WO2009096610A1 - 太陽電池用基材 - Google Patents
太陽電池用基材 Download PDFInfo
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- WO2009096610A1 WO2009096610A1 PCT/JP2009/052016 JP2009052016W WO2009096610A1 WO 2009096610 A1 WO2009096610 A1 WO 2009096610A1 JP 2009052016 W JP2009052016 W JP 2009052016W WO 2009096610 A1 WO2009096610 A1 WO 2009096610A1
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- Prior art keywords
- film
- average
- solar cell
- inert particles
- solar battery
- Prior art date
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- 239000010408 film Substances 0.000 claims abstract description 93
- 239000002245 particle Substances 0.000 claims abstract description 85
- 239000010409 thin film Substances 0.000 claims abstract description 23
- 230000003746 surface roughness Effects 0.000 claims abstract description 22
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 22
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 22
- 229920006038 crystalline resin Polymers 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 31
- 238000006243 chemical reaction Methods 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 16
- 238000005259 measurement Methods 0.000 description 10
- -1 polyethylene terephthalate Polymers 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000001816 cooling Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- PJKVFARRVXDXAD-UHFFFAOYSA-N 2-naphthaldehyde Chemical compound C1=CC=CC2=CC(C=O)=CC=C21 PJKVFARRVXDXAD-UHFFFAOYSA-N 0.000 description 1
- GTYZDORKFFSTLS-UHFFFAOYSA-N 2h-3,1-benzoxazine Chemical compound C1=CC=CC2=NCOC=C21 GTYZDORKFFSTLS-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000005130 benzoxazines Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell substrate used as a solar cell substrate, and more particularly to a solar cell substrate suitably used as a flexible type thin film solar cell substrate.
- Solar cells include a rigid type that uses glass as a base material and a flexible type that uses a plastic film.
- flexible solar cells have come to be frequently used as an auxiliary power source for mobile communication devices such as mobile phones and mobile terminals.
- the rigid type has the highest conversion efficiency of solar cells compared to the flexible type, but there are limits to the reduction in thickness and weight of solar cell modules.
- the glass of the battery may be broken and the solar cell module may be damaged.
- Japanese Patent Laid-Open No. 1 1980 081 discloses a thin film solar cell having a structure in which an amorphous silicon layer is sandwiched between electrode layers on a polymer film substrate.
- Japanese Laid-Open Patent Publication No. 2-2606077, Japanese Examined Patent Publication No. 6-5782, and Japanese Laid-open Patent Publication No. 6-355011 are disclosed in the following.
- a battery module is disclosed.
- the photoelectric conversion efficiency is improved. Therefore, it is important to increase the amount of light absorption within the thickness of the light absorption layer. Therefore, conventionally, an effort has been made to increase the optical path length of light in the light absorption layer by forming an uneven conductive layer on the surface of the substrate and diffusing the light.
- an effort has been made to increase the optical path length of light in the light absorption layer by forming an uneven conductive layer on the surface of the substrate and diffusing the light.
- the substrate is exposed to a temperature of 3500 or higher. Plastic films cannot withstand this temperature and this method cannot be applied.
- a method of forming a conductive layer on a sheet having an uneven surface by casting a solution of a composition in which a filler is added to a resin and solidifying the solution on a base material (special method) Kaihei 1 1 1 9 0 7 4) is proposed.
- this method in order to form sufficient unevenness, it is necessary to increase the concentration of the filler in the solution. If the concentration of the filler is increased, the sheet will become brittle and cannot be practically used.
- the resin composition solution is applied to the surface of the base material in order to provide unevenness.
- the solvent of the solution remains in the uneven layer and serves as a gas when forming the transparent conductive layer. Volatilization (degassing) will not maintain the shape of the concave / convex layer at this time, and it will enter the semiconductor and the transparent conductive layer as impurities, degrading the quality of the product.
