WO2008143043A1 - 無線icタグおよび無線icタグの製造方法 - Google Patents
無線icタグおよび無線icタグの製造方法 Download PDFInfo
- Publication number
- WO2008143043A1 WO2008143043A1 PCT/JP2008/058697 JP2008058697W WO2008143043A1 WO 2008143043 A1 WO2008143043 A1 WO 2008143043A1 JP 2008058697 W JP2008058697 W JP 2008058697W WO 2008143043 A1 WO2008143043 A1 WO 2008143043A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna circuit
- tag
- wireless
- base material
- solder
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880000835XA CN101548287B (zh) | 2007-05-14 | 2008-05-12 | 无线ic标签及无线ic标签的制造方法 |
US12/525,042 US9053402B2 (en) | 2007-05-14 | 2008-05-12 | Wireless IC tag and method for manufacturing wireless IC tag |
HK10102738.1A HK1136064A1 (en) | 2007-05-14 | 2010-03-16 | Wireless ic tag and method for manufacturing wireless ic tag |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007127986A JP4674710B2 (ja) | 2007-05-14 | 2007-05-14 | 無線icタグの製造方法 |
JP2007-127986 | 2007-05-14 | ||
JP2007151880A JP4618690B2 (ja) | 2007-06-07 | 2007-06-07 | 無線icタグおよび無線icタグの製造方法 |
JP2007-151880 | 2007-06-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008143043A1 true WO2008143043A1 (ja) | 2008-11-27 |
Family
ID=40031752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058697 WO2008143043A1 (ja) | 2007-05-14 | 2008-05-12 | 無線icタグおよび無線icタグの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9053402B2 (ja) |
HK (1) | HK1136064A1 (ja) |
WO (1) | WO2008143043A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2251934B1 (en) * | 2008-03-03 | 2018-05-02 | Murata Manufacturing Co. Ltd. | Wireless ic device and wireless communication system |
US8735735B2 (en) * | 2010-07-23 | 2014-05-27 | Ge Embedded Electronics Oy | Electronic module with embedded jumper conductor |
EP2492847A1 (fr) * | 2011-02-25 | 2012-08-29 | NagraID S.A. | Carte incorporant un transpondeur |
US20140145826A1 (en) * | 2012-11-26 | 2014-05-29 | Jacob Conner | Analysis of stimulus by rfid |
USD749062S1 (en) * | 2013-01-02 | 2016-02-09 | Callas Enterprises Llc | Combined floor mat and EAS antenna |
JP2014204029A (ja) * | 2013-04-08 | 2014-10-27 | 立山科学工業株式会社 | Led実装用基板 |
US10980160B2 (en) * | 2018-09-26 | 2021-04-13 | Canon Kabushiki Kaisha | Image pickup module, method for manufacturing image pickup module, and electronic device |
US10621483B2 (en) * | 2018-12-28 | 2020-04-14 | Intel Corporation | Power activation via conductive contact label |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6456595A (en) * | 1987-08-28 | 1989-03-03 | Dainippon Printing Co Ltd | Manufacture of ic card |
JPH06282699A (ja) * | 1993-03-25 | 1994-10-07 | Toshiba Corp | 非接触情報伝達装置 |
JPH0722831A (ja) * | 1993-03-11 | 1995-01-24 | Csir | 電子回路を基板に取付ける方法および包装構成要素 |
JP2001126044A (ja) * | 1999-02-05 | 2001-05-11 | Hitachi Maxell Ltd | フレキシブルicモジュール及びその製造方法並びにフレキシブルicモジュールを用いた情報担体の製造方法 |
JP2002298109A (ja) * | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | 非接触型icメディアおよびその製造方法 |
JP2005108259A (ja) * | 2004-12-17 | 2005-04-21 | Omron Corp | 電磁波読み取り可能なデータキャリア |
JP2006122913A (ja) * | 2004-10-26 | 2006-05-18 | Matsushita Electric Ind Co Ltd | 半田ペーストおよび半田接合方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5985394A (ja) | 1982-11-09 | 1984-05-17 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
