KR101953761B1 - Apparatus for manufacturing replication stamp and manufacture method thereof - Google Patents

Abstract

The present invention relates to an apparatus and a method for manufacturing a duplication stamp which uniformly form the thickness of an intermediate layer making up a duplication stamp when manufacturing the duplication stamp. According to the present invention provides the apparatus for manufacturing a duplication stamp, which manufactures a duplication stamp created by sequentially laminating a substrate layer, an intermediate layer, and a pattern layer, comprises: a support chuck for supporting the substrate layer; a pressing chuck for pressing a master substrate on which the pattern layer is laminated towards the substrate layer; a thickness adjustment member arranged between the substrate layer and the master substrate to adjust the thickness of an intermediate layer material to form the intermediate layer; a support rod vertically arranged on an upper surface of the support chuck; and a support bar wherein one end thereof is coupled to the pressing chuck, and the other end thereof is coupled to be slid with respect to the support rod to allow the pressing chuck to descend towards the support chuck, and also provides a manufacturing method thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a replica stamp manufacturing apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a replica stamp manufacturing apparatus and a manufacturing method thereof, and more particularly, to a replica stamp manufacturing apparatus capable of uniformly forming a thickness of an intermediate layer constituting a replica stamp when a replica stamp is manufactured, ≪ / RTI >

The UV nanoimprinting process is a process in which a stamp having a pattern to be copied is brought into contact with a substrate coated with a UV resin so that the resin fills the patterns of the stamp and the UV light is used to cure the resin The pattern of the stamp is copied to the resin of the substrate.

Recently, SUSS MicroTec has partnered with Philips to commercialize a new UV nanoimprinting process called SCIL (Substrate Conformal Imprint Lithography). In the SCIL process, a master substrate is generally manufactured by using photo lithography or e-beam lithography on a silicon wafer, and a duplicate stamp is produced. This replica stamp uses thin glass as a substrate and consists of a h-PDMS replicating the pattern of the master substrate and a PDMS layer between the glass substrate and the h-PDMS.

In the conventional manufacturing process of the duplicate stamp, h-PDMS is attached and cured over the whole area of the master substrate, and then the PDMS is dropped thereon (to be a substrate in the future) . When the PDMS layer thus formed is cured and then the master substrate is removed, the production of the duplicate stamp is completed.

The most important part in fabricating such a duplicate stamp is a step of dropping a proper amount of PDMS and covering a thin glass so that a uniform thickness of PDMS can be formed on the entire surface of the master substrate. However, in the actual process, the PDMS is not uniformly distributed over the entire surface of the master substrate, so that a uniform PDMS layer can not be formed.

Korean Patent Laid-Open Publication No. 2010-0132282 ("Nanoparticle Thin Film Manufacturing Method and Manufacturing Method of Stamp for Nanoimprint Using It," 2010.12.17)

SUMMARY OF THE INVENTION The object of the present invention is to solve the problems of the prior art, and it is an object of the present invention to provide an apparatus and method for forming an intermediate layer (i.e., a PDMS layer) And a method for producing the same.

In order to achieve the object of the present invention, an apparatus for producing replica stamps according to an embodiment of the present invention is a replica stamp production apparatus for producing a replica stamp comprising a substrate layer, an intermediate layer and a pattern layer successively laminated A support chuck for supporting the substrate layer; A pressing chuck for pressing the master substrate on which the pattern layers are stacked to the substrate layer side; A thickness adjusting member disposed between the substrate layer and the master substrate to adjust a thickness of the intermediate layer material for forming the intermediate layer; A support rod vertically disposed on the upper surface of the support chuck; And a support bar slidably engaged with the support bar so that one end thereof is coupled to the pressure chuck and the other end is capable of descending toward the support chuck.

According to another aspect of the present invention, there is provided a replica stamp manufacturing apparatus, wherein the replica stamp manufacturing apparatus further includes a heater unit disposed below the support chuck and heating the intermediate layer material.

Further, in the duplicating stamp manufacturing apparatus according to an embodiment of the present invention, the supporting rod is coupled to the lower end of the supporting rod, the supporting rod is seated on the supporting chuck, and a portion, which is in contact with the supporting chuck when the pressing chuck is lowered, And a seating member formed to have a curved surface at a portion where the supporting rod is brought into contact with the supporting chuck so as to be rotatable.

