 2018-07-30 | 2021-05-13 | 富士フイルム株式会社 | 機上現像型平版印刷版原版、平版印刷版の作製方法、及び、平版印刷方法 |
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JP2006010793A (ja) * | 2004-06-23 | 2006-01-12 | Jsr Corp | 着色層形成用感放射線性組成物およびカラーフィルタ |
JP2006259150A (ja) * | 2005-03-16 | 2006-09-28 | Tamura Kaken Co Ltd | 感光性樹脂組成物およびプリント配線板 |
WO2006129697A1 (ja) * | 2005-05-31 | 2006-12-07 | Taiyo Ink Manufacturing Co., Ltd. | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
JP2007033467A (ja) * | 2005-06-22 | 2007-02-08 | Tokyo Ohka Kogyo Co Ltd | 感光性組成物およびブラックマトリクス |
JP2007072034A (ja) * | 2005-09-06 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | 感光性組成物 |
JP2008052069A (ja) * | 2006-08-25 | 2008-03-06 | Tokyo Ohka Kogyo Co Ltd | 着色感光性樹脂組成物 |
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JPH11209613A (ja) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | 感光性ポリイミド前駆体組成物、およびそれを用いたパターン製造方法 |
TWI258634B (en) * | 1999-10-22 | 2006-07-21 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element using the same, a process for producing resist pattern and resist pattern laminate |
AU2001222286A1 (en) * | 2000-01-17 | 2001-07-31 | Showa Highpolymer Co. Ltd. | Photosensitive resin composition |
JP4395384B2 (ja) * | 2004-01-28 | 2010-01-06 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び積層体 |
CN100460432C (zh) * | 2004-08-12 | 2009-02-11 | Jsr株式会社 | 侧链不饱和聚合物、辐射敏感性树脂组合物以及液晶显示元件用隔板 |
JP2007004138A (ja) * | 2005-05-23 | 2007-01-11 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
US20090233230A1 (en) * | 2005-07-22 | 2009-09-17 | Yosuke Hata | Photosensitive Resin Composition and Laminates |
JP4761909B2 (ja) * | 2005-10-05 | 2011-08-31 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び積層体 |
JP2007286487A (ja) * | 2006-04-19 | 2007-11-01 | Fujifilm Corp | 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板 |
JP4745146B2 (ja) * | 2006-06-22 | 2011-08-10 | 東京応化工業株式会社 | 着色感光性樹脂組成物 |
JP2008003299A (ja) * | 2006-06-22 | 2008-01-10 | Tokyo Ohka Kogyo Co Ltd | 着色感光性樹脂組成物 |
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WO2008059935A1 (fr) * | 2006-11-15 | 2008-05-22 | Taiyo Ink Mfg. Co., Ltd. | Composition de résine photodurcissable/thermodurcissable, produit durci et planche de câblage imprimé |
KR100961818B1 (ko) * | 2007-02-21 | 2010-06-08 | 주식회사 엘지화학 | 블랙 매트릭스용 감광성 수지 조성물, 이에 의해 형성되는블랙 매트릭스 및 이를 포함하는 액정표시소자 |
-
2008
- 2008-05-08 JP JP2009514138A patent/JP4985768B2/ja active Active
- 2008-05-08 CN CN2008800155325A patent/CN101681107B/zh active Active
- 2008-05-08 WO PCT/JP2008/058552 patent/WO2008140017A1/ja active Application Filing
- 2008-05-08 KR KR1020097021753A patent/KR101139543B1/ko active IP Right Grant
- 2008-05-09 TW TW097117346A patent/TWI398729B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006010793A (ja) * | 2004-06-23 | 2006-01-12 | Jsr Corp | 着色層形成用感放射線性組成物およびカラーフィルタ |
JP2006259150A (ja) * | 2005-03-16 | 2006-09-28 | Tamura Kaken Co Ltd | 感光性樹脂組成物およびプリント配線板 |
WO2006129697A1 (ja) * | 2005-05-31 | 2006-12-07 | Taiyo Ink Manufacturing Co., Ltd. | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
JP2007033467A (ja) * | 2005-06-22 | 2007-02-08 | Tokyo Ohka Kogyo Co Ltd | 感光性組成物およびブラックマトリクス |
JP2007072034A (ja) * | 2005-09-06 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | 感光性組成物 |
JP2008052069A (ja) * | 2006-08-25 | 2008-03-06 | Tokyo Ohka Kogyo Co Ltd | 着色感光性樹脂組成物 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010039475A (ja) * | 2008-06-10 | 2010-02-18 | Fujifilm Corp | 紫外光レーザー露光用感光性樹脂組成物、パターン形成方法、その方法を用いて製造したカラーフィルタ、カラーフィルタの製造方法および液晶表示装置 |
JP2010271708A (ja) * | 2009-04-21 | 2010-12-02 | Central Glass Co Ltd | トップコート組成物 |
JP2011034005A (ja) * | 2009-08-05 | 2011-02-17 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2012048202A (ja) * | 2010-07-30 | 2012-03-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法、プリント配線板の製造方法及びプリント配線板 |
JP2013047816A (ja) * | 2012-10-01 | 2013-03-07 | Taiyo Holdings Co Ltd | プリント配線板用光硬化性樹脂組成物 |
JP2018049220A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008140017A1 (ja) | 2010-08-05 |
KR20100009549A (ko) | 2010-01-27 |
TWI398729B (zh) | 2013-06-11 |
JP4985768B2 (ja) | 2012-07-25 |
CN101681107A (zh) | 2010-03-24 |
TW200910008A (en) | 2009-03-01 |
CN101681107B (zh) | 2012-12-26 |
KR101139543B1 (ko) | 2012-04-26 |
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