WO2008146724A1 - シリコン単結晶の製造方法及びシリコン単結晶基板 - Google Patents

シリコン単結晶の製造方法及びシリコン単結晶基板 Download PDF

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Publication number
WO2008146724A1
WO2008146724A1 PCT/JP2008/059510 JP2008059510W WO2008146724A1 WO 2008146724 A1 WO2008146724 A1 WO 2008146724A1 JP 2008059510 W JP2008059510 W JP 2008059510W WO 2008146724 A1 WO2008146724 A1 WO 2008146724A1
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WO
WIPO (PCT)
Prior art keywords
single crystal
silicon single
crystal
dopant
growing
Prior art date
Application number
PCT/JP2008/059510
Other languages
English (en)
French (fr)
Inventor
Shinichi Kawazoe
Toshimichi Kubota
Yasuhito Narushima
Fukuo Ogawa
Original Assignee
Sumco Techxiv Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Techxiv Corporation filed Critical Sumco Techxiv Corporation
Priority to DE112008001160.5T priority Critical patent/DE112008001160B4/de
Priority to US12/524,303 priority patent/US8043428B2/en
Publication of WO2008146724A1 publication Critical patent/WO2008146724A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
    • C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

　Ｎ型ドーパントを添加したシリコン融液からチョクラルスキー法によりシリコン単結晶を育成する際に、前記シリコン融液中のドーパント濃度をＣ（atoms／cm３）、育成結晶側の平均温度勾配をＧave（K／mm）、引き上げ速度をＶ（mm／min）、ドーパントの種類に応じた係数をＡとしたときに、下記式（１）の関係を満たすように結晶を育成する。臨界ラインＧ１の左側の領域となるようにシリコン単結晶を育成することにより、組成的過冷却現象に起因する異常成長が発生することを防止できる。
PCT/JP2008/059510 2007-05-31 2008-05-23 シリコン単結晶の製造方法及びシリコン単結晶基板 WO2008146724A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112008001160.5T DE112008001160B4 (de) 2007-05-31 2008-05-23 Verfahren zum Herstellen eines Siliziumeinkristalls und Siliziumkristallsubstrat
US12/524,303 US8043428B2 (en) 2007-05-31 2008-05-23 Process for production of silicon single crystal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007146086A JP5161492B2 (ja) 2007-05-31 2007-05-31 シリコン単結晶の製造方法
JP2007-146086 2007-05-31

Publications (1)

Publication Number Publication Date
WO2008146724A1 true WO2008146724A1 (ja) 2008-12-04

Family

ID=40074977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059510 WO2008146724A1 (ja) 2007-05-31 2008-05-23 シリコン単結晶の製造方法及びシリコン単結晶基板

Country Status (4)

Country Link
US (1) US8043428B2 (ja)
JP (1) JP5161492B2 (ja)
DE (1) DE112008001160B4 (ja)
WO (1) WO2008146724A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014175120A1 (ja) * 2013-04-24 2014-10-30 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 単結晶の製造方法およびシリコンウェーハの製造方法
JP2017088460A (ja) * 2015-11-13 2017-05-25 信越半導体株式会社 エピタキシャルウェーハの製造方法及びエピタキシャルウェーハ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574645B2 (ja) * 2009-09-07 2014-08-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 単結晶シリコンの製造方法
JP5434801B2 (ja) * 2010-06-03 2014-03-05 トヨタ自動車株式会社 ＳｉＣ単結晶の製造方法
KR101390797B1 (ko) * 2012-01-05 2014-05-02 주식회사 엘지실트론 실리콘 단결정 성장 방법
JP6579046B2 (ja) 2016-06-17 2019-09-25 株式会社Sumco シリコン単結晶の製造方法
JP6786905B2 (ja) 2016-06-27 2020-11-18 株式会社Sumco シリコン単結晶の製造方法
JP6631460B2 (ja) 2016-10-03 2020-01-15 株式会社Sumco シリコン単結晶の製造方法およびシリコン単結晶
WO2022118922A1 (ja) * 2020-12-04 2022-06-09 株式会社Sumco シリコン単結晶の育成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246197A (ja) * 1988-03-25 1989-10-02 Sumitomo Electric Ind Ltd ３−ｖ族化合物半導体単結晶の製造方法
JPH11186121A (ja) * 1997-12-24 1999-07-09 Sumitomo Sitix Corp シリコンウエーハ及びその製造方法
JP2005314213A (ja) * 2004-03-29 2005-11-10 Toshiba Ceramics Co Ltd シリコン単結晶引上げ用砒素ドーパント及びその製造方法並びにそれを用いたシリコン単結晶の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6131382A (ja) 1984-07-20 1986-02-13 Sumitomo Electric Ind Ltd 化合物半導体単結晶の引上方法
US6491752B1 (en) * 1999-07-16 2002-12-10 Sumco Oregon Corporation Enhanced n-type silicon material for epitaxial wafer substrate and method of making same
JP2005314231A (ja) * 2004-04-27 2005-11-10 Ono Pharmaceut Co Ltd ３−［（シクロヘプチルカルボニル）アミノ］−２−オキソ−３−（テトラヒドロ−２ｈ−ピラン−４−イル）プロパン酸エステルの製造方法
US7485928B2 (en) * 2005-11-09 2009-02-03 Memc Electronic Materials, Inc. Arsenic and phosphorus doped silicon wafer substrates having intrinsic gettering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246197A (ja) * 1988-03-25 1989-10-02 Sumitomo Electric Ind Ltd ３−ｖ族化合物半導体単結晶の製造方法
JPH11186121A (ja) * 1997-12-24 1999-07-09 Sumitomo Sitix Corp シリコンウエーハ及びその製造方法
JP2005314213A (ja) * 2004-03-29 2005-11-10 Toshiba Ceramics Co Ltd シリコン単結晶引上げ用砒素ドーパント及びその製造方法並びにそれを用いたシリコン単結晶の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014175120A1 (ja) * 2013-04-24 2014-10-30 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 単結晶の製造方法およびシリコンウェーハの製造方法
CN105121713A (zh) * 2013-04-24 2015-12-02 胜高科技股份有限公司 单晶的制造方法和硅晶片的制造方法
JP5890587B2 (ja) * 2013-04-24 2016-03-22 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 単結晶の製造方法およびシリコンウェーハの製造方法
US10233562B2 (en) 2013-04-24 2019-03-19 Sumco Techxiv Corporation Method for producing single crystal, and method for producing silicon wafer
JP2017088460A (ja) * 2015-11-13 2017-05-25 信越半導体株式会社 エピタキシャルウェーハの製造方法及びエピタキシャルウェーハ

Also Published As

Publication number Publication date
US8043428B2 (en) 2011-10-25
DE112008001160B4 (de) 2017-11-02
US20100133485A1 (en) 2010-06-03
JP5161492B2 (ja) 2013-03-13
DE112008001160T5 (de) 2010-04-29
JP2008297167A (ja) 2008-12-11

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