WO2010063194A1 - 多层混压印刷电路板及其制造方法、装置 - Google Patents

多层混压印刷电路板及其制造方法、装置 Download PDF

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Publication number
WO2010063194A1
WO2010063194A1 PCT/CN2009/074099 CN2009074099W WO2010063194A1 WO 2010063194 A1 WO2010063194 A1 WO 2010063194A1 CN 2009074099 W CN2009074099 W CN 2009074099W WO 2010063194 A1 WO2010063194 A1 WO 2010063194A1
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WO
WIPO (PCT)
Prior art keywords
type
printed circuit
circuit board
layers
layer
Prior art date
Application number
PCT/CN2009/074099
Other languages
English (en)
French (fr)
Inventor
唐瑞波
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2010063194A1 publication Critical patent/WO2010063194A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Definitions

  • the present invention relates to the field of printed circuit board manufacturing, and in particular to a multilayer hybrid printed circuit board, a method of manufacturing the same, and an apparatus.
  • PCB printed circuit board
  • a printed circuit board (PCB) used in a ⁇ ⁇ radio frequency in the prior art uses a common board, such as an FR-4 board.
  • the advantages of such a board are relatively low cost, and the disadvantage is that high frequency characteristics are compared. Poor, can only be used around 3GHz.
  • a kind of plate with better high frequency performance such as Rogres plate, is used.
  • the advantage of this type of plate is that the high frequency characteristics are better and the loss is small.
  • FIG. 1 is a side view of the mixed-pressure sheet, in which: the bottom layer is made of ordinary sheet material (such as FR-4 sheet), and the top layer is made of high-frequency material (such as Rogers sheet).
  • the advantage of this type of mixed-plate is that the high-frequency performance is better.
  • the present invention is directed to a multilayer hybrid printed circuit board, a method of manufacturing the same, and an apparatus, which are capable of solving the problem of high cost of a printed circuit board in the prior art.
  • a multi-layer hybrid printed circuit board for achieving the effect of a laminated board, the printed circuit board comprising: at least one layer at the top, wherein each The layers are respectively formed by splicing at least one of the first type of sheets, and at least one of the second type of sheets; the other layers below the top portion are composed of at least one of the first type of sheets; The top and bottom layers are joined by lamination and pressure mixing.
  • the high frequency characteristics of the second type of sheet material are superior to the first type of sheet material.
  • the first type of sheet material is used for a 3 GHz high frequency.
  • the first type of sheet material comprises FR-1, FR-2, FR-3, FR-4 sheet, glass fiber, epoxy glass cloth copper sheet; and/or, the second type of sheet material comprises Rogers Rogres Plate, alumina sheet, ceramic plate.
  • the difference in expansion coefficient 'J between the different sheets spliced to form each of the top layers is at a first threshold.
  • the multi-layer hybrid printed circuit board further comprises: a prepreg, a gap filled between different plates of each of the top layers.
  • the fluidity parameter of the prepreg is greater than a second threshold.
  • the slit has a width of 5 mil ⁇ 5 mils.
  • a method of manufacturing a multilayer mixed-pressure printed circuit board for achieving the effect of a mixed-pressure board comprising: at least one of the first type of sheets Laying the layers of the sheet material to form a substrate; respectively splicing at least one of the first type of sheets and at least one of the second type of sheets to form each of the at least one of the top layers And stacking the top layers on the substrate; and bonding the layers of the substrate and the top layer in a mixed manner.
  • the method further comprises: distributing signal lines at each layer of the substrate.
  • a manufacturing apparatus of a multilayer hybrid printed circuit board for achieving the effect of a mixed-pressure board, the apparatus comprising: at least one of the first type of sheets to be Forming layers of the sheet material to form a first unit of the substrate; Separating at least one of the first type of sheets and at least one of the second types of sheets to form at least one of the top layers, and stacking the top layers on the substrate a second unit above; a third unit that joins the substrate and the top layer in a mixed manner.
  • the method further comprises: distributing a third unit of the signal line at each layer of the substrate.
  • the multi-layer hybrid printed circuit board in the embodiment of the present invention is different from the mixed-voltage circuit board in the prior art, and achieves the effect of the mixed-pressure board, and includes: at least one layer located at the top, wherein each layer is first At least one sheet of the sheet material is formed by splicing with at least one of the second type of sheets; the other layers below the top portion are composed of at least one of the first type of sheets; the top and the top The following layers are joined by lamination and pressure mixing.
