JP2011051328A - Pressurizing equipment and pressurizing process and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressurizing technique capable of controlling mutual clearance of pressurized objects more accurately. <P>SOLUTION: A pressurizing equipment 1 is equipped with a stage 12, a head 22, a range finding sensor 33 and a piezoactuator 31, etc. The stage 12 and the head 22 are relatively movable in Z direction while countering separated in Z direction. Both objects to be pressurized 91 and 92 are set intervening between a pressurizing surface of stage 12 and a pressurizing surface of head 22. Both the objects to be pressurized 91 and 92 are arranged interposing a layer of flowable substance (thermosetting resin, etc.) in between. A mutual distance in Z direction of both the objects 91 and 92 is measured in a plurality of positions (e.g. three positions) within the plane parallel to XY plane by the range finding sensor 33, etc. Additionally, the pressurizing surface of stage 12 and the pressurizing surface of head 22 are moved relatively based on those measured results to that the mutual distances in the plurality of positions may respectively approach their target values. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a pressurizing apparatus that pressurizes an object to be pressurized and a technique related thereto.

  There is a technique in which two objects to be pressed are brought into contact and pressurized.

  For example, Patent Document 1 describes a nanoimprint technique (fine transfer technique) in which a mold (original plate) and a base material are pressed while being kept parallel to transfer a concavo-convex pattern of the mold onto a resin layer on the base material. Yes.

  In the above Patent Document 1, by measuring the pressure acting between the two holding tools that hold the two objects to be pressed (mold and substrate) facing each other using three pressure detection elements, It is described that the inclination between the two holding tools is detected and the inclination is corrected. This technique corrects the relative inclinations of the two holding tools so that the pressure measurement values of the three pressure detection elements at different positions are equal. According to such a technique, it is possible to arrange two holding tools (as a result, two objects to be pressed) in parallel.

JP 2006-116602 A

  If the technique described in Patent Document 1 is used as described above, it is possible to keep both objects to be pressed in parallel. However, even if the technique described in Patent Document 1 is used, the distance between the two holding tools (also referred to as pressure members), and the distance between the two objects to be pressed, can be accurately determined. It is not easy to control.

  For example, in the case where these objects to be pressed are pressed with a fluid resin layer (such as a photocurable resin layer) sandwiched between two objects to be pressed (mold and substrate), It is desired to keep both the objects to be pressed in parallel and to control the distance between the objects to be pressed (in short, the gap) to an appropriate value.

  However, even if the technique described in Patent Document 1 is used in such a case, the resin layer sandwiched between the two objects to be pressed (although it is possible to keep both objects to be pressed in parallel). Since it has fluidity, it is not easy to control the distance between the two objects to be pressed to an appropriate value.

  Such circumstances exist not only in the nanoimprint technology but also in other joining technologies.

  Then, the subject of this invention is providing the pressurization technique which can control more accurately the separation distance between two to-be-pressurized objects.

  In order to solve the above-mentioned problem, the invention of claim 1 is a pressurizing device, wherein the first and second pressurizing members are opposed to each other in a predetermined direction and are relatively movable in the predetermined direction, and A first and a second pressurized object interposed between a pressure surface of the first pressure member and a pressure surface of the second pressure member, and a flowable substance layer sandwiched between them Measuring means for measuring the mutual distance in the predetermined direction of the first and second objects to be pressed arranged at a plurality of positions in a plane having the predetermined direction as a normal direction; and the measuring means Based on the measurement result by the above, the pressure surface of the first pressure member and the pressure surface of the second pressure member are relative to each other so that the mutual distances at the plurality of positions approach the target values, respectively. Drive means for moving to the position.

  According to a second aspect of the present invention, in the pressurizing apparatus according to the first aspect of the invention, the plurality of positions include three positions on a non-collinear line in the plane.

  According to a third aspect of the present invention, in the pressurizing apparatus according to the first or second aspect of the present invention, the driving means includes three piezo actuators that extend and contract in the predetermined direction independently of each other, and the three piezo actuators. The actuators are arranged at different positions on a non-collinear line in the plane.

  According to a fourth aspect of the present invention, in the pressure device according to any one of the first to third aspects of the invention, the measuring means includes the first position and the second pressure in the first pressure member. A distance measuring sensor for measuring a distance in a predetermined direction from a second position of the member; a measured value by the distance measuring sensor; a thickness of the first object to be pressed in the predetermined direction; The mutual distance is measured based on the thickness of the object to be pressed in the predetermined direction.

  According to a fifth aspect of the present invention, in the pressure device according to the fourth aspect of the present invention, the measurement means includes a measurement value by the distance measuring sensor, the first position, and a pressure surface of the first pressure member. Displacement in the predetermined direction, displacement in the predetermined direction between the second position and the pressure surface of the second pressure member, the thickness of the first object to be pressed in the predetermined direction, The mutual distance is measured based on the thickness of the second object to be pressed in the predetermined direction.

  According to a sixth aspect of the present invention, in the pressure device according to the fourth or fifth aspect of the present invention, the thickness of the first object to be pressed in the predetermined direction and the predetermined direction of the second object to be pressed. A storage unit that stores data obtained by measuring the thickness of the storage unit in advance, and the measurement unit measures the mutual distance based on the data stored in the storage unit.

  According to a seventh aspect of the present invention, in the pressurizing apparatus according to any one of the first to third aspects, at least one of the first pressurized object and the second pressurized object is light-transmitting. The first object to be pressed has a first reflecting surface on the first facing surface facing the second object to be pressed, and the second object to be pressed. Has a second reflecting surface on a second facing surface facing the first object to be pressed, and the measuring means is transmitted through the translucent member and reflected by the first reflecting surface. A first distance, which is a distance in the predetermined direction from a reference position to the first reflecting surface, using light that passes through the translucent member and then returns, and then transmits the translucent member. Is transmitted from the reference position to the second reflecting surface using light that passes through the translucent member and returns after being reflected by the second reflecting surface. Wherein the second distance is a distance in a predetermined direction is measured, based on a difference between the second distance and the first distance, and obtains the mutual distance of.

  According to an eighth aspect of the present invention, in the pressurizing apparatus according to the seventh aspect of the present invention, the measuring means includes a distance measuring sensor movable in a direction parallel to the plane, and the distance measuring sensor is located on the plane. The first distance and the second distance are measured at each of the plurality of positions by moving in parallel directions.

  A ninth aspect of the present invention is the pressurizing apparatus according to any one of the first to seventh aspects of the present invention, wherein the measuring means has three distance measuring sensors, and the three distance measuring sensors are used. The mutual distances are respectively measured at different positions on a non-collinear line in the plane.

  A tenth aspect of the present invention is the pressurizing apparatus according to any one of the first to ninth aspects, wherein the flowable substance layer is a resin material of any one of a thermosetting resin material and a photocurable resin material. The pressurizing device is a curing means for curing the resin material having fluidity in a state where errors with respect to the target value of the mutual distance are within an allowable range, respectively. Are further provided.

  The invention according to claim 11 is the pressurizing apparatus according to any one of the first to sixth aspects, wherein the flowable substance layer is a metal bump layer, and the pressurizing apparatus The apparatus further includes a curing unit that cools and cures the metal bump layer that has been thermally melted in a state where an error with respect to the target value is within an allowable range.

  The invention of claim 12 is the pressurizing apparatus according to any one of claims 1 to 6, wherein each of the first and second objects to be pressurized is a substrate, and the measuring means is Measuring a distance between the first object to be pressed and the second object to be pressed arranged in a predetermined direction with a resin material between them at a plurality of positions in the plane. It is characterized by.

  The invention of claim 13 is the pressurizing apparatus according to any one of claims 1 to 6, wherein one of the first and second objects to be pressed is a substrate and the other is a chip. The measuring means is configured to calculate a distance between the first object to be pressed and the second object to be pressed, which are arranged with a metal bump layer interposed therebetween, in the predetermined direction. It measures in the position of this.

  The invention of claim 14 is the pressurizing apparatus according to any one of claims 1 to 9, wherein one of the first and second objects to be pressed is a mold and the other is a substrate. The measuring means has the predetermined direction of the first object to be pressed and the second object to be pressed which are disposed with either one of a photocurable resin material and a thermosetting resin material interposed therebetween. The distance between each other is measured at a plurality of positions in the plane.

  According to a fifteenth aspect of the present invention, in the pressurizing apparatus according to any one of the first to fourteenth aspects, the first pressure object and the second pressure object act between each other. Detecting means for detecting force, wherein the driving means has a predetermined value detected by the detecting means during a pressurization period of the first object to be pressed and the second object to be pressed. The pressure surface of the first pressure member and the pressure surface of the second pressure member are relatively moved so as to approach the value.

  According to a sixteenth aspect of the present invention, in the pressurizing apparatus according to any one of the first to fifteenth aspects, the target value related to the mutual distance is the first pressed object and the second pressed object. It is characterized in that it is set to a value that changes with time during the pressurizing period with the pressurized object.

  According to a seventeenth aspect of the present invention, in the pressurizing apparatus according to the sixteenth aspect of the present invention, the target value is determined based on a variation in the thickness of the flowable substance layer during the pressurization period. Features.

  The invention according to claim 18 is a pressurizing method, and a) first and second pressed members interposed between first and second pressurizing members which are spaced apart and face each other in a predetermined direction. The distance between the first and second objects to be pressed, which are arranged with a flowable substance layer sandwiched between them, in the predetermined direction is determined in a plane having the normal direction as the predetermined direction. A step of measuring at a plurality of positions, and b) a pressure surface of the first pressure member such that the mutual distances at the plurality of positions approach a target value based on the measurement result of step a). And a step of relatively moving the pressure surface of the second pressure member.

  A nineteenth aspect of the invention is a device produced using the pressurizing method according to the eighteenth aspect of the invention.

  A twentieth aspect of the invention is a pressurizing apparatus, which is held by the first holding member and the first and second holding members which are opposed to each other in a predetermined direction and are relatively movable in the predetermined direction. The mutual distance in the predetermined direction between the first object to be pressurized and the second object to be pressed held by the second holding member is within a plane in which the predetermined direction is a normal direction. Based on the measurement means for measuring at a plurality of positions, and the measurement results of the measurement means, the pressure surface of the first pressure member and the pressure surface of the first pressure member so that the mutual distances at the plurality of positions approach the target values, respectively. Drive means for relatively moving the pressure surface of the second pressure member.

