WO2009044800A1 - 電極の製造方法、電子回路パターン、薄膜トランジスタ素子及び有機エレクトロルミネッセンス素子 - Google Patents
電極の製造方法、電子回路パターン、薄膜トランジスタ素子及び有機エレクトロルミネッセンス素子 Download PDFInfo
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- WO2009044800A1 WO2009044800A1 PCT/JP2008/067910 JP2008067910W WO2009044800A1 WO 2009044800 A1 WO2009044800 A1 WO 2009044800A1 JP 2008067910 W JP2008067910 W JP 2008067910W WO 2009044800 A1 WO2009044800 A1 WO 2009044800A1
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- thin
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- 239000010409 thin film Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 238000005401 electroluminescence Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000011859 microparticle Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/655—Aromatic compounds comprising a hetero atom comprising only sulfur as heteroatom
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Thin Film Transistor (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
本発明は、低抵抗かつ超微細な回路パターンを形成でき、耐熱性の低い樹脂基板にも適用でき、電極材料として一般的な銀、金、銅、白金、ニッケル、アルミニウムを使用でき、かつ生産効率が高い電極及びその製造方法を提供し、さらには、該電極を用いた電子回路パターン、薄膜トランジスタ素子及び有機エレクトロルミネッセンス素子提供する。この電極の製造方法は、基板上に金属微粒子及び、電磁波吸収能を持つ金属酸化物または金属酸化物の前駆体を含む薄膜パターンを形成した後、前記薄膜パターンを形成した基板に対して導電体を直接的または間接的に配置し、前記薄膜パターンに電磁波を照射することにより、前記金属微粒子を結合することを特徴とする。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009536079A JP5310559B2 (ja) | 2007-10-03 | 2008-10-02 | 電極の製造方法、電子回路パターン、薄膜トランジスタ素子及び有機エレクトロルミネッセンス素子 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-259627 | 2007-10-03 | ||
JP2007259627 | 2007-10-03 |
Publications (1)
Publication Number | Publication Date |
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WO2009044800A1 true WO2009044800A1 (ja) | 2009-04-09 |
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PCT/JP2008/067910 WO2009044800A1 (ja) | 2007-10-03 | 2008-10-02 | 電極の製造方法、電子回路パターン、薄膜トランジスタ素子及び有機エレクトロルミネッセンス素子 |
Country Status (2)
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JP (1) | JP5310559B2 (ja) |
WO (1) | WO2009044800A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011008991A (ja) * | 2009-06-24 | 2011-01-13 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子、白色有機エレクトロルミネッセンス素子、表示装置及び照明装置 |
JP2011159885A (ja) * | 2010-02-02 | 2011-08-18 | Toshiba Corp | 薄膜の製造方法 |
KR101334920B1 (ko) | 2011-04-13 | 2013-11-29 | 한국기계연구원 | 마이크로웨이브를 이용한 패턴형성방법 |
WO2014108995A1 (ja) * | 2013-01-08 | 2014-07-17 | 富士機械製造株式会社 | 金属膜形成方法、および印刷装置 |
JP2019204915A (ja) * | 2018-05-25 | 2019-11-28 | コニカミノルタ株式会社 | 金属アルコキシド含有組成物、金属酸化物薄膜及びその作製方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003308984A (ja) * | 2002-04-17 | 2003-10-31 | Fujikura Ltd | 有機エレクトロルミネッセンス素子およびその製造方法 |
JP2005079010A (ja) * | 2003-09-02 | 2005-03-24 | Seiko Epson Corp | 導電膜パターンの形成方法、電気光学装置及び電子機器 |
JP2006060064A (ja) * | 2004-08-20 | 2006-03-02 | Ishikawajima Harima Heavy Ind Co Ltd | 薄膜のマイクロ波加熱方法 |
JP2006261528A (ja) * | 2005-03-18 | 2006-09-28 | Ricoh Co Ltd | 有機薄膜トランジスタ、それを備えた表示装置および有機薄膜トランジスタの製造方法。 |
JP2006269984A (ja) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
JP2006276121A (ja) * | 2005-03-28 | 2006-10-12 | Seiko Epson Corp | 機能性膜パターン成膜方法、機能性膜パターン、および電子機器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04367268A (ja) * | 1991-06-14 | 1992-12-18 | Nec Corp | 薄膜トランジスタアレイ装置 |
JPH0610929U (ja) * | 1992-07-20 | 1994-02-10 | カシオ計算機株式会社 | アクティブマトリクス液晶表示装置 |
-
2008
- 2008-10-02 JP JP2009536079A patent/JP5310559B2/ja not_active Expired - Fee Related
- 2008-10-02 WO PCT/JP2008/067910 patent/WO2009044800A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003308984A (ja) * | 2002-04-17 | 2003-10-31 | Fujikura Ltd | 有機エレクトロルミネッセンス素子およびその製造方法 |
JP2005079010A (ja) * | 2003-09-02 | 2005-03-24 | Seiko Epson Corp | 導電膜パターンの形成方法、電気光学装置及び電子機器 |
JP2006060064A (ja) * | 2004-08-20 | 2006-03-02 | Ishikawajima Harima Heavy Ind Co Ltd | 薄膜のマイクロ波加熱方法 |
JP2006261528A (ja) * | 2005-03-18 | 2006-09-28 | Ricoh Co Ltd | 有機薄膜トランジスタ、それを備えた表示装置および有機薄膜トランジスタの製造方法。 |
JP2006269984A (ja) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | 高周波電磁波照射による金属粒子を相互融着するための金属粒子の焼生方法及びそれを用いて製造した電子部品と金属粒子焼成用材料 |
JP2006276121A (ja) * | 2005-03-28 | 2006-10-12 | Seiko Epson Corp | 機能性膜パターン成膜方法、機能性膜パターン、および電子機器 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011008991A (ja) * | 2009-06-24 | 2011-01-13 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子、白色有機エレクトロルミネッセンス素子、表示装置及び照明装置 |
JP2011159885A (ja) * | 2010-02-02 | 2011-08-18 | Toshiba Corp | 薄膜の製造方法 |
KR101334920B1 (ko) | 2011-04-13 | 2013-11-29 | 한국기계연구원 | 마이크로웨이브를 이용한 패턴형성방법 |
WO2014108995A1 (ja) * | 2013-01-08 | 2014-07-17 | 富士機械製造株式会社 | 金属膜形成方法、および印刷装置 |
JPWO2014108995A1 (ja) * | 2013-01-08 | 2017-01-19 | 富士機械製造株式会社 | 金属膜形成方法、および印刷装置 |
JP2019204915A (ja) * | 2018-05-25 | 2019-11-28 | コニカミノルタ株式会社 | 金属アルコキシド含有組成物、金属酸化物薄膜及びその作製方法 |
JP7070091B2 (ja) | 2018-05-25 | 2022-05-18 | コニカミノルタ株式会社 | 金属アルコキシド含有組成物、金属酸化物薄膜及びその作製方法 |
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Publication number | Publication date |
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JPWO2009044800A1 (ja) | 2011-02-10 |
JP5310559B2 (ja) | 2013-10-09 |
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