  • the multilayer hybrid printed circuit board of the embodiment of the invention can achieve better high frequency performance, and, since each layer in the top layer only In part, a second type of plate material with better high frequency characteristics is used, so that the manufacturing process of the multilayer mixed pressure printed circuit board is obtained in comparison with the prior art method in which the top layer and the whole layer are all made of high frequency performance.
  • the advancement has greatly reduced the cost of multi-layer hybrid printed circuit boards.
  • the filling of the prepreg between the different sheets of each layer in the top also improves the quality of the multilayer hybrid printed circuit board.
  • FIG. 1 is a side view of a mixed board in the background art
  • FIG. 2 is a side view of a multilayer mixed printed circuit board according to an embodiment of the present invention
  • FIG. 3 is a multilayer mixed-pressure printed circuit according to an embodiment of the present invention
  • 4 is a top view of a method for manufacturing a multilayer hybrid printed circuit board according to an embodiment of the present invention
  • FIG. 1 is a side view of a mixed board in the background art
  • FIG. 2 is a side view of a multilayer mixed printed circuit board according to an embodiment of the present invention
  • FIG. 3 is a multilayer mixed-pressure printed circuit according to an embodiment of the present invention
  • 4 is a top view of a method for manufacturing a multilayer hybrid printed circuit board according to an embodiment of the present invention
  • FIG. 5 is a structural view of a manufacturing apparatus for a multilayer mixed printed circuit board according to an embodiment of the present invention.
  • BEST MODE FOR CARRYING OUT THE INVENTION the present invention will be described in detail with reference to the accompanying drawings in conjunction with the embodiments. Since in general, only a small portion of the radio frequency portion of the printed circuit board is used, or where the strict requirements on the board are small, the inventors consider that only a partial stack is performed on a printed circuit board. By mixing, a printed circuit board structure of a multi-media laminate that achieves both high frequency characteristics and reduced cost is formed.
  • the multi-layer hybrid printed circuit board in the embodiment of the present invention comprises: at least one layer located at the top, wherein each layer is respectively spliced by at least one of the first type of plates and at least one of the second type of plates Forming; the other layers below the top portion are composed of at least one of the first type of sheet materials; and the top and bottom layers are joined together by lamination and pressure mixing.
  • the top portion may have only one layer, that is, in the multilayer printed circuit board, only the top layer is spliced with at least one of the first type of sheets, and at least one of the second type of sheets. The construction is carried out in a manner other than the top layer using at least one of the first type of sheets.
  • the top portion may also have two layers, three layers, and the like.
  • the two layers are constructed in the manner of the foregoing splicing, and the layers other than the two layers are still At least one of the first type of sheets is used.
  • the high frequency characteristics of the second type of sheet material may be superior to the first type of sheet material.
  • the first type of sheet can be ordinary sheet, the cost is lower, but the high frequency performance is poor, and only about 3 GHz can be used; the second type of sheet can be a kind of sheet with high frequency performance and high frequency characteristics. Better, less loss, but higher cost.
  • the second type of plate can ensure better high frequency performance, and because the high frequency performance is better, the second type of plate only occupies a part of each layer in the top, and can also reduce more The manufacturing cost of a layer mixed printed circuit board.
  • the implementation does not exclude the case where the high-frequency characteristics of the second type of sheet material are inferior to those of the first type of sheet material.
  • the multilayer mixed-pressure printed circuit board in which each layer of the top layer is spliced by different sheets has been provided in the embodiment of the present invention. Different from the prior art mixed-voltage circuit board, the effect of the mixed-pressure board can be achieved.
  • the second type of sheet can also be determined according to the special requirements of the user.
  • the first type of sheet may include FR-1, FR-2, FR-3, FR-4 sheet, glass fiber, epoxy glass cloth copper sheet; and/or, the second type of sheet may include Rogers Rogres sheet, Alumina sheet, ceramic sheet.
  • FIG. 3 are a specific example of a multi-layer hybrid printed circuit board according to an embodiment of the present invention. In this specific example, there is only one layer at the top, that is, only the top layer is at least one of the first type of boards. The sheet is spliced with at least one of the second type of sheets. 2 is a side view of the multilayer hybrid printed circuit board, and FIG. 3 is a plan view of the multilayer hybrid printed circuit board.
