CN114690550A

CN114690550A - Transfer device capable of aligning patterns

Info

Publication number: CN114690550A
Application number: CN202111017484.7A
Authority: CN
Inventors: 金泰完; 金准基; 权相民; 郑明教; 朴惠贞; 郑熙锡
Original assignee: GigaLane Co Ltd
Current assignee: GigaLane Co Ltd
Priority date: 2020-12-29
Filing date: 2021-08-30
Publication date: 2022-07-01
Also published as: TW202225829A; KR102520642B1; KR20220095024A; TW202248751A; TWI790759B

Abstract

According to an aspect of the present invention, there may be provided a transfer device capable of aligning a pattern, including: a first pressing unit for supporting a mold on which a pattern and a positioning mark are formed; a second pressing unit for supporting the substrate formed with resin and positioning key; and an imaging unit recognizing the positioning mark and the positioning key, wherein the second pressing unit includes a substrate mounting unit having a support region for supporting a bottom surface of the substrate and formed with an imaging path extending in a vertical direction such that one end portion is disposed in the support region, and the imaging unit includes a lower imaging unit imaging through the imaging path of the substrate mounting unit to recognize at least one of the positioning mark and the positioning key.

Description

Transfer device capable of aligning patterns

Technical Field

The present invention relates to a transfer device capable of aligning a pattern.

Background

Recently, in a display process and a semiconductor process, a Nano Imprint Lithography (Nano Imprint Lithography) process is used to form a pattern (e.g., a structured molding pattern, a mask pattern for etching or vapor deposition, etc.) on a surface of a substrate (e.g., a display panel, a Wafer (Wafer), etc.).

The nano-imprint process is a technology capable of economically and efficiently manufacturing a nano-structure since it can replace an existing photolithography (Photo Lithography) process. Specifically, the nanoimprint process is a process of transferring a pattern to a Resin by pressing a Mold (Mold) formed with a nano-scale pattern and a substrate formed with a Resin (Resin) against each other using a Transfer Apparatus (Transfer Apparatus). The transfer device used in such a nanoimprint process performs a process of separating the mold from the substrate after pressing the mold against the substrate.

On the other hand, when transferring the pattern of the mold to the resin of the substrate, it is necessary to cause the mold and the substrate to be located at a predetermined target position and pressed against each other. In a conventional transfer device, a positioning mark formed on a mold and a positioning key formed on a substrate are recognized by an imaging unit located above the mold and the substrate, and the mold and the substrate are positioned at target positions. However, when the mold is an opaque mold or a positioning key is formed on the lower side of an opaque substrate, the imaging unit included in the conventional transfer apparatus cannot recognize the positioning key formed on the substrate. In other words, when the conventional transfer device cannot pass through the space between the positioning mark and the positioning key, the imaging unit cannot recognize the positioning key formed on the substrate, and thus there is a problem that the mold and the substrate cannot be moved to the target positions. If the mold and the substrate are pressed against each other without being located at the target positions, the pattern is not transferred to the predetermined target position of the resin, and a pattern substrate with poor performance may be manufactured.

Therefore, there is a need for a device that can align a mold and a substrate to a target position even if the mold is a non-transparent mold or even if a positioning key is formed on the lower side of a non-transparent substrate.

Disclosure of Invention

The present invention has been made in view of the above-described background, and an object of the present invention is to provide a device that can position a mold and a substrate at a target position (target position) by an imaging unit even if the mold is an opaque mold or even if a positioning key is formed on the lower side of an opaque substrate.

In addition, the present invention is directed to provide a device capable of aligning a horizontal position so that a mold and a substrate are located at a predetermined target position (target position) before transferring a pattern of the mold to a resin of the substrate.

Another object of the present invention is to provide a device capable of accurately transferring a pattern to a predetermined target position of a resin.

According to an aspect of the present invention, there may be provided a transfer device capable of aligning a pattern, including: a first pressing unit which supports a mold on which a pattern and a positioning mark are formed; a second pressing unit for supporting the substrate formed with resin and positioning key; and a photographing part recognizing the positioning mark and the positioning key, the second pressing unit including: a substrate mounting portion including a support region for supporting a bottom surface of the substrate and having an imaging path formed therein extending in a vertical direction such that one end portion thereof is disposed in the support region, the imaging portion including: and a lower photographing part for recognizing one or more of the positioning mark and the positioning key by photographing through the photographing path of the substrate mounting part.

In addition, there may be provided a transfer device capable of aligning a pattern, the photographing part further including: and an upper imaging unit configured to recognize one of the positioning key and the positioning mark when the lower imaging unit recognizes the other.

Further, it is possible to provide a transfer device capable of aligning a pattern, in which one of the first pressing unit and the second pressing unit is moved toward the other, one or more of the first pressing unit and the second pressing unit is moved based on one or more of the positioning mark and the positioning key recognized by the lower imaging unit to align a horizontal position of the mold and the substrate, and the mold and the substrate aligned in the horizontal position are pressed against each other to transfer the pattern to the resin, and the lower imaging unit is configured to adjust one or more of a horizontal position, a vertical position, and an angle so that a viewing angle is directed to a position where the positioning mark and the positioning key are formed.

In addition, the lower image pickup unit may be configured to have a first focal length for identifying the positioning mark and a second focal length for identifying the positioning key, and the focal length may be changed to the first focal length or the second focal length.

In addition, there may be provided a transfer device capable of aligning a pattern, the positioning mark including a first positioning mark and a second positioning mark, the positioning key including a first positioning key corresponding to the first positioning mark and a second positioning key corresponding to the second positioning mark, the lower photographing part including: a first lower imaging unit configured to recognize one or more of the first positioning mark and the first positioning key; and a second lower imaging unit configured to recognize one or more of the second positioning mark and the second positioning key.

In addition, there may be provided a transfer device capable of aligning a pattern, the second pressing unit further including: a photographing guide part having one side communicating with the photographing path and the other side opposite to the one side connected to the lower photographing part; and a reflection unit disposed between the imaging path and the imaging guide unit, the imaging guide unit being arranged in a direction shifted from a vertical direction, and the lower imaging unit recognizing the positioning key by the reflection unit.

In addition, there may be provided a transfer device capable of aligning a pattern, the substrate seating part including: a mounting part body formed with the photographing path; a shielding window for cutting off the gas flowing in the shooting path; and a shielding member disposed between the shielding window and the mounting portion body to block a flow of gas between the shielding window and the mounting portion body.

In addition, there may be provided a transfer device capable of aligning a pattern, the seating part body including: an upper mounting part provided with the support region; and a lower mounting part supporting the upper mounting part, the photographing path including: a first path portion formed on the upper mounting portion and a second path portion formed on the lower mounting portion, the one or more shielding windows including: a first shielding window disposed on the first path portion to block a gas from flowing inside the first path portion; and a second shielding window spaced apart from the first shielding window and disposed on the second path portion to block a flow of the gas inside the second path portion, the one or more shielding members including: a first shielding member positioned between the first shielding window and the upper receiving portion; and a second shielding member positioned between the second shielding window and the lower receiving portion.

In addition, there may be provided a transfer device capable of aligning a pattern, the transfer device capable of aligning a pattern further comprising: a positioning part for adjusting the horizontal position of the substrate placing part; and an elevating unit configured to elevate the positioning unit, wherein the lower imaging unit moves together with the substrate placement unit when the substrate placement unit moves through the positioning unit and the elevating unit.

In addition, there may be provided a transfer device capable of aligning a pattern, the transfer device capable of aligning a pattern further comprising: a control unit that performs control for operations of the first pressing unit, the second pressing unit, and the positioning unit.

In addition, there may be provided a transfer device capable of aligning a pattern, the transfer device capable of aligning a pattern including: a first pressing unit for supporting the mold having the pattern; and a second pressing unit that supports the substrate on which the resin is formed, the second pressing unit including: a substrate mounting portion supporting the substrate; a positioning part for adjusting the horizontal position of the substrate placing part; and a bellows: the adjustment portion adjusts a horizontal position of the substrate placement portion in a contact state where one end of the bellows is in contact with the first pressing unit.

In addition, there may be provided a transfer device capable of aligning a pattern, the second pressing unit further including: a bellows moving part supported by an outer surface of the substrate mounting part and connected to the bellows to extend and contract the bellows, the bellows moving part including: a lift cylinder including a shaft and a cylinder actuator providing a driving force for moving the shaft; a block provided at an end of the shaft; and a bellows connection part supporting the block to allow the block to move in a horizontal direction, in which a seating groove extending in the horizontal direction to seat the block and a receiving groove extending in an up-down direction to communicate with the seating groove and surrounding the shaft with a predetermined gap are formed, the shaft moving in the horizontal direction in the receiving groove when the horizontal position of the substrate seating part is adjusted in the contact state.

In addition, it is possible to provide a transfer device capable of aligning a pattern, the bellows being elastically deformed in the contact state to allow adjustment of a horizontal position of the substrate seating part.

In addition, there may be provided a transfer device capable of aligning a pattern, the first pressing unit further including: a mold clamp supporting an edge portion of the mold, the mold clamp being in contact with one end portion of the corrugated tube when the corrugated tube is in the contact state; a clamp supporting an edge of the mold clamp to fix the mold clamp to the first pressing unit side; and a sealing part, a lower part of which is contacted with an upper part of the mold clamp, wherein the clamp comprises a sliding component which supports the mold clamp from the lower part, and the mold clamp is inserted between the sliding component and the sealing part and supported by the clamp.