- the object of the present invention is to solve the problems of the prior art and produce a solar cell having a surface capable of obtaining a light confinement effect and exhibiting excellent photoelectric conversion efficiency when used as a substrate of a thin film solar cell.
- An object of the present invention is to provide a solar cell substrate useful for the purpose. Means for solving the problem
- the present invention is a solar cell substrate comprising a film obtained by melt-extrusion of a composition of a thermoplastic crystalline resin and inert particles, and has an average surface roughness Ra Is a substrate for solar cells, characterized in that it has at least one surface having a surface area of 30 to 500 nm and an average distance S between local peaks of the surface of 40 to 500 nm.
- thermoplastic crystalline resin in the substrate for solar cells of the present invention is a thermoplastic crystalline resin that can be melt-extruded.
- a thermoplastic crystalline resin that can be melt-extruded.
- polyether ether ketone, polyphenylene sulfide, polyamide, polyethylene terephthalate, polyethylene 2, 6-naphthal rate can be used.
- polyethylene-2,6-naphthalene is particularly preferred because it can be biaxially stretched, has high mechanical strength, and has heat resistance.
- the inert particles in the present invention are used to form appropriate irregularities on the film surface in order to obtain a light confinement effect.
- the average particle diameter of the inert particles is preferably 0.05 to 10 m, more preferably 0.1 to 8 / m, and particularly preferably 0.2 to 6 m. If the average particle size of the inert particles is less than 0, a surface shape that sufficiently scatters light cannot be formed, and if it exceeds l O ⁇ m, the protrusions formed on the surface become too large. It is not preferable because it may be difficult to form a uniform conductive layer thereon.
- the content of the inert particles is 100% by volume of the resin composition constituting the film, preferably 0.5 to 20% by volume, more preferably 1 to 15% by volume, and particularly preferably 2 to 10% by volume. is there.
- the volume% is obtained by calculation from the weight% using the true density of the inert particles and the density of the amorphous state of the resin.
- inert particles having sufficient heat resistance to withstand melt extrusion are used.
- inorganic materials such as spherical silica, porous silica, calcium carbonate, alumina, titanium dioxide, kaolin clay, barium sulfate, and zeolite.
- Particles Silicone resin particles, crosslinked polystyrene particles and some crosslinked polymer particles or organic salt particles can be used.
- the average particle size of the inert particles was measured using a CP-50 Centrifugal Particle Size Analyzer manufactured by Shimadzu Corporation, and calculated based on the centrifugal sedimentation curve obtained. This is the value obtained by reading the particle size corresponding to 50% by weight from the integrated curve of the particles and their abundance (see “Granularity Measurement Technology” published by Nikkan Kogyo Shimbun, 1975, pages 242-247).
- the inert particles may be of a single type or multiple types. May be used in combination. You may combine the particle
- a composition obtained from a thermoplastic crystalline resin and inert particles is melt-extruded into an unstretched sheet, and a film obtained by stretching the composition is used as a solar cell substrate.
- the stretched film is preferably a biaxially stretched film.
- the process of providing a conductive layer on the film for processing into a solar cell generates degass derived from the residual solvent.
- the uneven structure formed on the film before the step of providing is disturbed, and the uneven structure is not accurately reflected in the solar cell.
- the composition constituting the film may contain an additive.
- the additive include an antioxidant, a heat stabilizer, a lubricant (for example, a wax), a flame retardant, an antistatic agent, and an ultraviolet absorber.
- an ultraviolet absorber in order to improve the weather resistance of the film.
- a UV absorber a compound having a large absorption coefficient that is effective in a small amount is preferable.
- the film of the solar cell base material of the present invention may be a multilayer film.
- the multilayer film contains an ultraviolet absorber, the weather resistance can be effectively improved by adding it to the outermost layer on the light incident side of the film.
- Center plane average surface roughness R a Center plane average surface roughness R a
- the substrate for solar cells of the present invention has at least one surface having an average surface roughness Ra of 30 to 50 O nm and an average distance S between local peaks of the surface of 40 to 5000 nm. It is important to prepare for.
