200928503 九、發明說明： 【發明所屬之技術領域】 本發明係關於貼合基板製造裝置及貼合基板製造方法。 本申請案基於2007年11月8日於日本申請之曰本特願 2007-29091 3號來主張優先權，於此引用其内容。 【先前技術】 液晶顯示器或電漿顯示器等平面面板顯示器（FPD)係含 有貼合2片基板之構造。例如液晶顯示器係以數μπι程度之 G 間隔對向配置複數TFT(薄膜電晶體）形成矩陣狀之陣列基 板（TFT基板）、及形成有彩色渡光器或遮光膜等之彩色遽 光器基板（CF基板）’於兩基板間封入液晶，並且以含光硬 化性樹脂之密封構件（接著劑），將兩基板互相貼合而製 造。此外，該2片基板之貼合係於真空環境下進行，用以 防止不純氣體之混入等。 作為該類使2片基板貼合之裝置，據知有例如專利文獻1 之基板貼合裝置《專利文獻1之基板貼合裝置具備：真空 ® 腔室，其係以上侧容器及下侧容器所構成；上基板搬送治 具，其係用以使上基板移動；第一支持棒，其係用以使上 側容器上下移動；基座板，其係支持該支持棒；及第二支 持棒’其係用以使上基板搬送治具上下移動。 於上述基板貼合裝置，使第一支持棒往下方移動，上側 容器與下側容器抵接而構成真空腔室，並且使第二支持棒 往下方移動，降下上基板搬送治具，使上基板與下基板隔 著特定間隔而對向配置。其後，進行上基板與下基板之對 135949.doc 200928503 位，使該等貼合。 [專利文獻1]日本特開2007-212572號公報 【發明内容】 [發明所欲解決之問題] 上述專利文獻1之貼合基板製造裝置係將處理室内抽取 真空後，進行上基板與下基板之對位，使該等2片基板貼 合。然而，於進行上基板與下基板之對位後，若藉由使基 座板所備有之第二支持棒移動來移動上基板搬送治具，則 © 唯恐上基板與下基板之位置會相對地偏離。此係由於複數 構件介在基座板至下基板間，配置有下基板之下側容器與 第二支持棒所備有之基座板進行不同之運動所致。如此， 具有良率由於上基板與下基板之相對位置偏離而降低之問 題。 本發明係有鑑於上述事情所完成者，其所欲解決之問題 在於提供一種可提升2片基板之對位精度、提升良率之貼 合基板製造裝置及貼合基板製造方法。 ϋ [解決問題之技術手段] 關於本發明之貼合基板製造裝置係一面將上基板與下基 板對位一面貼合而製造貼合基板；且包含·載置台其係 载置前述下基板；移動機構，其係使該載置台移動；基座 部，其係設置有該移動機構；支持棒，其係立設於該基座 部；及上加壓構件，其係可沿著該支持棒上下移動，且可 2持别述上基板，·藉由使前述上加㈣件下降以貼合由 月’J述上加壓構件所保持之前述上基板與載置於前述載置台 135949.doc -8 - 200928503 之前述下基板。 若根據上述貼合基板製造裝置，由於保持有上基板之上 加壓構件及載置有下基板之載置台均由基座部所支持，因 此可將介在上基板與下基板間之構件數抑制在最小限度。 藉此，於進行上基板與下基板之對位後至貼合為止之期 - 間，可防止上基板與下基板之相對位置偏離。其結果，可 * 提升2片基板之對位精度、提升良率。而且，由於下基板 載置於載置台，因此可安定保持下基板，可高精度地進行 ® 下基板與上基板之對位。 於前述上加壓構件及前述基座部之至少任一方，以圍繞 配置别述上基板或前述下基板之區域之方式設置有密封構 件，於由前述密封構件、前述上加壓構件及前述基座部所 圍起之空間形成貼合處理室亦可。 該情況下，由於能以上加壓構件、基座部及密封構件來 構成貼合處理室，因此可減少零件數。其結果，可將裝置 予以小型•輕量化。 參 前述貼合基板製造裝置進一步包含減壓機構，其係將前 述貼合處理室之内部減壓；藉由該減壓機構將前述貼合處 - 理室減壓時，前述貼合處理室由前述密封構件所密閉亦 可。 該情況下，由於密封構件介裝於上加壓構件與基座部 間，因此將貼合處理室減壓時，可確實地密閉該貼合處理 室。因此，可確實地將貼合處理室減壓，可製造所需之貼 合基板。 135949.doc 200928503 前述密封構件亦可包+:接合部，其係對於前述基座部 及則述上加壓構件之一方上下移動，構成前述貼合處理室 之壁部；及密封塾，其係設置於該接合部，抵接於前述基 座部或前述上加壓構件以確保前述貼合處理室之氣密性。 該清况下，由於接合部對於基座部或上加壓構件上下移 動而構成貼合處理室之壁部，因此即使上加壓構件上升， 仍可將貼合處理室保持於密閉狀態。藉此，即使於分離配 置下基板與上基板以增大氣導之狀態仍可將貼合處理室 減壓，其結果可縮短減壓時間。 而且，關於本發明之貼合基板製造方法係於設置於基座 部之載置台載置下基板，藉由可沿著立設於前述基座部之 支持棒上下移動之上加壓構件來保持上基板，一面將前述 下基板與前述上基板對位一面貼合而製造貼合基板；且包 含以下步冑.上基板移動步驟，其係使前述上加麼構件下 降，將前述下基板與前述上基板隔著特定間隔而而對向配 置；處理室形成步驟，其係藉由密封構件密閉前述上加壓 構件與前述基座㈣，形成收容前述上基板及前述下基板 之貼合處理室；減壓步驟，其係將前述貼合處理室内減 壓；基板對位步驟，其係藉由移動機構使前述下基板移 動，進行前述下基板與前述上基板之對位；及基板貼合步 驟，其係使前述上加壓構件下降以貼合前述下基板與前述 上基板。 根據上述貼合基板製造方法，由於保持有上基板之上加 壓構件係由立設於設置有載置下基板之載置台之基座部之 135949.doc • 10_ 200928503 支持棒所導引而上下移動，因此可將介在上基板與下基板 間之構件數抑制在最小限度。藉此，於進行上基板與下基 板之對位後至貼合為止之期間，可防止上基板與下基板之 位置關係偏離。因此，可提升2片基板之對位精度、提升 良率。 而且’於僅特定距離分離配置下基板與上基板之狀態， 將貼合處理室減壓，因此可於氣導大之狀態下減壓。藉 此’可縮短減壓時間。 再者，將貼合處理室内減壓後，可藉由移動機構進行下 基板與上基板之對位。因此，進行下基板與上基板之對位 後’不需再度使上加壓構件上升，可提升生產效率。 【實施方式】 [發明之效果] 由於保持有上基板之上加壓構件及載置有下基板之載置 台均由基座部所支持，因此可將介在上基板與下基板間之 構件抑制在最小限度。 藉此’於進行上基板與下基板之對位後至貼合為止之期 間，可防止上基板與下基板之位置關係偏離。因此，具有 提升2片基板之對位精度、提升良率之效果。而且，由於 下基板載置於載置台，因此可安定保持下基板，其結果可 高精度地進行下基板與上基板之對位。 (第一實施型態）（貼合基板製造裝置） 根據圖1至圖12來說明關於本發明之第一實施型態之貼 合基板製造裝置。 135949.doc 200928503 圖1為貼合基板製造裝置之正面概略圖；圖2係沿著圖1 之A-A線之剖面圖。如圖1及圖2所示，貼合基板製造裝置 1〇具備：基座部11’其係載置下基板W1;支持棒13，其 係立設於基座部11 ;及上加壓構件15，其係由支持棒13所 支持’可沿著支持棒13上下移動，且可保持上基板W2。 基座部11具有剛性，大致形成直方體形狀。基座部“係 於其下面21之四角設有腳22而載置於地板。另一方面，基 座部11之上面23係於俯視看來形成長方形。於上面23，形 成在俯視看來大於下基板W1之凹部25。於凹部25之大致 中央部及四角’設有可移動於正交2軸水平方向及水平旋 轉方向（以下稱水平面内方向）之χγθ導件27。而且，於凹 部25之周緣部之χΥΘ導件27彼此之大致中央部，配置含有 與ΧΥΘ導件27具有相同構造之χγθ導件，且設有致動器33 之移動機構29。總言之，於凹部25，配置有5個ΧΥΘ導件 27及4個移動機構29。此外，ΧΥΘ導件27之表面28與移動 機構29之表面30係配置為齊平面。 於ΧΥΘ導件27及移動機構29之上部，設有於俯視看來呈 矩形狀之載置台31。於載置台31之上面32,可載置下基板 W1。藉由驅動移動機構29,可使載置台31往水平面内方 向移動。總言之，可使下基板W1往水平面内方向移動。 ΧΥ0導件27大致為3層構造，以固定於基座部u之基座 固定部27a、固定於載置台31之台固定部27c、及配置於基 座固定部27a與台固定部27c間並可往水平面内方向移動之 移動部27b所構成。 135949.doc 12 200928503 藉由驅動移動機構29之致動器33，移動部27b會往所需 方向移動。於此，例如可將設置於凹部25之長邊方向中央 之移動機構2如沿著又方向（載置台31之長邊方向）移動，可 將設置於短邊方向之移動機構29b沿著Y方向（載置台31之 短邊方向）移動之情況下，可藉由控制各移動機構29之移 動量’使載置台31往所需方向移動。總言之，要使載置台 31沿著X方向移動之情況時，則使移動機構29a移動，要使 載置台3 1沿著Y方向移動之情況時，則使移動機構29b移動 即可。而且，藉由使2個移動機構29a及2個移動機構2913移 動，可使載置台31繞著其垂直軸轉動。 而且，於載置台31之上面32之對應於下基板霤丨之位 置，設有複數抬升銷45。抬升銷45係於通常時，較載置台 31之上面32配置於下方。而且，從未圖示之其他裝置交付 下基板W1至貼合基板製造裝置1〇時，抬升銷45上升可 從未圖示之機器人手臂收取下基板wi。收取下基板W1 後，藉由使抬升銷45下降，可將下基板wi載置於載置台 31之上面32。而且’基板Wl、W2之貼合處理完成後交付 貼合基板W3至其他裝置時，使抬升銷45上升以使貼合基 板W3從載置台31之上面32分離。可於該間隙插入機器人 手臂，搬送貼合基板W3。 而且，於凹部25之底面26形成有排氣口 47。排氣口 47連 接於貫通基座部11之排氣管48。排氣管48連接於安裝在基 座部11之下面21之真空泵49。 而且’於基座部11之上面23，以包圍凹部25之方式設有 135949.doc •13· 200928503 密封構件55 °密封構件55係於俯視看來設置為矩形狀。密 封構件55之高度大於下基板W1、上基板W2及载置台31之 合計厚度。 圖3為圖1之b部玫大圖。如圖3所示，密封構件55具備： 剖面凹字狀之支持構件51，其係設置於基座部u之上面 23 ’管56 ’其係配置於支持構件51之凹部52之下方，例如 為橡膠製，及接合部57，其係配置於管56之上方。藉由變 動擴縮管56之空氣壓，接合部57可沿著凹部52之側面上下 ® 移動而追隨上加壓構件15之運動。於接合部57之上面58， »又有密閉與上加壓構件15間之密封墊62。進一步於接合部 57之側面59與支持構件51之凹部52之侧面6〇間，設有密閉 兩者間之密封墊61。藉此，以基座部n、上加壓構件15及 密封構件55來構成腔室17。而且，凹部52之側面6〇係支持 接合部57，以便在將腔室17内抽取真空時，接合部刃不會 往腔室17侧倒下。 ❹ 回到圖2，於密封構件55之外側，在基座部u之上面23 立設有支持棒13。支持棒13立設於基座部u之四角。而 且，於基座部11之上面23之短邊方向大致令間部之支持棒 13間，立設有驅動軸65。 驅動轴65具備：驅動源66,其係由安裝於基座部u之馬 達等所組成，·及單側2支軸部67,其係按照來自驅動源66 之指示而上下移動。總言之，於基座部u，立設有4支支 持棒13及4支驅動軸65 ^此外，為了便於說明圖〗係於右 侧圖示支持棒13 ’於左側圖示驅動軸65。 135949.doc 200928503 例如駆動轴65係構成如轴部67藉由來自驅動源66之驅動 力而旋轉》於軸部67形成有公螺紋85 »該公螺紋85係藉由 軸部67旋轉而螺合於形成在基座部u之母螺紋86，軸部67 藉此而上升/下降。 於支持棒13之上方設有上加壓構件15。上加壓構件15係 於俯視看來，以與基座部11大致同一大小之長方形形成。 於俯視看來，於上加壓構件15之四角，在對應於支持棒13 之位置形成支持棒13可插通之貫通孔71。於貫通孔71之下 方配置有導引導件83 ’以使上加壓構件15沿著支持棒13往 垂直方向升降。而且，於上加壓構件15之下面之對應於驅 動轴65之位置’設有加載單元69。加載單元69之受壓面 (下面）與軸部67之前端部68係配置為該等鄰接。 於上加壓構件15之下面之對應於支持棒13之位置（短邊 方向之兩側部72)與其以外之位置間，形成有階差部73。 而且’兩側部72係形成如對於基座部11，較階差部73位於 遠處。於較兩侧部72接近基座部U之位置，形成保持上基 板W2之保持面75。保持面乃之周緣部76係形成如於俯視 看來，位於密封構件55之外側。 而且，於保持面75之保持有上基板W2之位置，設有複 數靜電夹頭部77。靜電夾頭部77之表面配置為與保持面75 齊平面。而且’保持面75之未配置有靜電夾頭部77之處， 没有複數保持銷79。保持銷79係於其前端設有空氣吸入 口，可吸著保持上基板W2。保持銷79係於通常時較保持 面75配置於上方。從未圖示之其他裝置交付上基板W2至 135949.doc •15· 200928503 貼合基板製造裝置10時，保持銷79下降，可從未圖示之機 器人手臂收取上基板W2a收取上基板冒2後，使保持銷79 上升，同時使靜電夾頭部77發揮功能，藉此可將上基板 W2保持於保持面75。 進一步而言，於保持面75之保持有上基板界2之任意位 置（宜為上基板W2之周緣部附近），形成進行與下基板ψι 之對位時所用之相機80之攝影部81。於攝影部81，形成貫 通上加壓構件15之貫通孔即相機配置部82。總言之，於相 〇 機配置部82裝設相機8〇，以相機80透過攝影部81來拍攝下 基板W1與上基板W2之對準標記Ml、M2 ,可檢測對準標 記Ml、M2之偏離。 而且，設有未圖示之控制部，其係以相機80所拍攝到之 結果為基礎，用以對於移動機構29指示水平面内方向之移 動量® (作用） 接者’利用圖4至圖12來說明用貼合基板製造裝置1〇製 造貼合基板之順序。此外，圖4至圖丨j係表示利用貼合基 板製造裝置來製造貼合基板之過程之說明圖；圖12係表示 製造貼合基板之過程之流程圖。此外，後述各步驟號碼係 對應於圖12之步驟號碼。 首先’如圊4所示，貼合基板製造裝置10之上加壓構件 15係保持為位在其最高位之狀態。 於步驟S1，於該狀態下，藉由機器人手臂搬入下基板 W1，下基板W1之具體搬入方法表示於步驟S2以後。 135949.doc 200928503 於步驟S2’將未圖示之機器人手臂所搬送而來之下基板 W1配置於載置台31之上方《於此，使抬升銷45上升以 使下基板W1從機器人手臂浮起。 於步驟S3’使機器人手臂從腔室17内退避。 於步驟S4’使抬升銷45下降，將下基板W1載置於載置 台31之上面32。 , 於步驟S5 ’將未圖示之機器人手臂所搬送而來之上基板 W2，配置於上加壓構件15之保持面75之下方。 © 於步驟S6 ’使保持銷79下降以吸著上基板W2。 於步驟S7’使機器人手臂從腔室17内退避。 於步驟S8，使保持銷79上升。 於步驟S9，使靜電夾頭部77發揮功能，將上基板，2吸 著於保持面75。圖5係完成至上述步驟S9時之說明圖。 此外’步驟S1~S4之搬入下基板W1之步驟與步驟S5〜S9 之搬入上基板W2之步驟係何者為先均可。