WO2009014219A1 - Ｌｅｄ照明デバイス - Google Patents

Ｌｅｄ照明デバイス Download PDF

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Publication number
WO2009014219A1
WO2009014219A1 PCT/JP2008/063437 JP2008063437W WO2009014219A1 WO 2009014219 A1 WO2009014219 A1 WO 2009014219A1 JP 2008063437 W JP2008063437 W JP 2008063437W WO 2009014219 A1 WO2009014219 A1 WO 2009014219A1
Authority
WO
WIPO (PCT)
Prior art keywords
led chip
light
illumination device
light emitting
led illumination
Prior art date
Application number
PCT/JP2008/063437
Other languages
English (en)
French (fr)
Inventor
Kenichiro Tanaka
Takanori Aketa
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007195151A external-priority patent/JP2009032524A/ja
Priority claimed from JP2008064878A external-priority patent/JP5452877B2/ja
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to EP08791681.3A priority Critical patent/EP2172984A4/en
Priority to KR1020107004250A priority patent/KR101134996B1/ko
Priority to US12/670,110 priority patent/US8729573B2/en
Priority to CN2008801006436A priority patent/CN101765923B/zh
Publication of WO2009014219A1 publication Critical patent/WO2009014219A1/ja

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

　本発明のＬＥＤ照明デバイスは、複数種の発光ユニットを備え、当該複数種の発光ユニットから発光される異なる色の可視光を混合して白色光を得るように構成されている。発光ユニットは、ＬＥＤチップと、蛍光体を備える。蛍光体は、ＬＥＤチップから放射される光によって励起され、所定の色の光を発する。ＬＥＤチップは、青色ＬＥＤチップ、紫外ＬＥＤチップ、紫色ＬＥＤチップの群のうちの１つから選択される。前記蛍光体は、それぞれ互いに異なる発光色を発するように構成されている。このようなＬＥＤ照明デバイスは、発する光の色ずれを抑制すると共に、発する光の色再現性の高いＬＥＤ照明デバイスを得ることができる。また、制御回路を備える必要が無いため、低コストである。
PCT/JP2008/063437 2007-07-26 2008-07-25 Ｌｅｄ照明デバイス WO2009014219A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08791681.3A EP2172984A4 (en) 2007-07-26 2008-07-25 LED LIGHTING DEVICE
KR1020107004250A KR101134996B1 (ko) 2007-07-26 2008-07-25 Ｌｅｄ 조명 디바이스
US12/670,110 US8729573B2 (en) 2007-07-26 2008-07-25 LED lighting device
CN2008801006436A CN101765923B (zh) 2007-07-26 2008-07-25 Led照明器件

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007195151A JP2009032524A (ja) 2007-07-26 2007-07-26 Ｌｅｄ照明装置
JP2007-195151 2007-07-26
JP2007-195162 2007-07-26
JP2007195162 2007-07-26
JP2008064878A JP5452877B2 (ja) 2008-03-13 2008-03-13 Ｌｅｄ照明装置
JP2008-064878 2008-03-13

Publications (1)

Publication Number Publication Date
WO2009014219A1 true WO2009014219A1 (ja) 2009-01-29

Family

ID=40281465

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063437 WO2009014219A1 (ja) 2007-07-26 2008-07-25 Ｌｅｄ照明デバイス

Country Status (5)

Country Link
US (1) US8729573B2 (ja)
EP (1) EP2172984A4 (ja)
KR (1) KR101134996B1 (ja)
CN (1) CN101765923B (ja)
WO (1) WO2009014219A1 (ja)