In addition, in the replica stamp manufacturing apparatus according to an embodiment of the present invention, the support chuck may further include a seating groove in which the seating member can be seated with a clearance.

Further, in the replica stamp manufacturing apparatus according to an embodiment of the present invention, the support bar may include a through-hole provided so that the support bar penetrates through the support bar, and the support bar may be provided along the longitudinal direction of the support rod through the through- And can be lowered together with the pressurizing chuck while sliding.

Further, in the replica stamp manufacturing apparatus according to an embodiment of the present invention, the supporting bar may include a fixing part for fixing the supporting bar to the supporting bar after the master board and the pattern layer are seated on the thickness adjusting member .

In addition, in the apparatus for producing duplicate stamp according to an embodiment of the present invention, the thickness adjusting member may include a thickness adjusting portion formed to have the same thickness as the desired intermediate layer and seated on the substrate layer, And may include an extension formed by being bent and extending upward.

Further, in the duplicating stamp manufacturing apparatus according to an embodiment of the present invention, the first fixing member protruding from the through hole; A second fixing member formed at a predetermined distance from the first fixing member and formed in the same shape as the first fixing member; And a fixing knob for fixing the support bar to the support bar by narrowing the gap between the first and second fixing members by screwing.

Further, in the duplicating stamp manufacturing apparatus according to an embodiment of the present invention, three support rods are provided at intervals of 120 degrees along the circumferential direction of the pressure chuck, and the thickness adjustment member is provided between the support rods and the adjacent support rods As shown in FIG.

A method of manufacturing a duplicate stamp according to an embodiment of the present invention includes the steps of: a) forming the pattern layer on an upper surface of the master substrate; b) applying an intermediate layer material forming the intermediate layer on the upper surface of the pattern layer; c) disposing the substrate layer above the interlayer material; d) placing the master substrate, the pattern layer, the intermediate layer material, and the substrate layer between the support chuck and the pressurizing chuck such that the top and bottom of the master substrate, the pattern layer, the intermediate layer material and the substrate layer are sequentially stacked from the bottom to the top, Disposing the thickness adjusting member between the substrates; e) pressing the intermediate layer material by lowering the pressurizing chuck by a load of the pressurizing chuck; f) removing the thickness adjustment member and securing the support bar to the support bar after the master substrate and the pattern layer are seated on the thickness adjustment member; g) curing the intermediate layer material to form the intermediate layer; And h) removing the support chuck and the pressure chuck, and removing the master substrate from the pattern layer.

Further, in the method of manufacturing a replica stamp according to an embodiment of the present invention, after the step f), an additional portion of the interlayer material may be injected into an area not filled with the interlayer material.

In addition, in the method of manufacturing a replica stamp according to an embodiment of the present invention, the addition of the intermediate layer material and the intermediate layer material may be the same material.

In the method of manufacturing a duplicate stamp according to an embodiment of the present invention, the substrate layer may be made of glass, the intermediate layer may be made of PDMS (polydimethylsiloxane), and the pattern layer may be made of h-PDMS or X-PDMS.

INDUSTRIAL APPLICABILITY The duplication stamp manufacturing apparatus and its manufacturing method according to the present invention have the effect of producing a duplicate stamp having an intermediate layer of uniform thickness.

In addition, the apparatus and method for manufacturing a duplicate stamp according to the present invention can easily adjust the thickness of a desired intermediate layer by providing a thickness adjusting member having a simple structure.

Further, in the duplicating stamp manufacturing apparatus and the manufacturing method thereof according to the present invention, since the support rods are rotatably provided on the support chuck by the seating members, there is an effect that the pressurizing chuck can be lowered in a state of being held horizontally toward the substrate layer .

1 is a perspective view schematically showing a structure of a duplicate stamp manufacturing apparatus according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a structure of a duplicate stamp manufacturing apparatus according to an embodiment of the present invention.
3 is a perspective view illustrating a structure of a thickness adjusting member according to an embodiment of the present invention.
4 is a view illustrating a state where a thickness adjusting member is disposed between a substrate layer and a master substrate according to an embodiment of the present invention.
5 is a view showing steps of a method of manufacturing a duplicate stamp according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention in which the above-mentioned problems to be solved can be specifically realized will be described with reference to the accompanying drawings. In describing the embodiments, the same names and the same symbols are used for the same configurations, and additional description therefor will be omitted below.

