WO2009069284A1 - 熱伝導性樹脂組成物 - Google Patents

熱伝導性樹脂組成物 Download PDF

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Publication number
WO2009069284A1
WO2009069284A1 PCT/JP2008/003469 JP2008003469W WO2009069284A1 WO 2009069284 A1 WO2009069284 A1 WO 2009069284A1 JP 2008003469 W JP2008003469 W JP 2008003469W WO 2009069284 A1 WO2009069284 A1 WO 2009069284A1
Authority
WO
WIPO (PCT)
Prior art keywords
parts per
per weight
resin composition
heat conductive
conductive resin
Prior art date
Application number
PCT/JP2008/003469
Other languages
English (en)
French (fr)
Inventor
Takayuki Miyashita
Takashi Usami
Miki Watanabe
Original Assignee
Polyplastics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co., Ltd. filed Critical Polyplastics Co., Ltd.
Priority to CN200880118445.2A priority Critical patent/CN101878268B/zh
Publication of WO2009069284A1 publication Critical patent/WO2009069284A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　本発明は、絶縁性があり、成形性に優れた熱伝導性の高い材料を提供する。詳しくは、(A)液晶性ポリマー100重量部に対し、(B)熱伝導率が３Ｗ／ｍ・Ｋ以上、平均粒径が１～300μmの板状フィラー10～300重量部及び(C)熱伝導率が３Ｗ／ｍ・Ｋ以上で、平均粒径が(B)板状フィラーの１／10～１／200である粉粒状フィラー10～300重量部を添加してなり、(B)、(C)成分の総添加量を(A)液晶性ポリマー100重量部に対し20～500重量部とし、(B)成分と(C)成分の添加比率を３：１～１：３とする。
PCT/JP2008/003469 2007-11-28 2008-11-26 熱伝導性樹脂組成物 WO2009069284A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880118445.2A CN101878268B (zh) 2007-11-28 2008-11-26 导热性树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007306874A JP5297639B2 (ja) 2007-11-28 2007-11-28 熱伝導性樹脂組成物
JP2007-306874 2007-11-28

Publications (1)

Publication Number Publication Date
WO2009069284A1 true WO2009069284A1 (ja) 2009-06-04

Family

ID=40678195

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003469 WO2009069284A1 (ja) 2007-11-28 2008-11-26 熱伝導性樹脂組成物

Country Status (3)

Country Link
JP (1) JP5297639B2 (ja)
CN (1) CN101878268B (ja)
WO (1) WO2009069284A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2695914A4 (en) * 2011-04-06 2015-06-03 Shenzhen Wote Advanced Materials Co Ltd HEAT-LEADING POLYMER COMPOSITE AND ARTICLES THEREWITH
JP2015117351A (ja) * 2013-12-20 2015-06-25 東レ株式会社 液晶性ポリエステル樹脂組成物およびそれを用いた金属複合成形品
EP2479202A4 (en) * 2009-09-16 2017-08-30 Kaneka Corporation Thermally-conductive organic additive, resin composition, and cured product

