WO2010059683A2 - Durcisseurs pour résines époxydes - Google Patents

Durcisseurs pour résines époxydes Download PDF

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Publication number
WO2010059683A2
WO2010059683A2 PCT/US2009/064929 US2009064929W WO2010059683A2 WO 2010059683 A2 WO2010059683 A2 WO 2010059683A2 US 2009064929 W US2009064929 W US 2009064929W WO 2010059683 A2 WO2010059683 A2 WO 2010059683A2
Authority
WO
WIPO (PCT)
Prior art keywords
group
independently
epoxy
substituted
hydrocarbylene
Prior art date
Application number
PCT/US2009/064929
Other languages
English (en)
Other versions
WO2010059683A3 (fr
Inventor
Pukun Zhu
Puwei Liu
Original Assignee
Henkel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corporation filed Critical Henkel Corporation
Priority to CN2009801465643A priority Critical patent/CN102224199B/zh
Priority to EP09828141.3A priority patent/EP2358813B1/fr
Priority to KR1020117013605A priority patent/KR101761423B1/ko
Priority to JP2011537571A priority patent/JP5685545B2/ja
Publication of WO2010059683A2 publication Critical patent/WO2010059683A2/fr
Publication of WO2010059683A3 publication Critical patent/WO2010059683A3/fr
Priority to US13/106,924 priority patent/US8278396B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • R is a monovalent or polyvalent radical, which includes hydrocarbyl, heteroatom-containing hydrocarbyl, substituted heteroatom-containing hydrocarbyl, hydrocarbylene, substituted hydrocarbylene, heteroatom-containing hydrocarbylene, substituted heteroatom-containing hydrocarbylene, polysiloxanes, polysiloxane-polyurethane block copolymers, and combinations of any of the above linked with one or more linking groups selected from the group consisting of a covalent bond, —O-, -S-, — NR 3 - , — O— C(O)- , — O— C(O)-O-, -0-C(O)-NR 3 -, — NR 3 - C(O) — , — NR 3 - C(O) — NR 3 - ,
  • R 1 and R 2 independently are selected from the group consisting of — R, — H, -CH 3 , -OCH 3 , — O(CH 2 ) n CH 3 , -(CH 2 J n f 3 in which n is a numeral from 1 to 20 and f 3 is a hydrocarbyl group containing at least one carbon to carbon unsaturated bond (e.g. a vinyl group, and allyl group, an aryl
  • n is a numeral from 1 to 20, preferably 1 to 10, and f 3 is a hydrocarbyl group containing at least one vinyl functionality;

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne un durcisseur pour résine époxyde qui comporte un ou plusieurs noyaux aromatiques à cinq ou six chaînons, et comme substituants de ces noyaux aromatiques, au moins deux fonctionnalités réactives avec l'époxyde choisies dans le groupe constitué par l’hydroxyle, les amines, les imidazoles, les azines, les hydrazides, les anhydrides et les acides de Lewis. Le choix des fonctionnalités peut aboutir à un réseau polymère mixte, avec une structure polymère à réticulation plus dense ayant une Tg élevée, et une autre structure polymère plus linéaire qui contribue à la réduction des contraintes.
PCT/US2009/064929 2008-11-20 2009-11-18 Durcisseurs pour résines époxydes WO2010059683A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2009801465643A CN102224199B (zh) 2008-11-20 2009-11-18 用于环氧树脂的固化剂
EP09828141.3A EP2358813B1 (fr) 2008-11-20 2009-11-18 Durcisseurs pour résines époxydes
KR1020117013605A KR101761423B1 (ko) 2008-11-20 2009-11-18 에폭시 수지용 경화제
JP2011537571A JP5685545B2 (ja) 2008-11-20 2009-11-18 エポキシ樹脂用の硬化剤
US13/106,924 US8278396B2 (en) 2008-11-20 2011-05-13 Curing agents for epoxy resins

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11632808P 2008-11-20 2008-11-20
US61/116,328 2008-11-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/106,924 Continuation US8278396B2 (en) 2008-11-20 2011-05-13 Curing agents for epoxy resins

Publications (2)

Publication Number Publication Date
WO2010059683A2 true WO2010059683A2 (fr) 2010-05-27
WO2010059683A3 WO2010059683A3 (fr) 2010-08-19

Family

ID=42198779

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/064929 WO2010059683A2 (fr) 2008-11-20 2009-11-18 Durcisseurs pour résines époxydes

Country Status (7)

Country Link
US (1) US8278396B2 (fr)
EP (1) EP2358813B1 (fr)
JP (1) JP5685545B2 (fr)
KR (1) KR101761423B1 (fr)
CN (1) CN102224199B (fr)
TW (1) TWI488881B (fr)
WO (1) WO2010059683A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013124265A (ja) * 2011-12-13 2013-06-24 Nippon Synthetic Chem Ind Co Ltd:The エポキシ樹脂用硬化剤