FIG. 1 is a perspective view schematically showing a structure of a duplicate stamp manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic view showing a cross section of a duplicate stamp manufacturing apparatus according to an embodiment of the present invention .

1 and 2, a duplication stamp manufacturing apparatus according to an embodiment of the present invention includes a duplication stamp 10 formed by sequentially laminating a substrate layer 11, an intermediate layer 13, and a pattern layer 15 The replica stamp manufacturing apparatus includes a support chuck 100, a pressurizing chuck 200, a thickness adjusting member 300, a support bar 400, and a support bar 500.

The support chuck 100 supports the substrate layer 11 in a state where the substrate layer 11 is seated.

In one embodiment of the present invention, although the support chuck 100 is shown using a vacuum chuck using vacuum, any chuck may be used provided it has a structure capable of supporting the substrate layer 11. [

The pressure chuck 200 presses the master substrate 17 on which the pattern layer 15 is laminated to the substrate layer 11 side.

More specifically, the pressure chuck 200 descends toward the substrate layer 11 while the upper surface of the master substrate 17 on which the pattern layer 15 is stacked is adsorbed on the lower surface of the pressure chuck 200, (13a) for forming the intermediate layer material (13).

In the embodiment of the present invention, although the vacuum chuck 200 is shown using a vacuum chuck using a vacuum in the same manner as the support chuck 100, it is possible to pressurize the substrate layer 11 by supporting the master substrate 17 Any chuck can be used if it has a structure with a structure.

FIG. 3 is a perspective view illustrating a structure of a thickness adjusting member 300 according to an embodiment of the present invention. FIG. 4 is a cross- And the member 300 is arranged.

3 and 4, the thickness adjusting unit 310 is disposed between the substrate layer 11 and the master substrate 17 to adjust the thickness of the intermediate layer material 13a for forming the intermediate layer 13 do. The thickness adjusting member 300 may include a thickness adjusting portion 310 and an extending portion 320.

The thickness adjusting portion 310 may be formed to have the same thickness as the desired thickness of the intermediate layer 13 and may be mounted on the upper surface of the substrate layer 11 and sandwiched between the substrate layer 11 and the master substrate 17 Lt; / RTI >

 The extension 320 may be bent from the end of the thickness adjuster 310 to extend upward and the thickness adjuster 310 may be coupled to the substrate layer 11, Can be sandwiched between the master substrates (17).

That is, there is an advantage that the thickness of the desired intermediate layer 13 can be formed by adjusting the thickness of the intermediate layer material 13a by the thickness control member 300 of simple structure.

The support bar 400 may be disposed on the upper surface of the support chuck 100 in a vertical direction and supports the pressurizing chuck 200 on the support chuck 100 together with a support bar 500 to be described later.

In the embodiment of the present invention, three support rods 400 are disposed at intervals of 120 degrees along the circumferential direction of the pressurizing chuck 200, and the thickness control member 300 is disposed between the support rods 400 and the adjacent support rods 400 Are arranged at regular intervals. At this time, the support rods 400 are connected to the pressurizing chuck 200 by the support bars 500, which will be described later.

Thus, the pressurizing chuck 200 can be stably supported on the support chuck 100 by the respective support rods 400.

The support rod 400 may further include a seating member 410.

The seating member 410 is coupled to the lower end of the support rod 400 to seat the support rod 400 on the upper surface of the support chuck 100.

Although not shown, the support rod 400 and the seating member 410 can be coupled by a screw fastening structure.

The supporting member 400 is rotated so that a portion of the supporting member 400 which is in contact with the supporting chuck 100 has a curved surface so that the supporting member 400 is rotatable about a portion where the supporting member 400 contacts the supporting chuck 100 when the pressing chuck 200 descends. .

At this time, the seating member 410 may be formed in a spherical shape, and a portion where the seating member 410 is in contact with the support chuck 100 is formed to have a curved surface by being formed in a spherical shape.

Of course, the structure of the seating member 410 does not need to be formed in a spherical shape as a whole, but may also be formed in a hemispherical shape so that only a portion in contact with the supporting chuck 100 has a curved surface.

