Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/13—Phenols; Phenolates
  • C08K5/132—Phenols containing keto groups, e.g. benzophenones
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0206—Materials
  • H05K2201/0209—Inorganic, non-metallic particles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0017—Etching of the substrate by chemical or physical means
  • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
  • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
  • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
  • H05K3/4676—Single layer compositions

Definitions

• the present invention relates to a resin composition and a laminated resin film using the same, and more specifically, it can improve the ultraviolet laser processability of the resin and can not only be used as an electronic material such as an insulating film of a buildup substrate
• the present invention relates to a resin composition that can form a circuit board that does not impair the electrical insulation, and a laminated resin film using the same.
• the drilling process by a laser has come to be applied recently.
• the epoxy resin composition has a small absorption band at the laser wavelength, requires a large number of shots for processing, and requires a large amount of energy.
• an ultraviolet laser can process a resin finer than a carbon dioxide gas laser, but the number of laser shots increases when resin processing is performed as compared to a carbon dioxide laser, and a large amount of energy is required.
• damage to the resin is likely to be large, cracks may occur in the insulating layer, sagging of the inner layer copper foil land, and cracks may occur under the land.
• there is a method of optimizing the laser conditions but there is a problem that the tolerance is narrow.
• the ultraviolet light absorber contained in the resin composition is decomposed and inactivated to lose its function, and at the time of laser processing In the via, there is a possibility that the insulation failure may occur due to the generation of the crack or the shape defect of the via.
• the object of the present invention is to improve the ultraviolet laser processability of resin and not only to use as an electronic material such as an insulating film of a buildup substrate It is providing a resin composition which can form a substrate, and a lamination resin film using the same.
• the present inventor blended a specific amount of a cyanoacrylate compound or a benzophenone compound as a UV absorber into a thermosetting resin such as an epoxy resin together with a curing agent and silica. And after kneading with a specific amount of solvent, the obtained resin composition is found to improve the laser processability in the formation of grooves by an ultraviolet laser after curing it, and complete the present invention It came to
• a resin composition comprising a thermosetting resin (A), a curing agent (B), silica (C), an ultraviolet absorber (D) and a solvent (E).
• the UV absorber (D) is a cyanoacrylate compound (D1) and / or a benzophenone compound (D2), and the content thereof includes the curable resin (A), the curing agent (B) and the UV absorber (D).
• 0.5 parts by weight to 50 parts by weight with respect to the total of (1) and the compounding amount of the solvent (E) is 100 parts by weight in total of the thermosetting resin (A) and the curing agent (B)
• the resin composition is provided in an amount of 20 to 500 parts by weight.
• the content of the ultraviolet light absorber (D) is one of the curable resin (A), the curing agent (B) and the ultraviolet light absorber (D).
• a resin composition is provided, which is characterized in that it is 1.0 to 30 parts by weight with respect to the total.
• the cyanoacrylate compound (D1) or the benzophenone compound (D2) has an absorption maximum in a wavelength range of 200 to 380 nm.
• a resin composition is provided.
• the cyanoacrylate compound (D1) is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group, an aryl group or an arylalkyl.
• a resin composition is provided, which is a compound having a group and / or two or more arylacryloxy groups.
• the cyanoacrylate compound (D1) is a compound having an alkyl group having 2 to 8 carbon atoms and two aryl groups, or two or more.
• a resin composition is provided, which is a compound having an arylacryloxy group of
• the benzophenone compound (D2) is benzophenone, a hydroxyl group, a hydroxyalkyl group, an alkyloxy group, an aryloxy group
• a resin composition is provided, which is a compound having an arylalkyloxy group or a functional group of a carboxy group or an acid anhydride thereof.
• the benzophenone compound (D2) is a compound having a functional group having any one of a hydroxyl group and a hydroxyalkyl group or an acid anhydride thereof.
• thermosetting resin (A) is an epoxy resin.
• curing agent (B) is at least one compound selected from dicyandiamide, a phenol type curing agent, or an acid anhydride.
• the compounding amount of the silica (C) is a total of 100 of the thermosetting resin (A) and the curing agent (B).
• a resin composition is provided, characterized in that it is 10 to 100 parts by weight with respect to the parts by weight.
• the resin composition according to the eleventh aspect wherein the silica (C) is surface-treated with a silane coupling agent.
• any one of the first to twelfth inventions it further comprises a layered silicate, and the content thereof is between the thermosetting resin (A) and the curing agent (B).
• a resin composition is provided, which is 0.1 to 25 parts by weight with respect to a total of 100 parts by weight.
• the layered silicate is a smectite clay mineral and / or a swelling mica.
• a fifteenth invention of the present invention is a laminated resin film formed by laminating the resin composition in a sheet form on a substrate, The laminated resin film is provided, wherein the upper sheet-like resin composition is dried, and the content of the solvent is 0.01 to 5 parts by weight with respect to the whole resin composition.
• a laminated resin film according to the fifteenth aspect which is used as an insulating material for a circuit board and is excellent in the processability by an ultraviolet laser.
• the resin composition of the present invention contains a specific amount of a specific ultraviolet absorber, and each component is uniformly dispersed by a specific amount of solvent, so that the absorption of light near the ultraviolet wavelength increases, and the resin is processed by laser Improves the quality.
• a resin composition or a resin film is used as an electronic material such as an insulating film of a buildup substrate, there is an effect that the electrical insulation property is not impaired.
• the resin composition of the present invention is a resin composition containing a thermosetting resin (A), a curing agent (B), silica (C), an ultraviolet absorber (D) and a solvent (E).
• the ultraviolet absorber (D) is a cyanoacrylate compound (D1) and / or a benzophenone compound (D2), the content of which is a curable resin (A), a curing agent (B) and an ultraviolet absorber (D)
• the compounding amount of the solvent (E) is 0.5 parts by weight to 50 parts by weight with respect to the total of 100 parts by weight of the total of the thermosetting resin (A) and the curing agent (B). , 20 to 500 parts by weight.
