KR102520642B1 - Transfer apparatus capable of pattern alignment - Google Patents

Abstract

According to one aspect of the present invention, the first compression unit for supporting the mold on which the pattern and alignment marks are formed; a second compression unit supporting a substrate on which resin and an align key are formed; and a photographing unit for recognizing the align mark and the align key, wherein the second compression unit has a support area for supporting the lower surface of the substrate, and one end is moved up and down so as to be disposed in the support area. A pattern including a substrate seating portion having an extended photographing passage, and a lower image capturing portion recognizing at least one of the align mark and the align key by photographing through the photographing passage of the substrate seating portion. An alignable transfer device may be provided.

Description

Pattern alignable transfer device {TRANSFER APPARATUS CAPABLE OF PATTERN ALIGNMENT}

The present invention relates to a transfer device capable of pattern alignment.

In order to form patterns (eg, structured molding patterns and mask patterns for etching or deposition) on the surface of substrates (eg, display panels and wafers) in recent display processes and semiconductor processes, nano An imprint lithography (Nano Imprint Lithography) process is used.

A nanoimprint lithography process is a technology capable of economically and effectively manufacturing a nano-structure because it can replace a conventional photolithography process. Specifically, the nanoimprint lithography process is a process of transferring a pattern to a resin by pressing a mold on which a nano-scale pattern is formed and a substrate on which a resin is formed by using a transfer apparatus (Transfer Apparatus) to each other. am. A transfer device used in the nanoimprint lithography process presses a mold onto a substrate and then separates the mold from the substrate.

Meanwhile, in transferring the pattern of the mold to the resin of the substrate, it is necessary to position the mold and the substrate at a predetermined target position and press them together. A conventional transfer device positions the mold and the substrate in place by recognizing an alignment mark formed on the mold and an alignment key formed on the substrate through a photographing unit located above the mold and substrate. However, when the mold is an impermeable mold or an align key is formed on the lower surface of the impermeable substrate, the photographing unit included in the conventional transfer device cannot recognize the align key formed on the substrate. In other words, the conventional transfer device has a problem in that the mold and the substrate cannot be moved to the correct position because the photographing unit does not recognize the align key formed on the substrate when it cannot penetrate between the align mark and the align key. If the mold and the substrate are pressed together without being positioned correctly, the pattern may not be transferred to the resin in a predetermined position, resulting in a patterned substrate with poor performance.

Therefore, there is a need for a device capable of aligning the mold and the substrate in place even if the mold is an impermeable mold or an align key is formed on the lower surface of the impermeable substrate.

Embodiments of the present invention were invented with the above background in mind, and even if the mold is an impermeable mold or an align key is formed on the lower surface of the impermeable substrate, the mold and the substrate are placed in a target position through the photographing unit. It is intended to provide a device that can be placed on the

In addition, it is intended to provide a device capable of aligning the horizontal positions of the mold and the substrate so that they are positioned at a predetermined target position before transferring the pattern of the mold to the resin of the substrate.

In addition, it is intended to provide a device capable of accurately transferring a pattern to a predetermined location of a resin.

According to one aspect of the present invention, the first compression unit for supporting the mold on which the pattern and alignment marks are formed; a second compression unit supporting a substrate on which resin and an align key are formed; and a photographing unit for recognizing the align mark and the align key, wherein the second compression unit has a support area for supporting the lower surface of the substrate, and one end is moved up and down so as to be disposed in the support area. A pattern including a substrate seating portion having an extended photographing passage, and a lower image capturing portion recognizing at least one of the align mark and the align key by photographing through the photographing passage of the substrate seating portion. An alignable transfer device may be provided.

In addition, the photographing unit may further include an upper photographing unit recognizing the other one of the align key and the alignment mark when the lower photographing unit recognizes one of the align key and the alignment mark.

In addition, any one of the first compression unit and the second compression unit moves toward the other one, and at least one of the first compression unit and the second compression unit is aligned with the alignment recognized by the lower photographing unit. By moving based on any one or more of a mark and the align key, the horizontal positions of the mold and the substrate are aligned, and the mold and the substrate, the horizontal positions of which are aligned, are pressed together to press each other to form the pattern into the resin. A pattern alignable transfer device configured to adjust one or more of a horizontal position, a vertical position, and an angle so that the angle of view of the lower photographing unit is adjusted toward a position where the align mark and the align key are formed may be provided. there is.

In addition, the lower photographing unit has a first focal length for recognizing the align mark and a second focal length for recognizing the align key, so that the focal length is changed to the first focal length or the second focal length. A pattern alignable transfer device configured may be provided.

In addition, the alignment mark includes a first alignment mark and a second alignment mark, and the alignment key corresponds to the first alignment key corresponding to the first alignment mark and the second alignment mark. A first lower photographing unit configured to recognize at least one of the first align mark and the first align key; and a second lower photographing unit for recognizing at least one of the second align mark and the second align key, and a pattern alignable transfer device may be provided.

In addition, the second compression unit, one side is in communication with the recording passage and the other side opposite to the one side is connected to the lower recording unit; and a reflector disposed between the photographing passage and the photographing guide unit, wherein the photographing guide unit is oriented in a direction different from the vertical direction, and the lower photographing unit recognizes the align key through the reflector. A possible transfer device may be provided.

In addition, the substrate seating unit may include a seating unit body in which the photographing passage is formed; a shielding window blocking the flow of gas in the photographing passage; and a shielding member disposed between the shielding window and the seat body to block gas from flowing between the shield window and the seat body.

In addition, the seating part body may include an upper seating part having the support area; and a lower seating portion supporting the upper seating portion, wherein the photographing passage includes a first passage portion formed in the upper seating portion and a second passage portion formed in the lower seating portion, wherein the at least one shielding window comprises the a first shielding window disposed on the first passage to block gas from flowing into the first passage; and a second shielding window spaced apart from the first shielding window and disposed on the second passage to block the flow of gas into the second passage, wherein the one or more shielding members comprise the A first shielding member positioned between the first shielding window and the upper seating portion; and a second shielding member positioned between the second shielding window and the lower seating portion, and a pattern alignable transfer device may be provided.

In addition, a position adjusting unit for adjusting the horizontal position of the substrate seating unit; and an elevation unit for elevating the positioning unit, wherein the lower photographing unit is moved together when the substrate mounting unit is moved by the positioning unit and the elevation unit.

In addition, the first compression unit for supporting the mold on which the pattern is formed; and a second compression unit supporting the substrate on which the resin is formed, wherein the second compression unit includes: a substrate seating portion supporting the substrate; a position adjusting unit for adjusting the horizontal position of the substrate receiving unit; and a bellows having one end in contact with the first compression unit when elongated to seal a space around the substrate against the outside, and the position adjusting unit having one end of the bellows in contact with the first compression unit. A pattern-alignable transfer device may be provided that adjusts the horizontal position of the substrate mounting portion in the contact state.

In addition, the second compression unit further includes a bellows moving part supported on an outer surface of the substrate seating part and connected to the bellows to expand and contract the bellows, wherein the bellows moving part includes a shaft and a driving force for moving the shaft. An elevating cylinder including a cylinder actuator that provides a; a block provided at an end of the shaft; And a bellows connection part supporting the block so as to allow the block to move in a horizontal direction, wherein the bellows connection part includes a seating groove extending in a horizontal direction so that the block is seated, and a seating groove extending in a vertical direction so as to communicate with the seating groove. A pattern alignable transfer device in which an accommodating groove is formed extending and surrounding the shaft with a predetermined gap, and the shaft moves in a horizontal direction in the accommodating groove when the horizontal position of the substrate receiving part is adjusted in the contact state. can be provided.

In addition, the bellows may be elastically deformed to allow adjustment of the horizontal position of the substrate receiving part in the contact state, and a pattern alignable transfer device may be provided.

In addition, the first compression unit may include a mold jig that supports an edge portion of the mold and contacts one end portion of the bellows when the bellows are in the contact state; a clamp supporting an edge of the mold jig and fixing the mold jig to the first compression unit; and a sealing portion having a lower portion in contact with an upper portion of the mold jig, wherein the clamp includes a slide member supporting the mold jig at a lower portion, and the mold jig is inserted between the slide member and the sealing portion. A transfer device supported by the clamp and capable of pattern alignment may be provided.

In addition, the first compression unit further includes a mold jig supporting an edge of the mold and contacting one end of the bellows when in the contact state, the mold jig is provided with a jig sealing member, A bellows sealing member is provided at one end of the bellows, and when in the contact state, the jig sealing member and the bellows sealing member contact each other to prevent gas from flowing between the mold jig and one end of the bellows, The jig sealing member and the bellows sealing member may be provided with a pattern-alignable transfer device having different shapes.

In addition, the first compression unit may include a mold jig that supports an edge portion of the mold and contacts one end portion of the bellows when in the contact state; a UV transmission window supporting the mold and through which UV is transmitted; a sealing part protruding in a ring shape and having a lower part in contact with the mold jig to seal the periphery of the UV transmission window against the outside; and a first air discharge unit for discharging gas remaining in the closed space inside the sealing unit to the outside when the sealing unit seals the space around the UV transmission window to the outside. may be provided.

In addition, the second compression unit further includes a second air discharge unit for discharging gas remaining in the closed space inside the bellows to the outside when the bellows seals the space around the substrate to the outside. and wherein the first air discharge unit and the second air discharge unit operate to prevent the difference between the gas pressure inside the sealing unit and the gas pressure inside the bellows from exceeding a predetermined range. can

In addition, the pattern alignable transfer device may further include a control unit for controlling operations of the first compression unit, the second compression unit, and the position adjusting unit.