  According to the invention described in claims 1 to 20, it is possible to more accurately control the distance between the objects to be pressed.

  In particular, according to the sixth aspect of the present invention, it is possible to more accurately determine the distance between each other by using individual measurement data relating to the thickness of each object to be pressed.

  In particular, according to the invention described in claim 7, it is possible to directly determine the distance between the objects to be pressed.

  In particular, according to the invention of claim 15, the first value is set so that the detection value relating to the force acting between the first object to be pressed and the second object to be pressed approaches a predetermined value. Since the pressure surface of the pressure member and the pressure surface of the second pressure member are relatively moved, it is possible to prevent an excessive force from acting on the object to be pressed.

  In particular, according to the sixteenth aspect of the invention, the target value for the mutual distance is set to a value that changes with time during the pressurization period of the first pressurization object and the second pressurization object. Therefore, it is possible to control the mutual distance more appropriately.

It is a longitudinal cross-sectional view which shows the pressurization apparatus which concerns on 1st Embodiment. It is a perspective view which shows the outline | summary of a stage and head vicinity. It is a top view which shows the head vicinity. It is a functional block diagram of a controller. It is a figure which shows an example of the data table in a data storage part. It is a figure which shows the state which alignment operation completed. It is a figure which expands further and shows both the to-be-pressurized object vicinity in FIG. It is a figure which shows a non-parallel separation state. It is a figure which shows a parallel separation state. It is a figure which shows the state which the resin layer and the upper to-be-joined object are contacting. It is a figure which shows the parallel arrangement | positioning state by which the mutual distance was adjusted. It is a figure which shows a modification. It is a figure which shows the to-be-pressurized object etc. in 2nd Embodiment. It is a figure which shows another modification. It is a longitudinal cross-sectional view which shows the pressurization apparatus which concerns on 3rd Embodiment. It is a figure which shows a non-parallel separation state. It is a figure which shows a parallel separation state. It is a figure which shows the state which the resin layer and the mold are contacting. It is a figure which shows the parallel arrangement | positioning state by which the mutual distance was adjusted. It is a figure which shows a UV irradiation state. It is a figure which shows the state which the photocurable resin hardened | cured. It is a figure which shows the stage vicinity of the pressurization apparatus which concerns on 4th Embodiment. It is a figure which shows the state after adjustment of the Z position and attitude | position of a head. It is the top view which looked at the stage vicinity from the lower side. It is a figure which shows the stage vicinity of the pressurization apparatus which concerns on 5th Embodiment. It is the top view which looked at the stage vicinity from the lower side. It is a figure which shows the stage vicinity of the pressurization apparatus which concerns on a modification. It is a figure which shows the stage vicinity of the pressurization apparatus which concerns on a modification. It is a top view which shows the head vicinity. It is a figure which shows the mode of both the to-be-pressurized objects in the start time of a hardening period. It is a figure which shows the mode of both the to-be-pressurized objects in the end time of a hardening period. It is a figure which shows an example of the time-dependent change curve (measurement result) of the thickness of a resin layer. It is a figure which shows an example of a target value curve.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1. First Embodiment>
<1-1. Device>
FIG. 1 is a longitudinal sectional view showing a pressure device 1 (also referred to as 1A) according to a first embodiment of the present invention. In the following, in each figure, directions and the like are shown using an XYZ orthogonal coordinate system for convenience.

  The pressurizing device 1 is a device that pressurizes an object to be pressurized 91 and an object to be pressurized 92 facing each other in a chamber (vacuum chamber) 2 under reduced pressure, and joins the objects to be pressurized 91 and 92 together. It is. Therefore, the pressurizing device 1 is also expressed as a joining device.

  The pressurizing apparatus 1 includes a vacuum chamber 2 that is a processing space for the objects to be pressed 91 and 92. The vacuum chamber 2 is connected to a vacuum pump 5 via an exhaust pipe 6 and an exhaust valve 7. The vacuum chamber 2 is put into a vacuum state by reducing (reducing pressure) the pressure in the vacuum chamber 2 in accordance with the suction operation of the vacuum pump 5. Further, the exhaust valve 7 can adjust the degree of vacuum in the vacuum chamber 2 by the opening / closing operation and the exhaust flow rate adjusting operation.

  Here, a semiconductor wafer (substrate) is used as the objects to be pressurized 91 and 92. In addition, both the pressed objects 91 and 92 are pressed in a state in which a resin layer 93 having fluidity is sandwiched between the pressed objects 91 and 92. Specifically, it is assumed that the object to be pressed 91, the resin layer 93, and the object to be pressed 92 are pressed in a state where they are stacked in this order. The resin layer 93 is composed of a substance (also referred to as “flowable substance” in this application) having fluidity (flowable state) in a part of the pressurization period (particularly before heating described later). As a material of the resin layer 93, for example, a thermosetting resin material or the like is used. The resin layer 93 is also referred to as a “flowable substance layer”. The objects to be pressed 91 and 92 are also referred to as objects to be bonded through a resin layer, and the pressure treatment (pressure method) in the apparatus 1 is also referred to as a bonding process (bonding method). Is done.

  Further, both the objects to be pressurized 91 and 92 are interposed between the pressure surface 22f of the head 22 (pressure member) and the pressure surface 12d of the stage 12 (pressure member). Specifically, the upper object 92 is held by the head 22 (more specifically, an electrostatic chuck or a mechanical chuck provided at the tip of the head 22). Similarly, the lower object to be pressed 91 is held by the stage 12 (more specifically, an electrostatic chuck or a mechanical chuck provided at the tip thereof).

  Both the head 22 and the stage 12 are installed in the vacuum chamber 2. The head 22 is heated by a heater 22 h built in the head 22, and the temperature of the pressurized object 92 held by the head 22 can be adjusted. Similarly, the stage 12 is heated by a heater 12 h built in the stage 12, and the temperature of the pressurized object 91 on the stage 12 can be adjusted. The heaters 12h and 22h also function as curing means (thermosetting means) for curing the resin material (specifically, thermosetting resin material) of the resin layer 93.

  The head 22 is moved (translationally moved) in the X direction and the Y direction by the alignment table 23, and is rotated in the θ direction (rotation direction about the Z axis) by the rotation drive mechanism 25. The head 22 is driven by the alignment table 23 and the rotation drive mechanism 25 based on a position detection result by a position recognition unit 28 described later, and alignment operations in the X direction, the Y direction, and the θ direction are executed.

  The head 22 is moved (lifted / lowered) in the Z direction by the Z-axis lifting / lowering drive mechanism 26. The Z-axis raising / lowering drive mechanism 26 cooperates with a plurality (three in this case) of piezoelectric actuators 31 (31a, 31b, 31c), and a plurality of pressure detection sensors (load cells, etc.) 29, 32 (32a, 32b, 32c). ) Can be controlled based on the signal detected by (1).

  Further, the pressurizing apparatus 1 includes a position recognition unit 28 that recognizes the positions (specifically, X, Y, θ) of the objects to be pressed 91, 92.

  As illustrated in FIG. 1, the position recognition unit 28 includes imaging units (cameras) 28 c and 28 d that acquire a light image related to an object to be pressed as image data. The imaging units 28c and 28d each have a coaxial illumination system. In addition, a position identification pattern mark (hereinafter also simply referred to as a pattern or a mark) is attached to each of the objects to be pressed 91 and 92. For example, two position identification marks are provided on one pressurized object 91, and two position identification marks are provided on the other pressurized object 92. Each mark preferably has a specific shape.

  In the positioning operation (alignment operation) of the objects to be pressed 91 and 92, the position recognition unit (camera or the like) 28 recognizes the positions of the two sets of marks attached to the objects to be pressed 91 and 92. Is executed by.

  As shown in FIG. 1, the position recognizing unit 28 relates to transmitted light and reflected light of illumination light emitted from the respective coaxial illumination systems of the imaging units 28 c and 28 d in a state where the objects to be pressed 91 and 92 face each other. The positions of the objects to be pressed 91 and 92 are recognized using the image data. Note that light (for example, infrared light) transmitted through both the objects to be pressed 91 and 92 and the stage 12 is used as a light source of each coaxial illumination system of the imaging units 28c and 28d.

  Specifically, the light emitted from the light source (not shown) of the coaxial illumination system in the camera 28M is reflected by the mirror 28e, changes its traveling direction, and travels upward. When the light further passes through the window 2b (FIG. 1) and part (or all) of the objects to be pressed 91 and 92 and then is reflected by the marks of the objects to be pressed 91 and 92, This time it proceeds in the opposite direction (downward). Then, the light again passes through the window 2b and is reflected by the mirror 28e, and its traveling direction is changed to the left, and reaches the imaging unit 28c of the camera 28M. In this way, the position recognizing unit 28 acquires the optical images (images including the respective marks) related to the objects to be pressed 91 and 92 as image data, and applies the pressure to the objects to be pressed 91 and 92 based on the image data. The position of a given set of marks is recognized, and the amount of positional deviation between the set of marks is obtained.

  Similarly, the light emitted from the light source (not shown) of the coaxial illumination system in the camera 28N is reflected by the mirror 28f, changes its traveling direction, and travels upward. When the light further passes through part or all of the window portion 2b (FIG. 1) and the objects to be pressed 91 and 92 and then is reflected by the marks of the objects to be pressed 91 and 92, this time, Proceeds backward (downward). Then, the light is again transmitted through the window portion 2b and reflected by the mirror 28f, and the traveling direction thereof is changed to the right, and reaches the imaging unit 28d of the camera 28N. In this way, the position recognizing unit 28 acquires the optical images (images including the respective marks) related to the objects to be pressed 91 and 92 as image data, and applies the pressure to the objects to be pressed 91 and 92 based on the image data. While recognizing the position of another set of attached marks, the amount of positional deviation between the set of marks is obtained.