• thermosetting resin is not particularly limited.
• epoxy resin phenoxy resin, phenol resin, urea resin, amino resin such as melamine resin, unsaturated polyester resin, thermosetting resin Urethane resin, thermosetting polyimide resin, benzoxazine resin, amino alkyd resin etc. are mentioned.
• thermosetting resins may be used alone or in combination of two or more.
• epoxy resins having two or more epoxy groups (oxirane ring) per molecule are preferable.
• epoxy resin known ones conventionally used in this field can be used.
• aromatic epoxy resin alicyclic epoxy resin, aliphatic epoxy resin, glycidyl ester type epoxy resin, Various epoxy compounds such as glycidyl amine type epoxy resin, glycidyl acrylic type epoxy resin, polyester type epoxy resin and the like can be mentioned. These epoxy resins may be used alone or in combination of two or more.
• examples of the aromatic epoxy resin include biphenyl phenol type epoxy resin, bisphenol type epoxy resin, and novolac type epoxy resin.
• examples of the bisphenol-type epoxy resin include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol AD-type epoxy resin, and bisphenol S-type epoxy resin.
• examples of novolac epoxy resins include phenol novolac epoxy resins and cresol novolac epoxy resins.
• epoxy resins and the like made of aromatic compounds such as trisphenol methane triglycidyl ether and the like can also be mentioned.
• alicyclic epoxy resins such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-2-methylcyclohexylmethyl-3,4-epoxy-2-methylcyclohexanecarboxy , Bis (3,4-epoxycyclohexyl) adipate, bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 2- (3,4-epoxycyclohexyl And -5,5-spiro-3,4-epoxy) cyclohexanone-meta-dioxane, bis (2,3-epoxycyclopentyl) ether and the like.
• EHPE-3150 softening temperature 71 ° C.
• aliphatic epoxy resins for example, diglycidyl ether of neopentyl glycol, diglycidyl ether of 1,4-butanediol, diglycidyl ether of 1,6-hexanediol, triglycidyl ether of glycerin, trimethyolpropane triacetate
• Polyglycidyl ether of a polyol etc. are mentioned.
• glycidyl ester type epoxy resins such as phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, diglycidyl-p-hydroxybenzoic acid, glycidyl ether-glycidyl ester of salicylic acid, dimer acid Glycidyl ester etc. are mentioned.
• glycidyl amine type epoxy resin for example, triglycidyl isocyanurate, N, N'-diglycidyl derivative of cyclic alkylene urea, N, N, O-triglycidyl derivative of p-aminophenol, N, N of m-aminophenol And O-triglycidyl derivatives.
• glycidyl acrylic epoxy resin for example, a copolymer of glycidyl (meth) acrylate and a radical polymerizable monomer such as ethylene, vinyl acetate, (meth) acrylic acid ester and the like can be mentioned.
• polyester type epoxy resins for example, polyester resins having one or more, preferably two or more epoxy groups per molecule, and the like can be mentioned.
• the epoxy resin for example, a polymer mainly composed of a conjugated diene compound such as epoxidized polybutadiene or a compound obtained by epoxidizing the double bond of unsaturated carbon in the polymer of partially hydrogenated product thereof is mentioned.
• a block copolymer having, in the same molecule, a polymer block mainly composed of a vinyl aromatic compound and a polymer block mainly composed of a conjugated diene compound or a polymer block of a partially hydrogenated product thereof as an epoxy resin
• compounds obtained by epoxidizing the double bond portion of unsaturated carbon possessed by the conjugated diene compound are mentioned, for example.
• the epoxy resin derivatives or hydrogenated products of these epoxy compounds may be used.
• a urethane modified epoxy resin, a polycaprolactone modified epoxy resin, etc. which introduced a urethane bond and a polycaprolactone bond in the structure of one of the above-mentioned epoxy resins are mentioned.
• thermosetting resin contains an epoxy resin which is liquid at normal temperature, it is preferable because of its excellent adhesion to the circuit board.
• thermosetting resin is 100 parts by weight, when 25 parts by weight or more of an epoxy resin which is liquid at normal temperature is contained, it is preferable because the ultraviolet laser processability is further improved.
• the epoxy resin which is liquid at normal temperature include bisphenol A epoxy resin, bisphenol F epoxy resin, and glycidyl ester epoxy resin.
• the curing agent is not particularly limited as long as it has a function of curing a thermosetting resin, and conventionally known curing agents can be used.
• epoxy resins for example, amine compounds, compounds synthesized from amine compounds, imidazole compounds, hydrazide compounds, melamine compounds, acid anhydrides, phenol compounds (phenol type curing agents), ester compounds, heat latent cations
• examples thereof include polymerization catalysts, photolatent cationic polymerization initiators, dicyandiamide and derivatives thereof. Among these, dicyandiamide, a phenol type curing agent, or an acid anhydride is preferable.
• These curing agents may be used alone or in combination of two or more.
• amine compound a chain
• chain aliphatic amine compound include ethylene diamine, diethylene triamine, triethylene tetramine, tetraethylene pentamine, polyoxypropylene diamine, polyoxypropylene triamine and the like.
• cyclic aliphatic amine compounds include mensene diamine, isophorone diamine, bis (4-amino-3-methylcyclohexyl) methane, diaminodicyclohexylmethane, bis (aminomethyl) cyclohexane, N-aminoethyl piperazine, Examples include 9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro (5,5) undecane and the like.
• aromatic amine compound m-xylenediamine, ⁇ - (m / p-aminophenyl) ethylamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, ⁇ , ⁇ -bis (4-aminophenyl) -p- Diisopropyl benzene etc. are mentioned.
