WO2008143166A1 - Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板および半導体発光デバイス - Google Patents

Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板および半導体発光デバイス Download PDF

Info

Publication number
WO2008143166A1
WO2008143166A1 PCT/JP2008/059018 JP2008059018W WO2008143166A1 WO 2008143166 A1 WO2008143166 A1 WO 2008143166A1 JP 2008059018 W JP2008059018 W JP 2008059018W WO 2008143166 A1 WO2008143166 A1 WO 2008143166A1
Authority
WO
WIPO (PCT)
Prior art keywords
nitride
iii
group
element belonging
semiconductor
Prior art date
Application number
PCT/JP2008/059018
Other languages
English (en)
French (fr)
Inventor
Kenji Fujito
Kazumasa Kiyomi
Original Assignee
Mitsubishi Chemical Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corporation filed Critical Mitsubishi Chemical Corporation
Priority to US12/600,352 priority Critical patent/US8269251B2/en
Priority to KR1020097026018A priority patent/KR101488545B1/ko
Priority to EP08764307A priority patent/EP2154272A4/en
Publication of WO2008143166A1 publication Critical patent/WO2008143166A1/ja
Priority to US13/571,782 priority patent/US20120305983A1/en
Priority to US13/932,249 priority patent/US9112096B2/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/38Nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/20Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02609Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • H01L21/02645Seed materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1844Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P
    • H01L31/1848Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P comprising nitride compounds, e.g. InGaN, InGaAlN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

本発明のIII族窒化物半導体結晶の製造方法では、非極性面を有する種結晶を準備し、前記非極性面からIII族窒化物半導体を気相中で成長させる成長工程を具備し、前記成長工程は、前記種結晶の+C軸方向に伸びるようにIII族窒化物半導体を成長させる。これによって、高品位で大面積の非極性面を有するIII-V族化合物窒化物半導体結晶を得ることができる。
PCT/JP2008/059018 2007-05-17 2008-05-16 Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板および半導体発光デバイス WO2008143166A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/600,352 US8269251B2 (en) 2007-05-17 2008-05-16 Method for producing group III nitride semiconductor crystal, group III nitride semiconductor substrate, and semiconductor light-emitting device
KR1020097026018A KR101488545B1 (ko) 2007-05-17 2008-05-16 Iii 족 질화물 반도체 결정의 제조 방법, iii 족 질화물 반도체 기판 및 반도체 발광 디바이스
EP08764307A EP2154272A4 (en) 2007-05-17 2008-05-16 METHOD FOR MANUFACTURING A NITRIDE SEMICONDUCTOR CRYSTAL OF AN ELEMENT BELONGING TO GROUP III, A NITRIDE-FORMED SEMICONDUCTOR SUBSTRATE OF A GROUP III ELEMENT, AND A SEMICONDUCTOR LIGHT EMITTING DEVICE
US13/571,782 US20120305983A1 (en) 2007-05-17 2012-08-10 Method for producing group-iii nitride semiconductor crystal, group-iii nitride semiconductor substrate, and semiconductor light emitting device
US13/932,249 US9112096B2 (en) 2007-05-17 2013-07-01 Method for producing group-III nitride semiconductor crystal, group-III nitride semiconductor substrate, and semiconductor light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-131955 2007-05-17
JP2007131955 2007-05-17

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/600,352 A-371-Of-International US8269251B2 (en) 2007-05-17 2008-05-16 Method for producing group III nitride semiconductor crystal, group III nitride semiconductor substrate, and semiconductor light-emitting device
US13/571,782 Continuation US20120305983A1 (en) 2007-05-17 2012-08-10 Method for producing group-iii nitride semiconductor crystal, group-iii nitride semiconductor substrate, and semiconductor light emitting device

Publications (1)

Publication Number Publication Date
WO2008143166A1 true WO2008143166A1 (ja) 2008-11-27

Family

ID=40031868

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059018 WO2008143166A1 (ja) 2007-05-17 2008-05-16 Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板および半導体発光デバイス

Country Status (5)

Country Link
US (3) US8269251B2 (ja)
EP (1) EP2154272A4 (ja)
JP (4) JP2008308401A (ja)
KR (1) KR101488545B1 (ja)
WO (1) WO2008143166A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9890474B2 (en) 2013-02-22 2018-02-13 Mitsubishi Chemical Corporation Crystal of nitride of group-13 metal on periodic table, and method for producing the same