其中，由於上 ❺基板W2有從吸著銷57落下之虞，因此藉由先進行上基板 W2之搬入’可防止上基板W2落下所造成之影響殃及下基 板W1。特別於製造液晶面板之情況時，由於下基板W12 上面塗布有液晶，因此宜先進行上基板％2之搬入。 接著’於步驟S10，如圖6所示驅動驅動軸65，使上加壓 構件15朝向基座部11(下基板W1)下降（上基板移動步驟）。 此時’轴部6 7根據來自驅動源66之指不而旋轉，轴部6 7藉 此下降。由於上加壓構件15係由轴部67所支持，因此會同 時下降。而且，由於支持棒13插通於上加壓構件15之四角 135949.doc 17· 200928503 之導引導件83，因此上加壓構件15係原樣保持水平狀態而 下降。使上加壓構件15下降至保持面75與密封構件55之接 合部57抵接為止。藉此，構成由基座部丨丨、上加壓構件15 及密封構件55所密閉封住之腔室17(處理室形成步驟）。具 體而言，若上加壓構件15按壓接合部57，則接合部57按壓 管56。於管56連接有未圖示之釋放閥，因此於内壓保持為 一定之狀態下’管56收縮。藉此，可防止管56之破損，同 時維持上加壓構件15與接合部57之密閉狀態。 〇 於步驟S11’如圖7所示，若已構成腔室17，則進行腔室 17内之真空抽取。具體而言，使真空泵49稼動，從排氣口 47將腔室17内部予以排氣（減壓步驟）。然後，將腔室17内 保持於真空狀態（約0.4 Pa以下）。此時，調整管56之空氣 壓，以保持密封構件5 5之氣密性。此外，若如本實施型 態’於充分確保下基板W1與上基板W2之距離之狀態下進 行真空抽取’則可增大氣導，縮短真空抽取時間，並且可 確實地將基板Wl、W2間之空氣予以排氣。 0 於步驟S12,如圖8所示，腔室17内之真空抽取完成後， 再度降下上加壓構件15，使下基板wi與上基板W2之間成 為特定間隔（數百μιη程度）。 於步驟S13，如圖9所示’相機80動作，於下基板W1& 上基板W2之對準標記Μ1、M2依序對焦點以拍攝該等。然 後，將下基板W1往水平面内方向移動，以使分別之對準 標記ΜΙ、M2 —致（基板對位步驟）。此時，以對準標記 Ml、M2之偏離量為基礎，藉由移動機構29使載置台”移 135949.doc -18· 200928503 動，將下基板wi移動至適當位置。 於步驟S14，下基板W1與上基板W2之對位完成後，進 一步降下上加壓構件15。 於步驟S15，如圖10所示，使下基板W1與上基板|2貼 合（基板貼合步驟）》此時，藉由上加壓構件15之自重之一 °卩分’於兩基板Wl、W2加壓。於此，藉由設置於轴部67 之前端部68與上加壓構件15之兩侧部72間之加載單元69， 一面檢出作用於兩基板Wl、W2之荷重，一面調整為以適 © 當荷重貼合基板。 於步驟S16’如圖11所示，若下基板wi與上基板W2之 貼合完成，使上加壓構件15上升。此時，使貼合基板W3 配置於基座部11上。總言之，解除上加壓構件15之靜電夾 頭部77之功能，使上基板W2從上加壓構件15分離。 於步驟S17 ’使基座部丨丨之抬升銷45上升，以使貼合基 板W3從上面23上升。 ❹ 於步驟S18,於貼合基板W3與基座部丨丨之上面23之間 隙，插入機器人手臂，從抬升銷45交付貼合基板W3至機 器人手臂。然後，機器人手臂將貼合基板W3搬送至未圖 示之其他裝置，完成處理。 若根據本實施型態，於一面將上基板W2與下基板W1對 位面貼合，以製造貼合基板W3之貼合基板製造裝置 10其具備載置台31，其係載置下基板W1 ;移動機構 其係使載置台31移動；基座部u，其係設置有移動機 構29，支持棒13，其係立設於基座部11;及上加壓構件 135949.doc -19- 200928503 15，其係可沿著支持棒13上下移動，且可保持上基板 W2 ;且藉由使上加壓構件15下降，以貼合上基板臂2與下 基板W卜 ' 因此’由於保持上基板W2之上加壓構件15及載置有下 基板W1之載置台31均藉由基座部u來支持，將介在上基 • 板W2與下基板wi間之構件數抑制在最小限度。藉此，於 進行上基板W2與下基板冒！之對位後至貼合為止之期間， 可防止上基板W2與下基板W1之相對位置偏離。因此，可 〇 提升2片基板wi、W2之對位精度、提升良率。而且，由於 下基板wi載置於載置台31，因此可安定保持下基板W1， 其結果可高精度地進行下基板W1與上基板W2之對位。 而且’於關於本實施型態之貼合基板製造裝置1〇，於基 座部11，以圍繞下基板W1之配置區域之方式設置有密封 構件55 ;於由密封構件55、上加壓構件15及基座部^所圍 起之空間，形成有腔室17。 因此，能以上加壓構件15、基座部11及密封構件55來構 成腔室17，可減少零件數。因此，可將裝置予以小型•輕 量化。 而且，於關於本實施型態之貼合基板製造裝置1〇，進一 步具備真空泵49，其係將腔室17之内部減壓；藉由真空泵 49進行腔室17之減壓時，腔室17係由密封構件55所密閉。 如此，由於密封構件55介裝於上加壓構件15與基座部11 間，因此將腔室17減壓時，可確實地密閉腔室17。因此， 可確實地將腔室17減壓，可製造所需之貼合基板W3。 135949.doc -20- 200928503 進一步而言，密封構件55具備：接合部57，其係對於基 座部11上下移動’構成腔室17之壁部；及密封墊62，其係 設置於接合部57，抵接於上加壓構件丨5以確保腔室1<7之氣 密性》 因此，接合部57係對於基座部丨〗上下移動而構成腔室17 之壁部。因此，即使上加壓構件丨5上升，仍可建構密閉之 腔室17。藉此’即使於分離配置下基板wi與上基板W2以 增大氣導之狀態，仍可將腔室17減壓，可縮短減壓時間。 Ο 然後，於本實施型態’將腔室17内抽取真空後，可藉由 移動機構29進行下基板W1與上基板W2之對位。因此，進 行下基板W1與上基板W2之對位後，不須為了真空抽取而 再度使上加壓構件15上升，可提升生產效率。 此外，於圖13表示本實施型態之密封構件55之其他態 樣。如圖13所示，密封構件255設置於凹部51，具備形成 於凹部51之下方之空氣供給部256、及配置於空氣供給部 25 6之上方之接合部57。藉由變動空氣供給部25 6之空氣 胃壓’接合部57可沿著凹部51之側面60上下移動，可追隨上 加壓構件15之運動。接合部57之上面58係較基座部11之上 面23位於上方。 而且，於接合部57之上面58，設有密閉與上加壓構件15 間之密封墊62。進一步於接合部57之側面59與基座部11之 凹部5 1之側面60間，設有2處密閉兩者間之密封墊61。於 該密封墊61，61間之空間部263，連接與外部（大氣）連通之 未圖示之連通管。藉此，可減輕對於密封墊61之壓力負 135949.doc -21 · 200928503 載。而且’於設有密封墊61之相反側，設有遮斷空氣供給 部256與外部（大氣）間之密封墊262。 藉此，密封構件255可獲得與上述密封構件55大致同一 作用效果。 (第二實施型態） 接著’根據圖14來說明關於本發明之第二實施型態之貼 合基板製造裝置。此外’本實施型態係與第一實施型態僅 有密封構件之結構不同，關於其他結構大致相同，因此於 ❹ 同一處附以同一符號，並省略詳細說明。 圖14為密封構件之結構圖β如圖14所示，密封構件155 設置於上加壓構件15側。具體而言，於上加壓構件15之保 持面75形成有凹部151。凹部ι51係形成於與第一實施型態 之凹部5 1大致相對向之位置。 於凹部151設有密封構件155。密封構件155具備：彈簧 156’其係配置於凹部151之底部；及接合部157，其係配 置於彈簧156之上方。藉由彈簧156收縮，接合部157進行 ❹ 上下移動。而且’於接合部157之前端面162設有密封塾 164°進一步於接合部ι57之侧面ι59與凹部ι51之側面ι6〇 .間’設有侧密封墊161 »從凹部151之側面160朝向接合部 157之側面159立設止動器165，以使接合部157不會從凹部 151落下。藉此’能以基座部^、上加壓構件15及密封構 件155來構成腔室17。 (作用） 使基板貼合前（裝置之初始狀態），接合部i 57係以彈簧 135949.doc -22· 200928503 156之施力及自重而往下方垂下，並由止動器17所扣止。 若為了使基板貼合而使上加壓構件15下降，則上基板W2 會同時下降。如此一來，接合部157之密封墊164抵接於基 座部11之上面23，以基座部11、上加壓構件15及密封構件 155構成腔室17。其後，若進一步使上加壓構件15下降， • 則彈簧156收縮’將接合部157收納於凹部151内。其後， 即使使上加壓構件15稍微升降，彈簧156之施力發揮作 用’仍可將密封墊164與基座部11之上面23保持抵接狀 ❹ 態。 因此，於基板Wl、W2之貼合時，可確實地構成腔室 17’可製造所需之貼合基板W3。 此外’為了以機器人手臂，從腔室17取放上基板界2及 貼合基板W3，密封構件155配置為不構成妨礙。而且，若 接合部157可僅藉由自重往下方移動，則於密封構件155不 认置彈簧156亦可。該情況下，由於不需要接合部157之升 參 Μ構’因此可減少零件數，其結果不花f用即可製作裝 置。而且，於基板取放時，由於有機器人手臂之取放，因 此上加壓構件15上升至接合部157不構成妨礙之程度。 此外，本發明之技術範圍不限定於上述實施型態，於不 脫離本發明之旨趣之範圍内，包含上述實施型態加入有各 種變更者亦即，實施型態所舉出之具體形狀或結構等只 不過為一例，可予以適宜地變更。 例如於本實施型態雖說明採用管或彈著，用以使接合部 上下移動之情況，但利用致動器等亦可。 135949.doc -23· 200928503 而且，於本實施型態係構成如僅可將移動機構往水平面 内方向移動，但亦可構成如亦可往上下方向移動。 而且，於本實施型態雖說明於上加壓構件設置相機之情 況，但設置於基座部亦可。 [產業上之可利用性] 可提供一種可提升2片基板之對位精度、提升良率之貼 合基板製造裝置及貼合基板製造方法。 【圖式簡單說明】 圖1係關於本發明之第一實施型態之貼合基板製造装置 之正面概略圖。 圖2係沿著圖1之A-A線之剖面圖。 圖3為圖1之B部放大圖。 圖4係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（丨）。 圖5係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（2)。 圖6係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（3)。 圖7係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（4)。 圖8係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（5)。 圖9係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（6)。 135949.doc -24- 200928503 圖ι〇係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明囷（7)。 圖Π係表示利用關於同實施型態之貼合基板製造裝置來 製造貼合基板之過程之說明圖（8)。 圖12係表示表示製造關於同實施型態之貼合基板之過程 之流程圖。 圖13係表示表示關於同實施型態之密封構件之其他態樣 之結構圖》 圖14係關於本發明之第二實施型態之密封構件之纟士 圖。 、、°構 【主要元件符號說明】 10 貼合基板製造裝置 11 基座部 13 支持棒 15 上加壓構件 17 腔室（貼合處理室） 29 移動機構 31 栽置台 55 密封構件 57 接合部 62 密封墊 W1 下基板 W2 上基板 W3 貼合基板 I35949.doc -25·BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method. The present application claims priority based on Japanese Patent Application No. 2007-29091, filed on Jan. 8, 2007, which is hereby incorporated by reference. [Prior Art] A flat panel display (FPD) such as a liquid crystal display or a plasma display includes a structure in which two substrates are bonded. For example, a liquid crystal display is a matrix substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are arranged to face each other at a G interval of several μm, and a color chopper substrate having a color apex or a light shielding film is formed ( The CF substrate] is produced by sealing a liquid crystal between two substrates and bonding the two substrates to each other by a sealing member (adhesive) containing a photocurable resin. Further, the bonding of the two substrates is carried out under a vacuum atmosphere to prevent the incorporation of impure gas. For example, the substrate bonding apparatus of Patent Document 1 is provided as a device for bonding two substrates to each other. The substrate bonding apparatus of Patent Document 1 includes a vacuum chamber, which is a container on the upper side and a container on the lower side. Constructing; an upper substrate transporting jig for moving the upper substrate; a first support bar for