In addition, in the method of manufacturing a pattern substrate by pressing a substrate on which resin and align keys are formed with a mold on which patterns and alignment marks are formed, a photographing unit photographs the alignment marks formed on the mold and the align key formed on the substrate. filming stage; A first positioning step of adjusting the horizontal position of the substrate by a positioning unit; a sealing step in which a bellows seals the space around the substrate against the outside and discharges gas remaining in the space around the substrate to the outside; a second positioning step of readjusting the horizontal position of the substrate by the positioning unit after the sealing step; and a substrate pressing step of pressing the substrate to the mold, a method for manufacturing a patterned substrate may be provided.

In addition, at least one of the first position adjustment step and the second position adjustment step is performed a plurality of times before the substrate pressing step, and the photographing step is performed when the first position adjustment step and the second position adjustment step are performed. A method for manufacturing a patterned substrate, performed every time, can be provided

The elevation step may further include an elevation step in which the elevation unit raises the position adjustment unit, and the elevation step, the photographing step, and the first position adjustment step may include the photographing step when the substrate is raised by a predetermined distance by the elevation step. and a pattern substrate, which is performed a plurality of times, such that the first position adjusting step is performed and the photographing step and the first position adjusting step are performed again when the substrate is raised more than a predetermined distance by the lifting step. A manufacturing method may be provided.

In addition, a method of manufacturing a patterned substrate may be provided in which a horizontal movement distance by which the substrate is moved by the second positioning step is smaller than a horizontal movement distance by which the substrate is moved by the first positioning step.

In addition, in a computer readable recording medium storing a computer program for performing a method of manufacturing a pattern substrate by pressing a mold on which patterns and alignment marks are formed with a substrate on which resin and align keys are formed, the computer program comprises: a storage step of storing image information of the align key photographed by the photographing unit and the align mark photographed by the upper photographing unit in the computer readable recording medium; a calculation step of calculating location information of the alignment mark and the alignment key based on the image information stored in the computer-readable recording medium; and an outputting step of outputting an operation command for adjusting the position of the mold or the substrate based on the calculated positional information, wherein the calculating step includes the calculated position of the alignment mark. Acquiring a path value along which the position of the align key moves, and the outputting step further outputs an operation command for adjusting the central position of the image information of the align key according to the obtained path value, computer readable. A computer program stored on a recording medium may be provided.

According to the embodiments of the present invention, before transferring the pattern of the mold to the resin of the substrate, it is possible to align the horizontal positions of the mold and the substrate so that they are located in a predetermined position.

In addition, there is an effect that the pattern can be accurately transferred to a predetermined location of the resin.

In addition, even if the mold is an impermeable mold or an align key is formed on the lower surface of the impermeable substrate, the mold and the substrate can be positioned at a target position through the photographing unit.

1 is a perspective view of a transfer device capable of pattern alignment according to an embodiment of the present invention.
Figure 2 is a plan view of the mold of Figure 1;
3 is a bottom view of the substrate of FIG. 1;
4 is a cross-sectional view taken along line A-A' of FIG. 1;
5 is a cross-sectional view taken along AA′ of FIG. 1 when the second compression unit moves upward.
6 is a cross-sectional view taken along line BB′ of FIG. 1 .
7 is a cross-sectional view taken along line BB′ when the capturing unit of FIG. 1 is moved to a non-photographing position.
8 is an enlarged view of B in FIG. 6 .
Figure 9 is a side view of Figure 1;
10 is an exploded perspective view in which the mold supporter of FIG. 1 is disassembled.
11 is a perspective view showing that the mold jig is inserted by moving the clamp downward.
12 is a perspective view illustrating a state in which the mold jig is moved to a space between the clamp and the sealing part and is seated in the clamp.
FIG. 13 is an enlarged view of D of FIG. 9 , which is a perspective view illustrating a state in which the mold jig is moved to a space between the clamp and the sealing part and is seated in the clamp.
14 is a front view showing that the mold jig is interposed between the clamp and the sealing portion so that the mold jig contacts the sealing portion.
15 is an enlarged view of C in FIG. 4;
Fig. 16 is an enlarged view of E in Fig. 9;
17 is a cross-sectional view taken along line XX' of FIG. 16;
18 is an exploded perspective view of FIG. 1;
19 is an exploded perspective view of the bottom of FIG. 1;
20 is a flowchart schematically illustrating a method of manufacturing a pattern substrate according to an embodiment of the present invention.

Hereinafter, specific embodiments for implementing the technical idea of the present invention will be described in detail with reference to the drawings.

In addition, in the description of the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

In addition, when a component is referred to as 'support', 'inflow', 'output', or 'fixed' to another component, it may be directly supported, introduced, discharged, or fixed to the other component, but other components in the middle It should be understood that elements may be present.

Terms used in this specification are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In addition, terms including ordinal numbers, such as first and second, may be used to describe various components, but the components are not limited by these terms. These terms are only used to distinguish one component from another.

As used herein, the meaning of "comprising" specifies specific characteristics, regions, integers, steps, operations, elements, and/or components, and other specific characteristics, regions, integers, steps, operations, elements, elements, and/or groups. does not exclude the presence or addition of

In addition, in this specification, expressions such as upper, lower, and lower surfaces are described based on the drawings, and it is made clear in advance that they may be differently expressed when the direction of the object is changed. Meanwhile, in the present specification, the left-right direction may be the x-axis direction (x ₁ is the right side and x ₂ is the left side) of FIGS. 1, 4, and 5 . In addition, the front-back direction may be the y-axis direction of FIGS. 1, 6, 7, and 9 (y ₁ is the front side, y ₂ is the rear side), and the up-and-down direction is the 9 (z ₁ is the upper side, z ₂ is the lower side). In addition, the θ direction may be a direction rotating about the z-axis direction of FIG. 1 as a central axis. Also, the horizontal direction may be one or a combination of an x-axis direction and a y-axis direction. Also, the horizontal position may be a position on a virtual plane in the x-axis direction and the y-axis direction. Also, the vertical direction may be the z-axis direction. Also, the vertical position may be a position on a virtual straight line in the z-axis direction.

Hereinafter, a specific configuration of a transfer device 1 capable of pattern alignment according to an embodiment of the present invention will be described with reference to the drawings.

Referring to FIGS. 1, 4, and 5, in the pattern alignable transfer device 1 according to an embodiment of the present invention, a mold 10 and a substrate 20 are pressed together to press each other to form a mold. The pattern formed in (10) can be transferred to the resin formed on the substrate 20. Here, the meaning of transferring the pattern to the resin may mean that the pattern (not shown) formed in the mold 10 is transferred to the resin formed in the substrate 20 . In addition, the meaning of transferring the mold 10 to the substrate 20 may mean that the pattern formed on the mold 10 is transferred to the resin formed on the substrate 20 .

The transfer device 1 capable of aligning the pattern determines the relative horizontal position between the mold 10 and the substrate 20 so that the mold 10 and the substrate 20 are positioned in a target position before transferring the pattern to the resin. can be sorted Here, the correct position of the mold 10 and the substrate 20 is when the mold 10 and the substrate 20 are viewed from above, the alignment mark 11 to be described later and the alignment key 21 to be described later match each other. It may mean a horizontal position of the mold 10 and the substrate 20 in a state arranged so as to be.

In this way, before transferring the pattern of the mold 10 to the resin of the substrate 20, the pattern alignable transfer device 1 aligns the horizontal positions of the mold 10 and the substrate 20 so that they are positioned in a predetermined position. There are effects that can be done. In addition, there is an effect that the pattern can be accurately transferred to a predetermined location of the resin.

The mold 10 may be supported by the transfer device 1 capable of pattern alignment. In addition, the mold 10 may be an impervious mold made of an opaque material, but is not limited thereto. In addition, a pattern to be transferred to the resin of the substrate 20 may be formed on one surface of the mold 10 .

Referring to FIG. 2 , an alignment mark 11 may be formed on the mold 10 as a basis for aligning the substrate 20 to be positioned at a predetermined position. For example, as the mold 10 is supported by the first compression unit 100 to be described later, the pattern may be disposed on the lower surface of the mold 10 to face downward.

The alignment marks 11 may be formed on at least one of a lower surface side and an upper surface side of the mold 10 .

Also, the pattern may be formed below the alignment mark 11 .

A plurality of alignment marks 11 may be provided in the mold 10 . In addition, the alignment mark 11 may include a first alignment mark 11a and a second alignment mark 11b spaced apart from the first alignment mark 11a.

The photographing unit 300 to be described later may recognize the alignment mark 11 by recognizing at least one of the lower surface side and the upper surface side of the mold 10 .

The substrate 20 may be supported by the transfer device 1 capable of pattern alignment. In addition, the substrate 20 may be an opaque substrate made of an opaque material, but is not limited thereto. For example, the impervious substrate may be a silicon wafer, a metal deposition wafer, or the like. In addition, a resin onto which a pattern is transferred may be formed on one surface of the substrate 20 . In addition, the resin may be formed by being coated on the surface of the substrate 20 .

Referring to FIG. 3 , an alignment key 21, which is a basis for aligning the substrate 20 to be located in a predetermined position with the mold 10 at a position corresponding to the position where the alignment mark 11 is formed, is provided. can be formed For example, as the substrate 20 is supported by the second compression unit 200 to be described later, the resin may be disposed on the top surface of the substrate 20 so as to face upward.

The align key 21 may be formed on at least one of the upper and lower surfaces of the substrate 20 . Also, resin may be formed above the align key 21 .

A plurality of align keys 21 may be formed on the substrate 20 . In addition, the align key 21 corresponds to the first align key 21a corresponding to the first alignment mark 11a and the second alignment mark 11b and is spaced apart from the first align key 21a. It may include a second align key 21b located in the position.