  Thereafter, the position recognizing unit 28 calculates the relative shift amounts of the pressed objects 91 and 92 in the X direction, the Y direction, and the θ direction based on the shift amounts of the two sets of marks. Then, the head 22 is driven in two translational directions (X direction and Y direction) and a rotational direction (θ direction) so that the relative shift amount recognized by the position recognition unit 28 is reduced. Thereby, both the to-be-pressurized objects 91 and 92 are relatively moved, and the above-described positional deviation amount is corrected.

  In this way, the alignment operation (with respect to the X direction, the Y direction, and the θ direction) is executed.

  Further, such a position recognition operation and an alignment driving operation are repeatedly executed. According to this, the drive error at the time of driving the head 22 is gradually reduced, and a more accurate alignment operation is executed.

  FIG. 2 is a schematic perspective view showing the vicinity of the stage 12 and the head 22. In FIG. 2, the stage 12, the head 22, and the like are shown in a schematic shape (substantially cylindrical shape) for simplification of illustration.

  As shown in FIG. 2, the pressurizing device 1 includes three piezo actuators 31 (31a, 31b, 31c), three pressure detection sensors 32 (32a, 32b, 32c), and three distance measuring sensors 33 (33a, 33b, 33c) and three reflectors 34 (34a, 34b, 34c).

  The three piezoelectric actuators 31a, 31b, and 31c and the three pressure detection sensors 32a, 32b, and 32c are provided between the head 22 and the alignment table 23. Specifically, as shown in the plan view of FIG. 3, the three piezo actuators 31a, 31b, and 31c are located at different positions (three positions on the non-collinear line) PE1, PE2, and PE3 on the upper surface of the head 22. It is fixed. More specifically, the three piezoelectric actuators 31a, 31b, and 31c are arranged at substantially equal intervals in the vicinity of the outer peripheral portion in the substantially circular upper surface of the substantially cylindrical head 22. The three pressure detection sensors 32a, 32b, and 32c connect the upper end surfaces of the corresponding piezoelectric actuators 31a, 31b, and 31c and the lower surface of the alignment table 23, respectively. In other words, the three pressure detection sensors 32a, 32b, and 32c are disposed at three independent positions (non-collinear positions) PE1, PE2, and P3 in a plane parallel to the pressure surface of the head 22. .

  The three piezo actuators 31a, 31b, and 31c can extend and contract in the Z direction independently of each other, and the posture of the head 22 (specifically, the posture angle around two axes (for example, around the X axis and around the Y axis)) and The position (specifically, the position in the Z direction) can be finely adjusted. Further, the three pressure detection sensors 32a, 32b, and 32c respectively apply pressures at three positions (positions on non-collinear lines) PE1, PE2, and P3 in a plane parallel to the lower surface (pressure surface) 22f of the head 22. Can be measured. By driving the three piezoelectric actuators 31a, 31b, and 31c so as to equalize the applied pressure at each position, the lower surface 22f (see FIG. 2) of the head 22 and the upper surface (pressure surface) 12f of the stage 12 are parallel. Can be maintained. However, in this embodiment, as will be described later, both the lower surface 22f of the head 22 and the upper surface 12f of the stage 12 are maintained in parallel using mainly measured values of the three distance measuring sensors 33a, 33b, and 33c. At the same time, the gap between the two is controlled to an appropriate value.

  The three distance measuring sensors 33a, 33b, and 33c are arranged at different positions P1, P2, and P3 on a non-collinear line in a plane parallel to the upper surface 12f of the stage 12 (a plane parallel to the XY plane). (See FIG. 3). More specifically, the three distance measuring sensors 33a, 33b, 33c are fixed at substantially equal intervals on the outer peripheral side surface of the substantially cylindrical stage 12 (see FIG. 2). In addition, on the outer peripheral side surface of the head 22, reflectors 34a, 34b, and 34c are provided at fixed positions corresponding to the distance measuring sensors 33a, 33b, and 33c, respectively.

  As each distance measuring sensor 33a, 33b, 33c, for example, a laser type distance measuring sensor is used. Each distance measuring sensor (laser type distance measuring sensor or the like) 33a, 33b, 33c fixed to the stage 12 measures the distance to the corresponding reflectors 34a, 34b, 34c, respectively. Specifically, each distance measuring sensor 33 emits laser light and uses the laser light (reflected light) reflected by the reflecting plate 34 to use the distance (position PZ1) from the distance measuring sensor 33 to the reflecting plate 34. And the distance PZ2) DM is measured (see FIG. 7). More specifically, the distance measuring sensors 33a, 33b, and 33c are respectively in the Z direction between the Z direction position PZ1 and the Z direction position PZ2 at positions P1, P2, and P3 in a plane parallel to the XY plane. The distance DM at (DM1, DM2, DM3) is measured. The Z direction position PZ1 is a position in the Z direction of the distance measuring sensor 33 fixed to the stage 12, and the Z direction position PZ2 is a position in the Z direction of the reflecting plate 34 fixed to the head 22 (FIG. 7).

  According to this, as will be described later, it is possible to measure the separation distance DA (see FIG. 7) in the Z direction between the two pressed objects 91 and 92. The pressurizing operation including such a measuring operation will be described in detail later. The three distance measuring sensors 33a, 33b, and 33c measure the Z direction distance DA (relative position) of the head 22 with respect to the stage 12 in order to measure the Z direction distance DA at the three positions P1, P2, and P3 as described above. ) And posture (relative posture) can be measured very accurately. In other words, it is possible to measure the relative position and the relative posture of both the workpieces 91 and 92 very accurately.

  The pressurizing device 1 further includes a controller 100. The controller 100 is a control unit that controls various operations such as an alignment operation and a pressurizing operation.

  FIG. 4 is a functional block diagram of the controller 100. As shown in FIG. 4, the controller 100 includes an alignment control unit 110, a pressure control unit 120, and a data storage unit 130.

  The alignment control unit 110 is a control unit that controls the above-described alignment operation. Specifically, the alignment control unit 110 controls an image acquisition operation by the imaging units 28c and 28d, a positional deviation amount calculation operation by the position recognition unit 28, a positional deviation correction operation by the alignment table 23, and the like.

  The pressurization control unit 120 is a control unit that controls a pressurization operation described later. The pressure control unit 120 includes a distance measurement (also simply referred to as “ranging”) control unit 121, a pressure detection control unit 122, and a drive control unit 123. The distance measurement control unit 121 controls the distance measurement operation (and thus the position and orientation detection operation) by the plurality of distance sensors 33, and the pressure detection control unit 122 performs the pressure detection operation (and thus the position and orientation detection) by the plurality of pressure sensors 32 and the like. Control). Further, the drive control unit 123 controls a position / orientation correction operation (including a pressurizing operation) by the Z-axis elevating drive mechanism 26 and the plurality of piezoelectric actuators 31.

  The data storage unit 130 is a storage unit that stores the thicknesses and the like of the objects to be pressed 91 and 92 measured in advance.

  FIG. 5 is a diagram illustrating an example of the data table TB in the data storage unit 130. As shown in FIG. 5, in the data table TB, the thicknesses of a plurality of sets of objects to be pressed 91 and 92 are stored together with the identification numbers (ID) of the objects to be pressed 91 and 92. Specifically, prior to the pressurizing operation, the thickness of the object to be pressed is measured in advance outside the pressurizing apparatus 1 and the measurement results are stored in the data table TB (FIG. 5). Reference) is stored. For example, the object to be pressed with the identification number “ID00001” corresponds to one object to be pressed 91 of the first set of both objects to be pressed (objects), and the object to be pressed with the identification number “ID00002”. The object corresponds to the other object to be pressed 92 in the first set of both objects to be pressed (objects). In addition, the object to be pressed having the identification number “ID00003” corresponds to one object to be pressed 91 of the two sets of objects to be pressed (objects), and the object to be pressed having the identification number “ID00004”. The object corresponds to the other object to be pressed 92 in the first set of both objects to be pressed (objects). In FIG. 5, the type information (“semiconductor wafer”) of each object to be pressed is also stored.

  As will be described later, when measuring (calculating) the separation distance between the two objects to be pressurized 91 and 92 interposed between the stage 12 and the head 22, it is stored in the data storage unit 130. Further, the thicknesses (measured values) of the objects to be pressed 91 and 92 are used.

<1-2. Pressurization action>
Next, the pressurizing operation regarding the two objects to be pressed 91 and 92 will be described. In this pressurizing operation, as described above, both the objects to be pressed 91 and 92 are pressed in a state where the resin layer 93 having fluidity is sandwiched between the objects to be pressed 91 and 92. The

  FIG. 6 is a view showing a state in the vicinity of the objects to be pressed 91 and 92 showing the state where the alignment operation as described above is completed, and FIG. 7 is a view in the vicinity of the objects to be pressed 91 and 92 in FIG. It is a figure expanding further.

  Here, it is assumed that a resin layer 93 is formed in advance on the upper surface of the object to be pressed 91, and the object to be pressed 92 is brought into contact with the resin layer 93 and pressed. However, in FIG. 6, both the objects to be pressed 91 and 92 (specifically, the resin layer 93 and the object to be pressed 92) are not yet in contact with each other and are arranged in a state spaced from each other in the Z direction. ing.

  In the state of FIG. 6 (and FIG. 7), it is assumed that the relative positions of the objects to be pressed 91 and 92 in the XY direction and the θ direction have a desired state by the alignment operation described above.

  7 shows an ideal state (completely parallel arrangement state) in which the head 22 and the stage 12 are arranged completely in parallel, but actually, as shown in FIG. In many cases, the stage 12 is displaced from the completely parallel arrangement state. FIG. 8 is a schematic diagram showing such a state (non-parallel arrangement state). In FIG. 8, the state in which the head 22 and the stage 12 are arranged in a state having a minute inclination angle is exaggerated. In FIG. 8 and the like, the head 22, the stage 12, and the like are shown in a schematic shape (such as a substantially rectangular shape).

  In the following, from the state of FIG. 8, the operation of controlling the distance DA (see FIG. 7) between the objects to be pressed 91 and 92 to a predetermined value while arranging the objects to be pressed 91 and 92 in parallel with each other. Will be described.

