WO2010016588A1 - 基板の保持装置、基板の保持方法および合わせガラスの製造方法 - Google Patents
基板の保持装置、基板の保持方法および合わせガラスの製造方法 Download PDFInfo
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- WO2010016588A1 WO2010016588A1 PCT/JP2009/064056 JP2009064056W WO2010016588A1 WO 2010016588 A1 WO2010016588 A1 WO 2010016588A1 JP 2009064056 W JP2009064056 W JP 2009064056W WO 2010016588 A1 WO2010016588 A1 WO 2010016588A1
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- substrate
- support
- elastic member
- belt
- board
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10706—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being photo-polymerized
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10899—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin
- B32B17/10908—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin in liquid form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10899—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin
- B32B17/10954—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin by using an aligning laminating device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
- B32B2310/025—Electrostatic charges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49998—Work holding
Definitions
- the present invention relates to a substrate holding apparatus, a substrate holding method, and a laminated glass manufacturing method used when manufacturing laminated glass and the like.
- a laminated glass constituted by bonding a pair of glass substrates (substrates) while heating and pressurizing them with an autoclave through a thermoplastic transparent resin film such as polyvinyl butyral (PVB) or a thermally crosslinkable transparent resin film is known. ing.
- a thermoplastic transparent resin film such as polyvinyl butyral (PVB) or a thermally crosslinkable transparent resin film.
- Patent Document 1 discloses an apparatus for manufacturing a liquid crystal panel by pressing a laminated body in which an adhesive is interposed between two upper and lower substrates, crushing to a predetermined gap, and curing the adhesive with ultraviolet rays. .
- a pressure plate that adsorbs an upper substrate and holds it inside the apparatus is supported by a horizontal outer periphery surrounded by a flexible material that is made of a thin metal plate such as stainless steel and can be elastically deformed.
- the flexible material is elastically deformed, and the pressure plate is moved down (lowered) in units of microns to form a substrate. The whole is pressed.
- the liquid crystal panel manufacturing apparatus disclosed in Patent Document 1 has a configuration in which the pressure plate is moved down (lowered) in units of microns, and thus, for example, manufacturing laminated glass that requires a lowering (down) of 0.1 mm or more.
- the flexible material surrounding the pressure plate is deformed when pressure is applied to the fluid and lowers (lowers) the pressure plate in units of microns, but the flexible material gradually stretches in the plane direction according to the deformation, Since the apparent rigidity increases and it becomes difficult to elastically deform, the use of this apparatus has been limited to use when the downward movement (downward movement) is small.
- the apparatus can be used only on a substrate having a predetermined size. Furthermore, it is conceivable to configure the apparatus so as to supply fluids to a plurality of pressure plates, respectively, but a piping member, a control member, and the like are required for this purpose, which complicates the apparatus and increases equipment costs. Another problem will arise. Furthermore, in place of the above-mentioned flexible material, for example, if a spiral part is used in the descending direction such as a torsion spring or a coil spring, not only the structure becomes complicated but also the vertical of the holding part It turned out that the length of the direction increased, the number of parts increased, and it was not compact.
- the present invention has been made in view of such circumstances, using a simple and compact structure, can accurately determine the position of the substrate to be held, can sufficiently ensure the adsorption force of the substrate, Provided are a substrate holding device, a method for holding a substrate, and a method for manufacturing a laminated glass, which can prevent the substrate from dropping off.
- a substrate holding device is a substrate holding device for holding a substrate substantially horizontally and moving it up and down.
- the substrate holding device is supported by at least one of the supporting member and the supporting member.
- the substrate adsorber is relatively wide with respect to the support in a strip shape that is wide in the horizontal direction and thin in the vertical direction between the one end connected to the substrate adsorbent and the other end connected to the support. It is characterized by having a displacement part that is displaced so as to approach and separate in the vertical direction and that is displaced in the horizontal direction.
- the substrate holding method according to the present invention is a substrate holding method for holding the substrate substantially horizontally and moving it up and down, wherein the substrate is supported at least by the support and adsorbs the substrate.
- One substrate adsorbing body, an outer peripheral portion of the substrate adsorbing body, and a region of the support that is horizontally separated from the outer peripheral portion of the substrate adsorbing body are connected at a plurality of locations, and one end that is connected to the substrate adsorbing body; Between the other end connected to the support, it is a strip that is wide in the horizontal direction and thin in the vertical direction, and is displaced so that the substrate adsorber approaches and separates in the vertical direction relative to the support.
- a belt-like elastic member having a displacement portion that is displaced in the horizontal direction, the support body is lowered, and the substrate-adsorbing body comes relatively close to the support body so that the belt-like elastic member is compressed.
- the substrate adsorbent and the support Displacing in a direction crossing a relatively approaching direction, adsorbing the substrate with the substrate adsorbing body, raising the support, and the substrate adsorbing body with the weight of the substrate
- the band-shaped elastic member extends relative to each other and is displaced in the opposite direction of the one direction intersecting the direction in which the substrate adsorbing body and the supporting body are relatively separated from each other. Holding the substrate.
- the substrate adsorbing body and the support body are relatively moved in the vertical direction so as to approach and separate from each other between the substrate adsorbing body and the support body for sucking and holding the substrate.
- An elastically deformable belt-like elastic member that can be connected is provided.
- the band-shaped elastic member is a band that is wide in the horizontal direction and thin in the vertical direction between one end connected to the substrate adsorber and the other end connected to the support, and adsorbs the substrate to the support.
- the body has a displacement portion that is displaced so as to be relatively close to and away from each other in the vertical direction and that is displaced in the horizontal direction.
- the substrate adsorbing body and the support body are relatively moved in the up-and-down direction to approach and separate from each other, and the relative movement in both directions is relatively large compared to the cross-sectional rigidity of the belt-like elastic member with respect to the up-and-down displacement. Regulated by cross-sectional rigidity.
- the displacement portion of the belt-like elastic member is deformed in the horizontal direction when the substrate adsorbing body and the support body are largely separated in the vertical direction, so that the apparent rigidity with respect to the vertical displacement is increased and the vertical displacement is increased. Is prevented from being suppressed.
- the simple and compact structure allows the substrate adsorbing body to cope with large vertical displacements, and the adsorbed and held substrate is restricted from moving horizontally with respect to the support. The accuracy is sufficiently secured.
- the substrate adsorbing body is supported by the support via the belt-shaped elastic member, when the substrate adsorbing body adsorbs the substrate, for example, the substrate does not have sufficient flatness or is inclined. Even in such a case, the belt-like elastic member is deformed, and the substrate adsorbing body is brought into close contact with the shape of the substrate so that the adhesion between the substrate adsorbing body and the substrate is sufficiently secured, and a high adsorbing force is obtained. Is obtained. Accordingly, it is possible to prevent the substrate held by suction from dropping from the substrate suction body.
- the substrate held by the substrate adsorbing body can be moved in a relatively wide range in the approaching and separating direction, it can be used for various applications. In particular, it is possible to cope with a case where the substrate is large in size and easily warps during holding, or the substrate itself originally has a warp.
- the belt-like elastic member is longer than a linear distance between the one end and the other end and is bent or detoured with respect to the straight line of the linear distance. It is preferable to be curved.
- the band-shaped elastic member is longer than the linear distance between both ends between the one end connected to the substrate adsorbent and the other end connected to the support.
- the plate-like elastic member is bent or curved so as to detour with respect to the straight line of the linear distance, and becomes a leaf spring that connects both ends, and accurately moves relative to each other in the vertical direction to move the substrate adsorber and the support closer to and away from each other. And relative movement in a direction other than the approaching / separating direction can be further restricted.
- the band-shaped elastic member when the band-shaped elastic member relatively moves in the vertical direction in which the substrate adsorbing body approaches and separates from the support, compared to the relative displacement in the vertical direction, It is preferable that the relative displacement in the horizontal direction between the one end and the other end is small.
- the band-shaped elastic member has a smaller horizontal relative displacement between the one end and the other end compared to the relative displacement in the vertical direction.
- the relative movement of the support in the up and down direction approaching and separating can be performed with high accuracy, and the relative movement in a direction other than the approaching and separating direction can be further restricted.
- the band-shaped elastic member is formed so that the shape on the one end side and the shape on the other end side are substantially line symmetrical with each other in a plane perpendicular to the vertical direction. It is preferable that the one end and the other end are close to each other and face each other.
- the shape of the belt-like elastic member on the one end portion side and the shape of the other end portion side are substantially line symmetrical.
- the rigidity on the other end side is set to be substantially the same.
- the one end portion and the other end portion of the belt-like elastic member are close to each other and disposed opposite to each other, the relative movement between the substrate adsorbing body and the support body can be performed in a wide range with higher accuracy.
- the relative displacement other than the approaching / separating direction between the one end connecting the substrate adsorbent and the other end connecting the support is further suppressed by the degree of freedom of both ends.
- the belt-like elastic member is substantially annular, substantially U-shaped, substantially V-shaped, substantially C-shaped, or substantially ⁇ -shaped within a plane orthogonal to the vertical direction. It is good also as forming in a shape.
- the belt-like elastic member is formed in a substantially annular shape bent in an L shape in a plane orthogonal to the vertical direction, and the substrate adsorbing body has a corner on the outer periphery.
- the corner of the outer periphery of the substrate adsorbing body may be connected to the bent portion of the inner ring portion of the belt-like elastic member, and the support may be connected to the bent portion of the outer ring portion of the band-like elastic member.
- the number of regions including the other end of the band-shaped elastic member connected to the band-shaped elastic member of the support is three or more with respect to one substrate adsorbing body. It is preferable. According to the substrate holding apparatus of the present invention, since the belt-like elastic member can further suppress the rotation of the substrate adsorbing body relative to the support, the one end connecting the substrate adsorbing body of the belt-like elastic member and the other end connecting the support. The relative displacement other than the vertical direction with respect to the portion is further sufficiently suppressed.