Meanwhile, the support chuck 100 according to an embodiment of the present invention may further include a seating groove 110 for allowing the seating member 410 to be seated with a clearance therebetween.

That is, when the support rod 400 is rotated on the upper surface of the support chuck 100, the seating member 110 coupled with the support rod 400 is formed so as to be seated with a clearance therebetween , The supporting groove 400 supports the lower end of the seating member 410, so that the supporting bar 400 can be stably rotated without collapsing.

 The support bar 500 may be slidably engaged with the support bar 400 so that one end of the support bar 500 is coupled to the pressurizing chuck 200 and the other end of the support bar 500 can be lowered toward the support chuck 100 have.

More specifically, the support bar 500 supports the pressurizing chuck 200 on the substrate layer 11 together with the support rod 400 described above.

The support bar 500 includes a through hole 510 through which the support bar 400 is inserted so that the support bar 500 slides along the longitudinal direction of the support bar 400 through the through hole 510 And can be lowered together with the pressure chuck 200.

That is, since the supporting bar 500 is in a state in which the supporting bar 400 is installed in the through hole 510 formed in the supporting bar 500 in the process of lowering the pressing chuck 200 to press the master substrate 17, The chuck 200 is guided by the support rods 400 and descends while sliding.

At this time, the support rod 400 is rotated by the seating member 410, so that the pressure chuck 200 can be lowered while maintaining the horizontal position of the pressure chuck 200 with respect to the substrate layer 11.

The support bar 500 connected to the pressurizing chuck 200 may be pressed against the pressurizing chuck 200 if the support bar 400 is fixed to the support chuck 100. In this case, The support bar 500 may be caught by the support bar 400 in the process of descending with the support bar 200. [

When the support bar 500 is caught by the support bar 400, the pressure chuck 200 connected to the support bar 500 may be tilted obliquely to provide a uniform pressing force to the intermediate layer material 13a A problem may occur that it can not be performed.

Therefore, it is preferable that the support bar 400 is rotatably installed by the seating member 410 so that the support bar 500 is not caught by the support bar 400 during the downward movement of the pressure chuck 200.

The supporting bar 500 further includes a coupling part 520 for coupling the supporting bar 500 to the pressing chuck 200 and a fixing part 530 for fixing the supporting bar 500 to the supporting bar 400 can do.

The coupling part 520 is coupled to the coupling groove 521 formed at one side of the supporting bar 500 and the coupling groove 521 to connect one side of the supporting bar 500 to the upper surface of the pressing chuck 200. Member 522 as shown in FIG.

At this time, the engaging portion 520 can couple one side of the supporting bar 500 to the upper surface of the pressing chuck 200 by the screw fastening structure, and a bolt can be used as the engaging member 522.

The fixing portion 530 fixes the supporting bar 500 to the supporting rod 400 after the master substrate 17 and the pattern layer 15 are seated on the thickness adjusting member 300. The fixing portion 530 may include a first fixing member 531 and a second fixing member 532 and a fixing knob 533. [

The first fixing member 531 may protrude from the through hole 510. The second fixing member 532 may be spaced apart from the first fixing member 531 by a predetermined distance, It may be formed in the same shape as the member 531.

The fixing knob 533 can fix the support bar 500 to the support bar 400 by narrowing the gap between the first fixing member 531 and the second fixing member 532 by screwing.

At this time, a screw fastening shaft 533a is provided on one side of the fixing knob 533, and the screw fastening shaft 553a can be installed in a state of passing through the first fastening member 551 and the second fastening member 553 have.

Although not shown, the first fixing member 531 and the second fixing member 532 may be formed with a first screw groove and a second screw groove so that the screw fastening shaft 533a is fastened.

That is, when the fixing knob 533 is operated, the screw fastening shaft 533a is screwed into the first screw groove of the first fixing member 531 and the second screw groove of the second fixing member 532, The gap between the fixing member 531 and the second fixing member 532 is narrowed and the gap between the first fixing member 531 and the second fixing member 532 is narrowed, So that the support bar 400 can be fixed to the support rod 500, which is inserted through the through hole 510.