  First, in the state of FIG. 8, the distance measurement control unit 121 uses the three distance sensors 33a, 33b, and 33c to measure the distances DM (in detail, at three positions P1, P2, and P3 (see FIG. 3)). DMi (i = 1, 2, 3)) is measured (see FIG. 7).

  Next, the mutual distance DA between the objects to be pressed 91 and 92 is calculated based on the measurement distance DM and the equation (1).

  Here, as shown in FIG. 6, the value DE1 is the displacement (Z-direction distance) in the Z direction between the position PZ1 and the pressure surface 12f of the stage 12 (pressure member), and the value DE2 is the same as the position PZ2. It is the displacement (Z direction distance) in the Z direction with respect to the pressure surface 12f of the head 22 (pressure member). These values DE1 and DE2 are assumed to be known values measured in advance and are stored in the data storage unit 130.

  The value DT1 is the thickness in the Z direction of the object to be pressed 91, and the value DT2 is the thickness in the Z direction of the object to be pressed 92. The thicknesses DT1 and DT2 of both the objects to be pressed 91 and 92 are measured in advance and stored in the data storage unit 130 as described above.

  The distance measurement control unit 121 acquires data regarding the values DE1 and DE2 from the data storage unit 130, and based on the identification numbers, the data DT1 and DT2 regarding the thicknesses of the objects to be pressed 91 and 92 that are the objects of pressure processing. The data is acquired from the data storage unit 130 and the calculation process based on the above formula (1) is performed. As described above, by using the individual measurement data regarding the thicknesses of the workpieces 91 and 92 to be actually processed, compared to the case of using the theoretical value regarding the thicknesses of both the workpieces 91 and 92. Thus, the mutual separation DA can be obtained more accurately.

  Note that the separation distance DC between the pressure surface 22f of the head 22 and the pressure surface 12f of the stage 12 is expressed by the equation (2) using the above values DE1 and DE2.

  That is, using the above values DE1 and DE2, measuring the distance DM is equivalent to measuring the distance DC. In other words, the distance measurement sensor 33 measuring the distance DM is equivalent to the distance measurement sensor 33 measuring the distance DC.

  Then, considering this equation (2), the above equation (1) is also expressed as equation (3).

  That is, the distance DA between the two pressed objects 91 and 92 at the position Pi is calculated using the value DC and the values DT1 and DT2.

  By using the formula (1) or the formula (3), the value DA is calculated based on the distance measurement value DM (or DC) and the thicknesses DT1 and DT2 of the two pressures 91 and 92. Is done. In short, the distance measuring sensor 33 can measure the distance DA by measuring the distance DM (or DC).

  More specifically, the mutual distance DAi at the three positions Pi is calculated by performing the above calculation processing on the measurement distance DMi at the three positions Pi. Specifically, the distance measurement control unit 121 can measure the mutual distance DAi at the three positions Pi based on the measurement distance DMi, the values DT1, DT2, and the values DE1, DE2.

  Here, if each value DAi is completely the same value, the objects to be pressed 91 and 92 are completely parallel, but actually both objects to be pressed 91 and 92 are shown in FIG. In many cases, they are arranged to be inclined with respect to each other. At this time, the values DAi are not the same but are different from each other.

  In this embodiment, first, the three piezo actuators 31a, 31b, and 31c are driven so that these values DAi are equal to each other (see FIG. 8). Specifically, each piezo actuator 31a, 31b, 31c is driven so that each value DAi is equal to the first target value TF (positive number). Here, the target value TF is set to a value larger than a second target value TG, which will be described later, so that the pressurized object 92 and the resin layer 93 are not yet in contact at this point. Further, the driving amount of each of the three piezoelectric actuators 31a, 31b, and 31c may be calculated based on a geometric relationship or the like. In order to effectively use the driving ranges of the piezo actuators 31a, 31b, and 31c (in order to prevent the piezo actuator from extending), for example, an average value of three values DAi is determined as the first target value TF. It is preferable that

  According to such an operation, the head 22 and the stage 12 (specifically, the pressurizing surfaces 22f and 12f) are arranged in parallel to each other, and the opposing surfaces of the objects to be pressed 91 and 92 are also arranged in parallel to each other. (See FIG. 9). The mutual distance DA between the objects to be pressed 91 and 92 substantially coincides with the value TF.

  The desired parallelism may not be realized by one measurement operation and one drive operation. In such a case, the measurement operation and the drive operation as described above may be repeated until a desired parallelism is realized.

  Thereafter, the head 22 is lowered by a predetermined amount DD (= TF−TG) by driving the Z-axis lifting drive mechanism 26 (see FIG. 10). Here, the value TG is the final target value (second target value) of the inter-distance DA. As a result, as shown in FIG. 10, the resin layer 93 on the article to be pressurized 91 comes into contact with the surface of the article to be pressurized 92. It should be noted that the head 22 is moved to a position that is a minute amount ΔD lower (−Z side) than the position in the Z direction corresponding to the predetermined amount DD in order to ensure that the workpiece 92 and the fluid resin layer 93 are in close contact with each other. The head 22 may be raised by a minute amount ΔD after being lowered.

  At this time, as the head 22 is lowered, the head 22 and the stage 12 may deviate from the parallel arrangement state as shown in FIG.

  Therefore, here, the measurement operation by the three distance measuring sensors 33a, 33b, and 33c is performed again. This measurement operation is the same as the measurement operation described above, and the mutual distance DAi at the three positions Pi is measured based on the measurement distances DMi, the values DT1, DT2, and the values DE1, DE2, respectively.

  Further, the plurality of piezo actuators 31a, 31b, and 31c are set so that the distances DAi at the three positions Pi (i = 1, 2, 3) approach the final target value (second target value) TG, respectively. By performing expansion and contraction driving, the position and posture of the head 22 are finely adjusted.

  When such a measurement operation and a drive operation are executed once or a plurality of times, the error ΔEi (= TG−DAi) with respect to the target value TG of each mutual distance DAi is within an allowable range ( For example, -TH1 <ΔEi <TH2, where the values TH1 and TH2 are predetermined minute values) (see FIG. 11). That is, a desired parallelism and a desired gap DA are realized by repeating the measurement operation and the drive operation as necessary. As the target value TG, for example, a very small value such as 1 μm (micrometer) can be set.

  Thereafter, in a state where the error ΔEi with respect to the target value TG of each mutual distance DAi is within an allowable range (for example, −TH1 <ΔEi <TH2, where the values TH1 and TH2 are predetermined minute values). A resin material (resin layer 93) (having fluidity before heating) is heated and cured by the heaters 12h and 22h. In short, the resin layer 93 is heated and cured in a state where each distance DAi reaches the final target value (second target value) TG. As a result, the objects to be pressed 91 and 92 are joined together with the resin layer 93 having a desired film thickness DA formed between the objects to be pressed 91 and 92.

  Through these steps, various semiconductor devices are generated (manufactured).

  As described above, according to the pressurizing apparatus 1 according to this embodiment, the distance DA between the objects to be pressed 91 and 92 is a plurality of positions on a non-collinear line in a plane parallel to the XY plane. Measured at P1, P2, and P3. Then, based on the measurement result, the pressure surface 22f of the head 22 with respect to the pressure surface 12f of the stage 12 is set so that the mutual distance DAi at each of the plurality of positions P1, P2, P3 approaches the predetermined target value TG. Moved. Therefore, it is possible to accurately control the distance DA between the two pressed objects 91 and 92 while maintaining the two pressed objects 91 and 92 in parallel.

  In the above embodiment, there is a case where the resin layer (resin material) 93 is disposed across a relatively large area (specifically, the entire surface) in the gap between the semiconductor wafer 91 and the semiconductor wafer 92. Although illustrated, it is not limited to this.

  For example, as shown in FIG. 12, in order to perform vacuum sealing, in the gap between the semiconductor wafer 91 and the semiconductor wafer 92, a relatively narrow area (specifically, a boundary wall region surrounding the vacuum sealing region). The above concept can also be applied to the case where the resin material 94 is disposed between the portions).

<2. Second Embodiment>
In the first embodiment, the case where the resin layer having fluidity is sandwiched in the gap between the semiconductor wafer 91 and the semiconductor wafer 92 is illustrated, but the present invention is not limited to this.

  For example, it is possible to apply the above idea to a chip on wafer (COW) technology. Specifically, as shown in FIG. 13, when the chip (semiconductor chip) 95 is disposed on the semiconductor wafer 91 via the metal bump 96, the above idea may be applied. Such a mode will be described in the second embodiment. Hereinafter, the difference from the first embodiment will be mainly described.

  In the second embodiment, a chip 95 is employed instead of the semiconductor wafer 92 as the upper object to be pressed. In addition, as the flowable substance, metal bumps (solder bumps) 96 are employed instead of the resin layer 93 described above. In other words, the metal bump 96 layer is used as the flowable material layer. Here, it is assumed that solder is used as the material of the metal bump 96, but the present invention is not limited to this, and Au (gold), Cu (copper), Al (aluminum), or the like may be used.

  When the pressed objects of the semiconductor wafer 91 and the chip 95 are pressed with the metal bumps 96 (layers) sandwiched between the pressed objects, the metal bumps 96 are heated. Then, the metal bump 96 is melted by heat. For this reason, it is generally difficult to control the distance between the objects to be pressed (the thickness of the metal bump 96) to a predetermined value.

  In 2nd Embodiment, the case where the thought of this invention is applied in such a situation is illustrated. According to the following aspect, the thickness of the metal bump 96 layer can be controlled to a desired value while the semiconductor wafer 91 and the chip 95 are arranged in parallel.

  The pressurization apparatus 1 (also referred to as 1B) according to the second embodiment has the same configuration as the pressurization apparatus 1A according to the first embodiment and performs the same operation. In the second embodiment, the heaters 12h and 22h function as softening means for softening the metal bumps, and also function as hardening means for hardening the metal bumps. In the second embodiment, prior to the pressurizing operation, the thickness of the semiconductor wafer 91 and the thickness of the chip 95 to be subjected to the pressurizing process are measured in advance outside the pressurizing apparatus 1 and the measurement results are obtained. Is used to obtain the mutual distance DA. More specifically, for example, the thickness of the semiconductor wafer 91 and the thickness of the chip 95 are separately measured using a predetermined measuring device. Alternatively, a total value of the thickness of the semiconductor wafer 91, the thickness of the metal bump 96, and the thickness of the chip 95 is measured in a chip mounting machine for mounting the chip on the semiconductor wafer, and the thickness of the metal bump 96 is calculated from the total value. By subtracting, a total value of the thickness of the semiconductor wafer 91 and the thickness of the chip 95 may be calculated.