- a plurality of sets of the substrate adsorbing body and the belt-like elastic member may be provided below the support.
- the substrate holding apparatus according to the present invention since a plurality of sets of the substrate adsorbing body and the belt-like elastic member are provided, for example, even when a relatively large substrate is adsorbed and held, the plurality of substrate adsorbing bodies are used for adsorption. Thus, a sufficient holding force can be secured.
- these substrate adsorbers are supported by the belt-like elastic members so that they can be in close contact with the inclination of the substrate, the adhesion between each substrate adsorber and the substrate is sufficiently ensured, and higher adsorption is achieved. Power is obtained. Further, it can cope with various substrate sizes.
- the support is formed so as to cover the upper side of the substrate adsorbing body, and an elastically deformable stopper member is provided on the upper surface of the substrate adsorbing body, and the stopper It is good also as a member being able to contact
- the substrate holding apparatus of the present invention when the substrate is adsorbed by the substrate adsorbing body, the substrate adsorbing body is pressed more strongly against the substrate by bringing the stopper member of the substrate adsorbing body into contact with the support. It can be urged to adhere. Therefore, the adsorption force and holding force of the substrate adsorber on the substrate can be more reliably increased.
- the substrate holding device according to the present invention may be arranged in a reduced pressure atmosphere.
- the substrate holding device according to the present invention has a simple structure in which the substrate adsorbent is brought into close contact with the substrate by elastic deformation of the belt-like elastic member, so that the device is disposed in a reduced-pressure atmosphere such as a vacuum. Even in such a case, no special additional equipment is required, and the equipment cost can be reduced.
- the structure is simple and the number of parts is small, the substrate adsorber, the support and the belt-like elastic member can be formed so as to be contained in a relatively small space, and the space for the reduced-pressure atmosphere can be further reduced. it can. Therefore, the time required for evacuation for forming a reduced pressure atmosphere can be reduced, and workability and productivity are improved.
- a reduced-pressure atmosphere for example, even when a resin material is laminated between a pair of substrates facing vertically, and the resin material is uncured and opened to the atmosphere, the upper substrate is adsorbed. Since the substrate adsorbing body thus regulated restricts the movement of the substrate in the horizontal direction, the pair of substrates are prevented from moving relative to each other in the horizontal direction due to wind pressure or the like when the atmosphere is released.
- the substrate adsorbing body may be configured to adsorb the substrate by electrostatic attraction force.
- the substrate holding apparatus of the present invention since the substrate adsorbing body adsorbs the substrate by electrostatic adsorption force, the adsorption and release of the substrate can be performed easily and in a short time, and a plurality of substrates are adsorbed repeatedly and continuously. Even in such a case, the adsorption force is stably secured. Therefore, workability and productivity are improved.
- the present invention is a method for producing a laminated glass, in which a curable resin material is interposed between a pair of substrates opposed to each other in the vertical direction, and then the resin material is cured.
- a body at least one substrate adsorber that is supported by the support and adsorbs the upper substrate of the pair of substrates, an outer periphery of the substrate adsorber, and an outer periphery of the substrate adsorber of the support in a horizontal direction
- the support is connected to a plurality of separated areas at a plurality of locations, and is formed in a strip shape that is wide in the horizontal direction and thin in the vertical direction between one end connected to the substrate adsorbent and the other end connected to the support.
- a belt-like elastic member having a displacement portion that is displaced so that the substrate adsorbing body approaches and separates in a vertical direction relative to the body, and that horizontally displaces, and lowers the support to Body relative to said support Approaching the band-like elastic member to be compressed and displacing in a direction intersecting the direction in which the substrate adsorbing body and the support body are relatively close to each other, and adsorbing the upper substrate with the substrate adsorbing body
- the support is raised, the substrate adsorber is relatively separated from the support by the weight of the upper substrate, the band-like elastic member is extended, and the substrate adsorber and the support are relatively Displacing in the opposite direction of the one direction intersecting with the direction of separating the substrate, and holding the upper substrate by the substrate adsorbent, and the lower substrate of the pair of substrates is cured between the upper substrate
- a step of arranging the resin material made of a conductive resin composition so as to face the lower side of the upper substrate, and lowering
- the support body descends in a state where the upper substrate is spaced apart and disposed below the substrate adsorbing body, and the substrate adsorbing body and the upper substrate approach each other.
- the support further descends after the substrate adsorbing body comes into contact with the upper surface of the upper substrate, the belt-like elastic member is compressed in the vertical direction and intersects in a direction in which the substrate adsorbing body and the support relatively approach each other. Displacement in the direction causes the substrate adsorbing body to be in close contact with the shape of the upper surface of the upper substrate. Accordingly, the upper substrate is reliably adsorbed by the substrate adsorbing body.
- the substrate adsorbent adheres along the shape of the upper surface of the upper substrate, so that the upper substrate is reliably adsorbed. Can be done.
- the substrate adsorber is separated from the support by the weight of the upper substrate, and the belt-like elastic member extends in the vertical direction and the substrate adsorbs.
- the body and the support are displaced in the opposite direction of the one direction intersecting with the relatively separated direction, and the upper substrate is raised and held in the vertical direction.
- the cross-sectional rigidity with respect to the horizontal displacement is larger than the cross-sectional rigidity with respect to the vertical displacement of the belt-like elastic member, the horizontal relative displacement between the substrate adsorbing body and the support body is restricted, and the adsorbed upper substrate A movement in a direction other than the vertical direction is prevented, and the horizontal position accuracy of the upper substrate is sufficiently ensured.
- the upper substrate held by the substrate adsorbent is moved only in the vertical direction.
- the relative positional accuracy in the horizontal direction between the upper substrate and the lower substrate is sufficiently secured.
- the resin material is made of a curable resin composition, the workability is excellent and the yield of the material is good as compared with the conventional case where a resin film or the like formed as a resin material is used.
- the upper substrate may be adsorbed using a plurality of sets of the substrate adsorbing body and the belt-like elastic member.
- the upper substrate is adsorbed using a plurality of sets of the substrate adsorbing body and the band-shaped elastic member, even when adsorbing the upper substrate having a relatively large area, for example, a plurality of substrates Sufficient adsorption power can be secured by adsorption with an adsorbent.
- these substrate adsorbers are supported on the belt-like elastic members so that they can be tilted so as to be in close contact with the shape of the upper surface of the upper substrate, so that the adhesion between each substrate adsorber and the upper substrate is sufficiently ensured.
- the adsorptive power is more enhanced.
- it can respond to various sizes of the upper substrate.
- the step of opposingly arranging in the step of opposingly arranging, the outer periphery of the resin material of the lower substrate is surrounded by a sealing member, and the lower substrate is disposed oppositely to the lower side of the upper substrate.
- the step of adhering includes the step of adhering the pair of substrates in a reduced pressure atmosphere with the resin material and the seal member interposed therebetween, and the pressure reduction between the step of adhering and the step of curing It is good to include the process of crimping
- the outer periphery of the resin material is surrounded by the sealing member, and the resin material is sealed by closely contacting the pair of substrates with the resin material and the sealing member interposed therebetween. State. Therefore, after a pair of substrates are brought into close contact with each other with a resin material and a sealing member sandwiched in a reduced pressure atmosphere such as a vacuum, the pressure in the reduced pressure atmosphere is increased by releasing the air, etc. Thus, the resin material is diffused without a gap between the pair of substrates. Therefore, the filling of the resin material between the substrates can be performed easily and accurately.
- the substrate holding apparatus and the substrate holding method according to the present invention since the substrate adsorbing body is closely attached and adsorbed along the inclination of the upper surface of the substrate using a simple and compact structure, a high adsorbing force is obtained. Thus, it is possible to reliably prevent the substrate from falling off when holding the adsorbed substrate.
- the substrate adsorbed and held by the substrate adsorbing body is moved only in the direction in which the substrate adsorbing body and the support come close to each other, the positional accuracy of the substrate is sufficiently secured. Furthermore, since the substrate adsorbed and held by the substrate adsorbing body can be moved in a relatively wide range in the approaching and separating direction, it can be used for various applications.
- the substrate adsorber adheres closely along the shape of the upper substrate and adsorbs the upper substrate, so that a high adsorbing force is obtained and the upper substrate is prevented from falling off. Is done. Further, since the upper substrate held by the substrate adsorbing body moves only in the vertical direction, the relative positional accuracy in the horizontal direction between the upper substrate and the lower substrate is sufficiently ensured.
- FIG. 2 is a schematic plan view seen from AA in FIG. It is the top view and side view which expand and show the C section of FIG.
- FIG. 2 is a sectional side view showing a schematic structure of a vacuum chamber in which a substrate holding device concerning one embodiment of the present invention is installed.
- It is a sectional side view explaining adsorption
- FIG. 8 is a schematic plan view seen from DD in FIG. 7. It is a schematic plan view which shows the other example of the relative position of the some electrostatic chuck and upper board
- FIG. 1 is a side sectional view showing a schematic configuration of a substrate holding apparatus according to an embodiment of the present invention
- FIG. 2 is a schematic plan view seen from AA in FIG. 1
- FIG. 3 is an enlarged view of a portion C in FIG.
- FIG. 4 is a side sectional view showing a schematic configuration of a vacuum chamber in which a substrate holding device according to an embodiment of the present invention is installed
- FIG. 5 is according to an embodiment of the present invention.
- FIG. 6 is a side sectional view for explaining holding of a substrate in a substrate holding apparatus according to an embodiment of the present invention
- FIG. 7 is an embodiment of the present invention.
