TW202248751A - Apparatus and method for manufacturing pattern substrate, computer-readable recording medium - Google Patents

Abstract

According to one aspect of the present invention, a transfer apparatus capable of aligning patterns can be provided, comprising: a first pressing unit for supporting a mold on which patterns and positioning marks are formed; a second pressing unit for supporting a substrate on which resin and positioning keys are formed; and a photographing unit for recognizing the positioning mark and the positioning key. The second pressing unit includes a substrate placement component. The substrate placement component is provided with a support area for supporting the bottom surface of the substrate and forms a photographing path extending along the up-down direction such that one end is configured in the support area. The photographing unit includes a lower photographing part, and the lower photographing part recognizes any one or more of the positioning mark and the positioning key by photographing through the photographing path of the substrate placement component.

Description

Apparatus, method, and computer-readable recording medium for manufacturing pattern substrate

The present invention relates to a transfer device capable of aligning patterns.

Recently, in display manufacturing and semiconductor manufacturing, in order to form patterns (such as structured molding patterns and mask patterns for etching or evaporation) on the surface of substrates (such as display panels and wafers, etc.) ), using the Nano Imprint Lithography process.

Since the nanoimprint process can replace the existing photolithography (Photo Lithography) process, it is a technology that can economically and effectively manufacture nano-structures. Specifically, the nanoimprint process uses a transfer apparatus (Transfer Apparatus) to press a mold (Mold) formed with a nano-scale (nano-scale) pattern and a substrate formed with a resin (Resin) to each other, and the pattern The process of transferring to resin. A transfer apparatus used in such a nanoimprint process performs a process of detaching the mold from the substrate after pressing the mold on the substrate.

On the other hand, when transferring the pattern of the mold to the resin of the substrate, the mold and the substrate need to be positioned at a predetermined target position and pressed against each other. In a conventional transfer device, an imaging unit positioned above the mold and the substrate recognizes alignment marks formed on the mold and alignment keys formed on the substrate, thereby positioning the mold and the substrate at target positions. However, when the mold is an impermeable mold or alignment keys are formed on the lower side of the impermeable substrate, the imaging unit included in the conventional transfer device cannot recognize the alignment keys formed on the substrate. In other words, when the conventional transfer device cannot see through between the positioning mark and the positioning key, the imaging unit cannot recognize the positioning key formed on the substrate, so there is a problem that the mold and the substrate cannot be moved to the target position. If the mold and the substrate are pressed against each other without being located at the target position, the pattern will not be transferred to the predetermined target position of the resin, and a patterned substrate with poor performance may be produced.

Therefore, there is a need for an apparatus capable of aligning the mold and the substrate to target positions even if the mold is an impermeable mold or even if positioning keys are formed on the underside of the impermeable substrate.

The embodiment of the present invention was invented in view of the above-mentioned background, and its object is to provide a mold that can be aligned with the imaging unit even if the mold is an impermeable mold, or even if a positioning key is formed on the lower side of an impermeable substrate. A device in which the substrate is positioned at a target position.

Another object of the present invention is to provide a device capable of aligning the horizontal position so that the mold and the substrate are located at a predetermined target position before transferring the pattern of the mold to the resin of the substrate.

Another object of the present invention is to provide a device capable of accurately transferring a pattern to a predetermined target position of resin.

According to one aspect of the present invention, a transfer printing device capable of aligning patterns can be provided, including: a first pressing unit supporting a mold formed with patterns and positioning marks; a second pressing unit supporting the mold formed with resin and positioning keys; The substrate is supported; and the imaging part recognizes the positioning mark and the positioning key, and the second pressing unit includes: a substrate placement part, the substrate placement part has a support area for supporting the bottom surface of the substrate, and An imaging path is formed extending in the vertical direction such that one end portion is disposed in the support region, and the imaging unit includes a lower imaging portion for identifying the positioning mark by imaging through the imaging path of the board mounting portion. and any one or more of the positioning keys.

In addition, a transfer device capable of aligning patterns can be provided, the photographing part further includes: an upper photographing part, when the lower photographing part recognizes any one of the positioning key and the positioning mark, it recognizes the other .

In addition, it is possible to provide a transfer device capable of aligning patterns, either one of the first pressing unit and the second pressing unit moves toward the other, and one of the first pressing unit and the second pressing unit One or more of the positioning marks and positioning keys recognized by the lower imaging part are used to move and align the horizontal positions of the mold and the substrate, and to align the horizontal positions The mold and the substrate press each other to press each other to transfer the pattern to the resin, and the lower imaging part is configured to adjust one or more of a horizontal position, a vertical position, and an angle so that it can be viewed The field angle faces the position where the positioning mark and the positioning key are formed.

In addition, it is possible to provide a transfer device capable of aligning patterns, the lower imaging part is configured to have a first focal length for recognizing the positioning mark and a second focal length for recognizing the positioning key, and the focal length is changed to the first focal length. focal length or the second focal length.

In addition, a transfer printing device capable of aligning patterns can be provided, the positioning marks include a first positioning mark and a second positioning mark, and the positioning keys include a first positioning key corresponding to the first positioning mark and a For the second positioning key corresponding to the second positioning mark, the lower photographing part includes: a first lower photographing part for identifying more than one of the first positioning mark and the first positioning key; The second shooting part is used to identify more than one of the second positioning mark and the second positioning key.

In addition, it is possible to provide a transfer device capable of aligning patterns, the second pressing unit further includes: a photographing guide part, one side communicates with the photographing path, and the other side opposite to the one side communicates with the lower The photographing part is connected; and the reflection part is arranged between the photographing path and the photographing guide part, the photographing guide part is arranged along a direction staggered from the up and down direction, and the lower photographing part is identified by the reflector The positioning key.

In addition, it is possible to provide a transfer device capable of aligning patterns, wherein the substrate mounting part includes: a mounting part body, on which the shooting path is formed; a shielding window, which cuts off the flow of gas in the shooting path; and a blocking member, for The shut-off gas flows between the shielding window and the housing part body, and is arranged between the shielding window and the housing part body.

In addition, it is possible to provide a transfer device capable of aligning patterns, the placement part body includes: an upper placement part provided with the support area; and a lower placement part supporting the upper placement part, and the imaging path includes: In the first path portion of the upper placement portion and the second path portion formed in the lower placement portion, the one or more shielding windows include: a first shielding window for cutting off gas in the first path portion The internal flow of the gas is arranged on the first path portion; and the second shielding window is separated from the first shielding window and is arranged on the first path portion in order to cut off the gas flow inside the second path portion. On the second path part, the more than one shielding parts include: a first shielding part, located between the first shielding window and the upper placement part; and a second shielding part, located between the second shielding window and the upper placement part; Between the placement parts described below.

In addition, a transfer device capable of aligning patterns can be provided, and the transfer device capable of aligning patterns further includes: a position adjustment part, which adjusts the horizontal position of the substrate placement part; and a lifting part, which makes the position adjustment part The lower imaging part moves together when the substrate placement part moves through the position adjustment part and the lifting part.

In addition, it is possible to provide a transfer device capable of aligning a pattern, the transfer device capable of aligning a pattern further comprising: a control unit configured to perform operations for the first pressing unit, the second pressing unit, and the adjustment Control of bit work.

In addition, it is possible to provide a transfer device capable of aligning a pattern, the transfer device capable of aligning a pattern including: a first pressing unit supporting a mold formed with a pattern; and a second pressing unit supporting a mold formed with a resin The substrate is supported, and the second pressing unit includes: a substrate placement part, which supports the substrate; a position adjustment part, which adjusts the horizontal position of the substrate placement part; The space around the substrate can be sealed from the outside by the first pressing unit, and the position adjusting part adjusts the placement of the substrate in a state where one end of the corrugated tube is in contact with the first pressing unit. The horizontal position of the head.

In addition, it is possible to provide a transfer device capable of aligning patterns, the second pressing unit further includes: a bellows moving part supported by the outer surface of the substrate placement part, and connected to the bellows so that the bellows The tube is extended and contracted, and the bellows moving part includes: a lifting cylinder including a shaft and a cylinder actuator providing a driving force for moving the shaft; a block provided at the end of the shaft; and a bellows A connection portion that supports the block to allow the block to move in the horizontal direction, and a seating groove extending in the horizontal direction to seat the block and extending in the up and down direction to communicate with the block is formed in the bellows connection portion. The accommodating groove communicates with the accommodating groove surrounding the shaft with a predetermined gap, and when the horizontal position of the substrate accommodating part is adjusted in the contact state, the arbor moves in the accommodating groove along the horizontal direction.

In addition, it is possible to provide a transfer device capable of aligning patterns, the bellows being elastically deformed in the contact state to allow adjustment of the horizontal position of the substrate seating portion.

In addition, it is possible to provide a transfer device capable of aligning patterns, the first pressing unit further includes: a mold jig supporting an edge portion of the mold, and when the bellows is in the contact state, it is in contact with the corrugated tube. one end of the tube is in contact; clamps supporting the edge of the mold jig to fix the mold jig to the first pressing unit side; It includes a sliding member supporting the mold jig from below, and the mold jig is inserted between the sliding member and the sealing portion and supported by the clamp.

In addition, it is possible to provide a transfer device capable of aligning a pattern, and the first pressing unit further includes: a mold clamp supporting an edge portion of the mold, and when in the contact state, is in contact with one end portion of the bellows contact, a jig sealing part is provided in the mold jig, and a bellows sealing part is provided at one end of the bellows, and when in the contact state, the jig sealing part and the bellows sealing part for To prevent gas from flowing between the mold jig and one end portion of the bellows to contact each other, the jig sealing member and the bellows sealing member have shapes different from each other.