  • the FR-4 sheet or other common sheet forms the other layers below the top layer; the FR-4 sheet (or other common sheet) is spliced with the Rogres (or other high frequency sheet) to form the top layer.
  • FR-4 sheet or other common sheet is generally a multi-layer structure; Rogres or other high-frequency sheet is a single layer structure.
  • Rogres can be used as a cured or prepreg.
  • the Rogers and FR4 bonds can be mixed by the prepreg.
  • portions of each layer in the top are typically required to be pressed to the same thickness.
  • the Rogres sheet can only occupy a part of the entire top layer, which not only achieves better high frequency performance, but also can greatly reduce the cost of the multilayer mixed printed circuit board.
  • the other layers below the top may be referred to as the substrate, the material portion of the substrate is used at a lower frequency, and the portion with better performance is spliced to the top at a higher frequency or a portion having special requirements for the sheet.
  • the first type of plate and the second type of plate used in the entire multi-layer mixed printed circuit board may be one or more, that is, each layer in the top may use only one of the first type of plates.
  • the splicing may be performed on one of the second type of plates, or may be formed by arranging a plurality of plates in the first type of plates and a plurality of plates in the second type of plates.
  • the first type of sheet used in each of the top layers and the first type of sheets used in the other layers below the top may also be the same or different sheets.
  • the fluidity parameter of the prepreg must be greater than the second threshold.
  • the width of the slit should not be too wide, preferably 5 mil ⁇ 5 mil.
  • the wiring is required, it may be considered to be connected through other layers below the top layer, that is, the substrate. It can be said that the multilayer hybrid printed circuit board of the embodiment of the present invention is formed by mixing a substrate, a prepreg, and a top plate (which may be two or more types). As shown in FIG.
  • an embodiment of the present invention further provides a method for manufacturing a multilayer hybrid printed circuit board, the method comprising: step 401, at least one of the first type of boards Forming each layer of the sheet material to form a substrate; Step 402, respectively splicing at least one of the first type of sheet material and at least one of the second type of sheet material to form at least one of the top layers a layer, and each of the top layers is laminated on the substrate; Step 403, the layers of the substrate and the top are joined by a pressure.
  • the above method may further comprise the step of: distributing signal lines at each layer of the bottom. As shown in FIG.
  • an embodiment of the present invention further provides a manufacturing apparatus for a multilayer hybrid printed circuit board, the apparatus comprising: performing layers of at least one of the first type of boards Laminating, forming a first unit 501 of the substrate; respectively splicing at least one of the first type of sheet material and at least one of the second type of sheet material to form each of the at least one layer of the top layer, and a second unit 502 in which the top layers are each laminated on the substrate; and a third unit 503 in which the respective layers of the substrate and the top are joined by a pressure.
  • the apparatus may further include: a fourth unit that distributes signal lines at each layer of the substrate.
  • the multi-layer hybrid printed circuit board in the embodiment of the present invention is different from the mixed-voltage circuit board in the prior art, and achieves the effect of the mixed-pressure board, and includes: at least one layer located at the top, wherein each layer is first At least one sheet of the sheet material is formed by splicing with at least one of the second type of sheets; the other layers below the top portion are composed of at least one of the first type of sheets; the top and the top The following layers are joined by lamination and pressure mixing.
  • the multilayer hybrid printed circuit board of the embodiment of the invention can achieve better high frequency performance, and, since each layer in the top layer only In part, a second type of plate material with better high frequency characteristics is used, so that the manufacturing process of the multilayer mixed pressure printed circuit board is obtained in comparison with the prior art method in which the top layer and the whole layer are all made of high frequency performance.
  • the advancement has greatly reduced the cost of multi-layer hybrid printed circuit boards.
  • the filling of the prepreg between the different sheets of each layer in the top also improves the quality of the multilayer hybrid printed circuit board.
  • modules or steps of the present invention can be implemented by a general-purpose computing device, which can be concentrated on a single computing device or distributed over a network composed of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device, such that they may be stored in the storage device by the computing device, or they may be separately fabricated into individual integrated circuit modules, or they may be Multiple modules or steps are made into a single integrated circuit module.
  • the invention is not limited to any specific combination of hardware and software.
