WO2010039014A3 - 액정고분자를 이용한 발광다이오드 패키지 - Google Patents

액정고분자를 이용한 발광다이오드 패키지 Download PDF

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WO2010039014A3
WO2010039014A3 PCT/KR2009/005671 KR2009005671W WO2010039014A3 WO 2010039014 A3 WO2010039014 A3 WO 2010039014A3 KR 2009005671 W KR2009005671 W KR 2009005671W WO 2010039014 A3 WO2010039014 A3 WO 2010039014A3
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Prior art keywords
light
emitting diode
liquid crystal
crystal polymer
diode package
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PCT/KR2009/005671
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English (en)
French (fr)
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WO2010039014A2 (ko
Inventor
곽창훈
박일우
손종락
이효진
박나나
주성아
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삼성엘이디 주식회사
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Priority to US13/122,323 priority Critical patent/US20110260192A1/en
Priority to CN2009801488221A priority patent/CN102232250A/zh
Priority to EP09818024A priority patent/EP2348551A2/en
Publication of WO2010039014A2 publication Critical patent/WO2010039014A2/ko
Publication of WO2010039014A3 publication Critical patent/WO2010039014A3/ko

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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 액정고분자를 이용한 발광다이오드 패키지를 제공하기 위한 것으로, 액정고분자(Liquid Crystal Polymer)를 이용하여 형성되는 패키지 본체; 상기 패키지 본체에 형성되는 리드프레임; 상기 리드프레임에 실장되는 발광다이오드 칩; 및 형광체를 포함하며 상기 발광다이오드 칩을 봉지하는 수지포장부;를 포함함으로써, 고신뢰성의 발광다이오드 패키지를 제공할 수 있다.
PCT/KR2009/005671 2008-10-01 2009-10-01 액정고분자를 이용한 발광다이오드 패키지 WO2010039014A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/122,323 US20110260192A1 (en) 2008-10-01 2009-10-01 Light-emitting diode package using a liquid crystal polymer
CN2009801488221A CN102232250A (zh) 2008-10-01 2009-10-01 使用液晶聚合物的发光二极管封装件
EP09818024A EP2348551A2 (en) 2008-10-01 2009-10-01 Light-emitting diode package using a liquid crystal polymer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20080096763 2008-10-01
KR10-2008-0096763 2008-10-01

Publications (2)

Publication Number Publication Date
WO2010039014A2 WO2010039014A2 (ko) 2010-04-08
WO2010039014A3 true WO2010039014A3 (ko) 2010-07-01

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PCT/KR2009/005671 WO2010039014A2 (ko) 2008-10-01 2009-10-01 액정고분자를 이용한 발광다이오드 패키지

Country Status (5)

Country Link
US (1) US20110260192A1 (ko)
EP (1) EP2348551A2 (ko)
KR (1) KR101101135B1 (ko)
CN (1) CN102232250A (ko)
WO (1) WO2010039014A2 (ko)

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EP2348551A2 (en) 2011-07-27
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WO2010039014A2 (ko) 2010-04-08
US20110260192A1 (en) 2011-10-27

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