WO2009134088A3 - 홀더 스테이지 - Google Patents

홀더 스테이지 Download PDF

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Publication number
WO2009134088A3
WO2009134088A3 PCT/KR2009/002282 KR2009002282W WO2009134088A3 WO 2009134088 A3 WO2009134088 A3 WO 2009134088A3 KR 2009002282 W KR2009002282 W KR 2009002282W WO 2009134088 A3 WO2009134088 A3 WO 2009134088A3
Authority
WO
WIPO (PCT)
Prior art keywords
holders
holder stage
glass substrates
alignment unit
aligning
Prior art date
Application number
PCT/KR2009/002282
Other languages
English (en)
French (fr)
Other versions
WO2009134088A2 (ko
Inventor
허관선
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to CN200980114297.1A priority Critical patent/CN102016697B/zh
Priority to JP2011507350A priority patent/JP5364156B2/ja
Publication of WO2009134088A2 publication Critical patent/WO2009134088A2/ko
Publication of WO2009134088A3 publication Critical patent/WO2009134088A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

기판처리 시스템에서 글래스 기판이 홀더 상에 정렬되어 안착된 상태로 기판 보트에 로딩될 수 있도록 글래스 기판 및/또는 홀더의 위치를 정렬해 주는 홀더 스테이지가 개시된다. 본 발명에 따른 홀더 스테이지(100)는, 홀더(140) 및 홀더(140)에 대응되는 글래스 기판(10)이 탑재되어 수용되는 홀더 스테이지로서, 홀더(140)와 글래스 기판(10)을 동시에 정렬시키는 얼라인부(200); 및 얼라인부(200)를 회전시키는 얼라인 회전부(150)를 포함하는 것을 특징으로 한다.
PCT/KR2009/002282 2008-04-30 2009-04-30 홀더 스테이지 WO2009134088A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980114297.1A CN102016697B (zh) 2008-04-30 2009-04-30 支架载置台
JP2011507350A JP5364156B2 (ja) 2008-04-30 2009-04-30 ホルダステージ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0040921 2008-04-30
KR20080040921A KR100942066B1 (ko) 2008-04-30 2008-04-30 홀더 스테이지

Publications (2)

Publication Number Publication Date
WO2009134088A2 WO2009134088A2 (ko) 2009-11-05
WO2009134088A3 true WO2009134088A3 (ko) 2010-03-04

Family

ID=41255562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002282 WO2009134088A2 (ko) 2008-04-30 2009-04-30 홀더 스테이지

Country Status (4)

Country Link
JP (1) JP5364156B2 (ko)
KR (1) KR100942066B1 (ko)
CN (1) CN102016697B (ko)
WO (1) WO2009134088A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8826693B2 (en) * 2010-08-30 2014-09-09 Corning Incorporated Apparatus and method for heat treating a glass substrate
KR101355213B1 (ko) * 2011-10-18 2014-01-28 주식회사 테라세미콘 기판 정렬 장치
KR101445686B1 (ko) * 2012-06-29 2014-10-02 주식회사 테라세미콘 기판 정렬장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040043204A (ko) * 2002-11-16 2004-05-24 엘지.필립스 엘시디 주식회사 액정표시소자용 기판 합착 장치
KR20070060251A (ko) * 2005-12-08 2007-06-13 주식회사 테라세미콘 반도체 제조공정 및 반도체 제조장치
KR20070060640A (ko) * 2005-12-09 2007-06-13 주식회사 테라세미콘 평판표시장치 제조시스템

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114233B2 (ja) * 1992-04-01 1995-12-06 株式会社ニコン 基板の位置決め装置
JP2001332600A (ja) * 2000-05-19 2001-11-30 Nikon Corp 搬送方法、露光装置
JP2003209153A (ja) * 2002-01-11 2003-07-25 Hitachi Kokusai Electric Inc 基板処理装置、及び半導体デバイスの製造方法
US7275577B2 (en) * 2002-11-16 2007-10-02 Lg.Philips Lcd Co., Ltd. Substrate bonding machine for liquid crystal display device
EP1450398A3 (en) * 2003-02-20 2004-11-10 Applied Materials, Inc. A method and an apparatus for positioning a substrate relative to a support stage
JP2005197542A (ja) * 2004-01-09 2005-07-21 Hitachi Kokusai Electric Inc 基板処理装置
JP4410063B2 (ja) * 2004-09-06 2010-02-03 東京エレクトロン株式会社 基板処理装置
TW201115675A (en) * 2005-04-25 2011-05-01 Terasemicon Co Ltd Manufacturing method for the holder of the batch type boat
JP2008064666A (ja) * 2006-09-08 2008-03-21 Olympus Corp 外観検査装置の基板保持機構
KR100807090B1 (ko) * 2007-03-28 2008-02-26 에스엔유 프리시젼 주식회사 기판 지지장치와 이를 이용한 엘씨디 셀의 씰패턴 검사장치
CN201141958Y (zh) * 2007-11-01 2008-10-29 中勤实业股份有限公司 卡匣结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040043204A (ko) * 2002-11-16 2004-05-24 엘지.필립스 엘시디 주식회사 액정표시소자용 기판 합착 장치
KR20070060251A (ko) * 2005-12-08 2007-06-13 주식회사 테라세미콘 반도체 제조공정 및 반도체 제조장치
KR20070060640A (ko) * 2005-12-09 2007-06-13 주식회사 테라세미콘 평판표시장치 제조시스템

Also Published As

Publication number Publication date
JP5364156B2 (ja) 2013-12-11
JP2011519482A (ja) 2011-07-07
CN102016697A (zh) 2011-04-13
WO2009134088A2 (ko) 2009-11-05
KR100942066B1 (ko) 2010-02-11
KR20090115002A (ko) 2009-11-04
CN102016697B (zh) 2013-07-03

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