WO2009031574A1 - フラットパネルディテクタ - Google Patents

フラットパネルディテクタ Download PDF

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Publication number
WO2009031574A1
WO2009031574A1 PCT/JP2008/065856 JP2008065856W WO2009031574A1 WO 2009031574 A1 WO2009031574 A1 WO 2009031574A1 JP 2008065856 W JP2008065856 W JP 2008065856W WO 2009031574 A1 WO2009031574 A1 WO 2009031574A1
Authority
WO
WIPO (PCT)
Prior art keywords
scintillator
flat panel
panel detector
layer
phosphor
Prior art date
Application number
PCT/JP2008/065856
Other languages
English (en)
French (fr)
Inventor
Takehiko Shoji
Mika Sakai
Original Assignee
Konica Minolta Medical & Graphic, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Medical & Graphic, Inc. filed Critical Konica Minolta Medical & Graphic, Inc.
Priority to JP2009531257A priority Critical patent/JP4819163B2/ja
Priority to US12/675,154 priority patent/US8525132B2/en
Publication of WO2009031574A1 publication Critical patent/WO2009031574A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2002—Optical details, e.g. reflecting or diffusing layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14632—Wafer-level processed structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Toxicology (AREA)
  • Measurement Of Radiation (AREA)
  • Conversion Of X-Rays Into Visible Images (AREA)

Abstract

　本発明は、蛍光体層の経時での特性劣化を防止し、蛍光体層を化学的な変質あるいは物理的な衝撃から保護し、シンチレータパネルと平面受光素子の接触状態が安定なフラットパネルディテクタを提供する。このフラットパネルディテクタは、基板上に蛍光体層が設けられてなるシンチレータと、該シンチレータの蛍光体面を被覆する保護層からなるシンチレータパネルを、２次元状に配置した複数の画素を有する平面受光素子面上に配置したフラットパネルディテクタにおいて、前記保護層表面に再剥離粘着剤層が設けられていることを特徴とする。
PCT/JP2008/065856 2007-09-06 2008-09-03 フラットパネルディテクタ WO2009031574A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009531257A JP4819163B2 (ja) 2007-09-06 2008-09-03 フラットパネルディテクタ
US12/675,154 US8525132B2 (en) 2007-09-06 2008-09-03 Flat panel detector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007231259 2007-09-06
JP2007-231259 2007-09-06

Publications (1)

Publication Number Publication Date
WO2009031574A1 true WO2009031574A1 (ja) 2009-03-12

Family

ID=40428888

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065856 WO2009031574A1 (ja) 2007-09-06 2008-09-03 フラットパネルディテクタ

Country Status (3)

Country Link
US (1) US8525132B2 (ja)
JP (4) JP4819163B2 (ja)
WO (1) WO2009031574A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059058A (ja) * 2009-09-14 2011-03-24 Fujifilm Corp 放射線画像撮影装置
JP2011069992A (ja) * 2009-09-25 2011-04-07 Fujifilm Corp 放射線画像撮影装置
WO2011136195A1 (ja) * 2010-04-30 2011-11-03 富士フイルム株式会社 放射線画像撮影装置、放射線画像撮影システム、及び、放射線画像撮影装置における放射線変換パネルの固定方法
JP2011232315A (ja) * 2010-04-30 2011-11-17 Fujifilm Corp 放射線画像撮影装置及び放射線画像撮影システム
WO2011161897A1 (en) * 2010-06-23 2011-12-29 Canon Kabushiki Kaisha Radiation image pickup apparatus, radiation image pickup system, and method for manufacturing radiation image pickup apparatus
JP2012108048A (ja) * 2010-11-18 2012-06-07 Fujifilm Corp 放射線検出器および放射線画像撮影装置
JP2012133315A (ja) * 2010-11-29 2012-07-12 Fujifilm Corp 放射線撮影装置
JP2012159395A (ja) * 2011-01-31 2012-08-23 Fujifilm Corp 放射線画像検出装置
JP2012173275A (ja) * 2011-02-24 2012-09-10 Fujifilm Corp 放射線画像検出装置及び放射線撮影用カセッテ
JP2016070890A (ja) * 2014-10-01 2016-05-09 キヤノン株式会社 放射線撮影装置および放射線撮影システム
WO2021256011A1 (ja) * 2020-06-16 2021-12-23 浜松ホトニクス株式会社 シンチレータパネル及び放射線検出器