  First, a chip 95 having a metal bump (here, a solder bump) 96 attached to its lower surface is temporarily fixed with a flux on the semiconductor wafer 91 in a state where an alignment operation relating to the position (X, Y, θ) is performed. Shall.

  After that, as in FIG. 9, the mutual distance DCi between the head 22 and the stage 12 is equal to the first target value TL (= TF + DT1 + DT2) (see FIG. 7). 31c is driven. According to such an operation, the head 22 and the stage 12 (specifically, the pressurizing surfaces 22f and 12f) are arranged in parallel to each other, and the opposing surfaces of the pressurizing objects 91 and 95 are also arranged in parallel to each other. The The distance DC between the head 22 and the stage 12 substantially matches the value TL.

  Next, the solder is heated to a predetermined temperature using the heater 12h (and / or the heater 22h), and the solder is melted and softened.

  After that, the head 22 is lowered by a predetermined amount DD (= TF−TG) by driving the Z-axis elevating drive mechanism 26. As a result, both the objects to be pressurized 91 and 95 interposed between the stage 12 and the head 22 are pressurized by the stage 12 and the head 22.

  At this time, a plurality of piezo actuators are measured so that the distance DAi between the chip 95 and the semiconductor wafer 91 becomes a desired value TG while measuring the distance DMi at three different positions in the same manner as in the above embodiment. 31a, 31b, 31c and the like are driven. As a result, each distance DAi reaches the final target value (second target value) TG (see FIG. 13).

  Then, in a state where each distance DAi has reached the final target value (second target value) TG, the solder is cooled and the solder is hardened again. Specifically, in a state where the error ΔEi with respect to the target value TG of each distance DAi is within an allowable range, the metal bump layer that has been thermally melted is cooled by lowering the temperature of the heater 12h and the like. Harden. As a result, the chip 95 is fixed on the semiconductor wafer 91 via the metal bumps (solder bumps) 96 having a desired thickness TG.

  According to such an aspect, it is possible to control the thickness DA of the metal bump 96 to a desired value while arranging the semiconductor wafer (substrate) 91 and the chip 95 in parallel.

  In the second embodiment, the case where one chip is stacked on the semiconductor wafer 91 is exemplified, but the present invention is not limited to this. For example, the above concept may be applied when a plurality of chip layers are stacked on the semiconductor wafer 91. More specifically, as shown in FIG. 14, a plurality of chips 95 (95a, 95b, 95c) and a plurality of metal bumps 96 (96a, 96b, 96c) layers are alternately stacked in the Z direction. In addition, the above idea may be applied. FIG. 14 is a diagram showing such a modification.

  In such a modification, the total thickness of the plurality of metal bumps 96 (96a, 96b, 96c, etc.) may be controlled to a desired value. Specifically, the head 22 and the stage 12 are relatively moved in the Z direction by using a plurality of piezoelectric actuators 31 and the like so that the distance DC in the Z direction between the head 22 and the stage 12 approaches the target value TC. It only has to be done. At this time, the target value TC related to the separation distance DC between the head 22 and the stage 12 is the total value of the actual thickness (measured value) of the semiconductor wafer 91 and the actual thickness (measured value) of the plurality of chips 95. The sum of the theoretical thicknesses (target values) of the plurality of metal bumps 96 may be calculated. According to this, the total value of the plurality of metal bumps 96 can be brought close to the target value.

  In particular, in such a modification, when only the lowermost metal bump 96a is melted, the thickness of the lowermost metal bump 96a can be accurately controlled in the same manner as described above.

  Moreover, in this 2nd Embodiment, although the case where a chip | tip was joined via a metal bump on a semiconductor wafer was illustrated, it is not limited to this. For example, the above idea may be applied when a metal bump layer is provided between a lower semiconductor wafer and an upper semiconductor wafer. According to this, it is possible to accurately control the thickness of the metal bump layer by accurately controlling the distance between the two semiconductor wafers.

<3. Third Embodiment>
In the said 1st and 2nd embodiment, although the case where the thought of this invention was applied about the technique which applies a pressure to both to-be-pressurized objects and joins the said to-be-pressurized objects was illustrated, it is not limited to this For example, the idea of the present invention may be applied to nanoimprint technology.

  In the third embodiment, such a modified example, that is, a case where the idea of the present invention is applied to the nanoimprint technique is illustrated. Hereinafter, the difference from the first embodiment will be mainly described.

  In the first embodiment, a resin material (specifically, a thermosetting resin material) is used as the flowable substance, and the thermosetting resin is used by using the heaters 12h and 22h as the curing means (thermosetting means). The case of curing the material was illustrated. On the other hand, in the third embodiment, a resin material (specifically, a photocurable resin material (UV curable resin material)) is used as the flowable substance, and the UV irradiation unit 61 is set to a curing means (photocuring). The case where the said photocurable resin material is hardened using as a means) is illustrated. In the third embodiment, the thickness of the semiconductor wafer 92 to be subjected to the pressure treatment and the thickness of the mold 97 (described later) are measured in advance before the pressure treatment, for example, outside the pressure device 1. The mutual distance DA is obtained using the measurement result. More specifically, for example, the thickness of the semiconductor wafer 92 and the thickness of the mold 97 are separately measured using a predetermined jig or the like outside the pressure device 1. Alternatively, the total of the thickness of the semiconductor wafer 92 and the thickness of the mold 97 in a state where the semiconductor wafer 92 and the mold 97 are fixed to a predetermined jig outside the pressurizing apparatus 1 and the semiconductor wafer 92 and the mold 97 are in contact with each other. The value may be measured.

  FIG. 15 is a diagram illustrating a configuration of a pressurizing device 1 (also referred to in detail as 1C) according to the third embodiment. This pressurizing apparatus 1C has the same configuration as the pressurizing apparatus 1A of the first embodiment. However, the pressurizing apparatus 1C is different from the pressurizing apparatus 1A in that the pressurizing apparatus 1C includes a UV (ultraviolet) irradiation unit 61 and that the mirror fixing member 28g can be moved and retracted in the Y-axis direction during UV irradiation. To do. The mirror fixing member 28g is a member that fixes the mirrors 28e and 28f. The pressurizing apparatus 1C is also referred to as a nanoimprint apparatus (fine transfer apparatus).

  In addition, here, a case is shown in which an object to be pressurized (semiconductor wafer) 92 is held by the head 22 and a mold (original plate) 97 is held by the stage 12 (see FIG. 16). Further, a photo-curing resin is applied in advance to the surface (lower surface) of the object to be pressed 92. In other words, a resin layer (also referred to as a flowable substance layer) 98 made of a photo-curing resin is provided on the lower surface side of the object to be pressed 92. Further, the mold 97 is formed of a translucent member (for example, quartz), and an uneven pattern is provided on the surface of the mold 97 (upper side in the drawing). In short, the mold 97 is a transparent mold.

  In addition, as will be described later, both the objects to be pressed 92 and 97 are pressed with a resin layer 98 formed of a photo-curing resin interposed therebetween, and the uneven pattern of the mold 97 is pressed against the resin material of the resin layer 98. For example, the uneven pattern is transferred to the resin layer 98. In the nanoimprint technique, a predetermined pattern is formed on the pressed object 92 based on such a principle.

  Next, the operation in the third embodiment will be described with reference to FIGS.

  First, as in the first embodiment, the position (X, Y) is maintained in a state in which the object 92 to which the photocurable resin is applied is held by the head 22 and the mold (original plate) 97 is held by the stage 12. , Θ) is performed.

  FIG. 16 is a diagram showing a state immediately after the alignment operation described above. In FIG. 16, the objects to be pressed 92 and 97 (specifically, the object to be pressed 92 and the resin layer 98) are not yet in contact with each other and are arranged in a state of being spaced from each other in the Z direction. . In the state of FIG. 16, it is assumed that the relative positions of the objects to be pressed 91 and 92 in the XY direction and the θ direction have a desired state by the alignment operation described above. In FIG. 16, it is assumed that the head 22 and the stage 12 are arranged in a non-parallel arrangement state.

  Thereafter, the piezoelectric actuators 31a, 31b, and 31c are set so that the mutual distance DAi between the pressed object (semiconductor wafer) 92 and the pressed object (mold) 97 becomes equal to the first target value TF. Driven (FIG. 16). By such an operation, the head 22 and the stage 12 (specifically, the pressurizing surfaces 22f and 12f) are arranged in parallel to each other, and the opposing surfaces of the objects to be pressed 92 and 97 are also arranged in parallel to each other. And the mutual distance DA of both the to-be-pressurized objects 92 and 97 substantially corresponds to the value TF (FIG. 17).

  Next, the head 22 is lowered by a predetermined amount DD (= TF−TG) by driving the Z-axis lifting drive mechanism 26. Thereby, as shown in FIG. 18, the resin layer 98 on the object to be pressed 97 comes into contact with the surface of the object to be pressed 92.

  Thereafter, in the same manner as in the above embodiments, the distance DMi is measured at three different positions, and the mutual distance DAi between the pressurized object 92 and the pressurized object 97 becomes a desired value TG. The plurality of piezoelectric actuators 31a, 31b, 31c, etc. are driven (see FIG. 18). As a result, the error ΔEi with respect to the target value TG for each distance DAi falls within the allowable range. In short, each distance DAi reaches the final target value (second target value) TG (FIG. 19). FIG. 19 shows a situation in which the objects to be pressed 92 and 97 are arranged in parallel to each other and the distance DAi between them is equal to the desired value TG. As the target value TG, a very small value, for example, several hundred nm (nanometer) can be set.