  • the above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the scope of the present invention are intended to be included within the scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Description

多层混压印刷电路板及其制造方法、 装置
技术领域 本发明涉及印刷电路板制造领域，尤其涉及一种多层混压印刷电路板及 其制造方法、 装置。 背景技术 现有技术中一 δΐ射频上用的一类印刷电路板 ( Printed Circuit Board, PCB )采用普通板材， 如 FR-4板材， 这类板材的优点是成本比较低， 缺点是 高频特性比较差， 只能用到 3GHz左右。 在更高的频段上或是功放上用的板 材需采用高频性能比较好的一类板材， 如罗杰斯 （Rogres ) 板材， 这类板材 的优点是高频特性比较好， 损耗较小， 缺点是成本比较高。 随着通信技术的发展， 人们对射频通讯系统的要求日益严格， 对数模混 合大板（数字和射频在同一块单板上） 的需求也越来越多， 为了提高射频单 板的性能， 降低生产成本， 印刷电路板制造业界进而普遍使用一种混合的板 材， 这种混合板材通过 ^！夺一种板材与另一种板材进行层叠、 混压而形成多层 板结构。 图 1为这种混压板材的侧视图， 一^:在这种多层板结构中， 底层采 用普通板材（如 FR-4板材）， 顶层采用高频性能比较好的板材（如罗杰斯板 材）， 这种混压板材的优点是高频性能比较好， 但是， 由于顶层一整层均采用 高频性能比较好的板材， 因而也存在缺点： 成本仍然偏高。 发明内容 本发明旨在提供一种多层混压印刷电路板及其制造方法、 装置， 能够解 决现有技术中印刷电路板成本较高的问题。 为了实现上述目的 , 才艮据本发明的一个方面， 提供了一种多层混压印刷 电路板， 用以达到混压板材的效果， 该印刷电路板包括： 位于顶部的至少一层， 其中各层分别由第一类板材中的至少一种板材、 与第二类板材中的至少一种板材拼接形成； 所述顶部以下的其它各层 , 由第一类板材中的至少一种板材构成； 所述顶部及顶部以下的各层之间以叠层、 混压的方式相接合。 较佳的 , 所述第二类板材的高频特性优于所述第一类板材。 较佳的， 所述第一类板材用于 3GHz高频。 较佳的， 所述第一类板材包括 FR-1、 FR-2、 FR-3、 FR-4板材、 玻璃纤 维、 环氧玻璃布敷铜板； 和 /或， 所述第二类板材包括罗杰斯 Rogres板材、 氧化铝板材、 陶瓷板材。 较佳的，拼接形成所述顶部中每一层的不同板材之间的膨胀系数差值 'J、 于第一阈值。 较佳的 , 所述多层混压印刷电路板还包括： 半固化片， 填充于所述顶部中每一层的不同板材之间的缝隙。 较佳的， 所述半固化片的流性参数大于第二阈值。 较佳的， 所述缝隙的宽度为 5mil ± 5mil。 为了实现上述目的 , 根据本发明的一个方面， 还提供了一种多层混压印 刷电路板的制造方法 , 用以达到混压板材的效果， 该方法包括： 将由第一类板材中的至少一种板材构成的各层进行叠层， 形成基板； 分别将第一类板材中的至少一种板材、与第二类板材中的至少一种板材 进行拼接， 形成顶部至少一层中的每一层， 并将所述顶部各层叠层于所述基 板之上； 将所述基板及顶部的各层以混压的方式进行接合。 较佳的， 该方法还包括： 在所述基板的各层分布信号线。 为了实现上述目的 , 根据本发明的一个方面， 还提供了一种多层混压印 刷电路板的制造装置， 用以达到混压板材的效果， 该装置包括： 将由第一类板材中的至少一种板材构成的各层进行叠层，形成基板的第 一单元； 分别将第一类板材中的至少一种板材、与第二类板材中的至少一种板材 进行拼接， 形成顶部至少一层中的每一层， 并将所述顶部各层叠层于所述基 板之上的第二单元； 将所述基板及顶部的各层以混压的方式进行接合的第三单元。 