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5332168B2 (ja) 2006-11-17 2013-11-06 住友電気工業株式会社 Iii族窒化物結晶の製造方法
US9064706B2 (en) 2006-11-17 2015-06-23 Sumitomo Electric Industries, Ltd. Composite of III-nitride crystal on laterally stacked substrates
JP2009234906A (ja) * 2008-03-03 2009-10-15 Mitsubishi Chemicals Corp 窒化物半導体結晶とその製造方法
JP5461859B2 (ja) * 2008-03-28 2014-04-02 Jfeミネラル株式会社 AlNバルク単結晶及び半導体デバイス並びにAlN単結晶バルクの製造方法
US9404197B2 (en) * 2008-07-07 2016-08-02 Soraa, Inc. Large area, low-defect gallium-containing nitride crystals, method of making, and method of use
CN102067286B (zh) * 2009-03-06 2013-03-06 松下电器产业株式会社 氮化物半导体的晶体生长方法和半导体装置的制造方法
CN102369590A (zh) * 2009-04-03 2012-03-07 松下电器产业株式会社 氮化物半导体的结晶生长方法和半导体装置的制造方法
KR20120036816A (ko) * 2009-06-01 2012-04-18 미쓰비시 가가꾸 가부시키가이샤 질화물 반도체 결정 및 그 제조 방법
JP5789929B2 (ja) * 2010-08-03 2015-10-07 住友電気工業株式会社 Iii族窒化物結晶の成長方法
KR101852519B1 (ko) * 2010-10-29 2018-04-26 가부시키가이샤 도쿠야마 광학 소자의 제조 방법
EP2633103B1 (en) * 2010-10-29 2015-07-29 The Regents of The University of California Ammonothermal growth of group-iii nitride crystals on seeds with at least two surfaces making an acute, right or obtuse angle with each other
JP5480169B2 (ja) 2011-01-13 2014-04-23 浜松ホトニクス株式会社 レーザ加工方法
KR101877396B1 (ko) * 2011-09-07 2018-08-09 엘지이노텍 주식회사 발광소자
KR101433548B1 (ko) * 2011-09-12 2014-08-22 미쓰비시 가가꾸 가부시키가이샤 발광 다이오드 소자
JPWO2013042297A1 (ja) * 2011-09-20 2015-03-26 パナソニックIpマネジメント株式会社 窒化ガリウム系化合物半導体発光素子及びそれを用いた光源装置
US9834859B2 (en) 2012-01-11 2017-12-05 Osaka University Method for producing group III nitride crystal, group III nitride crystal, and semiconductor device
EP2832901A4 (en) * 2012-03-30 2015-07-08 Mitsubishi Chem Corp GROUP 13 METAL NITRIDE CRYSTALS OF THE PERIODIC TABLE OF ELEMENTS AND PROCESS FOR THE MANUFACTURE OF GROUP 13 METAL NITRIDE CRYSTALS OF THE PERIODIC TABLE OF ELEMENTS
JP2013209274A (ja) * 2012-03-30 2013-10-10 Mitsubishi Chemicals Corp 周期表第13族金属窒化物結晶
WO2014098261A1 (ja) * 2012-12-20 2014-06-26 日本碍子株式会社 種結晶基板、複合基板および機能素子
JP6032099B2 (ja) * 2013-03-29 2016-11-24 三菱化学株式会社 周期表第13族金属窒化物半導体結晶の製造方法
JP6187083B2 (ja) * 2013-06-06 2017-08-30 三菱ケミカル株式会社 第13族金属窒化物結晶
US9708733B2 (en) * 2013-06-10 2017-07-18 Tokuyama Corporation Method for manufacturing aluminum-based group III nitride single crystal by hydride vapor phase epitaxy
EP3315639B1 (en) * 2013-08-08 2024-05-01 Mitsubishi Chemical Corporation Self-standing gan substrate, gan crystal, method for producing gan single crystal, and method for producing semiconductor device
JP2015199631A (ja) * 2014-04-09 2015-11-12 古河機械金属株式会社 接合基板、接合基板の製造方法、及び、iii族窒化物半導体の製造方法
WO2016125890A1 (ja) * 2015-02-06 2016-08-11 三菱化学株式会社 GaN単結晶およびGaN単結晶製造方法
JP6135954B2 (ja) 2015-10-22 2017-05-31 ウシオ電機株式会社 窒化物半導体発光素子
JP6365992B2 (ja) * 2016-03-25 2018-08-01 パナソニックIpマネジメント株式会社 Iii族窒化物結晶製造方法及びramo4基板
JP6861490B2 (ja) * 2016-09-07 2021-04-21 株式会社サイオクス 窒化物結晶基板の製造方法および結晶成長用基板
JP7046496B2 (ja) 2017-03-28 2022-04-04 古河機械金属株式会社 Iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板、及び、バルク結晶
CN109423690B (zh) 2017-08-21 2022-09-16 株式会社Flosfia 用于制造结晶膜的方法
JP7182262B2 (ja) 2018-12-10 2022-12-02 パナソニックIpマネジメント株式会社 Ramo4基板およびその製造方法、ならびにiii族窒化物半導体
JP7228467B2 (ja) * 2019-05-27 2023-02-24 信越化学工業株式会社 Iii族化合物基板の製造方法及びiii族化合物基板