In addition, there may be provided a transfer device capable of aligning a pattern, the first pressing unit includes: a mold jig supporting an edge portion of the mold, and being in contact with one end portion of the bellows when in the contact state The UV transmission window supports the mold and allows UV transmission; the sealing part protrudes in an annular shape and is in contact with the mold clamp below to seal the surrounding of the UV transmission window relative to the outside; and the first row The gas unit is configured to discharge gas remaining in the space sealed inside the sealing unit to the outside when the sealing unit seals the surrounding space of the UV transmission window from the outside.

In addition, it is possible to provide a transfer device capable of aligning patterns, the second pressing unit further includes: a second exhaust part for sealing the surrounding space of the substrate from the outside by the bellows. The gas remaining in the space sealed inside the bellows is exhausted to the outside, and the first exhaust part and the second exhaust part work to prevent the gas pressure inside the sealed part and the The difference in gas pressure inside the bellows exceeds a predetermined range.

In addition, it is possible to provide a transfer device capable of aligning a pattern, the transfer device capable of aligning a pattern further comprising: a control unit configured to perform operations for the first pressing unit, the second pressing unit, and the adjustment Control of bit work.

In addition, a method for manufacturing a patterned substrate may be provided, wherein a mold formed with patterns and positioning marks is pressed against a substrate formed with resin and positioning keys to manufacture a patterned substrate, wherein the method for manufacturing a patterned substrate includes the following steps: a photographing step , the photographing part photographs the positioning marks formed on the mold and the positioning keys formed on the substrate; in the first adjustment step, the adjustment part adjusts the horizontal position of the substrate; in the sealing step, the bellows seals the substrate around The space is sealed relative to the outside, and the gas remaining in the space around the substrate is discharged to the outside; the second adjustment step, after the sealing step, the adjustment unit adjusts the horizontal position of the substrate again ; A substrate pressing step, pressing the substrate to the mold.

In addition, it is possible to provide a method for manufacturing a pattern substrate, wherein one or more of the first alignment step and the second alignment step are performed multiple times before the substrate pressing step, and the photographing step is executed each time. Execute when the first adjustment step and the second adjustment step are mentioned above.

In addition, a method for manufacturing a pattern substrate may be provided, further comprising the following steps: a lifting step, the lifting part makes the positioning part rise, and the lifting step, the photographing step and the first positioning step are performed multiple times, When the substrate is raised by a predetermined distance through the lifting step, the photographing step and the first adjustment step are performed, and when the substrate is raised by a predetermined distance or more by the lifting step, the step of performing the first adjustment is performed again. The photographing step and the first positioning step are described above.

In addition, there may be provided a method of manufacturing a pattern substrate whose horizontal movement distance moved by the second alignment step is smaller than the horizontal movement distance of the substrate moved by the first alignment step.

In addition, a computer-readable recording medium stores a computer program for executing a method of manufacturing a patterned substrate by pressing a mold formed with a pattern and positioning marks on a substrate formed with resin and positioning keys, wherein the computer program The program is designed to perform the following steps: a storage step, storing the image information of the positioning key captured by the lower imaging unit and the positioning mark captured by the upper imaging unit in the computer-readable recording medium; the computing step, Based on the image information stored in the computer-readable recording medium, calculating the position information of the positioning mark and the positioning key; and an output step of outputting and adjusting the position information based on the calculated position information An action command for the position of the mold or the substrate, the calculation step obtains the calculated path value from the calculated position of the positioning key to the calculated position of the positioning mark, and the output step is based on the obtained path value value, and further output an action command for adjusting the central position of the image information of the positioning key.

Invention effect

According to the embodiment of the present invention, there is an effect of being able to align the horizontal position so that the mold and the substrate are located at predetermined target positions before transferring the pattern of the mold to the resin of the substrate.

In addition, there is an effect that the pattern can be accurately transferred to a predetermined target position of the resin.

In addition, even if the mold is an impermeable mold or positioning keys are formed under the impermeable substrate, there is an effect that the mold and the substrate can be positioned at the target position (target position) by the imaging unit.

Hereinafter, specific embodiments for realizing the technical concept of the present invention will be described in detail with reference to the accompanying drawings.

Moreover, when describing the present invention, when it is judged that specific descriptions for related known structures or functions may obscure the gist of the present invention, the detailed descriptions will be omitted.

In addition, when it is mentioned that a constituent element is "supported", "inflowed", "discharged" and "fixed" by other constituent elements, although it may be directly supported, flowed in, discharged, or fixed by other constituent elements, it should be understood as There may be other constituent elements in between.

The terms used in this specification are for describing specific examples, and are not intended to limit the present invention. Expressions of the singular include expressions of the plural unless clearly indicated differently in context.

In addition, terms including ordinal numbers such as first and second may be used in the description of various constituent elements, but the corresponding constituent elements are not limited to such terms. The terms are used only for the purpose of distinguishing one element from other elements.

The meaning of "comprising" used in the description is to specify specific characteristics, regions, integers, steps, actions, factors and/or components, and does not exclude other specific characteristics, regions, integers, steps, actions, factors, components and /or the existence or attachment of groups.

In addition, it is clear in advance that in this specification, expressions such as upper side, lower side, and bottom surface are described based on the illustrations in the drawings, and may be expressed differently if the direction of the corresponding object is changed. On the other hand, in this specification, the left-right direction may be the x-axis direction in FIGS. 1 , 4 , and 5 (x1 is the right side, and x2 is the left side). In addition, the front-rear direction can be the y-axis direction in FIG. 1, FIG. 6, FIG. 7 and FIG. 9 (y1 is the front side, y2 is the rear side), and the up-down direction can be the z direction in FIG. Axis direction (z1 is the upper side, z2 is the lower side). In addition, the θ-axis direction may be a direction in which the z-axis direction in FIG. 1 is used as a center axis and rotates. In addition, the horizontal direction may be one or a combination of the x-axis direction and the y-axis direction. In addition, the horizontal position may be a position on a virtual plane in the x-axis direction and the y-axis direction. In addition, the vertical direction may be the z-axis direction. In addition, the vertical position may be a position on a virtual straight line in the z-axis direction.

Hereinafter, a specific structure of a transfer device 1 capable of aligning patterns according to an embodiment of the present invention will be described with reference to the drawings.

Hereinafter, referring to FIG. 1 , FIG. 4 and FIG. 5 , the transfer device 1 capable of aligning patterns according to an embodiment of the present invention can make the mold 10 and the substrate 20 press (press) each other, thereby pressurizing each other and placing the pattern on the mold. The pattern formed at 10 is transferred to the resin formed on the substrate 20 . Here, transferring the pattern to the resin may mean transferring the pattern (not shown) formed on the mold 10 to the resin formed on the substrate 20 . In addition, the meaning of transferring the mold 10 to the substrate 20 may be the meaning of transferring the pattern formed on the mold 10 to the resin formed on the substrate 20 .

In addition, the transfer device 1 capable of aligning the pattern may align relative horizontal positions between the mold 10 and the substrate 20 before transferring the pattern to the resin so that the mold 10 and the substrate 20 are located at a target position. Here, the target position of the mold 10 and the substrate 20 can mean the mold 10 in a state where the positioning marks 11 described later and the positioning keys 21 described later are matched with each other when the mold 10 and the substrate 20 are viewed from above. and the horizontal position of the substrate 20.

In this way, the pattern-alignable transfer device 1 has the effect of aligning the horizontal position so that the mold 10 and the substrate 20 can be located at predetermined target positions before transferring the pattern of the mold 10 to the resin of the substrate 20 . In addition, there is an effect that the pattern can be accurately transferred to a predetermined target position of the resin.

The mold 10 may be supported by a transfer device 1 capable of aligning patterns. In addition, the mold 10 may be an impermeable mold made of opaque material, but is not limited thereto. In addition, a pattern of the resin to be transferred to the substrate 20 may be formed on one surface of the mold 10 .

Referring to FIG. 2 , a positioning mark 11 may be formed on the mold 10 , and the positioning mark 11 serves as a reference for alignment so as to be located at a predetermined target position together with the substrate 20 . For example, as the mold 10 is supported by a first pressing unit 100 described later, patterns may be arranged on the lower side of the mold 10 so as to face the lower side.

The positioning marks 11 may be formed on one or more of the lower side and the upper side of the mold 10 .

In addition, the pattern may be formed on the lower side than the alignment mark 11 .

The positioning mark 11 may be provided in plural in the mold 10 . In addition, the positioning mark 11 may include a first positioning mark 11a and a second positioning mark 11b spaced apart from the first positioning mark 11a.

The imaging unit 300 described later can recognize the positioning mark 11 as it recognizes one or more of the lower side and the upper side of the mold 10 .

The substrate 20 may be supported by the transfer device 1 capable of aligning patterns. In addition, the substrate 20 may be an opaque substrate made of an opaque material, but is not limited thereto. For example, the impermeable substrate can be a silicon wafer, a metal evaporated wafer, and the like. In addition, a resin to which a pattern is to be transferred may be formed on one side of the substrate 20 . In addition, the resin may be formed by coating the surface of the substrate 20 .

Referring to FIG. 3 , a positioning key 21 may be formed at a position of the substrate 20 corresponding to a position where the positioning mark 11 is formed, and the positioning key 21 becomes a reference for alignment so as to be located at a predetermined target position together with the mold 10 . For example, as the substrate 20 is supported by the second pressing unit 200 described later, the resin is disposed on the upper side of the substrate 20 so as to face upward.