• a polyamino amide compound, a polyamino imide compound, a ketimine compound etc. are mentioned, for example.
• combined from said amine compound and carboxylic acid are mentioned, for example.
• carboxylic acids include succinic acid, adipic acid, azelaic acid, sebacic acid, dodecadiic acid, isophthalic acid, terephthalic acid, dihydroisophthalic acid, tetrahydroisophthalic acid, hexahydroisophthalic acid and the like.
• maleimide compounds include diaminodiphenylmethane bismaleimide and the like.
• ketimine compound the compound etc. which are synthesize
• a compound synthesized from the above-mentioned amine compound for example, it is synthesized from the above-mentioned amine compound and a compound such as an epoxy compound, a urea compound, a thiourea compound, an aldehyde compound, a phenol compound and an acrylic compound.
• a tertiary amine compound for example, N, N-dimethylpiperazine, pyridine, picoline, benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, 1 , 8-Diazabiscyclo (5,4,0) undecene-1 and the like.
• the imidazole compound include 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole and the like.
• hydrazide compound examples include 1,3-bis (hydrazinocarboethyl) -5-isopropylhydantoin, 7,11-octadecadiene-1,18-dicarbohydrazide, eicosane diacid dihydrazide, adipic acid dihydrazide and the like. Can be mentioned.
• melamine compound examples include 2,4-diamino-6-vinyl-1,3,5-triazine and the like.
• the acid anhydride examples include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid anhydride, ethylene glycol bisanhydro trimellitate, glycerol trisane hydrotrimelitate Methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic anhydride, methyl nadic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, 5- (2,5-dioxo anhydride Tetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride adduct, dodecenyl succinic anhydride, polyazelaic anhydride, polydodecaned
• phenol compound examples include phenol novolac, o-cresol novolac, p-cresol novolac, t-butylphenol novolac, dicyclopentadiene cresol, derivatives thereof and the like.
• aminotriazine novolac (ATN) resin represented by the following formula (1) or terpene modified resin represented by the formula (2) can be used.
• ATN aminotriazine novolac
• terpene modified resin represented by the formula (2) terpene modified resin represented by the formula (2)
• the number n of repeating units is 1 to 10
• the number m of repeating units is 1 to 10.
• cresol aminotriazine novolac (CATN) resin examples of the phenol compound may be used alone or in combination of two or more.
• a curing accelerator may be used in combination with the above-mentioned curing agent for epoxy resin in order to adjust the curing speed and the physical properties of the cured product.
• the curing accelerator is not particularly limited, and examples thereof include imidazole curing accelerators and tertiary amine curing accelerators. Among them, the curing speed and physical properties of the cured product are adjusted. Because it is easy to control the reaction system, an imidazole-based curing accelerator is suitably used. These curing accelerators may be used alone or in combination of two or more.
• Examples thereof include 1-cyanoethyl-2-phenylimidazole in which the 1-position of the imidazole is protected by a cyanoethyl group, and trade name "2MA-OK" (manufactured by Shikoku Kasei Kogyo Co., Ltd.) whose basicity is protected by isocyanuric acid.
• These imidazole-type curing accelerators may be used alone or in combination of two or more.
• the weight ratio of the thermosetting resin to the curing agent is 30 to 70:70 to 30.
• the preferred weight ratio of the thermosetting resin to the curing agent is 40 to 70:60 to 30, and more preferably 50 to 70:50 to 30.
• the weight ratio of the curing agent to the epoxy resin is 30 or more, the possibility of insufficient curing of the epoxy resin is small.
• the curing agent is 70 or less, there is little possibility that the strength physical properties and the adhesion reliability of the cured epoxy resin product may be deteriorated by the excess curing agent.
• the equivalent ratio of the thermosetting resin to the curing agent is preferably epoxy 1: curing agent 0.7 to 1.5.
• silica is blended as an inorganic filler.
• Inorganic fillers include, besides silica, layered silicates, alumina, silicon nitride, hydrotalcite, kaolin and the like.
• spherical silica having an average particle diameter of 2 to 15 ⁇ m is preferable. If it is 2 ⁇ m or more, high packing can be performed, and if it is 15 ⁇ m or less, unevenness is hardly generated on the surface, and smoothness can be obtained.
• silica treated with a silane coupling agent is preferable.
• a silane coupling agent an epoxy silane coupling agent, an aminosilane coupling agent, a ketimine silane coupling agent, an imidazole silane coupling agent, a cationic silane coupling agent, etc. are mentioned.
• a silane coupling agent is used, the affinity to silica is improved, and thus the silica treated with the silane coupling agent is excellent in the reinforcing effect of the resin.
• the blending amount of silica is 10 to 100 parts by weight based on 100 parts by weight of the total of the thermosetting resin and the curing agent. In particular, it is preferable to blend 50 to 85 parts by weight.
• the amount is 10 parts by weight or more, the effect of lowering the linear expansion by the silica is sufficiently obtained, and the heat resistance such as the thermal cycle property and the high-temperature leaving property is also obtained.
• it is 100 parts by weight or less, sufficient adhesion and adhesion to the circuit board on which the cured resin is laminated can be obtained.
• the blending amount of silica is 10 to 120 parts by weight, preferably 25 to 120 parts by weight based on 100 parts by weight of components excluding the solvent in the thermosetting resin composition. Be part. It is particularly preferable to blend 35 to 100 parts by weight. If it is 25 parts by weight or more, the effect of lowering the linear expansion due to the silica can be sufficiently obtained, and heat resistance such as cold thermal cycleability and high-temperature leaving ability can also be obtained. On the other hand, if the amount is 120 parts by weight or less, sufficient adhesion and adhesion to the circuit board on which the cured resin is laminated can be obtained.