- FIG. 8 is a schematic sectional side view for explaining the relative positions of the plurality of electrostatic chucks and the upper substrate of the substrate holding apparatus according to FIG. 8,
- FIG. 8 is a schematic plan view seen from DD of FIG. 7, and
- FIG. FIG. 4 is a schematic diagram showing another example of the relative positions of the plurality of electrostatic chucks and the upper substrate of the substrate holding apparatus according to the embodiment.
- FIG. 10 is an enlarged plan view and a side sectional view showing an E portion of FIG. 9, and FIGS. 11 to 13 use a plurality of electrostatic chucks of a substrate holding device according to an embodiment of the present invention.
- FIG. 14 is a schematic side sectional view for explaining the holding of the upper substrate, FIG.
- FIGS. 14 is a schematic view for explaining the manufacturing procedure of laminated glass using the substrate holding device according to one embodiment of the present invention, and FIGS. It is a schematic plan view which shows the other example of the leaf
- the side cross-sectional views of the substrate holding device in FIGS. 1, 4 to 7 and 10 to 14 show side cross sections as viewed from BB in FIG.
- a glass substrate having a transparent soda lime composition usually used as a window material for buildings, vehicles, and the like is used as a pair of glass substrates (substrates) used for manufacturing the laminated glass of the present embodiment.
- Each of the pair of substrates is formed in a substantially rectangular plate shape, and the outer dimensions in the surface direction are the same.
- the external dimensions of the substrate are variously set, for example, within a range of about ⁇ 150 mm ⁇ 300 mm to ⁇ 4000 mm ⁇ 3000 mm, and the thickness of one glass substrate constituting the laminated glass is about 2 to 15 mm.
- the mass density of the substrate is about 2.5 g / cm 3. For example, when the size of one glass substrate is 4000 mm ⁇ 3000 mm and the plate thickness is 6 mm, the mass is about 180 kg.
- a resin material is disposed between the pair of substrates, these substrates are previously treated with a coupling agent selected from a silane compound or a titanium compound at least one of the surfaces in contact with the resin material. It is preferable. That is, a coupling agent is applied to the substrate in advance as a surface treatment agent and bonded to the surface by heating or the like. By using the surface-treated substrate in this way, the adhesion of the resin material to the substrate is improved, and the mechanical strength of the laminated glass is improved.
- a curable resin material having fluidity is used.
- the curable resin material include curable resin materials such as a photocurable resin composition having a property of being cured by light such as ultraviolet rays and a thermosetting resin composition having a property of being cured by heating.
- a photocurable resin composition containing a polymerization curable compound such as an acrylate compound or a methacrylate compound and a photopolymerization initiator is preferable.
- the curable resin material is sealed between the substrates, and is cured after being opened to the atmosphere as will be described later.
- the substrate holding device when stacking and manufacturing such a pair of substrates and a laminated glass made of a resin material, adsorbs and holds the upper substrate disposed above among the pair of substrates in a hollow state. In addition, the held upper substrate is lowered toward the lower substrate disposed below, and the upper substrate, the resin material, and the lower substrate are sequentially laminated.
- a substrate holding device 10 covers an electrostatic chuck (substrate attracting body) 1 that attracts and holds the upper surface of an upper substrate (substrate) and covers the upper portion of the electrostatic chuck 1.
- a plurality of strip-shaped leaf spring members that are arranged between the formed support body 2 and the electrostatic chuck 1 and the support body 2 to connect the electrostatic chuck 1 and the support body 2 and can be elastically deformed.
- the support 2 is provided with a plurality of sets of the electrostatic chuck 1 and the leaf spring members 4.
- the electrostatic chuck 1 is formed in a substantially rectangular plate shape or a substantially rectangular parallelepiped shape, and for example, its outer dimensions are set to ⁇ 150 mm ⁇ 150 mm and a thickness of about 25 mm.
- a dielectric film 1a made of a polyimide film or the like in which an electrode pattern is embedded is formed on the lower surface of the electrostatic chuck 1 (the lower surface in FIG. 1).
- the electrostatic chuck 1 is electrically connected to a high voltage power source (not shown), and is configured to adsorb the upper substrate by electrostatic adsorption force when a high voltage is applied between the upper substrate and the opposite surface. It is said that.
- the support 2 has a projecting portion 2b having a substantially rectangular frame shape or a substantially rectangular frame shape on the lower surface of a main body portion 2a having a substantially rectangular plate shape or a substantially rectangular parallelepiped shape.
- the leaf spring member 4 is made of, for example, a thin metal material or resin material having a thickness of about 0.1 mm to 1 mm, and is disposed in the vicinity of the four corners of the electrostatic chuck 1 on the plan view.
- the width of the leaf spring member 4 is preferably, for example, 5 mm or more and 100 mm or less, and more preferably 10 mm or more and 50 mm or less.
- the width is significantly larger than the thickness of the leaf spring member 4, so that the electrostatic chuck 1 and the support 2 are compared with the bending rigidity in the vertical direction in which the electrostatic chuck 1 and the support 2 are moved closer to and away from each other.
- the bending rigidity and the torsional rigidity in directions other than the approaching and separating directions are remarkably increased, and the electrostatic chuck 1 and the support body 2 are relatively moved in the approaching and separating directions and directions other than the approaching and separating directions.
- the relative movement can be restricted.
- the bending rigidity of the leaf spring member 4 is proportional to the cube of the length in the deformation direction of the target cross section and proportional to the length in the direction orthogonal thereto.
- thick portions may be provided at both ends in the width direction of the plate spring member 4.
- Each of the leaf spring members 4 includes a displacement portion composed of a pair of leaf spring elements 4A and 4B.
- This displacement portion is the shortest distance from the support 2 to the electrostatic chuck 1 on the plan view in FIG. It is formed to bend so as to detour with respect to a straight line (straight line distance).
- the upper surface of the outer portion is connected to the lower surface of the protruding portion 2 b of the support 2. That is, the leaf spring member 4 is formed in a substantially annular shape bent in an L shape as a whole in a plane (horizontal plane) perpendicular to the vertical direction in which the electrostatic chuck 1 and the support 2 approach and separate from each other.
- the outer peripheral corner of the substantially flat electrostatic chuck 1 is connected to the central portion (one end portion described later) of the inner inner ring portion in FIG.
- the support body 2 is connected to a central portion (the other end portion described later) of the outer ring portion, that is, a bent portion.
- plate spring member 4 in the protrusion part 2b of the support body 2 is made into four places of four corners on the top view of the protrusion part 2b. .
- each of the leaf spring elements 4A and 4B is formed in a substantially strip shape or a substantially rectangular thin plate shape, and the pair of leaf spring elements 4A and 4B extend in substantially the same direction on the plan view. They are arranged close to each other, and one end (left side in FIG. 3) in the extending direction is connected by a connecting portion 13 to be integrated.
- the plate spring member 4 is formed in a substantially annular shape, a substantially U shape, a substantially V shape, a substantially C shape, or a substantially ⁇ shape on the plan view.
- the other end (one end) 11 in the extending direction of the leaf spring element 4B (right side in FIG. 3) is connected to the electrostatic chuck 1, and the other end in the extending direction of the leaf spring element 4A ( The other end portion 12 is connected to the protruding portion 2 b of the support 2. Further, the other end portion 12 of the leaf spring element 4A and the other end portion 11 of the leaf spring element 4B are disposed close to each other on the plan view.
- the shape of the leaf spring element 4B on the one end portion 11 side in the leaf spring member 4 and the shape of the leaf spring element 4A on the other end portion 12 side are between the one end portion 11 and the other end portion 12 and the leaf spring element 4A.
- the lines are substantially symmetrical with respect to each other across a virtual line L1 extending in parallel with the extending direction of 4B.
- a substantially disc-like stopper base 5 is detachably disposed on the upper surface of the electrostatic chuck 1 at the approximate center of the upper surface.
- a substantially ring-shaped stopper member 6 made of deformable silicon rubber or a coil spring is disposed so as to protrude upward from the stopper base 5.
- the stopper member 6 has sufficient elasticity. For example, when the material is made of silicon rubber, the Shore hardness (A) is set to about 50. As shown in FIG. 1, the upper surface of the stopper member 6 is separated from the lower surface of the main body 2 a of the support 2.
- the substrate holding device 10 is installed inside a box-like sealable vacuum chamber 7 and can be moved up and down. Specifically, a plurality of through holes 7b are formed in the upper surface 7a of the vacuum chamber 7, and rod-like lifting shafts 8 extending in the vertical direction are respectively inserted into the through holes 7b.
- the lower and upper shafts 8 are connected to the upper surface of the main body 2a of the support 2 of the substrate holding device 10, and the upper ends are connected to the lifting frame 8b to be integrated.
- Each elevating shaft 8 has a substantially bellows shape or a substantially cylindrical shape and is accommodated in a metal bellows 8a that is vertically extendable. These metal bellows 8a have their upper ends in airtight contact with the lifting frame 8b and their lower ends in airtight contact with the upper surface 7a, and the lifting shaft 8 is airtightly penetrated through the through hole 7b.
- the elevating frame 8b is connected to an elevating drive source (not shown) and can elevate in the vertical direction.
- the substrate holding device 10 can be moved up and down in the sealed vacuum chamber 7 by moving the lifting frame 8 b up and down.
- a plurality of rod-like support pins 9 are erected on the bottom surface of the vacuum chamber 7 so as to face each electrostatic chuck 1 arranged above the bottom surface.
- the vacuum chamber 7 is provided with positioning means (not shown) for accurately positioning the substrate placed on the support pins 9 in the horizontal direction.
- a decompression means such as a vacuum pump (not shown) is provided outside the vacuum chamber 7 and connected to the vacuum chamber 7, and the inside of the vacuum chamber 7 is made a vacuum atmosphere (decompression atmosphere) by evacuation. ing. Further, the vacuum chamber 7 is provided with an open / close damper (not shown) and the like so that the inside of the vacuum atmosphere can be opened to the atmosphere and returned to the atmospheric pressure atmosphere.