较佳的， 该方法还包括： 在所述基板的各层分布信号线的第三单元。 本发明实施例中的多层混压印刷电路板有别于现有技术中的混压电路 板， 达到了混压板材的效果， 其包括： 位于顶部的至少一层， 其中各层由第 一类板材中的至少一种板材、 与第二类板材中的至少一种板材拼接形成； 所 述顶部以下的其它各层， 由第一类板材中的至少一种板材构成； 所述顶部及 顶部以下的各层之间以叠层、 混压的方式相接合。 进一步的， 当第二类板材 的高频特性优于第一类板材时 , 本发明实施例的多层混压印刷电路板可以达 到较好的高频性能， 并且， 由于顶部中每一层仅部分采用高频特性较好的第 二类板材， 因而相对于现有技术中顶层一整层均采用高频性能比较好的板材 的技术方案而言， 取得了多层混压印刷电路板制造工艺上的进步， 大幅降低 了多层混压印刷电路板的成本。 另外， 在顶部中每一层的不同板材之间的缝 隙填充半固化片 , 也提高了多层混压印刷电路板的质量。 附图说明 此处所说明的附图用来提供对本发明的进一步理解 ,构成本申请的一部 分， 本发明的示意性实施例及其说明用于解释本发明， 并不构成对本发明的 不当限定。 在附图中： 图 1为背景技术中混合板材的侧视图； 图 2为本发明实施例中多层混压印刷电路板的侧视图； 图 3为本发明实施例中多层混压印刷电路板的俯视图； 图 4为本发明实施例中多层混压印刷电路板的制造方法流程图； 图 5为本发明实施例中多层混压印刷电路板的制造装置结构图。 具体实施方式 下面将参考附图并结合实施例 , 来详细说明本发明。 由于一般而言印刷电路板上的射频部分只需用到很小的一部分，或者说 对板材要求比较严格的地方是很小的 , 因而发明人考虑在一块印刷电路板上 只进行部分叠层、 混压， 形成既能实现好的高频特性又能降低成本的多介质 叠层的印刷电路板结构。 本发明实施例中的多层混压印刷电路板包括： 位于顶部的至少一层， 其中各层分别由第一类板材中的至少一种板材、 与第二类板材中的至少一种板材拼接形成； 所述顶部以下的其它各层， 由第一类板材中的至少一种板材构成； 所述顶部及顶部以下的各层之间以叠层、 混压的方式相接合。 一个实施例中， 所述顶部可以仅有一层， 即在多层印刷电路板中， 仅将 顶层采用第一类板材中的至少一种板材、 与第二类板材中的至少一种板材进 行拼接的方式进行构造， 而除顶层之外的其它各层采用第一类板材中的至少 一种板材。 当然， 实施中， 所述顶部也可以有两层、 三层等情况， 例如所述 顶部有两层时， 该两层按前述拼接的方式进行构造， 而该两层之外的其它各 层仍采用第一类板材中的至少一种板材。 一个实施例中，第二类板材的高频特性可以优于所述第一类板材。例如， 第一类板材可以是普通板材， 其成本较低， 但高频性能较差， 只能用到 3GHz 左右； 第二类板材可以是高频性能比较好的一类板材， 其高频特性较好、 损 耗较小， 但成本较高。 这样， 将第一类板材与第二类板材混压， 可以保证较 好的高频性能 , 并且由于高频性能比较好的第二类板材只占顶部中每一层的 一部分， 还可以降低多层混压印刷电路板的制造成本。 当然， 实施中并不排 除第二类板材的高频特性劣于第一类板材的情况 , 本发明实施例所提供的顶 部中每一层由不同板材进行拼接的多层混压印刷电路板已不同于现有技术的 混压电路板， 已经可以达到混压板材的效果。 另外， 除考虑高频特性以外， 第二类板材也可以按用户的特殊要求进行确定。 实施中， 第一类板材可以包括 FR-1、 FR-2、 FR-3、 FR-4板材、 玻璃纤 维、 环氧玻璃布敷铜板； 和 /或， 第二类板材可以包括罗杰斯 Rogres板材、 氧化铝板材、 陶瓷板材。 图 2、 图 3为本发明实施例所述的多层混压印刷电 路板的一个具体实例， 在该具体实例中， 顶部只有一层， 即仅有顶层由第一 类板材中的至少一种板材、 与第二类板材中的至少一种板材进行拼接。 其中 图 2为该多层混压印刷电路板的侧视图 , 图 3为该多层混压印刷电路板的俯 视图。