WO2010052823A1 - エポキシ樹脂組成物用硬化促進剤、および1液型熱硬化性エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物用硬化促進剤、および1液型熱硬化性エポキシ樹脂組成物 Download PDFInfo
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- WO2010052823A1 WO2010052823A1 PCT/JP2009/004946 JP2009004946W WO2010052823A1 WO 2010052823 A1 WO2010052823 A1 WO 2010052823A1 JP 2009004946 W JP2009004946 W JP 2009004946W WO 2010052823 A1 WO2010052823 A1 WO 2010052823A1
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- 0 C=N*C(O*C(*OC(*N)=O)(*OC(*N)=O)*OC(*N=C)=O)=O Chemical compound C=N*C(O*C(*OC(*N)=O)(*OC(*N)=O)*OC(*N=C)=O)=O 0.000 description 2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
Definitions
- the present invention relates to a curing accelerator for an epoxy resin composition and a one-component thermosetting epoxy resin composition.
- Patent Document 1 A composition using an aromatic diamine compound as a curing agent for an epoxy resin provides a cured product having a high glass transition temperature.
- Patent Document 1 A composition using an aromatic diamine compound as a curing agent for an epoxy resin provides a cured product having a high glass transition temperature.
- Patent Document 1 A composition using an aromatic diamine compound as a curing agent for an epoxy resin provides a cured product having a high glass transition temperature.
- Patent Document 1 A composition using an aromatic diamine compound as a curing agent for an epoxy resin provides a cured product having a high glass transition temperature.
- Patent Document 1 A composition using an aromatic diamine compound as a curing agent for an epoxy resin provides a cured product having a high glass transition temperature.
- Patent Document 4 an epoxy resin composition containing an epoxy resin, a curing agent, and a microcapsule-type phosphorus curing accelerator
- JP 2007-326906 A JP-A-6-73163 JP-A-8-73566 Japanese Patent Laid-Open No. 11-343332
- an epoxy resin composition using a microcapsule containing trisphenylphosphine triphenylborane or tris (4-methylphenyl) phosphine triphenylborane as a curing accelerator for a phenolic resin as a curing agent for an epoxy resin The present inventor has found that the curing time (gel time) is long as in the case where triphenylphosphine is used for a phenolic resin as a curing agent for an epoxy resin.
- the present invention provides a one-pack type epoxy resin composition excellent in storage stability and fast curability, and a curing accelerator for an epoxy resin composition used in such a one-pack type epoxy resin composition. For the purpose.
- an epoxy resin, a polythiol as a curing agent, and a compound represented by a specific structure as a curing accelerator are included in a thermoplastic resin.
- the present inventors have found that a composition containing a capsule-type curing accelerator can be a one-component thermosetting epoxy resin composition having excellent storage stability and fast curability, and completed the present invention.
- this invention provides the hardening accelerator for epoxy resin compositions containing the microcapsule type hardening accelerator by which the compound represented by the following (I) is included by the thermoplastic resin.
- R 1 and R 2 each represent a hydrogen atom or an alkyl group.
- the present invention also provides a one-component thermosetting epoxy resin composition comprising an epoxy resin, polythiol as a curing agent, and the curing accelerator for the epoxy resin composition.
- the one-component thermosetting epoxy resin composition containing the curing accelerator for an epoxy resin composition of the present invention is excellent in storage stability and fast curability. Moreover, the one-component thermosetting epoxy resin composition of the present invention is excellent in storage stability and fast curability.
- the one-component thermosetting epoxy resin composition of the present invention is It is a composition containing an epoxy resin, a polythiol as a curing agent, and a microcapsule type curing accelerator formed by encapsulating a compound represented by the following formula (I) with a thermoplastic resin.
- R 1 and R 2 each represent a hydrogen atom or an alkyl group.
- the one-component thermosetting epoxy resin composition of the present invention may be hereinafter referred to as “the composition of the present invention”.
- the epoxy resin contained in the composition of the present invention is not particularly limited as long as it is a compound having two or more epoxy groups on average in one molecule.
- polyglycidyl ether obtained by reacting polychlorophenol such as bisphenol A, bisphenol F, bisphenol AD, catechol and resorcinol, polyhydric alcohol such as glycerin and polyethylene glycol and epichlorohydrin; p-hydroxybenzoic acid, Glycidyl ether ester obtained by reacting a hydroxycarboxylic acid such as ⁇ -hydroxynaphthoic acid with epichlorohydrin; a polyglycol obtained by reacting a polycarboxylic acid such as phthalic acid or terephthalic acid with epichlorohydrin Glycidyl ester; epoxidized phenol novolak resin, epoxidized cresol novolak resin, epoxidized polyolefin, cycloaliphatic epoxy resin,
- the epoxy resin is excellent in storage stability and fast curability and can be a cured product having a high glass transition temperature
- bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin, and glycidyl amine type epoxy resin are used.
- the epoxy resins can be used alone or in combination of two or more.
- polythiol (hereinafter also referred to as thiol curing agent) is used as a curing agent for epoxy resin.
- the polythiol contained in the composition of the present invention is a compound having two or more mercapto groups (—SH) in the molecule.
- the number of mercapto groups contained in one molecule of polythiol is preferably 2 to 20 from the viewpoint that it is excellent in storage stability and fast curability and can be a cured product having a high glass transition temperature. More preferably, the number is ⁇ 10.
- the polythiol include mercapto group-containing hydrocarbon compounds having two or more mercapto groups (-SH) in the molecule, and mercapto group-containing silicones having two or more mercapto groups (-SH) in the molecule.
- the main chain of the mercapto group-containing silicone having two or more mercapto groups in the molecule is silicone.
- the mercapto group-containing silicone can be directly bonded to the main chain of the mercapto group-containing silicone.
- the mercapto group can be bonded to the main chain of the mercapto group-containing silicone via an organic group.
- the organic group through the mercapto group and the main chain of the mercapto group-containing silicone is not particularly limited as long as it is a divalent hydrocarbon group.
- the divalent hydrocarbon group can have a hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom.
- Examples of the divalent hydrocarbon group include an aliphatic hydrocarbon group (the aliphatic hydrocarbon group can include an unsaturated bond), an alicyclic hydrocarbon group (the alicyclic hydrocarbon group is unsaturated). And an aromatic hydrocarbon group and a hydrocarbon group formed by a combination thereof.
- an aliphatic hydrocarbon group is preferable from the viewpoint of being excellent in rapid curability.
- Examples of the aliphatic hydrocarbon group include those having 1 to 6 carbon atoms. Specific examples include a methylene group, an ethylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group.
- the main chain of the mercapto group-containing silicone can have, for example, an alkoxy group such as a methoxy group or an ethoxy group; an alkyl group such as a methyl group or an ethyl group.
- Examples of the mercapto group-containing silicone include compounds represented by the following formula (II).
- the mercapto group-containing silicone is preferably a compound represented by the formula (II) from the viewpoint that it is excellent in storage stability and fast curability and can be a cured product having a high glass transition temperature.
- R1 is an alkyl group
- R is an alkylene group
- R2 is an alkyl group or an alkoxy group
- R3 is an alkyl group
- n is an integer of 2 or more.
- Examples of the alkyl group include a methyl group and an ethyl group.
- Examples of the alkylene group include those having 2 to 6 carbon atoms, and specific examples include a methylene group, an ethylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group.
- Examples of the alkyl group or alkoxy group as R2 include a methyl group, an ethyl group, a methoxy group, and an ethoxy group.
- Examples of the alkyl group as R3 include a methyl group.
- n is an integer of 2 or more, and is preferably from 5 to 10 and preferably from 6 to 8 from the viewpoint that the glass transition temperature (glass transition point) of the cured product is high, and it is excellent in fast curability and storage stability. Is more preferable.