  Then, in a state where the error ΔEi of each mutual distance DAi with respect to the target value TG is within the allowable range (in short, each distance DAi has reached the final target TG), the UV irradiation unit 61 Ultraviolet rays (UV) are irradiated (see FIG. 20). The irradiated ultraviolet rays pass through the translucent mold 97 and reach the resin layer 98. Thereby, the photocurable resin of the resin layer 98 having fluidity before UV irradiation is cured (see FIG. 21). As a result, the resin layer 98 having a predetermined concavo-convex pattern is formed on the surface of the pressed object 92 in a state having a desired residual TG and being cured.

  Through the steps as described above, various devices (semiconductor devices or MEMS (Micro Electro Mechanical Systems) devices) are generated (manufactured) using the nanoimprint technology.

  According to such an aspect, it is possible to control the thickness (residual) DA of the resin layer 98 to a desired value TG while arranging the semiconductor wafer 92 and the mold 97 in parallel.

  In the third embodiment, the case where a photocurable resin material is used is exemplified, but the present invention is not limited to this. For example, the above idea may be applied to nanoimprint technology using a thermosetting resin material. Good.

<4. Fourth Embodiment>
In each of the above embodiments, the case where the three inter-distances DAi are measured based on the respective measurement distances DMi, the values DT1, DT2, and the values DE1, DE2 by the three distance measuring sensors 33a, 33b, 33c is illustrated. did. In short, the case where each mutual distance DAi is indirectly measured is illustrated. However, the present invention is not limited to this. In the fourth embodiment, a case where each inter-distance DAi is directly measured is exemplified. Note that the fourth embodiment is a modification of the third embodiment, and the following description will focus on differences from the third embodiment.

  22 and 23 are side views (partially sectional views) showing the vicinity of the head 22 and the stage 12 of the pressure device 1 (also referred to as 1D) according to the fourth embodiment. FIG. 22 shows a state before (or during adjustment) of the Z-direction position and posture of the head 22, and FIG. 23 shows a state after adjustment of the Z-direction position and posture of the head 22. FIG. 24 is a plan view of the vicinity of the stage 12 and the window 2b of the pressurizing apparatus 1D as viewed from below. In FIG. 24, the window portion 2b is omitted for convenience of illustration.

  As shown in FIGS. 22 and 24, in the fourth embodiment, three distance measuring sensors 36 (specifically 36a, 36b, 36c) are provided instead of the three distance measuring sensors 33a, 33b, 33c. It has been.

  Using these three distance measuring sensors 36a, 36b, 36c, the mutual distance DAi (DA1, DA2, DA3) at the position Qi (Q1, Q2, Q3) is measured. The positions Q1, Q2, and Q3 are three positions in a plane parallel to the XY plane, and are different positions on a non-collinear line. Hereinafter, such a measurement method will be described in detail.

  As shown in FIG. 22, the semiconductor wafer (object to be pressed) 92 has a reflecting surface 38p on an opposing surface (surface coated with resin) 92f facing the mold (object to be pressed) 97. . The mold 97 has a reflecting surface 38q on a facing surface 97f facing the semiconductor wafer 92 (surface of a portion protruding toward the semiconductor wafer 92) 97f. These reflecting surfaces 38p and 38q are formed as a very thin thin film using, for example, a metal material that reflects light.

  The distance measurement sensor 36 and the distance measurement control unit 121 measure the mutual distance DAi at each position Qi (see also FIG. 24) in a plane parallel to the XY plane. Specifically, each distance measuring sensor 36 includes two sub sensors 37p and 37q. Each of the sub sensors 37p and 37q is a distance sensor that measures a Z-direction distance from the reference position BP to the object. Further, the sub sensors 37p and 37q are arranged at a minute distance ΔP in a plane parallel to the XY plane, and can respectively measure the Z direction distance at the position Qi (strictly in the vicinity of the position Qi).

  For example, the distance measurement sensor 36a and the distance measurement control unit 121 obtain the mutual distance DA1 at the position Q1 as follows.

  As shown in FIG. 22, first, the sub sensor 37p of the distance measuring sensor 36a measures the Z direction distance DZ1 near the position Q1, and the sub sensor 37q of the distance measuring sensor 36a measures the Z direction distance DZ2 near the position Q1. . Here, the Z-direction distance DZ1 is a distance in the Z direction from the reference position BP to the reflecting surface 38p, and the Z-direction distance DZ2 is a distance in the Z direction from the reference position BP to the reflecting surface 38q.

  More specifically, the sub-sensor 37p emits measurement light (laser light) from the reference position BP, and measures the Z-direction distance DZ1 using light that is reflected by the reflecting surface 38p and incident again.

  Specifically, the light emitted from the sub sensor 37p passes (transmits) through the window 2b, passes through the hole (hollow part) 12e of the stage 12, and also passes (transmits) through the translucent mold 97. . Then, the light passes (transmits) through the resin layer 98 formed of a translucent resin material, reaches the reflection surface 38p provided on the surface 92f of the pressed object 92, and is reflected. Thereafter, the reflected light travels in the reverse direction and is incident on the sub sensor 37p again. Specifically, the reflected light from the reflecting surface 38p passes through the resin layer 98, the mold 97, the hole 12e, and the window 2b in this order and returns to the sub sensor 37p. The sub sensor 37p can measure the Z-direction distance DZ1 between the reference position BP and the reflecting surface 38p using such light.

  On the other hand, the sub-sensor 37q emits measurement light (laser light) from the reference position BP, and measures the Z-direction distance DZ2 using the light that is reflected by the reflecting surface 38q and incident again.

  Specifically, the light emitted from the sub-sensor 37q passes through (transmits) the window 2b, passes through the hole (hollow part) 12e of the stage 12, and travels through the translucent mold 97 to be reflected. It reaches the surface 38q and is reflected. Thereafter, the reflected light travels in the opposite direction and is incident on the sub sensor 37q again. Specifically, the reflected light from the reflecting surface 38q passes through the mold 97, the hole 12e, and the window 2b in this order and returns to the sub sensor 37q. The sub sensor 37q can measure the Z-direction distance DZ2 between the reference position BP and the reflecting surface 38q using such light.

  Then, the distance measurement control unit 121 obtains the mutual distance DA1 based on the Z direction distance DZ1 and the Z direction distance DZ2. Specifically, the mutual distance DA (DAii) is calculated based on the following equation (4).

  In this way, the distance measurement sensor 36a and the distance measurement control unit 121 obtain the difference between the Z direction distance DZ1 and the Z direction distance DZ2 as the mutual distance DAi.

  Similarly, the distance measurement sensor 36b and the distance measurement control unit 121 obtain the mutual distance DA2 at the position P2, and the distance measurement sensor 36c and the distance measurement control part 121 obtain the mutual distance DA3 at the position P3.

  In the fourth embodiment, each mutual distance DAi is measured as described above. Other operations (such as drive operation) are the same as in the third embodiment.

  According to such an aspect, it is possible to measure the mutual distance DAi directly. Therefore, it is not necessary to measure the thickness of the objects to be pressed 92 and 97 in advance. In addition, since it is not affected by indirect measurement results, it is possible to perform a more accurate measurement operation.

  Since the three distance measuring sensors 36a, 36b, and 36c can operate in parallel, the mutual distances DA1, DA2, and DA3 at the positions Q1, Q2, and Q3 are parallel (in short, at the same time). Can be measured.

<5. Fifth Embodiment>
The fifth embodiment is a modification of the fourth embodiment. Hereinafter, the difference from the fourth embodiment will be mainly described.

  In the fourth embodiment, the case where the distances DA1, DA2, and DA3 are measured in parallel (simultaneously) using the three distance measuring sensors 36a, 36b, and 36c has been exemplified. In the fifth embodiment, a case where three distances DA1, DA2 and DA3 are sequentially measured using a single distance measuring sensor 36 (specifically 36 s) will be exemplified. It should be noted that the distance measuring sensor 36s of the pressure device 1 (1E) according to the fifth embodiment has the same configuration as the distance measuring sensor 36a and the like except that it has a moving mechanism.

  As shown in FIGS. 25 and 26, the distance measuring sensor 36s is provided below the stage 12 (and below the window 2b) so as to be movable in the X direction and the Y direction. FIG. 26 is a plan view of the vicinity of the stage 12 and the window 2b as viewed from below. In FIG. 26, the window portion 2b is omitted for convenience of illustration.

  First, the distance measurement sensor 36s and the distance measurement control unit 121 obtain the distance DA1 at the position Q1. Specifically, the distance measuring sensor 36s measures the Z direction distances DZ1 and DZ2 at the position Q1 using the two sub sensors 37p and 37q, and the distance measurement control unit 121 is based on the Z direction distances DZ1 and DZ2. To obtain the value DA1.

  Thereafter, the distance measuring sensor 36s stops in the X direction and the Y direction and reaches the position Q2, and the distance DA2 is measured. Specifically, the distance measurement sensor 36s measures the Z direction distances DZ1 and DZ2 at the position Q2 using the two sub sensors 37p and 37q, and the distance measurement control unit 121 is based on the Z direction distances DZ1 and DZ2. To obtain the value DA2.

  Further, the distance measuring sensor 36s is moved in the Y direction and stops when it reaches the position Q3, and the distance DA3 is measured. Specifically, the distance measuring sensor 36s measures the Z-direction distances DZ1 and DZ2 at the position P3 using the two sub-sensors 37p and 37q, and the distance measurement control unit 121 is based on the Z-direction distances DZ1 and DZ2. To obtain the value DA3.

  As described above, in the fifth embodiment, the distance measuring sensor 36s moves in the direction parallel to the XY plane, and is the same as that in the fourth embodiment at each of the three positions Q1, Q2, and Q3 on the non-colinear line. Each distance DAi is measured based on the principle.

  In the fifth embodiment, the mutual distances DAi are sequentially acquired in this way. Other operations are the same as those in the fourth embodiment.

  According to such an embodiment, each distance DAi is measured using a single distance measuring sensor 36s, and each distance DAi is adjusted to a desired size by finely adjusting the position and orientation of the head 22. Is possible.

<6. Modified example>
Although the embodiments of the present invention have been described above, the present invention is not limited to the contents described above.