The positioning key 21 may be formed on one or more of the upper side and the lower side of the substrate 20 . In addition, the resin may be formed on the upper side than the positioning key 21 .

The alignment key 21 may be formed in plural on the substrate 20 . In addition, the positioning key 21 may include a first positioning key 21a corresponding to the first positioning mark 11a and a second positioning key 21b corresponding to the second positioning mark 11b and spaced apart from the first positioning key 21a.

The imaging unit 300 described later can recognize the positioning key 21 by recognizing one or more of the upper side and the lower side of the substrate 20 .

The positioning mark 11 and the positioning key 21 can be formed to correspond to each other. For example, the positioning mark 11 may be formed in the shape of a cross. In addition, the positioning key 21 may be formed in a shape in which a plurality of quadrilaterals are arranged to form a space where the positioning mark 11 can be located inside when viewed from the upper side.

The positioning mark 11 and the positioning key 21 can serve as a reference for whether the mold 10 and the substrate 20 are located at the target positions. For example, if the alignment mark 11 overlaps at least a portion of the alignment key 21 , or is not adjacent to the alignment key 21 , the mold 10 and the substrate 20 may not be at the target position. As another example, when the alignment marks 11 are matingly located between the alignment keys 21, the mold 10 and the substrate 20 may be at the target position.

Referring to FIGS. 4 and 5 , the transfer device 1 capable of aligning patterns may include a first pressing unit 100 , a second pressing unit 200 , an imaging unit 300 , a UV irradiation unit 400 , a driving unit 500 and a control unit 600 .

The following is a description about the first pressing unit 100 .

The first pressing unit 100 may support the mold 10 . In addition, the second pressing unit 200 may support the substrate 20 . In addition, any one of the first pressing unit 100 and the second pressing unit 200 may move toward the other. In other words, any one of the first pressing unit 100 and the second pressing unit 200 can move vertically. In addition, one or more of the first pressing unit 100 and the second pressing unit 200 may be aligned horizontally based on the movement of the positioning mark 11 and the positioning key 21 in the horizontal direction so that the mold 10 and the substrate 20 are located at the target position. In addition, one or more of the first pressing unit 100 and the second pressing unit 200 can be raised and lowered so that the horizontally aligned mold 10 and substrate 20 press each other, thereby accurately transferring the pattern to the target position of the resin.

The first pressing unit 100 includes a mold support 110 , a UV transmission window 120 , a sealing part 130 , a first exhaust part 140 , a sealing part sealing member 150 , and a support moving part (not shown).

Referring again to FIGS. 6 to 9 , a mold support 110 may be provided for supporting the mold 10 . For example, the mold 10 may be supported by the mold support 110 so that the patterns face the lower side.

The mold support 110 may include a mold clamp 111 , a clamp 112 , a clamp mover 113 , and a mover support 114 .

The mold clamp 111 may support the mold 10 . In addition, the mold jig 111 may be partially opened so that a central portion of the mold 10 is exposed toward the substrate 20 . Here, the central portion of the mold 10 exposed by the mold jig 111 may mean a portion where a pattern is formed on the mold 10 or a portion of the mold 10 supported by a UV transmission window 120 described later. In addition, the mold jig 111 may support the edge portion of the mold 10 . Therefore, the mold jig 111 can fix the mold 10 closely to the mold jig 111 by exposing the center portion of the mold 10 and supporting the edge of the mold 10 . The mold jig 111 may be supported between the clamp 112 and the sealing part 130 , and may be slid to be removed from between the clamp 112 and the sealing part 130 .

A jig sealing member 111 a may be provided on the mold jig 111 .

As shown in FIG. 8 , the jig sealing member 111 a may be disposed on the bottom surface of the mold jig 111 to be in contact with a bellows sealing member 241 disposed at one end of a bellows 240 described below that contacts the mold jig 111 . In addition, the jig sealing member 111 a is in contact with the bellows sealing member 241 to prevent gas from flowing between the mold jig 111 and one end of the bellows 240 . In addition, the jig sealing part 111 a may include a flat ring fitted in a groove formed in the bottom surface of the mold jig 111 .

10 to 13 , the clamp 112 , the clamp mover 113 and the mover support 114 will be described. FIG. 10 is an exploded perspective view of the mold support 110 disassembled. FIG. 11 shows a state where the clamp 112 moves downward so that the mold jig 111 can slide into the space between the clamp 112 and the sealing part 130 . FIG. 12 is a perspective view showing a state in which the mold jig 111 moves to the space between the clamp 112 and the sealing part 130 and is placed on the clamp 112 .

FIGS. 13 and 14 are enlarged side views and front views showing that the mold jig 111 is interposed between the clamp 112 and the sealing part 130 so that the upper surface of the mold jig 111 is in contact with the sealing part 130 .

The clamp 112 may support the edge of the mold jig 111 to fix the mold jig 111 to the first pressing unit 100 side.

The clamp 112 may include a slide part 112a supporting the mold jig 111 and a clamp body 112b supporting the slide part 112a.

The slide member 112a may be supported by the clamp body 112b in a state of being separated from the sealing portion 130 by a predetermined distance in the vertical direction. Accordingly, a space for inserting the mold jig 111 may be provided between the sliding part 112 a and the sealing part 130 .

The clamp mover 113 can move the clamp 112 in the up and down direction. For example, the clamp mover 113 may be supported by the mover support 114 to move the slide member 112a and the clamp body 112b in the vertical direction.

The mover support 114 may be supported by the sealing portion 130 to support the clamp mover 113 . For example, the mover support 114 may be attached to the side of the sealing part 130 to support the clamp mover 113 .

Hereinafter, a process in which the mold jig 111 is slidably inserted between the clamp 112 and the sealing portion 130 will be described.

First, as shown in FIG. 11 , the clamp mover 113 moves the clamp 112 in the lower direction. When such clamp 112 moves in the downward direction, the distance in the vertical direction between the clamp 112 and the sealing portion 130 increases.

In this state, as shown in FIG. 12 , the mold jig 111 slides from the external space to the space between the clamp 112 and the sealing portion 130 and is placed on the slide member 112 a. In addition, in order to place the mold jig 111 on the clamp 112, the sliding direction may be the front-rear direction.

Thereafter, as shown in FIGS. 13 and 14 , the clamp 112 is moved upward by the clamp mover 113 . If such clamps 112 are moved in the upper direction, the mold jig 111 may be fixed between the clamps 112 and the sealing part 130 so as to come into contact with the sealing part 130 by the upper side movement of the clamps 112 .

In this way, the mold jig 111 has an effect of preventing random movement between the clamps 112 and the sealing part 130 by the clamps 112 , and the edges thereof are pressed and fixed by the sealing part 130 .

On the other hand, the process of removing the mold jig 111 from between the clamp 112 and the sealing part 130 may be performed in the reverse order of the above-mentioned sliding insertion process of the mold jig 111 .

Referring again to FIGS. 6 to 8 , the UV transmissive window 120 may be configured to transmit UV irradiated from the UV irradiation unit 400 . In addition, the bottom surface of the UV transmission window 120 may support the mold 10 . In addition, the UV transmission window 120 may be surrounded by the sealing part 130 to be cut off from the outside.

The sealing part 130 can seal the periphery of the UV transmission window 120 from the outside. In other words, the sealing part 130 is provided to surround the UV transmission window 120 so that the UV transmission window 120 can be cut off from the outside. In addition, the lower part of the sealing part 130 may be in contact with the mold jig 111 . For example, the sealing part 130 may have a ring shape in which a part protrudes to be in contact with the mold jig 111 .

The sealing part 130 may be provided such that a part of the sealing part 130 is separated from the UV transmission window 120 . Therefore, a predetermined separation space S may be formed between the sealing part 130 and the UV transmission window 120 . In addition, the separated space S may communicate with the first exhaust part 140 . In addition, when the lower side of the sealing part 130 contacts the upper side of the mold jig 111 , the gas remaining in the inner side of the partitioned space S may be exhausted to the outside through the first exhaust part 140 . In addition, the lower part of the sealing part 130 is in contact with the upper part of the mold jig 111 to make the partition space S hermetically sealed. Therefore, as the sealing portion 130 comes into contact with the mold holder 111 , air in the partitioned space S can be exhausted while preventing air from flowing in from the outside, so that the partitioned space S can be formed in a vacuum state.

In this way, by forming the partitioned space S in a vacuum state, it is possible to block the inflow of air into the substrate 20 , and thus there is an effect that the periphery of the UV transmission window 120 can be more effectively sealed from the outside.

The first exhaust part 140 may exhaust gas between the UV transmission window 120 and the sealing part 130 to the outside. In other words, when the sealing part 130 seals the space around the UV transmission window 120 from the outside, the first exhaust part 140 may discharge gas remaining inside the partitioned space S to the outside. In addition, the first exhaust part 140 may include a nozzle exposed on the inner peripheral surface of the sealing part 130 .

The sealing part sealing member 150 can block the flow of gas between the mold jig 111 and the sealing part 130 . In addition, the sealing part sealing member 150 may be located between the mold jig 111 and the sealing part 130 . In addition, the sealing part sealing member 150 may include an elastic ring fitted in a groove formed in a concave manner along the upper side of the bottom surface of the sealing part 130 .

The support moving unit (not shown) can move the mold support 110 in the horizontal direction to move the center position of the mold 10 in the horizontal direction. For example, when the substrate 20 has a relatively larger area than the mold 10, the support moving part can move the mold support 110 to move the mold 10 from one point to another on the upper side of the substrate 20, and move the pattern of the mold 10 to another point. Partially and sequentially transferred to the substrate 20 having a larger area than the mold 10 .