从图 2可以看到 , FR-4板材或其它普通板材构成顶层以下的其它各层； FR-4板材（或其它普通板材） 与 Rogres (或其它高频板材） 拼接形成顶层。 实施中， 在一层中， FR-4板材或其它普通板材一般为多层结构； Rogres或其 它高频板材一 为单层结构。 Rogres可以采用固化片或半固化片。 层与层之 间进行混压时 , Rogers和 FR4粘结可以通过半固化片来混压。另外在混压时 , 顶部中每一层的各部分一般要求压至相同的厚度。 另夕卜， 从图 3可以看到， Rogres板材可以仅占整个顶层的一' j、部分， 这样不仅可以达到较好的高频性 能， 而且可以大幅降低多层混压印刷电路板的成本。 实施中可将顶部以下的其它各层称为基板 ,基板的材料部分用在较低的 频率 , 在较高的频率或是对板材有特殊要求的部分采用性能比较好的板材部 分拼接于顶部的各层。 实施中， 整个多层混压印刷电路板中使用的第一类板材、 第二类板材可 以是一种或多种， 即顶部中的每一层可以仅采用第一类板材中的一种板材与 第二类板材中的一种板材进行拼接 , 也可以采用第一类板材中的多种板材、 第二类板材中的多种板材相互拼接而成。 另外， 顶部中的每一层采用的第一 类板材与顶部以下其它各层采用的第一类板材也可以是相同或不同的板材。 为了达到很好的混压效果还需要考虑到板材的膨胀系数，因此拼接形成 顶部中每一层的不同板材之间的膨胀系数差值需小于第一阈值， 最好是膨胀 系数比较接近。 另夕卜， 在制造多层混压印刷电路板时， 需要在压板排板过程中一层一层 的进行叠层、 混压， 由于现有技术中每层采用相同的板材所以不会出现缝隙， 而本发明实施例中由于顶部中的每一层采用了不同板材进行拼接， 因而在不 同板材之间可能出现缝隙， 这个的缝隙在混压的时候可以考虑让半固化片流 到这个缝隙里面进行填充， 以提高多层混压印刷电路板的质量。 图 2中也示 出了填充于不同板材之间的半固化片的位置， 叠层时半固化片熔化时会有一 部分流到缝隙之中。 为了达到很好填充的效果，半固化片的要用流性流性参数需大于第二阈 值， 即流性要大一点的， 以保证将缝隙充满。 另夕卜， 缝隙的宽度也不能太宽， 以 5mil ± 5 mil为佳。 另夕卜， 实施中跨材料的间隙的地方不宜走线， 如需要走线可以考虑通过 顶层以下的其它各层， 即基板来相连。 可以说， 本发明实施例的多层混压印刷电路板是基板、 半固化片、 顶部 的板材 （可以是两种或多种） 混压而成的。 如图 4所示， 基于同一发明构思， 本发明实施例还提供一种多层混压印 刷电路板的制造方法， 该方法 ¾ u程包括： 步骤 401、 将由第一类板材中的至少一种板材构成的各层进行叠层， 形 成基板； 步骤 402、 分别将第一类板材中的至少一种板材、 与第二类板材中的至 少一种板材进行拼接， 形成顶部至少一层中的每一层， 并将所述顶部各层叠 层于所述基板之上； 步骤 403、 将所述基板及顶部的各层以混压的方式进行接合。 —个实施例中， 上述方法还可以包括如下步骤： 在所述底部的各层分布信号线。 如图 5所示， 基于同一发明构思， 本发明实施例还提供一种多层混压印 刷电路板的制造装置， 该装置包括： 将由第一类板材中的至少一种板材构成的各层进行叠层，形成基板的第 一单元 501 ; 分别将第一类板材中的至少一种板材、与第二类板材中的至少一种板材 进行拼接， 形成顶部至少一层中的每一层， 并将所述顶部各层叠层于所述基 板之上的第二单元 502; 将所述基板及顶部的各层以混压的方式进行接合的第三单元 503。