• the layered silicate which can be used as the above-mentioned inorganic filler is a silicate mineral having exchangeable metal cations between the layers, and montmorillonite, swelling mica, hectorite and the like can be mentioned.
• These layered silicates have improved heat resistance such as cold thermal cycleability and high-temperature storage stability due to a decrease in linear expansion coefficient when added in small amounts, as compared with the above-mentioned silica. Therefore, it is possible to suppress the decrease in adhesive strength with the substrate on which the cured resin product is laminated.
• a layered silicate When using a layered silicate, it is preferable to blend 0.1 to 25 parts by weight with respect to a total of 100 parts by weight of the thermosetting resin (A) and the curing agent (B). A more preferable range of the layered silicate is 0.5 to 10 parts by weight.
• the layered silicate is 0.1 parts by weight or more, the effect of reducing linear expansion by the layered silicate, and the effect of improving heat resistance such as cold thermal cycleability and high-temperature storage stability become remarkable.
• it if it is 25 parts by weight or less, the viscosity of the resin composition can ensure formability to a film-like shape or the like.
• the ultraviolet absorber may be either a cyanoacrylate compound (D1) or a benzophenone compound (D2), which may have an absorption band corresponding to the wavelength of the ultraviolet laser to be used.
• the ultraviolet absorber may be either a cyanoacrylate compound (D1) or a benzophenone compound (D2), which may have an absorption band corresponding to the wavelength of the ultraviolet laser to be used.
• the cyanoacrylate compound or the benzophenone compound can improve the processability of the cured epoxy resin product by the ultraviolet laser because it has an absorption maximum at around 300 nm.
• Cyanoacrylate and benzophenone are preferably those having good solubility in a solvent. However, those that contain chlorine to a certain extent that the electrical insulation may be degraded are excluded.
• the cyanoacrylate compound is a compound having an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group, an aryl group, an arylalkyl group, and / or two or more arylacryloxy groups, and has 2 to 6 carbon atoms
• Compounds having 8 alkyl groups and 2 aryl groups, or compounds having 2 or more arylacryloxy groups are preferred.
• the number of substituents is, for example, 1 to 5.
• Benzophenone compound (D2) examples include benzophenone, a compound having a functional group having any one of a hydroxyl group, a hydroxyalkyl group, an alkyloxy group, an aryloxy group, an arylalkyloxy group and a carboxy group or an acid anhydride thereof.
• Compounds having any functional group of hydroxyl group or hydroxyalkyl group or their acid anhydrides are preferred.
• the number of functional groups such as hydroxyl group is, for example, 1 to 5, preferably 2 to 4.
• benzophenone 2-hydroxy-4-methoxybenzophenone, 2,2-dihydroxy-4,4-dimethoxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy- 4,4'-dimethoxy-benzophenone, 3,3 ', 4,4'-benzophenonetetracarboxylic acid dianhydride and the like.
• the said ultraviolet absorber can also be used individually by 1 type, and can also be used in combination of 2 or more type.
• the content of the ultraviolet absorber is preferably 0.5 to 50 parts by weight with respect to the total amount of the thermosetting resin and the curing agent added. More preferably, it is 1.0 to 30 parts by weight, still more preferably 2.5 to 10 parts by weight. If the content is less than 0.5 parts by weight, the effect on processability is small, and if it exceeds 2.5 parts by weight, a remarkable effect appears. On the other hand, when the amount is 50 parts by weight or less, mechanical properties, electrical properties and the like due to the thermoplastic resin and the curing agent are not significantly reduced.
• Patent Document 2 discloses an interlayer insulating resin composition for a multilayer printed wiring board, which is obtained by blending a thermosetting resin with an ultraviolet absorber such as hydroxyphenylbenzotriazole. Then, it is described that "the processability can be improved by increasing the energy absorption efficiency at the time of ultraviolet laser processing and reducing the energy of the laser to be irradiated, and the cracks around the BVH can be reduced". However, even if such a hydroxyphenylbenzotriazole is used, productivity (processability) can not be improved in the technique of forming a groove in the surface of the insulating material with a laser.
• Solvent (E) In the resin composition of the present invention, a solvent is used to dissolve or disperse resin, silica, an ultraviolet light absorber, and the like .
• hydrocarbon solvents such as hexane, heptane, octane, toluene and xylene
• alcohol solvents such as methanol, ethanol, isopropanol, butanol, amino alcohol, 2-ethylhexyl alcohol and cyclohexanol
• hexyl ether, dioxane ethylene glycol monomethyl Ether solvents such as ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol diethyl ether, diethylene glycol monobutyl ether
• ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and isophorone; ethyl acetate,
• the compounding amount of the solvent is 20 to 500 parts by weight, preferably 50 to 300 parts by weight, more preferably 100 to 500 parts by weight, based on 100 parts by weight of the total of the thermosetting resin and the curing agent in the resin composition. It is 200 parts by weight.
• the amount is 20 parts by weight or more, the resin, silica, UV absorber, layered silicate and the like can be sufficiently dissolved or dispersed.
• the amount is 500 parts by weight or less, the energy for volatilizing the solvent is small, and temperature nonuniformity at the time of curing the resin composition due to solvent volatilization hardly occurs.
• thermoplastic resin may be blended, if necessary.
• the thermoplastic resin is not particularly limited.
• polyester resins thermoplastic urethane resins, polyamide resins, thermoplastic polyimide resins, ketone resins, norbornene resins, styrene-butadiene block copolymers, and polyphenylene ethers.
• These thermoplastic resins may be modified for the purpose of improving the compatibility with the epoxy resin component or the like, may be used alone, or two or more types may be used in combination.
• the resin composition of the present invention may contain a thixotropic agent and a dispersing agent, if necessary.
• the thixotropic agent is not particularly limited, and examples thereof include polyamide resin, fatty acid amide resin, polyamide resin and dioctyl phthalate resin.