The apparatus for producing replica stamps according to an embodiment of the present invention may further include a heater unit 600 installed at a lower portion of the support chuck 100 to heat the intermediate layer material 13a.

Although not shown, the heater unit 600 may include a heater body and a heater built in the heater body, and the heater body may have a stage structure supporting the support chuck 100. That is, the intermediate layer material 13a can be heated and cured through the heater of the heater unit 600. [

Hereinafter, a method for manufacturing a duplicate stamp produced by the duplication stamp manufacturing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

5 is a view showing steps of a method of manufacturing a duplicate stamp according to an embodiment of the present invention.

A method of manufacturing a duplicate stamp according to an embodiment of the present invention includes the steps of: a) forming the pattern layer 15 on the upper surface of the master substrate 17; b) 13); c) disposing the substrate layer (11) on the upper side of the intermediate layer material (13a); and d) disposing the master substrate (17), the pattern The intermediate layer material 13a and the substrate layer 11 are sequentially stacked from the lower part to the upper part and are arranged between the support chuck 100 and the pressurizing chuck 200 Disposing the thickness adjusting member 300 between the substrate layer 11 and the master substrate 17 and e) moving the pressurizing chuck 200 downward by a load of the pressurizing chuck 200 And pressing the intermediate layer material (13a) so that the thickness of the master layer (17) and the pattern layer (15) Removing the thickness adjustment member 300 and securing the support bar 500 to the support bar 400 after being seated on the member 300; g) curing the intermediate layer material 13a Forming the intermediate layer 13 and h) removing the support chuck 100 and the pressure chuck 200 and removing the master substrate 17 from the pattern layer 15. [

At this time, although not shown, after step g), the step of implanting an additional portion (not shown) of the interlayer material may be performed on the region where the interlayer material 13a is not filled.

At this time, the addition of the intermediate layer material 13a and the intermediate layer material may be the same material.

At this time, the substrate layer 11 may be made of glass, the intermediate layer 13 may be made of PDMS (polydimethylsiloxane), and the pattern layer 15 may be made of h-PDMS or X-PDMS.

Referring to FIG. 5, a method of manufacturing a duplicate stamp according to an embodiment of the present invention will be described in more detail as follows.

First, as shown in FIG. 5 (a), a pattern layer 15 is formed on the top surface of the master substrate 17 in step a).

The process of forming the pattern layer 15 will be described in detail. First, a pattern layer material (not shown) is applied to the master substrate 17 on which a pattern is formed. At this time, h-PDMS or X-PDMS may be used as the pattern layer material.

 At this time, the material of the pattern layer can be applied by a method such as spin coating, and the thickness of the pattern layer 15 can be controlled by controlling the spin speed of the spin coating.

That is, if the rotation speed of the spin coating is slow, the thickness of the pattern layer 15 becomes thick, and if the spin coating speed is increased, the thickness of the pattern layer 15 can be adjusted to be thin. Accordingly, it is possible to form the desired thickness of the pattern layer 15 by adjusting the rotational speed of the spin coating.

Next, the pattern layer material applied on the master substrate 17 is cured to form the pattern layer 15. [

On the other hand, when the pattern layer material is h-PDMS, it is preferable that the material is cured by heating for a time within a range of 1 to 2 hours at a temperature within a range of 60 to 80 占 폚.

The pattern layer 15 may be formed on the upper surface of the master substrate 17 through the above process.

Next, as shown in FIG. 5B, in step b), a process of disposing the intermediate layer material 13a on the upper surface of the pattern layer 15 is performed. At this time, PDMS can be used for the intermediate layer material 13a, and the PDMS can be placed in a liquid state having a high viscosity and can be arranged by a dropping method.

Next, as shown in FIG. 5C, in step c), a process of disposing the substrate layer 11 on the intermediate layer material 13a is performed. At this time, the intermediate layer material 13a can be primarily cured while being heated by the pressurization by the substrate layer 11 and a separate heating device.

That is, when the substrate layer 11 presses the intermediate layer material 13a, the intermediate layer material 13a is heated to be cured first, in a state in which the intermediate layer material 13a is spread by pressing.

After this process, the following process can be performed through the duplication stamp manufacturing apparatus according to the embodiment of the present invention described above.

