WO2010038733A1 - Composition de résine pour agent adhésif, agent adhésif et feuille adhésive le comprenant, et stratifié pour carte de circuit imprimé l'employant pour son adhésion - Google Patents

Composition de résine pour agent adhésif, agent adhésif et feuille adhésive le comprenant, et stratifié pour carte de circuit imprimé l'employant pour son adhésion Download PDF

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Publication number
WO2010038733A1
WO2010038733A1 PCT/JP2009/066935 JP2009066935W WO2010038733A1 WO 2010038733 A1 WO2010038733 A1 WO 2010038733A1 JP 2009066935 W JP2009066935 W JP 2009066935W WO 2010038733 A1 WO2010038733 A1 WO 2010038733A1
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WO
WIPO (PCT)
Prior art keywords
resin
acid
adhesive
resin composition
polyester resin
Prior art date
Application number
PCT/JP2009/066935
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English (en)
Japanese (ja)
Inventor
秀樹 田中
武 伊藤
達也 粟田
慎太郎 南原
武久 家根
裕子 麻田
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東洋紡績株式会社
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Publication date
Application filed by 東洋紡績株式会社 filed Critical 東洋紡績株式会社
Priority to JP2009554800A priority Critical patent/JP5126239B2/ja
Publication of WO2010038733A1 publication Critical patent/WO2010038733A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/04—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters
    • C08F299/0485—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters from polyesters with side or terminal unsaturations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

L'invention concerne une composition de résine pour un agent adhésif, qui comprend : (a) une résine de polyester contenant un site polymérisable par les radicaux ; (b) un polymère d'un monomère polymérisable par les radicaux ; (c) une résine de polyester modifiée par un polymère d'un monomère polymérisable par les radicaux, la résine (a) et le polymère (b) étant liés l'un à l'autre ; (d) une résine de polyuréthane dont l'indice d'acide est de 100 à 1000 équivalents/106 g compris ; et (e) un composé époxy ayant une structure dicyclopentadiène. Dans la composition de résine, l'anhydride maléique constitue 10 à 60 % en masse compris du monomère polymérisable par les radicaux, la résine (c) a une température de transition vitreuse (Tg(c)) de 0 à 80 ˚C compris, la résine (d) a une température de transition vitreuse (Tg(d)) de -10 à 60 ˚C compris, Tg(c) et Tg(d) satisfont la condition représentée par la formule : 50 ≥ Tg(c)–Tg(d) ≥ 5, et l'indice d'acide de la résine (c) (AV(c) équivalent/106 g) et l'indice d'acide de la résine (d) (AV(d) équivalent/106 g) satisfont la condition représentée par la formule : 8 000 ≥ AV(c)-AV(d) ≥ 200.  L'invention concerne également un agent adhésif, une feuille adhésive et un stratifié pour carte de circuit imprimé, chacun comprenant la composition de résine.
PCT/JP2009/066935 2008-09-30 2009-09-29 Composition de résine pour agent adhésif, agent adhésif et feuille adhésive le comprenant, et stratifié pour carte de circuit imprimé l'employant pour son adhésion WO2010038733A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009554800A JP5126239B2 (ja) 2008-09-30 2009-09-29 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-254366 2008-09-30
JP2008254366 2008-09-30

Publications (1)

Publication Number Publication Date
WO2010038733A1 true WO2010038733A1 (fr) 2010-04-08

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JP (1) JP5126239B2 (fr)
WO (1) WO2010038733A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011129323A1 (fr) * 2010-04-14 2011-10-20 東洋紡績株式会社 Composition de résine pour un agent adhésif, agent adhésif et feuille adhésive la comprenant, et carte à câblage imprimé l'impliquant en tant que couche d'un agent adhésif
WO2011129278A1 (fr) * 2010-04-14 2011-10-20 東洋紡績株式会社 Composition de résine pour agent adhésif, agent adhésif comprenant la composition de résine, feuille adhésive, et carte de circuit imprimé mettant en œuvre la feuille adhésive en tant que couche adhésive
JP2015078298A (ja) * 2013-10-16 2015-04-23 出光興産株式会社 エチルメチルケトン用酸化防止剤、及びそれを配合してなる組成物
JP2015530701A (ja) * 2012-08-03 2015-10-15 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止製品
JP2015217577A (ja) * 2014-05-16 2015-12-07 昭和電工パッケージング株式会社 成形用包装材及び成形ケース
JP2019157005A (ja) * 2018-03-14 2019-09-19 Ｍｃｐｐイノベーション合同会社 接着性樹脂組成物、積層体及び成形体
CN112285273A (zh) * 2020-11-16 2021-01-29 黄河三角洲京博化工研究院有限公司 一种二羟甲基丙酸羟值含量的检测方法
JP2021102711A (ja) * 2019-12-25 2021-07-15 東洋インキＳｃホールディングス株式会社 樹脂組成物及び接着剤組成物の製造方法

Citations (7)

