CN101801646B - 粘合基板制造装置和粘合基板制造方法 - Google Patents

粘合基板制造装置和粘合基板制造方法 Download PDF

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Publication number
CN101801646B
CN101801646B CN200880108048.7A CN200880108048A CN101801646B CN 101801646 B CN101801646 B CN 101801646B CN 200880108048 A CN200880108048 A CN 200880108048A CN 101801646 B CN101801646 B CN 101801646B
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China
Prior art keywords
infrabasal plate
pressure
upper substrate
basal part
adhesive base
Prior art date
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Active
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CN200880108048.7A
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English (en)
Chinese (zh)
Other versions
CN101801646A (zh
Inventor
佐藤诚一
矢作充
南展史
武者和博
汤山纯平
村田真朗
宫田贵裕
中村久三
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Ulvac Inc
Original Assignee
Ulvac Inc
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Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN101801646A publication Critical patent/CN101801646A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
CN200880108048.7A 2007-11-08 2008-11-05 粘合基板制造装置和粘合基板制造方法 Active CN101801646B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007290912 2007-11-08
JP2007-290912 2007-11-08
PCT/JP2008/070114 WO2009060855A1 (ja) 2007-11-08 2008-11-05 貼合せ基板製造装置および貼合せ基板製造方法

Publications (2)

Publication Number Publication Date
CN101801646A CN101801646A (zh) 2010-08-11
CN101801646B true CN101801646B (zh) 2013-04-17

Family

ID=40625743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880108048.7A Active CN101801646B (zh) 2007-11-08 2008-11-05 粘合基板制造装置和粘合基板制造方法

Country Status (5)

Country Link
JP (1) JP4839407B2 (ja)
KR (1) KR101195085B1 (ja)
CN (1) CN101801646B (ja)
TW (1) TW200941614A (ja)
WO (1) WO2009060855A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101470921B1 (ko) * 2012-10-16 2014-12-10 주식회사 글로벌스탠다드테크놀로지 기판 합착장치 및 기판 합착 방법
JP6188123B2 (ja) * 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
JP6100571B2 (ja) * 2013-03-22 2017-03-22 株式会社東芝 表示装置の製造装置、および表示装置の製造方法
CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
JP6049820B1 (ja) * 2015-07-24 2016-12-21 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP6622254B2 (ja) * 2017-06-21 2019-12-18 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1669770A (zh) * 2004-02-24 2005-09-21 住友化学株式会社 透光板的生产方法
TWI250338B (en) * 2000-10-30 2006-03-01 Shinetsu Eng Co Ltd Lamination device for laminating substrate for liquid crystal panel
CN1869778A (zh) * 2005-05-25 2006-11-29 株式会社日立工业设备技术 基板组装装置和基板组装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI250338B (en) * 2000-10-30 2006-03-01 Shinetsu Eng Co Ltd Lamination device for laminating substrate for liquid crystal panel
CN1669770A (zh) * 2004-02-24 2005-09-21 住友化学株式会社 透光板的生产方法
CN1869778A (zh) * 2005-05-25 2006-11-29 株式会社日立工业设备技术 基板组装装置和基板组装方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-031500A 1994.02.08

Also Published As

Publication number Publication date
WO2009060855A1 (ja) 2009-05-14
KR20100057653A (ko) 2010-05-31
CN101801646A (zh) 2010-08-11
JPWO2009060855A1 (ja) 2011-03-24
TW200941614A (en) 2009-10-01
KR101195085B1 (ko) 2012-10-29
JP4839407B2 (ja) 2011-12-21

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