moving the upper container up and down; a base plate supporting the support bar; and a second support bar It is used to move the upper substrate transporting fixture up and down. In the substrate bonding apparatus, the first support bar is moved downward, the upper container and the lower container are in contact with each other to form a vacuum chamber, and the second support bar is moved downward, and the upper substrate is conveyed to the jig to make the upper substrate. The lower substrate is disposed opposite to each other with a predetermined interval therebetween. Thereafter, the upper substrate and the lower substrate are paired with 135949.doc 200928503 to make the bonding. [Problem to be Solved by the Invention] The bonded substrate manufacturing apparatus of Patent Document 1 performs vacuum extraction in a processing chamber, and then performs an upper substrate and a lower substrate. In alignment, the two substrates are bonded together. However, after the alignment between the upper substrate and the lower substrate, if the upper substrate transporting jig is moved by moving the second support bar provided on the base plate, the position of the upper substrate and the lower substrate is opposed to each other. Deviate from the ground. This is because the plurality of members are disposed between the base plate and the lower substrate, and the lower substrate of the lower substrate is disposed to perform different movements from the base plate provided by the second support bar. Thus, there is a problem that the yield is lowered due to the deviation of the relative positions of the upper substrate and the lower substrate. The present invention has been made in view of the above circumstances, and a problem to be solved by the present invention is to provide a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method which can improve the alignment accuracy of two substrates and improve the yield.技术 [Technical means for solving the problem] The bonded substrate manufacturing apparatus of the present invention bonds the upper substrate and the lower substrate to each other to produce a bonded substrate, and includes a mounting table on which the lower substrate is placed; a mechanism for moving the mounting table; a base portion provided with the moving mechanism; a support rod erected on the base portion; and an upper pressing member movable up and down the support rod Moving, and holding the upper substrate, and lowering the upper (four) member to fit the upper substrate held by the pressing member by the month and the placement on the mounting table 135949.doc - 8 - 200928503 The aforementioned lower substrate. According to the above-described bonded substrate manufacturing apparatus, since the pressing member on the upper substrate and the mounting table on which the lower substrate is placed are supported by the base portion, the number of members interposed between the upper substrate and the lower substrate can be suppressed. At a minimum. Thereby, the relative positional deviation between the upper substrate and the lower substrate can be prevented during the alignment between the upper substrate and the lower substrate and during the bonding. As a result, the alignment accuracy of the two substrates can be improved and the yield can be improved. Further, since the lower substrate is placed on the mounting table, the lower substrate can be stably held, and the alignment between the lower substrate and the upper substrate can be performed with high precision. At least one of the upper pressing member and the base portion is provided with a sealing member so as to surround a region where the upper substrate or the lower substrate is disposed, and the sealing member, the upper pressing member, and the base The space enclosed by the seat may also form a bonding processing chamber. In this case, since the bonding processing chamber can be configured by the above pressing member, the base portion, and the sealing member, the number of parts can be reduced. As a result, the device can be reduced in size and weight. Further, the bonded substrate manufacturing apparatus further includes a pressure reducing mechanism that decompresses the inside of the bonding processing chamber; and when the pressure reducing mechanism decompresses the bonding chamber, the bonding processing chamber is The sealing member may be sealed. In this case, since the sealing member is interposed between the upper pressing member and the base portion, when the bonding processing chamber is depressurized, the bonding processing chamber can be reliably sealed. Therefore, the bonding processing chamber can be reliably decompressed, and the desired bonded substrate can be manufactured. 135949.doc 200928503 The sealing member may further include: a joint portion that moves up and down one of the base portion and the upper pressing member to form a wall portion of the bonding processing chamber; and a sealing member The joint portion is provided to abut against the base portion or the upper pressing member to ensure airtightness of the bonding processing chamber. In this case, since the joint portion moves up and down with respect to the base portion or the upper pressing member to constitute the wall portion of the bonding processing chamber, the bonding processing chamber can be held in a sealed state even if the upper pressing member is raised. Thereby, even if the lower substrate and the upper substrate are separated to increase the air conduction state, the bonding processing chamber can be decompressed, and as a result, the decompression time can be shortened. Further, in the method for manufacturing a bonded substrate according to the present invention, the lower substrate is placed on the mounting table provided on the base portion, and the upper pressing member can be held up and down along the support bar standing on the base portion. a bonding substrate is bonded to the upper substrate while the lower substrate is aligned with the upper substrate; and the step of moving the upper substrate is performed by lowering the upper substrate and the lower substrate The upper substrate is disposed opposite to each other with a predetermined interval; and the processing chamber forming step of sealing the upper pressing member and the pedestal (4) by a sealing member to form a bonding processing