The following is a description about the second pressing unit 200 .

Referring to FIGS. 4 and 5 , the second pressing unit 200 may support the substrate 20 and adjust the position of the substrate 20 . In other words, the second pressing unit 200 can align the horizontal position of the substrate 20 .

The second pressing unit 200 may approach the substrate 20 toward the mold 10 . In other words, the second pressing unit 200 can move the substrate 20 along the vertical direction.

The second pressing unit 200 may include a substrate placing part 210 , a positioning part 220 , a lifting part 230 , a bellows 240 , a second exhaust part 250 , a bellows moving part 260 , a shooting guide part 280 , and a reflection part 290 .

Referring again to FIG. 15 , the substrate seating part 210 may provide a portion for seating the substrate 20 . In addition, the substrate placement part 210 may include a support area for supporting the lower side of the substrate 20 . In addition, an imaging path 210a extending in the up-down direction may be formed in the board mounting portion 210 such that one end portion is disposed in the supporting area.

The photographing path 210a may include a first path portion 210a-1 and a second path portion 210a-2 lower than the first path portion 210a-1. In addition, the lower imaging unit 320 can recognize the positioning key 21 of the substrate 20 described later through the imaging path 210 a.

The substrate placement part 210 may include a placement part body 211 , a shielding window 213 , and a shielding part 214 .

The seating part body 211 may support the substrate 20 . In addition, a photographing path 210 a may be formed in the mounting part body 211 . In addition, the mounting part body 211 may be supported by the position adjusting part 220 shown in FIG. 5 .

The seating part body 211 may include an upper seating part 211a and a lower seating part 211b.

The upper mounting part 211a is arranged on the upper side than the lower mounting part 211b and has a support region for supporting the substrate 20 . In addition, the upper seating part 211a may form the first path part 210a-1. In addition, the first path portion 210a-1 may pass through the upper mounting portion 211a in the vertical direction. In addition, one end portion of the first path portion 210a-1 may be provided at a supporting area of the upper seating portion 211a.

The lower seating part 211b may support the upper seating part 211a. In addition, a second path part 210a-2 may be formed in the lower seating part 211b. In addition, the second path portion 210a-2 may pass through the lower mounting portion 211b in the vertical direction. In addition, the second path portion 210a - 2 may be connected to the first path portion 210a - 1 and not communicate with the first path portion 210a - 1 through the blocking window 213 .

The shielding window 213 can cut off the flow of gas in the shooting path 210a. In addition, the shielding window 213 may include a first shielding window 213a and a second shielding window 213b.

The first shielding window 213a can block the gas inside the first path portion 210a-1 from flowing in between the upper housing portion 211a and the lower housing portion 211b. In addition, the first shielding window 213a may be disposed in the first path portion 210a-1.

The second shielding window 213b can block the flow of gas inside the second path portion 210a-2 between the upper housing portion 211a and the lower housing portion 211b. In addition, the second shielding window 213b may be spaced apart from the first shielding window 213a in an up-down direction, and disposed in the second path portion 210a-2. In other words, the first shielding window 213a and the second shielding window 213b may be spaced apart from each other.

Thus, by arranging the first shielding window 213a and the second shielding window 213b apart from each other, it is possible to prevent damage to each other and contribute to maintaining the level of the housing portion main body 211 . In addition, since the first shielding window 213a and the second shielding window 213b are spaced apart from each other without contact, even if the position of the upper resting part 211a relative to the lower resting part 211b is adjusted in order to align the level of the resting part body 211 or The moving and shaking of the mounting part body 211 has the effect of preventing at least one of the first shielding window 213a and the second shielding window 213b from being worn due to friction.

The shielding component 214 can cut off the flow of gas between the shielding window 213 and the mounting part body 211 . In addition, the shielding member 214 may be disposed between the shielding window 213 and the receiving part body 211 . In addition, the horizontal length of the blocking member 214 may be formed to be larger than the horizontal length of the imaging path 210a. In other words, based on the center of the photographing path 210a, the radius of the shielding part 214 may be formed to be larger than the radius of the photographing path 210a of the portion adjacent to the shielding part 214 .

In this way, there is an effect that since the shielding member 214 is formed larger and does not interfere with the imaging path 210a, the imaging space passing through the shielding window 213 can be substantially ensured at the same level as the width of the imaging path 210a, and the shielding member 214 and the imaging path 210a can be sealed. Place between the main body 211 of the placement part.

The shielding part 214 may include a first shielding part 214a and a second shielding part 214b.

The first shielding member 214a can prevent gas from flowing between the first shielding window 213a and the first path portion 210a-1. In addition, the first shielding part 214a may be disposed between the first shielding window 213a and the upper seating part 211a. In addition, the first blocking member 214a may include an elastic ring formed along the circumference of the first blocking window 213a.

The second shielding member 214b can prevent gas from flowing between the second shielding window 213b and the second path portion 210a-2. In addition, the second shielding part 214b may be disposed between the second shielding window 213b and the lower seating part 211b. In addition, the second blocking member 214b may include an elastic ring formed along the circumference of the second blocking window 213b.

Referring to FIG. 4 to FIG. 7 and FIG. 9 , the position adjustment part 220 can adjust the horizontal position of the substrate placement part 210 . For example, the position adjustment unit 220 can move the substrate mounting portion 210 in front, rear, left, and right directions (horizontal directions), and can rotate the substrate mounting portion 210 . Therefore, the position adjusting part 220 can align the mold 10 and the substrate 20 at the target position by adjusting the position of the substrate placing part 210 . In addition, when the bellows sealing member 241 at one end of the bellows 240 is in contact with the jig sealing member 111a on the bottom surface of the mold jig 111 of the first pressing unit 100, that is, in a contact state, the position adjustment unit 220 can readjust the substrate placement unit 210. horizontal position.

The alignment unit 220 may be an alignment stage (Alignment stage). For example, the position adjustment part 220 can be formed by a plurality of modules that work independently to move (that is, the x-axis direction, y-axis direction, y-axis direction, and Axis direction and movement work in theta-axis direction) xyθ stage. As another example, the position adjustment unit 220 can form a mobile operation through a plurality of modules working in cooperation (that is, form x direction, y direction and The mobile work in the θ direction) of the uvw stage.

The positioning part 220 can be located on the upper side of the lifting part 230 and can be lifted up and down by the lifting part 230 .

The position adjustment part 220 may include a first adjustment part 221 , a second adjustment part 222 and a third adjustment part 223 .

The first adjustment part 221 , the second adjustment part 222 and the third adjustment part 223 may be respective modules that move along the u-axis, v-axis and w-axis of the uvw stage for adjusting the horizontal position of the substrate placement part 210 . In addition, even when one end of the corrugated tube 240 is in contact with the first pressing unit 100, the first adjustment part 221, the second adjustment part 222, and the third adjustment part 223 can make the substrate placement part 210 move along the front-rear direction (y-axis Direction) can move along the left and right directions (x-axis direction), and can be rotated.

In this way, the positioning unit 220 adjusts the horizontal position of the substrate mounting unit 210 based on the positioning marks 11 and the positioning keys 21 to align the mold 10 and the substrate 20 at the target positions. In addition, when the bellows 240 is in a contact state, by adjusting the horizontal position of the substrate 20 again, there is an effect that the relative position between the mold 10 and the substrate 20 can be adjusted more precisely.

The lifting part 230 can lift the substrate placement part 210 up and down. For example, the lifting part 230 can move the substrate placing part 210 in a direction perpendicular to the bottom surface. In addition, the lifting part 230 can lift the substrate placement part 210 to move the substrate 20 closer to the first pressing unit 100 or separate from the first pressing unit 100 . In addition, the lifting part 230 can move the substrate 20 toward the first pressing unit 100 side, thereby pressing the substrate 20 to the mold 10 .

The bellows 240 may be configured to seal the space around the substrate 20 from the outside. In other words, the bellows 240 can seal the space around the substrate 20 from the outside by extending.

The bellows 240 may have a plurality of folded portions in order to expand and contract toward the first pressing unit 100 when pressing the mold 10 and the substrate 20 . In addition, the bellows 240 can be configured such that one end can expand and contract toward the first pressing unit 100 and the other end is supported by the substrate placement part 210 . For example, the bellows 240 may be extended toward the first pressing unit 100 , and at this time, the upper end of the bellows 240 may be in contact with the first pressing unit 100 . In this way, when the bellows 240 is in contact with the first pressing unit 100 , the substrate 20 can be cut off from the outside. As another example, an elongated bellows 240 may be retracted again. In this way, when the bellows 240 shrinks toward the substrate 20, the substrate 20 can be exposed to the outside.

The bellows 240 may elastically deform in a contact state to allow adjustment of the horizontal position of the substrate seating part 210 .

As shown in FIG. 15 , a bellows sealing member 241 may be provided at one end portion of the bellows 240 .

When the bellows 240 is in contact, the bellows sealing member 241 may contact the jig sealing member 111a in order to prevent gas from flowing between the mold jig 111 and one end of the bellows 240 . In addition, the bellows seal member 241 and the jig sealing member 111a may be formed in shapes different from each other and have frictional forces different from each other. In this way, since the bellows sealing member 241 and the jig sealing member 111a are formed in different shapes from each other and have different frictional forces from each other, when the bellows 240 is in a contact state, the substrate mounting part 210 can be moved horizontally so that one end of the bellows 240 The part also slides in the mold fixture 111. For example, the bellows sealing member 241 may include an O-ring fitted in a groove formed at one end (eg, upper end) of the bellows 240 .