- the degree of reduced pressure is preferably 0.1 to 1000 Pa, more preferably 1 to 100 Pa.
- the upper substrate 21 is inserted into the vacuum chamber 7 out of a pair of substrates of the laminated glass to be manufactured, and the upper substrate 21 is placed on the support pins 9 in a positioned state by using positioning means.
- the substrate holding device 10 is lowered, and the dielectric film 1 a of the electrostatic chuck 1 is brought into contact with the upper surface of the upper substrate 21.
- the leaf spring member 4 is elastically deformed as will be described later, and the stopper member 6 on the upper surface of the electrostatic chuck 1 and the lower surface of the main body portion 2 a of the support body 2 approach each other. As shown in FIG. 5B, the upper surface of the stopper member 6 comes into contact with the lower surface of the main body portion 2a.
- the stopper member 6 and the support 2 are further moved relative to each other in the vertical direction while the stopper member 6 is in contact with the main body portion 2a, the stopper member 6 is elastically deformed, and the elastic member is urged by the urging force of the elastic deformation.
- the upper surface of the substrate 21 is strongly pressed against the dielectric film 1 a of the electrostatic chuck 1.
- the electrostatic chuck 1 attracts the upper substrate 21 by electrostatic attraction force.
- the biasing force of the elastic deformation of the stopper member 6 is not used as in the prior art.
- the attracting force is about 2 to 4 times. Is secured.
- the substrate holding device 10 is raised as shown in FIG. 6 to hold the upper substrate 21 in the hollow inside the vacuum chamber 7.
- FIG. 6B when the flatness of the upper substrate 21 is not sufficient or inclined with respect to the horizontal direction, the electrostatic chuck 1 in contact with the upper substrate 21 is The leaf spring member 4 is deformed and tilted along the inclination of the upper substrate 21, adheres to and adsorbs to the upper substrate 21, and rises in this state to hold the upper substrate 21 hollow.
- the leaf spring member 4 is configured such that the electrostatic chuck 1 is pressed against the upper substrate 21 or supports the weight of the electrostatic chuck 1 or the upper substrate 21 as described above. Then, the one end portion 11 of the leaf spring element 4B and the other end portion 12 of the leaf spring element 4A are relatively moved in the vertical direction.
- the leaf spring elements 4 ⁇ / b> A and 4 ⁇ / b> B are integrally formed by connecting the end portions on one side (left side in FIG. 3) with the connection portion 13.
- the connection part 13 can move to the extending longitudinal direction (left-right direction in FIG. 3), in the short side direction (up-down direction in FIG. 3 (a)), in the horizontal surface of leaf
- the support 2 and the electrostatic chuck 1 respectively connected to the other side (the right side in FIG. 3) of the leaf spring elements 4A and 4B are restrained from moving relative to each other in the longitudinal direction and the short direction. Yes.
- the leaf spring member 4 extends in the vertical direction, and the one end portion 11 and the other end portion 12 are separated from each other in the vertical direction. As described above, the one end portion 11 and the other end portion 12 of the leaf spring member 4 are relatively moved only in the vertical direction.
- the deformation of the leaf spring member 4 is caused by the elastic deformation of the leaf spring element 4B on the one end portion 11 side and the elastic deformation of the leaf spring element 4A on the other end portion 12 side when viewed from the side surface.
- the arrangement of the plurality of electrostatic chucks 1 and the stopper members 6 facing the upper substrate 21 will be described with reference to FIGS.
- the upper substrate 21 of various sizes is sucked and held. Therefore, the stoppers of the electrostatic chucks 1 that face the upper substrate 21 according to the outer shape of the upper substrate 21 on the plan view.
- Various arrangements of the member 6 can be set.
- the stopper member 6 provided on the upper surface side of each electrostatic chuck 1 is movable within the outer shape of the electrostatic chuck 1. That is, the lower surface of the stopper base 5 that supports the stopper member 6 and the electrostatic chuck 1 that faces the lower surface are provided with opposing pins and a plurality of holes, respectively, and the holes for inserting the pins are appropriately selected. Thus, various arrangements of the stopper member 6 can be set.
- the arrangement of the stopper members 6 is any The position may be, for example, disposed at the center of the electrostatic chuck 1. Further, as shown in FIG. 9, when there is a plurality of electrostatic chucks 1 that are arranged so as to protrude outside the outer region of the upper substrate 21 on the plan view, the stopper member of the electrostatic chuck 1
- the arrangement of 6 is set as follows.
- the stopper member 6 of the electrostatic chuck 1 that protrudes outside the region of the outer shape of the upper substrate 21 is such that the stopper member 6 extends over the entire circumferential direction on the plan view. It arrange
- the stopper member 6 when the stopper member 6 cannot be disposed so as to face the upper substrate 21 over the entire circumferential direction even if the setting of the arrangement of the stopper member 6 is changed, the stopper The member 6 is disposed outside the outer region of the upper substrate 21 so as not to face the upper substrate 21.
- each electrostatic chuck 1 abuts on the upper substrate 21 and the plate
- Each spring member 4 is elastically deformed and brought into close contact with the inclination of the upper substrate 21 to adsorb and hold the upper substrate 21 in a hollow state.
- the stopper member 6 of the electrostatic chuck 1 As shown in FIG. 9A, among the plurality of electrostatic chucks 1, there is one that is disposed so as to protrude out of the region of the outer shape of the upper substrate 21 on the plan view, and the stopper member 6 of the electrostatic chuck 1.
- the stopper member 6 When the stopper member 6 is arranged so as to face the upper substrate 21 over the entire circumferential direction by changing the arrangement of the electrostatic chuck 1, all the electrostatic chucks 1 are in close contact with the upper substrate 21 as shown in FIG. 12. Then, the upper substrate 21 is adsorbed and held hollow.
- the electrostatic chuck 1 ⁇ / b> A that protrudes outward (the right end in FIG. 13) is not attracted to the upper substrate 21, and the other electrostatic chucks 1 hold the upper substrate 21. Adsorb and hold hollow.
- the electrostatic chuck 1 attracting and holding the upper substrate 21 elastically deforms the leaf spring member 4 by the weight of the upper substrate 21 and the electrostatic chuck 1 as shown in FIG. Is also disposed below, a slight gap is provided between the lower surface of the electrostatic chuck 1 ⁇ / b> A and the upper surface of the upper substrate 21.
- FIG. 14 (a) in a state where the lower substrate 22 of the pair of transparent substrates 21 and 22 is arranged substantially horizontally, a highly viscous curing in which spacer particles are mixed in the vicinity of the outer periphery of the upper surface thereof.
- a sealing resin (seal member) 23 made of an adhesive resin composition is applied in a substantially rectangular frame shape.
- resin materials 24 made of a curable resin composition having a low viscosity and a property of being cured by ultraviolet irradiation are arranged at substantially equal intervals. Apply so that it is scattered.
- the application of the resin material 24 is set to a pitch of about 30 mm, for example, and the amount of the resin material 24 to be applied is surrounded by the seal resin 23 and the pair of substrates 21 and 22 when the substrates 21 and 22 described later are in close contact with each other.
- the gap to be sealed is set in advance so as to be filled with the resin material 24.
- the supply of the sealing resin 23 and the resin material 24 is performed by, for example, a dispenser, a die coater, or the like.
- the upper substrate 21 is held in the vacuum chamber 7 in advance in the vacuum chamber 7 by using the substrate holding device 10 in advance as described above.
- the lower substrate 22 coated with the sealing resin 23 and the resin material 24 is inserted on the upper surface so as to face the lower side of the upper substrate 21, and the lower substrate 22 is positioned by the positioning means.
- the vacuum chamber 7 is sealed and evacuated using a decompression means, and the inside of the vacuum chamber 7 is decompressed to form a vacuum atmosphere.
- the upper substrate 21 is lowered using the substrate holding device 10, and the pair of substrates 21 and 22 are adhered and laminated with the sealing resin 23 and the resin material 24 interposed therebetween. At this time, the upper substrate 21 is in close contact with the lower substrate 22 due to the weight of the upper substrate 21 and the electrostatic chuck 1.
- the inside of the vacuum chamber 7 is opened to the atmosphere to increase the pressure, and the original atmospheric pressure atmosphere is restored. Due to the pressure difference between the internal pressure and the external pressure of the portion of the resin material 24 sealed with the seal resin 23, the substrates 21 and 22 are pressed in the vertical direction to obtain the laminate 25. Even if a space that is not filled with the resin material 24 remains between the substrates 21 and 22 that have been sealed before being released to the atmosphere, the volume of the remaining space is not increased by the addition of the substrates 21 and 22 by the release to the atmosphere. The possibility that a space that is not filled with the resin material 24 remains between the sealed substrates 21 and 22 is reduced by the pressure. Similarly, even if bubbles exist in the resin material 24 before opening to the atmosphere, the bubbles are likely to disappear due to opening to the atmosphere.
- the sealing resin 23 and the resin material 24 are cured by uniformly irradiating ultraviolet rays from the upper substrate 21 side and the lower substrate 22 side of the laminate 25 using a high-pressure mercury lamp or the like. Let In this way, the laminated glass P is manufactured.
- the electrostatic chuck 1 and the support 2 are connected to each other between the electrostatic chuck 1 and the support 2 that hold the upper substrate 21 by suction.
- a leaf spring member 4 is provided that is connected so as to be relatively movable in the vertical direction of approaching and separating. That is, when the electrostatic chuck 1 and the support 2 move relative to each other, the leaf spring element 4A is formed by bending so as to bypass the portion between the one end portion 11 and the other end portion 12 of the leaf spring member 4.
- the displacement part which consists of a pair of 4B is displaced to the direction which cross
- the positional accuracy of the upper substrate 21 in the horizontal direction is sufficiently ensured.