5 (d), in the step d), the master substrate 17, the pattern layer 15, the intermediate layer material 13a and the substrate layer 11 are sequentially stacked from the lower part to the upper part The thickness of the intermediate layer 13 is set between the support chuck 100 and the pressurizing chuck 200 so that the thickness of the intermediate layer 13 is formed between the substrate layer 11 and the master substrate 17, The adjusting member 300 is disposed.

The reason for disposing the master substrate 17, the pattern layer 15, the intermediate layer material 13a, and the substrate layer 11 in such a manner that they are vertically shifted in the state where the layers are sequentially stacked from the bottom to the top, So that an additional portion of the intermediate layer material can be discharged to the outside of the substrate layer 11 in the process of filling the insufficient region of the intermediate layer 13 by injecting an additional material.

At this time, since the substrate layer 11 is formed wider than the master substrate 17, it is possible to prevent an additional portion of the intermediate layer material from flowing between the substrate layer 11 and the support chuck 100.

When the master substrate 17 is arranged to be disposed at the lower side, that is, when the master substrate 17 is arranged to be placed on the upper surface of the support chuck 100, in the process of filling the insufficient area of the intermediate layer 13, Because it can flow between the master substrate 17 and the support chuck 100.

At this time, when an additional portion of the intermediate layer material flows between the master substrate 17 and the support chuck 100, the master substrate 17 and the support chuck 100 are separated from each other during the separation of the master substrate 17 and the support chuck 100 So that the master substrate 17 may be damaged.

Therefore, in order to prevent the above problems, the master substrate 17, the pattern layer 15, the intermediate layer material 13a, and the substrate layer 11 are vertically shifted in a state where the layers are sequentially stacked from the bottom to the top It is preferable to arrange it.

On the other hand, the thickness adjusting member 300 can adjust the thickness of the intermediate layer 13. That is, since the thickness of the thickness adjusting part 310 of the thickness adjusting member 300 can be made to correspond to the desired thickness of the intermediate layer 13, the thickness of the intermediate layer 13 can be easily adjusted by a simple structure.

Next, as shown in FIG. 5E, in step e), the pressing chuck 200 is lowered by the load of the pressing chuck 200 so that the intermediate layer material 13a is pressed .

At this time, the pressure chuck 200 is lowered while being guided by the support bar 400 connected to the support bar 500.

5 (f), after the master substrate 17 and the pattern layer 15 are seated on the thickness adjusting member 300, the thickness adjusting member 300 is removed And the process of fixing the support bar 500 to the support bar 400 is performed.

At this time, the distance between the first fixing member 531 and the second fixing member 532 is narrowed by tightening the fixing knob 533 provided at the fixing portion of the supporting bar 500, As shown in Fig.

On the other hand, although not shown, after the step (f), a step of implanting an additional portion of the intermediate layer material into the region where the intermediate layer material 13a is not filled can be performed.

At this time, an additional material of the intermediate layer material may be the same material as the intermediate layer material 13a, and may be injected by a capillary phenomenon using a device such as a syringe.

In this manner, an additional portion of the intermediate layer material 13a is further injected, so that an additional portion of the intermediate layer material is filled in the region where the intermediate layer material 13a is not filled, that is, the edge portion or the region where the thickness adjusting portion 310 is seated.

Next, as shown in Fig. 5 (g), in the step g), the process of forming the intermediate layer is performed by curing the intermediate layer material 13a and the additional portion of the intermediate layer material.

At this time, the curing of the additional layer of the intermediate layer material 13a and the intermediate layer material can be performed by heating through the heater portion 600 provided at the lower portion of the support chuck 100. [ That is, the intermediate layer material 13a and the additional material of the intermediate layer material are hardened by the heating of the heater portion 600 to form the intermediate layer 13. [

5 (h), a process of removing the support chuck 100 and the pressure chuck 200 and removing the master substrate 17 from the pattern layer 15 is performed in step h) do. The manufacturing of the duplicate stamp 10 according to the embodiment of the present invention can be completed through the process as described above.

INDUSTRIAL APPLICABILITY As described above, the duplication stamp manufacturing apparatus and the manufacturing method thereof according to the present invention have the effect of producing a duplicate stamp having an intermediate layer of uniform thickness.