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5177089B2 (ja) * 2008-07-30 2013-04-03 東レ株式会社 ポリアリーレンスルフィド樹脂組成物、ポリアリーレンスルフィド樹脂組成物錠剤およびそれらから得られる成形品
JP5684999B2 (ja) * 2009-08-06 2015-03-18 株式会社カネカ ブロー成形用高熱伝導性熱可塑性樹脂組成物
JP5680873B2 (ja) * 2009-08-20 2015-03-04 株式会社カネカ 高熱伝導性熱可塑性樹脂および熱可塑性樹脂成形体
JP5490604B2 (ja) * 2009-09-18 2014-05-14 株式会社カネカ 熱可塑性樹脂組成物および放熱・伝熱用樹脂材料
JP5543789B2 (ja) * 2010-01-22 2014-07-09 三菱エンジニアリングプラスチックス株式会社 熱伝導性ポリアルキレンテレフタレート系樹脂組成物および樹脂成形体
CN101899209B (zh) * 2010-03-30 2012-12-26 金发科技股份有限公司 一种导热绝缘材料及其制备方法
JP5476203B2 (ja) * 2010-04-26 2014-04-23 株式会社カネカ 高熱伝導性熱可塑性樹脂組成物
JP5543895B2 (ja) * 2010-10-21 2014-07-09 三菱エンジニアリングプラスチックス株式会社 熱伝導性ポリアルキレンテレフタレート系樹脂組成物
KR20140020245A (ko) * 2011-02-10 2014-02-18 도와 일렉트로닉스 가부시키가이샤 금속 코팅재
KR101238238B1 (ko) 2011-05-26 2013-03-04 주식회사 케이에이치바텍 박막 세라믹 회로기판 모듈 및 열전도성 접착조성물
JP5730704B2 (ja) * 2011-07-27 2015-06-10 上野製薬株式会社 液晶ポリマー組成物
CN103160134A (zh) * 2011-12-14 2013-06-19 中国钢铁股份有限公司 导热性聚合物复合材料
JP5914934B2 (ja) * 2012-02-28 2016-05-11 住友化学株式会社 液晶ポリエステル組成物、成形体及び発光装置
CN102856521A (zh) * 2012-09-19 2013-01-02 蚌埠鑫源石英材料有限公司 用于锂电池的板状α-氧化铝涂层
JP6776099B2 (ja) * 2016-11-15 2020-10-28 上野製薬株式会社 液晶ポリマー組成物
JP2019169619A (ja) * 2018-03-23 2019-10-03 三菱マテリアル株式会社 金属ベース基板およびモジュール
JP7310095B2 (ja) * 2018-03-30 2023-07-19 トヨタ自動車株式会社 電池温度調節装置
EP3932987A4 (en) * 2019-02-25 2022-11-23 Kuraray Co., Ltd. WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING THE SAME, WATERPROOFING METHOD USING INSERT MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139733A (ja) * 1999-09-01 2001-05-22 Kitagawa Ind Co Ltd 熱伝導シート及びその製造方法
JP2005146124A (ja) * 2003-11-14 2005-06-09 Toray Ind Inc フィラー高充填樹脂組成物およびそれから得られる成形品
JP2005343983A (ja) * 2004-06-02 2005-12-15 Denki Kagaku Kogyo Kk 無機質粉末及びその用途
JP2006276477A (ja) * 2005-03-29 2006-10-12 Canon Inc 定着フィルム及び定着装置
JP2007182990A (ja) * 2005-12-08 2007-07-19 Toray Ind Inc トルクリミッタ部品用樹脂組成物、それからなるトルクリミッタ部品
JP2008133382A (ja) * 2006-11-29 2008-06-12 Polyplastics Co 熱伝導性樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1318508C (zh) * 2005-11-25 2007-05-30 华南理工大学<Del/> 注射成型的导热绝缘塑料

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139733A (ja) * 1999-09-01 2001-05-22 Kitagawa Ind Co Ltd 熱伝導シート及びその製造方法
JP2005146124A (ja) * 2003-11-14 2005-06-09 Toray Ind Inc フィラー高充填樹脂組成物およびそれから得られる成形品
JP2005343983A (ja) * 2004-06-02 2005-12-15 Denki Kagaku Kogyo Kk 無機質粉末及びその用途
JP2006276477A (ja) * 2005-03-29 2006-10-12 Canon Inc 定着フィルム及び定着装置
JP2007182990A (ja) * 2005-12-08 2007-07-19 Toray Ind Inc トルクリミッタ部品用樹脂組成物、それからなるトルクリミッタ部品
JP2008133382A (ja) * 2006-11-29 2008-06-12 Polyplastics Co 熱伝導性樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2479202A4 (en) * 2009-09-16 2017-08-30 Kaneka Corporation Thermally-conductive organic additive, resin composition, and cured product
EP2695914A4 (en) * 2011-04-06 2015-06-03 Shenzhen Wote Advanced Materials Co Ltd HEAT-LEADING POLYMER COMPOSITE AND ARTICLES THEREWITH
JP2015117351A (ja) * 2013-12-20 2015-06-25 東レ株式会社 液晶性ポリエステル樹脂組成物およびそれを用いた金属複合成形品

Also Published As

Publication number Publication date
JP2009127026A (ja) 2009-06-11
CN101878268B (zh) 2012-11-07
CN101878268A (zh) 2010-11-03
JP5297639B2 (ja) 2013-09-25

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