WO2010066494A3 - Anordnung zweier substrate mit einer slid-bondverbindung und verfahren zur herstellung einer solchen anordnung - Google Patents

Anordnung zweier substrate mit einer slid-bondverbindung und verfahren zur herstellung einer solchen anordnung Download PDF

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Publication number
WO2010066494A3
WO2010066494A3 PCT/EP2009/063675 EP2009063675W WO2010066494A3 WO 2010066494 A3 WO2010066494 A3 WO 2010066494A3 EP 2009063675 W EP2009063675 W EP 2009063675W WO 2010066494 A3 WO2010066494 A3 WO 2010066494A3
Authority
WO
WIPO (PCT)
Prior art keywords
arrangement
substrates
slid
bond
producing
Prior art date
Application number
PCT/EP2009/063675
Other languages
English (en)
French (fr)
Other versions
WO2010066494A2 (de
Inventor
Achim Trautmann
Ando Feyh
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to US13/133,521 priority Critical patent/US9111787B2/en
Priority to EP09740308A priority patent/EP2376369A2/de
Priority to CN2009801490683A priority patent/CN102245498A/zh
Publication of WO2010066494A2 publication Critical patent/WO2010066494A2/de
Publication of WO2010066494A3 publication Critical patent/WO2010066494A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Materials For Medical Uses (AREA)

Abstract

Es wird eine Anordnung (1) mit einem ersten (5) und einem zweiten Substrat (10) beschrieben, wobei die beiden Substrate (5, 10) mittels einer SLID (Solid-Liquid- Interdiffusion)-Bondverbindung (15) miteinander verbunden sind. Die SLID- Bondverbindung (15) weist ein erstes metallisches Material und ein zweites metallisches Material auf, wobei die SLID-Bondverbindung (15) die intermetallische Al/Sn-Phase (15c) umfasst. Weiter wird ein Verfahren zur Herstellung einer solchen Anordnung (1) vorgestellt.
PCT/EP2009/063675 2008-12-09 2009-10-19 Anordnung zweier substrate mit einer slid-bondverbindung und verfahren zur herstellung einer solchen anordnung WO2010066494A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/133,521 US9111787B2 (en) 2008-12-09 2009-10-19 Arrangement of two substrates having an SLID bond and method for producing such an arrangement
EP09740308A EP2376369A2 (de) 2008-12-09 2009-10-19 Anordnung zweier substrate mit einer slid-bondverbindung und verfahren zur herstellung einer solchen anordnung
CN2009801490683A CN102245498A (zh) 2008-12-09 2009-10-19 具有slid粘结连接的两个衬底的装置和用于制造这种装置的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810054415 DE102008054415A1 (de) 2008-12-09 2008-12-09 Anordnung zweier Substrate mit einer SLID-Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung
DE102008054415.9 2008-12-09

Publications (2)

Publication Number Publication Date
WO2010066494A2 WO2010066494A2 (de) 2010-06-17
WO2010066494A3 true WO2010066494A3 (de) 2011-03-10

Family

ID=42145303

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/063675 WO2010066494A2 (de) 2008-12-09 2009-10-19 Anordnung zweier substrate mit einer slid-bondverbindung und verfahren zur herstellung einer solchen anordnung

Country Status (5)

Country Link
US (1) US9111787B2 (de)
EP (1) EP2376369A2 (de)
CN (1) CN102245498A (de)
DE (1) DE102008054415A1 (de)
WO (1) WO2010066494A2 (de)

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CN102183335B (zh) 2011-03-15 2015-10-21 迈尔森电子（天津）有限公司 Mems压力传感器及其制作方法
JP5588419B2 (ja) 2011-10-26 2014-09-10 株式会社東芝 パッケージ
DE102012208031A1 (de) * 2012-05-14 2013-11-14 Robert Bosch Gmbh +Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung
DE102017204887B4 (de) 2017-03-23 2020-07-23 Deutsches Zentrum für Luft- und Raumfahrt e.V. Verfahren mit Nutzung eines Flüssigmetalls zur Fügung thermoelektrischer Module in einem SLID-Prozess und damit hergestellte Anordnung und Verwendung zur Fügung thermoelektrischer Module

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Also Published As

Publication number Publication date
CN102245498A (zh) 2011-11-16
EP2376369A2 (de) 2011-10-19
US9111787B2 (en) 2015-08-18
DE102008054415A1 (de) 2010-06-10
US20110233750A1 (en) 2011-09-29
WO2010066494A2 (de) 2010-06-17

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