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10335750A (ja) 1997-06-03 1998-12-18 Sony Corp 半導体基板および半導体装置
JP2002029897A (ja) 2000-07-10 2002-01-29 Sumitomo Electric Ind Ltd 単結晶GaN基板の製造方法と単結晶GaN基板
JP2004262755A (ja) * 2000-08-24 2004-09-24 Nichia Chem Ind Ltd 窒化物半導体の成長方法と窒化物半導体基板
JP2005060227A (ja) * 2004-09-30 2005-03-10 Toyoda Gosei Co Ltd 窒化ガリウム系化合物半導体及び半導体基板
JP2006160568A (ja) 2004-12-08 2006-06-22 Ricoh Co Ltd Iii族窒化物の結晶成長方法およびiii族窒化物結晶および半導体デバイス
JP2006169104A (ja) * 2000-09-18 2006-06-29 Mitsubishi Cable Ind Ltd 半導体基材及びその作製方法
JP2006265101A (ja) * 2001-09-19 2006-10-05 Sumitomo Electric Ind Ltd 窒化ガリウム結晶、窒化ガリウム基板及び半導体レーザデバイス
JP2006315947A (ja) 2005-04-11 2006-11-24 Nichia Chem Ind Ltd 窒化物半導体ウエハ及びその製造方法
US20070037308A1 (en) 2005-08-09 2007-02-15 Sony Corporation METHOD FOR MANUFACTURING GaN SEMICONDUCTOR LIGHT-EMITTING ELEMENT