JP3216832B2 (ja) | 1992-07-16 | 2001-10-09 | 日本ジーイープラスチックス株式会社 | 芳香族ポリカーボネートの製造法 |
JPH0645743A (ja) | 1992-07-24 | 1994-02-18 | Matsushita Electric Ind Co Ltd | 回路基板とそのハンダ付方法 |
JPH11175683A (ja) | 1997-12-12 | 1999-07-02 | Hitachi Ltd | 非接触式のicカード並びに回路基板及びその製造方法並びに電子部品の実装構造体及びその製造方法 |
JPH11291684A (ja) | 1998-04-07 | 1999-10-26 | Dainippon Printing Co Ltd | 非接触式情報媒体 |
JP4340929B2 (ja) | 1998-10-02 | 2009-10-07 | ソニー株式会社 | メモリicタグ装置 |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
JP2000182017A (ja) | 1998-12-18 | 2000-06-30 | Dainippon Printing Co Ltd | 接触型非接触型共用icカードおよびその製造方法 |
JP2001211019A (ja) | 2000-01-25 | 2001-08-03 | Hideo Suyama | 送受信モジュールのアンテナ装置とその製造法 |
JP3538125B2 (ja) | 2000-07-19 | 2004-06-14 | 清 小川 | 鋼管複合加工設備と鋼管加工方法 |
JP4774646B2 (ja) | 2001-07-30 | 2011-09-14 | 凸版印刷株式会社 | 非接触icカードと非接触icカード用インレット及びその検査方法 |
AT412682B (de) | 2001-09-19 | 2005-05-25 | Akg Acoustics Gmbh | Lackbeschichteter draht |
JP2003133053A (ja) | 2001-10-24 | 2003-05-09 | Matsushita Electric Ind Co Ltd | 高周波加熱装置 |
JP2003196634A (ja) | 2001-12-28 | 2003-07-11 | Nec Tokin Corp | 非接触型idタグ |
FR2853115B1 (fr) * | 2003-03-28 | 2005-05-06 | A S K | Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede |
JP4177241B2 (ja) | 2003-12-04 | 2008-11-05 | 株式会社日立情報制御ソリューションズ | 無線icタグ用アンテナ、無線icタグ及び無線icタグ付き容器 |
JP2006024087A (ja) * | 2004-07-09 | 2006-01-26 | Nec Corp | 無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法 |
JP2006127424A (ja) | 2004-11-01 | 2006-05-18 | Daido Steel Co Ltd | 無線タグ |
JP2006185428A (ja) | 2004-11-30 | 2006-07-13 | Canon Inc | Rfタグ |
JP4669270B2 (ja) * | 2004-12-02 | 2011-04-13 | 富士通株式会社 | Rfidタグおよびその製造方法 |
JP2006344871A (ja) | 2005-06-10 | 2006-12-21 | Nippon Avionics Co Ltd | リフロー半田付け方法および装置 |
KR101346241B1 (ko) * | 2005-11-29 | 2013-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 안테나 및 그의 제작방법, 안테나를 가지는 반도체장치 및그의 제작방법, 및 무선통신 시스템 |
US7651033B2 (en) * | 2005-12-19 | 2010-01-26 | Dai Nippon Printing Co., Ltd. | Noncontract IC tag with non-conductive metal film |
JP4674710B2 (ja) | 2007-05-14 | 2011-04-20 | 立山科学工業株式会社 | 無線icタグの製造方法 |
-
2008
- 2008-05-12 US US12/525,042 patent/US9053402B2/en not_active Expired - Fee Related
- 2008-05-12 WO PCT/JP2008/058697 patent/WO2008143043A1/ja active Application Filing
-
2010
- 2010-03-16 HK HK10102738.1A patent/HK1136064A1/xx not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6456595A (en) * | 1987-08-28 | 1989-03-03 | Dainippon Printing Co Ltd | Manufacture of ic card |
JPH0722831A (ja) * | 1993-03-11 | 1995-01-24 | Csir | 電子回路を基板に取付ける方法および包装構成要素 |
JPH06282699A (ja) * | 1993-03-25 | 1994-10-07 | Toshiba Corp | 非接触情報伝達装置 |
JP2001126044A (ja) * | 1999-02-05 | 2001-05-11 | Hitachi Maxell Ltd | フレキシブルicモジュール及びその製造方法並びにフレキシブルicモジュールを用いた情報担体の製造方法 |
JP2002298109A (ja) * | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | 非接触型icメディアおよびその製造方法 |
JP2006122913A (ja) * | 2004-10-26 | 2006-05-18 | Matsushita Electric Ind Co Ltd | 半田ペーストおよび半田接合方法 |
JP2005108259A (ja) * | 2004-12-17 | 2005-04-21 | Omron Corp | 電磁波読み取り可能なデータキャリア |
Also Published As
Publication number | Publication date |
---|---|
US20110006119A1 (en) | 2011-01-13 |
US9053402B2 (en) | 2015-06-09 |
HK1136064A1 (en) | 2010-06-18 |
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