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JPH04248890A (ja) * 1991-01-25 1992-09-04 Nissan Motor Co Ltd 接着剤組成物
JPH0632882A (ja) * 1992-05-19 1994-02-08 Mitsui Petrochem Ind Ltd 接着剤成分および接着性ポリエステル組成物
JPH06240213A (ja) * 1993-02-19 1994-08-30 Mitsui Mining & Smelting Co Ltd 接着剤塗布銅箔及びそれを用いた銅張積層板
JP2000129236A (ja) * 1998-10-27 2000-05-09 Hitachi Chem Co Ltd 水性接着剤用樹脂組成物及びフィルム接着物の製造法
JP2003027030A (ja) * 2001-07-19 2003-01-29 Nitto Shinko Kk 耐湿熱性ホットメルト接着剤組成物
JP2008007720A (ja) * 2006-06-30 2008-01-17 Toyobo Co Ltd ハイブリッド樹脂水分散体、及びこれを用いた接着剤、コーティング剤、塗料
JP2008038111A (ja) * 2006-08-10 2008-02-21 Nippon Steel Chem Co Ltd フィルム状接着剤及びそれを使用する半導体パッケージの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04248890A (ja) * 1991-01-25 1992-09-04 Nissan Motor Co Ltd 接着剤組成物
JPH0632882A (ja) * 1992-05-19 1994-02-08 Mitsui Petrochem Ind Ltd 接着剤成分および接着性ポリエステル組成物
JPH06240213A (ja) * 1993-02-19 1994-08-30 Mitsui Mining & Smelting Co Ltd 接着剤塗布銅箔及びそれを用いた銅張積層板
JP2000129236A (ja) * 1998-10-27 2000-05-09 Hitachi Chem Co Ltd 水性接着剤用樹脂組成物及びフィルム接着物の製造法
JP2003027030A (ja) * 2001-07-19 2003-01-29 Nitto Shinko Kk 耐湿熱性ホットメルト接着剤組成物
JP2008007720A (ja) * 2006-06-30 2008-01-17 Toyobo Co Ltd ハイブリッド樹脂水分散体、及びこれを用いた接着剤、コーティング剤、塗料
JP2008038111A (ja) * 2006-08-10 2008-02-21 Nippon Steel Chem Co Ltd フィルム状接着剤及びそれを使用する半導体パッケージの製造方法

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487762B (zh) * 2010-04-14 2015-06-11 Toyo Boseki 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板
JP4978753B2 (ja) * 2010-04-14 2012-07-18 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板
US9133300B2 (en) 2010-04-14 2015-09-15 Toyo Boseki Kabushiki Kaisha Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer
CN102782074A (zh) * 2010-04-14 2012-11-14 东洋纺织株式会社 粘合剂用树脂组合物、含有其的粘合剂、粘合性片以及将其作为粘合剂层含有的印制线路板
CN102822304A (zh) * 2010-04-14 2012-12-12 东洋纺织株式会社 胶粘剂用树脂组合物、含有该组合物的胶粘剂、胶粘性片及含有该片作为胶粘剂层的印制线路板
KR20130057965A (ko) * 2010-04-14 2013-06-03 도요보 가부시키가이샤 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착성 시트 및 이것을 접착제층으로서 포함하는 프린트 배선판
KR20130086117A (ko) * 2010-04-14 2013-07-31 도요보 가부시키가이샤 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착성 시트 및 이것을 접착제층으로서 포함하는 프린트 배선판
CN102782074B (zh) * 2010-04-14 2014-06-18 东洋纺织株式会社 粘合剂用树脂组合物、含有其的粘合剂、粘合性片以及将其作为粘合剂层含有的印制线路板
WO2011129323A1 (fr) * 2010-04-14 2011-10-20 東洋紡績株式会社 Composition de résine pour un agent adhésif, agent adhésif et feuille adhésive la comprenant, et carte à câblage imprimé l'impliquant en tant que couche d'un agent adhésif
KR101727353B1 (ko) * 2010-04-14 2017-04-14 도요보 가부시키가이샤 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착성 시트 및 이것을 접착제층으로서 포함하는 프린트 배선판
KR101660083B1 (ko) * 2010-04-14 2016-09-26 도요보 가부시키가이샤 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착성 시트 및 이것을 접착제층으로서 포함하는 프린트 배선판
WO2011129278A1 (fr) * 2010-04-14 2011-10-20 東洋紡績株式会社 Composition de résine pour agent adhésif, agent adhésif comprenant la composition de résine, feuille adhésive, et carte de circuit imprimé mettant en œuvre la feuille adhésive en tant que couche adhésive
JP5688077B2 (ja) * 2010-04-14 2015-03-25 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板
TWI504712B (zh) * 2010-04-14 2015-10-21 Toyo Boseki 黏著劑用樹脂組成物、含有其之黏著劑、黏著劑薄片及含有其作為黏著劑層之印刷配線板
JP2015530701A (ja) * 2012-08-03 2015-10-15 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止製品
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JP2019157005A (ja) * 2018-03-14 2019-09-19 Ｍｃｐｐイノベーション合同会社 接着性樹脂組成物、積層体及び成形体
JP7147195B2 (ja) 2018-03-14 2022-10-05 Ｍｃｐｐイノベーション合同会社 接着性樹脂組成物、積層体及び成形体
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JP2021102711A (ja) * 2019-12-25 2021-07-15 東洋インキＳｃホールディングス株式会社 樹脂組成物及び接着剤組成物の製造方法
CN112285273A (zh) * 2020-11-16 2021-01-29 黄河三角洲京博化工研究院有限公司 一种二羟甲基丙酸羟值含量的检测方法

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