- Examples of the compound represented by the formula (II) include a compound represented by the following formula (III).
- the compound represented by the formula (II) is preferably a compound represented by the formula (III) from the viewpoint that it is excellent in storage stability and immediate curability and can be a cured product having a high glass transition temperature.
- R1 is an alkyl group
- R2 is an alkyl group or an alkoxy group
- R3 is an alkyl group
- n is an integer of 2 or more.
- R1, R2, R3, and n are as defined above.
- the mercapto group-containing hydrocarbon compound having two or more mercapto groups in the molecule can have a hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom.
- Examples of the mercapto group-containing hydrocarbon compound having two or more mercapto groups in the molecule include compounds represented by the following formulas (1), (2), (3), (4), and (5). .
- R1 is an alkyl group having 1 to 6 carbon atoms
- R2 to R7 each represents an alkylene group having 1 to 10 carbon atoms
- n is an integer of 1 or more.
- R1 to R8 each represents a hydrocarbon group (for example, an alkylene group).
- R1 to R12 each represents a hydrocarbon group (for example, an alkylene group).
- R1 to R6 each represents a hydrocarbon group (for example, an alkylene group).
- the hydrocarbon compound having two or more mercapto groups in the molecule is preferably a compound represented by the formula (1) from the viewpoint of excellent storage stability and fast curability.
- Examples of the compound represented by the formula (1) include trimethylolpropane tristhioglycolate and trimethylolpropane tristhiopropionate.
- the compound represented by the formula (1) is preferably trimethylolpropane tristhioglycolate or trimethylolpropane tristhiopropionate from the viewpoint of excellent storage stability and fast curability.
- Polythiol can be used individually or in combination of 2 or more types, respectively. Polythiol is not particularly limited for its production. For example, a conventionally well-known thing is mentioned.
- the amount of polythiol is excellent in storage stability and fast curability, can be a cured product having a high glass transition temperature, and is active hydrogen (mercapto group active hydrogen) from the viewpoint of excellent low-temperature curability.
- the amount is preferably 0.5 to 2.5 equivalents (active hydrogen / epoxy group), more preferably 0.7 to 2.0 equivalents, based on the epoxy group of the epoxy resin. preferable.
- the microcapsule type curing accelerator contained in the composition of the present invention is one in which a curing accelerator represented by the following formula (I) is covered with a thermoplastic resin.
- the microcapsule type curing accelerator has the curing accelerator represented by the formula (I) as a core, and has a thermoplastic resin as a shell.
- the thermoplastic resin can cover at least part or all of the surface of the core.
- R 1 and R 2 each represent a hydrogen atom or an alkyl group.
- R1 represents a hydrogen atom or an alkyl group.
- R2 represents a hydrogen atom or an alkyl group.
- R1 and R2 may be the same or different.
- a plurality of R1 may be the same or different.
- a plurality of R2 may be the same or different.
- the alkyl group preferably has 1 to 6 carbon atoms, and more preferably 1 to 3 carbon atoms from the viewpoint of excellent curability and a high glass transition temperature.
- Specific examples of the alkyl group include a methyl group, an ethyl group, and a propyl group.
- Examples of the compound represented by the formula (I) include a compound represented by the formula (6) and a compound represented by the formula (7).
- the composition of the present invention is superior in rapid curability and has a high glass transition temperature, so that the compound represented by the formula (I) and / or the formula (7) is represented by the formula (I). It is preferable to contain the compound represented.
- the compound name of the compound represented by the formula (6) is triphenylphosphine triphenylborate, which is sometimes referred to as “TPP-S” in the present specification.
- the compound name of the compound represented by the formula (7) is trisparamethylphenylphosphine triphenylborate, which is sometimes referred to as “TPTP-S” in the present specification.
- the compound represented by the formula (I) is not particularly limited for its production. A commercial item can be used as a compound represented by a formula (I).
- the compound represented by the formula (I) is preferably a solid (or a melting point exceeding 70 ° C.) at 25 to 70 ° C. from the viewpoint of easy microencapsulation when producing a microcapsule type curing accelerator.
- the compound represented by the formula (I) preferably has an average particle size of 0.1 to 100 ⁇ m from the viewpoint of excellent curability and storage stability.
- the average particle size of the compound represented by the formula (I) is measured using a nanoparticle size distribution measuring device SALD-7100 (manufactured by Shimadzu Corporation).
- SALD-7100 nanoparticle size distribution measuring device
- the amount of the curing accelerator represented by the formula (I) is 1 to 50 with respect to 100 parts by mass of the epoxy resin from the viewpoints of excellent storage stability, excellent quick curability, and a high glass transition temperature of the cured product.
- the amount is preferably part by mass, more preferably 1 to 30 parts by mass.
- the composition of the present invention contains a microcapsule type curing accelerator in which the compound represented by the formula (I) is encapsulated by a thermoplastic resin.
- the microcapsule type curing accelerator has the compound represented by the formula (I) as a core and has a thermoplastic resin as a shell.
- the compound represented by the formula (I) is preferably a solid at 25 to 70 ° C. (or a melting point exceeding 70 ° C.) from the viewpoint of easy microencapsulation when producing a microcapsule type curing accelerator. .
- thermoplastic resin used as the shell is not particularly limited.
- urethane resin styrene butadiene elastomer
- polyvinyl acetal resin phenoxy resin
- polymethyl methacrylate resin polyvinyl alcohol
- acrylic monomers such as acrylic acid ester, itaconic acid ester, crotonic acid ester, etc.
- Monofunctional compounds such as 1 to 8 alkyl ethers and those in which part or all of the hydrogen atoms of the alkyl group of this alkyl ester are substituted with allyl groups, styrene, ⁇ -methylstyrene, acrylonitrile, methacrylonitrile, vinyl acetate, etc.
- thermoplastic resins can be used alone or in combination of two or more.
- urethane resins styrene butadiene elastomers
- polyvinyls are preferred from the viewpoints of excellent storage stability and fast curability, excellent film-forming properties and mechanical strength, and the ability to maintain the glass transition temperature of the obtained cured product. It is preferably at least one selected from the group consisting of an acetal resin, polyvinyl alcohol and phenoxy resin.
- the urethane resin is not particularly limited as long as it is a compound having a urethane bond.
- those obtained by reaction of polyisocyanates and polyamines those obtained by reaction of polyisocyanates and water, those obtained by reaction of polyisocyanates and polyhydric alcohols, Examples thereof include those obtained by reaction of isocyanates, polyvalent amines and polyhydric alcohols.
- the polyvalent isocyanate used in producing the urethane resin may be a compound having two or more isocyanate groups in the molecule. Specifically, for example, m-phenylene diisocyanate, p-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,4-diisocyanate, diphenylmethane-4,4′-diisocyanate, 3,3'-dimethoxy-4,4'-biphenyl diisocyanate, 3,3'-dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-dimethyldiphenylmethane-2,2 ', 5,5'-tetraisocyanate
- Aromatic polyisocyanates such as xylylene-1,4-diisocyanate and polyisocyanates having an isocyanate group bonded to an alkylene group having
- aromatic poly- ylene such as tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, p-phenylene diisocyanate, xylylene diisocyanate, and the like.
- Isocyanates are preferred.
- Polyvalent isocyanates can be used alone or in combination of two or more.
- the polyvalent amine used when producing the urethane resin may be a compound having two or more amino groups in the molecule.