The photographing unit 300 to be described later may recognize the align key 21 by recognizing at least one of the upper and lower surfaces of the substrate 20 .

The alignment mark 11 and the alignment key 21 may be formed to correspond to each other. For example, the alignment mark 11 may be formed in a cross shape. In addition, when viewed from the top, the align key 21 may be formed in a shape in which a plurality of squares are arranged in which a space in which the align mark 11 can be located is formed.

The alignment mark 11 and the alignment key 21 may serve as standards for determining whether the mold 10 and the substrate 20 are in proper position. For example, if the alignment mark 11 overlaps at least a part of the alignment key 21 or is not adjacent to the alignment key 21, the mold 10 and the substrate 20 are not in place. can As another example, when the alignment marks 11 are aligned with the alignment keys 21, the mold 10 and the substrate 20 may be in place.

Referring to FIGS. 4 and 5 , the pattern alignable transfer device 1 includes a first compression unit 100, a second compression unit 200, a photographing unit 300, a UV irradiation unit 400, and a driving unit 500. And it may include a control unit 600.

The following is a description of the first compression unit 100 .

The first compression unit 100 may support the mold 10 . Also, the second compression unit 200 may support the substrate 20 . In addition, either one of the first compression unit 100 and the second compression unit 200 may move toward the other one. In other words, any one of the first compression unit 100 and the second compression unit 200 may move in a vertical direction. In addition, at least one of the first compression unit 100 and the second compression unit 200 is moved in a horizontal direction based on the alignment mark 11 and the alignment key 21 to form the mold 10 and the substrate 20 ) can be aligned horizontally so that it is in place. In addition, at least one of the first compression unit 100 and the second compression unit 200 moves up and down to press the horizontally aligned mold 10 and the substrate 20 to each other to accurately transfer the pattern to the position of the resin. can do.

The first compression unit 100 includes a mold supporter 110, a UV transmission window 120, a sealing unit 130, a first air discharge unit 140, a sealing unit sealing member 150, and a supporter moving unit (not shown). can include

Further referring to FIGS. 6 to 9 , the mold supporter 110 may be provided to support the mold 10 . For example, the mold 10 may be supported so that the pattern faces downward by the mold supporter 110 .

The mold supporter 110 may include a mold jig 111 , a clamp 112 , a clamp mover 113 and a mover supporter 114 .

The mold jig 111 may support the mold 10 . In addition, a part of the mold jig 111 may be open so that the center of the mold 10 is exposed toward the substrate 20 . Here, the central portion of the mold 10 exposed by the mold jig 111 may refer to a portion where a pattern is formed in the mold 10 or a portion of the mold 10 supported by a UV transmission window 120 to be described later. In addition, the mold jig 111 may support the edge of the mold 10 . Accordingly, the mold jig 111 exposes the central portion of the mold 10 and supports the edge of the mold 10 so that the mold 10 can be fixedly brought into close contact with the mold jig 111 . The mold jig 111 may be interposed between the clamp 112 and the sealing portion 130 and supported, and may be slid and removed from between the clamp 112 and the sealing portion 130 .

A jig sealing member 111a may be provided in the mold jig 111 .

As shown in FIG. 8, the jig sealing member 111a is provided on the lower surface of the mold jig 111 and is provided at one end of a bellows 240 that will be described later in contact with the mold jig 111. can be contacted. In addition, the jig sealing member 111a is in contact with the bellows sealing member 241 to prevent gas from flowing between the mold jig 111 and one end of the bellows 240 . In addition, the jig sealing member 111a may include a flat ring fitted into a groove formed on a lower surface of the mold jig 111 .

Referring to FIGS. 10 to 13 , the clamp 112 , the clamp mover 113 and the mover supporter 114 will be described. 10 is an exploded perspective view in which the mold supporter 110 is disassembled. 11 is a perspective view showing a state in which the clamp 112 is moved downward so that the mold jig 111 can slide into the space between the clamp 112 and the sealing part 130. 12 is a perspective view illustrating a state in which the mold jig 111 is moved to the space between the clamp 112 and the sealing part 130 and is seated on the clamp 112.

13 and 14 are enlarged side views and front views illustrating that the mold jig 111 is interposed between the clamp 112 and the sealing portion 130 such that the upper surface of the mold jig 111 contacts the sealing portion 130.

The clamp 112 may support the edge of the mold jig 111 to fix the mold jig 111 to the side of the first compression unit 100 .

The clamp 112 may include a slide member 112a supporting the mold jig 111 and a clamp body 112b supporting the slide member 112a.

The slide member 112a may be supported by the clamp body 112b while being spaced apart from the sealing part 130 by a predetermined distance in the vertical direction. Accordingly, a space for inserting the mold jig 111 may be provided between the slide member 112a and the sealing part 130 .

The clamp mover 113 may move the clamp 112 in a vertical direction. For example, the clamp mover 113 is supported by the mover supporter 114 to move the slide member 112a and the clamp body 112b in a vertical direction.

The mover supporter 114 is supported by the sealing part 130 to support the clamp mover 113 . For example, the mover supporter 114 may be attached to a side surface of the sealing part 130 to support the clamp mover 113 .

Hereinafter, a process of sliding the mold jig 111 between the clamp 112 and the sealing part 130 will be described.

First, as shown in FIG. 11 , the clamp mover 113 moves the clamp 112 downward. When the clamp 112 moves downward, the distance between the clamp 112 and the sealing part 130 in the vertical direction increases.

In this state, as shown in FIG. 12 , the mold jig 111 slides from the external space to the space between the clamp 112 and the sealing part 130 and is seated on the slide member 112a. In addition, the direction in which the mold jig 111 slides to be seated on the clamp 112 may be in the forward and backward directions.

Then, as shown in FIGS. 13 and 14 , the clamp 112 is moved upward by the clamp mover 113 . When the clamp 112 is moved upward, the mold jig 111 is interposed between the clamp 112 and the sealing portion 130 so as to come into contact with the sealing portion 130 by the upward movement of the clamp 112. can be fixed

In this way, the edge of the mold jig 111 is pressed and fixed to the sealing portion 130 by the clamp 112, thereby preventing any movement between the clamp 112 and the sealing portion 130. .

Meanwhile, the process of removing the mold jig 111 from between the clamp 112 and the sealing part 130 may be performed in the reverse order of the process of sliding and inserting the mold jig 111.

Referring again to FIGS. 6 to 8 , the UV transmission window 120 may be configured to transmit UV irradiated from the UV irradiation unit 400 . In addition, the lower surface of the UV transmission window 120 may support the mold 10 . In addition, the UV transmission window 120 may be surrounded by a sealing portion 130 to be blocked from the outside.

The sealing part 130 may seal around the UV transmission window 120 against the outside. In other words, the sealing portion 130 is provided to surround the UV transmission window 120, thereby blocking the UV transmission window 120 from the outside. Also, the bottom of the sealing part 130 may come into contact with the mold jig 111 . For example, the sealing portion 130 may have a ring shape with a portion protruding to come into contact with the mold jig 111 .

The sealing part 130 may be provided such that a part of the sealing part 130 is spaced apart from the UV transmission window 120 . Thus, a predetermined separation space (S) may be formed between the sealing part 130 and the UV transmission window 120 . In addition, the separation space (S) may communicate with the first air discharge unit (140). In addition, when the lower part of the sealing part 130 comes into contact with the upper part of the mold jig 111, the gas remaining inside the separation space S can be discharged to the outside by the first air discharge part 140. . In addition, the lower part of the sealing part 130 contacts the upper part of the mold jig 111 so that the separation space S is sealed. Therefore, as the sealing part 130 comes into contact with the upper part of the mold jig 111, it can discharge the air in the separation space S and prevent air from entering from the outside, leaving the separation space S in a vacuum state. can be formed with

In this way, as the separation space (S) is formed in a vacuum state, it is possible to block the inflow of air into the substrate 20, so that the periphery of the UV transmission window 120 can be more effectively sealed against the outside.

The first air discharge unit 140 may discharge gas between the UV transmission window 120 and the sealing unit 130 to the outside. In other words, when the sealing part 130 seals the space around the UV transmission window 120 to the outside, the first air discharge unit 140 discharges the gas remaining inside the separation space S to the outside. can In addition, the first air discharge unit 140 may include a nozzle exposed on an inner circumferential surface of the sealing unit 130 .

The sealing member 150 may block gas from entering between the mold jig 111 and the sealing portion 130 . In addition, the sealing member 150 may be positioned between the mold jig 111 and the sealing portion 130 . In addition, the sealing member sealing member 150 may include an elastic ring fitted into a groove concave upwardly on the bottom surface of the sealing portion 130 .

The supporter moving unit (not shown) may move the center of the mold 10 in a horizontal direction by moving the mold supporter 110 in a horizontal direction. For example, when the substrate 20 has a relatively large area compared to the mold 10, the supporter moving unit moves the mold 10 to position the mold supporter 110 from one point on the upper side of the substrate 20 to another point. ) may be moved to partially transfer the pattern of the mold 10 to the substrate 20 having a larger area than the mold 10 one by one.

The following is a description of the second compression unit 200 .

Referring to FIGS. 4 and 5 , the second compression unit 200 may support the substrate 20 and adjust the position of the substrate 20 . In other words, the second compression unit 200 may align the horizontal position of the substrate 20 .

The second compression unit 200 may approach the substrate 20 toward the mold 10 . In other words, the second compression unit 200 may move the substrate 20 in a vertical direction.

The second compression unit 200 includes a substrate seating unit 210, a position adjusting unit 220, an elevation unit 230, a bellows 240, a second air discharge unit 250, a bellows moving unit 260, and a shooting guide unit. 280 and a reflector 290 may be included.