In addition, there may be provided a transfer device capable of aligning a pattern, the first pressing unit further including: a mold clamp supporting an edge portion of the mold, contacting one end portion of the corrugated tube when in the contact state, a clamp closing member provided in the mold clamp, a corrugated tube sealing member provided at one end portion of the corrugated tube, the clamp closing member and the corrugated tube sealing member contacting each other in order to prevent gas from flowing between the mold clamp and the one end portion of the corrugated tube when in the contact state, the clamp closing member and the corrugated tube sealing member having different shapes from each other.

In addition, there may be provided a transfer device capable of aligning a pattern, the first pressing unit including: a mold clamp supporting an edge portion of the mold and contacting one end portion of the corrugated tube when in the contact state; a UV transparent window for supporting the mold and allowing UV to pass therethrough; a sealing part which protrudes in an annular shape, and the lower part of which is in contact with the mold clamp so as to seal the periphery of the UV transmission window relative to the outside; and a first exhaust unit for exhausting gas remaining in the space sealed inside the sealing unit to the outside when the sealing unit seals the space around the UV transmission window from the outside.

In addition, there may be provided a transfer device capable of aligning a pattern, the second pressing unit further including: and a second exhaust part for exhausting gas remaining in the space sealed in the inside of the bellows to the outside when the bellows seals the space around the substrate from the outside, the first exhaust part and the second exhaust part operating to prevent a difference between a gas pressure inside the sealed part and a gas pressure inside the bellows from exceeding a predetermined range.

In addition, there may be provided a method of manufacturing a pattern substrate by pressing a mold formed with a pattern and a positioning mark against a substrate formed with a resin and a positioning key, the method including: an imaging step in which an imaging unit images a positioning mark formed on the mold and a positioning key formed on a substrate; a first positioning step of adjusting the horizontal position of the substrate by a positioning part; a sealing step of sealing a space around the substrate from the outside by a bellows and discharging a gas remaining in the space around the substrate to the outside; a second positioning step of adjusting the horizontal position of the substrate again by the positioning section after the sealing step; a substrate pressing step of pressing the substrate to the mold.

In addition, a method of manufacturing a pattern substrate may be provided, wherein one or more of the first positioning step and the second positioning step are performed a plurality of times before the substrate pressing step, and the photographing step is performed each time the first positioning step and the second positioning step are performed.

In addition, there may be provided a method of manufacturing a pattern substrate, further comprising: and a lifting/lowering step of lifting the positioning portion by a lifting/lowering unit, and executing the lifting/lowering step, the imaging step, and the first positioning step a plurality of times so that the imaging step and the first positioning step are executed when the substrate has been lifted by the lifting/lowering step by a predetermined distance, and the imaging step and the first positioning step are executed again when the substrate has been lifted by more than the predetermined distance by the lifting/lowering step.

In addition, a method of manufacturing a pattern substrate may be provided, in which the horizontal movement distance of the substrate moved by the second positioning step is smaller than the horizontal movement distance of the substrate moved by the first positioning step.

Further, a computer-readable recording medium storing a computer program for executing a method of manufacturing a pattern substrate by pressing a mold on which a pattern and a positioning mark are formed and a substrate on which a resin and a positioning key are formed, wherein the computer program is programmed to execute the steps of: a storage step of storing the positioning key photographed by the lower photographing unit and the image information of the positioning mark photographed by the upper photographing unit in the computer-readable recording medium; an operation step of calculating the position information of the positioning mark and the positioning key based on the image information stored in the computer-readable recording medium; and an output step of outputting an operation command for adjusting the position of the mold or the substrate based on the calculated position information, wherein the calculation step obtains a path value at which the calculated position of the positioning key moves to the calculated position of the positioning mark, and the output step further outputs an operation command for adjusting the center position of the image information of the positioning key based on the obtained path value.

Effects of the invention

According to the embodiment of the present invention, there is an effect that it is possible to align the horizontal position before transferring the pattern of the mold to the resin of the substrate so that the mold and the substrate are located at the predetermined target position.

In addition, the pattern can be accurately transferred to a predetermined target position of the resin.

Even if the mold is an opaque mold or a positioning key is formed below the opaque substrate, the mold and the substrate can be positioned at a target position by the imaging unit.

Drawings

Fig. 1 is a perspective view of a transfer device capable of aligning patterns according to an embodiment of the present invention.

Fig. 2 is a plan view of the mold of fig. 1.

Fig. 3 is a bottom view of the substrate of fig. 1.

Fig. 4 is a sectional view taken along a-a' of fig. 1.

Fig. 5 is a sectional view taken along a-a' of fig. 1 when the second pressing unit is moved in an upper direction.

Fig. 6 is a sectional view taken along B-B' of fig. 1.

Fig. 7 is a sectional view taken along B-B' when the photographing part of fig. 1 is moved to a non-photographing position.

Fig. 8 is an enlarged view of B of fig. 6.

Fig. 9 is a side view of fig. 1.

Fig. 10 is an exploded perspective view of the mold support of fig. 1.

Fig. 11 is a perspective view showing the clamp moved along the lower side to be inserted into the mold cramp.

Fig. 12 is a perspective view showing a state in which the mold cramp is moved to a space between the cramp and the closed part and is mounted on the cramp.

Fig. 13 is an enlarged view of D in fig. 9, and is a perspective view showing a state in which the mold holder is moved to a space between the clamp and the sealing portion and is mounted on the clamp.

Fig. 14 is a front view showing that the mold cramp is interposed between the cramp and the closed portion so that the mold cramp comes into contact with the closed portion.

Fig. 15 is an enlarged view of C of fig. 4.

Fig. 16 is an enlarged view of E of fig. 9.

Fig. 17 is a sectional view taken along X-X' of fig. 16.

Fig. 18 is an exploded perspective view of fig. 1.

Fig. 19 is an exploded bottom perspective view of fig. 1.

Fig. 20 is a flowchart schematically illustrating a method of manufacturing a pattern substrate according to an embodiment of the present invention.

(description of reference numerals)

1: transfer device capable of aligning patterns

10: die set

11: positioning mark

11 a: first positioning mark

11 b: second positioning mark

20: substrate

21: positioning key

21 a: first positioning key

21 b: second positioning key

100: first pressing unit

110: mould support

111: die clamp

111 a: clamp sealing component

112: clamp forceps

112 a: sliding component

112 b: clamp body

113: clamp shifter

114: mover support

120: UV transparent window

130: sealing part

140: first exhaust part

150: sealing member for sealing part

200: second pressing unit

210: substrate mounting part

210 a: shooting path

210 a-1: first path part

210 a-2: second path part

211: placing part body

211 a: upper placing part

211 b: lower placing part

213: shielding window

213 a: first shielding window

213 b: second shielding window

214: shielding component

214 a: first shielding part

214 b: second shielding member

220: position adjusting part

221: first adjusting part

222: second adjusting part

223: third adjusting part

230: lifting part

240: corrugated pipe

241: bellows seal member

250: second exhaust part

260: bellows moving part

261: lifting cylinder

261 a: shaft

261 b: cylinder actuator

262: block

263: corrugated pipe connecting part

263 a: placing groove

263b accommodating groove

280: shooting guide part

290: reflection part

300: image pickup unit

310: upper shooting part

320: lower shooting part

400: UV irradiation part

500: driving part

510: support body

520: support actuator

600: control unit

Detailed Description

Hereinafter, specific embodiments for implementing the technical idea of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present invention, when it is determined that specific descriptions of related known structures or functions may obscure the gist of the present invention, detailed descriptions thereof will be omitted.

When a certain constituent element is referred to as being "supported", "flowed in", "discharged", or "fixed" by another constituent element, it is to be understood that the other constituent element may be directly supported, flowed in, discharged, or fixed by the other constituent element, but it may be possible to have another constituent element in between.

The terms used in the present specification are used only for describing specific embodiments, and are not intended to limit the present invention. Expressions in the singular include expressions in the plural unless explicitly stated differently in context.

In addition, terms including ordinal numbers such as first, second, and the like may be used in the description of various constituent elements, but the respective constituent elements are not limited to such terms. The term is used for the purpose of distinguishing one constituent element from another constituent element.

The use of "including" in the specification is meant to specify the presence of stated features, regions, integers, steps, acts, elements, and/or components, but does not preclude the presence or addition of other specified features, regions, integers, steps, acts, elements, components, and/or groups thereof.

It is to be understood that, in the present specification, expressions such as upper, lower, and bottom are described with reference to the drawings in the drawings, and the expressions may be differently expressed if the direction of the corresponding object is changed. On the other hand, in the present specification, the left-right direction may be the x-axis direction (x-axis direction) of fig. 1, 4, and 5₁Is the right side, x₂Is the left side). The front-rear direction may be the y-axis direction (y) in fig. 1, 6, 7, and 9₁Is the front side, y₂Is the rear side), the up-down direction may be the z-axis direction (z-axis direction) of fig. 1, 4 to 7, and 9₁Is the upper side, z₂Is the lower side). The θ axis direction may be a direction rotating with the z axis direction of fig. 1 as a central axis. In addition, the horizontal direction may be one or a combination of the x-axis direction and the y-axis direction. The horizontal position may be a position on a virtual plane in the x-axis direction and the y-axis direction. In addition, the vertical direction may be a z-axis direction. In addition, the vertical position may be a position on a virtual straight line in the z-axis direction.