In this way, when the bellows 240 is in a contact state, the positioning part 220 moves, so that the bellows sealing member 241 slides in a state of contacting the jig sealing member 111a to prevent the inflow of gas and prevent the bellows 240 from being excessively elastically deformed. Effect.

When the bellows 240 seals the space around the substrate 20 from the outside, the second exhaust part 250 may exhaust gas remaining in the space sealed inside the bellows 240 to the outside. In addition, the second exhaust unit 250 exhausts the gas remaining in the space sealed inside the bellows 240 to the outside, so that the space around the substrate 20 can be kept in a vacuum state. In addition, the second exhaust part 250 may include a nozzle exposed inside the bellows 240 .

The first exhaust part 140 and the second exhaust part 250 can prevent the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 from exceeding a predetermined range.

In this way, the difference between the gas pressure inside the sealing part 130 and the gas pressure inside the bellows 240 is prevented from exceeding a predetermined range to prevent the difference between the pressure applied to the upper side and the lower side of the mold 10 from exceeding a predetermined range, and thus finally prevents the mold 10 from exceeding a predetermined range. The effect of being bent.

Referring to FIGS. 16 to 19 , the bellows moving part 260 may be supported by the outer surface of the substrate placement part 210 and connected to the bellows 240 to expand and contract the bellows 240 . In other words, the bellows moving part 260 can switch the bellows 240 into a contact state or a contracted state.

The bellows moving part 260 may include a lifting cylinder 261 , a block 262 and a bellows connecting part 263 .

The lift cylinder 261 may include a shaft 261a and a cylinder actuator 261b providing a driving force for moving the shaft 261a in an up and down direction.

The lift cylinder 261 may be supported by the outer surface of the substrate seating part 210 . In other words, the lift cylinder 261 may be supported by the outer surface of the lower seating part 211b.

The block 262 may be provided at an end of the shaft 261a to move together with the shaft 261a.

The bellows connection 263 may support the block 262 to allow the block 262 to move in a horizontal direction. In addition, a housing groove 263a extending in the horizontal direction to accommodate the block 262 and an accommodating groove 263b extending in the vertical direction to communicate with the lower side of the housing groove 263a and surround the shaft 261a through a predetermined gap may be formed in the bellows connecting portion 263 . For example, the predetermined gap of the storage groove 263b may be not less than 0.4 mm and not more than 0.5 mm. In addition, when the horizontal position of the substrate mounting part 210 is adjusted in a state where the bellows 240 is in contact, the shaft 261 a can move in the horizontal direction in the storage groove 263 b. In other words, in the contact state, the substrate placement part 210 moves horizontally below the predetermined gap through the position adjustment part 220 .

Referring to FIG. 15 again, one side of the imaging guide 280 may communicate with the lower imaging path 210-2 in the imaging path 210a, and the other side opposite to one side may be connected to the lower imaging portion 320 described later. In addition, at least a part of the imaging guide part 280 may be located on a lower side than the substrate mounting part 210 . In addition, the photographing guides 280 may be arranged in a direction shifted from the vertical direction. For example, the photographing guide 280 may be formed in a direction perpendicular to the direction in which the photographing path 210a is formed. In addition, the lower imaging part 320 mentioned later can image the lower side of the board|substrate 20 through the imaging guide part 280 and the imaging path 210a.

The imaging guide part 280 may include a reflective part 290 on the inner surface of the imaging guide part 280 for the lower imaging part 320 described later to effectively recognize the lower side of the board 20 .

The reflection part 290 may be disposed between the imaging guide part 280 and the imaging path 210 a to reflect the image of the positioning mark 11 so as to enter the lower imaging part 320 described later. For example, the reflection part 290 may be a reflection mirror capable of reflecting light. As a more detailed example, the reflection unit 290 may reflect the light emitted along the imaging path 210 a to be emitted along the imaging guide 280 . In this way, even if the imaging path 210 a and the imaging guide 280 are arranged to be offset from each other, the reflector 290 can reflect the image of the positioning key 21 so that the lower imaging unit 320 described later can recognize the positioning key 21 . In other words, the lower imaging unit 320 described later can recognize the positioning key 21 through the reflection unit 290 .

The following is a description of the imaging unit 300 .

The imaging unit 300 can recognize the positioning mark 11 of the mold 10 and the positioning key 21 of the substrate 20 . For example, the photographing unit 300 may be a camera that photographs the positioning mark 11 and the positioning key 21 . In addition, the photographing section 300 may recognize the alignment mark 11 and the alignment key 21 at the same time, or recognize any one of the alignment mark 11 and the alignment key 21 first and recognize the other based thereon. Therefore, the position of the positioning mark 11 and the positioning key 21 can be recognized by the imaging unit 300 to confirm the error between the positioning mark 11 and the positioning key 21 relative to the target position.

In this way, the photographing part 300 recognizes the relative position between the first positioning mark 11a and the first positioning key 21a and the relative position between the second positioning mark 11b and the second positioning key 21b, so that the photographing part 300 complementarily recognizes the position and The effect of whether or not the mold 10 and the substrate 20 are located at the target positions can be more accurately recognized.

The imaging unit 300 is configured to adjust one or more of a horizontal position, a vertical position, and an angle so that the viewing angle faces the position where the alignment mark 11 and the alignment key 21 are formed.

The imaging unit 300 may be configured to have a first focal length for recognizing the positioning mark 11 and a second focal length for recognizing the positioning key 21 , and the focal length may be changed to the first focal length or the second focal length. For example, the focal length of the imaging unit 300 may be changed from the first focal length to the second focal length in order to recognize the positioning key 21 after recognizing the positioning mark 11 .

Based on the recognition of the positioning marks 11 and positioning keys 21 of the imaging unit 300 , one or more of the first pressing unit 100 and the second pressing unit 200 can be moved to align the horizontal positions of the mold 10 and the substrate 20 .

The photographing part 300 may include an upper photographing part 310 and a lower photographing part 320 .

The upper imaging part 310 can recognize at least one of the positioning mark 11 and the positioning key 21 . For example, when the mold 10 is made of opaque material so that light cannot pass through between the positioning mark 11 and the positioning key 21 , the upper photographing part 310 can identify the positioning mark 11 of the mold 10 . As another example, when the mold 10 is made of an opaque material and light is transmitted between the positioning mark 11 and the positioning key 21 , the upper imaging part 310 can identify all the positioning mark 11 and the positioning key 21 .

The upper imaging unit 310 can move horizontally between the imaging position and the non-imaging position in order to recognize one or more of the positioning mark 11 and the positioning key 21 . For example, the upper imaging unit 310 may move to one or more imaging positions for identifying the positioning mark 11 and the positioning key 21 . Here, as shown in FIG. 6 , the photographing position may mean that the upper photographing part 310 is arranged at a predetermined position above the mold 10 and the substrate 20 for identifying the positioning mark 11 and the positioning key 21 . As another example, the upper imaging unit 310 may move to a non-imaging position where the positioning mark 11 and the positioning key 21 are not recognized. Here, as shown in FIG. 7 , the non-photographing position may mean that the upper photographing part 310 moves horizontally from the photographing position, that is, the upper side predetermined position of the mold 10 and the substrate 20, in order not to recognize the positioning mark 11 and the positioning key 21. configuration. In addition, the non-photographing position may mean an arrangement spaced apart from the photographing position along the horizontal direction.

The upper imaging part 310 may be formed in plural. In addition, the upper photographing part 310 may include a first upper photographing part and a second upper photographing part. In addition, the first upper imaging part can recognize one or more of the first positioning mark 11a and the first positioning key 21a. In addition, the second upper imaging part can recognize one or more of the second positioning mark 11b and the second positioning key 21b.

The lower imaging unit 320 may take an image through the imaging path 210 a of the substrate placement unit 210 in order to recognize one or more of the alignment mark 11 and the alignment key 21 . In addition, when the upper imaging part 310 recognizes any one of the positioning mark 11 and the positioning key 21 , the lower imaging part 320 can recognize the other one through the imaging path 210 a of the board placement part 210 . For example, when the substrate 20 is made of an opaque material so that light cannot pass through between the positioning mark 11 and the positioning key 21 , the positioning key 21 of the substrate 20 can be identified. As another example, when the substrate 20 is made of a transparent material to transmit light between the positioning mark 11 and the positioning key 21 , the lower imaging unit 320 can identify all the positioning mark 11 and the positioning key 21 through the imaging path 210 a.

As shown in FIG. 5 , the lower imaging unit 320 may be disposed on a lower side than the upper imaging unit 310 and connected to the second pressing unit 200 . For example, the lower photographing part 320 may be connected to the lower side of the substrate seating part 210 . Therefore, when the substrate placing part 210 is moved by the positioning part 220 and the lifting part 230 , the lower imaging part 320 can move together. In other words, if the mold 10 moves horizontally or the mold 10 moves vertically, the lower photographing part 320 can move together.

The lower photographing part 320 may be formed in plural. In addition, the lower photographing part 320 may include a first lower photographing part and a second lower photographing part. In addition, the first lower photographing part can recognize one or more of the first positioning mark 11a and the first positioning key 21a. In addition, the second lower photographing part can recognize one or more of the second positioning mark 11b and the second positioning key 21b.