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3556916B2 (ja) * 2000-09-18 2004-08-25 三菱電線工業株式会社 半導体基材の製造方法
JP2002169104A (ja) 2000-12-01 2002-06-14 Sumitomo Electric Ind Ltd 光デバイス
JP2002293697A (ja) * 2001-03-29 2002-10-09 Sumitomo Electric Ind Ltd GaNエピタキシャル層の成長方法
US7105865B2 (en) * 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
US7303630B2 (en) * 2003-11-05 2007-12-04 Sumitomo Electric Industries, Ltd. Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
JP3864870B2 (ja) * 2001-09-19 2007-01-10 住友電気工業株式会社 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法
US7556687B2 (en) * 2001-09-19 2009-07-07 Sumitomo Electric Industries, Ltd. Gallium nitride crystal substrate and method of producing same
US20080006201A1 (en) * 2001-09-19 2008-01-10 Sumitomo Electric Industries, Ltd. Method of growing gallium nitride crystal
US20070280872A1 (en) * 2001-09-19 2007-12-06 Sumitomo Electric Industries, Ltd. Method of growing gallium nitride crystal and gallium nitride substrate
CN1316070C (zh) * 2001-10-26 2007-05-16 波兰商艾蒙诺公司 取向生长用基底
US7750355B2 (en) * 2001-10-26 2010-07-06 Ammono Sp. Z O.O. Light emitting element structure using nitride bulk single crystal layer
JP2003218043A (ja) * 2002-01-28 2003-07-31 Nikko Materials Co Ltd GaN系化合物半導体結晶の製造方法
KR100992960B1 (ko) * 2002-04-15 2010-11-09 더 리전츠 오브 더 유니버시티 오브 캘리포니아 유기금속 화학기상 증착법에 의해 성장된 무극성 α면질화갈륨 박막
US7208393B2 (en) * 2002-04-15 2007-04-24 The Regents Of The University Of California Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy
AU2003285768A1 (en) 2002-12-11 2004-06-30 Ammono Sp. Z O.O. A template type substrate and a method of preparing the same
JP4486506B2 (ja) * 2002-12-16 2010-06-23 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア ハイドライド気相成長方法による転位密度の低い無極性窒化ガリウムの成長
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
JP4340866B2 (ja) * 2003-11-14 2009-10-07 日立電線株式会社 窒化物半導体基板及びその製造方法
KR100718188B1 (ko) * 2004-05-07 2007-05-15 삼성코닝 주식회사 비극성 a면 질화물 반도체 단결정 기판 및 이의 제조방법
JP4581490B2 (ja) * 2004-05-31 2010-11-17 日立電線株式会社 Iii−v族窒化物系半導体自立基板の製造方法、及びiii−v族窒化物系半導体の製造方法
JP2006016294A (ja) 2004-05-31 2006-01-19 Sumitomo Electric Ind Ltd Iii族窒化物結晶の成長方法、iii族窒化物結晶基板および半導体デバイス
KR100848380B1 (ko) * 2004-06-11 2008-07-25 암모노 에스피. 제트오. 오. 갈륨 함유 질화물의 벌크 단결정 및 그의 어플리케이션
JP4997744B2 (ja) * 2004-12-24 2012-08-08 日亜化学工業株式会社 窒化物半導体素子及びその製造方法
JP4735949B2 (ja) * 2005-04-08 2011-07-27 日立電線株式会社 Iii−v族窒化物半導体結晶の製造方法およびiii−v族窒化物半導体基板の製造方法
TW200703463A (en) * 2005-05-31 2007-01-16 Univ California Defect reduction of non-polar and semi-polar III-nitrides with sidewall lateral epitaxial overgrowth (SLEO)
JP5026271B2 (ja) * 2005-09-05 2012-09-12 パナソニック株式会社 六方晶系窒化物単結晶の製造方法、六方晶系窒化物半導体結晶及び六方晶系窒化物単結晶ウエハの製造方法
EP1801855B1 (en) * 2005-12-22 2009-01-14 Freiberger Compound Materials GmbH Processes for selective masking of III-N layers and for the preparation of free-standing III-N layers or of devices
JP2008285364A (ja) * 2007-05-17 2008-11-27 Sumitomo Electric Ind Ltd GaN基板、それを用いたエピタキシャル基板及び半導体発光素子
JP2009234906A (ja) 2008-03-03 2009-10-15 Mitsubishi Chemicals Corp 窒化物半導体結晶とその製造方法
KR20120036816A (ko) 2009-06-01 2012-04-18 미쓰비시 가가꾸 가부시키가이샤 질화물 반도체 결정 및 그 제조 방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10335750A (ja) 1997-06-03 1998-12-18 Sony Corp 半導体基板および半導体装置
JP2002029897A (ja) 2000-07-10 2002-01-29 Sumitomo Electric Ind Ltd 単結晶GaN基板の製造方法と単結晶GaN基板
JP2004262755A (ja) * 2000-08-24 2004-09-24 Nichia Chem Ind Ltd 窒化物半導体の成長方法と窒化物半導体基板
JP2006169104A (ja) * 2000-09-18 2006-06-29 Mitsubishi Cable Ind Ltd 半導体基材及びその作製方法
JP2006265101A (ja) * 2001-09-19 2006-10-05 Sumitomo Electric Ind Ltd 窒化ガリウム結晶、窒化ガリウム基板及び半導体レーザデバイス
JP2005060227A (ja) * 2004-09-30 2005-03-10 Toyoda Gosei Co Ltd 窒化ガリウム系化合物半導体及び半導体基板
JP2006160568A (ja) 2004-12-08 2006-06-22 Ricoh Co Ltd Iii族窒化物の結晶成長方法およびiii族窒化物結晶および半導体デバイス
JP2006315947A (ja) 2005-04-11 2006-11-24 Nichia Chem Ind Ltd 窒化物半導体ウエハ及びその製造方法
US20070037308A1 (en) 2005-08-09 2007-02-15 Sony Corporation METHOD FOR MANUFACTURING GaN SEMICONDUCTOR LIGHT-EMITTING ELEMENT