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4819163B2 (ja) * 2007-09-06 2011-11-24 コニカミノルタエムジー株式会社 フラットパネルディテクタ
JP5597039B2 (ja) * 2010-06-23 2014-10-01 キヤノン株式会社 放射線撮像装置、放射線撮像システム及び放射線撮像装置の製造方法
JP5649872B2 (ja) * 2010-08-24 2015-01-07 浜松ホトニクス株式会社 放射線検出器の製造方法
US9069083B2 (en) * 2011-05-19 2015-06-30 Danimar Ltd. Portable radiation detector
JP2013050364A (ja) * 2011-08-30 2013-03-14 Fujifilm Corp 放射線画像検出装置
US20130236677A1 (en) * 2012-03-06 2013-09-12 Ge Medical Systems Global Technology Company, Llc Detector and method of panel bonding using removable adhesive film
JP5462305B2 (ja) 2012-03-12 2014-04-02 株式会社東芝 画像処理装置、画像処理方法およびそのプログラム
US8784597B2 (en) * 2012-04-13 2014-07-22 Pal Wonn (Taiwan) Co., Ltd. Method for reinforcing a glass of touch panel and reinforcement structure thereof
CN102956661B (zh) * 2012-11-21 2016-01-20 烟台睿创微纳技术有限公司 一种芯片封装方法及其封装结构
US9702986B2 (en) 2013-05-24 2017-07-11 Teledyne Dalsa B.V. Moisture protection structure for a device and a fabrication method thereof
JP6314984B2 (ja) * 2013-07-04 2018-04-25 コニカミノルタ株式会社 シンチレータパネル及びその製造方法
JP2015057589A (ja) * 2013-08-16 2015-03-26 富士フイルム株式会社 放射線画像検出装置の製造方法
DE102013221883A1 (de) * 2013-10-28 2015-04-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung und Fluidikvorrichtung zum Messen einer Menge einer zu untersuchenden Substanz
EP3234646B1 (en) 2016-01-29 2021-04-14 Shanghai United Imaging Healthcare Ltd. Heat exchanger for temperature control in a pet detector
TWI613804B (zh) 2017-09-04 2018-02-01 友達光電股份有限公司 光感測裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005181121A (ja) * 2003-12-19 2005-07-07 Canon Inc Ｘ線エリアセンサー
JP2006184187A (ja) * 2004-12-28 2006-07-13 Canon Inc 放射線検出装置、シンチレータパネル、および放射線検出システム

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382736A (en) * 1944-02-07 1945-08-14 Mason Collins Label
JP3334581B2 (ja) 1997-11-27 2002-10-15 松下電器産業株式会社 Ｘ線画像検出器
JP3649907B2 (ja) * 1998-01-20 2005-05-18 シャープ株式会社 二次元画像検出器およびその製造方法
WO1999066345A1 (fr) 1998-06-18 1999-12-23 Hamamatsu Photonics K.K. Panneau de scintillateur et capteur d'image de rayonnement
JP3789646B2 (ja) 1998-06-19 2006-06-28 浜松ホトニクス株式会社 放射線イメージセンサ
JP2002006050A (ja) * 2000-06-26 2002-01-09 Canon Inc 二次元撮像装置の実装構造
JP2002055165A (ja) * 2000-08-09 2002-02-20 Canon Inc 放射線検出装置及びそれを備えた放射線撮像システム
WO2002023220A1 (fr) * 2000-09-11 2002-03-21 Hamamatsu Photonics K.K. Panneau de scintillateur, capteur d'images radiographiques et procedes de production
JP2002341039A (ja) * 2001-05-15 2002-11-27 Canon Inc 放射線検出装置、その製造方法及び放射線検出システム
JP4307127B2 (ja) * 2003-04-02 2009-08-05 キヤノン株式会社 放射線撮影装置
US7355184B2 (en) * 2003-04-07 2008-04-08 Canon Kabushiki Kaisha Radiation detecting apparatus and method for manufacturing the same
JP2005062015A (ja) * 2003-08-13 2005-03-10 Fuji Photo Film Co Ltd 放射線像変換パネルおよびその製造方法
EP1678525A1 (en) * 2003-10-22 2006-07-12 Canon Kabushiki Kaisha Radiation detection device, scintillator panel, method of making the same, making apparatus, and radiation image pick-up system
JP2005172511A (ja) * 2003-12-09 2005-06-30 Canon Inc 放射線検出装置、その製造方法、および放射線撮像システム
JP2006189377A (ja) 2005-01-07 2006-07-20 Canon Inc シンチレータパネル、放射線検出装置、及び放射線検出システム
JP2006220439A (ja) 2005-02-08 2006-08-24 Canon Inc シンチレータパネル、放射線検出装置及びその製造方法
JP2006337184A (ja) 2005-06-02 2006-12-14 Canon Inc 放射線検出装置
JP4819163B2 (ja) 2007-09-06 2011-11-24 コニカミノルタエムジー株式会社 フラットパネルディテクタ
JP2011186902A (ja) 2010-03-10 2011-09-22 Nec Corp バックアップシステム及びバックアップ方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005181121A (ja) * 2003-12-19 2005-07-07 Canon Inc Ｘ線エリアセンサー
JP2006184187A (ja) * 2004-12-28 2006-07-13 Canon Inc 放射線検出装置、シンチレータパネル、および放射線検出システム