chamber for accommodating the upper substrate and the lower substrate; a depressurization step of depressurizing the bonding processing chamber; a substrate alignment step of moving the lower substrate by a moving mechanism to perform alignment between the lower substrate and the upper substrate; and a substrate bonding step The lower pressing member is lowered to bond the lower substrate and the upper substrate. According to the method for manufacturing a bonded substrate, the pressing member is held on the upper substrate, and is supported by a 135949.doc • 10_ 200928503 support rod that is erected on the base portion on which the lower substrate is placed. By moving, the number of members interposed between the upper substrate and the lower substrate can be minimized. Thereby, the positional relationship between the upper substrate and the lower substrate can be prevented from deviating during the alignment between the upper substrate and the lower substrate until the bonding. Therefore, the alignment accuracy of the two substrates can be improved and the yield can be improved. Further, the state in which the lower substrate and the upper substrate are separated and disposed at a specific distance is used to decompress the bonding processing chamber, so that the pressure can be reduced in a state where the air conduction is large. By this, the decompression time can be shortened. Further, after the pressure in the bonding processing chamber is reduced, the positioning of the lower substrate and the upper substrate can be performed by the moving mechanism. Therefore, after the alignment between the lower substrate and the upper substrate is performed, it is not necessary to raise the upper pressing member again, and the production efficiency can be improved. [Embodiment] [Effects of the Invention] Since the pressing member on the upper substrate and the mounting table on which the lower substrate is placed are supported by the base portion, the member interposed between the upper substrate and the lower substrate can be suppressed. Minimal. Thereby, the positional relationship between the upper substrate and the lower substrate can be prevented from being deviated during the alignment of the upper substrate and the lower substrate until the bonding. Therefore, it has the effect of improving the alignment accuracy of the two substrates and improving the yield. Further, since the lower substrate is placed on the mounting table, the lower substrate can be stably held, and as a result, the alignment between the lower substrate and the upper substrate can be performed with high precision. (First embodiment) (bonding substrate manufacturing apparatus) A bonding substrate manufacturing apparatus according to a first embodiment of the present invention will be described with reference to Figs. 1 to 12 . 135949.doc 200928503 FIG. 1 is a front schematic view of a laminated substrate manufacturing apparatus; and FIG. 2 is a cross-sectional view taken along line A-A of FIG. As shown in FIG. 1 and FIG. 2, the bonded substrate manufacturing apparatus 1A includes a base portion 11' on which a lower substrate W1 is placed, a support rod 13 which is erected on the base portion 11, and an upper pressing member. 15, which is supported by the support rod 13 'can move up and down along the support rod 13 and can hold the upper substrate W2. The base portion 11 has rigidity and substantially forms a rectangular parallelepiped shape. The base portion "is provided with a foot 22 at the four corners of the lower surface thereof and is placed on the floor. On the other hand, the upper surface 23 of the base portion 11 is formed in a rectangular shape in a plan view. On the upper surface 23, the formation is larger than the upper surface. The concave portion 25 of the lower substrate W1 is provided with a χ θ θ guide 27 movable in the horizontal direction of the two orthogonal axes and the horizontal rotation direction (hereinafter referred to as the horizontal direction in the horizontal direction) at substantially the central portion and the four corners of the concave portion 25. Further, in the concave portion 25 The χΥΘ θ θ guide having the same structure as the ΧΥΘ guide 27 is disposed at a substantially central portion of the ridge guide 27 at the peripheral portion, and the moving mechanism 29 of the actuator 33 is provided. In general, the recess 25 is provided with 5 ΧΥΘ guides 27 and 4 moving mechanisms 29. In addition, the surface 28 of the ΧΥΘ guide 27 and the surface 30 of the moving mechanism 29 are arranged in a plane. The ΧΥΘ guide 27 and the upper part of the moving mechanism 29 are provided on The mounting table 31 has a rectangular shape in plan view. The lower substrate W1 can be placed on the upper surface 32 of the mounting table 31. By driving the moving mechanism 29, the mounting table 31 can be moved in the horizontal direction. The lower substrate W1 moves in the horizontal direction. The ΧΥ0 guide 27 has a substantially three-layer structure, and is fixed to the base fixing portion 27a of the base portion u, the table fixing portion 27c fixed to the mounting table 31, and disposed between the base fixing portion 27a and the table fixing portion 27c. The moving portion 27b is movable in the horizontal direction. 135949.doc 12 200928503 The moving portion 27b is moved in a desired direction by driving the actuator 33 of the moving mechanism 29. Here, for example, it can be disposed in the recess 25 When the moving mechanism 2 in the center in the longitudinal direction moves in the direction of the other direction (the longitudinal direction of the mounting table 31), the moving mechanism 29b provided in the short-side direction can be moved in the Y direction (the short side direction of the mounting table 31). In this case, the mounting table 31 can be moved in the desired direction by controlling the amount of movement of each of the moving mechanisms 29. In general, when the mounting table 31 is moved in the X direction, the moving mechanism 29a is moved. When the mounting table 31 is moved in the Y direction, the moving mechanism 29b can be moved. Further, by moving the two moving mechanisms 29a and the two moving mechanisms 2913, the mounting table 31 can be wound around The vertical axis rotates. Moreover, on the mounting table 3 A plurality of lifting pins 45 are