• the resin film according to the present invention is a resin film obtained by drying the above-mentioned resin composition and forming it into a film, and the content of the solvent is 0.01 to 5 weight with respect to the whole resin composition. It is a department. When flexibility is required, the content of the solvent is preferably 0.1 parts by weight or more, more preferably 0.5 parts by weight or more, based on the entire resin composition.
• the resin film may be a single layer or a multilayer, but is preferably a multilayer (hereinafter also referred to as a multilayer insulating film).
• the method for producing the multilayer insulating film according to the present invention is not particularly limited, and for example, after (k) materials such as a thermosetting resin, a curing agent, an ultraviolet absorber, silica, and a solvent are kneaded by an extruder Extrusion, extrusion molding method of forming into sheet form using T die or circular die, (b) Raw materials such as thermosetting resin, curing agent, UV absorber, silica, etc. are dissolved or dispersed in solvent such as organic solvent After casting, casting and forming into a sheet form, and (c) other known sheet forming methods known in the art.
• materials such as a thermosetting resin, a curing agent, an ultraviolet absorber, silica, and a solvent are kneaded by an extruder Extrusion, extrusion molding method of forming into sheet form using T die or circular die,
• Raw materials such as thermosetting resin, curing agent, UV absorber, silica, etc. are dissolved or dispersed in solvent such as
• the thickness of the multilayer insulating film is not particularly limited, but is, for example, 10 to 300 ⁇ m, preferably 25 to 200 ⁇ m, and more preferably 50 to 180 ⁇ m. If the film thickness is 10 ⁇ m or more, insulation can be obtained. If the distance is 300 ⁇ m or less, the distance of the circuit between the electrodes will not be longer than necessary.
• the laminated resin film of the present invention is a laminated resin film formed by laminating the resin composition on a base material in a sheet form, and the sheet-like resin composition on the base material is dried, and the solvent is
• the present invention is characterized in that the content of (B) is 0.01 to 5 parts by weight with respect to the entire resin composition. If the content of the solvent in the laminated resin film is 0.01 parts by weight or more with respect to the entire resin composition, adhesion and adhesiveness can be obtained when laminating on a circuit board, and 5 parts by weight or less If it is, flatness after heat curing can be obtained.
• the laminated resin film of the present invention is used as an insulating material of a circuit board, and is characterized by being excellent in processability by an ultraviolet laser.
• polyester films such as polyethylene terephthalate (PET) film and polybutylene terephthalate (PBT) film, polypropylene (PP) film, polyimide film, polyimide amide film, polyphenylene sulfide film, A polyether imide film, a fluorine resin film, a liquid crystal polymer film, a copper foil, etc. may be mentioned, and it may be further subjected to a release treatment, if necessary.
• the average thickness is 5 to 150 ⁇ m, preferably 5 to 125 ⁇ m, particularly preferably 25 to 75 ⁇ m.
• a protective film may be laminated on the resin side and the base side in order to further prevent adhesion of dust and the like.
• the protective film may be the same material as the base material, or may be a different material.
• the protective film is preferably pressure-bonded to the substrate to such an extent that it can be relatively easily peeled off.
• a slight adhesion layer may be formed on the substrate side of the protective film and may be pressure-bonded.
• a release layer may be formed on the resin side of the protective film so as to facilitate release when releasing from the resin.
• the parting layer may be formed by applying a parting resin layer or a parting agent.
• plating is performed to such an extent that the groove is not filled, a circuit is formed as needed, or plating is not performed, electronic components such as semiconductor elements and capacitors are placed in the groove, and electrical wiring is formed as necessary.
• the filling of the insulating resin can be performed by applying and drying the resin composition of the present invention or by using a resin film of the present invention with a laminating machine or a pressing machine. And after forming a groove in the filled insulating resin and repeating each said process, laminating a copper foil on the filled insulating resin, or forming plating, a circuit can be formed.
• the method for producing a multilayer printed wiring board according to the present invention comprises: (1) placing a laminated film comprising a substrate, a thermosetting resin, a curing agent, an ultraviolet absorber, silica, and a resin composition containing a solvent on a circuit board After the first step of heating and pressurizing at a temperature of 10 to 200 ° C. and a pressure of 0.1 to 30 MPa, and (ii) heating the multilayer insulating film to a temperature of 60 to 200 ° C. And a second step of processing.
• the second layer of the multilayer insulating film is placed on the circuit surface formed on the printed circuit board, and heated with a press at a temperature of 10 to 200 ° C. and a pressure of 0.1 to 30 MPa. Press down.
• the first step to the second step may be performed in the same apparatus or in another apparatus. If the same device is used, it takes time to change the temperature and the productivity tends to be low, but the flatness is good. If it is another device, many facilities are needed instead of having no time of temperature change.
• a heating press and a roll laminator can be mentioned as a heating-pressing apparatus used for manufacture of the multilayer printed wiring board which concerns on this invention.
• a known plate such as a metal plate having a smooth surface, a cushioning material, a release film, a protective film, etc. can be inserted between the press die and the base of the multilayer laminate film.
• a cushioning material, a release film, a protective film, etc. can be used.
• the ultraviolet laser generally refers to a laser having a wavelength in the near ultraviolet (wavelength 380 to 200 nm) wavelength region among the ultraviolet (wavelength region 100 to 400 nm) wavelengths.
• the laser having such a wavelength include KrF excimer laser (wavelength 248 nm), YAG-FHG laser (wavelength 266 nm), YAG-THG laser (wavelength 366 nm), and the like.
• the irradiation conditions of the ultraviolet laser can not be generally defined because they differ depending on the thickness of the film to be treated, etc.
• the output is 0.04 mJ, and the number of shots is appropriately variable.