In addition, the apparatus and method for manufacturing a duplicate stamp according to the present invention can easily adjust the thickness of a desired intermediate layer by providing a thickness adjusting member having a simple structure.

Further, in the duplicating stamp manufacturing apparatus and the manufacturing method thereof according to the present invention, since the support rods are rotatably provided on the support chuck by the seating members, there is an effect that the pressurizing chuck can be lowered in a state of being held horizontally toward the substrate layer .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Modify or modify the Software.

10: copy stamp 11: substrate layer
13: intermediate layer 13a: intermediate layer material
15: pattern layer 17: master substrate
100: support chuck 200: pressure chuck
300: thickness adjusting member 400:
500: Support bar

Claims (13)

An apparatus for producing a replica stamp for producing a replica stamp comprising a substrate layer, an intermediate layer and a pattern layer successively laminated,
A support chuck for supporting the substrate layer;
A pressing chuck for pressing the master substrate on which the pattern layers are stacked to the substrate layer side;
A thickness regulating portion disposed between the substrate layer and the master substrate and formed to have the same thickness as the desired thickness of the intermediate layer and seated on the substrate layer; and an extension portion formed by being bent from the end portion of the thickness regulating portion and extending upward A thickness adjusting member for adjusting the thickness of the intermediate layer material for forming the intermediate layer;
A support rod vertically disposed on the upper surface of the support chuck; And
And a support bar slidably engaged with the support bar so that the one end portion is coupled to the pressure chuck and the other end portion is capable of descending toward the support chuck. The method according to claim 1,
And a heater unit installed at a lower portion of the support chuck to heat the intermediate layer material. The method according to claim 1,
So that a portion of the support rod, which is in contact with the support chuck, has a curved surface so that the support rod can be rotated around a portion that is in contact with the support chuck when the pressurizing chuck is lowered, And a formed seating member (130). The method of claim 3,
Wherein the support chuck further comprises a seating groove in which the seating member can be seated with a clearance. The method according to claim 1,
Wherein the support bar includes a through-hole provided so that the support rod penetrates through the support bar,
Wherein the support bar is lowered together with the pressurizing chuck while sliding along the longitudinal direction of the support bar through the through-hole. 6. The method of claim 5,
Wherein the support bar comprises a fixing portion for fixing the support bar to the support bar after the master substrate and the pattern layer are seated on the thickness adjusting member. delete The method according to claim 6,
The fixing unit includes:
A first fixing member protruding from the through hole;
A second fixing member formed at a predetermined distance from the first fixing member and formed in the same shape as the first fixing member; And
And a fixing knob for fixing the support bar to the support bar by narrowing an interval between the first fixing member and the second fixing member by screwing. The method according to claim 1,
The support rod
And three thickness adjusting members are disposed at intervals of 120 degrees along the circumferential direction of the pressing chuck, and the thickness adjusting member is disposed between the supporting rods and the neighboring supporting rods with a predetermined gap therebetween. A duplicate stamp manufacturing method using the duplication stamp manufacturing apparatus according to claim 1,
a) forming the pattern layer on an upper surface of the master substrate;
b) applying an intermediate layer material forming the intermediate layer on the upper surface of the pattern layer;
c) disposing the substrate layer above the interlayer material;
d) placing the master substrate, the pattern layer, the intermediate layer material, and the substrate layer between the support chuck and the pressurizing chuck such that the top and bottom of the master substrate, the pattern layer, the intermediate layer material and the substrate layer are sequentially stacked from the bottom to the top, Disposing the thickness adjusting member between the substrates;
e) pressing the intermediate layer material by lowering the pressurizing chuck by a load of the pressurizing chuck;
f) removing the thickness adjustment member and securing the support bar to the support bar after the master substrate and the pattern layer are seated on the thickness adjustment member;
Injecting an additional portion of the interlayer material into the unfilled region of the interlayer material after step f);
g) curing the intermediate layer material to form the intermediate layer; And
h) removing the support chuck and the pressure chuck, and removing the master substrate from the pattern layer. delete 11. The method of claim 10,
Wherein the additional material of the intermediate layer material and the intermediate layer material is the same material. 13. The method of claim 12,
Wherein the substrate layer is made of glass, the intermediate layer is made of PDMS (polydimethylsiloxane), and the pattern layer is made of h-PDMS or X-PDMS.

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