provided at positions 32 on the upper surface of the upper substrate corresponding to the lower substrate. The lifting pins 45 are disposed below the upper surface 32 of the mounting table 31, and are delivered to other devices (not shown). When the lower substrate W1 is attached to the bonded substrate manufacturing apparatus 1 , the lift pin 45 is raised to collect the lower substrate wi from the robot arm (not shown). After the lower substrate W1 is received, the lower substrate w can be carried by lowering the lift pin 45. The upper surface 32 of the mounting table 31 is placed. When the bonding process of the substrates W1 and W2 is completed and the bonding substrate W3 is delivered to another device, the lifting pin 45 is raised to separate the bonding substrate W3 from the upper surface 32 of the mounting table 31. . The robot arm can be inserted into the gap to transport the bonded substrate W3. Further, an exhaust port 47 is formed in the bottom surface 26 of the recess 25. The exhaust port 47 is connected to the exhaust pipe 48 that penetrates the base portion 11. The exhaust pipe 48 is connected to a vacuum pump 49 mounted on the lower surface 21 of the base portion 11. Further, the upper surface 23 of the base portion 11 is provided so as to surround the concave portion 25. 135949.doc • 13· 200928503 Sealing member 55 ° The sealing member 55 is formed in a rectangular shape in plan view. The height of the sealing member 55 is larger than the total thickness of the lower substrate W1, the upper substrate W2, and the mounting table 31. Figure 3 is a large part of the b part of Figure 1. As shown in FIG. 3, the sealing member 55 is provided with a support member 51 having a concave shape in cross section, and is provided on the upper surface 23' of the base portion u. The tube 56' is disposed below the concave portion 52 of the support member 51, for example, The rubber portion and the joint portion 57 are disposed above the tube 56. By changing the air pressure of the expansion/contraction tube 56, the engaging portion 57 can move up and down along the side of the recess 52 to follow the movement of the upper pressing member 15. On the upper surface 58 of the joint portion 57, there is again a gasket 62 which is sealed between the upper pressing member 15. Further, between the side surface 59 of the joint portion 57 and the side surface 6 of the recess 52 of the support member 51, a gasket 61 for sealing therebetween is provided. Thereby, the chamber 17 is constituted by the base portion n, the upper pressing member 15, and the sealing member 55. Further, the side surface 6 of the recess 52 supports the joint portion 57 so that the joint blade does not fall down toward the chamber 17 side when the vacuum is extracted from the chamber 17. ❹ Returning to Fig. 2, on the outer side of the sealing member 55, a support rod 13 is erected on the upper surface 23 of the base portion u. The support rods 13 are erected at the four corners of the base portion u. Further, a drive shaft 65 is vertically disposed between the support bars 13 in the short side direction of the upper surface 23 of the base portion 11. The drive shaft 65 includes a drive source 66 composed of a motor or the like attached to the base portion u, and a one-sided two-shaft portion 67 that moves up and down in accordance with an instruction from the drive source 66. In summary, four support rods 13 and four drive shafts 65 are provided on the base portion u. Further, for convenience of explanation, the support rods 13' are shown on the right side and the drive shafts 65 are illustrated on the left side. 135949.doc 200928503 For example, the swing shaft 65 is configured such that the shaft portion 67 is rotated by the driving force from the drive source 66. The male shaft 85 is formed on the shaft portion 67. The male screw 85 is screwed by the rotation of the shaft portion 67. The female shaft 86 formed in the base portion u is thereby raised/lowered by the shaft portion 67. An upper pressing member 15 is provided above the support rod 13. The upper pressing member 15 is formed in a rectangular shape having substantially the same size as the base portion 11 in plan view. In the plan view, at the four corners of the upper pressing member 15, a through hole 71 through which the support rod 13 can be inserted is formed at a position corresponding to the support rod 13. A guide guide 83' is disposed below the through hole 71 to raise and lower the upper pressing member 15 in the vertical direction along the support rod 13. Further, a loading unit 69 is provided at a position below the upper pressing member 15 corresponding to the driving shaft 65. The pressure receiving surface (lower surface) of the loading unit 69 and the front end portion 68 of the shaft portion 67 are disposed adjacent to each other. A step portion 73 is formed between a position corresponding to the support bar 13 on the lower surface of the upper pressing member 15 (both side portions 72 in the short side direction) and a position other than the support bar 13. Further, the both side portions 72 are formed such that, for the base portion 11, the step portion 73 is located far away. At a position closer to the base portion U than the side portions 72, a holding surface 75 for holding the upper substrate W2 is formed. The peripheral portion 76 of the holding surface is formed on the outer side of the sealing member 55 as viewed from the top. Further, a plurality of electrostatic chuck portions 77 are provided at positions where the upper surface W2 of the holding surface 75 is held. The surface of the electrostatic chuck head 77 is disposed flush with the holding surface 75. Further, where the holding surface 75 is not provided with the electrostatic chuck portion 77, the plurality of holding pins 79 are not provided. The holding pin 79 is provided with an air suction port at its front end to suck and hold the upper substrate W2. The holding pin 79 is disposed above the holding surface 75 in the normal state. The upper substrate W2 to 135949.doc •15· 200928503 is attached from another device (not shown). When the substrate manufacturing apparatus 10 is bonded, the holding pin 79 is lowered, and the upper substrate W2a can be collected from the robot arm (not shown). The holding pin 79 is raised and the electrostatic chuck head 77 is made