Referring further to FIG. 15 , the substrate seating portion 210 may provide a portion on which the substrate 20 is seated. In addition, the substrate seating unit 210 may include a support area for supporting the lower surface of the substrate 20 . In addition, a photographing passage 210a may be formed in the substrate mounting portion 210 to extend vertically so that one end thereof is disposed in the support area.

The photographing passage 210a may include a first passage part 210a-1 and a second passage part 210a-2 lower than the first passage part 210a-1. In addition, the lower photographing unit 320 to be described later may recognize the align key 21 of the substrate 20 through the photographing passage 210a.

The substrate seating unit 210 may include a seating unit body 211 , a shielding window 213 , and a shielding member 214 .

The seat body 211 may support the substrate 20 . In addition, a photographing passage 210a may be formed in the seat body 211 . In addition, the seat body 211 may be supported by the position adjusting unit 220 shown in FIG. 5 .

The seating body 211 may include an upper seating portion 211a and a lower seating portion 211b.

The upper seating portion 211a may be disposed above the lower seating portion 211b and may have a support area capable of supporting the substrate 20 . In addition, the upper seating portion 211a may have a first passage portion 210a-1 formed therein. Also, the first passage part 210a-1 may pass through the upper seating part 211a in a vertical direction. In addition, one end of the first passage part 210a-1 may be provided in the support area of the upper seating part 211a.

The lower seating portion 211b may support the upper seating portion 211a. In addition, the second passage part 210a-2 may be formed in the lower seating part 211b. Also, the second passage part 210a-2 may pass through the lower seating part 211b in the vertical direction. In addition, the second passage part 210a-2 is connected to the first passage part 210a-1, but may be out of communication with the first passage part 210a-1 by the shielding window 213.

The shielding window 213 may block the flow of gas in the photographing passage 210a. In addition, the shielding window 213 may include a first shielding window 213a and a second shielding window 213b.

The first shielding window 213a may block gas inside the first passage part 210a-1 from flowing between the upper seating part 211a and the lower seating part 211b. Also, the first shielding window 213a may be disposed within the first passage part 210a-1.

The second shielding window 213b may block gas from flowing into the second passage part 210a-2 between the upper seating part 211a and the lower seating part 211b. In addition, the second shielding window 213b may be vertically spaced apart from the first shielding window 213a and disposed within the second passage part 210a-2. In other words, the first shielding window 213a and the second shielding window 213b may be spaced apart from each other.

In this way, as the first shielding window 213a and the second shielding window 213b are spaced apart from each other, damage to each other can be prevented and there is an effect of helping to maintain the level of the mounting part body 211. . In addition, since the first shielding window 213a and the second shielding window 213b are not in contact and are spaced apart from each other, the upper seating part 211a for the lower seating part 211b to level the mounting body 211. ) has an effect of preventing at least one of the first shielding window 213a and the second shielding window 213b from being worn due to friction even if the position of the seat body 211 is shaken as the seat body 211 is moved.

The shielding member 214 may block gas from flowing between the shielding window 213 and the mounting body 211 . In addition, the shielding member 214 may be disposed between the shielding window 213 and the seat body 211 . In addition, the length of the shielding member 214 in the horizontal direction may be greater than the length of the photographing passage 210a in the horizontal direction. In other words, the radius of the shielding member 214 based on the center of the photographing passage 210a may be larger than the radius of the photographing passage 210a adjacent to the shielding member 214 .

In this way, since the shielding member 214 is formed large, it does not interfere with the shooting passage 210a, and while securing the shooting space through the shielding window 213 at the same level as the width of the shooting passage 210a, the shielding member ( 214) and the seating part body 211 may be effective in sealing.

The shielding member 214 may include a first shielding member 214a and a second shielding member 214b.

The first shielding member 214a may prevent gas from flowing between the first shielding window 213a and the first passage 210a-1. In addition, the first shielding member 214a may be disposed between the first shielding window 213a and the upper seating portion 211a. In addition, the first shielding member 214a may include an elastic ring formed along the circumferential surface of the first shielding window 213a.

The second shielding member 214b may prevent gas from flowing between the second shielding window 213b and the second passage 210a-2. In addition, the second shielding member 214b may be disposed between the second shielding window 213b and the lower seating portion 211b. In addition, the second shielding member 214b may include an elastic ring formed along the circumferential surface of the second shielding window 213b.

Referring to FIGS. 4 to 7 and 9 , the position adjusting unit 220 may adjust the horizontal position of the substrate mounting unit 210 . For example, the position adjusting unit 220 may move the substrate seating unit 210 in front and rear directions (horizontal direction) and may rotate the substrate seating unit 210 . Accordingly, the position adjuster 220 may adjust the position of the substrate seating part 210 to align the mold 10 and the substrate 20 so that they are positioned in the right position. In addition, the position adjusting unit 220 may readjust the horizontal position of the substrate seating unit 210 when one end of the bellows 240 is in contact with the first compression unit 100 .

The positioning unit 220 may be an alignment stage. For example, the position adjusting unit 220 forms a movement operation by a plurality of individually operated modules (ie, the x-axis direction by the individual operation of each module moving in the x-axis direction, the y-axis direction, and the θ direction). , forming movement motions in the y-axis direction and the θ direction) may be an xyθ stage. As another example, the position adjusting unit 220 forms a movement operation by a plurality of modules operated to influence each other (ie, x-direction, x-direction, It may be a uvw stage that forms movement motions in the Y direction and the θ direction).

The position adjusting unit 220 may be located on the upper side of the lifting unit 230 and may be moved up and down by the lifting unit 230 .

The position adjusting unit 220 may include a first adjusting unit 221 , a second adjusting unit 222 and a third adjusting unit 223 .

The first adjusting unit 221, the second adjusting unit 222, and the third adjusting unit 223 adjust the horizontal position of the substrate mounting unit 210. Each module that moves in the u-axis, v-axis, and w-axis of the uvw stage can be In addition, the first adjusting unit 221 , the second adjusting unit 222 , and the third adjusting unit 223 maintain the substrate seating unit 210 even in a state in which one end of the bellows 240 is in contact with the first compression unit 100 . It can be moved in the direction (y-axis direction), it can be moved in the left-right direction (x-axis direction), and it can be rotated.

In this way, the position adjusting unit 220 adjusts the horizontal position of the substrate mounting unit 210 based on the alignment mark 11 and the alignment key 21 so that the mold 10 and the substrate 20 are in place. There is an effect that can be aligned to position. In addition, when the bellows 240 is in a contact state, the relative position between the mold 10 and the substrate 20 can be more precisely adjusted by adjusting the horizontal position of the substrate 20 once more.

The elevating unit 230 may elevate and lower the substrate seating unit 210 . For example, the elevation unit 230 may move the substrate seating unit 210 in a vertical direction with respect to the ground. In addition, the elevating unit 230 may move the substrate 20 toward the first compressing unit 100 or separate it from the first compressing unit 100 by elevating the substrate seating portion 210 . Also, the elevating unit 230 may compress the substrate 20 to the mold 10 by moving the substrate 20 toward the first compression unit 100 .

The bellows 240 may be configured to seal the space around the substrate 20 to the outside. In other words, by extending the bellows 240 , the space around the substrate 20 can be sealed against the outside.

The bellows 240 may have a plurality of folds to be stretched toward the first compression unit 100 when the mold 10 and the substrate 20 are compressed. In addition, one end of the bellows 240 may be provided to be flexible so as to move toward the first compression unit 100 , and the other end may be supported by the substrate seating part 210 . For example, the bellows 240 may extend toward the first compression unit 100, and at this time, the upper end of the bellows 240 may contact the first compression unit 100. As such, when the bellows 240 is in contact with the first compression unit 100, the substrate 20 may be blocked from the outside. As another example, the extended bellows 240 can be retracted again. In this way, when the bellows 240 is in a reduced state toward the substrate 20, the substrate 20 may be exposed to the outside.

The bellows 240 may be elastically deformed to allow adjustment of the horizontal position of the substrate seat 210 in a contact state.

As shown in FIG. 15, a bellows sealing member 241 may be provided at one end of the bellows 240.

The bellows sealing member 241 may be in contact with the jig sealing member 111a to prevent gas from flowing between the mold jig 111 and one end of the bellows 240 when the bellows 240 is in contact. . In addition, the bellows sealing member 241 and the jig sealing member 111a may be formed in different shapes and have different frictional forces. As such, since the bellows sealing member 241 and the jig sealing member 111a may have different shapes and have different frictional forces, when the bellows 240 are in contact, as the substrate seating part 210 moves horizontally, the bellows One end of 240 can also slide in the mold jig 111. For example, the bellows sealing member 241 may include an O-ring fitted into a groove formed at one end (eg, upper end) of the bellows 240 .

In this way, when the bellows 240 is in contact, as it is moved by the position adjusting unit 220, the bellows sealing member 241 slides while in contact with the jig sealing member 111a to prevent gas from flowing in. At the same time, there is an effect of preventing the bellows 240 from being excessively elastically deformed.

When the bellows 240 seals the space around the substrate 20 to the outside, the second air discharge unit 250 can discharge gas remaining in the closed space inside the bellows 240 to the outside. In addition, the second air discharge unit 250 may maintain the space around the substrate 20 in a vacuum state by discharging gas remaining in the sealed space inside the bellows 240 to the outside. Also, the second air outlet 250 may include a nozzle exposed inside the bellows 240 .

The first air outlet 140 and the second air outlet 250 may be operated to prevent a difference between the gas pressure inside the sealing portion 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range. .