  For example, in each of the above embodiments, a case where only three inter-distances DAi (i = 1, 2, 3) at three positions P1, P2, P3 (or Q1, Q2, Q3) are obtained is illustrated. However, the present invention is not limited to this, and four or more mutual distances DAi (i = 1, 2, 3,..., N) at four or more positions may be obtained.

  Conversely, when a predetermined condition is satisfied, each separation distance DAi at only two positions (for example, positions P1, P2 (or positions Q1, Q2)) may be measured.

  FIG. 27 is a view showing the pressurizing apparatus 1 (also referred to as 1F) according to the modification, and FIG. 28 is a view showing a state where the head 22 of the pressurizing apparatus 1F is slightly tilted about the position CP. is there. 27 and 28, the head 22 and the stage 12 are shown in a simplified manner. Further, FIG. 29 is a plan view showing the vicinity of the head 22 of the pressure device 1 (1F) according to this modification.

  For example, as shown in FIGS. 27 and 28, the head 22 (specifically, the substantially hemispherical sliding surface 22u on the upper side thereof) is pressed against and supported by the substantially hemispherical spherical bearing 27v by the biasing force of the spring 27s. In addition, the head 22 is inclined with respect to the stage 12 on the premise that the rotation center position CP of the head 22 exists at a desired position in the Z direction (that is, the position of the position CP in the Z direction exists at the target position). Assume that you get.

  In such a case, as shown in FIG. 29, the mutual distance DA between the two positions P4 and P5 may be obtained. That is, when the precondition that the Z-direction distance DA at the position CP is adjusted to a correct value (TG or the like) is satisfied, only the mutual distance DA at the two positions P4 and P5 is measured. You may make it adjust each said mutual distance DA to target value (TG etc.). This also makes it possible to maintain the head 22 and the stage 12 in parallel and adjust the mutual distance DM (and hence DA) to a predetermined value.

  Moreover, in the said 1st and 3rd embodiment etc., although the thermosetting resin material and the photocurable resin material were illustrated as a flowable substance, it is not limited to this. For example, a thermoplastic resin material may be used as the flowable substance. Specifically, in a state where the thermoplastic resin material is heated and fluidized, the mutual distance between the objects to be pressed (that is, the thickness of the resin material) is controlled to a desired value, and then The resin material may be cooled and solidified while the mutual distance is maintained at the desired value.

  Further, in each of the above-described embodiments and the like, relative movement of both pressure members is realized by fixing the stage 12 as the lower pressure member and moving the head 22 as the upper pressure member. Although the case was illustrated, it is not limited to this. For example, conversely, the head 22 that is the upper pressure member is fixed and the stage 12 that is the lower pressure member moves, so that the relative movement of both pressure members may be realized. . More specifically, the stage 12 is moved in the Z direction, the X direction, the Y direction, the θ direction (around the Z axis), and the other two rotation directions (the rotation direction around the X axis and the rotation direction around the Y axis). It may be.

  Further, in each of the above-described embodiments and the like, the case where the relative positions in the Z direction of the upper and lower pressed objects are adjusted using only the plurality of piezoelectric actuators 31a, 31b, and 31c is exemplified, but the present invention is not limited to this. For example, the relative positional relationship between the objects to be pressed is roughly set so that the objects to be pressed are brought into parallel with each other using a plurality of pressure detection sensors 32a, 32b, and 32c. After the adjustment (coarse adjustment) in advance, the relative position adjustment operation using the plurality of piezoelectric actuators 31a, 31b, 31c as described above may be performed.

  Further, in each of the above embodiments and the like, when the three mutual distances DAi are obtained, the same values are used as the values DT1 and DT2 and the values DE1 and DE2, respectively, with respect to each position Pi. Not. For example, as the values DT1 and DT2 and the values DE1 and DE2, separate values respectively measured at parts in the vicinity of each position Pi may be used for each position Pi.

  Moreover, in each said embodiment etc., although the case where an upper side to-be-pressurized object and a lower to-be-pressurized object were arrange | positioned in parallel was illustrated, it is not limited to this. For example, at the three positions P1, P2, and P3, the relative relationship between the upper pressure object and the lower pressure object so that the three mutual distances DAi can reach (converge) different target values. The positional relationship may be adjusted.

  In the pressurizing operation in each of the above-described embodiments and the like, it is preferable that the pressure between the objects to be pressed is appropriately controlled together with the distance DA between the objects to be pressed. In short, it is preferable that the pressure control (force control) is executed precisely together with the position control.

  More specifically, in each of the above embodiments and the like, the controller 100 detects the mutual relationship between the two objects to be pressed during pressurization (bonding) based on a detection signal from the pressure detection sensor 29 (and / or 32) or the like. What is necessary is just to control the Z-axis raising / lowering drive mechanism 26 so that the force (pressing force) which acts between them may approach a predetermined value. For example, the following force control may be performed during the pressurization period (joining period) (see FIGS. 10 and 11) after the objects to be pressed 91 and 92 contact each other. Specifically, first, the controller 100 detects a force (specifically, the magnitude of the force) acting between the objects to be pressed 91 and 92 by using the pressure detection sensor 29 or the like. Then, the controller 100 relatively moves the pressure surface of the stage 12 and the pressure surface of the head 22 so that the value detected by the pressure detection sensor 29 or the like approaches a predetermined value (for example, 0.5 N (Newton)) THf. . Such an operation may be performed repeatedly.

  In this case (when position control and force control are used in combination), it is preferable that the force control is preferentially used when the position control and the force control between the objects to be pressed compete with each other. For example, the relative positions of the objects to be pressed are controlled so that the detection value by the pressure detection sensor 29 is equal to a predetermined value (relatively small value) THf, and an excessive force is applied to both objects to be pressed. Is preferably prevented. More specifically, the controller 100 prohibits the relative position change (the mutual distance DAi from becoming too small) such that the detection value of the pressure detection sensor 29 exceeds the predetermined value THf. What is necessary is just to control so that the distance DAi may approach each target value equally.

  According to this, while appropriately maintaining the relative posture between the two objects to be pressed (for example, maintaining both the objects to be pressed 91 and 92 in parallel), further, between the two objects to be pressed. Since the applied force can be appropriately controlled, both objects to be pressed can be joined very well.

  Further, in each of the above embodiments, the case where the mutual distance DA is controlled to coincide with the target value as a fixed value is exemplified, but the present invention is not limited to this, and the target value of the distance DA is the time. It may be set to a value that changes (changes with time) in accordance with. Such a modification is particularly useful when the thickness of the flowable substance layer changes with time.

  For example, in the third embodiment, the resin layer 98 contracts with the photocuring, particularly during the curing period of the resin layer 98 among the pressurizing periods of the objects to be pressed 97 and 92. FIG. 30 is a diagram showing a state in the vicinity of the objects to be pressed 97 and 92 at the start time ts of the curing period, and FIG. FIG. 30 and 31, the unevenness (particularly, the recesses) on the surface of the mold 97 is omitted, and the shrinkage of the resin layer 98 is exaggerated. As can be seen from a comparison between FIG. 30 and FIG. 31, the thickness H of the resin layer 98 decreases from the value HS to the value HE with photocuring (HS> HE). In other words, the flowable substance layer shrinks during the curing period, and the thickness of the flowable substance layer is reduced.

  On the other hand, in this modified example, the time change of the thickness H of the resin layer 98 accompanying the shrinkage of the resin layer 98 is measured in advance, and the time-dependent change curve CL of the thickness H is stored in the storage unit in the controller 100. Shall be remembered. FIG. 32 is a diagram illustrating an example of a time-dependent change curve CL (measurement result) of the thickness H of the resin layer 98. Then, the joining operation (curing operation) is performed such that the target value of the mutual distance DA changes with time according to the change with time of the thickness H of the resin layer 98 (see FIG. 32). In other words, the above-described target value (second target value) TG (see FIG. 19) is set as a value that changes with time, and the curing operation is executed. In this curing operation, it is preferable that the time-dependent change curve of the target value of the mutual distance DA is set to a curve having the same rate of change as the time-dependent change curve CL of the thickness H of the resin layer 98. For example, the target value of the inter-distance DA is the above-described temporal change at each time point from the value HS at the start time ts of the pressurization period (specifically, the curing period) to the value HE at the end time te of the pressurization period. What is necessary is just to set as a value on the curve LF (refer FIG. 33) which offset the curve CL (refer FIG. 32) in the predetermined direction. Alternatively, the target value of the mutual distance DA may be set as a value on the same curve as the time-dependent change curve CL.

  According to this, compared with the case where a fixed value (that is, a fixed value) that does not change with time is used as the target value, the target value can be always set to an appropriate value at each of a plurality of times. Therefore, it is possible to prevent the force (pressing force) applied to both objects to be pressurized from becoming too small (or too large) in consideration of the variation in the thickness of the flowable substance layer.

  Furthermore, such a modification can be applied not only to the situation where the thickness H of the flowable substance layer decreases during the curing period, but also to the situation where the thickness H of the flowable substance layer increases during the curing period. It is. For example, in the first embodiment, when the thickness H of the thermosetting resin layer of the resin layer 93 fluctuates during the curing period (specifically, the thickness of the thermosetting resin layer 93 increases according to the application of heat). In this case, the target value of the mutual distance DA may be changed with time (in this case, increased) according to the thickness H of the thermosetting resin layer. Also by this, the same effect as the above modification can be obtained. Similar modifications can be made to the second embodiment and the like.

  Further, these modifications can be applied not only when the thickness of the flowable substance layer varies but also when the thickness of the objects to be pressed itself varies. For example, in the first embodiment, when the thicknesses of the objects to be pressed 91 and 92 are increased (or decreased) by heating (or cooling), a variation curve regarding the thicknesses of the objects to be pressed 91 and 92 is obtained. Based on (time course curve), a time course curve of the target value of the inter-distance DA may be determined. Or in 2nd Embodiment (refer FIG. 13), when the thickness of the to-be-pressurized objects 91 and 95 increases (or decreases) by heating (or cooling), the thickness of the to-be-pressurized objects 91 and 95 is Based on a fluctuation curve (time-dependent change curve) related to the change in time, a time-dependent change curve of the target value of the mutual distance DA may be determined.