- the center surface average surface roughness Ra of the surface is 30 to 500 nm, preferably 35 to 300 nm, and more preferably 40 to 200 nm.
- Ra is less than 30 nm, the light scattering effect is reduced and the effect of improving the photoelectric conversion efficiency of the solar cell is reduced.
- the thickness exceeds 500 nm, the protrusions on the surface are too large, and it becomes difficult to form a uniform conductive layer thereon.
- This center plane average surface roughness R a can be achieved by adjusting the average particle size and the amount of inert particles contained in the composition together with the thermoplastic crystalline resin, as will be described later. . Average distance between local summits S
- the average distance S between local peaks is 40 to 5000 nm, preferably 50 to: I 000 nm, and more preferably 60 to 500 nm.
- the average distance S between the local peaks is less than 40 nm, the unevenness becomes steep, and when each layer is laminated on the film, it is impossible to form a sufficiently laminated structure on the unevenness. As a result, problems such as short circuit occur.
- the average distance S between local peaks exceeds 5000 nm, the frequency of unevenness is too small to scatter light sufficiently, and the desired light confinement effect is not exhibited.
- the solar cell substrate of the present invention is a film produced from a composition of a thermoplastic crystalline resin containing inert particles, and has the above-mentioned center plane average surface roughness Ra and local peak.
- the average interval S can be achieved by setting the average particle size and content of the inert particles within an appropriate range.
- the inert particles are thermoplastic crystallinity in the range of 1 to 40% by volume per 100% by volume of the thermoplastic crystalline resin composition. It can achieve by making it contain in the composition of resin. Further, for example, when using inert particles having an average particle size of 0.3 m, 1 to 25% by volume, for example, using inert particles having an average particle size of 1.0 m, 0.3 to 2. 5% by volume, for example, in the case of using inert particles having an average particle size of 3.0 m, the range of 0.1 to 3.0% by volume is contained in the composition of the inert crystalline thermoplastic crystalline resin. Can be achieved.
- a film by producing a film by a stretching method, in particular, a biaxial stretching method, it has surface irregularities defined by the center plane average surface roughness Ra of the present invention and the average interval S between local peaks.
- a film can be obtained. Even if the inert particles are buried inside the film before stretching, the stretching stretches the thermoplastic crystalline resin around the inert particles, and the inert particles inside the film surface. Can be extruded to form a good texture.
- thermoplastic crystalline resin is used, and the resin structure is fixed by crystallization after stretching. For this reason, it is possible to form a stable surface uneven structure that is not damaged even during a high-temperature process.
- the thickness of the layer containing inert particles by changing the thickness of the layer containing inert particles, Surface irregularities can be finely adjusted. For example, if it is difficult to achieve the target center plane average surface roughness Ra using inert particles with a small particle size, the shape of the inert particles can be reduced by thinning the layer containing the inert particles. It is possible to obtain sufficient unevenness by reflecting the shape. For example, when an inert particle having an average particle size of 0.1 lm is used, the thickness of the layer containing the inert particle is preferably 0.1 to 3 m.
- the average surface roughness Ra becomes too large if the inert particle content per volume is increased in order to reduce the average distance S between the local peaks.
- the thickness of the layer containing the inert particles is increased, and the inert particles contained inside the film are projected to the outside without increasing the center surface average surface roughness Ra. A film with a small average distance S between local peaks can be obtained.
- a film having a small average interval S between local peaks can be obtained by setting the thickness of the layer containing the inert particles to 5 or more.
- the substrate for solar cells of the present invention preferably has a total light transmittance of 80% or more because it can be used as a substrate for a super-straight type solar cell as a surface electrode side substrate. Even if the total light transmittance is less than 80%, it can be used as a substrate for solar cells, and in particular, it can be used as a substrate on the back electrode side.
- the base material for solar cell of the present invention has a thermal shrinkage rate of preferably 1% when treated with 20 0 for 10 minutes from the viewpoint of suppressing dimensional change in the heating step in the processing step for solar cells. Hereinafter, it is more preferably 0.8% or less, particularly preferably 0.6% or less.