In this way, the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 is prevented from going out of a predetermined range, so that the difference in pressure applied to the upper and lower sides of the mold 10 is out of a predetermined range As a result, it has an effect of preventing the mold 10 from being bent.

16 to 19 , the bellows moving unit 260 is supported on the outer surface of the substrate mounting unit 210 and is connected to the bellows 240 to expand or contract the bellows 240 . In other words, the bellows moving unit 260 may convert the bellows 240 into a contact state or a reduced state.

The bellows moving unit 260 may include an elevating cylinder 261, a block 262, and a bellows connecting unit 263.

The elevating cylinder 261 may include a shaft 261a and a cylinder actuator 261b providing a driving force for moving the shaft 261a in the vertical direction.

The elevating cylinder 261 may be supported on an outer surface of the substrate seating part 210 . In other words, the elevating cylinder 261 may be supported on the outer surface of the lower seating portion 211b.

The block 262 is provided at the end of the shaft 261a and can be moved together with the shaft 261a.

The bellows connection part 263 may support the block 262 so that the movement of the block 262 in the horizontal direction is allowed. In addition, the bellows connection portion 263 has a seating groove 263a extending in a horizontal direction so that the block 262 is seated and extending vertically to communicate with the lower portion of the seating groove 263a and surrounds the shaft 261a with a predetermined gap. A receiving groove 263b may be formed. For example, the predetermined gap of the accommodating groove 263b may be 0.4 mm or more and 0.5 mm or less. In addition, when the horizontal position of the substrate seating part 210 is adjusted while the bellows 240 is in a contact state, the shaft 261a may move in the horizontal direction within the receiving groove 263b. In other words, in the contact state, the substrate seating part 210 may move horizontally by a predetermined gap or less by the position adjusting part 220 .

Referring back to FIG. 15 , one side of the recording guide unit 280 communicates with the recording passage 210a and the other side opposite to the one side may be connected to a lower capturing unit 320 to be described later. In addition, at least a portion of the photographing guide unit 280 may be positioned lower than the substrate seating unit 210 . In addition, the shooting guide unit 280 may be oriented in a direction different from the vertical direction. For example, the photographing guide unit 280 may be formed in a direction perpendicular to the direction in which the photographing passage 210a is formed. In addition, the lower photographing unit 320 to be described later may photograph the lower surface of the substrate 20 through the photographing guide unit 280 and the photographing passage 210a.

The photographing guide unit 280 may include a reflector 290 on an inner surface of the photographing guide unit 280 for the lower photographing unit 320 to be described later to efficiently recognize the lower surface of the substrate 20 .

The reflector 290 may be disposed between the photographing guide unit 280 and the photographing passage 210a to reflect the image of the alignment mark 11 and make it incident to the lower photographing part 320 to be described later. For example, the reflector 290 may be a reflector capable of reflecting light. As a more specific example, the reflector 290 may reflect light traveling along the imaging passage 210a to travel along the imaging guide 280 . In this way, the reflector 290 has the image of the align key 21 so that the lower photographing unit 320 to be described later recognizes the align key 21 even if the photographing passage 210a and the photographing guide 280 are displaced from each other. can reflect. In other words, the lower photographing unit 320 to be described later may recognize the align key 21 through the reflecting unit 290 .

The following is a description of the photographing unit 300 .

The photographing unit 300 may recognize the alignment mark 11 of the mold 10 and the alignment key 21 of the substrate 20 . For example, the photographing unit 300 may be a camera that photographs the align mark 11 and the align key 21 . In addition, the photographing unit 300 recognizes the align mark 11 and the align key 21 at the same time, or recognizes one of the align mark 11 and the align key 21 first, and recognizes another one based on this. one can recognize. Therefore, it is possible to recognize the position of the alignment mark 11 and the alignment key 21 through the photographing unit 300 to check the error in the correct position between the alignment mark 11 and the alignment key 21. there is.

In this way, the photographing unit 300 determines the relative position between the first alignment mark 11a and the first align key 21a and the position between the second alignment mark 11b and the second align key 21b. By recognizing the relative position, the photographing unit 300 has an effect of recognizing the position complementary to each other and more accurately recognizing whether the mold 10 and the substrate 20 are positioned at the correct position.

The photographing unit 300 may be configured such that at least one of a horizontal position, a vertical position, and an angle is adjusted so that the angle of view is directed toward the position where the align mark 11 and the align key 21 are formed.

The photographing unit 300 has a first focal length for recognizing the align mark 11 and a second focal length for recognizing the align key 21, and the focal length is the first focal length or the second focal length. It can be configured to change. For example, the focal length of the photographing unit 300 may be configured to change from a first focal length to a second focal length in order to recognize the align key 21 while recognizing the align mark 11 .

At least one of the first compression unit 100 and the second compression unit 200 is moved based on the alignment mark 11 and the alignment key 21 recognized by the photographing unit 300 to form the mold 10 and The horizontal position of the substrate 20 may be aligned.

The photographing unit 300 may include an upper photographing unit 310 and a lower photographing unit 320 .

The upper photographing unit 310 may recognize one or more of the align mark 11 and the align key 21 . For example, when the mold 10 is formed of an opaque material so that light cannot pass between the align mark 11 and the align key 21, the upper photographing unit 310 captures the image of the mold 10. The in mark 11 can be recognized. As another example, when the mold 10 is formed of an opaque material and light passes between the alignment mark 11 and the alignment key 21, the upper photographing unit 310 is formed of the alignment mark 11 and All of the align keys 21 can be recognized.

The upper photographing unit 310 may move in a horizontal direction between a photographing position and a non-photographing position in order to recognize one or more of the align mark 11 and the align key 21 . For example, the upper photographing unit 310 may move to a photographing position for recognizing one or more of the align mark 11 and the align key 21 . As shown in FIG. 6, the photographing position is located at a predetermined position above the mold 10 and the substrate 20 in order for the upper photographing unit 310 to recognize the alignment mark 11 and the alignment key 21. It can mean being placed. As another example, the upper photographing unit 310 may move to a non-photographed position where the align mark 11 and the align key 21 are not recognized. As shown in FIG. 7, this non-photographed position is the mold 10 and substrate 20, which are photographed positions, so that the upper photographing unit 310 does not recognize the alignment mark 11 and the align key 21. It may mean moving and disposing in a horizontal direction at a predetermined upper side of the . In addition, the non-capturing position may refer to a position spaced apart from the photographing position in a horizontal direction.

The upper photographing unit 310 may be formed in plurality. Also, the upper capturing unit 310 may include a first upper capturing unit and a second upper capturing unit. Also, the first upper photographing unit may recognize at least one of the first align mark 11a and the first align key 21a. Also, the second upper photographing unit may recognize at least one of the second align mark 11b and the second align key 21b.

The lower photographing unit 320 may photograph through the photographing passage 210a of the substrate seating part 210 in order to recognize at least one of the alignment mark 11 and the align key 21 . In addition, when the upper photographing unit 310 recognizes any one of the align mark 11 and the align key 21, the lower photographing unit 320 captures the photographing passage 210a of the substrate seating part 210. through which one can recognize the other. For example, when the substrate 20 is formed of an opaque material so that light cannot pass between the align mark 11 and the align key 21, the align key 21 of the substrate 20 is recognized. can do. As another example, when the substrate 20 is formed of a transparent material and light passes between the align mark 11 and the align key 21, the lower photographing unit 320 is formed through the photographing passage 210a. Both the in mark 11 and the align key 21 can be recognized.

As shown in FIG. 5 , the lower photographing unit 320 may be disposed lower than the upper photographing unit 310 and connected to the second compression unit 200 . For example, the lower photographing unit 320 may be connected to the lower side of the substrate mounting unit 210 . Accordingly, the lower photographing unit 320 may be moved together when the substrate seating unit 210 is moved by the position adjusting unit 220 and the lifting unit 230 . In other words, the lower photographing unit 320 may be moved together when the mold 10 is horizontally moved or the mold 10 is vertically moved.

The lower photographing unit 320 may be formed in plurality. Also, the lower capturing unit 320 may include a first lower capturing unit and a second lower capturing unit. Also, the first lower photographing unit may recognize at least one of the first align mark 11a and the first align key 21a. Also, the second lower photographing unit may recognize at least one of the second align mark 11b and the second align key 21b.

Previously, the photographing unit 300 has been described as including an upper photographing unit 310 and a lower photographing unit 320, but the spirit of the present invention is not necessarily limited thereto, and the photographing unit 300 is an upper photographing unit 310 and the lower photographing unit 320 may include only one of the two. For example, when the upper photographing unit 310 and the lower photographing unit 320 include only one of the two, the including one may recognize both the align mark 11 and the align key 21. . As another example, when the upper photographing unit 310 and the lower photographing unit 320 include both, the upper photographing unit 310 recognizes any one of the align mark 11 and the align key 21 And the lower photographing unit 320 can recognize the other one.

In this way, even if the mold 10 is an impermeable mold or the align key 21 is formed on the lower surface of the impermeable substrate, the mold 10 and the substrate 20 are placed in place through the photographing unit 300 (target There is an effect that can be placed in position).

The following is a description of the UV irradiation unit 400 .

The UV irradiation unit 400 may irradiate UV light to the resin formed on the substrate 20 to cure the resin.