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059058A (ja) * 2009-09-14 2011-03-24 Fujifilm Corp 放射線画像撮影装置
JP2011069992A (ja) * 2009-09-25 2011-04-07 Fujifilm Corp 放射線画像撮影装置
US8796623B2 (en) 2010-04-30 2014-08-05 Fujifilm Corporation Radiation imaging device, radiation imaging system, and method for affixing radiation conversion panel in radiation imaging device
WO2011136195A1 (ja) * 2010-04-30 2011-11-03 富士フイルム株式会社 放射線画像撮影装置、放射線画像撮影システム、及び、放射線画像撮影装置における放射線変換パネルの固定方法
JP2011232315A (ja) * 2010-04-30 2011-11-17 Fujifilm Corp 放射線画像撮影装置及び放射線画像撮影システム
CN102870008A (zh) * 2010-04-30 2013-01-09 富士胶片株式会社 辐射成像装置、辐射成像系统和用于将辐射转换板固定在辐射成像装置中的方法
WO2011161897A1 (en) * 2010-06-23 2011-12-29 Canon Kabushiki Kaisha Radiation image pickup apparatus, radiation image pickup system, and method for manufacturing radiation image pickup apparatus
JP2012007948A (ja) * 2010-06-23 2012-01-12 Canon Inc 放射線撮像装置、放射線撮像システム及び放射線撮像装置の製造方法
US9059343B2 (en) 2010-06-23 2015-06-16 Canon Kabushiki Kaisha Radiation image pickup apparatus, radiation image pickup system, and method for manufacturing radiation image pickup apparatus
JP2012108048A (ja) * 2010-11-18 2012-06-07 Fujifilm Corp 放射線検出器および放射線画像撮影装置
JP2012133315A (ja) * 2010-11-29 2012-07-12 Fujifilm Corp 放射線撮影装置
JP2012159395A (ja) * 2011-01-31 2012-08-23 Fujifilm Corp 放射線画像検出装置
US8861680B2 (en) 2011-02-24 2014-10-14 Fujifilm Corporation Radiological image detection apparatus and radiographic imaging cassette
JP2012173275A (ja) * 2011-02-24 2012-09-10 Fujifilm Corp 放射線画像検出装置及び放射線撮影用カセッテ
JP2016070890A (ja) * 2014-10-01 2016-05-09 キヤノン株式会社 放射線撮影装置および放射線撮影システム
WO2021256011A1 (ja) * 2020-06-16 2021-12-23 浜松ホトニクス株式会社 シンチレータパネル及び放射線検出器

Also Published As

Publication number Publication date
US8525132B2 (en) 2013-09-03
JP2012154940A (ja) 2012-08-16
JP5035464B2 (ja) 2012-09-26
JP2012008141A (ja) 2012-01-12
JP4819163B2 (ja) 2011-11-24
JP5565444B2 (ja) 2014-08-06
JP2013019912A (ja) 2013-01-31
JPWO2009031574A1 (ja) 2010-12-16
US20100243908A1 (en) 2010-09-30

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