• the laser is not a carbon dioxide gas laser but an ultraviolet laser, the processability is large. Therefore, even in the case of a resin composition containing an inorganic substance, it is possible to form a groove which is deeper and has a uniform shape than conventional. Moreover, you may process with another laser, a carbon dioxide gas laser (wavelength 1064 nm), etc. as needed.
• the laminated multilayer printed wiring board is subjected to a swelling step, a step of roughening the resin surface, a step of depositing a plating catalyst on the roughened resin surface, and a further plating step I do.
• the swelling method is not particularly limited, and a conventionally known method is adopted.
• a treatment method using an aqueous solution or an organic solvent dispersion solution of a compound mainly composed of dimethylformamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, pyridine, sulfuric acid, sulfonic acid and the like can be mentioned.
• a method of immersing and rocking the multilayer printed wiring board at a treatment temperature of 40 to 85 ° C. for 1 to 20 minutes using an aqueous solution containing ethylene glycol, for example is preferable.
• the surface of the wiring pattern has a surface roughness corresponding to the mirror surface of the electrodeposited copper foil, and the surface roughness (Rz) is usually 0.5 to 2.5 ⁇ m, often 0.5 to 1 In the range of 0.5 ⁇ m.
• the smoothness of the wiring pattern tends to be further enhanced. Therefore, when the metal plating layer is formed directly on the wiring pattern formed as described above, the surface roughness (Rz) is often less than 1.1 ⁇ m. Therefore, it is desirable to roughen the surface of the multilayer insulating film.
• the method of roughening the surface of the multilayer insulating film is not particularly limited, and a conventionally known method is employed.
• manganese compounds such as potassium permanganate and sodium permanganate
• chromium compounds such as potassium dichromate and potassium anhydrous anhydrate
• persulfate compounds such as sodium persulfate, potassium persulfate and ammonium persulfate as main components
• An aqueous solution of a chemical oxidizing agent or a treatment method using an organic solvent dispersion solution may be mentioned.
• a method of immersing and rocking the multilayer printed wiring board at a treatment temperature of 70 to 85 ° C. using a permanganate solution or a sodium hydroxide solution is preferable.
• the step of attaching a plating catalyst to the roughened resin surface and the step of plating can be performed by a known method.
• the multilayer insulating film which has been treated with permanganate etc. is treated with a washing solution at 25 ° C., pure and washed well and dried.
• the metal plating formed here may be tin plating, solder plating, lead-free solder plating, nickel plating, etc. in addition to copper plating.
• the multilayer insulating film is treated with an alkaline cleaner and the surface is degreased and cleaned. After washing, the multilayer insulation film is treated with a pre-dip solution, and then the multilayer insulation film is treated with an activator solution and a palladium catalyst is applied. Next, it is treated with a reducing solution, the multilayer insulating film is put into a chemical copper solution, and electroless plating is performed until the plating thickness becomes about 0.5 ⁇ m.
• the metal plating layer is formed on the entire surface of the surface-roughened wiring pattern as described above. After electroless plating, annealing is performed to remove residual hydrogen gas. Next, electrolytic plating is performed on the resin sheet subjected to electroless plating. Thereafter, it is washed with pure water and sufficiently dried by a vacuum dryer. Finally, the plating other than the grooves is polished to obtain a circuit board having a smooth surface.
• Thermosetting resin 1 Biphenylphenol type epoxy (Nippon Kayaku Co., Ltd.
• Thermosetting resin 2 Bisphenol A epoxy (Epiclon 828US, Japan Epoxy Resin) ⁇ (3)
• Thermosetting resin 3 Phenoxy resin (YP-40ASM40, solid content 40%, Toto Kasei Co., Ltd.) ⁇
• Hardener 1 Biphenylphenol type hardener (MEH-7851H, manufactured by Meiwa Kasei Co., Ltd.) ⁇
• Hardening agent 2 Dicyandiamide (manufactured by ADEKA Co., Ltd. EH3636-AS) ⁇ (6)
• Hardener 3 aminotriazine novolac resin (Dainippon Ink Chemical Co., Ltd.
• Hardening agent 4 benzophenone tetracarboxylic acid dianhydride (manufactured by Daicel Chemical Industries, Ltd. BTDN) ⁇ (8) Hardening agent 5: Terpene-modified phenol novolak resin (Japan Epoxy Resins Co., Ltd.
• UV absorber 1 cyanoacrylate compound 1 (manufactured by BASF Uvinul 3035) -(10)
• UV absorber 2 cyanoacrylate compound 2 (Uvinul 3030 manufactured by BASF) (11)
• UV absorber 3 benzophenone compound (Uvinul 3050, manufactured by BASF) -(12)
• UV absorber 4 hydroxyphenyl benzotriazole (Sumisorb-200, manufactured by Sumitomo Chemical Co., Ltd.) ⁇ (13) Silica: (Admatex Co., Ltd.
• the electrical insulation property of the circuit board formed the copper pattern of 20 micrometers of wiring distance, and line
• the sheet-like resin composition constituting the laminated resin film was cut into about 1 cm square, and 50 pieces of weight (a) were measured.
• the resultant was dried in a vacuum dryer under a substantially vacuum condition for 3 days, and the weight (b) was measured.
• the content of the solvent in the sheet-like resin composition was determined by the following equation. ⁇ (A)-(b) ⁇ / (a) x 100 (%)
• Example 1 Biphenylphenol type epoxy resin (Nippon Kayaku Co., Ltd. NC-3000H) 32.4 parts by weight, biphenyl phenol resin (hardening agent) 32.4 parts by weight, dicyandiamide 1.62 parts by weight, imidazole compound 0. 03 parts by weight, cyanoacrylate compound 1, and 30 parts by weight of silica as an inorganic filler were blended.
• the cyanoacrylate compound 1 was blended in 3.5 parts by weight.