- the thickness of the solar cell base material of the present invention is as follows. From the viewpoint of maintaining the flexibility of the solar cell module, it is preferably 25 to 250 m, more preferably 50 to 20 / m, particularly preferably 60 to 125 m. It is. Film production method
- the substrate for solar cell of the present invention is manufactured by melting a composition of thermoplastic crystalline resin containing inert particles, melt-extruding them to form an unstretched sheet, and stretching the sheet. Can do.
- the biaxial stretching method It is preferable to manufacture by. Further, in order to maintain the surface unevenness even in a high-temperature process in the processing step of the solar cell, it is preferable to produce the surface through a crystallization process of a thermoplastic crystalline resin.
- the method for producing a film will be described in detail by taking as an example a method for producing a film by sequential biaxial stretching after melt extrusion.
- the melting point is expressed as Tm
- Tg glass transition temperature
- thermoplastic crystalline resin A composition in which a predetermined amount of inert particles are contained in a thermoplastic crystalline resin and the inert particles are dispersed in the thermoplastic crystalline resin is subjected to ordinary heating or drying under a reduced pressure atmosphere as necessary. Remove moisture. Then, it is melted at a normal melt extrusion temperature, that is, Tm or more and (Tm + 50) or less, extruded from the die slit, and cooled on the rotating cooling drum below Tg of the thermoplastic crystalline resin. By rapid cooling and solidification, an amorphous unstretched sheet is obtained.
- the obtained unstretched sheet was stretched at a stretch ratio of 2.5 to 4.5 times in the machine direction at a temperature of T g or more and (T g + 50 t :) or less, and then in the transverse direction. Drawing is performed at a draw ratio of 2.5 to 4.5 times at a temperature of T g or more and (T g +50) or less.
- the simultaneous biaxial stretching method in which longitudinal and transverse stretching are performed at the same time, is preferred because it makes it easy to balance the mechanical properties of the machine and machine. Stretching method.
- a film provided with at least one of the surfaces of the center plane average surface roughness Ra and the average interval S between the local peaks of the present invention can be obtained.
- the surface irregularities can also be controlled by this stretching condition. For example, when inert particles that do not deform due to external force are used, protrusions are formed on the surface of the film during the film stretching process, but as the internal stress generated during stretching increases, that is, as the film is stretched at a higher magnification at a lower temperature, A surface with a large average surface roughness Ra is obtained.
- the projection frequency sufficiently reflects the average particle size and added amount of the inert particles.
- a surface having high unevenness that is, a surface having a small average interval S between local peaks can be obtained.
- the film stretched vertically and horizontally is heat-set at a temperature not lower than the crystallization temperature of the thermoplastic crystalline resin and not higher than (at Tm 120). Thereafter, for the purpose of reducing the thermal shrinkage rate, it is preferable to perform thermal relaxation treatment in the longitudinal direction and the Z or lateral direction in the range of relaxation rate of 0.5 to 15%.
- the thermal relaxation treatment may be performed in a separate step after winding, in addition to the method performed during film production.
- a method of performing a relaxation heat treatment in a suspended state as disclosed in Japanese Patent Application Laid-Open No. 1 275030 1 can be used.
- a film sample was cut into a triangle, fixed in an embedding capsule, and then embedded in an epoxy resin. Micro embedded samples! After making a cross section parallel to the longitudinal direction with a thin film section of 50 nm in thickness, use a transmission electron microscope (S-4700 manufactured by Hitachi) at an acceleration voltage of 100 kV. The film was observed and photographed with S-4700, and the thickness of each layer was measured from the photograph.
- S-4700 transmission electron microscope
- Ra ⁇ IZ ik -Z 1 / (MN)
- Z jk is the two-dimensional roughness chart at the j-th and k-th positions in each direction when the measurement direction (283 m) and the orthogonal direction (213; m) are divided into M and N, respectively. Of height.