Hereinafter, a specific structure of a transfer device 1 capable of aligning a pattern according to an embodiment of the present invention will be described with reference to the drawings.

Hereinafter, referring to fig. 1, 4 and 5, the transfer device 1 capable of aligning a pattern according to an embodiment of the present invention may press (press) the mold 10 and the substrate 20 against each other, thereby pressing each other to transfer the pattern formed at the mold 10 to the resin formed at the substrate 20. Here, the meaning of transferring the pattern to the resin may be that the pattern (not shown) formed on the mold 10 is transferred to the resin formed on the substrate 20. The meaning of transferring the mold 10 to the substrate 20 may be that of transferring the pattern formed on the mold 10 to the resin formed on the substrate 20.

In addition, the transfer device 1 capable of aligning the pattern may align the relative horizontal position between the mold 10 and the substrate 20 before transferring the pattern to the resin so that the mold 10 and the substrate 20 are located at a target position. Here, the target positions of the mold 10 and the substrate 20 may mean horizontal positions of the mold 10 and the substrate 20 in a state where a positioning mark 11 described later and a positioning key 21 described later are arranged to match each other when the mold 10 and the substrate 20 are viewed from above.

In this manner, the transfer device 1 capable of aligning the pattern has an effect of aligning the horizontal position so that the mold 10 and the substrate 20 can be located at predetermined target positions before transferring the pattern of the mold 10 to the resin of the substrate 20. In addition, the pattern can be accurately transferred to a predetermined target position of the resin.

The mold 10 may be supported by a transfer device 1 capable of aligning a pattern. In addition, the mold 10 may be an opaque mold made of an opaque material, but is not limited thereto. Further, a pattern of the resin to be transferred to the substrate 20 may be formed on one surface of the mold 10.

Referring to fig. 2, a positioning mark 11 may be formed on the mold 10, and the positioning mark 11 may be a reference for performing alignment so as to be located at a predetermined target position together with the substrate 20. For example, the pattern may be disposed on the lower side of the mold 10 to face the lower side as the mold 10 is supported by the first pressing unit 100 described later.

The positioning mark 11 may be formed on one or more of the lower side and the upper side of the mold 10.

In addition, the pattern may be formed at the lower side than the positioning mark 11.

The positioning mark 11 may be provided in plurality in the mold 10. In addition, the positioning mark 11 may include a first positioning mark 11a and a second positioning mark 11b spaced apart from the first positioning mark 11 a.

The imaging unit 300, which will be described later, can recognize the positioning mark 11 as recognizing one or more of the lower side and the upper side of the mold 10.

The substrate 20 may be supported by the transfer device 1 capable of aligning the pattern. The substrate 20 may be an opaque substrate made of an opaque material, but is not limited thereto. For example, the impermeable substrate may be a silicon wafer, a metal vapor deposition wafer, or the like. In addition, a resin to which a pattern is to be transferred may be formed on one surface of the substrate 20. In addition, the resin may be formed by coating on the surface of the substrate 20.

Referring to fig. 3, a positioning key 21 may be formed in the substrate 20 at a position corresponding to a position where the positioning mark 11 is formed, and the positioning key 21 may be a reference for aligning so as to be located at a predetermined target position together with the mold 10. For example, as the substrate 20 is supported by the second pressing unit 200 described later, the resin is disposed on the upper side of the substrate 20 so as to face upward.

The positioning key 21 may be formed on one or more of the upper and lower sides of the substrate 20. In addition, the resin may be formed at an upper side than the positioning key 21.

The positioning key 21 may be formed in plurality on the substrate 20. In addition, the positioning keys 21 may include a first positioning key 21a corresponding to the first positioning mark 11a and a second positioning key 21b corresponding to the second positioning mark 11b and spaced apart from the first positioning key 21 a.

The imaging unit 300, which will be described later, can recognize the positioning key 21 by recognizing one or more of the upper side and the lower side of the substrate 20.

The positioning marks 11 and the positioning keys 21 may be formed in patterns corresponding to each other. For example, the positioning marks 11 may be formed in a cross pattern. In addition, the positioning key 21 may be formed in a shape in which a plurality of quadrangles are arranged to form a space in which the positioning mark 11 can be located when viewed from the upper side.

The positioning mark 11 and the positioning key 21 may be used as a reference for determining whether the mold 10 and the substrate 20 are located at the target positions. For example, if the positioning mark 11 overlaps at least a portion of the positioning key 21, or is not adjacent to the positioning key 21, the mold 10 and the substrate 20 may not be at the target position. As another example, the mold 10 and the substrate 20 may be in the target position when the alignment marks 11 are matingly located between the alignment keys 21.

Referring to fig. 4 and 5, the transfer device 1 capable of aligning a pattern may include a first pressing unit 100, a second pressing unit 200, an image pickup part 300, a UV irradiation part 400, a driving part 500, and a control part 600.

The following is a description about the first pressing unit 100.

The first pressing unit 100 may support the mold 10. In addition, the second pressing unit 200 may support the substrate 20. In addition, either one of the first pressing unit 100 and the second pressing unit 200 may move toward the other. In other words, either one of the first pressing unit 100 and the second pressing unit 200 can be moved in the vertical direction. In addition, one or more of the first pressing unit 100 and the second pressing unit 200 may align the horizontal position based on the positioning mark 11 and the positioning key 21 moving in the horizontal direction so that the mold 10 and the substrate 20 are positioned at the target position. In addition, one or more of the first and second

pressing units

100 and 200 may be lifted and lowered to press the mold 10 and the substrate 20 aligned in a horizontal position against each other, thereby accurately transferring the pattern to a target position of the resin.

The first pressing unit 100 includes a mold support 110, a UV transmission window 120, a sealing part 130, a first exhaust part 140, a sealing part sealing member 150, and a support moving part (not shown).

Referring again to fig. 6-9, a mold support 110 may be provided for supporting the mold 10. For example, the mold 10 may be supported by the mold support 110 such that the pattern faces the lower side.

The mold support 110 may include a mold clamp 111, a clamp 112, a clamp mover 113, and a mover support 114.

The mold clamp 111 may support the mold 10. In addition, the mold holder 111 may be partially opened such that the central portion of the mold 10 is exposed toward the substrate 20. Here, the central portion of the mold 10 exposed through the mold holder 111 may mean a portion where a pattern is formed in the mold 10 or a portion of the mold 10 supported by a UV transmission window 120 described later. In addition, the mold cramp 111 may support an edge portion of the mold 10. Accordingly, the mold clamp 111 may secure the mold 10 against the mold clamp 111 by exposing the center portion of the mold 10 and supporting the edge of the mold 10. The mold clamp 111 may be supported between the clamp 112 and the closing portion 130, and may be slidably removed from between the clamp 112 and the closing portion 130.

The mold chuck 111 may be provided with a chuck closing member 111 a.

As shown in fig. 8, the jig sealing member 111a may be disposed on the bottom surface of the mold jig 111 and may be in contact with a bellows seal member 241 disposed at one end of a bellows 240, which will be described later, in contact with the mold jig 111. Further, the jig sealing member 111a is in contact with the bellows seal member 241, and thus, gas can be prevented from flowing between the mold jig 111 and one end of the bellows 240. In addition, the jig closing member 111a may include a planar ring that is fitted into a groove formed in the bottom surface of the mold jig 111.

Referring to fig. 10-13, a description is provided for clamp 112, clamp mover 113, and mover support 114. Fig. 10 is an exploded perspective view of the mold support 110. Fig. 11 shows a state in which the clamp 112 is moved downward so that the mold holder 111 can slide into the space between the clamp 112 and the sealing part 130. Fig. 12 is a perspective view showing a state in which the mold cramp 111 is mounted on the cramp 112 by moving to a space between the cramp 112 and the sealing portion 130.

Fig. 13 and 14 are a side enlarged view and a front view showing that the mold chuck 111 is interposed between the clamp 112 and the sealing part 130 so that the upper surface of the mold chuck 111 is in contact with the sealing part 130. .

The clamp 112 may support an edge of the mold clamp 111 to fix the mold clamp 111 to the first pressing unit 100 side.

The clamp 112 may include a slide member 112a supporting the mold cramp 111 and a clamp body 112b supporting the slide member 112 a.

The slide member 112a may be supported by the caliper body 112b in a state of being spaced apart from the sealing portion 130 by a predetermined distance in the vertical direction. Therefore, a space for inserting the mold cramp 111 may be provided between the sliding member 112a and the closing part 130.

The clamp mover 113 may move the clamp 112 in an up-and-down direction. For example, the clamp mover 113 may be supported by the mover support 114 to move the slide member 112a and the clamp body 112b in the up-down direction.

Mover support 114 may be supported by enclosure 130 to support clamp mover 113. For example, mover supporter 114 may be attached to a side surface of enclosure 130 to support clamp mover 113.

Hereinafter, a process of slidably inserting the mold holder 111 between the clamp 112 and the sealing portion 130 will be described.

