JP2013030621A - 実装基板および発光モジュール - Google Patents
実装基板および発光モジュール Download PDFInfo
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- JP2013030621A JP2013030621A JP2011165688A JP2011165688A JP2013030621A JP 2013030621 A JP2013030621 A JP 2013030621A JP 2011165688 A JP2011165688 A JP 2011165688A JP 2011165688 A JP2011165688 A JP 2011165688A JP 2013030621 A JP2013030621 A JP 2013030621A
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- light emitting
- heat transfer
- transfer plate
- emitting module
- wiring pattern
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- 239000000758 substrate Substances 0.000 claims abstract description 133
- 239000007787 solid Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 33
- 229910052782 aluminium Inorganic materials 0.000 claims description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 239000011241 protective layer Substances 0.000 claims description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 description 23
- 229920000647 polyepoxide Polymers 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000001965 increasing effect Effects 0.000 description 10
- 239000010949 copper Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000010931 gold Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000010292 electrical insulation Methods 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 101000990976 Homo sapiens Mitochondrial Rho GTPase 2 Proteins 0.000 description 1
- 102100030325 Mitochondrial Rho GTPase 2 Human genes 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
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- H05K1/0203—Cooling of mounted components
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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Abstract
【解決手段】実装基板2は、金属板により形成され電子部品を一面側に搭載可能な伝熱板21と、電子部品を電気的に接続可能な配線パターン22bが有機系絶縁基板22aの片面に設けられ伝熱板21の他面側に配置された配線基板22と、伝熱板21と配線基板22との間に介在する絶縁層23とを備えている。伝熱板21は、配線パターン22bにおける、電子部品の接続用部位を露出させる貫通孔21bが形成されている。実装基板2は、配線基板22の平面サイズが伝熱板21の平面サイズよりも大きく、配線基板22の配線パターン22bが、伝熱板21に重ならない領域まで広がっている。発光モジュールは、実装基板2に電子部品として固体発光素子を実装して構成する。
【選択図】図1
Description
2 実装基板
21b 貫通孔
3 固体発光素子(電子部品、LEDチップ)
21 伝熱板
22 配線基板
22a 有機系絶縁基板
22b 配線パターン
22ba 端子部
22c 保護層
23 絶縁層
26 ワイヤ
31 第1電極
32 第2電極
37 色変換部
Claims (11)
- 電子部品を実装可能な実装基板であって、金属板により形成され前記電子部品を一面側に搭載可能な伝熱板と、前記電子部品を電気的に接続可能な配線パターンが有機系絶縁基板の片面に設けられ前記伝熱板の他面側に配置された配線基板と、前記伝熱板と前記配線基板との間に介在する絶縁層とを備え、前記伝熱板は、前記配線パターンにおける、前記電子部品の接続用部位を露出させる貫通孔が形成されてなり、前記配線基板の平面サイズが前記伝熱板の平面サイズよりも大きく、前記配線基板は、前記配線パターンが、前記伝熱板に重ならない領域まで広がっていることを特徴とする実装基板。
- 前記配線基板は、前記有機系絶縁基板の前記片面において前記伝熱板に重ならない部位を覆うレジストからなる保護層を備え、前記保護層に、前記配線パターンの一部を端子部として露出させる露出部が形成されてなることを特徴とする請求項1記載の実装基板。
- 前記保護層の色が白色であることを特徴とする請求項2記載の実装基板。
- 前記配線基板は、前記配線パターンにおいて前記保護層により覆われた領域以外に、めっき層が形成されてなり、前記配線パターンの材料がCuであり、前記めっき層は、Ni膜とPd膜とAu膜との積層膜もしくはNi膜とAu膜との積層膜からなることを特徴とする請求項2または請求項3記載の実装基板。
- 前記絶縁層は、熱硬化性樹脂からなり、前記熱硬化性樹脂に比べて熱伝導率の高いフィラーを含有していることを特徴とする請求項1ないし請求項4のいずれか1項に記載の実装基板。
- 前記伝熱板は、前記金属板がアルミニウム板であり、前記アルミニウム板における前記絶縁層側とは反対側に前記アルミニウム板よりも高純度のアルミニウム膜が積層され、前記アルミニウム膜に屈折率の異なる2種類の誘電体膜からなる増反射膜が積層されてなることを特徴とする請求項1ないし請求項5のいずれか1項に記載の実装基板。
- 前記伝熱板は、長尺状の形状であって、複数の前記電子部品を前記伝熱板の長手方向に沿って並べて搭載可能であり、前記有機系樹脂基板は、前記伝熱板よりも幅寸法の大きな長尺状の形状であって、樹脂に前記樹脂よりも熱伝導率の高いフィラーを混合した樹脂基板からなり、前記配線パターンよりも前記金属板との線膨張率差が小さいことを特徴とする請求項1ないし請求項6のいずれか1項に記載の実装基板。
- 請求項1ないし請求項7のいずれか1項に記載の実装基板と、前記実装基板に実装された前記電子部品とを備え、前記電子部品が固体発光素子からなることを特徴とする発光モジュール。
- 前記固体発光素子は、LEDチップであることを特徴とする請求項8記載の発光モジュール。
- 前記LEDチップから放射された光によって励起されて前記LEDチップの発光色とは異なる色の光を放射する蛍光体および透光性材料を含む色変換部を備え、前記色変換部は、前記伝熱板に接していることを特徴とする請求項8または請求項9記載の発光モジュール。
- 前記各LEDチップは、厚み方向の一面側に第1電極と第2電極とが設けられたものであり、前記第1電極および前記第2電極の各々が前記貫通孔を通るワイヤを介して前記配線パターンと電気的に接続されてなることを特徴とする請求項8ないし請求項10のいずれか1項に記載の発光モジュール。
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CN104201276A (zh) * | 2014-08-15 | 2014-12-10 | 厦门市瀚锋光电科技有限公司 | 一种周面发光的条状光源 |
JP2015035284A (ja) * | 2013-08-07 | 2015-02-19 | パナソニックIpマネジメント株式会社 | 照明用光源及び照明装置 |
JP2016115947A (ja) * | 2014-07-30 | 2016-06-23 | 高玉宇 | 蛍光複合樹脂基板白色発光ダイオード |
JP2016162860A (ja) * | 2015-02-27 | 2016-09-05 | シチズン電子株式会社 | Led発光装置 |
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