一个实施例中， 上述装置还可以包括： 在所述基板的各层分布信号线的第四单元。 本发明实施例中的多层混压印刷电路板有别于现有技术中的混压电路 板， 达到了混压板材的效果， 其包括： 位于顶部的至少一层， 其中各层由第 一类板材中的至少一种板材、 与第二类板材中的至少一种板材拼接形成； 所 述顶部以下的其它各层， 由第一类板材中的至少一种板材构成； 所述顶部及 顶部以下的各层之间以叠层、 混压的方式相接合。 进一步的， 当第二类板材 的高频特性优于第一类板材时 , 本发明实施例的多层混压印刷电路板可以达 到较好的高频性能， 并且， 由于顶部中每一层仅部分采用高频特性较好的第 二类板材， 因而相对于现有技术中顶层一整层均采用高频性能比较好的板材 的技术方案而言， 取得了多层混压印刷电路板制造工艺上的进步， 大幅降低 了多层混压印刷电路板的成本。 另外， 在顶部中每一层的不同板材之间的缝 隙填充半固化片 , 也提高了多层混压印刷电路板的质量。 显然， 本领域的技术人员应该明白， 上述的本发明的各模块或各步骤可 以用通用的计算装置来实现， 它们可以集中在单个的计算装置上， 或者分布 在多个计算装置所组成的网络上， 可选地， 它们可以用计算装置可执行的程 序代码来实现， 从而， 可以将它们存储在存储装置中由计算装置来执行， 或 者将它们分别制作成各个集成电路模块， 或者将它们中的多个模块或步骤制 作成单个集成电路模块来实现。 这样， 本发明不限制于任何特定的硬件和软 件结合。 以上所述仅为本发明的优选实施例而已， 并不用于限制本发明， 对于本 领域的技术人员来说， 本发明可以有各种更改和变化。 凡在本发明的 4青申和 原则之内， 所作的任何修改、 等同替换、 改进等， 均应包含在本发明的保护 范围之内。

Claims

权 利 要 求 书
1. 一种多层混压印刷电路板， 其特征在于， 包括: 位于顶部的至少一层 , 其中各层分别由第一类板材中的至少一种 板材、 与第二类板材中的至少一种板材拼接形成；
所述顶部以下的其它各层， 由第一类板材中的至少一种板材构 成；
所述顶部及顶部以下的各层之间以叠层、 混压的方式相接合。
2. 如权利要求 1所述的多层混压印刷电路板， 其特征在于， 所述第二类板 材的高频特性优于所述第一类板材。
3. 如权利要求 2所述的多层混压印刷电路板 , 其特征在于 , 所述第一类板 材用于 3GHz高频。
4. 如权利要求 2所述的多层混压印刷电路板 , 其特征在于 , 所述第一类板 材包括 FR-1、 FR-2、 FR-3、 FR-4板材、 玻璃纤维、 环氧玻璃布敷铜板； 和 /或， 所述第二类板材包括罗杰斯 Rogres 板材、 氧化铝板材、 陶瓷板 材。
5. 如权利要求 1所述的多层混压印刷电路板 , 其特征在于 , 拼接形成所述 顶部中每一层的不同板材之间的膨胀系数差值小于第一阈值。
6. 如权利要求 1至 5中任一项所述的多层混压印刷电路板， 其特征在于， 还包括： 半固化片， 填充于所述顶部中每一层的不同板材之间的缝隙。
7. 如权利要求 6所述的多层混压印刷电路板， 其特征在于， 所述半固化片 的流性参数大于第二阈值。
8. 如权利要求 6所述的多层混压印刷电路板， 其特征在于， 所述缝隙的宽 度为 5mil士 5mil。
9. 一种多层混压印刷电路板的制造方法， 其特征在于， 该方法包括： 将由第一类板材中的至少一种板材构成的各层进行叠层， 形成基 板；
分别将第一类板材中的至少一种板材、 与第二类板材中的至少一 种板材进行拼接， 形成顶部至少一层中的每一层， 并将所述顶部各层 叠层于所述基板之上；
将所述底部及所述顶部的各层以混压的方式进行接合。
10. 如权利要求 9所述的方法， 其特征在于， 还包括： 在所述基板的各层分布信号线。
11. 一种多层混压印刷电路板的制造装置， 其特征在于， 该装置包括： 将由第一类板材中的至少一种板材构成的各层进行叠层， 形成基 板的第一单元；
分别将所述第一类板材中的至少一种板材、 与第二类板材中的至 少一种板材进行拼接 , 形成顶部至少一层中的每一层 , 并将所述顶部 各层叠层于所述基板之上的第二单元；
将所述基板及所述顶部的各层以混压的方式进行接合的第三单 元。
12. 如权利要求 11所述的装置， 其特征在于， 还包括： 在所述底部的各层分布信号线的第四单元。
PCT/CN2009/074099 2008-12-01 2009-09-22 多层混压印刷电路板及其制造方法、装置 WO2010063194A1 (zh)

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