- aliphatic polyamines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, 1,6-hexamethylenediamine, 1,8-octamethylenediamine, 1,12-dodecamethylenediamine; o-phenylene Aromatic polyamines such as diamine, m-phenylenediamine, and p-phenylenediamine; amino groups on alkylene groups having an aromatic hydrocarbon group such as o-xylylenediamine, m-xylylenediamine, and p-xylylenediamine
- alicyclic polyamines such as menthanediamine, bis (4-amino-3-methylcyclohexyl) methane, isophoronediamine and 1,3-diaminocyclohexane; spiroacetal diamines.
- the polyhydric alcohol used when using the urethane resin may be aliphatic, aromatic or alicyclic.
- catechol resorcinol, 1,2-dihydroxy-4-methylbenzene, 1,3-dihydroxy-5-methylbenzene, 3,4-dihydroxy-1-methylbenzene, 3,5-dihydroxy-1-methylbenzene, 2,4-dihydroxyethylbenzene, 1,3-naphthalenediol, 1,5-naphthalenediol, 2,7-naphthalenediol, 2,3-naphthalenediol, o, o'-biphenol, p, p'-biphenol, bisphenol A, bis- (2-hydroxyphenyl) methane, xylylenediol, ethylene glycol, 1,3-propylene glycol, 1,4-butylene glycol, 1,5-pentanediol, 1,6-hexanediol, 1,7 -Heptanediol
- the styrene butadiene elastomer is not particularly limited. For example, a conventionally well-known thing is mentioned.
- the weight average molecular weight of the styrene butadiene elastomer is preferably 12,000 to 50,000 from the viewpoint of excellent storage stability and fast curability.
- the weight average molecular weight is a polystyrene-reduced weight average molecular weight determined by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent.
- the polyvinyl acetal resin is not particularly limited. Examples thereof include polyvinyl formal resin and polyvinyl butyral resin.
- the weight average molecular weight of the polyvinyl acetal resin is preferably 10,000 to 60,000 from the viewpoint of excellent storage stability and fast curability.
- Polyvinyl alcohol is not particularly limited. For example, a conventionally well-known thing is mentioned.
- the weight average molecular weight of polyvinyl alcohol is preferably 10,000 to 150,000 from the viewpoint of excellent storage stability and fast curability.
- Phenoxy resin is not particularly limited.
- it is a high molecular weight epoxy resin having a molecular weight of 10,000 or more selected from bisphenol A and / or bisphenol F.
- a microcapsule type hardening accelerator can be used individually or in combination of 2 types or more, respectively.
- the shell material is selected from the group consisting of urethane resin, styrene butadiene elastomer, polyvinyl acetal resin, polyvinyl alcohol and phenoxy resin.
- a microcapsule type curing accelerator containing at least one selected from the above is preferable.
- the amount of the thermoplastic resin used in the microcapsule type curing accelerator can maintain the glass transition temperature of the resulting cured product, and is superior in storage stability, excellent in fast curability, film forming property, mechanical property From the viewpoint of excellent strength, it is preferably 1 to 50% by mass of the entire composition.
- the amount of the microcapsule type curing accelerator can maintain the glass transition temperature of the resulting cured product, is superior in storage stability, excellent in fast curability, and excellent in film forming property and mechanical strength.
- the amount is preferably 1 to 50 parts by mass and more preferably 1 to 30 parts by mass with respect to 100 parts by mass of the epoxy resin.
- the average particle diameter (diameter) of the microcapsule type curing accelerator is preferably from 0.1 to 50 (unit: micron) from the viewpoint of excellent storage stability and fast curability.
- the average particle size is measured using a nano particle size distribution analyzer SALD-7100 (manufactured by Shimadzu Corporation).
- the thickness of the shell in the microcapsule type curing accelerator is 0.01 to 10 (unit: micron) from the viewpoint of excellent storage stability and fast curability, and excellent film forming properties and mechanical strength. preferable.
- the thickness of the shell is measured using a nanoparticle size distribution measuring device SALD-7100 (manufactured by Shimadzu Corporation).
- the epoxy resin composition of the present invention can further contain spherical silica.
- the spherical silica will be described below.
- the spherical silica contained in the composition of the present invention is hydrophobic spherical silica (hydrophobic silica fine particles).
- One of the preferred embodiments of the spherical silica is spherical silica fine particles whose surface is hydrophobically treated.
- the average particle size of the spherical silica is preferably 20 to 200 nm, more preferably 20 to 100 nm, from the viewpoint of better storage stability.
- the average particle diameter of the spherical silica is measured with a nanoparticle size distribution analyzer SALD-7100 using a dispersion liquid in which spherical silica is dispersed in methanol as a solvent.
- Spherical silica is not particularly limited for its production. For example, a conventionally well-known thing is mentioned. A commercial item can be used as spherical silica.
- Spherical silica can be used alone or in combination of two or more.
- the amount of the spherical silica is preferably 30% by mass or more in the total amount of the microcapsule type curing accelerator and the spherical silica, from the viewpoint of excellent storage stability and excellent curability and physical properties of the cured product. More preferably, it is -95 mass%, and still more preferably 50-90 mass%.
- the microcapsule type curing accelerator is covered with spherical silica.
- the spherical silica can cover part or all of the surface of the microcapsule type curing accelerator.
- the microcapsule type curing accelerator further coated with spherical silica can be produced, for example, by mixing at least a microcapsule type curing accelerator and spherical silica.
- the spherical silica can be adsorbed on the surface of the microcapsule type curing accelerator by, for example, static electricity generated during production.
- the composition of this invention can contain an additive further as needed other than an epoxy resin, a hardening
- additives include curing agents other than polythiols, fillers (fillers), reactive diluents, plasticizers, thixotropic agents, pigments, dyes, anti-aging agents, antioxidants, antistatic agents, and flame retardants. , Adhesion-imparting agents, dispersants, and solvents.
- the composition of the present invention is not particularly limited for its production.
- an epoxy resin, a microcapsule type curing accelerator encapsulating a compound represented by the formula (I), spherical silica, a curing agent, and an additive that can be used as necessary are used under reduced pressure or in a nitrogen atmosphere.
- a stirring device such as a mixing mixer
- the composition of the present invention can be produced as a one-component composition.
- a silica microcapsule type curing accelerator may be contained in the resulting composition.
- a microcapsule type curing accelerator and spherical silica are mixed in advance.
- an epoxy resin, a thiol curing agent, and an additive that can be used as necessary are added to the obtained mixture and mixed.
- the viscosity is measured at 25 ° C. using an E-type viscometer VISCONIC EHD type (manufactured by Toki Sangyo Co., Ltd.).
- the rate of increase in viscosity after being placed under the condition of 25 ° C. for 24 hours with respect to the initial viscosity is preferably 10% or less. % Or less is more preferable.
- composition of the present invention is excellent in storage stability and can be stored for a long time at room temperature (20 to 30 ° C.).
- the conventional composition containing the compound represented by the formula (I) has been required to be refrigerated or frozen.
- the temperature at which the composition of the present invention is cured is preferably from 100 to 250 ° C., more preferably from 120 to 200 ° C., from the viewpoints of excellent fast curability and a high glass transition temperature of the cured product. preferable.
- the gelation time is preferably within 2 minutes (120 seconds) at 150 ° C., more preferably within 60 seconds, More preferably, it is within seconds.
- the gel time (gel time) was measured by a method according to JIS C2161: 1997.
- the composition of the present invention is used, for example, as an adhesive (for example, for construction, electrical, electronic, automobile), paint, civil engineering equipment, transport equipment, medical equipment, packaging equipment, textiles, sports / leisure goods. be able to.
- an adhesive for example, for construction, electrical, electronic, automobile
- the adherend to which the composition of the present invention can be applied include metal, glass, plastic, mortar, concrete, rubber, wood, leather, cloth, and paper.
