WO2009060855A1 - 貼合せ基板製造装置および貼合せ基板製造方法 - Google Patents

貼合せ基板製造装置および貼合せ基板製造方法 Download PDF

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Publication number
WO2009060855A1
WO2009060855A1 PCT/JP2008/070114 JP2008070114W WO2009060855A1 WO 2009060855 A1 WO2009060855 A1 WO 2009060855A1 JP 2008070114 W JP2008070114 W JP 2008070114W WO 2009060855 A1 WO2009060855 A1 WO 2009060855A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
bonding substrate
substrate manufacturing
bonding
base section
Prior art date
Application number
PCT/JP2008/070114
Other languages
English (en)
French (fr)
Inventor
Seiichi Sato
Mitsuru Yahagi
Hirofumi Minami
Kazuhiro Musha
Junpei Yuyama
Masao Murata
Takahiro Miyata
Kyuzo Nakamura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880108048.7A priority Critical patent/CN101801646B/zh
Priority to JP2009540055A priority patent/JP4839407B2/ja
Priority to KR1020107006124A priority patent/KR101195085B1/ko
Publication of WO2009060855A1 publication Critical patent/WO2009060855A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

　上基板と下基板とを位置合わせしつつ貼り合わせて貼合せ基板を製造する貼合せ基板製造装置であって：前記下基板を載置するベース部と；このベース部に立設された支持棒と；この支持棒に沿って上下移動可能であり、かつ、前記上基板を保持可能な上加圧部材と；を備え、前記上加圧部材を下降させることにより、前記上加圧部材に保持された前記上基板と前記ベース部に載置された前記下基板とが貼り合わせられることを特徴とする。
PCT/JP2008/070114 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法 WO2009060855A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880108048.7A CN101801646B (zh) 2007-11-08 2008-11-05 粘合基板制造装置和粘合基板制造方法
JP2009540055A JP4839407B2 (ja) 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法
KR1020107006124A KR101195085B1 (ko) 2007-11-08 2008-11-05 접합 기판 제조 장치 및 접합 기판 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007290912 2007-11-08
JP2007-290912 2007-11-08

Publications (1)

Publication Number Publication Date
WO2009060855A1 true WO2009060855A1 (ja) 2009-05-14

Family

ID=40625743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070114 WO2009060855A1 (ja) 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法

Country Status (5)

Country Link
JP (1) JP4839407B2 (ja)
KR (1) KR101195085B1 (ja)
CN (1) CN101801646B (ja)
TW (1) TW200941614A (ja)
WO (1) WO2009060855A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140182761A1 (en) * 2012-12-28 2014-07-03 Shibaura Mechatronics Corporation Bonding apparatus and bonding process method
JP2014186171A (ja) * 2013-03-22 2014-10-02 Toshiba Corp 表示装置の製造装置、および表示装置の製造方法
JP6049820B1 (ja) * 2015-07-24 2016-12-21 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP2017163166A (ja) * 2017-06-21 2017-09-14 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101470921B1 (ko) * 2012-10-16 2014-12-10 주식회사 글로벌스탠다드테크놀로지 기판 합착장치 및 기판 합착 방법
CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2002131762A (ja) * 2000-10-30 2002-05-09 Shinetsu Engineering Kk 液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238456A (ja) * 2004-02-24 2005-09-08 Sumitomo Chemical Co Ltd 偏肉大型導光板の製造方法
JP4078487B2 (ja) * 2005-05-25 2008-04-23 株式会社日立プラントテクノロジー 基板組立装置及び方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2002131762A (ja) * 2000-10-30 2002-05-09 Shinetsu Engineering Kk 液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140182761A1 (en) * 2012-12-28 2014-07-03 Shibaura Mechatronics Corporation Bonding apparatus and bonding process method
US9741596B2 (en) * 2012-12-28 2017-08-22 Shibaura Mechatronics Corporation Bonding apparatus and bonding process method
JP2014186171A (ja) * 2013-03-22 2014-10-02 Toshiba Corp 表示装置の製造装置、および表示装置の製造方法
US10120216B2 (en) 2013-03-22 2018-11-06 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing display device
JP6049820B1 (ja) * 2015-07-24 2016-12-21 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP2017163166A (ja) * 2017-06-21 2017-09-14 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法

Also Published As

Publication number Publication date
KR101195085B1 (ko) 2012-10-29
CN101801646A (zh) 2010-08-11
JP4839407B2 (ja) 2011-12-21
JPWO2009060855A1 (ja) 2011-03-24
TW200941614A (en) 2009-10-01
CN101801646B (zh) 2013-04-17
KR20100057653A (ko) 2010-05-31

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