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101374365B1 (ko) * 2010-12-27 2014-03-17 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
WO2016080202A1 (fr) * 2014-11-17 2016-05-26 東レ株式会社 Composition de résine époxyde, préimprégné, objet de résine durcie, et matériau composite renforcé par des fibres
JP2017082052A (ja) * 2015-10-26 2017-05-18 住友ベークライト株式会社 エポキシ樹脂組成物、及びこれを用いた半導体装置
US10450406B2 (en) * 2017-08-30 2019-10-22 Saudi Arabian Oil Company Fluorinated polyimide-based epoxy materials
EP3476885B1 (fr) * 2017-10-31 2020-06-17 Borealis AG Composition de polymère d'éthylène réticulable comprenant des groupes époxy et un agent de réticulation
JP6489274B1 (ja) * 2018-08-10 2019-03-27 千住金属工業株式会社 フラックス組成物、はんだペースト、はんだ接合部及びはんだ接合方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395105A (en) * 1964-10-06 1968-07-30 Mc Donnell Douglas Corp Epoxy systems containing encapsulated pressure fracturable curing agents
US3598765A (en) * 1967-05-04 1971-08-10 Gen Tire And Rubber Co The Process for polymerizing cyclic oxides with a catalyst consisting of an organozinc compound and another material
DE2152237A1 (de) * 1971-04-08 1972-10-19 Veba Chemie Ag Verfahren zur Herstellung von Polyaddukten
CA1082229A (fr) * 1975-03-17 1980-07-22 Robert A. Gardiner Catalyseur de durcissement de resines d'epoxyde et de polyaminophenol
CH621539A5 (fr) * 1976-12-14 1981-02-13 Ciba Geigy Ag
JPS5991117A (ja) * 1982-10-12 1984-05-25 チバ−ガイギ−・アクチエンゲゼルシヤフト 熱硬化性エポキシ樹脂組成物
CN87101669A (zh) * 1987-02-27 1988-09-07 项新 环氧树脂增韧性固化剂
JP2803055B2 (ja) * 1989-12-04 1998-09-24 東芝ケミカル株式会社 成形用耐熱性樹脂組成物
JPH03271250A (ja) * 1990-03-22 1991-12-03 Teijin Ltd 新規ヒドロキシカルボン酸誘導体及びその製法
US5591811A (en) * 1995-09-12 1997-01-07 Ciba-Geigy Corporation 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins
JP3630487B2 (ja) * 1995-12-19 2005-03-16 旭化成ケミカルズ株式会社 水性樹脂分散体組成物
JPH10265549A (ja) * 1997-03-27 1998-10-06 Toray Ind Inc エポキシ樹脂組成物および半導体装置
JP2000038439A (ja) * 1998-07-23 2000-02-08 Dainippon Ink & Chem Inc エポキシ樹脂組成物
JP3727591B2 (ja) * 2000-05-16 2005-12-14 サンスター技研株式会社 熱硬化性組成物
US20040147711A1 (en) * 2003-01-23 2004-07-29 Christiansen Walter H. Epoxy resin compositions, methods of preparing, and articles made therefrom
JP2006137822A (ja) * 2004-11-11 2006-06-01 Idemitsu Kosan Co Ltd エポキシ樹脂用硬化剤
JP2007056152A (ja) * 2005-08-25 2007-03-08 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びその硬化物
CN1958719A (zh) * 2006-11-30 2007-05-09 复旦大学 席夫碱型液晶环氧树脂及其制备方法和应用
JP2009084360A (ja) * 2007-09-28 2009-04-23 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物及び半導体装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None
See also references of EP2358813A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013124265A (ja) * 2011-12-13 2013-06-24 Nippon Synthetic Chem Ind Co Ltd:The エポキシ樹脂用硬化剤

Also Published As

Publication number Publication date
EP2358813A4 (fr) 2014-04-30
US20110213096A1 (en) 2011-09-01
JP5685545B2 (ja) 2015-03-18
TWI488881B (zh) 2015-06-21
TW201030045A (en) 2010-08-16
KR20110097835A (ko) 2011-08-31
WO2010059683A3 (fr) 2010-08-19
US8278396B2 (en) 2012-10-02
CN102224199A (zh) 2011-10-19
JP2012509391A (ja) 2012-04-19
EP2358813A2 (fr) 2011-08-24
CN102224199B (zh) 2013-07-03
EP2358813B1 (fr) 2018-08-22
KR101761423B1 (ko) 2017-07-25

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