- the method for applying the composition of the present invention to the adherend is not particularly limited. For example, a conventionally well-known thing is mentioned.
- the curing accelerator for epoxy resin compositions of the present invention is The hardening accelerator shown by following formula (I) contains the microcapsule type hardening accelerator formed by encapsulating with a thermoplastic resin.
- R 1 and R 2 each represent a hydrogen atom or an alkyl group.
- the curing accelerator and thermoplastic resin represented by the formula (I) used for the microcapsule type curing accelerator are the same as those used in the epoxy composition of the present invention.
- the microcapsule type curing accelerator is not particularly limited for its production. For example, it is produced in the same manner as the microcapsule type curing accelerator used in the composition of the present invention.
- the microcapsule type curing accelerator can be used as a curing accelerator for the epoxy resin composition.
- the curing accelerator for an epoxy resin composition of the present invention can further contain hydrophobic spherical silica. Hydrophobic spherical silica is synonymous with that used in the composition of the present invention.
- the hydrophobic spherical silica can cover a part or all of the microcapsule type curing accelerator.
- the silica microcapsule type curing accelerator will be described below.
- the silica microcapsule type curing accelerator has a curing accelerator represented by formula (I) as a core, the core is covered with a thermoplastic resin (first shell), and the thermoplastic resin is hydrophobic spherical silica (first 2 shells).
- the production of the silica microcapsule type curing accelerator is not particularly limited. For example, it can be produced by mixing a microcapsule type curing accelerator in which the curing accelerator represented by the formula (I) is covered with a thermoplastic resin and spherical silica.
- the silica microcapsule type curing accelerator can be used as a curing accelerator for the epoxy resin composition.
- the composition obtained as described below is placed on a hot plate, the metal bar is stirred at a rate of 60 ⁇ 5 times / minute, and the composition becomes a gel from the start of evaluation (the whole The time until the mixture can no longer be stirred or does not stick to the needle tip) was defined as the gel time (gel time).
- Viscosity The initial viscosity of the composition obtained as described below was measured under the condition of 25 ° C. using an E-type viscometer VISCONIC EHD type (manufactured by Toki Sangyo Co., Ltd.). In addition, the composition obtained as described below was stored in a thermostatic bath at 25 ° C. for 24 hours, and then the viscosity of the composition (viscosity after storage) was measured in the same manner as the initial viscosity. (3) Viscosity increase rate (storage stability) The viscosity increase rate was calculated by fitting the obtained initial viscosity and the viscosity value after storage to the following formula.
- Viscosity increase rate (%) (viscosity after storage ⁇ initial viscosity) / initial viscosity ⁇ 100 As a criterion for evaluating the rate of increase in viscosity, when it was within 10%, it could be used as a one-component thermosetting epoxy resin composition.
- Microencapsulation of the compound represented by the formula (I) (production of microcapsules having the compound represented by the formula (I) as a core) Microencapsulation was performed by a spray drying method using a spray dryer GS310 manufactured by Yamato Scientific Co., Ltd.
- TPP-S 10 g, melting point 205 ° C., manufactured by Hokuko Chemical Co., Ltd., the same shall apply hereinafter
- TPTP-S: 10 g, melting point 171 °C, made by Hokuko Chemical Co., Ltd. the same shall apply hereinafter
- Microcapsules TPP-S (10 g) (or TPTP-S: 10 g) having a thickness corresponding to 20% by mass of the weight of the core are suspended in a solvent: ethyl acetate (40 g) 50 g and a thermoplastic resin solution (2 g of thermoplastic resin in a solvent) dissolved in a solvent: ethyl acetate (18 g) are mixed and spray-dried using the above spray-drying apparatus to obtain
- TPP-S @ MC1 Shelling agent Microencapsulation was performed so that urethane resin Desmocol 500 (manufactured by Bayer Holding Co., Ltd., the same applies hereinafter) had a thickness of 10% by mass with respect to the core (TPP-S). The obtained microcapsule is designated as TPP-S @ MC1. The average particle size of TPP-S @ MC1 was 10 ⁇ m.
- TPP-S @ MC2 Shell agent Microencapsulation was performed so that the urethane resin Desmocol 500 had a thickness of 20 mass% with respect to the core (TPP-S). The obtained microcapsule is designated as TPP-S @ MC2. The average particle size of TPP-S @ MC2 was 11 ⁇ m.
- TPP-S @ MC3 Microencapsulation was performed so that the shell agent: styrene butadiene elastomer / tuffprene 912 (manufactured by Asahi Kasei Co., Ltd., block copolymer, hereinafter the same) had a thickness of 10% by mass with respect to the core (TPP-S).
- the obtained microcapsule is designated as TPP-S @ MC3.
- the average particle size of TPP-S @ MC3 was 10 ⁇ m.
- TPP-S @ MC4 Shell agent Polyvinyl acetal resin KS10 (manufactured by Sekisui Chemical Co., Ltd., weight average molecular weight 56,000, hydroxy group 18 mol%, acetalization degree 80 mol%, the same applies hereinafter) is 10 with respect to the core (TPP-S). Microencapsulation was performed so as to obtain a thickness of mass%. The obtained microcapsule is designated as TPP-S @ MC4. The average particle size of TPP-S @ MC4 was 10 ⁇ m.
- TPP-S @ MC5 Shell agent phenoxy resin YP-50 (manufactured by Tohto Kasei Co., Ltd., weight average molecular weight 60,000 to 80,000, the same shall apply hereinafter) is microscopic so that the thickness of the core (TPP-S) is 10 mass% Encapsulation was performed.
- the obtained microcapsule is designated as TPP-S @ MC5.
- the average particle size of TPP-S @ MC5 was 10 ⁇ m.
- TPP-S @ MC6 Shell agent Microencapsulation was performed so that polyvinyl alcohol (trade name NH-18, manufactured by Nippon Synthetic Chemical Co., Ltd.) had a thickness of 10% by mass with respect to the core (TPP-S). The obtained microcapsule is designated as TPP-S @ MC6. The average particle size of TPP-S @ MC6 was 10 ⁇ m.
- TPTP-S @ MC1 Shell agent: Microencapsulation was performed so that the phenoxy resin YP-50 had a thickness of 10 mass% with respect to the core (TPTP-S). The obtained microcapsule is designated as TPTP-S @ MC1. The average particle size of TPTP-S @ MC1 was 10 ⁇ m.
- compositions were produced by using the components shown in Tables 1 to 3 in the amounts (parts by mass) shown in the same table and mixing them with a vacuum stirrer.
- the numerical value having “eq” as a unit with respect to the amount of the curing agent is the number of equivalents of active hydrogen of the curing agent to the epoxy group (active hydrogen / epoxy group).
- the amount (mass part) as a microcapsule is shown about the microcapsule which encapsulates the compound represented by Formula (I).
- Epoxy resin EP4100E (made by ADEKA) Bisphenol A type epoxy resin Epoxy equivalent 188g / mol
- Curing agent (1) TMTG represented by the following formula: Trimethylolpropane tristhioglycolate, manufactured by Sakai Chemical Co., Ltd.
- Curing agent (2) Mercaptosilane condensate represented by the following formula (Z6362H, manufactured by Toray Dow) In the formula, n is 6 to 8.
- Curing agent (3) Trade name PN, phenol novolak (manufactured by Nippon Kayaku Co., Ltd.)
- Curing agent (4) trade name XYLOK-4L, xylylene glycol / phenol condensate (Mitsui Chemicals) -TPP-S @ MC1 to TPP-S @ MC6, TPTP-S @ MC1: Microcapsules containing the compound represented by formula (I), produced as described above-TPP-S: In the following formula (1) Compound represented by Hokuko Chemical Co., Ltd. TPTP-S: a compound represented by the following formula (2), manufactured by Hokuko Chemical Co., Ltd.