First, as shown in fig. 11, the clamp mover 113 moves the clamp 112 in the lower direction. When the clamp 112 moves in the lower direction, the distance between the clamp 112 and the sealing portion 130 in the vertical direction increases.

In this state, as shown in fig. 12, the mold holder 111 is placed on the slide member 112a by sliding from the external space to the space between the clamp 112 and the sealing part 130. In addition, in order to place the mold cramp 111 on the cramp 112, the sliding direction may be the front-back direction.

Thereafter, as shown in fig. 13 and 14, the clamp 112 is moved in the upper direction by the clamp mover 113. When the clamp 112 moves in the upward direction, the mold holder 111 may be interposed between the clamp 112 and the sealing portion 130 and fixed so as to contact the sealing portion 130 by the upward movement of the clamp 112.

In this way, the edge of the mold holder 111 is pressed and fixed by the sealing part 130 via the clamp 112, and thus the mold holder has an effect of preventing an arbitrary movement between the clamp 112 and the sealing part 130,

on the other hand, the process of removing the mold cramp 111 from between the clamp 112 and the closing part 130 may be performed in the reverse order of the above-described process of slidably inserting the mold cramp 111.

Referring to fig. 6 to 8 again, the UV transmission window 120 may be configured to transmit UV irradiated from the UV irradiation part 400. In addition, the bottom surface of the UV transparent window 120 may support the mold 10. In addition, the UV transmission window 120 may be surrounded by the sealing part 130 to be cut off from the outside.

The sealing portion 130 may seal the periphery of the UV transmission window 120 from the outside. In other words, the sealing part 130 is provided to surround the UV transmission window 120 so that the UV transmission window 120 can be cut off from the outside. The lower part of the sealing part 130 may contact the mold holder 111. For example, the sealing portion 130 may be a ring shape having a portion protruding to contact the mold cramp 111.

The sealing part 130 may be provided such that a portion of the sealing part 130 is spaced apart from the UV transmission window 120. Therefore, a predetermined space S can be formed between the sealing part 130 and the UV transmission window 120. In addition, the separate space S may communicate with the first exhaust portion 140. In addition, when the lower side of the sealing part 130 contacts the upper side of the mold chuck 111, the gas remaining inside the partitioned space S may be exhausted to the outside through the first exhaust part 140. The lower side of the sealing portion 130 contacts the upper side of the mold holder 111 to seal the partitioned space S. Therefore, as the sealing portion 130 comes into contact with the upper side of the mold chuck 111, the air in the partitioned space S can be discharged and the air can be prevented from flowing in from the outside.

Since the flow of air into the substrate 20 can be shut off by forming the partitioned space S in a vacuum state in this manner, the periphery of the UV transmission window 120 can be effectively sealed from the outside.

The first exhaust part 140 may exhaust the gas between the UV transmission window 120 and the closed part 130 to the outside. In other words, when the sealing part 130 seals the space around the UV transmission window 120 from the outside, the first exhaust part 140 may exhaust the gas remaining inside the partitioned space S to the outside. In addition, the first exhaust part 140 may include a nozzle exposed at an inner circumferential surface of the closed part 130.

The sealing member 150 can block the gas from flowing between the mold holder 111 and the sealing part 130. In addition, the sealing part sealing member 150 may be positioned between the mold cramp 111 and the sealing part 130. In addition, the sealing part sealing member 150 may include an elastic ring embedded in a groove concavely formed along an upper side in the bottom surface of the sealing part 130.

The support moving part (not shown) may move the mold support 110 in the horizontal direction so that the center position of the mold 10 is moved in the horizontal direction. For example, when the substrate 20 has a relatively larger area than the mold 10, the supporter moving part may move the mold supporter 110 to move the mold 10 from one point to another point on the upper side of the substrate 20, partially sequentially transferring the pattern of the mold 10 to the substrate 20 having a larger area than the mold 10.

The following is a description about the second pressing unit 200.

Referring to fig. 4 and 5, the second pressing unit 200 may support the substrate 20 and adjust the position of the substrate 20. In other words, the second pressing unit 200 may be aligned with the horizontal position of the substrate 20.

The second pressing unit 200 may approach the substrate 20 toward the mold 10. In other words, the second pressing unit 200 may move the substrate 20 in the vertical direction.

The second pressing unit 200 may include a substrate seating portion 210, an adjustment portion 220, an elevating portion 230, a bellows 240, a second exhaust portion 250, a bellows moving portion 260, an imaging guide portion 280, and a reflection portion 290.

Referring again to fig. 15, the substrate seating part 210 may provide a portion for seating the substrate 20. The substrate mounting portion 210 may include a support region for supporting the lower portion of the substrate 20. In addition, the substrate mounting portion 210 may be formed with an imaging path 210a extending in the vertical direction such that one end portion is disposed in the support region.

The photographing path 210a may include a first path portion 210a-1 and a second path portion 210a-2 lower than the first path portion 210 a-1. The lower imaging unit 320 can recognize the positioning key 21 of the substrate 20 described later through the imaging path 210 a.

The substrate seating part 210 may include a seating part body 211, a shielding window 213, and a shielding member 214.

The seating part body 211 may support the substrate 20. In addition, a photographing path 210a may be formed in the seating part body 211. In addition, the seating part body 211 may be supported by the positioning part 220 shown in fig. 5.

The seating part body 211 may include an upper seating part 211a and a lower seating part 211 b.

The upper mounting portion 211a is disposed above the lower mounting portion 211b and includes a support region for supporting the substrate 20. In addition, the upper seating portion 211a may form the first path portion 210 a-1. In addition, the first path portion 210a-1 may penetrate the upper seating portion 211a in the vertical direction. In addition, one end portion of the first path portion 210a-1 may be provided at a support region of the upper seating portion 211 a.

The lower seating portion 211b may support the upper seating portion 211 a. In addition, a second path portion 210a-2 may be formed in the lower seating portion 211 b. In addition, the second path portion 210a-2 may penetrate the lower seating portion 211b in the up-down direction. In addition, the second path portion 210a-2 may be connected to the first path portion 210a-1 and not connected to the first path portion 210a-1 through the shielding window 213.

The shielding window 213 can block the flow of gas in the imaging path 210 a. In addition, the shield window 213 may include a first shield window 213a and a second shield window 213 b.

The first shielding window 213a may cut off the inflow of gas inside the first path portion 210a-1 between the upper seating portion 211a and the lower seating portion 211 b. In addition, the first shielding window 213a may be disposed in the first path portion 210 a-1.

The second shielding window 213b may cut off the inflow of gas inside the second path portion 210a-2 between the upper seating portion 211a and the lower seating portion 211 b. The second shielding window 213b may be disposed in the second path portion 210a-2, spaced apart from the first shielding window 213a in the vertical direction. In other words, the first and

second shielding windows

213a and 213b may be disposed to be spaced apart from each other.

In this way, the first shielding window 213a and the second shielding window 213b are spaced apart from each other, so that damage to each other can be prevented, and the mounting portion body 211 can be maintained horizontal. In addition, since the first and

second shielding windows

213a and 213b are spaced apart from each other without contact, even if the position of the upper seating part 211a with respect to the lower seating part 211b is adjusted or shaken with the movement of the seating part body 211 in order to align the level of the seating part body 211, there is an effect of preventing one or more of the first and

second shielding windows

213a and 213b from being worn out due to friction.

The shielding member 214 can block the gas from flowing between the shielding window 213 and the mounting portion body 211. Further, the shielding member 214 may be disposed between the shielding window 213 and the mounting portion body 211. In addition, the horizontal direction length of the shielding member 214 may be formed to be greater than the horizontal direction length of the photographing path 210 a. In other words, the radius of the shielding member 214 may be formed larger than the radius of the photographing path 210a of a portion adjacent to the shielding member 214 with respect to the center of the photographing path 210 a.

Thus, the following effects are provided: since the shielding member 214 is formed to be large and does not interfere with the imaging path 210a, it is possible to seal between the shielding member 214 and the mounting portion body 211 while securing a large imaging space passing through the shielding window 213 at a level equal to the width of the imaging path 210 a.

The shielding member 214 may include a first shielding member 214a and a second shielding member 214 b.

The first shielding member 214a may prevent gas from flowing into between the first shielding window 213a and the first path portion 210 a-1. In addition, the first shielding member 214a may be disposed between the first shielding window 213a and the upper seating portion 211 a. In addition, the first shield member 214a may include an elastic ring formed along a circumference of the first shield window 213 a.

The second shielding member 214b may prevent gas from flowing in between the second shielding window 213b and the second path portion 210 a-2. In addition, the second shielding member 214b may be disposed between the second shielding window 213b and the lower seating portion 211 b. In addition, the second shield member 214b may include an elastic ring formed along a circumference of the second shield window 213 b.

Referring to fig. 4 to 7 and 9, the positioning portion 220 may adjust a horizontal position of the substrate seating portion 210. For example, the positioning unit 220 may move the substrate mounting unit 210 in the front-rear-left-right direction (horizontal direction) and may rotate the substrate mounting unit 210. Accordingly, the positioning part 220 may align the mold 10 and the substrate 20 to be located at a target position by adjusting the position of the substrate seating part 210. In addition, when the one end of the bellows 240 is in a contact state, that is, a contact state with the first pressing unit 100, the positioning part 220 may readjust the horizontal position of the substrate seating part 210.