The UV irradiation unit 400 may move in a horizontal direction between an irradiation position and a non-irradiation position in order to irradiate the resin with UV. For example, the UV irradiation unit 400 may move to an irradiation position for irradiating UV to the resin. As shown in FIG. 7 , such an irradiation position may mean that the UV irradiation unit 400 is disposed at a predetermined position above the mold 10 and the substrate 20 to irradiate the resin with UV. In addition, the irradiation position may mean a state in which the second compression unit 200 is elevated toward the first compression unit 100 . As another example, the UV radiating unit 400 may move to a non-irradiating position for not radiating UV. As shown in FIG. 6, the non-irradiation position means that the UV irradiation unit 400 is spaced apart from a predetermined position above the mold 10 and the substrate 20, which are irradiation positions, in order not to irradiate the resin with UV. can do. In addition, the non-irradiation position may mean a spaced apart from the irradiation position in a horizontal direction.

The UV irradiation unit 400 and the upper photographing unit 310 may be spaced apart in a horizontal direction. In addition, the UV irradiation unit 400 and the upper photographing unit 310 may be located above the first compression unit 100 .

The following is a description of the driving unit 500 .

Referring to FIGS. 1, 4, 6, 7, 9, and 18 , the driving unit 500 may horizontally move the upper photographing unit 310 between a photographing position and a non-photographing position. Also, the driving unit 500 may horizontally move the UV irradiation unit 400 between an irradiation position and a non-irradiation position.

The driving unit 500 may include a support body 510 and a support body actuator 520 .

The support 510 may support the upper photographing unit 310 and the UV irradiation unit 400 . In addition, the support 510 may be configured such that when the support 510 moves horizontally, the upper photographing unit 310 and the UV irradiation unit 400 move horizontally together.

The support actuator 520 may move the upper photographing unit 310 and the UV irradiation unit 400 together in a horizontal direction by moving the support 510 in a horizontal direction. For example, the support body actuator 520 may move the upper photographing unit 310 to a photographing position so that the upper photographing part 310 recognizes at least one of the alignment mark 11 and the align key 21. . In this case, the support body actuator 520 may move the UV irradiation unit 400 to a non-irradiation position. As another example, the support body actuator 520 may move the UV radiating unit 400 to an irradiation position so that the UV radiating unit 400 radiates UV to the resin. In this case, the support body actuator 520 may move the upper photographing unit 310 to a non-photographing position.

The support actuator 520 may include a ball screw motor, and may move the support 510 in a horizontal direction by a driving force of the ball screw motor. Also, the upper photographing unit 310 may be selectively moved to a photographing position by the support actuator 520, or the UV irradiation unit 400 may be selectively moved to an irradiation position by the support actuator 520. In addition, since the support body actuator 520 can selectively move the upper capture unit 310 to the recording position or move the UV irradiation unit 400 to the irradiation position, the upper capture unit 310 and the UV irradiation unit 400 It is possible to operate in a state of being disposed at predetermined positions on the upper side of the mold 10 and the substrate 20 without mutual interference.

The following is a description of the control unit 600.

The controller 600 may control operations of the first compression unit 100 , the second compression unit 200 , the photographing unit 300 , the UV irradiation unit 400 , and the driving unit 500 .

The controller 600 may control one of the first compression unit 100 and the second compression unit 200 to move toward the other one. In other words, the controller 600 may control driving of one of the first compression unit 100 and the second compression unit 200 to bring the mold 10 and the substrate 20 closer to each other. For example, the control unit 600 may control the lifting unit 230 of the second compression unit 200 to move the substrate 20 up and down.

The controller 600 may control the photographing unit 300 to recognize the align mark 11 and the align key 21 . In other words, the controller 600 may control one or more of the upper capture unit 310 and the lower capture unit 320 to recognize the alignment mark 11 and the align key 21 . For example, when light passes between the alignment mark 11 and the align key 21, the controller 600 determines that the upper capture unit 310 or the lower capture unit 320 is the alignment mark 11 and the align key 21 may be recognized to control the first compression unit 100 and the second compression unit 200 . As another example, when light does not pass between the alignment mark 11 and the align key 21, the upper capture unit 310 recognizes the alignment mark 11 and the lower capture unit 320 By recognizing the in key 21 , the first compression unit 100 and the second compression unit 200 may be controlled.

The control unit 600 may control the position adjusting unit 220 to adjust the horizontal position of the substrate mounting unit 210 . In addition, the control unit 600 may control one or more of the first adjustment unit 221 , the second adjustment unit 222 , and the third adjustment unit 223 to adjust the horizontal position of the substrate 20 .

The control unit 600 may control the driving unit 500 so that the UV irradiation unit 400 is located at the irradiation position to irradiate the resin with UV, and the control unit 600 moves the photographing unit 300 to a non-photographing position. It is possible to control the driving unit 500 so as to be. In addition, the control unit 600 determines that the upper capturing unit 310 is positioned at the capturing position and the UV irradiation unit 400 is not irradiated so that the capturing unit 300 recognizes the align mark 11 and the align key 21. The driving unit 500 may be controlled to move to the position.

Meanwhile, the control unit 600 controls the photographing unit 300 to continuously recognize the alignment mark 11 and the alignment key 21 when the mold 10 is horizontally moved by the position adjusting unit 220. can For example, the upper photographing unit 310 may be fixed to the upper side of the mold 10 and continuously recognize the alignment mark 11 when the substrate seating unit 210 is horizontally moved. As another example, the lower photographing unit 320 may continuously recognize the align key 21 as it is fixed to the lower side of the substrate seating unit 210 and moves horizontally like the substrate seating unit 210 . As such, while the alignment mark 11 and the alignment key 21 are continuously recognized, the control unit 600 controls the position adjustment unit 220 to move the alignment mark 11 and the alignment key 21 to their correct positions. can move quickly.

The control unit 600 recognizes the alignment mark 11 and the alignment key 21 so that the photographing unit 300 recognizes the alignment mark 11 and the alignment key 21 when the substrate 20 is elevated by a predetermined distance by the elevation unit 230, and the position adjusting unit 220 The elevating unit 230 , the photographing unit 300 , and the position adjusting unit 220 may be controlled to adjust the horizontal position of the substrate seating unit 210 . In addition, the control unit 600 recognizes the alignment mark 11 and the alignment key 21 again so that the photographing unit 300 recognizes the alignment mark 11 and the alignment key 21 when the board 20 is raised by the elevation unit 230 more than a predetermined distance. , The position adjusting unit 220 may control the position adjusting unit 220 , the elevation unit 230 , and the photographing unit 300 so as to re-adjust the horizontal position of the substrate mounting unit 210 .

The control unit 600 may control the position adjusting unit 220 to re-adjust the horizontal position of the substrate mounting unit 210 when the bellows 240 are in a contact state. In addition, the control unit 600 is positioned so as to adjust the horizontal position of the substrate seating unit 210 within a smaller movement range when the bellows 240 is in a contact state than when the horizontal position of the substrate seating unit 210 is primarily adjusted. The adjustment unit 220 may be controlled. In other words, when the bellows 240 is in a contact state, the control unit 600 may control the position adjusting unit 220 so that the substrate seating unit 210 moves within a fine movement range. In addition, when the bellows 240 is in a contact state, the range in which the substrate seating portion 210 can move is less than or equal to the predetermined gap of the accommodating groove 263b, so that the range of fine movement may be less than or equal to the predetermined gap of the accommodating groove 263b. . For example, the fine movement range may be 0.5 mm or less.

An effect of the control unit 600 to readjust the horizontal position of the substrate mounting unit 210 when the bellows 240 is in contact with it will be described. Even if the mold 10 and the substrate 20 are placed in the right position by adjusting the horizontal position of the substrate seating part 210 by the position adjusting unit 220, one end of the bellows 240 is in contact with the first compression unit 100. When doing so, the position of the substrate seating part 210 may be changed within a predetermined range.

As such, the control unit 600 has an effect of precisely adjusting the positions of the mold 10 and the substrate 20 by once again adjusting the horizontal position of the substrate seating part 210 when the bellows 240 are in contact with each other. there is.

When the mold 10 and the substrate 20 are compressed, the control unit 600 is positioned at the irradiation position so that the UV irradiation unit 400 irradiates UV to the resin, and the upper photographing unit 310 is not exposed. The driving unit 500 may be controlled to move to the photographing position. In addition, the controller 600 may control the UV irradiation unit 400 to irradiate UV to the resin in order to cure the resin of the substrate 20 .

Hereinafter, referring to FIG. 20 , the mold 10 on which the pattern and alignment marks 11 according to an embodiment of the present invention are formed is compressed with the substrate 20 on which the resin and the alignment key 21 are formed, thereby forming a pattern. A method (S10) of manufacturing a substrate will be described. Here, the 'pattern substrate' is defined as the substrate 20 on which the pattern of the mold 10 is transferred to the resin of the substrate 20 .

The method of manufacturing a pattern substrate ( S10 ) may produce a substrate 20 on which a pattern is transferred. In addition, in the method of manufacturing the pattern substrate (S10), the pattern is transferred to the resin by pressing the mold 10 on which the pattern and alignment marks 11 are formed with the substrate 20 on which the resin and the alignment key 21 are formed. can

The method of manufacturing the pattern substrate (S10) includes a clamp 112 fixing step (S100), a moving step (S200), a lifting step (S300), a photographing step (S400), a first position adjustment step (S500), a sealing step ( S600), a second position adjustment step (S700), a substrate pressing step (S800), a curing step (S900), a sealing release step (S1000), a lowering step (S1100), and a clamp releasing step (S1200).

In the clamp fixing step ( S100 ), the mold jig 111 may be fixed to the side of the first compression unit 100 through the clamp 112 . In addition, the mold jig 111 may be fixedly supported by the clamp 112 , and the mold 10 may be mounted on the mold jig 111 . Also, the clamp fixing step (S100) may be performed before the photographing step (S400).

In the moving step (S200), the mold 10 and the upper photographing unit 310 may be moved in a horizontal direction.