- Phenol novolac resin curing agent MEH-8000H (Maywa Kasei Co., Ltd.)
- Phenol aralkyl resin curing agent MEH-7800S (Maywa Kasei Co., Ltd.)
- Acid anhydride curing agent Suecid MT-500 (manufactured by Shin Nippon Chemical Co., Ltd.)
- TPP Triphenylphosphine, manufactured by Tokyo Chemical Industry Co., Ltd.
- Comparative Example II-1 containing a phenol resin as a curing agent and containing TPP as a curing accelerator
- the rate of increase in viscosity was within 10%, which was excellent in storage stability and excellent rapid curability could be maintained. 4). Evaluation About the composition obtained as follows, gel time, a viscosity, and a viscosity increase rate were evaluated with the following method. The results are shown in Tables 4-6.
- TPP-S @ MC 10% (microcapsule having a shell thickness corresponding to 10% by weight of the core) 50 g of a curing accelerator solution in which TPP-S (10 g) is suspended in a solvent: ethyl acetate (40 g), and a PVA solution (amount of PVA in the PVA solution is 1 g) dissolved in the solvent: ethyl acetate (10 g). It mixed and spray-dried using the said spray-drying apparatus, and obtained powder (microcapsule with a thickness of 10 mass%).
- the obtained microcapsule type curing accelerator is TPP-S @ MC 10%.
- the average particle size of TPP-S @ MC 10% was 10 ⁇ m.
- the silica microcapsule type curing accelerators obtained as described above were used in the amounts (parts by mass) shown in Table 4 for the remaining components shown in Table 4. In addition, they were mixed with a vacuum stirrer to produce a composition. About the Example shown in Table 5, and the comparative example shown in Table 6, they were mixed with a vacuum stirrer using the amounts (parts by mass) shown in the same table to produce compositions.
- the numerical value having “eq” as a unit with respect to the amount of the thiol curing agent is the number of equivalents of active hydrogen of the thiol curing agent to the epoxy group (active hydrogen / epoxy group).
- Comparative Examples III-1 and 2 which do not use hydrophobic spherical silica had a high viscosity increase rate and poor storage stability.
- Example II and Example III had a low rate of increase in viscosity and excellent storage stability.
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Abstract
Description
本願出願人は以前にエポキシ樹脂を含む第1液の貯蔵安定性に優れ、室温以下での硬化速度が速い2液型の硬化性樹脂組成物として特許文献1を提案している。
また、エポキシ樹脂と、硬化剤と、マイクロカプセル型リン系硬化促進剤とを含有するエポキシ樹脂組成物(特許文献2~3参照)、マイクロカプセル型硬化剤とエポキシ樹脂とを含有するエポキシ樹脂組成物(特許文献4参照)が提案されている。
また、トリフェニルホスフィンをエポキシ樹脂の硬化剤としてのフェノール系樹脂に対して使用する場合、組成物の硬化時間が短くなることが知られている。
また、エポキシ樹脂の硬化剤としてのフェノール系樹脂に対してトリフェニルホスフィンを硬化促進剤として使用する場合、硬化時間を短くすることができないことを本願発明者は見出した。
さらに、エポキシ樹脂の硬化剤としてのフェノール系樹脂に対して、トリスフェニルホスフィントリフェニルボランまたはトリス(4-メチルフェニル)ホスフィントリフェニルボランを内包するマイクロカプセルを硬化促進剤として使用するエポキシ樹脂組成物は、トリフェニルホスフィンをエポキシ樹脂の硬化剤としてのフェノール系樹脂に対して使用する場合と同様に硬化時間(ゲル化時間)が長いということを本願発明者は見出した。
そして、本発明者は、エポキシ樹脂に硬化剤としてチオール硬化剤、硬化促進剤としてトリフェニルホスフィントリフェニルボレートおよびトリスパラメチルフェニルトリフェニルホスフィンを用いると、速硬化性に優れるものの冷蔵または冷凍保存が必要で貯蔵安定性に劣るという欠点があることを見出した。
そこで、本発明は、貯蔵安定性、速硬化性に優れる1液型のエポキシ樹脂組成物、およびそのような1液型のエポキシ樹脂組成物に用いられるエポキシ樹脂組成物用硬化促進剤を提供することを目的とする。
また、本発明の一液型熱硬化性エポキシ樹脂組成物は、貯蔵安定性、速硬化性に優れる。
本発明の一液型熱硬化性エポキシ樹脂組成物は、
エポキシ樹脂と、硬化剤としてポリチオールと、下記式(I)で表される化合物が熱可塑性樹脂によって内包されてなるマイクロカプセル型硬化促進剤とを含有する組成物である。
なお本発明の一液型熱硬化性エポキシ樹脂組成物を以下「本発明の組成物」ということがある。
本発明の組成物に含まれるエポキシ樹脂は、1分子中に平均してエポキシ基を2個以上有する化合物であれば特に制限されない。例えば、ビスフェノールA、ビスフェノールF、ビスフェノールAD、カテコール、レゾルシノール等の多価フェノール、グリセリンやポリエチレングリコール等の多価アルコールとエピクロロヒドリンを反応させて得られるポリグリシジルエーテル;p-ヒドロキシ安息香酸、β-ヒドロキシナフトエ酸のようなヒドロキシカルボン酸と、エピクロロヒドリンを反応させて得られるグリシジルエーテルエステル;フタル酸、テレフタル酸のようなポリカルボン酸とエピクロロヒドリンを反応させて得られるポリグリシジルエステル;エポキシ化フェノールノボラック樹脂、エポキシ化クレゾールノボラック樹脂、エポキシ化ポリオレフィン、環式脂肪族エポキシ樹脂、ウレタン変性エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、4,4-ジアミノジフェニルメタンやm-アミノフェノールなどから得られるグリシジルアミン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、等が挙げられる。
エポキシ樹脂は、貯蔵安定性、速硬化性により優れ、高いガラス転移温度を有する硬化物となることができるという観点から、ビスフェノールA型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、グリシジルアミン型エポキシ樹脂が好ましい。