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"27th Basic Lecture of Thin Film/Surface Physics", SOCIETY OF APPLIED PHYSICS OF JAPAN, SUBCOMMITTEE OF THIN FILM/SURFACE PHYSICS, 16 November 1998 (1998-11-16), pages 75
See also references of EP2154272A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9890474B2 (en) 2013-02-22 2018-02-13 Mitsubishi Chemical Corporation Crystal of nitride of group-13 metal on periodic table, and method for producing the same
US10309038B2 (en) 2013-02-22 2019-06-04 Mitsubishi Chemical Corporation Crystal of nitride of group-13 metal on periodic table, and method for producing the same
US10995421B2 (en) 2013-02-22 2021-05-04 Mitsubishi Chemical Corporation Crystal of nitride of group-13 metal on periodic table, and method for producing the same

Also Published As

Publication number Publication date
JP5282766B2 (ja) 2013-09-04
JP2010222254A (ja) 2010-10-07
US20130320394A1 (en) 2013-12-05
JP5725086B2 (ja) 2015-05-27
US9112096B2 (en) 2015-08-18
EP2154272A4 (en) 2011-04-27
JP2010222253A (ja) 2010-10-07
JP4586936B2 (ja) 2010-11-24
US8269251B2 (en) 2012-09-18
KR101488545B1 (ko) 2015-02-02
JP2013230972A (ja) 2013-11-14
EP2154272A1 (en) 2010-02-17
JP2008308401A (ja) 2008-12-25
KR20100017798A (ko) 2010-02-16
US20120305983A1 (en) 2012-12-06
US20100148212A1 (en) 2010-06-17

Similar Documents

Publication Publication Date Title
WO2008143166A1 (ja) Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板および半導体発光デバイス
WO2009095764A8 (en) Method for growing p-type sic semiconductor single crystal and p-type sic semiconductor single crystal
WO2011084596A3 (en) Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods
WO2008078401A1 (ja) 窒化物半導体自立基板の製造方法及び窒化物半導体自立基板
WO2008060349A3 (en) Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
WO2008087791A1 (ja) Iii族窒化物結晶の製造方法、iii族窒化物結晶基板およびiii族窒化物半導体デバイス
EP2439316A4 (en) NITRIDE-SEMICONDUCTOR CRYSTAL AND MANUFACTURING METHOD THEREFOR
WO2006086471A3 (en) A method to grow iii-nitride materials using no buffer layer
EP1921668A3 (en) Compound semiconductor substrate grown on metal layer, method for manufacturing the same, and compund semiconductor device using the same
WO2006113442A8 (en) Wafer separation technique for the fabrication of free-standing (al, in, ga)n wafers
WO2009149299A8 (en) Methods for producing improved crystallinity group iii-nitride crystals from initial group iii-nitride seed by ammonothermal growth
WO2007136412A3 (en) Methods for oriented growth of nanowires on patterned substrates
WO2012134092A3 (en) Method of manufacturing single crystal ingot, and single crystal ingot and wafer manufactured thereby
EP2086003A3 (en) Method of growing group III-V compound semiconductor, and method of manufacturing light-emitting device and electronic device
WO2010099544A3 (en) Tiled substrates for deposition and epitaxial lift off processes
WO2009035095A1 (ja) エピタキシャルSiC単結晶基板及びエピタキシャルSiC単結晶基板の製造方法
WO2013061047A3 (en) Silicon carbide epitaxy
GB201210134D0 (en) Selective sidewall growth of semiconductor material
WO2007143743A3 (en) High volume delivery system for gallium trichloride
JP2008308401A5 (ja)
WO2008064077A3 (en) Methods for high volume manufacture of group iii-v semiconductor materials
EP2312651A4 (en) OPTICAL GAN SEMICONDUCTOR ELEMENT, METHOD FOR PRODUCING THE OPTICAL GAN SEMICONDUCTOR ELEMENT, EPITACTIC WAFERS, AND METHOD FOR BUILDING A GAN SEMICONDUCTOR FILM
AU2003255613A1 (en) Method for epitaxial growth of a gallium nitride film separated from its substrate
JP2011063504A5 (ja)
WO2011025290A3 (ko) 경사진 기판 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08764307

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12600352

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008764307

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20097026018

Country of ref document: KR

Kind code of ref document: A