WO2009060861A1 - 貼合せ基板製造装置および貼合せ基板製造方法 - Google Patents

貼合せ基板製造装置および貼合せ基板製造方法 Download PDF

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Publication number
WO2009060861A1
WO2009060861A1 PCT/JP2008/070121 JP2008070121W WO2009060861A1 WO 2009060861 A1 WO2009060861 A1 WO 2009060861A1 JP 2008070121 W JP2008070121 W JP 2008070121W WO 2009060861 A1 WO2009060861 A1 WO 2009060861A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
bonding substrate
substrate manufacturing
bonding
pressurizing member
Prior art date
Application number
PCT/JP2008/070121
Other languages
English (en)
French (fr)
Inventor
Seiichi Sato
Mitsuru Yahagi
Hirofumi Minami
Kazuhiro Musha
Junpei Yuyama
Masao Murata
Takahiro Miyata
Kyuzo Nakamura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880109657A priority Critical patent/CN101808810A/zh
Priority to JP2009540058A priority patent/JP4955069B2/ja
Priority to KR1020107008841A priority patent/KR101246800B1/ko
Publication of WO2009060861A1 publication Critical patent/WO2009060861A1/ja

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

 上基板と下基板とを位置合わせしつつ貼り合わせて貼合せ基板を製造する貼合せ基板製造装置であって、前記下基板を載置する載置テーブルと;この載置テーブルを移動させる移動機構と;この移動機構が設置されたベース部と;このベース部に立設された支持棒と;この支持棒に沿って上下移動可能であり、かつ、前記上基板を保持可能な上加圧部材と;を備え、前記上加圧部材を下降させることにより、前記上加圧部材に保持された前記上基板と前記載置テーブルに載置された前記下基板とが貼り合わされる。
PCT/JP2008/070121 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法 WO2009060861A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880109657A CN101808810A (zh) 2007-11-08 2008-11-05 粘合基板制造装置和粘合基板制造方法
JP2009540058A JP4955069B2 (ja) 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法
KR1020107008841A KR101246800B1 (ko) 2007-11-08 2008-11-05 접합기판 제조장치 및 접합기판 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-290913 2007-11-08
JP2007290913 2007-11-08

Publications (1)

Publication Number Publication Date
WO2009060861A1 true WO2009060861A1 (ja) 2009-05-14

Family

ID=40625748

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070121 WO2009060861A1 (ja) 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法

Country Status (5)

Country Link
JP (1) JP4955069B2 (ja)
KR (1) KR101246800B1 (ja)
CN (1) CN101808810A (ja)
TW (1) TW200928503A (ja)
WO (1) WO2009060861A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5837247B1 (ja) * 2015-03-31 2015-12-24 株式会社日立製作所 基板組立装置とそれを用いた基板組立方法
US10487863B2 (en) * 2017-02-17 2019-11-26 Ford Global Technologies, Llc Castellated joint for improved adhesive coverage when using mechanical fixings and adhesive in one joint
KR101953761B1 (ko) * 2017-10-13 2019-03-04 한국기계연구원 복제 스탬프 제조장치 및 이의 제조방법
KR102520642B1 (ko) * 2020-12-29 2023-04-11 주식회사 기가레인 패턴 정렬 가능한 전사 장치
CN115072369B (zh) * 2022-06-28 2024-07-09 深圳市华星光电半导体显示技术有限公司 搬运组件及成膜装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2002131762A (ja) * 2000-10-30 2002-05-09 Shinetsu Engineering Kk 液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3535044B2 (ja) * 1999-06-18 2004-06-07 株式会社 日立インダストリイズ 基板の組立て装置とその方法、及び液晶パネルの製造方法
TWI257515B (en) * 2002-11-16 2006-07-01 Lg Philips Lcd Co Ltd Substrate bonding apparatus for liquid crystal display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2002131762A (ja) * 2000-10-30 2002-05-09 Shinetsu Engineering Kk 液晶パネル用基板の貼り合わせ装置及び貼り合わせ方法

Also Published As

Publication number Publication date
JP4955069B2 (ja) 2012-06-20
KR101246800B1 (ko) 2013-03-26
KR20100060001A (ko) 2010-06-04
TW200928503A (en) 2009-07-01
CN101808810A (zh) 2010-08-18
JPWO2009060861A1 (ja) 2011-03-24

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