The moving step ( S200 ) may include a mold horizontally moving step ( S210 ) and a photographing unit moving step ( S220 ).

In the mold horizontal movement step ( S210 ), the center position of the mold supporter 110 for supporting the mold 10 may be moved in the horizontal direction. In other words, in the horizontally moving the mold ( S210 ), the mold 10 may be moved so that the mold 10 is disposed at a predetermined position above the substrate 20 by moving the mold supporter 110 in a horizontal direction. Also, the mold horizontally moving step (S210) may be performed before the photographing step (S400).

In the photographing unit moving step ( S220 ), the upper photographing unit 310 may be moved to a photographing position for recognizing the align mark 11 and the align key 21 . In addition, in the photographing unit moving step ( S220 ), the upper photographing unit 310 may be moved in a horizontal direction through the driving unit 500 . In addition, the photographing part moving step (S220) may be performed before the photographing step (S400), and may be performed simultaneously with or separately from the mold horizontally moving step (S210).

In the lifting step ( S300 ), the substrate 20 may be approached toward the first compression unit 100 by lifting the position adjusting unit 220 through the lifting unit 230 .

In the photographing step ( S400 ), the photographing unit 300 may photograph the alignment mark 11 formed on the mold 10 and the align key 21 formed on the substrate 20 . In addition, in the photographing step (S400), the photographing unit 300 may recognize the align mark 11 and the align key 21, and the controller 600 may use the image captured by the photographing unit 300. It may be determined whether the mold 10 and the substrate 20 are in the right position.

In the first position adjustment step ( S500 ), the position adjustment unit 220 may adjust the horizontal position of the substrate 20 . Also, in the first position adjustment step (S500), the control unit 600 adjusts the alignment mark 11 based on the positions of the alignment mark 11 and the alignment key 21 recognized in the photographing step (S400). The horizontal position of the substrate 20 may be adjusted so as to be located between the key 21 .

The photographing step (S400) and the first position adjustment step (S500) may be performed when the substrate 20 is elevated by a predetermined distance in the lifting step (S300). In addition, the photographing step (S400) and the first position adjustment step (S500) may be performed again when the substrate 20 is raised more than a predetermined distance by the lifting step (S300).

In the sealing step (S600), the space around the substrate 20 may be sealed against the outside through the bellows 240, and the gas remaining in the space around the substrate 20 may be removed through the second air discharge unit 250. can be discharged to the outside. In addition, in the sealing step (S600), the bellows 240 may be extended by the bellows moving unit 260 to provide a contact state in contact with the mold jig 111. In addition, the space around the UV transmission window 120 may be sealed against the outside through the sealing portion 130, and the gas remaining in the space around the UV transmission window 120 through the first air outlet 140 can be discharged to the outside. In addition, the sealing step (S600) may be performed after the first position adjustment step (S500) and before the second position adjustment step (S700).

In the second position adjustment step ( S700 ), after the sealing step ( S600 ), the position adjusting unit 220 may readjust the horizontal position of the substrate 20 . A horizontal movement distance by which the substrate 20 is moved by the second position adjustment step (S700) may be equal to or less than a predetermined gap between the shaft 261a and the receiving groove 263b surrounding the shaft 261a. In addition, the horizontal movement distance by which the substrate 20 is moved by the second position adjustment step ( S700 ) may be smaller than the horizontal movement distance by which the substrate 20 is moved by the first position adjustment step ( S500 ).

The second position adjustment step (S700) may be performed a plurality of times before the substrate pressing step (S800), and the photographing step (S400) may be performed each time the second position adjustment step (S700) is performed. In addition, as the position adjuster 220 adjusts the horizontal position of the substrate 20 in the second position adjustment step ( S700 ), the bellows 240 may be elastically deformed in a contact state.

In the substrate pressing step ( S800 ), the substrate 20 may be compressed with the mold 10 by raising the position adjusting unit 220 through the lifting unit 230 . At this time, the pattern formed on the mold 10 may be transferred to the resin formed on the substrate 20 .

In the curing step ( S900 ), the resin may be cured by the UV irradiator 400 irradiating UV to the resin of the substrate 20 .

The curing step (S900) may include a UV irradiation unit moving step (S910) and a UV irradiation step (S920).

In the step of moving the UV irradiation unit (S910), the UV irradiation unit 400 may be moved to an irradiation position for irradiating UV to the resin. Also, the step of moving the UV irradiator (S910) may be performed after the step of pressing the substrate (S800).

In the UV irradiation step (S920), the UV irradiation unit 400 may irradiate the resin with UV. As such, the resin may be cured by irradiating the resin with UV in the UV irradiation step (S920).

In the sealing releasing step ( S1000 ), gas may be introduced into the space around the substrate 20 and the space around the substrate 20 may be opened to the outside. In addition, the bellows 240 may be reduced by the sealing releasing step (S1000). In addition, gas may be introduced into the space around the UV transmission window 120 . Also, the sealing release step (S1000) may be performed after the substrate pressing step (S800).

In the lowering step (S1100), the lifting unit 230 may move the positioning unit 220 down, thereby separating the positioning unit 220 from the first compression unit 100.

In the clamp release step ( S1200 ), the clamp 112 may be released from the first compression unit 100 . At this time, the mold jig 111 is fixedly supported by the clamp 112, and the mold 10 may be mounted on the mold jig 111.

Meanwhile, in the lowering step ( S1100 ), the substrate 20 may or may not be separated from the mold 10 . For example, the substrate 20 may descend together with the position adjusting unit 220 to separate the substrate 20 from the mold 10 . As another example, the substrate 20 is left pressed with the mold 10, and the position adjusting unit 220 descends and separates the substrate 20 from the pattern alignable transfer device 1 to separate it from the mold 10. It can be transferred to the device and performed. At this time, the mold 10 and the substrate 20 pressed to the mold 10 may be mounted on the mold jig 111 in the clamp releasing step (S1200).

Meanwhile, the method (S10) of manufacturing a pattern substrate according to an embodiment of the present invention may be implemented in the form of a computer program that performs the same and stored in a computer readable recording medium. A computer-readable recording medium may include program instructions, data files, data structures, etc. alone or in combination. Program instructions recorded on a computer-readable recording medium may be specially designed and configured for the embodiment or may be known and usable to those skilled in computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks and magnetic tapes, optical media such as CD-ROMs and DVDs, and magnetic media such as floptical disks. - Includes hardware devices specially configured to store and execute program instructions, such as magneto-optical media and ROM, RAM, flash memory, etc.

For example, a computer program stored in a computer readable recording medium may be programmed to be executed including a storage step, a calculation step, and an output step.

In the storage step, image information of the align mark 11 and the align key 21 captured by the photographing unit 300 may be stored in a computer readable recording medium.

In the calculating step, positional information of the alignment mark 11 and the alignment key 21 may be calculated based on image information stored in a computer-readable recording medium. For example, the calculated location information may be an error value for the correct location between the alignment mark 11 and the alignment key 21 .

In the output step, an operation command for adjusting the position of the mold 10 or the substrate 20 may be output based on the calculated positional information. In addition, it may first be determined whether the mold 10 and the substrate 20 are located in the correct position based on the positional information calculated before the operation command is output, and based on the determined information, the mold 10 or the substrate Whether to output an operation command for adjusting the position of (20) can be determined. Here, it is possible to determine whether or not it is located in the correct position in various ways.

Meanwhile, in the calculation step, the align key 21 captured by the lower imager 320 with the position of the alignment mark 11 calculated from the image information of the align mark 11 captured by the upper imager 310 It is possible to calculate a path value along which the position of the align key 21 is moved, calculated from the image information of , and in the output step, the center position of the image information of the align key 21 captured by the lower photographing unit 320 An operation command for adjusting the position according to the calculated path value may be output. In other words, the lower photographing unit 320 is fixed to the lower side of the substrate seating unit 210 and is horizontally moved like the substrate seating unit 210, and the relative position of the central position of the image information and the unline mark 11 is the substrate seating unit. It does not change even with horizontal movement of (210). The central position of the image information of the alignment mark 11 may be the central position of the mold 10 shown in FIG. 2 . Also, the central position of the image information of the align key 21 may be the central position of the substrate 20 shown in FIG. 3 .

Although the embodiments of the present invention have been described as specific embodiments, this is merely an example, and the present invention is not limited thereto, and should be construed as having the widest scope according to the technical spirit disclosed herein. A person skilled in the art may implement a pattern of a shape not indicated by combining/substituting the disclosed embodiments, but this also does not deviate from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on this specification, and it is clear that such changes or modifications also fall within the scope of the present invention.