The adjustment section 220 may be an Alignment stage (Alignment stage). For example, the positioning portion 220 may be an xy θ stage that forms a moving work by a plurality of modules that operate independently (i.e., a moving work in the x-axis direction, the y-axis direction, and the θ -axis direction by the independent operation of each module that moves in the x-axis direction, the y-axis direction, and the θ -axis direction). As another example, the positioning unit 220 may be a uvw stage that performs a moving operation by a plurality of modules that cooperate with each other (i.e., performs a moving operation in the x-direction, the Y-direction, and the θ -direction by a combination of operations of the respective modules that move along the u-axis, the v-axis, and the w-axis).

The positioning unit 220 may be positioned above the elevating unit 230 and may be elevated by the elevating unit 230.

The adjustment section 220 may include a first adjustment section 221, a second adjustment section 222, and a third adjustment section 223.

The first, second, and third adjusting

parts

221, 222, and 223 may be modules that move along the u, v, and w axes of the uvw stage that adjusts the horizontal position of the substrate mounting part 210. Even in a state where one end of the bellows 240 is in contact with the first pressing unit 100, the first, second, and third adjusting

portions

221, 222, and 223 can move the substrate mounting portion 210 in the front-rear direction (y-axis direction) and can rotate in the left-right direction (x-axis direction).

In this way, the positioning portion 220 has an effect of adjusting the horizontal position of the substrate mounting portion 210 based on the positioning mark 11 and the positioning key 21 so that the mold 10 and the substrate 20 can be aligned to be located at the target position. In addition, when the bellows 240 is in the contact state, there is an effect that the relative position between the mold 10 and the substrate 20 can be more accurately adjusted by adjusting the horizontal position of the substrate 20 again.

The elevating part 230 may elevate the substrate seating part 210. For example, the elevating part 230 may move the substrate seating part 210 in a direction perpendicular to the bottom surface. In addition, the elevating part 230 may elevate the substrate seating part 210 so as to approach the substrate 20 toward the first pressing unit 100 or to separate the substrate from the first pressing unit 100. In addition, the elevating portion 230 may move the substrate 20 toward the first pressing unit 100 side, thereby pressing the substrate 20 to the mold 10.

The bellows 240 may be configured to seal a space around the substrate 20 from the outside. Stated differently, the bellows 240 may seal the space around the substrate 20 from the outside by being elongated.

The bellows 240 may have a plurality of folds in order to expand and contract toward the first pressing unit 100 when pressing the mold 10 and the substrate 20. The bellows 240 may be provided such that one end thereof is extendable and retractable toward the first pressing unit 100 and the other end thereof is supported by the substrate mounting portion 210. For example, the bellows 240 may be elongated toward the first pressing unit 100, and at this time, an upper end portion of the bellows 240 may be in contact with the first pressing unit 100. In this way, when the bellows 240 is in a state of being in contact with the first pressing unit 100, the substrate 20 may be cut off from the outside. As another example, the extended bellows 240 may be contracted again. As such, when the bellows 240 is in a state of being contracted toward the substrate 20, the substrate 20 may be exposed to the outside.

The bellows 240 may be elastically deformed in a contact state to allow adjustment of the horizontal position of the substrate seating part 210.

As shown in fig. 15, a bellows seal part 241 may be provided at one end of the bellows 240.

When the bellows 240 is in a contact state, the bellows seal member 241 may contact the jig sealing member 111a in order to prevent gas from flowing between the mold jig 111 and one end of the bellows 240. In addition, the bellows seal member 241 and the clamp closing member 111a may be formed in different shapes from each other, having different frictional forces from each other. In this manner, since the bellows seal member 241 and the jig sealing member 111a are formed in different shapes and have different frictional forces from each other, the substrate seating portion 210 can be horizontally moved when the bellows 240 is in a contact state, and thus one end portion of the bellows 240 also slides in the mold jig 111. For example, the bellows seal part 241 may include an O-ring embedded in a groove formed at one end (e.g., an upper end) of the bellows 240.

In this way, when the bellows 240 is in a contact state, the positioning portion 220 moves, and the bellows seal member 241 slides in a state of being in contact with the jig sealing member 111a, thereby preventing gas from flowing in, and preventing the bellows 240 from being excessively elastically deformed.

When the bellows 240 seals the space around the substrate 20 from the outside, the second exhaust part 250 may exhaust gas remaining in the space sealed inside the bellows 240 to the outside. In addition, the second exhaust part 250 exhausts the gas remaining in the space sealed inside the bellows 240 to the outside, so that the space around the substrate 20 can be maintained in a vacuum state. In addition, the second exhaust part 250 may include a nozzle exposed at the inner side of the bellows 240.

The first exhaust part 140 and the second exhaust part 250 can prevent the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range.

In this way, the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 is prevented from exceeding the predetermined range, and the difference between the pressures applied to the upper side and the lower side of the mold 10 is prevented from exceeding the predetermined range, so that the mold 10 is prevented from being bent finally.

Referring to fig. 16 to 19, the bellows moving part 260 may be supported by the outer surface of the substrate seating part 210 and connected to the bellows 240 to expand and contract the bellows 240. In other words, the bellows moving portion 260 may convert the bellows 240 into a contact state or a contracted state.

The bellows moving part 260 may include a lifting cylinder 261, a block 262, and a bellows connecting part 263.

The lift cylinder 261 may include a shaft 261a and a cylinder actuator 261b providing a driving force for moving the shaft 261a in the up-down direction.

The elevation cylinder 261 may be supported by an outer surface of the substrate seating portion 210. In other words, the elevation cylinder 261 may be supported by the outer surface of the lower seating portion 211 b.

The block 262 may be provided at an end of the shaft 261a to move together with the shaft 261 a.

The bellows connection portion 263 may support the block 262 to allow the block 262 to move in a horizontal direction. In addition, a seating groove 263a extending in a horizontal direction to seat the block 262 and a receiving groove 263b extending in an up-down direction to communicate with a lower side of the seating groove 263a and to surround the shaft 261a with a predetermined gap may be formed in the bellows connecting portion 263. For example, the predetermined gap of the receiving groove 263b may be 0.4mm or more and 0.5mm or less. In addition, when the horizontal position of the substrate seating portion 210 is adjusted in a state where the bellows 240 is in contact, the shaft 261a may be moved in the horizontal direction in the receiving groove 263 b. In other words, in the contact state, the substrate seating portion 210 is horizontally moved below the predetermined gap by the positioning portion 220.

Referring again to fig. 15, one side of the imaging guide 280 may communicate with the imaging path 210a, and the other side opposite to the one side may be connected to a lower imaging unit 320 described later. In addition, at least a portion of the photographing guide 280 may be located at a lower side than the substrate seating part 210. In addition, the photographing guide 280 may be arranged in a direction shifted from the vertical direction. For example, the photographing guide 280 may be formed in a direction perpendicular to a direction in which the photographing path 210a is formed. The lower imaging unit 320, which will be described later, can image the lower side of the substrate 20 through the imaging guide 280 and the imaging path 210 a.

The photographing guide 280 may include a reflection part 290 on an inner surface of the photographing guide 280, and the reflection part 290 may be used to effectively recognize the lower side of the substrate 20 by the lower photographing part 320, which will be described later.

The reflection unit 290 may be disposed between the imaging guide 280 and the imaging path 210a, and may reflect the image of the positioning mark 11 to enter the lower imaging unit 320, which will be described later. For example, the reflection unit 290 may be a mirror that can reflect light. As a more detailed example, the reflection unit 290 may reflect the light emitted along the photographing path 210a to be emitted along the photographing guide unit 280. In this way, even if the imaging path 210a and the imaging guide 280 are arranged in a staggered manner, the reflection unit 290 can reflect the image of the positioning key 21 so that the lower imaging unit 320, which will be described later, can recognize the positioning key 21. In other words, the lower imaging unit 320 described later can recognize the positioning key 21 through the reflection unit 290.

The following is a description of the imaging unit 300.

The photographing part 300 may recognize the positioning mark 11 of the mold 10 and the positioning key 21 of the substrate 20. For example, the photographing part 300 may be a camera that photographs the positioning mark 11 and the positioning key 21. In addition, the photographing part 300 may recognize the positioning mark 11 and the positioning key 21 at the same time, or recognize one of the positioning mark 11 and the positioning key 21 first and recognize the other based on this. Therefore, the error between the positioning mark 11 and the positioning key 21 with respect to the target position can be confirmed by the photographing part 300 recognizing the positions of the positioning mark 11 and the positioning key 21.

In this way, the image capturing unit 300 recognizes the relative position between the first positioning mark 11a and the first positioning key 21a and the relative position between the second positioning mark 11b and the second positioning key 21b, and thus has an effect that the image capturing unit 300 complementarily recognizes the positions and can more accurately recognize whether the mold 10 and the substrate 20 are located at the target positions.

The imaging unit 300 is configured to adjust one or more of the horizontal position, the vertical position, and the angle so that the angle of view is directed to the position where the positioning mark 11 and the positioning key 21 are formed.

The image pickup section 300 may be configured to have a first focal length to identify the positioning mark 11 and a second focal length to identify the positioning key 21, and the focal length may be changed to the first focal length or the second focal length. For example, the focal length of the imaging unit 300 may be changed from the first focal length to the second focal length in order to recognize the positioning key 21 after recognizing the positioning mark 11.