- the positional accuracy in the horizontal direction on a 4000 mm ⁇ 3000 mm substrate is preferably within ⁇ 0.5 mm, and more preferably within ⁇ 0.1 mm.
- the electrostatic chuck 1 is supported by the support 2 via the leaf spring member 4, when the electrostatic chuck 1 attracts the upper substrate 21, for example, the upper surface of the upper substrate 21 has sufficient flatness. Even when the plate spring member 4 is not tilted or inclined with respect to the horizontal direction, the leaf spring member 4 is deformed, and the electrostatic chuck 1 is in close contact with the upper surface of the upper substrate 21 so as to be in contact therewith. Therefore, the adhesiveness between the electrostatic chuck 1 and the upper substrate 21 is sufficiently ensured, and a high attracting force is obtained.
- the upper substrate 21 held by the electrostatic chuck 1 can be moved in a relatively wide range in the vertical direction, it can be used for various applications.
- the shape of the leaf spring element 4B on the one end portion 11 side in the displacement portion of the leaf spring member 4 and the shape of the leaf spring element 4A on the other end portion 12 side are formed substantially symmetrical with respect to the virtual line L1. Therefore, the rigidity on the one end 11 side and the rigidity on the other end 12 side of the displacement part are set to be substantially the same, and the one end 11 and the other end 12 of the leaf spring member 4 are close to each other and arranged to face each other. Therefore, the relative movement in the vertical direction between the electrostatic chuck 1 and the support 2 can be performed over a wide range with higher accuracy, and the movement in the horizontal direction can be defined.
- the electrostatic chuck 1 and the leaf spring member 4 are provided, even when the upper substrate 21 having a relatively large area is attracted and held, for example, it is attracted and sufficiently held by the plurality of electrostatic chucks 1. Power can be secured. Further, the electrostatic chuck 1 is supported by the leaf spring member 4 so as to be able to tilt in close contact with the inclination of the upper surface of the upper substrate 21, and thus the adhesion between each electrostatic chuck 1 and the upper substrate 21. Is sufficiently secured, and higher adsorption power can be obtained. Moreover, it can respond to various sizes of the upper substrate 21.
- the spring constant of the leaf spring member 4 is set to 2 kgf / mm, even if the vertical deviation between the plurality of electrostatic chucks 1 is 0.2 mm, the attractive force is reduced by about 20%. Therefore, a sufficient substrate holding force is ensured.
- the stopper member 6 of the electrostatic chuck 1 and the main body portion 2 a of the support 2 are brought into contact with each other, and the stopper member 6 is elastically deformed. 1 can be urged and brought into close contact with the upper substrate 21 more strongly. Therefore, the suction force and holding force with respect to the upper substrate 21 of the electrostatic chuck 1 are more reliably increased.
- the substrate holding device 10 has a simple configuration in which the electrostatic chuck 1 is in close contact with the upper substrate 21 by the deformation of the plate spring member 4, for example, a conventional fluid pressurization method is used. It is not necessary to use a complicated configuration or control for individually controlling the vertical movement of each electrostatic chuck 1. Furthermore, even if it is a case where it is arrange
- the electrostatic chuck 1, the support 2 and the leaf spring member 4 can be formed so as to be accommodated in a relatively small space in the vertical direction, and the inside of the vacuum chamber 7 which is a reduced pressure atmosphere is provided.
- the area can be further saved. Therefore, the time required for evacuation for forming a reduced pressure atmosphere can be further reduced, and workability and productivity are improved.
- the seal resin 23 and the resin material 24 are vacuumed while being uncured. Even when the chamber 7 is opened to the atmosphere, the electrostatic chuck 1 that attracts the upper substrate 21 restricts the movement of the upper substrate 21 in the horizontal direction. It is prevented that they are displaced due to relative movement in the horizontal direction.
- the electrostatic chuck 1 attracts the upper substrate 21 by electrostatic attraction force, the upper substrate 21 can be attracted and released easily and in a short time, and a plurality of upper substrates 21 can be attracted repeatedly and continuously. Even in this case, the adsorption force is secured stably. Therefore, workability and productivity are improved.
- the sealing resin 23 and the resin material 24 are made of a curable resin composition, the workability is excellent and the yield of the material is higher than when a resin film or the like formed as the resin material 24 is used as in the past. Good.
- the reduced pressure atmosphere is released to the atmosphere and the pressure is increased, whereby the substrate 21 and The two materials 22 are more strongly pressed together, and the resin material 24 is diffused between the substrates 21 and 22 without a gap. Therefore, the degassing of the resin material 24 and the filling between the substrates 21 and 22 can be performed easily and accurately.
- the leaf spring member 4 includes a pair of leaf spring elements 4A and 4B, and a displacement portion that is bent so as to detour is formed at a portion between the one end portion 11 and the other end portion 12.
- the leaf spring member 4 only needs to have a displacement portion that bends or curves so as to bypass, and is not limited to this embodiment.
- the leaf spring member 31 in FIG. 15 has strip-like leaf spring elements 31A and 31B extending in the same direction.
- the leaf spring elements 31A and 31B are arranged to face each other so as to overlap each other on a plan view and close to each other in the vertical direction. This is a case where the detour or bend between the both ends of the leaf spring member 4 is not in the horizontal direction but in the vertical direction.
- the leaf spring elements 31A and 31B are integrated by connecting one end (left side in FIG. 15) in the extending direction with a connecting portion 33.
- the other end portion 11 in the extending direction of the leaf spring element 31B (to the right in FIG. 15) is connected to the electrostatic chuck 1, and the other end portion 12 in the extending direction of the leaf spring element 31A is The support 2 is connected.
- the deformation of the leaf spring member 31 includes the elastic deformation of the leaf spring element 31B on the one end 11 side and the other end 12 side when the leaf spring member 31 is viewed from the side.
- the elastic deformation of the leaf spring element 31A is performed so as to be substantially line symmetric with respect to the virtual line L3 extending in the horizontal direction through the connecting portion 33.
- the leaf spring member 41 in FIG. 16 (a) has a displacement portion composed of substantially L-shaped plate spring elements 41A and 41B and a substantially I-shaped plate spring element 41C.
- the leaf spring elements 41A and 41B are arranged so that the short side portions of the leaf spring elements 41A and 41B are close to each other on the plan view, and one end (the left side in FIG. 16) of the short side portion extends. Are respectively connected to long side portions extending so as to be substantially orthogonal to the short side portions.
- the other end (right side in FIG. 16) of the short side portion of the leaf spring element 41B extends to one end portion 11 connected to the electrostatic chuck 1, and the short side portion of the leaf spring element 41A extends.
- the other end that exists is the other end 12 that is connected to the support 2.
- the long side portions of the leaf spring elements 41A and 41B are formed so as to extend away from each other in the opposite direction with one end portion of the short side portion as a base end. Further, a leaf spring element 41C is disposed close to and opposed to one side of these long side portions of the leaf spring elements 41A and 41B. The leaf spring element 41C is connected at its both ends to the respective distal ends of the long side portions of the leaf spring elements 41A and 41B facing outward. That is, the plate spring member 41 is formed by integrally connecting the plate spring elements 41A, 41B, and 41C with the two connecting portions 43.
- the shape on the one end portion 11 side and the shape on the other end portion 12 side of the leaf spring member 41 on the plan view are parallel to the direction in which the short side portion extends through the middle between the one end portion 11 and the other end portion 12. They are substantially line symmetrical with respect to the extending virtual line L4.
- the two connecting portions 43 are separated from each other on the plan view.
- the plate spring member 41 is compressed in the vertical direction while being displaced, and the one end portion 11 and the other end portion 12 are brought closer to each other in the vertical direction.
- the two connecting portions 43 are displaced in a direction approaching each other on the plan view.
- the leaf spring member 41 extends in the vertical direction, and the one end portion 11 and the other end portion 12 are separated from each other in the vertical direction.
- the one end portion 11 and the other end portion 12 are regulated so as to move relative to each other only in the vertical direction and not to move in any direction other than the vertical direction.
- the deformation of the leaf spring member 41 is caused by the elastic deformation on the one end 11 side and the elastic deformation on the other end 12 side of the leaf spring member 41 when the leaf spring member 41 is viewed from the side. It is performed so as to be substantially line symmetric with respect to each other across an imaginary line passing through the middle between the portion 11 and the other end portion 12 and extending in the horizontal direction.
- connection portions 53 that connect the leaf spring elements 41A and 41B and the leaf spring element 41C are approximately in the direction in which the short sides of the leaf spring elements 41A and 41B extend. It is formed extending in parallel. Further, the shape on the one end portion 11 side and the shape on the other end portion 12 side in the leaf spring member 51 on the plan view pass through the middle of the one end portion 11 and the other end portion 12 in the extending direction of the short side portion. They are formed substantially symmetrical with respect to each other across a virtual line L5 extending in parallel.
- the plate spring member 51 having such a configuration is also restricted so that the one end portion 11 and the other end portion 12 move relative to each other only in the vertical direction and do not move relative to directions other than the vertical direction.
- the deformation of the leaf spring member 51 is caused by the elastic deformation on the one end portion 11 side and the elastic deformation on the other end portion 12 side of the leaf spring member 51 when the leaf spring member 51 is viewed from the side. It is performed so as to be substantially line symmetric with respect to each other across an imaginary line passing through the middle between the portion 11 and the other end portion 12 and extending in the horizontal direction.
- the leaf spring element 61 ⁇ / b> A is formed in a substantially C shape or a substantially ⁇ shape, and both ends of the leaf spring element 61 ⁇ / b> A are formed as one end portion 11 and the other end portion 12. Yes.
