WO2009060890A1 - 貼合せ基板製造装置および貼合せ基板製造方法 - Google Patents

貼合せ基板製造装置および貼合せ基板製造方法 Download PDF

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Publication number
WO2009060890A1
WO2009060890A1 PCT/JP2008/070190 JP2008070190W WO2009060890A1 WO 2009060890 A1 WO2009060890 A1 WO 2009060890A1 JP 2008070190 W JP2008070190 W JP 2008070190W WO 2009060890 A1 WO2009060890 A1 WO 2009060890A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate manufacturing
bonding substrate
bonding
base section
Prior art date
Application number
PCT/JP2008/070190
Other languages
English (en)
French (fr)
Inventor
Seiichi Sato
Mitsuru Yahagi
Hirofumi Minami
Kazuhiro Musha
Junpei Yuyama
Masao Murata
Takahiro Miyata
Kyuzo Nakamura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880115485A priority Critical patent/CN101855060A/zh
Priority to JP2009540076A priority patent/JP4955070B2/ja
Priority to KR1020107006857A priority patent/KR101177090B1/ko
Publication of WO2009060890A1 publication Critical patent/WO2009060890A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Fluid Mechanics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

　本発明の貼合せ基板製造装置は、上基板と下基板とを位置合わせしつつ貼り合わせて貼合せ基板を製造する貼合せ基板製造装置であって、前記下基板を支持するベース部と；上下移動可能に構成され、前記ベース部とともに貼合せ処理室を形成するチャンバ部材と；前記ベース部に立設された支持棒と；前記支持棒に沿って前記チャンバ部材から独立して上下移動可能であり、かつ、前記上基板を保持可能な上加圧部材と；を備え、前記上加圧部材が移動することにより、前記貼合せ処理室の内部で上基板と前記下基板とが貼り合わされる。
PCT/JP2008/070190 2007-11-09 2008-11-06 貼合せ基板製造装置および貼合せ基板製造方法 WO2009060890A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880115485A CN101855060A (zh) 2007-11-09 2008-11-06 粘合基板制造装置和粘合基板制造方法
JP2009540076A JP4955070B2 (ja) 2007-11-09 2008-11-06 貼合せ基板製造装置および貼合せ基板製造方法
KR1020107006857A KR101177090B1 (ko) 2007-11-09 2008-11-06 접합 기판 제조 장치 및 접합 기판 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007291946 2007-11-09
JP2007-291946 2007-11-09

Publications (1)

Publication Number Publication Date
WO2009060890A1 true WO2009060890A1 (ja) 2009-05-14

Family

ID=40625777

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070190 WO2009060890A1 (ja) 2007-11-09 2008-11-06 貼合せ基板製造装置および貼合せ基板製造方法

Country Status (5)

Country Link
JP (1) JP4955070B2 (ja)
KR (1) KR101177090B1 (ja)
CN (1) CN101855060A (ja)
TW (1) TW200944873A (ja)
WO (1) WO2009060890A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2327546A1 (en) * 2009-11-27 2011-06-01 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and apparatus for laminating a first and a second sheet
EP2541587A1 (en) * 2010-02-25 2013-01-02 Nikon Corporation Substrate separation device, load lock device, substrate adhesion device and substrate separation method
KR101367705B1 (ko) * 2010-03-23 2014-02-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기억 매체
JP2018060982A (ja) * 2016-10-07 2018-04-12 東京応化工業株式会社 貼付装置
JP2020177191A (ja) * 2019-04-22 2020-10-29 信越エンジニアリング株式会社 貼合デバイスの貼り合わせ装置及び貼り合わせ方法並びに貼合デバイス
WO2022210857A1 (ja) * 2021-03-31 2022-10-06 ボンドテック株式会社 接合装置、接合システムおよび接合方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101470921B1 (ko) * 2012-10-16 2014-12-10 주식회사 글로벌스탠다드테크놀로지 기판 합착장치 및 기판 합착 방법
CN103926731B (zh) * 2014-04-01 2017-01-04 深圳市华星光电技术有限公司 一种夹持装置及其夹持方法
JP5654155B1 (ja) * 2014-04-04 2015-01-14 信越エンジニアリング株式会社 ワーク貼り合わせ装置
JP6468462B2 (ja) * 2015-02-23 2019-02-13 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
CN114505817B (zh) * 2022-03-11 2024-04-19 深圳市凯威达电子有限公司 一种智能照明驱动芯片生产用可精准定位的插接装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2007212572A (ja) * 2006-02-07 2007-08-23 Ulvac Japan Ltd 貼合せ基板の製造方法、及び貼合せ基板製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100720422B1 (ko) * 2002-11-15 2007-05-22 엘지.필립스 엘시디 주식회사 액정표시소자 제조 장치 및 이를 이용한 제조 방법
KR100829419B1 (ko) * 2005-04-12 2008-05-15 주식회사 에이디피엔지니어링 기판 합착기

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2007212572A (ja) * 2006-02-07 2007-08-23 Ulvac Japan Ltd 貼合せ基板の製造方法、及び貼合せ基板製造装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8980025B2 (en) 2009-11-27 2015-03-17 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Method and apparatus for laminating a first and a second sheet
WO2011065817A1 (en) * 2009-11-27 2011-06-03 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Method and apparatus for laminating a first and a second sheet
CN102686400A (zh) * 2009-11-27 2012-09-19 荷兰应用自然科学研究组织Tno 用于层压第一薄板和第二薄板的方法和设备
EP2327546A1 (en) * 2009-11-27 2011-06-01 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and apparatus for laminating a first and a second sheet
EP2541587A4 (en) * 2010-02-25 2017-04-05 Nikon Corporation Substrate separation device, load lock device, substrate adhesion device and substrate separation method
EP2541587A1 (en) * 2010-02-25 2013-01-02 Nikon Corporation Substrate separation device, load lock device, substrate adhesion device and substrate separation method
KR101770009B1 (ko) 2010-02-25 2017-08-21 가부시키가이샤 니콘 기판 분리 방법, 반도체 장치의 제조 방법, 기판 분리 장치, 로드 락 장치 및 기판 접합 장치
KR101367705B1 (ko) * 2010-03-23 2014-02-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기억 매체
JP2018060982A (ja) * 2016-10-07 2018-04-12 東京応化工業株式会社 貼付装置
TWI763696B (zh) * 2016-10-07 2022-05-11 日商東京應化工業股份有限公司 黏貼裝置
JP2020177191A (ja) * 2019-04-22 2020-10-29 信越エンジニアリング株式会社 貼合デバイスの貼り合わせ装置及び貼り合わせ方法並びに貼合デバイス
WO2022210857A1 (ja) * 2021-03-31 2022-10-06 ボンドテック株式会社 接合装置、接合システムおよび接合方法
JP7156753B1 (ja) * 2021-03-31 2022-10-19 ボンドテック株式会社 接合装置、接合システムおよび接合方法

Also Published As

Publication number Publication date
KR20100049674A (ko) 2010-05-12
TW200944873A (en) 2009-11-01
JPWO2009060890A1 (ja) 2011-03-24
JP4955070B2 (ja) 2012-06-20
CN101855060A (zh) 2010-10-06
KR101177090B1 (ko) 2012-08-24

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