to function, whereby the upper substrate W2 can be held on the holding surface 75. Further, the photographing portion 81 of the camera 80 used to perform the alignment with the lower substrate 形成 is formed at any position of the holding surface 75 where the upper substrate boundary 2 is held (preferably in the vicinity of the peripheral portion of the upper substrate W2). In the photographing unit 81, a camera arrangement portion 82 that is a through hole that passes through the upper pressing member 15 is formed. In short, the camera 8 is mounted in the camera setting unit 82, and the camera 80 is used to capture the alignment marks M1 and M2 of the lower substrate W1 and the upper substrate W2 through the imaging unit 81, and the alignment marks M1 and M2 can be detected. Deviation. Further, a control unit (not shown) is provided for indicating the amount of movement in the horizontal direction of the moving mechanism 29 based on the result captured by the camera 80. The procedure for manufacturing the bonded substrate by the bonded substrate manufacturing apparatus 1 will be described. 4 to FIG. 1 are explanatory views showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus; and FIG. 12 is a flow chart showing a process of manufacturing a bonded substrate. Further, each step number described later corresponds to the step number of Fig. 12. First, as shown in Fig. 4, the pressing member 15 on the bonded substrate manufacturing apparatus 10 is maintained in the state of its highest position. In step S1, in this state, the robot substrate is carried into the lower substrate W1, and the specific loading method of the lower substrate W1 is shown in step S2 and later. 135949.doc 200928503 In the step S2', the robot arm (not shown) is transported, and the lower substrate W1 is placed above the mounting table 31. Here, the lift pin 45 is raised to float the lower substrate W1 from the robot arm. The robot arm is retracted from the chamber 17 in step S3'. The lift pin 45 is lowered in step S4', and the lower substrate W1 is placed on the upper surface 32 of the stage 31. In step S5', the robot arm (not shown) is transported, and the upper substrate W2 is placed below the holding surface 75 of the upper pressing member 15. © The holding pin 79 is lowered in step S6' to suck the upper substrate W2. The robot arm is retracted from the chamber 17 in step S7'. At step S8, the holding pin 79 is raised. In step S9, the electrostatic chuck portion 77 is made to function, and the upper substrate 2 is attracted to the holding surface 75. Fig. 5 is an explanatory diagram when the above step S9 is completed. Further, the steps of the steps S1 to S4 for loading the lower substrate W1 and the steps for moving the upper substrate W2 for the steps S5 to S9 may be preceded. In this case, since the upper substrate W2 is dropped from the suction pin 57, the lower substrate W1 can be prevented from being affected by the falling of the upper substrate W2. In particular, in the case of manufacturing a liquid crystal panel, since the liquid crystal is coated on the lower substrate W12, it is preferable to carry in the upper substrate %2 first. Then, in step S10, the drive shaft 65 is driven as shown in Fig. 6, and the upper pressing member 15 is lowered toward the base portion 11 (lower substrate W1) (upper substrate moving step). At this time, the shaft portion 607 is rotated in accordance with the finger from the drive source 66, and the shaft portion 6 7 is thereby lowered. Since the upper pressing member 15 is supported by the shaft portion 67, it is simultaneously lowered. Further, since the support rod 13 is inserted into the guide guide 83 of the four corners 135949.doc 17· 200928503 of the upper pressing member 15, the upper pressing member 15 is lowered as it is in the horizontal state. The upper pressing member 15 is lowered until the holding surface 75 abuts against the joint portion 57 of the sealing member 55. Thereby, the chamber 17 which is hermetically sealed by the base portion 丨丨, the upper pressing member 15, and the sealing member 55 is formed (processing chamber forming step). Specifically, when the upper pressing member 15 presses the joint portion 57, the joint portion 57 presses the tube 56. Since the release valve (not shown) is connected to the pipe 56, the pipe 56 is contracted while the internal pressure is kept constant. Thereby, the tube 56 can be prevented from being damaged, and the sealed state of the upper pressing member 15 and the joint portion 57 can be maintained. In step S11', as shown in Fig. 7, if the chamber 17 is already formed, vacuum extraction in the chamber 17 is performed. Specifically, the vacuum pump 49 is caused to move, and the inside of the chamber 17 is exhausted from the exhaust port 47 (decompression step). Then, the inside of the chamber 17 is maintained in a vacuum state (about 0.4 Pa or less). At this time, the air pressure of the tube 56 is adjusted to maintain the airtightness of the sealing member 55. Further, if the vacuum extraction is performed in a state where the distance between the lower substrate W1 and the upper substrate W2 is sufficiently ensured as in the present embodiment, the air conduction can be increased, the vacuum extraction time can be shortened, and the substrates W1 and W2 can be surely The air is vented. In step S12, as shown in Fig. 8, after the vacuum extraction in the chamber 17 is completed, the upper pressing member 15 is lowered again to form a specific interval (a few hundred μm) between the lower substrate wi and the upper substrate W2. In step S13, as shown in FIG. 9, the camera 80 is operated, and the alignment marks Μ1 and M2 of the upper substrate W1 and the upper substrate W2 are sequentially focused to capture the image. Then, the lower substrate W1 is moved in the horizontal direction so that the alignment marks ΜΙ, M2 are respectively aligned (substrate alignment step). At this time, based on the deviation amount of the alignment marks M1 and M2, the moving table 29 moves the mounting table "135949.doc -18·200928503, and moves the lower substrate wi to an appropriate position. In step S14, the lower substrate After the alignment of W1 and the upper substrate W2 is completed, the upper pressing member 15 is further lowered. In step S15, as shown in FIG. 10, the lower substrate W1 is bonded to the