• the resin composition was prepared by uniformly kneading together with 130 parts by weight of methyl ethyl ketone as a solvent using a homodisper stirrer.
• the above resin composition was coated on a 50 ⁇ m-thick release-treated PET sheet so as to become 80 ⁇ m thick after drying, and two sheets dried at 70 ° C. for 1 hour at 40 ° C. It bonded by a heat
• the content of the solvent of the resin composition on the release PET is a sample of the laminated film cut into 10 cm square, and after measuring its weight, it is put into a 23 ° C. vacuum dryer and dried for 24 hours. went. The weight of the sample taken out of the drier was measured, and the weight difference before and after drying was divided by the weight before drying to determine the content of the solvent.
• the laminated film obtained as described above is placed on a circuit board, heated and pressed at a temperature of 100 ° C. and a pressure of 0.4 MPa for lamination, and then the multilayer insulating film is heated at a temperature of 180 ° C. It was cured by heating for time.
• a groove with a width of 20 ⁇ m and a depth of 10.5 ⁇ m was formed with an ultraviolet laser processing machine (manufactured by Hitachi Via Mechanics) at a wavelength of 355 nm, a pulse frequency of 30 kHz, an output of 0.04 mJ, and 10 shots.
• the processing depth was 128% when the following comparative example 1 was 100%.
• a laminated film is prepared in the same manner as above, and then the multilayer insulating film on the circuit board is immersed and rocked at a processing temperature of 75 ° C. for 20 minutes using an aqueous solution containing ethylene glycol, etc. It was processed.
• the multilayer insulating film is placed in a 70 ° C. potassium permanganate (concentrate compact CP, manufactured by Atotech Japan Co., Ltd.) roughened aqueous solution and shaken for 5 minutes. went.
• the multilayer insulating film after the permanganate treatment was treated for 2 minutes using a washing solution (Reduction Security G, manufactured by Atotech Japan Co., Ltd.) at 25 ° C., washed thoroughly with pure water, and dried.
• a washing solution Reduction Security G, manufactured by Atotech Japan Co., Ltd.
• the multilayer insulating film is treated for 5 minutes with an alkaline cleaner (cleaner security 902) at 60 ° C. The surface was degreased and cleaned.
• the multilayer insulating film was treated with a 25 ° C. pre-dip solution (Pre-dip Neogant B) for 2 minutes. Thereafter, the multilayer insulating film was treated with a 40 ° C.
• activator solution (Activator Neogant 834) for 5 minutes and coated with a palladium catalyst. Next, it was treated for 5 minutes with a 30 ° C. reducing solution (Reducer Neogant WA). Next, the multilayer insulating film was placed in a chemical copper solution (Basic Print Gantt MSK-DK, Kappa Print Gantt MSK, Stabilizer Print Gantt MSK), and electroless plating was performed until the plating thickness became about 0.5 ⁇ m. After electroless plating, annealing was performed at a temperature of 120 ° C. for 30 minutes to remove residual hydrogen gas.
• each step was carried out while making the processing solution 1 L in a beaker scale and swinging the multilayer insulating film.
• a photosensitive dry film (PHOTECH RY-3315 manufactured by Hitachi Chemical Co., Ltd.) is adhered onto the electroless plating at a temperature of 80 to 100 ° C. under a pressure of 0.3 to 0.4 MPa to bond it, The plating resist pattern was formed by performing development processing.
• electrolytic plating of the above sample was performed until the plating thickness became 10 ⁇ m, and a wiring pattern having a pattern width of 20 ⁇ m and a distance between patterns of 20 ⁇ m was formed.
• a copper sulfate plating solution was used as the electrolytic copper plating, and the current was 0.6 A / cm 2 . Then, the plating resist was peeled off, and the electroless plating between the patterns was removed by quick etching (Sugawara Densan SAC) to form a wiring. Thereafter, an after bake of 180 ° C. ⁇ 1 hr was performed. Thereafter, the substrate was thoroughly washed with pure water and thoroughly dried with a vacuum dryer to produce a circuit board. Finally, after laminating the resin composition on the circuit board under heating and pressure at a temperature of 100 ° C. and a pressure of 0.4 MPa, the multilayer insulating film is heated at a temperature of 180 ° C. for 2 hours to be cured.
• the circuit board for insulation evaluation was produced.
• the electrical insulation of this circuit board was ⁇ (good).
• the results are shown in Table 1 below.
• Table 1 the unit of content of a thermosetting resin, a hardening
• Example 1 A resin composition was prepared in the same manner as in Example 1 except that the ultraviolet absorber was not blended. In the same manner as in Example 1, a laminated film was prepared and laminated on a circuit board to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. The processing depth was 28% shallower than Example 1. (In evaluating the other examples and comparative examples, this depth is 100%.) Thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 1 below.
• Example 2 A resin composition was prepared in the same manner as Example 1, except that the ultraviolet absorber was changed to cyanoacrylate compound 2 as shown in Table 1 below. In the same manner as in Example 1, a laminated film was prepared to obtain a cured multilayer insulating film. Next, grooves were formed by the above-mentioned ultraviolet laser processing machine, and thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 1 below.
• Example 3 A resin composition was prepared in the same manner as Example 1, except that the ultraviolet absorber was changed to a benzophenone compound as shown in Table 1 below.
• a laminated film was prepared to obtain a cured multilayer insulating film.
• grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine.
• processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was measured, and the results are shown in Table 1 below.
• Examples 4 to 6, Example 12 The resin composition was prepared in the same manner as in Example 1 except that the blending amount of the ultraviolet absorber was changed as shown in Table 1 below.
• a laminated film was prepared to obtain a cured multilayer insulating film.
• grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. The processing depth of the grooves was as shown in Table 1.
• the treatment was carried out in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 1 below.