Based on the recognition of the positioning mark 11 and the positioning key 21 of the imaging unit 300, one or more of the first pressing unit 100 and the second pressing unit 200 can be moved to align the horizontal positions of the mold 10 and the substrate 20.

The photographing part 300 may include an upper photographing part 310 and a lower photographing part 320.

The upper image pickup unit 310 can recognize one or more of the positioning mark 11 and the positioning key 21. For example, when the mold 10 is made of an opaque material so that light cannot pass through between the positioning mark 11 and the positioning key 21, the upper image pickup unit 310 can recognize the positioning mark 11 of the mold 10. As another example, when the mold 10 is made of an opaque material and light is transmitted between the positioning mark 11 and the positioning key 21, the upper image pickup unit 310 can recognize all of the positioning mark 11 and the positioning key 21.

The upper image pickup unit 310 is movable in the horizontal direction between an image pickup position and a non-image pickup position to recognize one or more of the positioning mark 11 and the positioning key 21. For example, the upper image pickup unit 310 may move to an image pickup position for recognizing one or more of the positioning mark 11 and the positioning key 21. Here, as shown in fig. 6, the photographing position may mean: the upper image pickup unit 310 is disposed at a predetermined position above the mold 10 and the substrate 20 in order to recognize the positioning mark 11 and the positioning key 21. As another example, the upper image pickup unit 310 may move to a non-image pickup position where the positioning mark 11 and the positioning key 21 are not recognized. Here, as shown in fig. 7, the non-shooting position may mean: the upper imaging unit 310 is disposed to move in the horizontal direction from an imaging position, that is, a predetermined position above the mold 10 and the substrate 20 so as not to recognize the positioning mark 11 and the positioning key 21. In addition, the non-shooting position may mean a position spaced apart from the shooting position in the horizontal direction.

The upper photographing part 310 may be formed in plurality. In addition, the upper photographing part 310 may include a first upper photographing part and a second upper photographing part. The first upper image pickup unit may recognize one or more of the first positioning mark 11a and the first positioning key 21 a. The second upper imaging unit may recognize one or more of the second positioning mark 11b and the second positioning key 21 b.

The lower imaging unit 320 may perform imaging through the imaging path 210a of the substrate mounting unit 210 in order to recognize one or more of the positioning mark 11 and the positioning key 21. In addition, when the upper photographing part 310 recognizes one of the positioning mark 11 and the positioning key 21, the lower photographing part 320 may recognize the other through the photographing path 210a of the substrate mounting part 210. For example, when the substrate 20 is made of an opaque material so that light cannot pass through between the positioning mark 11 and the positioning key 21, the positioning key 21 of the substrate 20 can be recognized. As another example, when the substrate 20 is made of a transparent material and light is transmitted between the positioning mark 11 and the positioning key 21, the lower imaging unit 320 can recognize all of the positioning mark 11 and the positioning key 21 through the imaging path 210 a.

As shown in fig. 5, the lower imaging unit 320 may be disposed below the upper imaging unit 310 and connected to the second pressing unit 200. For example, the lower photographing part 320 may be connected to the lower side of the substrate seating part 210. Therefore, when the substrate mounting portion 210 moves through the positioning portion 220 and the elevating portion 230, the lower photographing portion 320 can move together. In other words, if the mold 10 moves horizontally or the mold 10 moves vertically, the lower photographing part 320 may move together.

The lower photographing part 320 may be formed in plurality. In addition, the lower photographing part 320 may include a first lower photographing part and a second lower photographing part. The first lower imaging unit may recognize one or more of the first positioning mark 11a and the first positioning key 21 a. The second lower imaging unit can recognize one or more of the second positioning mark 11b and the second positioning key 21 b.

Although the imaging unit 300 includes the upper imaging unit 310 and the lower imaging unit 320, the present invention is not limited to this, and the imaging unit 300 may include only one of the upper imaging unit 310 and the lower imaging unit 320. For example, when only one of the upper image pickup unit 310 and the lower image pickup unit 320 is included, the included one can recognize all of the positioning mark 11 and the positioning key 21. As another example, when both the upper image pickup unit 310 and the lower image pickup unit 320 are included, the upper image pickup unit 310 may recognize one of the positioning mark 11 and the positioning key 21, and the lower image pickup unit 320 may recognize the other.

In this way, even if the mold 10 is an opaque mold or the positioning key 21 is formed below the opaque substrate, the mold 10 and the substrate 20 can be positioned at the target position by the imaging unit 300.

The following is a description of the UV irradiation section 400.

The UV irradiation unit 400 may irradiate UV to the resin formed on the substrate 20 in order to cure the resin.

The UV irradiation section 400 may be moved in the horizontal direction between an irradiation position and a non-irradiation position in order to irradiate UV to the resin. For example, the UV irradiation section 400 may be moved to an irradiation position for irradiating UV to the resin. Here, as shown in fig. 7, the irradiation position may mean: the UV irradiation unit 400 is disposed at a predetermined position above the mold 10 and the substrate 20 to irradiate the resin with UV. In addition, the irradiation position may mean: the second pressing unit 200 is in a state of ascending toward the first pressing unit 100. As another example, the UV irradiation section 400 may be moved to a non-irradiation position for not irradiating UV. Here, as shown in fig. 6, the non-irradiation position may mean: the UV irradiation unit 400 is disposed at a position spaced apart from the irradiation position, that is, a predetermined position above the mold 10 and the substrate 20 so as not to irradiate the resin with UV. In addition, the non-irradiation position may mean a position spaced apart from the irradiation position in the horizontal direction.

The UV irradiation part 400 and the upper photographing part 310 may be spaced apart in a horizontal direction. In addition, the UV irradiation part 400 and the upper photographing part 310 may be located at an upper side of the first pressing unit 100.

The following is a description of the driving unit 500.

Referring again to fig. 1, 4, 6, 7, 9, and 18, the driving part 500 may move the upper photographing part 310 in the horizontal direction between the photographing position and the non-photographing position. In addition, the driving part 500 may move the UV irradiation part 400 in the horizontal direction between the irradiation position and the non-irradiation position.

The driving part 500 may include a support 510 and a support actuator 520.

The support 510 may support the upper imaging unit 310 and the UV irradiation unit 400. Further, when the support 510 moves horizontally, the upper image pickup unit 310 and the UV irradiation unit 400 may move horizontally together.

The support actuator 520 may move the upper image pickup unit 310 and the UV irradiation unit 400 together in the horizontal direction by moving the support 510 in the horizontal direction. For example, the support actuator 520 may move the upper image pickup unit 310 to the image pickup position so that the upper image pickup unit 310 recognizes one or more of the positioning mark 11 and the positioning key 21. In this case, the support actuator 520 may move the UV irradiation section 400 to the non-irradiation position. As another example, the support actuator 520 may move the UV irradiation section 400 to the imaging position so that the UV irradiation section 400 irradiates the resin with UV. In this case, the support actuator 520 can move the upper image pickup unit 310 to the non-image pickup position.

The support actuator 520 may include a ball screw motor, and the support 510 may be moved in a horizontal direction by the driving of the ball screw motor. In addition, the upper photographing section 310 may be selectively moved to the photographing position by the support actuator 520 or the UV irradiation section 400 may be selectively moved to the irradiation position by the support actuator 520. Further, the support actuator 520 can selectively move the upper image pickup portion 310 to the image pickup position or the UV irradiation portion 400 to the irradiation position, so that the upper image pickup portion 310 and the UV irradiation portion 400 can be operated in a state of being disposed at predetermined positions on the upper sides of the mold 10 and the substrate 20, respectively, without interfering with each other.

The following is a description of the control unit 600.

The control part 600 may control operations of the first pressing unit 100, the second pressing unit 200, the photographing part 300, the UV irradiation part 400, and the driving part 500.

The control unit 600 may control one of the first pressing unit 100 and the second pressing unit 200 to move toward the other. In other words, the control unit 600 may drive one or more of the first pressing unit 100 and the second pressing unit 200 in order to bring the mold 10 and the substrate 20 closer to each other. For example, the controller 600 may control the elevating unit 230 of the second pressing unit 200 to elevate the substrate 20.

The control part 600 may control the photographing part 300 to recognize the positioning mark 11 and the positioning key 21. In other words, the control unit 600 can control to recognize the positioning mark 11 and the positioning key 21 by controlling one or more of the upper image pickup unit 310 and the lower image pickup unit 320. For example, when light passes through between the positioning mark 11 and the positioning key 21, the upper or lower photographing

part

310 or 320 may recognize the positioning mark 11 and the positioning key 21 as a whole, and the control part 600 controls the first and second

pressing units

100 and 200. As another example, when light does not pass through between the positioning mark 11 and the positioning key 21, the upper photographing part 310 may recognize the positioning mark 11 and the lower photographing part 320 may recognize the positioning key 21, thereby controlling the first and second

pressing units

100 and 200.

The control part 600 may control the positioning part 220 to adjust the horizontal position of the substrate seating part 210. The control unit 600 may control one or more of the first adjustment unit 221, the second adjustment unit 222, and the third adjustment unit 223 to adjust the horizontal position of the substrate 20.