upper substrate|2 (substrate bonding step). The two substrates W1, W2 are pressurized by the weight of the upper pressing member 15. Here, by being disposed between the end portion 68 of the shaft portion 67 and the both side portions 72 of the upper pressing member 15. The loading unit 69 detects the load applied to the two substrates W1 and W2, and adjusts the substrate to be bonded to the substrate. In step S16', as shown in FIG. 11, if the lower substrate wi and the upper substrate W2 are attached. When the bonding is completed, the upper pressing member 15 is raised. At this time, the bonding substrate W3 is placed on the base portion 11. In summary, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, so that the upper substrate W2 is removed. Separating from the upper pressing member 15. In step S17', the lifting pin 45 of the base portion is raised to make the bonding substrate W 3 is raised from the upper surface 23. In step S18, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 23 of the base portion, and the bonded substrate W3 is delivered from the lift pin 45 to the robot arm. Then, the robot arm will The bonded substrate W3 is transferred to another device (not shown) to complete the process. According to this embodiment, the upper substrate W2 and the lower substrate W1 are bonded to each other to form a bonded substrate W3. The device 10 includes a mounting table 31 on which the lower substrate W1 is placed, a moving mechanism that moves the mounting table 31, and a base portion u that is provided with a moving mechanism 29 and a support rod 13 that is erected on the base. And the upper pressing member 135949.doc -19- 200928503 15, which is movable up and down along the support rod 13, and can hold the upper substrate W2; and by lowering the upper pressing member 15, to fit The substrate arm 2 and the lower substrate W are so "because" the holding member 15 on the upper substrate W2 and the mounting table 31 on which the lower substrate W1 is placed are supported by the base portion u, and will be interposed on the upper substrate W2. The number of components between the lower substrate and the lower substrate wi is minimized. During the period from the alignment of the upper substrate W2 to the lower substrate, the relative position of the upper substrate W2 and the lower substrate W1 can be prevented from deviating from each other. Therefore, the alignment accuracy and the lifting of the two substrates wi and W2 can be improved. In addition, since the lower substrate wi is placed on the mounting table 31, the lower substrate W1 can be stably held, and as a result, the alignment between the lower substrate W1 and the upper substrate W2 can be performed with high precision. In the bonded substrate manufacturing apparatus 1A, a sealing member 55 is provided on the base portion 11 so as to surround the arrangement region of the lower substrate W1; the sealing member 55, the upper pressing member 15, and the base portion are enclosed by the sealing member 55. The space is formed with a chamber 17. Therefore, the chamber 17 can be formed by the above pressing member 15, the base portion 11, and the sealing member 55, and the number of parts can be reduced. Therefore, the device can be made small and lightweight. Further, in the bonded substrate manufacturing apparatus 1 of the present embodiment, a vacuum pump 49 is further provided which decompresses the inside of the chamber 17, and when the chamber 17 is decompressed by the vacuum pump 49, the chamber 17 is It is sealed by the sealing member 55. In this manner, since the sealing member 55 is interposed between the upper pressing member 15 and the base portion 11, when the chamber 17 is decompressed, the chamber 17 can be reliably sealed. Therefore, the chamber 17 can be reliably depressurized, and the desired bonded substrate W3 can be manufactured. Further, the sealing member 55 is provided with a joint portion 57 that moves up and down the base portion 11 to form a wall portion constituting the chamber 17, and a gasket 62 that is provided at the joint portion 57. Abutting against the upper pressing member 丨5 to ensure the airtightness of the chamber 1 <7, the joint portion 57 is moved up and down with respect to the base portion to constitute the wall portion of the chamber 17. Therefore, even if the upper pressing member 丨5 is raised, the sealed chamber 17 can be constructed. Thereby, even if the substrate wi and the upper substrate W2 are separated and disposed to increase the air conduction state, the chamber 17 can be decompressed, and the decompression time can be shortened. Then, in the present embodiment, after vacuum is extracted from the chamber 17, the alignment of the lower substrate W1 and the upper substrate W2 can be performed by the moving mechanism 29. Therefore, after the alignment between the lower substrate W1 and the upper substrate W2 is performed, it is not necessary to raise the upper pressing member 15 again for vacuum extraction, and the production efficiency can be improved. Further, Fig. 13 shows another aspect of the sealing member 55 of the present embodiment. As shown in Fig. 13, the sealing member 255 is provided in the recess 51, and includes an air supply portion 256 formed below the recess 51 and a joint portion 57 disposed above the air supply portion 256. The air stomach pressure 'joining portion 57 of the variable air supply unit 25 6 can move up and down along the side surface 60 of the recess 51 to follow the movement of the upper pressing member 15. The upper surface 58 of the joint portion 57 is located above the upper surface 23 of the base portion 11. Further, a gasket 62 that seals between the upper pressing member 15 and the upper surface 58 of the joint portion 57 is provided. Further, between the side surface 59 of the joint portion 57 and the side surface 60 of the recess portion 51 of the base portion 11, two gaskets 61 for sealing the two are provided. A space portion 263 between the gaskets 61, 61 is connected to a communication pipe (not shown) that communicates with the outside (atmosphere). Thereby, the pressure on the gasket 61 can be reduced by 135949.doc -21 · 200928503. Further, a gasket 262 that blocks the air supply portion 256 from the outside (atmosphere) is provided on the opposite side of the gasket 61. Thereby, the sealing member 255 can