In the above, it is described that the imaging unit 300 includes the upper imaging unit 310 and the lower imaging unit 320, but the concept of the present invention is not limited thereto, and the imaging unit 300 may only include any one of the upper imaging unit 310 and the lower imaging unit 320. . For example, when only any one of the upper photographing part 310 and the lower photographing part 320 is included, the included one can recognize all the positioning marks 11 and the positioning keys 21 . As another example, when both the upper imaging unit 310 and the lower imaging unit 320 are included, the upper imaging unit 310 may recognize any one of the positioning mark 11 and the positioning key 21 , and the lower imaging unit 320 may recognize the other.

In this way, even if the mold 10 is an impermeable mold or the positioning key 21 is formed under the impermeable substrate, the imaging unit 300 can position the mold 10 and the substrate 20 at the target position.

The following is a description of the UV irradiation unit 400 .

The UV irradiation unit 400 may irradiate the resin with UV to cure the resin formed on the substrate 20 .

The UV irradiation unit 400 can move horizontally between an irradiation position and a non-irradiation position in order to irradiate the resin with UV. For example, the UV irradiation unit 400 may be moved to an irradiation position for irradiating resin with UV. Here, as shown in FIG. 7 , the irradiation position may mean that the UV irradiation unit 400 is arranged at a predetermined position above the mold 10 and the substrate 20 in order to irradiate the resin with UV. In addition, the irradiation position may mean a state where the second pressing unit 200 rises toward the first pressing unit 100 . As another example, the UV irradiation unit 400 may move to a non-irradiation position for not irradiating UV. Here, as shown in FIG. 6 , the non-irradiation position may mean that the UV irradiation unit 400 is arranged away from the irradiation position, that is, a predetermined position above the mold 10 and the substrate 20 so as not to irradiate the resin with UV. In addition, the non-irradiation position may mean being spaced apart from the irradiation position along the horizontal direction.

The UV irradiation unit 400 and the upper imaging unit 310 may be spaced apart in the horizontal direction. In addition, the UV irradiation part 400 and the upper photographing part 310 may be located on the upper side of the first pressing unit 100 .

The following is a description of the driving unit 500 .

1, FIG. 4, FIG. 6, FIG. 7, FIG. 9 and FIG. 18, the driving part 500 can move the upper shooting part 310 along the horizontal direction between the shooting position and the non-shooting position. In addition, the drive unit 500 can move the UV irradiation unit 400 in the horizontal direction between the irradiation position and the non-irradiation position.

The driving part 500 may include a support body 510 and a support body actuator 520 .

The support body 510 can support the upper imaging unit 310 and the UV irradiation unit 400 . In addition, the support body 510 may be configured so that when the support body 510 moves horizontally, the upper imaging unit 310 and the UV irradiation unit 400 move horizontally together.

The support actuator 520 can move the upper imaging unit 310 and the UV irradiation unit 400 together in the horizontal direction by moving the support 510 in the horizontal direction. For example, the support body actuator 520 may move the upper photographing part 310 to the photographing position so that the upper photographing part 310 recognizes one or more of the positioning mark 11 and the positioning key 21 . In this case, the support actuator 520 may move the UV irradiation unit 400 to the non-irradiation position. As another example, the support actuator 520 may move the UV irradiation unit 400 to an imaging position so that the UV irradiation unit 400 irradiates UV to the resin. In this case, the support body actuator 520 may move the upper imaging part 310 to the non-imaging position.

The supporting body actuator 520 may include a ball screw motor, and the supporting body 510 may move in a horizontal direction by being driven by the ball screw motor. In addition, the upper photographing part 310 may be selectively moved to the photographing position by the support actuator 520 or the UV irradiation part 400 may be selectively moved to the irradiation position by the support actuator 520 . In addition, the support actuator 520 can selectively move the upper imaging unit 310 to the imaging position or the UV irradiation unit 400 to the irradiation position, so the upper imaging unit 310 and the UV irradiation unit 400 can be arranged separately without interference. Work in the state where the upper side of the mold 10 and the substrate 20 are in a predetermined position.

The following is a description of the control unit 600 .

The control unit 600 can control the operations of the first pressing unit 100 , the second pressing unit 200 , the photographing unit 300 , the UV irradiation unit 400 and the driving unit 500 .

The control unit 600 may control any one of the first pressing unit 100 and the second pressing unit 200 to move toward the other. In other words, the control unit 600 may drive one or more of the first pressing unit 100 and the second pressing unit 200 to bring the mold 10 and the substrate 20 closer to each other. For example, the control unit 600 may control the lifting unit 230 of the second pressing unit 200 to lift the substrate 20 .

The control unit 600 can control the photographing unit 300 to recognize the positioning mark 11 and the positioning key 21 . In other words, the control unit 600 can control one or more of the upper imaging unit 310 and the lower imaging unit 320 to recognize the positioning mark 11 and the positioning key 21 . For example, when the light passes between the positioning mark 11 and the positioning key 21, the upper photographing part 310 or the lower photographing part 320 can recognize all the positioning marks 11 and the positioning key 21, so that the control part 600 controls the first pressing unit 100 and the second pressing unit 100. Unit 200. As another example, when the light does not pass between the positioning mark 11 and the positioning key 21, it may be that the upper imaging part 310 recognizes the positioning mark 11, and the lower imaging part 320 recognizes the positioning key 21, thereby controlling the first pressing unit 100 and the second pressing unit 100. Press unit 200 .

The control part 600 can control the position adjustment part 220 to adjust the horizontal position of the substrate placement part 210 . In addition, the control unit 600 may control one or more of the first adjustment unit 221 , the second adjustment unit 222 , and the third adjustment unit 223 in order to adjust the horizontal position of the substrate 20 .

The control unit 600 may control the driving unit 500 so that the UV irradiation unit 400 is located at the irradiation position for irradiating the resin with UV, and the control unit 600 may control the driving unit 500 to move the imaging unit 300 to the non-imaging position. In addition, the control unit 600 may control the driving unit 500 so that the upper imaging unit 310 is located at the imaging position and the UV irradiation unit 400 is moved to the non-irradiation position so that the imaging unit 300 recognizes the positioning mark 11 and the positioning key 21 .

On the other hand, when the mold 10 is horizontally moved by the positioning unit 220 , the control unit 600 can control the imaging unit 300 to recognize the positioning mark 11 and the positioning key 21 continuously. For example, when the substrate placing part 210 moves horizontally, the upper imaging part 310 is fixed to the upper side of the mold 10 to continuously recognize the positioning marks 11 . As another example, the lower photographing part 320 may continuously recognize the positioning key 21 by being fixed to the lower side of the substrate seating part 210 and moving horizontally together with the substrate seating part 210 . In this way, during the continuous identification of the positioning mark 11 and the positioning key 21 , the control unit 600 can control the positioning unit 220 so as to quickly move the positioning mark 11 and the positioning key 21 to the target position.

The control unit 600 can control the lifting unit 230, the imaging unit 300 and the positioning unit 220, so that when the substrate 20 is raised to a predetermined distance by the lifting unit 230, the imaging unit 300 recognizes the positioning mark 11 and the positioning key 21, and the positioning unit 220 adjusts the positioning of the substrate. The horizontal position of the placing part 210. In addition, the control unit 600 can control the positioning unit 220, the lifting unit 230, and the imaging unit 300, so that when the substrate 20 has been raised by a predetermined distance through the lifting unit 230, the imaging unit 300 will re-identify the positioning mark 11 and the positioning key 21, and adjust the position. The part 220 readjusts the horizontal position of the substrate placing part 210 .

When the bellows 240 is in contact, the control unit 600 may control the adjustment unit 220 to readjust the horizontal position of the substrate placement unit 210 . In addition, the control unit 600 may control the position adjustment unit 220 so that when the corrugated tube 240 is in a contact state, the level of the substrate placement unit 210 is adjusted within a smaller movement range than when the horizontal position of the substrate placement unit 210 is adjusted for the first time. Location. In other words, when the corrugated tube 240 is in a contact state, the control unit 600 can control the positioning unit 220 to move the substrate placing unit 210 within a small moving range. In addition, when the corrugated tube 240 is in the contact state, the movable range of the substrate mounting part 210 is below the predetermined gap of the storage groove 263b, so the small moving range may be below the predetermined gap of the storage groove 263b. For example, the minute movement range may be 0.5 mm or less.

When the corrugated tube 240 is in the contact state, the effect of the control unit 600 readjusting the horizontal position of the substrate placement unit 210 will be described. Even if the position adjustment part 220 adjusts the horizontal position of the substrate placement part 210 so that the mold 10 and the substrate 20 are arranged at the target position, when one end of the bellows 240 contacts the first pressing unit 100, the position of the substrate placement part 210 can be set at a predetermined position. The scope changes.

In this way, when the bellows 240 is in contact, the control unit 600 can adjust the horizontal position of the substrate placement unit 210 again, thereby having the effect of accurately adjusting the positions of the mold 10 and the substrate 20 .

When the mold 10 and the substrate 20 are pressed, the control unit 600 can control the driving unit 500 such that the UV irradiation unit 400 is located at the irradiation position and the upper imaging unit 310 is moved to the non-imaging position in order to irradiate the resin with UV. In addition, the control unit 600 may control the UV irradiation unit 400 such that the UV irradiation unit 400 irradiates UV to the resin in order to cure the resin of the substrate 20 .

Hereinafter, referring to FIG. 20 , a method ( S10 ) of manufacturing a pattern substrate by pressing the mold 10 formed with the pattern and the positioning marks 11 and the substrate 20 formed with the resin and the positioning keys 21 according to an embodiment of the present invention will be described. Here, a “pattern substrate” is defined as the substrate 20 in which the pattern of the mold 10 is transferred to the resin of the substrate 20 .