エポキシ樹脂はそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
本発明においてポリチオール(以下、チオール硬化剤ともいう)はエポキシ樹脂の硬化剤として使用される。
本発明の組成物に含まれるポリチオールは、分子内にメルカプト基(-SH)を2個以上有する化合物である。
ポリチオールとしては、例えば、分子内にメルカプト基(-SH)を2個以上有するメルカプト基含有炭化水素化合物、分子内にメルカプト基(-SH)を2個以上有するメルカプト基含有シリコーンが挙げられる。
メルカプト基含有シリコーンにおいてメルカプト基は、メルカプト基含有シリコーンの主鎖に直接結合することができる。また、メルカプト基は、メルカプト基含有シリコーンの主鎖に有機基を介して結合することができる。
アルキレン基としては、炭素原子数2~6のものが挙げられ、具体的には例えば、メチレン基、エチレン基、トリメチレン基、テトラメチレン基、ペンタメチレン基、ヘキサメチレン基が挙げられる。
R2であるアルキル基またはアルコキシ基としては、例えば、メチル基、エチル基またはメトキシ基、エトキシ基が挙げられる。R3であるアルキル基としては、例えば、メチル基が挙げられる。
nは2以上の整数であり、硬化物のガラス転移温度(ガラス転移点)が高く、速硬化性、貯蔵安定性により優れるという観点から、5~10であるのが好ましく、6~8であるのがより好ましい。
分子内にメルカプト基を2個以上有するメルカプト基含有炭化水素化合物としては、例えば、下記式(1)、(2)、(3)、(4)、(5)で表される化合物が挙げられる。
式(1)で表される化合物は、貯蔵安定性、速硬化性により優れるという観点から、トリメチロールプロパントリスチオグリコレート、トリメチロールプロパントリスチオプロピオネートが好ましい。
ポリチオールはそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
ポリチオールはその製造について特に制限されない。例えば、従来公知のものが挙げられる。
本発明の組成物に含まれるマイクロカプセル型硬化促進剤は、下記式(I)で示される硬化促進剤が熱可塑性樹脂で覆われるものである。
本発明において、マイクロカプセル型硬化促進剤は、式(I)で示される硬化促進剤をコアとして有し、熱可塑性樹脂をシェルとして有する。熱可塑性樹脂はコアの表面の少なくとも一部または全部を覆うことができる。
本発明の組成物において、式(I)で表される化合物は硬化促進剤として使用される。
本発明の組成物に含有される式(I)で表される化合物は以下の構造を有する。
R1は水素原子、アルキル基を示す。R2は水素原子、アルキル基を示す。
R1、R2は同じでも異なっていてもよい。複数のR1は同じでも異なっていてもよい。複数のR2は同じでも異なっていてもよい。
式(I)で表される化合物としては、例えば、式(6)で表される化合物、式(7)で表される化合物が挙げられる。
式(7)で表される化合物の化合物名はトリスパラメチルフェニルホスフィントリフェニルボレートであり、本願明細書においてこれを「TPTP-S」ということがある。
式(I)で表される化合物はその製造について特に制限されない。式(I)で表される化合物として市販品を使用することができる。
式(I)で示される化合物は、マイクロカプセル型硬化促進剤を製造する際にマイクロカプセル化しやすいという観点から、25~70℃において固体(または融点が70℃を超える)であるのが好ましい。
式(I)で示される化合物は、硬化性及び貯蔵安定性に優れるという観点から、その平均粒径が0.1~100μmであるのが好ましい。本発明において式(I)で示される化合物の平均粒径は、ナノ粒子径分布測定装置SALD-7100(株式会社島津製作所製)を用いて測定したものである。
式(I)で表される化合物はそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
本発明において、マイクロカプセル型硬化促進剤は、前記式(I)で表される化合物をコアとして有し、熱可塑性樹脂をシェルとして有する。
式(I)で表される化合物は、マイクロカプセル型硬化促進剤を製造する際にマイクロカプセル化しやすいという観点から、25~70℃において固体(または融点が70℃を超える)であるのが好ましい。
熱可塑性樹脂はそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
多価イソシアネート類はそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
多価アミン類はそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
多価アルコールはそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
スチレンブタジエンエラストマーの重量平均分子量は貯蔵安定性、速硬化性により優れるという観点から、12000~50000であるのが好ましい。
なお、本発明において、重量平均分子量は、テトラヒドロフランを溶媒とするゲル・パーミエーション・クロマトグラフィー(GPC)によるポリスチレン換算の重量平均分子量であるものとする。
ポリビニルアセタール樹脂の重量平均分子量は貯蔵安定性、速硬化性により優れるという観点から、10000~60000であるのが好ましい。
マイクロカプセル型硬化促進剤はそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
また、貯蔵安定性、速硬化性により優れ、造膜性、機械的強度に優れるという観点から、シェルの材料としてウレタン樹脂、スチレンブタジエンエラストマー、ポリビニルアセタール樹脂、ポリビニルアルコールおよびフェノキシ樹脂からなる群から選ばれる少なくとも1種を含むマイクロカプセル型硬化促進剤が好ましい。
マイクロカプセル型硬化促進剤におけるシェルの厚さは、貯蔵安定性、速硬化性により優れ、造膜性、機械的強度に優れるという観点から、0.01~10(単位:ミクロン)であるのが好ましい。本発明においてシェルの厚さはナノ粒子径分布測定装置SALD-7100(株式会社島津製作所製)を用いて測定されたものである。
球状シリカについて以下に説明する。本発明の組成物に含まれる球状シリカは、疎水性の球状のシリカ(疎水性シリカ微粒子)である。球状シリカは、表面が疎水処理された球状のシリカ微粒子であるのが好ましい態様の1つとして挙げられる。
本発明において、球状シリカの平均粒径は、球状シリカを溶剤としてメタノールに分散させた分散液とし、分散液を用いてナノ粒子径分布測定装置SALD-7100で測定されたものである。
球状シリカはその製造について特に制限されない。例えば従来公知のものが挙げられる。球状シリカとして市販品を使用することができる。例えば、商品名X-24-9404(信越化学工業株式会社製)、商品名X-24-9163A(信越化学工業株式会社製)が挙げられる。球状シリカはそれぞれ単独でまたは2種以上を組み合わせて使用することができる。
球状シリカによってさらにコーティングされたマイクロカプセル型硬化促進剤(シリカマイクロカプセル型硬化促進剤)は、例えば、少なくともマイクロカプセル型硬化促進剤と球状シリカとを混合することによって製造することができる。球状シリカは、例えば製造の際に発生する静電気によって、マイクロカプセル型硬化促進剤の表面に吸着することができる。
添加剤としては、例えば、ポリチオール以外の硬化剤、充填剤(フィラー)、反応性希釈剤、可塑剤、チクソトロピー性付与剤、顔料、染料、老化防止剤、酸化防止剤、帯電防止剤、難燃剤、接着性付与剤、分散剤、溶剤が挙げられる。
系内におけるシリカマイクロカプセル型硬化促進剤の量を多くすることができ、得られる組成物の貯蔵安定性がより優れるという観点から、例えば、マイクロカプセル型硬化促進剤と球状シリカとをあらかじめ混合し、得られた混合物に、エポキシ樹脂、チオール硬化剤、および必要に応じて使用することができる添加剤を加えて混合する方法が挙げられる。
一方、式(I)で表される化合物を含有する従来の組成物は冷蔵保存または冷凍保存が必要とされていた。
本発明においてゲル化時間(ゲルタイム)は、JIS C2161:1997に準じる方法で測定された。
本発明の組成物を適用することができる被着体としては、例えば、金属、ガラス、プラスチック、モルタル、コンクリート、ゴム、木材、皮、布、紙が挙げられる。
本発明の組成物を被着体に付与する方法は特に制限されない。例えば、従来公知のものが挙げられる。
本発明のエポキシ樹脂組成物用硬化促進剤は、
下記式(I)で示される硬化促進剤が熱可塑性樹脂によって内包されてなるマイクロカプセル型硬化促進剤を含む。
マイクロカプセル型硬化促進剤に使用される式(I)で示される硬化促進剤、熱可塑性樹脂は、それぞれ本発明のエポキシ組成物において使用されるものと同義である。
マイクロカプセル型硬化促進剤はその製造について特に制限されない。例えば、本発明の組成物において使用されるマイクロカプセル型硬化促進剤と同様に製造される。
マイクロカプセル型硬化促進剤は、エポキシ樹脂組成物の硬化促進剤として使用することができる。