- the length of the average line corresponding to each of the adjacent local summits at the reference length L is cut out from the roughness surface of the film surface by the reference length L (283 / m) in the average plane direction.
- S i was obtained, and the average value S (unit: nm) of the average line length S i was calculated from the following formula, and this was defined as the average interval S between the local peaks.
- the calculation was performed using the following formula using the surface analysis software built in the microscope.
- Figure 1 shows the relationship between the reference length L and the average line length Si in the calculation of the average distance (S) between local peaks.
- the total light transmittance T t (%) was measured according to JIS standard K67 14—1958.
- a 200 nm thick Ag thin film was formed on the surface of the film sample by sputtering, and a 50 nm thick AZO thin film was further formed thereon.
- the film samples with these thin films formed are put into a plasma CVD device, the substrate temperature is set to 190, and photoelectric conversion consisting of three layers of n, i, and p-type amorphous silicon (a-Si) layers A layer (total thickness of 3 layers 0.4 m) was formed.
- the Ag thin film is formed with a thickness of 200 nm by sputtering using a comb-like mask.
- a thin film solar cell was obtained.
- a 500W xenon lamp (manufactured by Usio Electric) is equipped with the correction film Yuichi (AMI. 5 G 1 oba 1) for solar simulation, and the incident light intensity is '10 OmWZcm for the above thin-film solar cell.
- 2 simulated sunlight was irradiated so as to be perpendicular to the horizontal plane.
- the system was kept indoors at an air temperature of 25 and a humidity of 50%.
- a current-voltage measurement device Kerithley source measure unit model 238), the DC voltage applied to the system was scanned at a constant speed of 1 OmVZ seconds, and I-V curve characteristics were measured. From the short-circuit current (J sc) and open-circuit voltage (Voc) FF (fill factor: fill factor) obtained from this result, the photoelectric conversion efficiency 7? (%) was calculated by the following formula.
- Rutile-type titanium dioxide with an average particle size of 0.3 / m (true density 4.2) 2.5% by volume and polyethylene 1,6-naphthalate (amorphous density 1.33, intrinsic viscosity: 0.63) 97.
- a composition composed of 5% by volume was dried at 170 for 6 hours, then fed to an extruder, extruded from a slit die at a melting temperature of 305, and a rotating cooling drum maintained at a surface temperature of 50 ° C. The film was rapidly cooled and solidified to obtain an unstretched film.
- the film was stretched 3.1 times in the longitudinal direction at 140, then stretched 3.3 times in the transverse direction at 145, heat-set at 245 for 5 seconds and shrunk 2% in the width direction, and the thickness 75 m biaxially stretched film was obtained.
- the average film surface roughness Ra of the obtained film was 43 nm
- the average distance S between the local peaks was 3740 nm
- the thermal shrinkage rate of the film at 200 was 0.3%.
- a thin-film solar cell was prepared, and the photoelectric conversion efficiency 7? () was measured.
- the open-circuit voltage was 0.52V and the short-circuit current density was 23.8 mA / cm 2
- the photoelectric conversion efficiency was 6.2%.
- a composition consisting of 5% by volume and polyethylene naphthalate containing no inert particles were each dried at 170 for 6 hours, each fed to a co-extruder, and at a melting temperature of 305 from a slit die. The film was coextruded and rapidly cooled and solidified on a rotary cooling drum maintained at a surface temperature of 50 to obtain an unstretched laminated film.
- a composition consisting of% by volume and polyethylene-2,6_naphthalate containing no inert particles are dried at 170 for 6 hours, respectively.
- a laminated biaxially stretched film having an inert particle-containing layer thickness of 1 im and a total film thickness of 75 xm was obtained.
- the center plane of the rough surface of the resulting laminated biaxially stretched film The average surface roughness Ra is 56 nm, the average distance S between the local peaks is 1834 nm, and the thermal contraction rate of the film at 200 is 0.2. %Met.