The control part 600 may control the driving part 500 such that the UV irradiation part 400 is located at the irradiation position in order to irradiate UV to the resin, and the control part 600 may control the driving part 500 such that the photographing part 300 moves to the non-photographing position. The control unit 600 may control the driving unit 500 so that the upper imaging unit 310 is located at the imaging position and the UV irradiation unit 400 is moved to the non-irradiation position in order to allow the imaging unit 300 to recognize the positioning mark 11 and the positioning key 21.

On the other hand, when the mold 10 is moved horizontally by the positioning portion 220, the control portion 600 can control so that the imaging portion 300 continuously recognizes the positioning mark 11 and the positioning key 21. For example, when the substrate seating part 210 moves horizontally, the upper photographing part 310 is fixed to the upper side of the mold 10 to continuously recognize the positioning mark 11. As another example, the lower photographing part 320 may continuously recognize the position keys 21 by being fixed to the lower side of the substrate seating part 210 to horizontally move together with the substrate seating part 210. In this way, while the positioning marks 11 and the positioning keys 21 are continuously recognized, the control unit 600 can control the positioning unit 220 to quickly move the positioning marks 11 and the positioning keys 21 to the target positions.

The control part 600 may control the elevating part 230, the photographing part 300, and the positioning part 220 such that when the substrate 20 is elevated to a predetermined distance by the elevating part 230, the photographing part 300 recognizes the positioning mark 11 and the positioning key 21, and the positioning part 220 adjusts the horizontal position of the substrate seating part 210. The control unit 600 may control the positioning unit 220, the elevating unit 230, and the image capturing unit 300 such that, when the substrate 20 is elevated by more than a predetermined distance by the elevating unit 230, the image capturing unit 300 re-recognizes the positioning mark 11 and the positioning key 21, and the positioning unit 220 re-adjusts the horizontal position of the substrate mounting unit 210.

When the bellows 240 is in the contact state, the control part 600 may control the positioning part 220 in order to readjust the horizontal position of the substrate seating part 210. In addition, the control part 600 may control the positioning part 220 such that the horizontal position of the substrate seating part 210 is adjusted within a smaller moving range when the bellows 240 is in a contact state than when the horizontal position of the substrate seating part 210 is adjusted for the first time. In other words, when the bellows 240 is in the contact state, the control portion 600 may control the positioning portion 220 to move the substrate mounting portion 210 within a minute movement range. In addition, since the range in which the substrate mounting portion 210 can move when the bellows 240 is in the contact state is equal to or less than the predetermined gap of the receiving groove 263b, the minute movement range may be equal to or less than the predetermined gap of the receiving groove 263 b. For example, the minute movement range may be 0.5mm or less.

The effect of the control part 600 re-adjusting the horizontal position of the substrate seating part 210 when the bellows 240 is in the contact state will be described. Even if the positioning part 220 disposes the mold 10 and the substrate 20 at the target position by adjusting the horizontal position of the substrate seating part 210, the position of the substrate seating part 210 may be changed in a predetermined range when one end of the bellows 240 contacts the first pressing unit 100.

In this way, when the bellows 240 is in the contact state, the control part 600 has an effect of being able to precisely adjust the positions of the mold 10 and the substrate 20 by adjusting the horizontal position of the substrate seating part 210 again.

When the mold 10 and the substrate 20 are pressed, the control unit 600 may control the driving unit 500 such that the UV irradiation unit 400 is located at the irradiation position and the upper imaging unit 310 moves to the non-imaging position in order to irradiate UV to the resin by the UV irradiation unit 400. In addition, the control part 600 may control the UV irradiation part 400 such that the UV irradiation part 400 irradiates UV to the resin of the substrate 20 in order to cure the resin.

Hereinafter, a method (S10) of manufacturing a pattern substrate by pressing a mold 10 on which a pattern and positioning marks 11 are formed and a substrate 20 on which a resin and positioning keys 21 are formed, according to an embodiment of the present invention, will be described with reference to fig. 20. Here, the "pattern substrate" is defined as the substrate 20 in which the pattern of the mold 10 is transferred in the resin of the substrate 20.

The method of manufacturing a pattern substrate (S10) may produce the substrate 20 to which the pattern is transferred. In the method of manufacturing a patterned substrate (S10), the mold 10 on which the pattern and the positioning marks 11 are formed may be pressed against the substrate 20 on which the resin and the positioning keys 21 are formed, and the pattern may be transferred to the resin.

The method of manufacturing a pattern substrate (S10) may include a clamp 112 fixing step (S100), a moving step (S200), a lifting step (S300), a photographing step (S400), a first positioning step (S500), a sealing step (S600), a second positioning step (S700), a substrate pressing step (S800), a curing step (S900), a sealing releasing step (S1000), a lowering step (S1100), and a clamp releasing step (S1200).

In the clamp fixing step (S100), the mold chuck 111 may be fixed to the first pressing unit 100 side by the clamp 112. Further, the clamp 112 may fixedly support the mold holder 111, and the mold 10 may be placed in the mold holder 111. In addition, the clamp fixing step (S100) may be performed before the photographing step (S400).

In the moving step (S200), the mold 10 and the upper photographing part 310 may be moved in the horizontal direction.

The moving step (S200) may include a mold horizontal moving step (S210) and a photographing part moving step (S220).

In the mold horizontal movement step (S210), the center position of the mold support 110 for supporting the mold 10 may be moved in the horizontal direction. In other words, in the mold horizontal movement step (S210), the mold 10 may be moved to dispose the mold 10 at a predetermined position on the upper side of the substrate 20 by moving the mold supporter 110 in the horizontal direction. In addition, the mold horizontal movement step (S210) may be performed before the photographing step (S400).

In the photographing section moving step (S220), the upper photographing section 310 may be moved to a photographing position for recognizing the positioning mark 11 and the positioning key 21. In addition, in the photographing section moving step (S220), the upper photographing section 310 may be moved in the horizontal direction by the driving section 500. In addition, the photographing part moving step (S220) may be performed before the photographing step (S400), and may be performed simultaneously with or separately from the mold horizontal moving step (S210).

In the ascending and descending step (S300), the elevating unit 230 may ascend the positioning unit 220 to bring the substrate 20 closer to the first pressing unit 100.

In the photographing step (S400), the photographing part 300 may photograph the positioning mark 11 formed on the mold 10 and the positioning key 21 formed on the substrate 20. In the imaging step (S400), the imaging unit 300 may recognize the positioning mark 11 and the positioning key 21, and the control unit 600 may determine whether the mold 10 and the substrate 20 are located at the target positions based on the image captured by the imaging unit 300.

In the first positioning step (S500), the positioning part 220 may adjust the horizontal position of the substrate 20. In the first positioning step (S500), the control unit 600 may adjust the horizontal position of the substrate 20 so that the positioning marks 11 are positioned between the positioning keys 21, based on the positions of the positioning marks 11 and the positioning keys 21 recognized in the imaging step (S400).

The photographing step (S400) and the first positioning step (S500) may be performed when the substrate 20 is raised by a predetermined distance in the raising and lowering step (S300). In addition, the photographing step (S400) and the first positioning step (S500) may be performed again when the substrate 20 is raised more than a predetermined distance by the raising and lowering step (S300).

In the sealing step (S600), the space around the substrate 20 may be sealed from the outside by the bellows 240, and the gas remaining in the space around the substrate 20 may be exhausted to the outside by the second exhaust part 250. In addition, in the sealing step (S600), the bellows 240 may provide a contact state of contacting the mold chuck 111 by the bellows moving part 260 being extended. The space around the UV transmission window 120 may be sealed from the outside by the sealing unit 130, and the gas remaining in the space around the UV transmission window 120 may be exhausted to the outside by the first exhaust unit 140. In addition, the sealing step (S600) may be performed after the first positioning step (S500) and before the second positioning step (S700).

In the second positioning step (S700), after the sealing step (S600), the positioning part 220 may readjust the horizontal position of the substrate 20. The horizontal moving distance of the substrate 20 moved by the second positioning step (S700) may be a predetermined gap or less between the shaft 261a and the receiving groove 263b surrounding it. In addition, the horizontal movement distance of the substrate 20 moved by the second positioning step (S700) may be smaller than the horizontal movement distance of the substrate 20 moved by the first positioning step (S500).

The second positioning step (S700) may be performed a plurality of times before the substrate pressing step (S800), and the photographing step (S400) may be performed each time the second positioning step (S700) is performed. In addition, the positioning portion 220 may adjust the horizontal position of the substrate 20 through the second positioning step (S700), and the bellows 240 may be elastically deformed in a contact state.

In the substrate pressing step (S700), the elevating unit 230 may raise the positioning unit 220 to press the mold 10 and the substrate 20. At this time, the pattern formed on the mold 10 may be transferred to the resin formed on the substrate 20.

In the curing step (S900), the resin of the substrate 20 may be cured by irradiating UV to the resin by the UV irradiation section 400.

The curing step (S900) may include a UV irradiation portion moving step (S910) and a UV irradiation step (S920).

In the UV irradiation section moving step (S910), the UV irradiation section 400 may be moved to an irradiation position for irradiating UV to the resin. In addition, the UV irradiation section moving step (S910) may be performed after the substrate pressing step (S800).

In the UV irradiation step (S920), the UV irradiation part 400 may irradiate UV to the resin. In this manner, in the UV irradiation step (S920), the resin can be cured by irradiating UV to the resin.