The method ( S10 ) of manufacturing a pattern substrate may produce a pattern-transferred substrate 20 . In addition, in the method ( S10 ) of manufacturing a pattern substrate, the pattern may be transferred to the resin by pressing the mold 10 formed with the pattern and the alignment mark 11 against the substrate 20 formed with the resin and the alignment key 21 .

The method (S10) for manufacturing a pattern substrate may include a clamp fixing step (S100), a moving step (S200), a lifting step (S300), a photographing step (S400), a first position adjustment step (S500), and a sealing step (S600) , a second position adjustment step (S700), a substrate pressing step (S800), a curing step (S900), a sealing releasing step (S1000), a lowering step (S1100), and a clamp releasing step (S1200).

In the clamp fixing step ( S100 ), the mold jig 111 may be fixed to the first pressing unit 100 side by the clamp 112 . In addition, the mold fixture 111 can be fixedly supported in the clamp 112 , and the mold 10 can be placed in the mold fixture 111 . In addition, the clamp fixing step ( S100 ) may be performed before the photographing step ( S400 ).

In the moving step ( S200 ), the mold 10 and the upper imaging part 310 may be moved in the horizontal direction.

The moving step (S200) may include a mold horizontal moving step (S210) and a photographing part moving step (S220).

In the mold horizontal moving step ( S210 ), the center position of the mold support 110 for supporting the mold 10 may be moved in the horizontal direction. In other words, in the mold horizontal moving step ( S210 ), the mold 10 may be moved to arrange the mold 10 at a predetermined position above the substrate 20 by moving the mold support 110 in the horizontal direction. In addition, the mold horizontal moving step (S210) may be performed before the photographing step (S400).

In the photographing unit moving step ( S220 ), the upper photographing unit 310 may be moved to a photographing position for identifying the positioning mark 11 and the positioning key 21 . In addition, in the imaging unit moving step ( S220 ), the upper imaging unit 310 may be moved in the horizontal direction by the driving unit 500 . In addition, the photographing part moving step (S220) may be performed before the photographing step (S400), and may be performed simultaneously with the mold horizontal moving step (S210) or separately.

In the lifting step ( S300 ), the positioning unit 220 may be lifted up by the lifting unit 230 to make the substrate 20 approach the first pressing unit 100 .

In the photographing step ( S400 ), the photographing unit 300 may photograph the alignment marks 11 formed on the mold 10 and the alignment keys 21 formed on the substrate 20 . In addition, in the photographing step ( S400 ), the photographing unit 300 can recognize the positioning mark 11 and the positioning key 21 , and the control unit 600 can judge whether the mold 10 and the substrate 20 are located at the target position through the images photographed by the photographing unit 300 .

In the first position adjustment step ( S500 ), the position adjustment unit 220 may adjust the horizontal position of the substrate 20 . In addition, in the first positioning step ( S500 ), based on the positions of the positioning marks 11 and the positioning keys 21 recognized in the photographing step ( S400 ), the control unit 600 adjusts the horizontal position of the substrate 20 so that the positioning marks 11 are located at Between the positioning keys 21.

The photographing step ( S400 ) and the first positioning step ( S500 ) may be performed when the substrate 20 has risen by a predetermined distance in the lifting step ( S300 ). In addition, the photographing step ( S400 ) and the first positioning step ( S500 ) may be performed again when the substrate 20 has risen more than a predetermined distance through the lifting step ( S300 ).

In the sealing step ( S600 ), the space around the substrate 20 may be sealed from the outside by the bellows 240 , and gas remaining in the space around the substrate 20 may be exhausted to the outside by the second exhaust unit 250 . In addition, in the sealing step ( S600 ), the bellows 240 may be provided in a contact state in which the bellows moving part 260 is extended to contact the mold jig 111 . In addition, the space around the UV transmission window 120 can be sealed from the outside by the sealing part 130 , and the gas remaining in the space around the UV transmission window 120 can be exhausted to the outside by the first exhaust part 140 . In addition, the sealing step ( S600 ) may be performed after the first adjusting step ( S500 ) and before the second adjusting step ( S700 ).

In the second positioning step ( S700 ), after the sealing step ( S600 ), the positioning unit 220 may readjust the horizontal position of the substrate 20 . The horizontal moving distance of the substrate 20 through the second positioning step ( S700 ) may be less than or equal to a predetermined gap between the shaft 261 a and the receiving groove 263 b surrounding it. In addition, the horizontal movement distance of the substrate 20 through the second alignment step ( S700 ) may be smaller than the horizontal movement distance of the substrate 20 through the first alignment step ( S500 ).

The second positioning step ( S700 ) may be performed multiple times before the substrate pressing step ( S800 ), and the photographing step ( S400 ) may be performed each time the second positioning step ( S700 ) is performed. In addition, the position adjustment part 220 can adjust the horizontal position of the substrate 20 through the second position adjustment step ( S700 ), and the bellows 240 can be elastically deformed in a contact state.

In the substrate pressing step ( S800 ), the positioning unit 220 may be raised by the lifting unit 230 to press the mold 10 and the substrate 20 . At this time, the pattern formed on the mold 10 can be transferred to the resin formed on the substrate 20 .

In the curing step ( S900 ), the resin of the substrate 20 may be irradiated with UV by the UV irradiation unit 400 to cure the resin.

The curing step ( S900 ) may include a UV irradiation part moving step ( S910 ) and a UV irradiation step ( S920 ).

In the UV irradiation unit moving step ( S910 ), the UV irradiation unit 400 may be moved to an irradiation position for irradiating the resin with UV. In addition, the UV irradiation part moving step ( S910 ) may be performed after the substrate pressing step ( S800 ).

In the UV irradiation step ( S920 ), the UV irradiation unit 400 may irradiate the resin with UV. In this way, in the UV irradiation step ( S920 ), the resin can be cured by irradiating UV to the resin.

In the sealing release step ( S1000 ), gas may flow into the space around the substrate 20 to open the space around the substrate 20 to the outside. In addition, the bellows 240 can be contracted by the airtight release step ( S1000 ). In addition, gas may flow into the space around the UV transmission window 120 . In addition, the sealing release step ( S1000 ) may be performed after the substrate pressing step ( S800 ).

In the descending step ( S1100 ), the positioning unit 220 may be lowered by the lifting unit 230 to separate the positioning unit 220 from the first pressing unit 100 .

In the clamp release step ( S1200 ), the clamp 112 may be released from the first pressing unit 100 side. It may be that a mold fixture 111 is fixedly supported in the clamp 112 , and the mold 10 is placed in the mold fixture 111 .

On the other hand, in the descending step ( S1100 ), the substrate 20 may or may not be separated from the mold 10 . For example, the substrate 20 may be lowered together with the positioning part 220 to separate the substrate 20 from the mold 10 . As another example, in the state where the substrate 20 and the mold 10 are pressed, the positioning unit 220 descends, and in the transfer device 1 capable of aligning the pattern, the transfer of the substrate 20 from the mold 10 can be performed by transferring to another separation device. separate. At this time, the mold 10 and the substrate 20 pressed by the mold 10 may be placed in the mold jig 111 in the clamp releasing step ( S1200 ).

On the other hand, the method ( S10 ) for manufacturing a pattern substrate according to an embodiment of the present invention may be implemented in the form of a computer program executing the method and stored in a computer-readable recording medium. The computer-readable recording medium may include program commands, data files, data structures, etc. alone or in combination. The program commands recorded in the computer-readable recording medium may be specially designed and constructed for the embodiment, or known and usable by computer software technicians. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, and optical media such as floptical disks. Magneto-optical media (magneto-optical media), read-only memory (ROM), random access memory (RAM), flash memory, etc. are specially configured to store program commands and execute hardware devices .

For example, a computer program stored in a computer-readable recording medium may be programmed to execute the storing step, calculating step, and outputting step.

In the storing step, the image information of the positioning mark 11 and the positioning key 21 photographed by the photographing unit 300 may be stored in a computer-readable recording medium.

In the calculation step, the position information of the positioning mark 11 and the positioning key 21 can be calculated based on the image information stored in the computer-readable recording medium. For example, the calculated position information may be an error value related to the target position between the positioning mark 11 and the positioning key 21 .

In the output step, an operation command for adjusting the position of the mold 10 or the substrate 20 may be output based on the calculated position information. In addition, it can be determined in advance whether the mold 10 and the substrate 20 are located at the target position based on the position information calculated before outputting the operation command, and whether to output the operation command to adjust the position of the mold 10 or the substrate 20 can be determined based on the determined information. Here, the determination of whether or not it is located at the target position can be determined in various ways.

On the other hand, the calculation step can calculate the position of the positioning key 21 calculated from the image information of the positioning key 21 captured by the lower imaging unit 320 to the image information of the positioning mark 11 captured by the upper imaging unit 310. In the outputting step of calculating the path value of the position of the positioning mark 11 , the center position of the image information of the positioning key 21 captured by the lower photographing unit 320 can be output based on the calculated path value to adjust the position. In other words, the lower imaging part 320 is fixed to the lower side of the substrate mounting part 210 and moves horizontally together with the substrate mounting part 210, and the relative position between the central position of the image information and the positioning mark 11 will not change even if the substrate mounting part 210 moves horizontally. change. The central position of the image information of such positioning marks 11 may be the central position of the mold 10 shown in FIG. 2 . In addition, the central position of the image information of the positioning key 21 may be the central position of the substrate 20 shown in FIG. 3 .