• Example 3 A resin composition was prepared in the same manner as in Example 4 except that the ultraviolet absorber was changed to hydroxyphenylbenzotriazole. In the same manner as in Example 1, a laminated film was prepared to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. Thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 1 below.
• Example 7 A resin composition was prepared in the same manner as in Example 1 except that aminotriazine novolac resin was used instead of the biphenyl phenol resin, and each component was changed as follows. 41.5 parts by weight of biphenyl phenol type epoxy resin, 21.9 parts by weight of aminotriazine novolak resin, 3.15 parts by weight of dicyandiamide, 0.03 parts by weight of imidazole compound, 30 parts by weight of silica, 3.5 parts by weight of cyanoacrylate compound 1 Department. A laminated film was prepared in the same manner as in Example 1 using this resin composition to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine.
• Example 4 A resin composition was prepared in the same manner as in Example 7 except that the ultraviolet absorber was not blended. In the same manner as in Example 7, a laminated film was prepared to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. Thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 2 below.
• Example 8 A resin composition was prepared in the same manner as in Example 1 except that benzophenonetetracarboxylic acid dianhydride or terpene-modified phenol novolak resin was used instead of the biphenylphenol resin, and each component was as follows.
• Example 8 43.0 parts by weight of biphenyl phenol type epoxy resin, 20.1 parts by weight of benzophenone tetracarboxylic acid dianhydride, 3.28 parts by weight of dicyandiamide, 0.03 parts by weight of imidazole compound, 30 parts by weight of silica
• the cyanoacrylate compound 1 is 3.5 parts by weight
• Example 9 43.0 parts by weight of a biphenylphenol type epoxy resin, 25.3 parts by weight of a terpene-modified phenol novolac resin, 3.28 parts by weight of dicyandiamide, imidazole 0.03 parts by weight of a compound, 30 parts by weight of silica, and 3.5 parts by weight of a cyanoacrylate compound.
• a laminated film was prepared in the same manner as in Example 1 using these resin compositions to obtain a cured multilayer insulating film.
• a groove was formed with an output of 0.04 mJ and a shot number of 10 using the ultraviolet laser processing machine.
• the processing depth of the grooves was as shown in Table 2.
• processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 2 below.
• Example 10 A resin composition was prepared in the same manner as in Example 1, except that the above-mentioned bisphenol A epoxy resin was used instead of the biphenylphenol type epoxy resin (NC-3000H), and each component was changed as follows. 27.5 parts by weight of bisphenol A type epoxy resin, 37.3 parts by weight of biphenyl phenol curing agent, 1.62 parts by weight of dicyandiamide, 0.03 parts by weight of imidazole compound, cyanoacrylate compound 1, and silica 30 as an inorganic filler Parts were blended. The cyanoacrylate compound 1 was compounded in an amount of 3.5 parts by weight with respect to the biphenyl phenol type epoxy resin and the biphenyl phenol resin (hardening agent).
• the resin composition was prepared by uniformly kneading together with 130 parts by weight of methyl ethyl ketone as a solvent using a homodisper stirrer.
• a laminated film was prepared in the same manner as in Example 1 using this resin composition to obtain a cured multilayer insulating film.
• grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine.
• processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. When the electrical insulation of this circuit board was evaluated, the result was good (o).
• Table 1 The results are shown in Table 1 below.
• Example 11 A resin composition was prepared in the same manner as Example 1, except that a layered silicate (synthetic smectite) was added, and each component was changed as follows.
• Biphenylphenol type epoxy resin NC-3000H
• biphenyl phenol curing agent 32.1 parts by weight
• dicyandiamide 1.60 parts by weight
• imidazole compound 0.03 parts by weight
• cyanoacrylate compound 1 inorganic substance 29.6 parts by weight of silica was blended as a filler.
• the cyanoacrylate compound 1 was compounded in an amount of 3.5 parts by weight with respect to the biphenyl phenol type epoxy resin and the biphenyl phenol resin (hardening agent).
• the resin composition was prepared by uniformly kneading together with 130 parts by weight of methyl ethyl ketone as a solvent using a homodisper stirrer.
• a laminated film was prepared in the same manner as in Example 1 using this resin composition to obtain a cured multilayer insulating film.
• grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine.
• processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. When the electrical insulation of this circuit board was evaluated, the result was good (o).
• Table 1 The results are shown in Table 1 below.
• Example 13 to 15 As shown in Table 1, a resin composition was prepared in the same manner as in Example 1 except that a mixture of thermosetting resin 1 and thermosetting resin 2 was used as the thermosetting resin, and the blending amount of the solvent was changed. Was prepared. In the same manner as in Example 1, a laminated film was prepared and laminated on a circuit board to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. The processing depth was evaluated, and the results are shown in Table 1. Thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 1 below.
• Example 16 As shown in Table 1, a resin composition was prepared in the same manner as in Example 1 except that a mixture of thermosetting resin 1 and thermosetting resin 3 was used as the thermosetting resin. In the same manner as in Example 1, a laminated film was prepared and laminated on a circuit board to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. The processing depth was evaluated, and the results are shown in Table 1. Thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 1 below.
• Example 7 A resin composition was prepared in the same manner as in Example 8 except that hydroxyphenylbenzotriazole was blended as a UV absorber. In the same manner as in Example 1, a laminated film was prepared to obtain a cured multilayer insulating film. Next, grooves were formed in the same manner as in Example 1 using the ultraviolet laser processing machine. The processing depth of the grooves was as shown in Table 2. Thereafter, processing was performed in the same manner as in Example 1 to obtain a circuit board having a smooth surface. The electrical insulation of this circuit board was evaluated, and the results are shown in Table 2 below.
• the resin composition of the present invention has a large processing depth by an ultraviolet laser and high processability, the resin film obtained using this is suitable as an electrical insulating material for a circuit board.

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• 2009
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