WO2008136096A1 - ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板 - Google Patents

ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板 Download PDF

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Publication number
WO2008136096A1
WO2008136096A1 PCT/JP2007/058854 JP2007058854W WO2008136096A1 WO 2008136096 A1 WO2008136096 A1 WO 2008136096A1 JP 2007058854 W JP2007058854 W JP 2007058854W WO 2008136096 A1 WO2008136096 A1 WO 2008136096A1
Authority
WO
WIPO (PCT)
Prior art keywords
halogen
epoxy resin
resin composition
prepreg
wiring board
Prior art date
Application number
PCT/JP2007/058854
Other languages
English (en)
French (fr)
Inventor
Takayoshi Ozeki
Yoshiaki Esaki
Yohsuke Ishikawa
Tetsuya Kato
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to JP2009512828A priority Critical patent/JPWO2008136096A1/ja
Priority to PCT/JP2007/058854 priority patent/WO2008136096A1/ja
Publication of WO2008136096A1 publication Critical patent/WO2008136096A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Abstract

（Ａ）ハロゲンを含有せず、エポキシ当量が１０００以下であるビスフェノールＡ型エポキシ樹脂 （Ｂ）ジアミノジフェニルスルホン （Ｃ）カルボキシル基を含有するアクリロニトリルブタジエンゴムを少なくとも含むエラストマー （Ｄ）有機ホスフィン類と、ホスホニウム塩のうち、少なくとも一方を含む硬化促進剤 の（Ａ）～（Ｄ）の各成分を必須成分とし、さらに （Ｅ）リン系難燃剤 （Ｆ）水酸化アルミニウム （Ｇ）タルクを少なくとも含む充填材 の（Ｅ）～（Ｇ）成分を配合して、エポキシ樹脂組成物を調製する。ハロゲンフリーで、難燃性を確保し、かつ密着性、電気絶縁信頼性、屈曲性を満足することができる。
PCT/JP2007/058854 2007-04-24 2007-04-24 ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板 WO2008136096A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009512828A JPWO2008136096A1 (ja) 2007-04-24 2007-04-24 ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板
PCT/JP2007/058854 WO2008136096A1 (ja) 2007-04-24 2007-04-24 ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/058854 WO2008136096A1 (ja) 2007-04-24 2007-04-24 ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板

Publications (1)

Publication Number Publication Date
WO2008136096A1 true WO2008136096A1 (ja) 2008-11-13

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WO (1) WO2008136096A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010026777A1 (ja) * 2008-09-05 2010-03-11 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
GB2472423A (en) * 2009-08-05 2011-02-09 Gurit Fire-retardant composite materials
WO2012007992A1 (ja) * 2010-07-14 2012-01-19 京セラケミカル株式会社 フレキシブル配線板、カバーレイ用ドライフィルム、及びフレキシブル配線板の製造方法
JP2012213898A (ja) * 2011-03-31 2012-11-08 Panasonic Corp 配線パターン形成基材
JP2013159695A (ja) * 2012-02-03 2013-08-19 Mitsubishi Rayon Co Ltd エポキシ樹脂組成物とこれを用いたプリプレグ、該プリプレグから製造された繊維強化複合樹脂成形体。
JP2018188578A (ja) * 2017-05-10 2018-11-29 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
WO2019238880A1 (en) 2018-06-15 2019-12-19 Hexcel Composites Limited Epoxy resin formulations
JP2020050829A (ja) * 2018-09-28 2020-04-02 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN113544180A (zh) * 2019-03-15 2021-10-22 汉高股份有限及两合公司 含砜树脂的阻气粘合剂
KR20230134976A (ko) 2022-03-15 2023-09-22 아사히 가세이 가부시키가이샤 블록 공중합체 그리고 해당 블록 공중합체를 함유하는 수지 조성물 및 경화물

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279639A (ja) * 1992-04-02 1993-10-26 Shin Etsu Chem Co Ltd カバーレイフィルム用接着剤組成物
JPH1081858A (ja) * 1996-09-06 1998-03-31 Shin Etsu Chem Co Ltd 耐熱性カバーレイフィルム
JPH10204260A (ja) * 1997-01-24 1998-08-04 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物及びそれを用いた積層板
JP2003213082A (ja) * 2002-01-22 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料
JP2003213083A (ja) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
JP2006045261A (ja) * 2004-07-30 2006-02-16 Nippon Kayaku Co Ltd 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
WO2007063580A1 (ja) * 2005-11-30 2007-06-07 Matsushita Electric Works, Ltd. ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279639A (ja) * 1992-04-02 1993-10-26 Shin Etsu Chem Co Ltd カバーレイフィルム用接着剤組成物
JPH1081858A (ja) * 1996-09-06 1998-03-31 Shin Etsu Chem Co Ltd 耐熱性カバーレイフィルム
JPH10204260A (ja) * 1997-01-24 1998-08-04 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物及びそれを用いた積層板
JP2003213082A (ja) * 2002-01-22 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料
JP2003213083A (ja) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
JP2006045261A (ja) * 2004-07-30 2006-02-16 Nippon Kayaku Co Ltd 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
WO2007063580A1 (ja) * 2005-11-30 2007-06-07 Matsushita Electric Works, Ltd. ハロゲンフリーエポキシ樹脂組成物、カバーレイフィルム、ボンディングシート、プリプレグ、プリント配線板用積層板

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737345B2 (ja) * 2008-09-05 2011-07-27 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
WO2010026777A1 (ja) * 2008-09-05 2010-03-11 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
US9909003B2 (en) 2009-08-05 2018-03-06 Gurit (Uk) Ltd. Fire-retardant composite materials
GB2472423A (en) * 2009-08-05 2011-02-09 Gurit Fire-retardant composite materials
GB2472423B (en) * 2009-08-05 2012-01-11 Gurit Uk Ltd Fire-retardant composite materials
WO2012007992A1 (ja) * 2010-07-14 2012-01-19 京セラケミカル株式会社 フレキシブル配線板、カバーレイ用ドライフィルム、及びフレキシブル配線板の製造方法
JP2012213898A (ja) * 2011-03-31 2012-11-08 Panasonic Corp 配線パターン形成基材
JP2013159695A (ja) * 2012-02-03 2013-08-19 Mitsubishi Rayon Co Ltd エポキシ樹脂組成物とこれを用いたプリプレグ、該プリプレグから製造された繊維強化複合樹脂成形体。
JP2018188578A (ja) * 2017-05-10 2018-11-29 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
WO2019238880A1 (en) 2018-06-15 2019-12-19 Hexcel Composites Limited Epoxy resin formulations
JP2020050829A (ja) * 2018-09-28 2020-04-02 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7305326B2 (ja) 2018-09-28 2023-07-10 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN113544180A (zh) * 2019-03-15 2021-10-22 汉高股份有限及两合公司 含砜树脂的阻气粘合剂
US11965119B2 (en) 2019-03-15 2024-04-23 Henkel Ag & Co. Kgaa Sulfone-resin containing gas-barrier adhesive
KR20230134976A (ko) 2022-03-15 2023-09-22 아사히 가세이 가부시키가이샤 블록 공중합체 그리고 해당 블록 공중합체를 함유하는 수지 조성물 및 경화물

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