As mentioned above, although the Example of this invention was demonstrated as concrete implementation, it is only an illustration, and this invention is not limited to this, It should interpret as having the widest range based on the technical idea disclosed in this specification. Combinations/substitutions of the disclosed embodiments may be made by those skilled in the art to implement patterns of shapes not proposed, without departing from the scope of the present invention. In addition, those skilled in the art can easily make changes or modifications to the disclosed embodiments based on this specification, and such changes or modifications also obviously belong to the right scope of the present invention.

1: Transfer printing device capable of aligning patterns 10: Mold 11: positioning mark 11a: First positioning mark 11b: Second positioning mark 20: Substrate 21: positioning key 21a: The first positioning key 21b: Second positioning key 100: the first pressing unit 110: Mold support 111: Die fixture 111a: clamp sealing part 112: Clamp 112a: sliding part 112b: clamp body 113: clamp mover 114: Mover support 120:UV through the window 130: Sealed part 140: The first exhaust part 150: sealing part sealing part 200: the second pressing unit 210: Substrate placement department 210a: Shooting path 210a-1: First Path Division 210a-2: Second Path Division 211: Place the body of the department 211a: upper installation part 211b: lower installation part 213: block window 213a: The first blocking window 213b: Second blocking window 214: Block parts 214a: the first shielding component 214b: the second shielding component 220: Position adjustment department 221: First Adjustment Department 222: Second Adjustment Department 223: The third adjustment department 230: Lifting Department 240: Bellows 241: Bellows sealing parts 250: Second exhaust part 260: bellows moving part 261:Lift cylinder 261a: Shaft 261b: Cylinder Actuator 262: block 263: Bellows connection 263a: placement slot 263b: storage slot 280: Shooting Guidance Department 290: Reflection Department 300: Photography Department 310: On the shooting department 320: Lower shooting department 400:UV irradiation department 500: drive unit 510: support body 520: Support body actuator 600: control department S: separated space S10: the method for manufacturing pattern substrate S100～S1200: Steps

FIG. 1 is a perspective view of a transfer device capable of aligning patterns according to an embodiment of the present invention. FIG. 2 is a plan view of the mold of FIG. 1 . FIG. 3 is a bottom view of the substrate of FIG. 1 . FIG. 4 is a cross-sectional view taken along AA' of FIG. 1 . 5 is a cross-sectional view taken along AA' of FIG. 1 when the second pressing unit moves in an upper direction. FIG. 6 is a cross-sectional view taken along BB' of FIG. 1 . FIG. 7 is a cross-sectional view taken along BB' when the photographing part of FIG. 1 is moved to a non-photographing position. FIG. 8 is an enlarged view of B in FIG. 6 . Fig. 9 is a side view of Fig. 1 . FIG. 10 is an exploded perspective view of the mold support of FIG. 1 . Fig. 11 is a perspective view showing the jaws moving along the underside to be inserted into the mold jig. Fig. 12 is a perspective view showing a state in which the mold jig is moved to the space between the tongs and the sealing part and set in the tongs. FIG. 13 is an enlarged view of D in FIG. 9 , and is a perspective view showing a state where the mold jig is moved to the space between the clamp and the sealing portion and placed in the clamp. Fig. 14 is a front view showing the mold jig interposed between the clamp and the sealing part so that the mold jig comes into contact with the sealing part. FIG. 15 is an enlarged view of C in FIG. 4 . FIG. 16 is an enlarged view of E in FIG. 9 . FIG. 17 is a cross-sectional view taken along XX' of FIG. 16 . Fig. 18 is an exploded perspective view of Fig. 1 . FIG. 19 is an exploded perspective view of the bottom surface of FIG. 1 . FIG. 20 is a flowchart schematically showing a method of manufacturing a pattern substrate according to an embodiment of the present invention.

100: the first pressing unit

120:UV through the window

200: the second pressing unit

221: First Adjustment Department

222: Second Adjustment Department

223: The third adjustment department

230: Lifting Department

300: Photography department

400:UV irradiation department

500: drive unit

600: control department

Claims (13)

A manufacturing device for a patterned substrate, comprising: a first pressing unit supporting a mold forming a pattern; and a second pressing unit supporting a substrate formed with a resin, The second pressing unit includes: a substrate placement part supporting the substrate; a position adjustment part, which adjusts the horizontal position of the substrate placement part; and a bellows, one end of which is in contact with the first pressing unit when it is extended, so that the space around the substrate can be sealed from the outside, The position adjusting part adjusts the horizontal position of the substrate placing part in a contact state where one end of the corrugated tube is in contact with the first pressing unit. The manufacturing device according to claim 1, wherein, The second pressing unit also includes: a bellows moving part, supported by the outer surface of the substrate placement part, and connected to the bellows to extend and contract the bellows, The bellows moving part consists of: a lift cylinder comprising a shaft and a cylinder actuator providing drive force for moving the shaft; a piece, positioned at the end of the shaft; and a bellows connection supporting the block to allow movement of the block in a horizontal direction, In the bellows connecting portion are formed a seating groove extending in the horizontal direction to accommodate the block and a receiving groove extending in the up-down direction to communicate with the seating groove and surrounding the shaft with a predetermined gap, When the horizontal position of the substrate placement part is adjusted in the contact state, the shaft moves in the storage groove along the horizontal direction. The manufacturing device according to claim 1, wherein, The bellows is elastically deformed in the contact state to allow adjustment of the horizontal position of the substrate seating portion. The manufacturing device according to claim 1, wherein, The first pressing unit also includes: a mold clamp supporting the edge portion of the mold in contact with an end portion of the bellows when the bellows is in the contact state; a clamp supporting the edge of the mold jig to fix the mold jig to the first pressing unit side; and a sealing part, the lower part of which is in contact with the upper part of the mold fixture, The clamp includes, a sliding part supporting the mold fixture from below, The mold jig is inserted between the sliding member and the sealing portion and is supported by the clamp. The manufacturing device according to claim 1, wherein, The first pressing unit also includes; a mold clamp supporting the edge portion of the mold in contact with an end portion of the bellows when in the contact state, A clamp closure part is provided in the mold clamp, A bellows sealing member is provided at one end of the bellows, When in the contact state, the jig sealing member and the bellows sealing member contact each other in order to prevent gas from flowing between the mold jig and an end portion of the bellows, The jig sealing member and the bellows sealing member have shapes different from each other. The manufacturing device according to claim 1, wherein, The first pressing unit includes: a mold clamp supporting the edge of the mold in contact with an end of the bellows when in the contact state; A UV transparent window supports the mold and allows UV to pass through; A sealing part protrudes in an annular shape and is in contact with the mold fixture below so as to be able to seal the periphery of the UV transmission window relative to the outside; and A first exhaust part for discharging gas remaining in the space sealed inside the sealing part to the outside when the sealing part seals the surrounding space of the UV transmission window from the outside. The manufacturing device according to claim 6, wherein, The second pressing unit also includes: a second exhaust portion for discharging gas remaining in the space sealed inside the bellows to the outside when the bellows seals the space around the substrate from the outside, The first exhaust part and the second exhaust part work to prevent the difference between the gas pressure inside the sealing part and the gas pressure inside the bellows from exceeding a predetermined range. The manufacturing device according to any one of claim 1 to claim 7, wherein, The manufacturing unit also includes: A control part controls the operation of the first pressing unit, the second pressing unit and the position adjusting part. A method of manufacturing a pattern substrate, which presses a substrate formed with a resin and a positioning key with a mold formed with a pattern and a positioning mark to manufacture a pattern substrate, wherein, The method for manufacturing a patterned substrate comprises the following steps: a photographing step, a photographing part photographs the positioning mark formed on the mold and the positioning key formed on the substrate; A first position adjustment step, a position adjustment unit adjusts the horizontal position of the substrate; A sealing step, a bellows sealing the space around the substrate relative to the outside, and discharging gas remaining in the space around the substrate to the outside; a second position adjustment step, after the sealing step, the position adjustment part adjusts the horizontal position of the substrate again; and A substrate pressing step, pressing the substrate to the mold. The method of manufacturing a pattern substrate according to claim 9, wherein, one or more of the first alignment step and the second alignment step are performed multiple times before the substrate pressing step, The photographing step is executed each time the first adjusting step and the second adjusting step are executed. The method of manufacturing a pattern substrate according to claim 9, wherein, The method for manufacturing a patterned substrate also includes the following steps: A lifting step, a lifting part makes the positioning part rise, Executing the lifting step, the photographing step and the first positioning step multiple times, so that when the substrate is raised by a predetermined distance through the lifting step, the photographing step and the first positioning step are performed, and when the substrate passes through When the lifting step rises greater than the predetermined distance, the photographing step and the first positioning step are executed again. The method of manufacturing a pattern substrate according to claim 9, wherein, The horizontal movement distance of the substrate moved by the second positioning step is smaller than the horizontal movement distance of the substrate moved by the first positioning step. A computer-readable recording medium storing a computer program for executing a method of manufacturing a pattern substrate by pressing a mold formed with a pattern and a positioning mark on a substrate formed with a resin and a positioning key, wherein, The computer program is designed to perform the following steps: a storing step, storing an image information of the positioning key captured by the lower imaging unit and the positioning mark captured by the upper imaging unit in the computer-readable recording medium; an operation step, based on the image information stored in the computer-readable recording medium, to calculate a position information of the positioning mark and the positioning key; and An output step, outputting an action command for adjusting the position of the mold or the substrate based on the calculated position information, The calculation step obtains a path value for moving the calculated position of the positioning key to the calculated position of the positioning mark, The outputting step further outputs an action command for adjusting a central position of the image information of the positioning key according to the obtained path value.

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