  The modification can also be applied to the case where the thickness of a substance other than the flowable substance that is disposed between the two objects to be pressed varies. For example, in the modified example of the second embodiment (see FIG. 14), when the thickness of the plurality of chips 95a and 95b varies due to heating or the like, a variation curve (time-varying curve) regarding the thickness of the chips 95a and 95b. Based on the above, a time-dependent change curve of the target value of the mutual distance DA may be determined.

  In addition, during the pressurization period (such as during the curing period), an aspect in which the target value of the distance DA between the two objects to be pressed is changed with time, and an aspect in which the pressure value between the two objects to be pressed approaches a predetermined value. May be executed in combination. In particular, it is preferable that each mutual distance DAi be made close to the respective target values equally while keeping the force close to the predetermined value THf so that the force acting between the objects to be pressed does not exceed the predetermined value THf. . According to this, even when the thickness H or the like of the flowable substance layer changes with time, the pressurizing device 1 suppresses the pressure value between the two pressurized objects to a predetermined level while the two pressurized objects. It is possible to join the objects to be pressed while maintaining the parallelism.

  More specifically, a force (pressure) greater than or equal to a predetermined value in the operation of reducing the distance between the objects to be pressed (the distance DA between the objects to be pressed) at a constant speed (the action of bringing the objects to be pressed close together). When this is detected, the approaching action of the workpieces may be temporarily stopped or the approaching speed may be reduced. According to this, it is possible to perform more appropriately the operation | movement which shortens the said space | interval below a predetermined pressure value.

Or you may make it set the time-dependent change curve regarding the target value of each mutual distance DAi as a curve in which the target value in each time point becomes a small amount larger value than the original target value. By setting such a target value, the mutual distance DA at each time point is controlled so as not to become too small (so that both pressurized objects are not too close), so both pressurized objects are It is possible to appropriately prevent an excessive force from acting between the two.
It is possible.

  As described above, according to each embodiment, modification, etc., each of the above advantages can be obtained. In particular, according to an appropriate mode, for example, a flowable substance (curing material or the like) is interposed between the objects to be pressed, and the alignment of both objects to be pressed in the plane direction (in the XY plane) Aligns the three-dimensional position by controlling the relative posture of the objects to be pressed (parallel maintenance, etc.) and the distance between the objects to be pressed (height direction (Z direction) distance), and UV. A three-dimensional assembly (mounting) that solidifies the state of a flowable substance or the like by light irradiation or the like is possible, and a plurality of devices can be collectively produced at the wafer level.

DESCRIPTION OF SYMBOLS 1,1A-1F Pressurization apparatus 2 Vacuum chamber 12 Stage 12f, 22f Pressurization surface 12h, 22h Heater 22 Head 23 Alignment table 25 Rotation drive mechanism 26 Z-axis raising / lowering drive mechanism 31, 31a, 31b, 31c Piezo actuator 32, 32a, 32b, 32c Pressure detection sensor 33, 33a, 33b, 33c, 36, 36a, 36b, 36c, 36s Distance sensor 34, 34a, 34b, 34c Reflector 91, 92 Semiconductor wafer (object to be pressed)
93, 94, 98 Resin layer (flowable material layer)
95 Chip (Pressurized object)
96 Metal bump (flowable material layer)
97 Mold

Claims (20)

A pressurizing device,
First and second pressure members that are opposed to each other in a predetermined direction and are relatively movable in the predetermined direction;
A first and a second pressurized object interposed between a pressure surface of the first pressure member and a pressure surface of the second pressure member, and a flowable substance layer therebetween. Measuring means for measuring the distance between the first and second objects to be pressed arranged in the predetermined direction at a plurality of positions in a plane having the predetermined direction as a normal direction;
Based on the measurement results by the measurement means, the pressure surface of the first pressure member and the pressure surface of the second pressure member so that the mutual distances at the plurality of positions approach the target values, respectively. Driving means for relatively moving,
A pressurizing apparatus comprising: The pressurizing apparatus according to claim 1, wherein
The plurality of positions includes three positions on a non-collinear line in the plane. The pressurizing device according to claim 1 or 2,
The drive means has three piezo actuators that extend and contract in the predetermined direction independently of each other;
The three piezoelectric actuators are arranged at different positions on a non-collinear line in the plane. The pressurizing device according to any one of claims 1 to 3,
The measuring means includes
A distance measuring sensor that measures a distance between the first position of the first pressure member and the second position of the second pressure member in the predetermined direction;
Measuring the distance between the distance measurement sensor, the thickness of the first object to be pressed in the predetermined direction, and the thickness of the second object to be pressed in the predetermined direction. A pressurizing device characterized. The pressurizing device according to claim 4, wherein
The measuring means includes
The measured value by the distance measuring sensor, the displacement in the predetermined direction between the first position and the pressure surface of the first pressure member, the second position and the pressure surface of the second pressure member And measuring the distance between the first pressurized object, the thickness of the first object to be pressed in the predetermined direction, and the thickness of the second object to be pressed in the predetermined direction. A pressurizing apparatus characterized by: The pressurizing device according to claim 4 or 5,
A storage unit for storing data obtained by measuring in advance the thickness of the first object to be pressed in the predetermined direction and the thickness of the second object to be pressed in the predetermined direction;
With
The pressurizing apparatus, wherein the measuring unit measures the mutual distance based on the data stored in the storage unit. The pressurizing device according to any one of claims 1 to 3,
At least one of the first object to be pressed and the second object to be pressed has a translucent member,
The first object to be pressed has a first reflecting surface on a first facing surface facing the second object to be pressed,
The second object to be pressed has a second reflecting surface on a second facing surface facing the first object to be pressed,
The measuring means includes
The predetermined direction from a reference position to the first reflective surface using light that passes through the translucent member and is reflected by the first reflective surface and then returns through the translucent member. Measure the first distance, which is the distance at
Using the light that passes through the translucent member and is reflected by the second reflective surface and then returns through the translucent member, the predetermined distance from the reference position to the second reflective surface is used. Measure the second distance, which is the distance in the direction,
The pressurizing apparatus, wherein the mutual distance is obtained based on a difference between the first distance and the second distance. The pressurizing device according to claim 7,
The measuring means has a distance measuring sensor movable in a direction parallel to the plane,
The pressurizing device, wherein the distance measuring sensor moves in a direction parallel to the plane and measures the first distance and the second distance at each of the plurality of positions. The pressurizing device according to any one of claims 1 to 7,
The measuring means includes three distance measuring sensors, and measures the mutual distances at different positions on a non-collinear line in the plane using the three distance measuring sensors. Pressurizing device. The pressurizing device according to any one of claims 1 to 9,
The flowable substance layer is a layer formed of any one of a thermosetting resin material and a photocurable resin material,
The pressure device is
Curing means for curing the resin material having fluidity in a state where an error with respect to the target value of the mutual distance is within an allowable range,
The pressurizing device further comprising: The pressurizing apparatus according to any one of claims 1 to 6,
The flowable material layer is a metal bump layer;
The pressure device is
Curing means for cooling and curing the metal bump layer that has been thermally melted in a state where an error with respect to the target value of the mutual distance is within an allowable range.
The pressurizing device further comprising: The pressurizing apparatus according to any one of claims 1 to 6,
Each of the first and second objects to be pressed is a substrate,
The measuring means is configured to determine a mutual distance in the predetermined direction between the first object to be pressed and the second object to be pressed arranged with a resin material interposed therebetween. A pressurizing device, characterized by measuring at a position. The pressurizing apparatus according to any one of claims 1 to 6,
One of the first and second objects to be pressed is a substrate and the other is a chip;
The measuring means is configured to calculate a distance between the first object to be pressed and the second object to be pressed, which are arranged with a metal bump layer interposed therebetween, in the predetermined direction. A pressurizing apparatus, characterized in that the measurement is performed at the position. The pressurizing device according to any one of claims 1 to 9,
One of the first and second objects to be pressed is a mold and the other is a substrate;
The measuring means has the predetermined direction of the first object to be pressed and the second object to be pressed which are disposed with either one of a photocurable resin material and a thermosetting resin material interposed therebetween. The pressurizing apparatus is characterized in that the distance between each other is measured at a plurality of positions in the plane. The pressurizing device according to any one of claims 1 to 14,
Detecting means for detecting a force acting between the first object to be pressed and the second object to be pressed;
Further comprising
The drive means is configured to apply the first application so that a detection value by the detection means approaches a predetermined value during a pressurization period of the first object to be pressed and the second object to be pressed. A pressurizing apparatus, wherein the pressurizing surface of the pressurizing member and the pressurizing surface of the second pressurizing member are relatively moved. The pressurizing apparatus according to any one of claims 1 to 15,
The target value related to the mutual distance is set to a value that changes with time during a pressurization period between the first object to be pressed and the second object to be pressed. apparatus. The pressurizing device according to claim 16,
The pressurizing apparatus, wherein the target value is determined based on a variation in the thickness of the flowable substance layer during the pressurizing period. Pressurizing method,
a) First and second pressurized objects interposed between first and second pressure members facing and spaced apart in a predetermined direction, with a flowable substance layer sandwiched therebetween. Measuring a distance between the first and second objects to be pressed in the predetermined direction at a plurality of positions in a plane having the predetermined direction as a normal direction;
b) Based on the measurement results obtained in step a), the pressure surfaces of the first pressure member and the second pressure member are adjusted so that the mutual distances at the plurality of positions approach the target values. Moving relative to the pressure surface;
A pressurizing method comprising:   A device produced using the pressing method according to claim 18. First and second holding members that are spaced apart and face each other in a predetermined direction and are relatively movable in the predetermined direction;
The distance between the first object to be pressed held by the first holding member and the second object to be pressed held by the second holding member in the predetermined direction is defined as the predetermined direction. Measuring means for measuring at a plurality of positions in a plane defined as a normal direction;
Based on the measurement results by the measurement means, the pressure surface of the first pressure member and the pressure surface of the second pressure member so that the mutual distances at the plurality of positions approach the target values, respectively. Driving means for relatively moving,
A pressurizing apparatus comprising:

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