- the shape on the one end portion 11 side and the shape on the other end portion 12 side of the leaf spring member 61 on the plan view pass through the middle between the one end portion 11 and the other end portion 12 so that the one end portion 11 and the other end portion 12 face each other.
- the lines are substantially symmetrical with respect to each other across a virtual line L6 extending in a direction intersecting the direction.
- the plate spring member 61 having such a configuration is also regulated such that the one end portion 11 and the other end portion 12 move relative to each other only in the vertical direction and do not move relative to directions other than the vertical direction.
- the deformation of the leaf spring member 61 is caused by the elastic deformation on the one end portion 11 side and the elastic deformation on the other end portion 12 side of the leaf spring member 61 in the side view seen from the vertical direction in FIG. It is performed so as to be substantially line symmetric with respect to each other across an imaginary line passing through the middle between the portion 11 and the other end portion 12 and extending in the horizontal direction.
- the support 2 is provided with a plurality of sets of the electrostatic chuck 1 and the leaf spring member 4.
- the present invention is not limited to this, and one set of the electrostatic chuck 1 and the leaf spring member 4 is provided. Only a set may be provided.
- the protruding portion 2b of the support body 2 has a substantially rectangular frame shape or a substantially rectangular frame shape, and the center of the outer ring portion of the leaf spring member 4 connected to the leaf spring member 4 at the protruding portion 2b of the support body 2 is formed.
- the region including the portion (the other end portion) has been described as having four locations at the four corners of the projecting portion 2b, but other than the leaf spring member 4 connected to the leaf spring member 4 of the projecting portion 2b of the support 2
- the region including the end portion only needs to suppress the rotation of the electrostatic chuck 1.
- the projecting portion 2 b of the support 2 has a substantially triangular frame shape and is connected to the leaf spring member 4 of the projecting portion 2 b.
- the area including the other end of 4 may be three places at the three corners of the protrusion 2b.
- plate spring member 4 of the protrusion part 2b is provided in four places of each side center of the protrusion part 2b. It doesn't matter. Note that the number of leaf spring members and leaf spring elements connected to the protrusion 2b of the support 2 strongly restricts the relative movement in the horizontal direction between the electrostatic chuck 1 and the protrusion 2b of the support 2. Adjust the number according to what. For example, when the restriction in the horizontal direction is made stronger, a larger number of leaf spring elements are installed.
- the upper substrate 21 is attracted and held by using the electrostatic attraction force of the electrostatic chuck 1, but the upper substrate 21 is not limited to this and other attraction force such as an adhesive force is used. May be adsorbed and held.
- the support body 2 has a substantially rectangular plate shape or a substantially rectangular parallelepiped shape and is formed so as to cover the upper side of the electrostatic chuck 1, but the support body 2 supports the electrostatic chuck 1.
- the support 2 may be formed in a substantially frame shape or a ladder shape so as not to cover the upper portion of the electrostatic chuck 1.
- the stopper member 6 is described as being provided. However, when the suction force of the electrostatic chuck 1 to the upper substrate 21 can be sufficiently obtained without using the biasing force of the elastic deformation of the stopper member 6.
- the stopper member 6 may not be provided.
- the substrate holding device 10 is installed in the vacuum chamber 7, and the inside of the vacuum chamber 7 is set to a reduced-pressure atmosphere such as a vacuum so that the pair of substrates 21 and 22 are brought into close contact with the seal resin 23 and the resin material 24.
- a reduced-pressure atmosphere such as a vacuum
- the present invention is not limited to this, and the substrate holding device 10 is installed in an atmospheric pressure atmosphere, and the pair of substrates 21 and 22 are sandwiched between the sealing resin 23 and the resin material 24 in the atmospheric pressure atmosphere. Adhering and stacking may be used.
- the one end portion 11 and the other end portion 12 of the leaf spring member 4 are described as being close to each other with the virtual line L1 interposed therebetween. 12 does not need to be arranged oppositely.
- the leaf spring element 4B on the one end portion 11 side and the leaf spring element 4A on the other end portion 12 side of the leaf spring member 4 are described as being substantially line symmetric with respect to the virtual line L1.
- the present invention is not limited to this.
- the substrate holding device and the substrate holding method of the present invention are useful when manufacturing laminated glass, liquid crystal panels, and the like. It should be noted that the entire contents of the specification, claims, drawings and abstract of Japanese Patent Application No. 2008-206124 filed on August 8, 2008 are cited here as disclosure of the specification of the present invention. Incorporated.
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Abstract
Description
すなわち、本発明は、上記の目的を達成するために以下の構成を採用した。
本発明に係る基板の保持装置は、基板を略水平に保持して上下に移動させるための基板の保持装置であって、支持体と、前記支持体によって支持され前記基板を吸着する少なくとも一つの基板吸着体と、前記基板吸着体の外周部と前記支持体の該基板吸着体外周部から水平方向に離れた領域とを複数箇所で連結する帯状弾性部材と、を備え、前記帯状弾性部材は、前記基板吸着体に連結する一端部と前記支持体に連結する他端部との間に、水平方向に広幅かつ上下方向に薄厚の帯状で、前記支持体に対して前記基板吸着体が相対的に上下方向に接近離間するように変位しかつ水平方向に変位する変位部を有する、ことを特徴とする。
また、本発明に係る基板の保持方法は、基板を略水平に保持して上下に移動させるための基板の保持方法であって、支持体と、前記支持体によって支持され前記基板を吸着する少なくとも一つの基板吸着体と、前記基板吸着体の外周部と前記支持体の該基板吸着体外周部から水平方向に離れた領域とを複数箇所で連結し、前記基板吸着体に連結する一端部と前記支持体に連結する他端部との間に、水平方向に広幅かつ上下方向に薄厚の帯状で、前記支持体に対して前記基板吸着体が相対的に上下方向に接近離間するように変位しかつ水平方向に変位する変位部を有する帯状弾性部材と、を備え、前記支持体を降下させ、前記基板吸着体が前記支持体に対し相対的に接近して前記帯状弾性部材は圧縮されるとともに前記基板吸着体と前記支持体とが相対的に接近する方向に交差する一方向に変位して、前記基板吸着体で前記基板を吸着する工程と、前記支持体を上昇させ、前記基板吸着体が前記基板の重みで前記支持体に対し相対的に離間して前記帯状弾性部材は伸びるとともに前記基板吸着体と前記支持体とが相対的に離間する方向に交差する前記一方向の逆方向に変位して、前記基板吸着体で前記基板を保持する工程と、を含むことを特徴とする。