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JP2010267826A (ja) * 2009-05-15 2010-11-25 Rohm Co Ltd Ｌｅｄ照明装置および液晶表示装置
WO2011067110A3 (de) * 2009-12-02 2011-10-13 Osram Opto Semiconductors Gmbh Verfahren zur klasseneinteilung strahlungsemittierender, optoelektronischer halbleiterbauelemente
WO2011132716A1 (ja) * 2010-04-21 2011-10-27 三菱化学株式会社 半導体発光装置及び半導体発光装置の製造方法
CN102278663A (zh) * 2011-05-13 2011-12-14 江苏科凌医疗器械有限公司 一种轻便型led无影灯
US20110316027A1 (en) * 2010-06-29 2011-12-29 Semileds Optoelectronics Co., Ltd., a Taiwanese Corporation Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof
US20110316017A1 (en) * 2010-06-29 2011-12-29 Semileds Optoelectronics Co., Ltd., a Taiwanese Corporation Wafer-type light emitting device having precisely coated wavelength-converting layer
WO2013014978A1 (ja) * 2011-07-28 2013-01-31 パナソニック株式会社 実装基板および発光モジュール
US8531668B2 (en) 2009-12-02 2013-09-10 Osram Opto Semiconductors Gmbh Method for the binning of radiation-emitting, optoelectronic semiconductor components
JP2016067378A (ja) * 2014-09-26 2016-05-09 オリンパス株式会社 内視鏡装置及び内視鏡用アダプタ

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JP6176525B2 (ja) 2013-07-19 2017-08-09 パナソニックＩｐマネジメント株式会社 発光モジュール、照明装置および照明器具
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JP6156213B2 (ja) 2013-09-17 2017-07-05 豊田合成株式会社 発光装置及びその製造方法
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KR102180557B1 (ko) * 2014-07-02 2020-11-19 엘지디스플레이 주식회사 액정표시장치
CN104295952A (zh) * 2014-08-22 2015-01-21 广州市珠江灯光科技有限公司 照明装置及其制作方法
KR101616193B1 (ko) 2014-09-03 2016-04-29 송인실 혼합광 생성장치
US10257901B2 (en) * 2014-09-03 2019-04-09 Osram Gmbh LED dental light source with variable chromaticity and method
JP6256699B2 (ja) * 2014-11-11 2018-01-10 豊田合成株式会社 発光装置
WO2016159407A1 (ko) * 2015-03-31 2016-10-06 (주)디엠라이트 색온도 조절이 가능한 엘이디 조명장치
CN105570822A (zh) * 2016-03-02 2016-05-11 成都恒坤光电科技有限公司 一种色温可调的光源及采用该光源的光源组件和前照灯
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JP2020053447A (ja) 2018-09-25 2020-04-02 日亜化学工業株式会社 発光モジュール
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Cited By (12)

* Cited by examiner, † Cited by third party
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JP2010267826A (ja) * 2009-05-15 2010-11-25 Rohm Co Ltd Ｌｅｄ照明装置および液晶表示装置
WO2011067110A3 (de) * 2009-12-02 2011-10-13 Osram Opto Semiconductors Gmbh Verfahren zur klasseneinteilung strahlungsemittierender, optoelektronischer halbleiterbauelemente
US8531668B2 (en) 2009-12-02 2013-09-10 Osram Opto Semiconductors Gmbh Method for the binning of radiation-emitting, optoelectronic semiconductor components
WO2011132716A1 (ja) * 2010-04-21 2011-10-27 三菱化学株式会社 半導体発光装置及び半導体発光装置の製造方法
US20110316027A1 (en) * 2010-06-29 2011-12-29 Semileds Optoelectronics Co., Ltd., a Taiwanese Corporation Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof
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WO2013014978A1 (ja) * 2011-07-28 2013-01-31 パナソニック株式会社 実装基板および発光モジュール
JP2013030621A (ja) * 2011-07-28 2013-02-07 Panasonic Corp 実装基板および発光モジュール
JP2016067378A (ja) * 2014-09-26 2016-05-09 オリンパス株式会社 内視鏡装置及び内視鏡用アダプタ

Also Published As

Publication number Publication date
KR20100044869A (ko) 2010-04-30
EP2172984A1 (en) 2010-04-07
CN101765923A (zh) 2010-06-30
US8729573B2 (en) 2014-05-20
CN101765923B (zh) 2013-01-16
KR101134996B1 (ko) 2012-04-09
EP2172984A4 (en) 2013-09-11
US20100207134A1 (en) 2010-08-19

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