- a laminated biaxially stretched film with a layer thickness of 1 // m and a total film thickness of 75 was obtained.
- the average surface roughness Ra of the rough surface of the laminated biaxially stretched film is 31 nm
- the average distance S between local peaks is 2320 nm
- the thermal shrinkage at 2000 of the film is 0.5. %Met.
- a composition consisting of 7% by volume was dried at 170 for 6 hours, fed to an extruder, extruded from a slit die at a melting temperature of 305, and rapidly cooled and solidified on a rotating cooling drum maintained at a surface temperature of 50. Thus, an unstretched film was obtained.
- the film was stretched 3.1 times in the longitudinal direction at 140, then stretched 3.3 times in the transverse direction at 145, heat-fixed at 245 for 5 seconds and shrunk 2% in the width direction, and the thickness was 75 m.
- a biaxially stretched film was obtained.
- the obtained biaxially stretched film had a center plane average surface roughness Ra of 26 nm, and the film had a thermal shrinkage ratio at 200: 0.4%.
- a thin-film solar cell was prepared, and the photoelectric conversion efficiency? (%) was measured.
- the open-circuit voltage was 0.42 V
- the short-circuit current density was 18.7 mAZcm 2
- the conversion efficiency was 4.7%.
- the base material for solar cells provided with the surface which can acquire the confinement effect, and useful for manufacturing the solar cell which shows the photoelectric conversion efficiency which was excellent when used as a base material of a thin film solar cell. Can be provided.
- Figure 1 shows the relationship between the reference length L and the average line length S i in the calculation of the average distance (S) between local peaks.
- the base material for solar cells of the present invention can be suitably used as a base material for flexible thin film solar cells.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
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CN2009801036826A CN101933152B (zh) | 2008-01-31 | 2009-01-30 | 太阳能电池用基材 |
EP09706843.1A EP2242110A4 (en) | 2008-01-31 | 2009-01-30 | SOLAR BATTERY BASE |
US12/865,483 US20100326515A1 (en) | 2008-01-31 | 2009-01-30 | Base material for solar cell |
AU2009209886A AU2009209886B2 (en) | 2008-01-31 | 2009-01-30 | Solar battery base |
JP2009551640A JPWO2009096610A1 (ja) | 2008-01-31 | 2009-01-30 | 太陽電池用基材 |
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US (1) | US20100326515A1 (ja) |
EP (1) | EP2242110A4 (ja) |
JP (1) | JPWO2009096610A1 (ja) |
KR (1) | KR101551510B1 (ja) |
CN (1) | CN101933152B (ja) |
AU (1) | AU2009209886B2 (ja) |
TW (1) | TWI445185B (ja) |
WO (1) | WO2009096610A1 (ja) |
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JP2011181892A (ja) * | 2010-02-04 | 2011-09-15 | Teijin Dupont Films Japan Ltd | 太陽電池用基材 |
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- 2009-01-30 KR KR1020107018441A patent/KR101551510B1/ko active IP Right Grant
- 2009-01-30 CN CN2009801036826A patent/CN101933152B/zh active Active
- 2009-01-30 US US12/865,483 patent/US20100326515A1/en not_active Abandoned
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- 2009-01-30 JP JP2009551640A patent/JPWO2009096610A1/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
CN101933152A (zh) | 2010-12-29 |
KR101551510B1 (ko) | 2015-09-08 |
KR20100114088A (ko) | 2010-10-22 |
EP2242110A1 (en) | 2010-10-20 |
CN101933152B (zh) | 2013-04-03 |
TW200950111A (en) | 2009-12-01 |
AU2009209886A1 (en) | 2009-08-06 |
US20100326515A1 (en) | 2010-12-30 |
JPWO2009096610A1 (ja) | 2011-05-26 |
EP2242110A4 (en) | 2016-02-10 |
TWI445185B (zh) | 2014-07-11 |
AU2009209886B2 (en) | 2014-03-20 |
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