本発明に係る基板の保持装置によれば、帯状弾性部材が、基板吸着体に連結する一端部と前記支持体に連結する他端部との間において、両端部間の直線距離よりも長いので、帯状弾性部材が前記直線距離の直線に対して迂回するように屈曲又は湾曲して両端部間を連結する板バネとなり、基板吸着体と支持体とを接近離間する上下方向に精度よく相対移動させるとともに該接近離間する方向以外の方向に相対移動することをさらに規制できる。
本発明に係る基板の保持装置によれば、帯状弾性部材が支持体に対する基板吸着体の回転を一層抑制できるため、帯状弾性部材の基板吸着体を連結する一端部と支持体を連結する他端部との上下方向以外の相対変位が一層十分に抑制される。
本発明に係る基板の保持装置によれば、基板吸着体および帯状弾性部材の組が複数設けられているため、たとえば比較的面積の大きい基板を吸着保持する場合でも、複数の基板吸着体で吸着して充分に保持力を確保できる。また、これら基板吸着体は、基板の傾斜に合わせ密着するように夫々が傾動可能に帯状弾性部材に支持されるため、各基板吸着体と基板との密着性が充分に確保され、より高い吸着力が得られる。また、種々の基板のサイズに対応可能である。
本発明に係る基板の保持装置によれば、帯状弾性部材が弾性変形することで基板吸着体を基板に密着させる簡単な構造であるため、たとえば真空等の減圧雰囲気中に装置が配設されるような場合であっても特別な追加設備を必要とせず、設備費用が低減できる。また、構造が簡単で部品点数が少なくコンパクトなため、基板吸着体、支持体および帯状弾性部材を比較的小さなスペース内に収めるように形成でき、減圧雰囲気とする領域をより省スペースに抑えることができる。従って、減圧雰囲気を形成するための真空引き等にかかる時間を削減でき、作業性および生産性が向上する。
本発明に係る基板の保持装置によれば、基板吸着体が静電吸着力により基板を吸着するため、基板の吸着と解放とが簡単かつ短時間で行え、複数の基板を連続して繰り返し吸着するような場合でも吸着力が安定して確保される。よって、作業性および生産性が向上する。
また、樹脂材料が硬化性樹脂組成物からなるため、従来のように、樹脂材料として成膜された樹脂フィルム等を用いる場合に比べ、作業性に優れ、また材料の歩留まりがよい。
板バネ部材4は、たとえば、厚み0.1mm以上1mm以下程度の薄板の金属材料または樹脂材料等からなり、平面図上における静電チャック1の四隅近傍に配置されている。また、板バネ部材4の幅は、たとえば5mm以上、100mm以下が好ましく、10mm以上、50mm以下がより好ましい。このような板ばね部材4を利用することによって、板バネ部材4の厚みに比べて幅が顕著に大きいので、静電チャック1と支持体2とを前記接近離間する上下方向の曲げ剛性に比べて、該接近離間する方向以外の方向の曲げ剛性およびねじり剛性が顕著に大きくなり、静電チャック1と支持体2とを前記接近離間する方向に相対移動させるとともに該接近離間する方向以外の方向に相対移動することを規制できる。これは、板バネ部材4の曲げ剛性が、対象となる断面の変形方向の長さの3乗に比例し、それに直交する方向の長さに比例することから明らかである。また、板バネ部材4の上下面を傾けるようなねじり力に対する剛性をさらに大きくする方法として、板バネ部材4の幅方向の両端部に厚みの大きな部分を設けてもよい。
すなわち、板バネ部材4は、静電チャック1と支持体2とが接近離間する上下方向に直交する平面内(水平面内)で全体としてL字状に屈曲した略環状に形成され、板バネ部材4における内方の内側環部の中央部分(後述の一端部)、すなわち屈曲した部位に平面図上において略矩形の静電チャック1の外周の角が連結し、板バネ部材4における外方の外側環部の中央部分(後述の他端部)、すなわち屈曲した部位に支持体2が連結される。また、支持体2の突出部2bにおける板バネ部材4に連結する板バネ部材4の外側環部の中央部分を含む領域は、突出部2bの平面図上における4隅の4個所とされている。
まず、製造される合わせガラスの一対の基板のうち上基板21を真空チャンバー7内に挿入するとともに、位置決め手段を用いて、該上基板21を支持ピン9上に位置決め状態に載置する。次いで、図5(a)に示すように、基板の保持装置10を下降させ、静電チャック1の誘電体膜1aを上基板21の上面に当接させる。
板バネ部材4は、前述のように静電チャック1が上基板21に押し当てられたり、静電チャック1や上基板21の重量を支持したりすることで、図3(b)に示すように、板バネ要素4Bの一端部11と板バネ要素4Aの他端部12とを鉛直方向に相対移動させる。
本実施形態の基板の保持装置10では、種々のサイズの上基板21を吸着保持するため、該上基板21の平面図上の外形によって、上基板21に対面する夫々の静電チャック1のストッパー部材6の配置を、種々に設定可能としている。
また、図9に示すように、複数の静電チャック1のうち、平面図上で上基板21の外形の領域外にはみ出して配置されるものが有る場合は、当該静電チャック1のストッパー部材6の配置を、次のように設定する。
また、図10(b)に示すように、ストッパー部材6の配置の設定に合わせ、対応する支持ピン9もその軸線を該ストッパー部材6の中心に平面図上で重ねるように対向配置される。
図8に示すように、複数の静電チャック1のすべてが、平面図上で上基板21の外形の領域内に配される場合は、図7に示すように、すべての静電チャック1が夫々上基板21に当接し密着して、静電吸着力により該上基板21を吸着し中空に保持する。
まず、図14(a)に示すように、透明な一対の基板21、22のうち下基板22を略水平に配置した状態で、その上面の外周近傍に、スペーサー粒子を混ぜた高粘性の硬化性樹脂組成物からなるシール樹脂(シール部材)23を略矩形枠状に塗布する。
これらシール樹脂23および樹脂材料24の供給は、たとえばディスペンサー、ダイコータ等により行われる。
次いで、基板の保持装置10を用いて上基板21を下降させ、シール樹脂23および樹脂材料24を挟んで一対の基板21、22を密着させ積層させる。この際、上基板21は、該上基板21および静電チャック1の重量により下基板22に押し付けられるように密着する。
例えば、本実施形態では、板バネ部材4は、一端部11と他端部12との間の部分に、板バネ要素4A、4Bの対からなり迂回するように屈曲する変位部が形成されることとして説明したが、板バネ部材4は、迂回するように屈曲または湾曲する変位部を有していればよく、本実施形態に限定されるものではない。
また、図15(b)に示すように、板バネ部材31の変形は、該板バネ部材31を側面から見た場合の一端部11側の板バネ要素31Bの弾性変形と他端部12側の板バネ要素31Aの弾性変形とが、接続部33を通り水平方向に延びる仮想線L3を挟んで互いに略線対称となるように行われる。
平面図上の板バネ部材41における一端部11側の形状と他端部12側の形状とは、一端部11と他端部12の中間を通り前記短辺部分の延在する方向に平行に延びる仮想線L4を挟んで、互いに略線対称に形成される。
また、平面図上の板バネ部材51における一端部11側の形状と他端部12側の形状とが、一端部11と他端部12の中間を通り前記短辺部分の延在する方向に平行に延びる仮想線L5を挟んで、互いに略線対称に形成されている。
また、図示しないが、板バネ部材51の変形は、板バネ部材51を側面から見た場合の板バネ部材51における一端部11側の弾性変形と他端部12側の弾性変形とが、一端部11と他端部12との中間を通り水平方向に延びる仮想線を挟んで互いに略線対称となるように行われる。
平面図上の板バネ部材61における一端部11側の形状と他端部12側の形状とが、一端部11と他端部12の中間を通りこれら一端部11と他端部12の対向する向きに交差する向きに延びる仮想線L6を挟んで互いに略線対称に形成される。
なお、支持体2の突出部2bに連結する板バネ部材、板バネ要素の数は、静電チャック1と支持体2の突出部2bとの水平方向の相対的な移動をどれだけ強く規制するかによって数を調整する。例えば、水平方向の規制をより強くする場合には、板バネ要素の数を多めに設置する。
なお、2008年8月8日に出願された日本特許出願2008-206124号の明細書、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。
2 支持体
4、31、41、51、61 板バネ部材(帯状弾性部材)
6 ストッパー部材
7 真空チャンバー
10 基板の保持装置
11 板バネ部材の一端部
12 板バネ部材の他端部
21 上基板(基板)
22 下基板(基板)
23 シール樹脂(シール部材)
24 樹脂材料
P 合わせガラス
Claims (15)
- 基板を略水平に保持して上下に移動させるための基板の保持装置であって、
支持体と、
前記支持体によって支持され前記基板を吸着する少なくとも一つの基板吸着体と、
前記基板吸着体の外周部と前記支持体の該基板吸着体外周部から水平方向に離れた領域とを複数箇所で連結する帯状弾性部材と、を備え、
前記帯状弾性部材は、前記基板吸着体に連結する一端部と前記支持体に連結する他端部との間に、水平方向に広幅かつ上下方向に薄厚の帯状で、前記支持体に対して前記基板吸着体が相対的に上下方向に接近離間するように変位しかつ水平方向に変位する変位部を有する、
ことを特徴とする基板の保持装置。 - 前記帯状弾性部材は、前記一端部と前記他端部との間の直線距離よりも長く、前記直線距離の直線に対して迂回するように屈曲又は湾曲して形成されている、請求項1に記載の基板の保持装置。
- 前記帯状弾性部材は、前記支持体に対して前記基板吸着体が接近離間する上下方向に相対移動する際に、上下方向の相対変位に比べて、前記一端部と前記他端部との水平方向の相対変位が小さい、請求項1または2に記載の基板の保持装置。
- 前記帯状弾性部材は、前記一端部側における形状と前記他端部側における形状とが、前記上下方向に直交する平面内で互いに略線対称に形成され、該一端部と該他端部とが接近して対向配置されている、請求項1から3のいずれか一項に記載の基板の保持装置。
- 前記帯状弾性部材が、前記上下方向に直交する平面内で、略環状、略U字状、略V字状、略C字状、または略Ω字状に形成される、請求項4に記載の基板の保持装置。
- 前記帯状弾性部材は、前記上下方向に直交する平面内でL字状に屈曲した略環状に形成され、前記基板吸着体が外周に角を有し、前記帯状弾性部材の内側環部の屈曲した部位に前記基板吸着体の外周の角が連結し、前記帯状弾性部材の外側環部の屈曲した部位に前記支持体が連結する、請求項1から3のいずれか一項に記載の基板の保持装置。
- 前記支持体の前記帯状弾性部材に連結する該帯状弾性部材の他端部を含む領域が、一つの前記基板吸着体に対して3個所以上である、請求項1から6のいずれか一項に記載の基板の保持装置。
- 前記基板吸着体と前記帯状弾性部材との組が、前記支持体下部に複数設けられている、請求項1から7のいずれか一項に記載の基板の保持装置。
- 前記支持体は、前記基板吸着体の上方を覆うように形成され、
前記基板吸着体の上面には弾性変形可能なストッパー部材が設けられ、
前記ストッパー部材が前記支持体に当接可能とされている、請求項1から8のいずれか一項に記載の基板の保持装置。 - 減圧雰囲気中に配される、請求項1から9のいずれか一項に記載の基板の保持装置。
- 前記基板吸着体が、静電吸着力により前記基板を吸着する構成とされる、請求項1から10のいずれか一項に記載の基板の保持装置。
- 基板を略水平に保持して上下に移動させるための基板の保持方法であって、
支持体と、前記支持体によって支持され前記基板を吸着する少なくとも一つの基板吸着体と、前記基板吸着体の外周部と前記支持体の該基板吸着体外周部から水平方向に離れた領域とを複数箇所で連結し、前記基板吸着体に連結する一端部と前記支持体に連結する他端部との間に、水平方向に広幅かつ上下方向に薄厚の帯状で、前記支持体に対して前記基板吸着体が相対的に上下方向に接近離間するように変位しかつ水平方向に変位する変位部を有する帯状弾性部材と、を備え、
前記支持体を降下させ、前記基板吸着体が前記支持体に対し相対的に接近して前記帯状弾性部材は圧縮されるとともに前記基板吸着体と前記支持体とが相対的に接近する方向に交差する一方向に変位して、前記基板吸着体で前記基板を吸着する工程と、
前記支持体を上昇させ、前記基板吸着体が前記基板の重みで前記支持体に対し相対的に離間して前記帯状弾性部材は伸びるとともに前記基板吸着体と前記支持体とが相対的に離間する方向に交差する前記一方向の逆方向に変位して、前記基板吸着体で前記基板を保持する工程と、を含むことを特徴とする基板の保持方法。 - 鉛直方向に対向配置された一対の基板の間に硬化性の樹脂材料を介在させて積層し、その後該樹脂材料を硬化させてなる合わせガラスの製造方法であって、
支持体と、前記支持体によって支持され一対の前記基板のうち上基板を吸着する少なくとも一つの基板吸着体と、前記基板吸着体の外周部と前記支持体の該基板吸着体外周部から水平方向に離れた領域とを複数箇所で連結し、前記基板吸着体に連結する一端部と前記支持体に連結する他端部との間に、水平方向に広幅かつ上下方向に薄厚の帯状で、前記支持体に対して前記基板吸着体が相対的に上下方向に接近離間するように変位しかつ水平方向に変位する変位部を有する帯状弾性部材と、を備え、
前記支持体を降下させ、前記基板吸着体が前記支持体に対し相対的に接近して前記帯状弾性部材は圧縮されるとともに前記基板吸着体と前記支持体とが相対的に接近する方向に交差する一方向に変位して、前記基板吸着体で前記上基板を吸着する工程と、
前記支持体を上昇させ、前記基板吸着体が前記上基板の重みで前記支持体に対し相対的に離間して前記帯状弾性部材は伸びるとともに前記基板吸着体と前記支持体とが相対的に離間する方向に交差する前記一方向の逆方向に変位して、前記基板吸着体で前記上基板を保持する工程と、