In the seal releasing step (S1000), the gas may be flowed into the space around the substrate 20 to open the space around the substrate 20 to the outside. In addition, the bellows 240 can be contracted by the seal releasing step (S1000). In addition, gas may be flowed into the space around the UV transparent window 120. In addition, the seal releasing step (S1000) may be performed after the substrate pressing step (S800).

In the lowering step (S1100), the positioning unit 220 may be lowered by the raising and lowering unit 230 to separate the positioning unit 220 from the first pressing unit 100.

In the clamp releasing step (S1200), the clamp 112 may be released from the first pressing unit 100 side. The mold holder 111 may be fixedly supported in the clamp 112, and the mold 10 may be placed in the mold holder 111.

On the other hand, in the lowering step (S1100), the substrate 20 may be separated or not separated from the mold 10. For example, the substrate 20 may be lowered together with the positioning portion 220 to separate the substrate 20 from the mold 10. As another example, in a state where the substrate 20 is pressed against the mold 10, the positioning portion 220 is lowered, and in the transfer device 1 capable of aligning the pattern, the substrate 20 may be separated from the mold 10 by being transferred to another separating device. At this time, the mold 10 and the substrate 20 pressed by the mold 10 can be placed in the mold chuck 111 in the clamp releasing step (S1200).

On the other hand, the method of manufacturing a pattern substrate (S10) according to an embodiment of the present invention may be implemented in the form of a computer program for executing the same and stored in a computer-readable recording medium. The computer-readable recording medium may include program commands, data files, data structures, etc. alone or in combination. The program command recorded in the computer-readable recording medium may be specially designed and constructed for the embodiments, or may be well known and available to those skilled in the computer software arts. Examples of the computer-readable recording medium include a magnetic medium (magnetic medium) such as a hard disk, a flexible disk, and a magnetic tape, an optical medium (optical medium) such as a CD-ROM and a DVD, a magneto-optical medium (magnetic-optical medium) such as a floptical disk, and a hardware device (hardware device) such as a Read Only Memory (ROM), a Random Access Memory (RAM), a flash memory, and the like, which is specially configured to store and execute a program command.

For example, the computer program stored in the computer-readable recording medium may be programmed to execute the storing step, the operating step, and the outputting step.

In the storing step, the image information of the positioning mark 11 and the positioning key 21 captured by the capturing unit 300 may be stored in a computer-readable recording medium.

In the calculation step, the position information of the positioning mark 11 and the positioning key 21 may be calculated based on the image information stored in the computer-readable recording medium. For example, the calculated position information may be an error value related to a target position between the positioning mark 11 and the positioning key 21.

In the output step, an operation command for adjusting the position of the mold 10 or the substrate 20 may be output based on the calculated position information. In addition, it may be determined in advance whether the mold 10 and the substrate 20 are located at the target positions based on the position information calculated before the operation command is output, and it may be determined whether to output the operation command for adjusting the position of the mold 10 or the substrate 20 based on the determined information. Here, the determination of whether or not the target position is located may be determined in various ways.

On the other hand, the calculating step may calculate a path value for moving the position of the positioning key 21 calculated from the image information of the positioning key 21 captured by the lower imaging unit 320 to the position of the positioning mark 11 calculated from the image information of the positioning mark 11 captured by the upper imaging unit 310, and the outputting step may output the position adjusting operation command based on the calculated path value from the center position of the image information of the positioning key 21 captured by the lower imaging unit 320. In other words, the lower image pickup unit 320 is fixed to the lower side of the substrate mounting unit 210 and horizontally moves together with the substrate mounting unit 210, and the relative positions of the center position of the image information and the positioning mark 11 do not change even if the substrate mounting unit 210 horizontally moves. The center position of the image information of such a positioning mark 11 may be the center position of the mold 10 shown in fig. 2. In addition, the center position of the image information of the positioning key 21 may be the center position of the substrate 20 shown in fig. 3.

The embodiments of the present invention have been described above in terms of specific embodiments, but they are merely illustrative, and the present invention is not limited thereto, and should be interpreted as having the widest scope based on the technical idea disclosed in the present specification. One skilled in the art can combine/replace the disclosed embodiments to implement patterns of shapes not presented, but without going beyond the scope of the present invention. In addition, the embodiments disclosed may be easily modified or changed by those skilled in the art based on the present specification, and such modifications or changes are also obvious to fall within the scope of the present invention.

Claims

1. A transfer device capable of aligning a pattern, comprising:

a first pressing unit for supporting a mold on which a pattern and a positioning mark are formed;

a second pressing unit for supporting the substrate formed with resin and positioning key; and

a photographing part for recognizing the positioning mark and the positioning key,

the second pressing unit includes:

a substrate mounting portion having a support region for supporting a bottom surface of the substrate and forming an imaging path extending in a vertical direction such that one end portion is disposed in the support region,

the shooting part includes:

and a lower photographing part for photographing through the photographing path of the substrate mounting part to recognize at least one of the positioning mark and the positioning key.

2. The transfer device capable of aligning patterns according to claim 1, wherein,

the photographing part further includes:

and an upper imaging unit configured to recognize one of the positioning key and the positioning mark when the lower imaging unit recognizes the other.

3. The transfer device capable of aligning patterns according to claim 1, wherein,

either one of the first pressing unit and the second pressing unit moves toward the other,

one or more of the first pressing unit and the second pressing unit move and align horizontal positions of the mold and the substrate based on one or more of the positioning mark and the positioning key recognized by the lower image pickup part, and press the mold and the substrate aligned in the horizontal positions against each other to press each other to transfer the pattern to the resin,

the lower imaging unit is configured to adjust one or more of a horizontal position, a vertical position, and an angle so that a viewing angle is directed to a position where the positioning mark and the positioning key are formed.

4. A transfer device capable of aligning a pattern, comprising:

a first pressing unit for supporting the mold having the pattern; and

a second pressing unit for supporting the substrate formed with resin,

the second pressing unit includes:

a substrate mounting part for supporting the substrate;

a positioning part for adjusting the horizontal position of the substrate placing part; and

a corrugated pipe: when the substrate is stretched, one end part of the substrate is contacted with the first pressing unit to seal the space around the substrate from the outside,

the adjustment portion adjusts a horizontal position of the substrate mounting portion in a contact state where one end portion of the bellows is in contact with the first pressing unit.

5. The transfer device capable of aligning patterns according to claim 4, wherein,

the second pressing unit further includes:

a bellows moving part supported by the outer surface of the substrate placing part and connected with the bellows to extend and contract the bellows,

the bellows moving part includes:

a lift cylinder including a shaft and a cylinder actuator providing a driving force for moving the shaft;

a block provided at an end of the shaft; and

a bellows connection part supporting the block to allow the block to move in a horizontal direction,

a seating groove extending in a horizontal direction to seat the block and a receiving groove extending in an up-down direction to communicate with the seating groove and surrounding the shaft with a predetermined gap are formed in the bellows connection portion,

when the horizontal position of the substrate seating part is adjusted in the contact state, the shaft moves in the horizontal direction in the receiving groove.

6. A method for manufacturing a pattern substrate by pressing a substrate formed with a resin and a positioning key against a mold formed with a pattern and a positioning mark,

the method of manufacturing a pattern substrate includes:

a shooting step, a shooting part shoots a positioning mark formed on the mould and a positioning key formed on a substrate;

a first positioning step, wherein a positioning part adjusts the horizontal position of the substrate;

a sealing step of sealing a space around the substrate from the outside by a bellows and discharging a gas remaining in the space around the substrate to the outside;

a second positioning step of adjusting the horizontal position of the substrate again by the positioning section after the sealing step;

a substrate pressing step of pressing the substrate to the mold.

7. The method of manufacturing a pattern substrate according to claim 6,

one or more of the first positioning step and the second positioning step are performed a plurality of times before the substrate pressing step,

the photographing step is performed each time the first positioning step and the second positioning step are performed.

8. The method of manufacturing a pattern substrate according to claim 6,

the method of manufacturing a pattern substrate further includes:

a lifting step of lifting the positioning portion by a lifting portion,

and performing the lifting step, the photographing step, and the first positioning step a plurality of times to perform the photographing step and the first positioning step when the substrate is lifted a predetermined distance by the lifting step, and to perform the photographing step and the first positioning step again when the substrate is lifted more than the predetermined distance by the lifting step.

9. The method of manufacturing a pattern substrate according to claim 6,

the horizontal moving distance of the substrate moved by the second positioning step is smaller than the horizontal moving distance of the substrate moved by the first positioning step.

10. A computer-readable recording medium storing a computer program for executing a method of manufacturing a patterned substrate by pressing a mold on which a pattern and a positioning mark are formed and a substrate on which a resin and a positioning key are formed,

the computer program is programmed to perform the steps of:

a storage step of storing the positioning key photographed by the lower photographing unit and the image information of the positioning mark photographed by the upper photographing unit in the computer-readable recording medium;

an operation step of calculating the position information of the positioning mark and the positioning key based on the image information stored in the computer-readable recording medium; and

an output step of outputting an operation command for adjusting the position of the mold or the substrate based on the calculated position information,

the calculating step obtains a path value for moving the calculated position of the positioning key to the calculated position of the positioning mark,

the outputting step further outputs an action command for adjusting the center position of the image information of the positioning key, based on the obtained path value.