WO2009075206A1 - セラミック成形体の製造方法 - Google Patents

セラミック成形体の製造方法 Download PDF

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Publication number
WO2009075206A1
WO2009075206A1 PCT/JP2008/071930 JP2008071930W WO2009075206A1 WO 2009075206 A1 WO2009075206 A1 WO 2009075206A1 JP 2008071930 W JP2008071930 W JP 2008071930W WO 2009075206 A1 WO2009075206 A1 WO 2009075206A1
Authority
WO
WIPO (PCT)
Prior art keywords
firing
molded product
layer
constrained layer
ceramic molded
Prior art date
Application number
PCT/JP2008/071930
Other languages
English (en)
French (fr)
Inventor
Osamu Chikagawa
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009508640A priority Critical patent/JP4420136B2/ja
Publication of WO2009075206A1 publication Critical patent/WO2009075206A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
    • B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

　焼成工程で収縮抑制効果を十分に確保しつつ、焼成後に拘束層を容易に除去することが可能で、拘束層を除去する工程において被焼成体にダメージを与えることなく、寸法精度の高いセラミック成形体を確実に、しかも効率よく製造することを可能にする。 　低酸素雰囲気で焼成した場合には焼失せず、酸素分圧を高くして焼成した場合には焼失する焼失材料と、基材層の焼結温度では焼結しないセラミック粉末とを含む拘束層３１を用い、この拘束層を、焼成後にセラミック基板（セラミック成形体）となる基材層Ａ'の少なくとも一方の主面に配設し、第１焼成工程では、低酸素雰囲気下において焼成（拘束焼成）を行って基材層Ａ'を焼結させ、第２焼成工程では、第１焼成工程より酸素分圧の高い条件で焼成を行って、拘束層３１を構成する焼失材料を焼失させ、その後の拘束層３１の除去を容易にする。
PCT/JP2008/071930 2007-12-11 2008-12-03 セラミック成形体の製造方法 WO2009075206A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009508640A JP4420136B2 (ja) 2007-12-11 2008-12-03 セラミック成形体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007319974 2007-12-11
JP2007-319974 2007-12-11

Publications (1)

Publication Number Publication Date
WO2009075206A1 true WO2009075206A1 (ja) 2009-06-18

Family

ID=40755450

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071930 WO2009075206A1 (ja) 2007-12-11 2008-12-03 セラミック成形体の製造方法

Country Status (3)

Country Link
JP (1) JP4420136B2 (ja)
TW (1) TWI388533B (ja)
WO (1) WO2009075206A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112218749A (zh) * 2018-05-31 2021-01-12 康宁股份有限公司 蜂窝体制造方法
CN115557795A (zh) * 2022-09-07 2023-01-03 广东环波新材料有限责任公司 一种低温共烧陶瓷基板烧平方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458693B (zh) * 2011-09-06 2014-11-01 Univ Far East A method for producing a high strength porous substrate using liquid crystal glass powder
EP3409467B1 (de) * 2017-05-30 2019-07-03 Heraeus Nexensos GmbH Heizer mit einem co-gesinterten mehrschichtenaufbau

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279132A (ja) * 1992-03-31 1993-10-26 Toray Ind Inc シート状物熱処理方法
JPH1095677A (ja) * 1996-09-24 1998-04-14 Matsushita Electric Works Ltd セラミック基板の製造方法
JP2001291959A (ja) * 2000-04-06 2001-10-19 Murata Mfg Co Ltd 多層セラミック基板の製造方法および銅系導電性ペースト
JP2002353624A (ja) * 2001-05-25 2002-12-06 Murata Mfg Co Ltd 多層セラミック基板およびその製造方法、未焼結セラミック積層体、ならびに電子装置
JP2005347674A (ja) * 2004-06-07 2005-12-15 Hitachi Metals Ltd 多層セラミック基板の製造方法及び多層セラミック基板
WO2008020534A1 (fr) * 2006-08-18 2008-02-21 Murata Manufacturing Co., Ltd. Procédé de fabrication de corps en céramique moulés

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279132A (ja) * 1992-03-31 1993-10-26 Toray Ind Inc シート状物熱処理方法
JPH1095677A (ja) * 1996-09-24 1998-04-14 Matsushita Electric Works Ltd セラミック基板の製造方法
JP2001291959A (ja) * 2000-04-06 2001-10-19 Murata Mfg Co Ltd 多層セラミック基板の製造方法および銅系導電性ペースト
JP2002353624A (ja) * 2001-05-25 2002-12-06 Murata Mfg Co Ltd 多層セラミック基板およびその製造方法、未焼結セラミック積層体、ならびに電子装置
JP2005347674A (ja) * 2004-06-07 2005-12-15 Hitachi Metals Ltd 多層セラミック基板の製造方法及び多層セラミック基板
WO2008020534A1 (fr) * 2006-08-18 2008-02-21 Murata Manufacturing Co., Ltd. Procédé de fabrication de corps en céramique moulés

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112218749A (zh) * 2018-05-31 2021-01-12 康宁股份有限公司 蜂窝体制造方法
CN112218749B (zh) * 2018-05-31 2022-10-04 康宁股份有限公司 蜂窝体制造方法
US11866375B2 (en) 2018-05-31 2024-01-09 Corning Incorporated Honeycomb body manufacturing methods
CN115557795A (zh) * 2022-09-07 2023-01-03 广东环波新材料有限责任公司 一种低温共烧陶瓷基板烧平方法

Also Published As

Publication number Publication date
TWI388533B (zh) 2013-03-11
JPWO2009075206A1 (ja) 2011-04-28
TW200927701A (en) 2009-07-01
JP4420136B2 (ja) 2010-02-24

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