前記一対の基板のうち下基板が、前記上基板との間に硬化性樹脂組成物からなる前記樹脂材料を介在させて前記上基板の下方に対向配置される工程と、
前記支持体を降下させて、前記樹脂材料を挟んで前記下基板を前記基板吸着体に保持された前記上基板と密着させる工程と、
前記樹脂材料を硬化させる工程と、を含むことを特徴とする合わせガラスの製造方法。 - 前記基板吸着体および前記帯状弾性部材を複数組用いて前記上基板を吸着する、請求項13に記載の合わせガラスの製造方法。
- 前記対向配置される工程に、前記下基板の前記樹脂材料の外周をシール部材で囲み、該下基板を前記上基板の下方に対向配置する作業を含み、
前記密着させる工程に、減圧雰囲気中で前記樹脂材料および前記シール部材を挟んで前記一対の基板を密着させる作業を含み、
前記密着させる工程と前記硬化させる工程との間に、前記減圧雰囲気の減圧度を増大させることで、前記基板同士を圧着させる工程を含む、請求項13または14に記載の合わせガラスの製造方法。
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CN200980130644.XA CN102112410B (zh) | 2008-08-08 | 2009-08-07 | 基板的保持装置、基板的保持方法以及夹层玻璃的制造方法 |
EP09805070A EP2319815A4 (en) | 2008-08-08 | 2009-08-07 | PLATE HOLDING DEVICE, PLATE HOLDING METHOD AND METHOD FOR PRODUCING VERTICAL GLASS |
JP2010523904A JP5505305B2 (ja) | 2008-08-08 | 2009-08-07 | 基板の保持装置、基板の保持方法および合わせガラスの製造方法 |
US13/021,654 US20110132518A1 (en) | 2008-08-08 | 2011-02-04 | Device for holding a substrate, process for holding a substrate, and process for manufacturing laminated glass |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102173238A (zh) * | 2010-12-29 | 2011-09-07 | 友达光电股份有限公司 | 真空压印装置、真空压合装置及层状光学组件的制造方法 |
US10557065B2 (en) | 2010-12-08 | 2020-02-11 | AGC Inc. | Adhesive layer-equipped transparent surface material, display device and processes for their production |
JP2020511776A (ja) * | 2017-03-09 | 2020-04-16 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 静電式基板保持ユニット |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7622562B2 (en) | 2002-06-26 | 2009-11-24 | Zimmer Orthobiologics, Inc. | Rapid isolation of osteoinductive protein mixtures from mammalian bone tissue |
EP2505352B1 (en) | 2006-12-28 | 2013-07-10 | Asahi Glass Company, Limited | A process for producing a transparent laminate |
KR101456660B1 (ko) * | 2013-01-23 | 2014-11-04 | 안성룡 | 기판 합착 장치 |
DE102018129806A1 (de) * | 2018-11-26 | 2020-05-28 | Manz Ag | Fügestempel für eine Fügevorrichtung und Fügevorrichtung |
KR20200129751A (ko) * | 2019-05-10 | 2020-11-18 | (주)포인트엔지니어링 | 마이크로 led 흡착체 및 이를 이용한 마이크로 led 디스플레이 제작 방법 및 마이크로 led 디스플레이 |
CN115072369A (zh) * | 2022-06-28 | 2022-09-20 | 深圳市华星光电半导体显示技术有限公司 | 搬运组件及成膜装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02271644A (ja) * | 1989-04-13 | 1990-11-06 | Canon Inc | ガラス基板の搬送装置 |
JPH04270151A (ja) * | 1991-02-26 | 1992-09-25 | Mitsubishi Electric Corp | 貼り合わせ装置 |
JP2001209058A (ja) | 2000-01-26 | 2001-08-03 | Shinetsu Engineering Kk | 液晶パネル製造装置 |
JP2004253718A (ja) * | 2003-02-21 | 2004-09-09 | Sumitomo Osaka Cement Co Ltd | 静電チャック及びそれを備えた板状体貼り合わせ装置 |
JP2007334209A (ja) * | 2006-06-19 | 2007-12-27 | Asahi Glass Co Ltd | 液晶光学素子の製造方法 |
JP2008206124A (ja) | 2007-01-23 | 2008-09-04 | Yokogawa Electric Corp | 無線ネットワーク構築方法及び無線ノード設置支援端末 |
JP2009010072A (ja) * | 2007-06-27 | 2009-01-15 | Shinko Electric Ind Co Ltd | 基板貼付装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4093083A (en) * | 1975-04-17 | 1978-06-06 | Spiegelglaswerke Germania, Zweigniederlassung Der Glaceries De Saint.Roch S.A. | Apparatus for stacking and unstacking sheet material, more particularly glass sheets |
US4737824A (en) * | 1984-10-16 | 1988-04-12 | Canon Kabushiki Kaisha | Surface shape controlling device |
US4620738A (en) * | 1985-08-19 | 1986-11-04 | Varian Associates, Inc. | Vacuum pick for semiconductor wafers |
JPS63172148A (ja) * | 1987-01-12 | 1988-07-15 | Hitachi Ltd | 基板表面変形装置 |
US5130747A (en) * | 1990-09-28 | 1992-07-14 | Kabushiki Kaisha Toshiba | Carrier apparatus |
JPH056931A (ja) * | 1991-02-27 | 1993-01-14 | Hitachi Ltd | ウエハ吸着装置 |
TW401582B (en) * | 1997-05-15 | 2000-08-11 | Tokyo Electorn Limtied | Apparatus for and method of transferring substrates |
US7295279B2 (en) * | 2002-06-28 | 2007-11-13 | Lg.Philips Lcd Co., Ltd. | System and method for manufacturing liquid crystal display devices |
KR100662497B1 (ko) * | 2002-11-18 | 2007-01-02 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 제조 공정용 기판 합착 장치 |
-
2009
- 2009-08-07 WO PCT/JP2009/064056 patent/WO2010016588A1/ja active Application Filing
- 2009-08-07 JP JP2010523904A patent/JP5505305B2/ja active Active
- 2009-08-07 KR KR1020107028314A patent/KR101540140B1/ko active IP Right Grant
- 2009-08-07 CN CN200980130644.XA patent/CN102112410B/zh not_active Expired - Fee Related
- 2009-08-07 EP EP09805070A patent/EP2319815A4/en not_active Withdrawn
-
2011
- 2011-02-04 US US13/021,654 patent/US20110132518A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02271644A (ja) * | 1989-04-13 | 1990-11-06 | Canon Inc | ガラス基板の搬送装置 |
JPH04270151A (ja) * | 1991-02-26 | 1992-09-25 | Mitsubishi Electric Corp | 貼り合わせ装置 |
JP2001209058A (ja) | 2000-01-26 | 2001-08-03 | Shinetsu Engineering Kk | 液晶パネル製造装置 |
JP2004253718A (ja) * | 2003-02-21 | 2004-09-09 | Sumitomo Osaka Cement Co Ltd | 静電チャック及びそれを備えた板状体貼り合わせ装置 |
JP2007334209A (ja) * | 2006-06-19 | 2007-12-27 | Asahi Glass Co Ltd | 液晶光学素子の製造方法 |
JP2008206124A (ja) | 2007-01-23 | 2008-09-04 | Yokogawa Electric Corp | 無線ネットワーク構築方法及び無線ノード設置支援端末 |
JP2009010072A (ja) * | 2007-06-27 | 2009-01-15 | Shinko Electric Ind Co Ltd | 基板貼付装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2319815A4 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10557065B2 (en) | 2010-12-08 | 2020-02-11 | AGC Inc. | Adhesive layer-equipped transparent surface material, display device and processes for their production |
CN102173238A (zh) * | 2010-12-29 | 2011-09-07 | 友达光电股份有限公司 | 真空压印装置、真空压合装置及层状光学组件的制造方法 |
TWI461283B (zh) * | 2010-12-29 | 2014-11-21 | Au Optronics Corp | 真空壓印裝置、真空壓合裝置及層狀光學元件之製造方法 |
JP2020511776A (ja) * | 2017-03-09 | 2020-04-16 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 静電式基板保持ユニット |
US11270902B2 (en) | 2017-03-09 | 2022-03-08 | Ev Group E. Thallner Gmbh | Electrostatic substrate holder |
Also Published As
Publication number | Publication date |
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JPWO2010016588A1 (ja) | 2012-01-26 |
EP2319815A4 (en) | 2011-08-24 |
EP2319815A1 (en) | 2011-05-11 |
US20110132518A1 (en) | 2011-06-09 |
KR101540140B1 (ko) | 2015-07-28 |
CN102112410B (zh) | 2013-08-28 |
JP5505305B2 (ja) | 2014-05-28 |
CN102112410A (zh) | 2011-06-29 |
KR20110040761A (ko) | 2011-04-20 |
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