1: transfer device capable of pattern alignment 10: mold
11: alignment mark 11a: first alignment mark
11b: second alignment mark 20: substrate
21: align key 21a: first align key
21b: second align key 100: first compression unit
110: mold supporter 111: mold jig
111a: jig sealing member 112: clamp
112a: slide member 112b: clamp body
113: clamp mover 114: mover supporter
120: UV transmission window 130: sealing unit
140: first air discharge unit 150: sealing unit sealing member
200: second compression unit 210: board mounting unit
210a: photographing passage 210a-1: first passage
210a-2: second passage part 211: seating part body
211a: upper seating portion 211b: lower seating portion
213: shielding window 213a: first shielding window
213b: second shielding window 214: shielding member
214a: first shielding member 214b: second shielding member
220: position adjustment unit 221: first adjustment unit
222: second adjustment unit 223: third adjustment unit
230: lift part 240: bellows
241: bellows sealing member 250: second air discharge unit
260: bellows moving part 261: lifting cylinder
261a: shaft 261b: cylinder actuator
262: block 263: bellows connection
263a: seating groove 263b: receiving groove
280: shooting guidance unit 290: reflection unit
300: photographing unit 310: upper photographing unit
320: lower photographing unit 400: UV irradiation unit
500: driving unit 510: support
520: support body actuator 600: control unit

Claims (22)

A first compression unit supporting the mold on which the pattern and alignment marks are formed;
a second compression unit supporting a substrate on which resin and an align key are formed; and
A photographing unit recognizing the align mark and the align key;
The second compression unit,
A substrate seating portion having a support area for supporting the lower surface of the substrate and having an imaging passage extending in the vertical direction so that one end is disposed in the support area;
the filming unit,
And a lower photographing unit recognizing at least one of the align mark and the align key by photographing through the photographing passage of the substrate mounting unit,
The photographing unit is configured to adjust at least one of a horizontal position, a vertical position, and an angle so that the angle of view is directed toward a position where the align mark and the align key are formed.
A transfer device capable of pattern alignment. According to claim 1,
the filming unit,
When the lower photographing unit recognizes any one of the align key and the align mark, further comprising an upper photographing unit recognizing the other one,
A transfer device capable of pattern alignment. According to claim 1,
One of the first compression unit and the second compression unit moves toward the other one,
At least one of the first compression unit and the second compression unit,
Aligning the horizontal positions of the mold and the substrate by moving based on any one or more of the alignment mark and the alignment key recognized by the lower photographing unit,
Transferring the pattern to the resin by pressing the mold and the substrate aligned in horizontal positions to each other to press each other
A transfer device capable of pattern alignment. According to claim 1,
The lower shooting unit,
Having a first focal length for recognizing the align mark and a second focal length for recognizing the align key, the focal length being configured to be changed to the first focal length or the second focal length,
A transfer device capable of pattern alignment. According to claim 1,
The alignment mark includes a first alignment mark and a second alignment mark,
The align key includes a first align key corresponding to the first alignment mark and a second align key corresponding to the second alignment mark;
The lower shooting unit,
a first lower photographing unit for recognizing at least one of the first align mark and the first align key; and
Including a second lower photographing unit for recognizing one or more of the second align mark and the second align key,
A transfer device capable of pattern alignment. According to claim 1,
The second compression unit,
a recording guide unit having one side communicating with the recording passage and the other side opposite to the one side being connected to the lower capturing unit; and
Further comprising a reflector disposed between the photographing passage and the photographing induction unit,
The shooting guide unit is oriented in a direction different from the vertical direction,
The lower photographing unit recognizes the align key through the reflecting unit,
A transfer device capable of pattern alignment. According to claim 1,
The substrate seating part,
a seating unit body in which the photographing passage is formed;
a shielding window blocking the flow of gas in the photographing passage; and
Including a shielding member disposed between the shielding window and the seat body to block the flow of gas between the shield window and the seat body.
A transfer device capable of pattern alignment. According to claim 7,
The seating part body,
an upper seating portion having the support area; and
Including a lower seating portion supporting the upper seating portion,
The shooting passage,
A first passage part formed in the upper seating part and a second passage part formed in the lower seating part,
The one or more shielding windows,
a first shielding window disposed on the first passage to block gas from flowing into the first passage; and
A second shielding window spaced apart from the first shielding window and disposed on the second passage to block the flow of gas into the second passage;
The one or more shielding members,
a first shielding member positioned between the first shielding window and the upper seating portion; and
Including a second shielding member located between the second shielding window and the lower seating portion,
A transfer device capable of pattern alignment. According to claim 1,
a position adjusting unit for adjusting the horizontal position of the substrate receiving unit; and
Further comprising a lifting unit for lifting the position adjusting unit,
The lower photographing unit is moved together when the substrate mounting unit is moved by the position adjusting unit and the lifting unit,
A transfer device capable of pattern alignment. a first compression unit supporting the mold on which the pattern is formed; and
A second compression unit supporting the substrate on which the resin is formed,
The second compression unit,
a substrate mounting portion supporting the substrate;
a position adjusting unit for adjusting the horizontal position of the substrate receiving unit; and
A bellows, which when extended, has one end in contact with the first compression unit to seal the space around the substrate against the outside;
The second compression unit further includes a bellows moving part supported on an outer surface of the substrate seating part and connected to the bellows to extend and contract the bellows,
The position adjusting unit adjusts the horizontal position of the substrate receiving unit in a contact state in which the one end of the bellows is in contact with the first pressing unit,
A transfer device capable of pattern alignment. According to claim 10,
The bellows moving part,
an elevating cylinder including a shaft and a cylinder actuator providing a driving force for moving the shaft;
a block provided at an end of the shaft; and
A bellows connection portion supporting the block to allow movement of the block in a horizontal direction;
The bellows connection part is formed with a seating groove extending in a horizontal direction so that the block is seated and an accommodation groove extending vertically to communicate with the seating groove and surrounding the shaft with a predetermined gap,
When the horizontal position of the substrate receiving part is adjusted in the contact state, the shaft is moved in the horizontal direction in the receiving groove.
A transfer device capable of pattern alignment. According to claim 10,
The bellows,
Elastically deformed to allow adjustment of the horizontal position of the substrate receiving portion in the contact state,
A transfer device capable of pattern alignment. According to claim 10,
The first compression unit,
a mold jig supporting an edge of the mold and contacting one end of the bellows when the bellows are in the contact state;
a clamp supporting an edge of the mold jig and fixing the mold jig to the first compression unit; and
Further comprising a sealing part in which the lower part is in contact with the upper part of the mold jig,
The clamp,
A slide member supporting the mold jig from a lower portion,
The mold jig is inserted between the slide member and the sealing part and supported by the clamp.
A transfer device capable of pattern alignment. According to claim 10,
The first compression unit,
Further comprising a mold jig supporting an edge of the mold and contacting one end of the bellows when in the contact state,
The mold jig is provided with a jig sealing member,
A bellows sealing member is provided at one end of the bellows,
When in the contact state, the jig sealing member and the bellows sealing member contact each other to prevent gas from flowing between the mold jig and one end of the bellows,
The jig sealing member and the bellows sealing member have different shapes,
A transfer device capable of pattern alignment. According to claim 10,
The first compression unit,
a mold jig supporting an edge of the mold and contacting one end of the bellows when in the contact state;
a UV transmission window supporting the mold and through which UV is transmitted;
a sealing part protruding in a ring shape and having a lower part in contact with the mold jig to seal the periphery of the UV transmission window against the outside; and
When the sealing portion seals the space around the UV transmission window to the outside, including a first air discharge portion for discharging the gas remaining in the closed space inside the sealing portion to the outside,
A transfer device capable of pattern alignment. According to claim 15,
The second compression unit,
When the bellows seals the space around the substrate to the outside, a second air discharge unit for discharging the gas remaining in the closed space inside the bellows to the outside;
The first air outlet and the second air outlet operate to prevent the difference between the gas pressure inside the sealing portion and the gas pressure inside the bellows from deviating from a predetermined range.
A transfer device capable of pattern alignment. According to claim 9 or 10,
The pattern alignable transfer device,
Further comprising a control unit for controlling the operation of the first squeezing unit, the second squeezing unit and the position adjusting unit,
A transfer device capable of pattern alignment. A method for manufacturing a pattern substrate by pressing a substrate on which resin and alignment keys are formed with a mold on which patterns and alignment marks are formed,
an elevation step in which the elevation unit raises the position adjusting unit;
a photographing step in which a photographing unit photographs the alignment mark formed on the mold and the align key formed on the substrate;
A first positioning step of adjusting the horizontal position of the substrate by a positioning unit;
a sealing step in which a bellows seals the space around the substrate against the outside and discharges gas remaining in the space around the substrate to the outside;
a second positioning step of readjusting the horizontal position of the substrate by the positioning unit after the sealing step; and
A substrate pressing step of pressing the substrate to the mold,
In the lifting step, the photographing step, and the first position adjusting step, when the substrate is raised by a predetermined distance by the lifting step, the photographing step and the first position adjusting step are performed, and the lifting step When the substrate is raised more than a predetermined distance, the photographing step and the first position adjusting step are performed a plurality of times so that they are performed again.
A method of manufacturing a patterned substrate. According to claim 18,
At least one of the first position adjustment step and the second position adjustment step is performed a plurality of times before the substrate pressing step,
The photographing step is performed each time the first position adjustment step and the second position adjustment step are performed,
A method of manufacturing a patterned substrate. delete According to claim 18,
The horizontal movement distance by which the substrate is moved by the second positioning step is smaller than the horizontal movement distance by which the substrate is moved by the first positioning step,
A method of manufacturing a patterned substrate. A computer readable recording medium storing a computer program for performing a method of manufacturing a pattern substrate by pressing a mold on which patterns and alignment marks are formed with a substrate on which resin and align keys are formed, the computer program comprising:
a storage step of storing image information of the align key photographed by the lower photographing unit and the align mark photographed by the upper photographing unit in the computer readable recording medium;
a calculation step of calculating location information of the alignment mark and the alignment key based on the image information stored in the computer-readable recording medium; and
An output step of outputting an operation command for adjusting the position of the mold or the substrate based on the calculated positional information,
The calculating step obtains a path value along which the calculated position of the align key moves to the calculated position of the align mark;
The outputting step further outputs an operation command for adjusting the center position of the image information of the align key according to the obtained path value,
According to the operation command for adjusting the position of the mold or the substrate based on the calculated location information, the lower photographing unit can move horizontally together with the substrate seating unit,
Adjustable so that the center position of the image information of the align key and the relative position of the align mark are maintained according to the operation command for adjusting the center position of the image information of the align key according to the obtained path value. ,
A computer program stored on a computer-readable recording medium.

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