本発明のエポキシ樹脂組成物用硬化促進剤は、さらに疎水性の球状シリカをさらに含むことができる。
疎水性の球状シリカは、本発明の組成物において使用されるものと同義である。
本発明のエポキシ樹脂組成物用硬化促進剤において、疎水性の球状シリカは、マイクロカプセル型硬化促進剤の一部又は全部を覆うこともできる。
シリカマイクロカプセル型硬化促進剤について以下に説明する。
シリカマイクロカプセル型硬化促進剤はその製造について特に制限されない。例えば、式(I)で示される硬化促進剤が熱可塑性樹脂で覆われるマイクロカプセル型硬化促進剤と、球状シリカとを混合することによって製造することができる。
シリカマイクロカプセル型硬化促進剤は、エポキシ樹脂組成物の硬化促進剤として使用することができる。
1.評価
下記のようにして得られた組成物について以下の方法で、ゲルタイム、粘度、粘度上昇率を評価した。結果を第1表~第3表に示す。
(1)ゲルタイム(速硬化性)
速硬化性についてJIS C2161:1997に従って150℃でのゲルタイムをホットプレート上で測定した。具体的には熱板上に下記のようにして得られた組成物0.1gを置き、金属棒を60±5回/分の速度でかき混ぜ、評価開始から組成物がゲル状になる(全体がかき混ぜられなくなったり針先に粘着しなくなるなど)までの時間をゲル化時間(ゲルタイム)とした。
下記のようにして得られた組成物について25℃の条件下でE型粘度計 VISCONIC EHD型(東機産業株式会社製)を用いてに準じて初期粘度を測定した。
また、下記のようにして得られた組成物を恒温槽の中で25℃の条件下に24時間保存した後、初期粘度と同様にして組成物の粘度(保存後の粘度)を測定した。
(3)粘度上昇率(貯蔵安定性)
得られた初期粘度および保存後の粘度の値を下記式にあてはめて粘度上昇率を算出した。
粘度上昇率(%)=(保存後の粘度―初期粘度)/初期粘度×100
粘度上昇率の評価基準としては、10%以内の場合1液型熱硬化性エポキシ樹脂組成物として使用可能とした。
マイクロカプセル化はヤマト科学株式会社製スプレードライヤーGS310を用いたスプレードライ法によって行った。
(1)コアの重さの10質量%に相当する厚みを有するマイクロカプセル
TPP-S(10g、融点205℃、北興化学工業株式会社製、以下同様。)(またはTPTP-S:10g、融点171℃、北興化学工業株式会社製、以下同様。)を溶剤:酢酸エチル(40g)に懸濁させた硬化促進剤溶液50gと、溶剤:酢酸エチル(9g)に溶解させた熱可塑性樹脂溶液(溶剤中熱可塑性樹脂1g)とを混合し、上記スプレードライ装置を用いてスプレードライを行い粉体(10質量%の厚みのマイクロカプセル)を得た。
(2)コアの重さの20質量%に相当する厚みを有するマイクロカプセル
TPP-S(10g)(またはTPTP-S:10g)を溶剤:酢酸エチル(40g)に懸濁させた硬化促進剤溶液50gと、溶剤:酢酸エチル(18g)に溶解させた熱可塑性樹脂溶液(溶剤中熱可塑性樹脂2g)とを混合し、上記スプレードライ装置を用いてスプレードライを行い粉体(20質量%の厚みのマイクロカプセル)を得た。
シェル剤:ウレタン樹脂デスモコール500(バイエルホールディング株式会社製、以下同様。)がコア(TPP-S)に対して10質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPP-S@MC1とする。TPP-S@MC1の平均粒子は10μmであった。
シェル剤:ウレタン樹脂デスモコール500がコア(TPP-S)に対して20質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPP-S@MC2とする。TPP-S@MC2の平均粒子は11μmであった。
シェル剤:スチレンブタジエンエラストマー・タフプレン912(旭化成株式会社製、ブロック共重合体、以下同様。)がコア(TPP-S)に対して10質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPP-S@MC3とする。TPP-S@MC3の平均粒子は10μmであった。
シェル剤:ポリビニルアセタール樹脂KS10(積水化学工業株式会社製、重量平均分子量56,000、ヒドロキシ基18モル%、アセタール化度80モル%、以下同様。)がコア(TPP-S)に対して10質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPP-S@MC4とする。TPP-S@MC4の平均粒子は10μmであった。
シェル剤:フェノキシ樹脂YP-50(東都化成株式会社製、重量平均分子量60,000~80,000、以下同様。)がコア(TPP-S)に対して10質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPP-S@MC5とする。TPP-S@MC5の平均粒子は10μmであった。
シェル剤:ポリビニールアルコール(商品名NH-18、日本合成化学株式会社製)がコア(TPP-S)に対して10質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPP-S@MC6とする。TPP-S@MC6の平均粒子は10μmであった。
シェル剤:フェノキシ樹脂YP-50がコア(TPTP-S)に対して10質量%の厚みとなるようにマイクロカプセル化を行った。得られたマイクロカプセルをTPTP-S@MC1とする。TPTP-S@MC1の平均粒子は10μmであった。
第1表~第3表に示す成分を同表に示す量(質量部)で用いてそれらを減圧攪拌機で混合し組成物を製造した。
なお、第1表、第2表において、硬化剤の量について単位として「eq」を有する数値は、エポキシ基に対する硬化剤の活性水素の当量数(活性水素/エポキシ基)である。
第1表において、式(I)で表される化合物を内包するマイクロカプセルについては、マイクロカプセルとしての量(質量部)を示す。
・エポキシ樹脂:EP4100E(ADEKA社製) ビスフェノールA型エポキシ樹脂 エポキシ当量188g/mol
・硬化剤(1):下記式で表されるTMTG:トリメチロールプロパントリスチオグリ
コレート、淀化学社製
・硬化剤(3):商品名PN、フェノールノボラック(日本化薬株式会社製)
・硬化剤(4):商品名XYLOK-4L、キシリレングリコール/フェノール縮合物(三井化学株式会社製)
・TPP-S@MC1~TPP-S@MC6、TPTP-S@MC1:上記のとおり製造した、式(I)で表される化合物を内包するマイクロカプセル
・TPP-S:下記式(1)で表される化合物、北興化学工業株式会社製
・フェノールアラルキル樹脂硬化剤:MEH-7800S(明和化成株式会社製)
・酸無水物硬化剤:リカシッドMT-500(新日本理化株式会社製)
・TPP:トリフェニルホスフィン、東京化成工業株式会社製
また、硬化剤としてフェノール樹脂を含有し硬化促進剤としてTPPを含有する比較例II-1、硬化剤としてポリチオールを含有せず代わりにフェノール樹脂を含有し硬化促進剤としてTPP-Sを含有する比較例II-2~4は、速硬化性に劣った。
これに対して、実施例I-1~14は、粘度上昇率が10%以内であり貯蔵安定性に優れるとともに、優れた速硬化性を維持することができた。
4.評価
下記のようにして得られた組成物について以下の方法で、ゲルタイム、粘度、粘度上昇率を評価した。結果を第4表~第6表に示す。
(1)ゲルタイム(速硬化性):上記1.(1)と同様
(2)粘度:上記1.(2)と同様
(3)粘度上昇率(貯蔵安定性):粘度上昇率の評価基準として粘度上昇率が5%以内の場合を熱硬化性エポキシ樹脂組成物として使用可能とした点を除いて、上記1.(3)と同様
マイクロカプセル化は上記2.と同様のスプレードライ法によって行った。
(1)TPP-S@MC50%(コアの重さの50質量%に相当する、シェルの厚みを有するマイクロカプセル)
TPP-S(コア剤。10g、融点205℃、北興化学工業株式会社製、以下同様。)を溶剤:酢酸エチル(40g)に懸濁させた硬化促進剤溶液50gと、溶剤:酢酸エチル(100g)に溶解させたポリビニルアルコール樹脂(PVA)溶液[ポリビニールアルコール樹脂(商品名NH-18、日本合成化学株式会社製。以下同様。)、PVA溶液中のPVAの量:10g]と混合し、上記スプレードライ装置を用いてスプレードライを行い粉体(50質量%の厚みのマイクロカプセル)を得た。得られたマイクロカプセル型硬化促進剤をTPP-S@MC50%とする。TPP-S@MC50%の平均粒径は10μmであった。
TPP-S(10g)を溶剤:酢酸エチル(40g)に懸濁させた硬化促進剤溶液50gと、溶剤:酢酸エチル(10g)に溶解させたPVA溶液(PVA溶液中のPVAの量1g)と混合し、上記スプレードライ装置を用いてスプレードライを行い粉体(10質量%の厚みのマイクロカプセル)を得た。得られたマイクロカプセル型硬化促進剤をTPP-S@MC10%とする。TPP-S@MC10%の平均粒径は10μmであった。
第4表に示す成分のうち、マイクロカプセル型硬化促進剤と球状シリカとを同表に示す量(質量部)で混合して、シリカマイクロカプセル型硬化促進剤を製造した。