obtain substantially the same operational effects as the above-described sealing member 55. (Second embodiment) Next, a bonded substrate manufacturing apparatus according to a second embodiment of the present invention will be described based on Fig. 14 . Further, the present embodiment is different from the first embodiment only in the configuration of the sealing member, and the other structures are substantially the same, and the same reference numerals will be given to the same portions, and the detailed description will be omitted. Fig. 14 is a structural view of the sealing member. As shown in Fig. 14, the sealing member 155 is provided on the side of the upper pressing member 15. Specifically, a concave portion 151 is formed on the holding surface 75 of the upper pressing member 15. The concave portion ι51 is formed at a position substantially opposite to the concave portion 51 of the first embodiment. A sealing member 155 is provided in the recess 151. The sealing member 155 includes a spring 156' disposed at the bottom of the recess 151, and a joint portion 157 disposed above the spring 156. By the contraction of the spring 156, the engaging portion 157 is moved up and down. Further, 'the front end surface 162 of the joint portion 157 is provided with a seal 塾164. Further, the side surface ι59 of the joint portion ι57 and the side surface ι6 of the recess portion ι51 are provided with a side seal 161 from the side 160 of the recess 151 toward the joint portion 157. The side surface 159 is provided with a stopper 165 so that the joint portion 157 does not fall from the concave portion 151. Thereby, the chamber 17 can be constituted by the base portion, the upper pressing member 15, and the sealing member 155. (Action) Before the substrate is bonded (in the initial state of the device), the joint portion i 57 is suspended downward by the biasing force and self-weight of the spring 135949.doc -22. 200928503 156, and is engaged by the stopper 17. When the upper pressing member 15 is lowered in order to bond the substrates, the upper substrate W2 is simultaneously lowered. In this manner, the gasket 164 of the joint portion 157 abuts against the upper surface 23 of the base portion 11, and the chamber portion 11 is formed by the base portion 11, the upper pressing member 15, and the sealing member 155. Thereafter, when the upper pressing member 15 is further lowered, • the spring 156 is contracted ‘the joint portion 157 is housed in the concave portion 151. Thereafter, even if the upper pressing member 15 is slightly raised and lowered, the urging force of the spring 156 functions to keep the gasket 164 in contact with the upper surface 23 of the base portion 11. Therefore, when the substrates W1 and W2 are bonded together, the desired bonding substrate W3 can be manufactured by reliably forming the chamber 17'. Further, in order to take the upper substrate boundary 2 and the bonded substrate W3 from the chamber 17 by the robot arm, the sealing member 155 is disposed so as not to interfere. Further, if the joint portion 157 can be moved downward by its own weight, the spring 156 may not be recognized by the seal member 155. In this case, since the number of parts of the joint portion 157 is not required, the number of parts can be reduced, and as a result, the apparatus can be produced without using it. Further, when the substrate is picked up and lowered, the robot arm is picked up and lowered, so that the upper pressing member 15 rises to the extent that the joint portion 157 does not hinder. Further, the technical scope of the present invention is not limited to the above-described embodiments, and various modifications, that is, specific shapes or configurations of the embodiments may be added to the above-described embodiments without departing from the scope of the present invention. Etc. is just an example and can be changed as appropriate. For example, in the present embodiment, a tube or a spring is used to move the joint portion up and down, but an actuator or the like may be used. 135949.doc -23· 200928503 Further, in the present embodiment, the moving mechanism can be moved only in the horizontal direction, but it is also possible to move in the vertical direction. Further, in the present embodiment, the case where the camera is attached to the upper pressing member is described, but the base portion may be provided. [Industrial Applicability] A bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of improving the alignment accuracy of two substrates and improving the yield can be provided. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front schematic view showing a laminated substrate manufacturing apparatus according to a first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line A-A of Figure 1. Fig. 3 is an enlarged view of a portion B of Fig. 1; Fig. 4 is an explanatory view showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 5 is an explanatory view (2) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 6 is an explanatory view (3) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 7 is an explanatory view (4) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 8 is an explanatory view (5) showing a process of manufacturing a bonded substrate by using the bonded substrate manufacturing apparatus of the same embodiment. Fig. 9 is an explanatory view (6) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. 135949.doc -24- 200928503 Fig. 1 shows an explanation of the process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment (7). Fig. 1 is an explanatory view (8) showing a process of manufacturing a bonded substrate by using a bonded substrate manufacturing apparatus of the same embodiment. Fig. 12 is a flow chart showing the process of manufacturing a bonded substrate of the same embodiment. Fig. 13 is a structural view showing another aspect of the sealing member of the same embodiment. Fig. 14 is a view showing a gentleman of the sealing member according to the second embodiment of the present invention. Structure of the main component: 10 affixed substrate manufacturing apparatus 11 base part 13 support rod 15 upper pressing member 17 chamber (bonding processing chamber) 29 moving mechanism 31 planting table 55 sealing member 57 joint portion 62 Seal W1 Lower substrate W2 Upper substrate W3 Bonding substrate I35949.doc -25·