第4表に示す実施例については、上記のようにして得られたシリカマイクロカプセル型硬化促進剤に、第4表に示す残りの成分を同表に示す量(質量部)を加えて、それらを減圧攪拌機で混合し組成物を製造した。
第5表に示す実施例、および第6表に示す比較例については、各成分を同表に示す量(質量部)を用いてそれらを減圧攪拌機で混合し組成物を製造した。
なお、第4表、第5表において、チオール硬化剤の量について単位として「eq」を有する数値は、エポキシ基に対するチオール硬化剤の活性水素の当量数(活性水素/エポキシ基)である。
・エポキシ樹脂:第1表と同様
・チオール硬化剤:第2表の硬化剤(2)と同様
・マイクロカプセル型硬化促進剤(TPP-S@MC50%、TPP-S@MC10%):上記のとおり製造したマイクロカプセル型硬化促進剤
・硬化促進剤1:第2表のTPP-Sと同様
・硬化促進剤2:第2表のTPTP-Sと同様
・球状シリカ1:表面が疎水処理されたシリカ球状微粒子(商品名X-24-9404、平均粒径50nm、信越化学工業株式会社製)
・球状シリカ2:表面が疎水処理されたシリカ球状微粒子(商品名X-24-9163A、平均粒径110nm、信越化学工業株式会社製)
これに比べて実施例II、実施例IIIは、粘度上昇率が低く貯蔵安定性に優れた。
Claims (6)
- 前記熱可塑性樹脂が、ウレタン樹脂、スチレンブタジエンエラストマー、ポリビニルアセタール樹脂、ポリビニルアルコールおよびフェノキシ樹脂からなる群から選ばれる少なくとも1種である請求項1に記載のエポキシ樹脂組成物用硬化促進剤。
- 疎水性の球状シリカをさらに含む請求項1または2に記載のエポキシ樹脂組成物用硬化促進剤。
- 前記マイクロカプセル型硬化促進剤が前記球状シリカで覆われている請求項3に記載のエポキシ樹脂組成物用硬化促進剤。
- エポキシ樹脂、硬化剤としてのポリチオール、および請求項1から4のいずれかに記載のエポキシ樹脂組成物用硬化促進剤を含む1液型熱硬化性エポキシ樹脂組成物。
- 前記硬化剤が有する活性水素の量が、前記エポキシ樹脂が有するエポキシ基に対して、0.5~2.5当量であり、 前記式(I)で表される化合物の量が、前記エポキシ樹脂100質量部に対して、1~50質量部である請求項5に記載の1液型熱硬化性エポキシ樹脂組成物。
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| JPH0673163A (ja) * | 1992-06-26 | 1994-03-15 | Nippon Kayaku Co Ltd | マイクロカプセル型硬化促進剤、これを含むエポキシ樹脂組成物及びその硬化物 |
| JPH0873566A (ja) * | 1994-09-06 | 1996-03-19 | Nippon Kayaku Co Ltd | マイクロカプセル型硬化促進剤、これを含むエポキシ樹脂組成物及びその硬化物 |
| JPH08283383A (ja) * | 1995-04-19 | 1996-10-29 | Nippon Steel Chem Co Ltd | 常温/低温硬化型プリプレグ用エポキシ樹脂組成物およびプリプレグ並びにその硬化方法 |
| JP2001007258A (ja) * | 1999-06-24 | 2001-01-12 | Nitto Denko Corp | 半導体素子封止用シートおよびそれを用いた半導体装置の製法ならびに半導体装置 |
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| CN1934158B (zh) * | 2004-01-22 | 2010-06-09 | 味之素株式会社 | 单组分环氧树脂组合物 |
| KR100561575B1 (ko) | 2004-12-21 | 2006-03-20 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
| JP2006290946A (ja) * | 2005-04-07 | 2006-10-26 | Hokko Chem Ind Co Ltd | エポキシ樹脂用硬化促進剤およびエポキシ樹脂組成物 |
| JP2007326906A (ja) | 2006-06-06 | 2007-12-20 | Yokohama Rubber Co Ltd:The | 硬化性樹脂組成物 |
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2009
- 2009-09-28 CN CN200980144388XA patent/CN102227457B/zh not_active Expired - Fee Related
- 2009-09-28 US US13/128,198 patent/US8084519B2/en not_active Expired - Fee Related
- 2009-09-28 KR KR1020117011501A patent/KR101089540B1/ko not_active Expired - Fee Related
- 2009-09-28 JP JP2010516720A patent/JP4561937B2/ja not_active Expired - Fee Related
- 2009-09-28 WO PCT/JP2009/004946 patent/WO2010052823A1/ja not_active Ceased
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| JPH0673163A (ja) * | 1992-06-26 | 1994-03-15 | Nippon Kayaku Co Ltd | マイクロカプセル型硬化促進剤、これを含むエポキシ樹脂組成物及びその硬化物 |
| JPH0873566A (ja) * | 1994-09-06 | 1996-03-19 | Nippon Kayaku Co Ltd | マイクロカプセル型硬化促進剤、これを含むエポキシ樹脂組成物及びその硬化物 |
| JPH08283383A (ja) * | 1995-04-19 | 1996-10-29 | Nippon Steel Chem Co Ltd | 常温/低温硬化型プリプレグ用エポキシ樹脂組成物およびプリプレグ並びにその硬化方法 |
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| JP2004099778A (ja) * | 2002-09-10 | 2004-04-02 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012093510A1 (ja) * | 2011-01-05 | 2012-07-12 | ナミックス株式会社 | 樹脂組成物 |
| WO2013089100A1 (ja) * | 2011-12-16 | 2013-06-20 | 株式会社スリーボンド | 硬化性樹脂組成物 |
| CN103987754A (zh) * | 2011-12-16 | 2014-08-13 | 三键精密化学有限公司 | 固化性树脂组合物 |
| US9150723B2 (en) | 2011-12-16 | 2015-10-06 | Three Bond Fine Chemical Co., Ltd. | Curable resin composition |
| CN103987754B (zh) * | 2011-12-16 | 2016-06-15 | 三键精密化学有限公司 | 固化性树脂组合物 |
| US11584823B2 (en) | 2016-12-13 | 2023-02-21 | 3M Innovative Properties Company | Epoxy stabilization using substituted barbituric acids |
| US11884850B2 (en) | 2017-09-15 | 2024-01-30 | 3M Innovative Properties Company | Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110213070A1 (en) | 2011-09-01 |
| KR20110063588A (ko) | 2011-06-10 |
| CN102227457A (zh) | 2011-10-26 |
| US8084519B2 (en) | 2011-12-27 |
| JP4561937B2 (ja) | 2010-10-13 |
| CN102227457B (zh) | 2012-10-31 |
| KR101089540B1 (ko) | 2011-12-05 |
| JPWO2010052823A1 (ja) | 2012-03-29 |
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